JP2006219621A - Resin composition and semiconductor device produced by using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin composition having excellent surface flatness, adhesiveness, heat resistance, flexibility and printability and a semiconductor device produced by using the composition. <P>SOLUTION: The resin composition contains (A) an aromatic thermoplastic resin soluble in a polar solvent at room temperature, (B) an aromatic thermoplastic resin insoluble in a polar solvent at room temperature but soluble by heating, (C) a filler having an average particle diameter of 0.1-6μm and a particle diameter distribution of 0.01-15μm and exhibiting rubber elasticity, and (D) a polar solvent. The storage elastic moduli of the composition measured by a rheometer at 1Hz under shear stress of 10 Pa and 1,000 Pa are ≥1,600 Pa and <1,000 Pa, respectively, and the storage elastic modulus ratio (storage modulus (Pa) under shear stress of 10Pa)/(storage modulus (Pa) under shear stress of 1,000Pa) is ≥2. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a resin composition excellent in surface flatness, adhesion, heat resistance, flexibility and printability, and a semiconductor device using the same.

  Since heat-resistant resins such as polyimide resins are excellent in heat resistance and mechanical properties, they are already widely used in the field of electronics as surface protective films and interlayer insulating films for semiconductor elements. Recently, screen printing methods that do not require complicated processes such as exposure, development, and etching have attracted attention as image forming methods for polyimide-based resin films for surface protective films, interlayer insulating films, and stress relieving materials. .

  In the screen printing method, a heat resistant resin paste having a base resin, a filler, and a solvent as constituent components and having thixotropic properties is used. Most of the heat-resistant resin pastes that have been developed so far use silica fine particles or non-soluble polyimide fine particles as a filler to impart thixotropic properties, so that many voids and bubbles remain at the filler interface during heating and drying. However, problems such as low film strength and poor electrical insulation have been pointed out.

  Therefore, there is no such problem, the filler is first dissolved at the time of heating and drying, and it becomes a characteristic by combining it with a special organic filler (soluble filler), base resin, and solvent that are compatible with the base resin to form a film. A heat-resistant resin paste capable of forming an excellent polyimide pattern has been disclosed (see Patent Document 1). In addition, there is a technique of adding a low-elasticity filler, liquid rubber, or the like in order to impart characteristics such as low elasticity to the paste (see Patent Document 2).

  However, if a low-viscosity paste is used to embed a finer wiring pattern on a semiconductor element, the shape retention after printing is inferior. On the other hand, a high-viscosity paste is necessary to impart shape retention after printing. However, there is a tendency that the embeddability of wiring and the like tends to be inferior.

JP-A-2-289646 International Publication No. 01-066665

  The objective of this invention is providing the resin composition excellent in surface flatness, adhesiveness, heat resistance, flexibility, and printability, and a semiconductor device using the same. Moreover, the objective of this invention is providing the resin composition which can form a precise pattern by well-known methods, such as screen printing and dispensing application | coating.

  The present invention is characterized by the following items (1) to (9).

  (1) (A) an aromatic thermoplastic resin soluble in a polar solvent at room temperature, (B) an aromatic thermoplastic resin insoluble in a polar solvent at room temperature, but soluble by heating, (C) average In a resin composition comprising a rubber-elastic filler having a particle size of 0.1 to 6 μm and a particle size distribution of 0.01 to 15 μm, and (D) a polar solvent, a frequency is measured using a rheometer. The storage elastic modulus measured at a shear stress of 10 Pa and 1000 Pa under the condition of 1 Hz is 1600 Pa or more and less than 1000 Pa, respectively, and the ratio of the storage elastic modulus (storage elastic modulus (Pa) at a shear stress of 10 Pa / shear stress of 1000 Pa). A resin composition having a storage elastic modulus (Pa) of 2 or more.

