JP2006222296A - Film forming device, and manufacturing method for semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film forming device which reduces a horizontal shift between a plurality of semiconductor wafers separated vertically from each other. <P>SOLUTION: The film forming device comprises a wafer holding member 10 which holds a plurality of wafers 1 to keep them separated vertically from each other; a transfer unit 20 which transfers a semiconductor wafer 1 to the holding member 10 to allow it to hold the wafer 1; location detecting sensors 24a which are arranged on the transfer unit 20 and detect the location of a semiconductor wafer 1 already held by the wafer holding member 10; and a control unit 40 which controls the transfer unit 20 on the basis of a detection result from the location detecting sensors 24a, and matches the position of a semiconductor wafer 1 on transfer in a horizontal plane to that of semiconductor wafers 1 already held by the wafer holding member 10 in the horizontal plane. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a film forming apparatus and a method for manufacturing a semiconductor device. In particular, the present invention relates to a film forming apparatus capable of reducing a positional deviation in the horizontal plane direction between a plurality of semiconductor wafers that are separated from each other in the vertical direction. The present invention also relates to a method for manufacturing a semiconductor device that can improve the uniformity of a film to be formed.

  FIG. 7 is a schematic side view for explaining the configuration of a conventional film forming apparatus. The film forming apparatus shown in this figure is a vertical CVD apparatus, and has a board 110 inside a reaction chamber (not shown). The board 110 has a plurality of support columns 112. A plurality of recesses 112a are provided on the side surfaces of each of the columns 112, and the silicon wafer 101 is inserted into each of the recesses 112a to hold the silicon wafer 101 apart from each other. The silicon wafer 101 is transferred from the inside of the cassette 130 to the board 110 by the transfer device 120.

Then, a source gas is injected into the reaction chamber, and the inside of the reaction chamber is maintained at a predetermined temperature. Thereby, a film is formed on each of the plurality of silicon wafers 101.
Japanese Patent Laid-Open No. 10-242245 (FIG. 1)

  It is desirable that the film formed on each of the plurality of semiconductor wafers has a small variation between the semiconductor wafers. Conventionally, by adjusting film forming conditions such as temperature, pressure, and raw material gas flow rate, and by devising the shape of a wafer holding member (for example, a board) for holding a semiconductor wafer, the entire surface of each of a plurality of semiconductor wafers is provided. The raw material gas was supplied uniformly. Thereby, the dispersion | variation in the film | membrane between semiconductor wafers is suppressed to some extent. However, in recent years, it has been desired to further improve the uniformity of the film.

  In order to further suppress the film variation between the semiconductor wafers, it is effective to reduce the position variation in the horizontal plane of the semiconductor wafer. However, there is a margin in the wafer holding portion (for example, a concave portion of the board) of the wafer holding member, and there is some variation in the reproducibility of the moving position of the transfer device. For this reason, the position of the semiconductor wafer in the horizontal plane is somewhat varied.

  Further, when the position of the semiconductor wafer varies within the cassette, when the semiconductor wafer is taken out from the cassette, the position of the semiconductor wafer with respect to the transfer device varies, and therefore, the position of the semiconductor wafer on the wafer holding member at the transfer destination also varies. .

  The present invention has been made in consideration of the above-described circumstances, and an object of the present invention is to form a film forming apparatus capable of reducing the positional deviation in the horizontal plane direction between a plurality of semiconductor wafers spaced vertically. Is to provide. Another object of the present invention is to provide a method of manufacturing a semiconductor device that can improve film uniformity between semiconductor wafers when a plurality of semiconductor wafers are simultaneously formed. .

In order to solve the above-described problem, a film forming apparatus according to the present invention includes a wafer holding member that holds a plurality of semiconductor wafers in a state of being vertically separated, and
A transport unit for transporting the semiconductor wafer to the wafer holding member and holding the semiconductor wafer on the wafer holding member;
A position detection sensor that is provided in the transfer unit and detects the position of a semiconductor wafer already held by the wafer holding member;
A control unit that controls the transfer unit based on the detection result of the position detection sensor, and adjusts the position of the semiconductor wafer being transferred in the horizontal plane to the position of the semiconductor wafer that is already held by the wafer holding member. It comprises.

  According to this film forming apparatus, when the transfer unit holds the semiconductor wafer on the wafer holding member, the transfer unit adjusts the position of the semiconductor wafer in the horizontal plane to the position of the already held semiconductor wafer in the horizontal plane. Therefore, the positional deviation in the horizontal plane direction between the plurality of semiconductor wafers can be reduced.

  In the case where the transfer unit holds the semiconductor wafers on the wafer holding member sequentially from the bottom, the position detection sensor is preferably provided on the lower surface of the transfer unit. In this case, the conveying unit is provided with a substantially plate-like first base member, an adsorption unit that is provided on the first base member and adsorbs the lower surface of the semiconductor wafer of the semiconductor wafer, and a shape along the edge of the semiconductor wafer. A second base member, and the position detection sensor may be provided on a lower surface of the second base member.

Another film forming apparatus according to the present invention includes a wafer holding member that holds a plurality of semiconductor wafers in a state of being vertically separated, and
A transport unit configured to transport and hold each of the plurality of semiconductor wafers to the wafer holding member;
A position detection sensor for detecting a position in a horizontal plane of each of a plurality of semiconductor wafers held by the wafer holding member;
A controller that controls the transfer unit based on the detection result of the position detection sensor and corrects the positions of the plurality of semiconductor wafers held by the wafer holding member in a horizontal plane;
It comprises.

  According to this film forming apparatus, the position of the plurality of semiconductor wafers in the horizontal plane is corrected based on the position detection result of the semiconductor wafer by the position detection sensor. Therefore, the positional deviation in the horizontal plane direction between the plurality of semiconductor wafers can be reduced.

The position detection sensor is preferably provided in the transport unit. In this way, there is no need to newly provide a mechanism for moving the position detection sensor. In the case where the transport unit includes a substantially plate-like base member, and an adsorption part that is provided on the base member and adsorbs a substantially central part of the lower surface of the semiconductor wafer, the position detection sensor is It is preferable that it is provided in the vicinity of the tip of the base member of the transport unit. In this way, the position detection sensor can be easily brought close to the semiconductor wafer, so that the measurement error of the position detection sensor can be reduced.
The position detection sensor is, for example, a light reflection type sensor.

Another film forming apparatus according to the present invention includes a transport unit that transports and holds a semiconductor wafer in a cassette that holds the plurality of semiconductor wafers in a state of being vertically separated, and
A position detection sensor that is provided in the transfer unit and detects the position of a semiconductor wafer already held in the cassette;
A control unit configured to control the transfer unit based on a detection result of the position detection sensor, and to adjust a position of the semiconductor wafer being transferred in a horizontal plane to a position in the horizontal plane of the semiconductor wafer already held in the cassette; It has.

  According to this film forming apparatus, the positional deviation in the horizontal plane direction between the plurality of semiconductor wafers can be reduced within the cassette. For this reason, when a semiconductor wafer is transported from a cassette to a board or the like using a conventional transport device in the next step, the positional deviation of the semiconductor wafer in the horizontal plane at the transport destination can be reduced.

Another film forming apparatus according to the present invention includes a transport unit that transports and holds each of the plurality of semiconductor wafers in a cassette that holds the plurality of semiconductor wafers in a state of being vertically separated from each other.
A position detection sensor for detecting positions in a horizontal plane of a plurality of semiconductor wafers held in the cassette;
A controller that controls the transfer unit based on the detection result of the position detection sensor and corrects the positions of the plurality of semiconductor wafers held in the cassette in a horizontal plane.

A method of manufacturing a semiconductor device according to the present invention includes a step of preparing a wafer holding member that holds a plurality of semiconductor wafers in a state of being vertically separated, and
A step of transporting the semiconductor wafer to the wafer holding member using a transport unit;
While detecting the planar position of the semiconductor wafer already held by the wafer holding member using a position detection sensor provided in the transfer unit, the position of the semiconductor wafer being transferred in the horizontal plane is determined by the wafer holding member. A step of holding the semiconductor wafer on the wafer holding member after adjusting the position of the semiconductor wafer held in the horizontal plane,
Forming a film on a plurality of semiconductor wafers held by the wafer holding member.

  According to this method for manufacturing a semiconductor device, in the wafer holding member, positional deviation in the horizontal plane direction between a plurality of semiconductor wafers is reduced. Accordingly, it is possible to improve the uniformity of a film formed between a plurality of semiconductor wafers.

Another method of manufacturing a semiconductor device according to the present invention includes a step of preparing a wafer holding member that holds a plurality of semiconductor wafers in a state of being vertically separated, and
Transporting and holding a plurality of semiconductor wafers to the wafer holding member;
A position detection sensor is used to detect the positions of the plurality of semiconductor wafers held by the wafer holding member in a horizontal plane, and the plurality of the plurality of semiconductor wafers held by the wafer holding member based on the detection result of the position detection sensor. Correcting the position of the semiconductor wafer in the horizontal plane;
Forming a film on a plurality of semiconductor wafers held by the wafer holding member.

BEST MODE FOR CARRYING OUT THE INVENTION

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1A is a schematic side view for explaining the configuration of the film forming apparatus according to the first embodiment of the present invention. FIG. 1B is a top view of FIG. The film forming apparatus shown in this figure is a vertical CVD apparatus, and is used, for example, when a silicon oxide film that becomes a gate sidewall of a transistor is formed on a silicon wafer 1. This vertical CVD apparatus performs a film forming process on a plurality of silicon wafers 1 simultaneously.

  The plurality of silicon wafers 1 are held on the board 10 so as to be spaced apart from each other in the reaction chamber (not shown). The board 10 has a plurality of support columns 12 (for example, four) arranged along the edge of one half of the silicon wafer 1. A plurality of concave portions 12a are provided on the side surfaces of the support columns 12 so as to extend vertically. The silicon wafer 1 is held on the board 10 by being inserted into the recess 12a.

  The plurality of silicon wafers 1 are carried into the reaction chamber while being held in the cassette 30 so as to be separated from each other in the vertical direction. The silicon wafer 1 held in the cassette 30 is taken out from the cassette 30 by the transfer device 20 and inserted into the concave portion 12a of the board 10 in order from the bottom. The transport device 20 is controlled by the control unit 40.

  FIG. 2 is a plan view of the transfer device 20. As shown in FIG. 1 and FIG. 1B, the transport device 20 has a first base member 22 that has a long and narrow plate shape. When holding the silicon wafer 1, the first base member 22 is inserted below the silicon wafer 1 and then moves upward to contact the lower surface of the silicon wafer 1. An adsorption portion 22 a that adsorbs the lower surface of the silicon wafer 1 is provided near the tip of the upper surface of the first base member 22. When the suction part 22a sucks the central portion of the lower surface of the silicon wafer 1, the transfer device 20 can hold and move the silicon wafer 1.

  A position detection sensor 22 b is attached to the tip of the first base member 22. The position detection sensor 22b is a light reflection type sensor, for example, and is a sensor that measures the position of the silicon wafer 1 held on the board 10 in the horizontal plane.

  The transport device 20 has a plate-like second base member 24. The second base member 24 has a shape substantially along the edge of the silicon wafer 1 and supports the edge of the silicon wafer 1 to which the suction portion 22a is sucked from below.

  A plurality of position detection sensors 24 a are attached to the lower surface of the second base member 24. The plurality of position detection sensors 24 a are, for example, light reflection type sensors, and detect the position of the silicon wafer 1 that is already inserted into the board 10 when the silicon wafer 1 that is held is inserted into the board 10. Is provided.

  The second base member 24 has a shape along the edge of one half of the silicon wafer 1, for example. Two or more position detection sensors 24 a may be provided, but it is preferable that the position detection sensors 24 a are provided at a portion overlapping the first base member 22 and at both ends of the second base member 24.

  FIG. 3 is a flowchart for explaining the operation of the film forming apparatus shown in FIGS. The flow shown in this figure is a part of the manufacturing process of the semiconductor device, and is for forming a predetermined film on the silicon wafer 1.

  First, a plurality of silicon wafers 1 are taken out from the cassette 30 and held on the board 10 (S20). Next, it is confirmed whether or not the variation in the position of the silicon wafer 1 in the horizontal plane is within an allowable range, and the position of the silicon wafer 1 that is displaced is corrected (S40). Next, after the film forming process is performed (S60), the silicon wafer 1 is returned to the cassette 30 (S80).

  FIG. 4 is a flowchart for explaining the operation of the film forming apparatus in S20 of FIG. First, the transfer device 20 of the film forming apparatus takes out the first silicon wafer 1 from the cassette 30 and inserts it into the recess 12 a located at the bottom of the board 10. Thereby, the first silicon wafer 1 is held on the board 10 (S22).

  Next, the transfer device 20 takes out the next silicon wafer 1 from the cassette 30 (S24), and inserts the silicon wafer 1 into the second recess 12a from the bottom. At this time, the control unit 40 detects the position of the silicon wafer 1 already held on the board 10 using the plurality of position detection sensors 24a. Then, the control unit 40 uses the transfer device 20 to adjust the position of the inserted silicon wafer 1, and the position of the silicon wafer 1 in the horizontal plane is within the horizontal plane of the silicon wafer 1 already held by the board 10. (S26).

  In addition, when the position detection sensor 24a is provided in each of the part which overlaps with the 1st base member 22, and the both ends of the 2nd base member 24, the position detection sensor 24a provided in the former position is a silicon wafer. 1 in the depth direction (X direction in FIG. 1B), and the position detection sensor 24a provided at the latter position is positioned in the width direction of the silicon wafer 1 (Y direction in FIG. 1B). ) Is detected.

  The operations shown in S24 and S26 are repeated until all the silicon wafers 1 are transferred to the board 10 (S28).

  In this way, the transfer device 20 inserts the next silicon wafer 1 into the board 10 while detecting the position of the silicon wafer 1 already held. And the position in the horizontal surface of the inserted silicon wafer 1 is adjusted so that it may overlap with the position in the horizontal surface of the silicon wafer 1 already hold | maintained. Accordingly, the positional deviation in the horizontal plane direction between the plurality of silicon wafers 1 can be reduced.

  FIG. 5 is a flowchart for explaining the processing in S40 of FIG. First, the control unit 40 moves the transfer device 20 in front of the silicon wafer 1 held at the bottom of the board 10 (S42). Next, the position detection sensor 22b is used to measure the distance from the tip of the first base member 22 to the tip of the silicon wafer 1 located at the bottom (S44).

  Since the position detection sensor 22b is attached to the tip of the first base member 22, there is no need to newly provide a mechanism for moving the position detection sensor 22b. Further, the position detection sensor 22b can be brought close to the silicon wafer 1. For this reason, the measurement error of the position detection sensor can be reduced.

  Next, when there is another silicon wafer 1 on the upper side (S46: No), the control unit 40 moves the transfer device 20 as it is upward and vertically and positions it next to the second silicon wafer 1 from the bottom ( S48). Then, the distance from the tip of the first base member 22 to the tip of the second silicon wafer 1 from the bottom is measured (S44). By repeating these operations, the distance from the tip of each of the plurality of silicon wafers 1 holding the board 10 to the first base member 22 is measured in order from the bottom (S42 to S46).

  Next, the control unit 40 recognizes the silicon wafer 1 whose distance to the first base member 22 is outside the reference range. When this distance is outside the reference range, the position of the silicon wafer 1 in the horizontal plane is out of the reference range. The controller 40 corrects the recognized position of the silicon wafer 1 using the transfer device 20 (S48). As a result, the position of the silicon wafer 1 in the horizontal plane is corrected, and the positions of all the silicon wafers 1 in the horizontal plane are within the reference range. The reference range here is set, for example, by adding an allowable error to the measurement result for the silicon wafer 1 held at the bottom.

  If the board 10 has a rotation mechanism (not shown), the process shown in FIG. 5 may be performed again after the board 10 is rotated by 90 ° or 180 °.

  FIG. 6 is a flowchart for explaining the processing in S80 of FIG. First, the transfer device 20 of the film forming apparatus takes out the first silicon wafer 1 from the board 10 (S82) and inserts it into the lowermost stage of the cassette 30. Thereby, the first silicon wafer 1 is stored in the cassette 30 (S84).

  Next, the transfer device 20 takes out the next silicon wafer 1 from the board 10 (S86), and inserts the silicon wafer 1 into the second stage portion from the bottom of the cassette 30. At this time, the position of the silicon wafer 1 already held in the cassette 30 is detected using a plurality of position detection sensors 24a. Then, the position of the inserted silicon wafer 1 is adjusted so that the position of the silicon wafer 1 in the horizontal plane overlaps the position of the silicon wafer 1 already held in the cassette 30 in the horizontal plane. In this way, the next silicon wafer 1 is stored in the cassette 30 (S88).

  The operations shown in S86 and S88 are repeated until all the silicon wafers 1 are transferred to the cassette 30 (S90).

  As described above, the transfer device 20 inserts the next silicon wafer 1 into the cassette 30 while detecting the position of the silicon wafer 1 already held. And the position in the horizontal surface of the inserted silicon wafer 1 is adjusted so that it may overlap with the position in the horizontal surface of the silicon wafer 1 already hold | maintained. Therefore, in the cassette 30, the positional deviation in the horizontal plane direction between the plurality of silicon wafers 1 can be reduced.

  Thereafter, the transfer device 20 uses the position detection sensor 22b attached to the front end of the first base member 22 to start the first base member from the front ends of the plurality of silicon wafers 1 held in the cassette 30. The distance to the tip of 22 is measured in order from the bottom. Next, the silicon wafer 1 whose distance to the tip of the first base member 22 is outside the reference range is recognized, and the position of the recognized silicon wafer 1 is corrected. As a result, the position of the silicon wafer 1 in the horizontal plane is corrected, and the positions of all the silicon wafers 1 in the horizontal plane are within the reference range.

  With these operations, when the silicon wafer 1 is transported from the cassette 30 to a board or the like using a conventional transport device in the next process, the transport device attracts all the silicon wafers 1 at substantially the same position. Can do. Therefore, the displacement in the horizontal plane direction of the silicon wafer 1 is reduced at the transfer destination.

  As described above, according to the first embodiment of the present invention, the transfer device 20 inserts the next silicon wafer 1 into the board 10 while detecting the position of the already held silicon wafer 1. And the position in the horizontal surface of the inserted silicon wafer 1 is adjusted so that it may overlap with the position in the horizontal surface of the silicon wafer 1 already hold | maintained. Accordingly, the positional deviation in the horizontal plane direction between the plurality of silicon wafers 1 can be reduced.

  Thereafter, the transfer device 20 measures the position of each of the plurality of silicon wafers 1 held on the board 10 in the horizontal plane, and moves the silicon wafer 1 that is shifted from the reference position so as to be positioned at the reference position. . For this reason, the positional shift in the horizontal plane direction between the plurality of silicon wafers 1 can be further reduced.

  For this reason, the variation of the deposited film is reduced among the plurality of silicon wafers 1 and the uniformity is increased.

  When the silicon wafer 1 after film formation is moved from the board 10 to the cassette 30, the next silicon wafer 1 is inserted into the cassette 30 while detecting the position of the already held silicon wafer 1. And the position in the horizontal surface of the inserted silicon wafer 1 is adjusted so that it may overlap with the position in the horizontal surface of the silicon wafer 1 already hold | maintained. Accordingly, the positional deviation in the horizontal plane direction between the plurality of silicon wafers 1 can be reduced.

For this reason, when the silicon wafer 1 is transported from the cassette 30 to a board or the like using a conventional transport device in the next step, the positional deviation of the silicon wafer 1 in the horizontal plane direction at the transport destination can be reduced.
In addition, since the control unit 40 controls the above-described operation, the above-described effects can be obtained regardless of the operator's ability.

  FIG. 7 is a schematic side view for explaining the configuration of the film forming apparatus according to the second embodiment of the present invention. The configuration and operation of the film forming apparatus shown in this drawing are the same as those in the first embodiment except that the transfer apparatus 20 transfers a plurality of silicon wafers 1 simultaneously. Hereinafter, the same components as those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  In the present embodiment, the transport device 20 has a plurality of first base members 22 in a state of being vertically separated. Thereby, the transfer device 20 can simultaneously take out the plurality of silicon wafers 1 from the cassette 30 and insert them into the board 10. In addition, after film formation, a plurality of silicon wafers 1 can be simultaneously taken out from the board 10 and inserted into the cassette 30.

  The position detection sensor 22b is attached to the first base member 22 located at the lowermost part. The second base member 24 and the position detection sensor 24a are attached to the first base member 22 located at the lowermost part.

The transfer device 20 of the present embodiment performs the same operation as that of the first embodiment, so that the position of the silicon wafer 1 being transferred in the horizontal plane is already held by the board 10 or the cassette 30. It overlaps with the position of 1 in the horizontal plane.
Also in this embodiment, the same effect as in the first embodiment can be obtained.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, in the above-described embodiment, the silicon wafer 1 is held on the board 10 or the cassette 30 in order from the bottom, but may be held in order from the top. In this case, the shape of the second base member 24 and the arrangement of the position detection sensor 24a are changed so that the position of the silicon wafer 1 located above can be detected. As a result, a new silicon wafer 1 can be inserted into the board 10 or the cassette 30 while matching the position of the silicon wafer 1 already held on the board 10 or the cassette 30 in the horizontal plane.

(A) is a schematic side view for explaining the configuration of the film forming apparatus according to the first embodiment, and (B) is a top view of (A). The top view of the conveying apparatus 20. FIG. 3 is a flowchart for explaining the operation of the film forming apparatus shown in FIGS. 1 and 2. Flowchart for explaining the process in S20 of FIG. The flowchart for demonstrating the process in S40 of FIG. The flowchart for demonstrating the process in S80 of FIG. Side surface schematic diagram for demonstrating the structure of the film-forming apparatus which concerns on 2nd Embodiment. Side surface schematic diagram for demonstrating the structure of the conventional film-forming apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,101 ... Silicon wafer, 10, 110 ... Board, 12, 112 ... Support | pillar, 12a, 112a ... Recess, 20, 120 ... Conveyance device, 22 ... First base member, 22a ... Adsorption part, 22b, 24a ... Position Detection sensor, 24 ... second base member, 30, 130 ... cassette, 40 ... control unit

Claims (11)

A wafer holding member for holding a plurality of semiconductor wafers in a state of being vertically separated;
A transport unit for transporting the semiconductor wafer to the wafer holding member and holding the semiconductor wafer on the wafer holding member;
A position detection sensor that is provided in the transfer unit and detects the position of a semiconductor wafer already held by the wafer holding member;
A control unit that controls the transfer unit based on the detection result of the position detection sensor, and adjusts the position of the semiconductor wafer being transferred in the horizontal plane to the position of the semiconductor wafer that is already held by the wafer holding member. When,
A film forming apparatus comprising: The transfer unit holds the semiconductor wafers in order from the bottom on the wafer holding member,
The film forming apparatus according to claim 1, wherein the position detection sensor is provided on a lower surface of the transfer unit. The transport unit is
A substantially plate-shaped first base member;
An adsorption portion provided on the first base member for adsorbing a lower surface of the semiconductor wafer;
A second base member shaped along the edge of the semiconductor wafer;
The film forming apparatus according to claim 1, wherein the position detection sensor is provided on a lower surface of the second base member. A wafer holding member for holding a plurality of semiconductor wafers in a state of being vertically separated;
A transport unit for transporting and holding a semiconductor wafer to the wafer holding member;
A position detection sensor for detecting a position in a horizontal plane of each of a plurality of semiconductor wafers held by the wafer holding member;
A controller that controls the transfer unit based on the detection result of the position detection sensor and corrects the positions of the plurality of semiconductor wafers held by the wafer holding member in a horizontal plane;
A film forming apparatus comprising:   The film forming apparatus according to claim 4, wherein the position detection sensor is provided in the transfer unit. The transport unit is
A substantially plate-shaped base member;
An adsorbing portion provided on the base member and adsorbing a substantially central portion of the lower surface of the semiconductor wafer of the semiconductor wafer;
The film forming apparatus according to claim 5, wherein the position detection sensor is provided in the vicinity of a tip end portion of the base member of the transport unit.   The film forming apparatus according to claim 1, wherein the position detection sensor is a light reflection type sensor. A transport unit that transports and holds the semiconductor wafer in a cassette that holds the plurality of semiconductor wafers in a state of being vertically separated; and
A position detection sensor that is provided in the transfer unit and detects the position of a semiconductor wafer already held in the cassette;
A control unit that controls the transfer unit based on the detection result of the position detection sensor, and adjusts the position in the horizontal plane of the semiconductor wafer being transferred to the position in the horizontal plane of the semiconductor wafer already held in the cassette;
A film forming apparatus comprising: A transport unit that transports and holds the semiconductor wafer in a cassette that holds the plurality of semiconductor wafers in a state of being vertically separated; and
A position detection sensor for detecting positions in a horizontal plane of a plurality of semiconductor wafers held in the cassette;
A control unit that controls the transfer unit based on the detection result of the position detection sensor and corrects the positions of the plurality of semiconductor wafers held in the cassette in a horizontal plane;
A film forming apparatus comprising: Preparing a wafer holding member for holding a plurality of semiconductor wafers in a state of being vertically separated;
A step of transporting the semiconductor wafer to the wafer holding member using a transport unit;
While detecting the planar position of the semiconductor wafer already held by the wafer holding member using a position detection sensor provided in the transfer unit, the position of the semiconductor wafer being transferred in the horizontal plane is determined by the wafer holding member. A step of holding the semiconductor wafer on the wafer holding member after adjusting the position of the semiconductor wafer held in the horizontal plane,
Performing a film forming process on a plurality of semiconductor wafers held by the wafer holding member;
A method for manufacturing a semiconductor device comprising: Preparing a wafer holding member for holding a plurality of semiconductor wafers in a state of being vertically separated;
Transporting and holding a plurality of semiconductor wafers to the wafer holding member;
A position detection sensor is used to detect the positions of the plurality of semiconductor wafers held by the wafer holding member in a horizontal plane, and the plurality of the plurality of semiconductor wafers held by the wafer holding member based on the detection result of the position detection sensor. Correcting the position of the semiconductor wafer in the horizontal plane;
Performing a film forming process on a plurality of semiconductor wafers held by the wafer holding member;
A method for manufacturing a semiconductor device comprising:

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