(2) The viscosity measured at a shear stress of 10 Pa and 1000 Pa under the condition of a frequency of 1 Hz using a rheometer is 400 Pa · s or more and less than 400 Pa · s, respectively, and the ratio of the viscosities (at a shear stress of 10 Pa) The resin composition according to the above (1), wherein the viscosity (Pa · s) / viscosity (Pa · s) at a shear stress of 1000 Pa is 1.6 or more.
(3) The storage elastic modulus measured at a frequency of 0.01 Hz and 10 Hz using a rheometer at frequencies of 0.01 Hz and 10 Hz is less than 4000 Pa and 4000 Pa or more, respectively, and the ratio of the storage elastic modulus (frequency 0. 0). The resin composition according to the above (1) or (2), wherein the storage elastic modulus (Pa) at 01 Hz / storage elastic modulus (Pa) at a frequency of 10 Hz) is less than 0.20.
(4) The viscosity measured at a frequency of 0.01 Hz and a frequency of 10 Hz using a rheometer at a frequency of 0.01 Hz and 10 Hz, respectively, is 4000 Pa · s or more and less than 500 Pa · s, and the ratio of the viscosities (frequency 0. The resin composition according to any one of the above (1) to (3), wherein the viscosity at 01 Hz (Pa · s) / viscosity at a frequency of 10 Hz (Pa · s)) is 20 or more.
(5) The value of tan δ (δ = loss elastic modulus (Pa) / storage elastic modulus (Pa)) measured at a frequency of 1 Hz or more using a rheometer is 1 or more and less than 2 The resin composition according to any one of (1) to (4).
(6) (A) an aromatic thermoplastic resin that is soluble in a polar solvent at room temperature, and (B) an aromatic thermoplastic resin that is insoluble in a polar solvent at room temperature, but is soluble by heating, The resin composition according to any one of (1) to (5) above, which is a polyamide resin, a polyimide resin, a polyamideimide resin, or a precursor thereof.

  (7) The resin composition according to any one of (1) to (6), wherein the surface of the filler having rubber elasticity (C) is chemically modified.

  (8) The resin composition according to the above (7), wherein the chemical modification is modification with an epoxy group.

  (9) A semiconductor device using the resin composition according to any one of (1) to (8).

  The resin composition of the present invention is excellent in adhesion, heat resistance, flexibility and printability. Further, the resin composition of the present invention can form a precise pattern even on fine wiring by screen printing, dispensing application, etc. For example, when used as a screen printing paste, fine wiring etc. are embedded. It is possible to satisfy both the conflicting properties of the printing property and the shape retention after printing. Furthermore, a semiconductor device using the resin composition of the present invention gives good characteristics.

  The resin composition of the present invention comprises (A) an aromatic thermoplastic resin that is soluble in a polar solvent at room temperature, and (B) an aromatic thermoplastic resin that is insoluble in a polar solvent at room temperature but is soluble by heating. (C) an average particle size of 0.1 to 6 μm and a particle size distribution of 0.01 to 15 μm, comprising a rubber-elastic filler and (D) a polar solvent, It has a specific storage modulus and viscosity.

  The resin composition of the present invention preferably has a storage elastic modulus measured at a shear stress of 10 Pa and a shear stress of 1000 Pa using a rheometer at a shear stress of 10 Pa and a shear stress of 1000 Pa, respectively, and more preferably less than 1000 Pa, respectively. It is 1800 Pa or more and less than 800 Pa, and particularly preferably 2000 Pa or more and less than 600 Pa, respectively. When the storage elastic modulus measured at a shear stress of 10 Pa is less than 1600 Pa, the shape retention after printing tends to be inferior, and when the storage elastic modulus measured at 1000 Pa is 1000 or more, the embedding property at the time of printing tends to be inferior. Further, the ratio of the storage elastic modulus measured at a shear stress of 10 Pa and the storage elastic modulus measured at a shear stress of 1000 Pa under the condition of a frequency of 1 Hz (storage elastic modulus (Pa) at a shear stress of 10 Pa / storage elastic modulus at a shear stress of 1000 Pa). (Pa)) is preferably 2 or more, more preferably 3 or more, and particularly preferably 4 or more. If this ratio is less than 2, it tends to be difficult to achieve both embedding during printing and shape retention after printing.

  The resin composition of the present invention preferably has a viscosity measured at a shear stress of 10 Pa and a shear stress of 1000 Pa using a rheometer at a shear stress of 10 Pa and a shear stress of 1000 Pa, respectively, of 400 Pa · s or more and less than 400 Pa · s. More preferably, they are 450 Pa · s or more and less than 380 Pa · s, respectively, and particularly preferably 500 Pa · s or more and less than 350 Pa · s, respectively. If the viscosity measured at a shear stress of 10 Pa is less than 400 Pa · s, the shape retention after printing tends to be inferior, and if the viscosity measured at a shear stress of 1000 Pa is 400 Pa · s or more, the embedding property at the time of printing tends to be inferior. . Further, the ratio of the viscosity measured at a shear stress of 10 Pa to the viscosity measured at a shear stress of 1000 Pa under the condition of a frequency of 1 Hz (viscosity at a shear stress of 10 Pa (Pa · s) / viscosity at a shear stress of 1000 Pa (Pa · s)). Is preferably 1.6 or more, more preferably 1.8 or more, and particularly preferably 2.0 or more. If this ratio is less than 1.6, it tends to be difficult to achieve both embedding during printing and shape retention after printing.

  Furthermore, the resin composition of the present invention preferably has a storage elastic modulus measured at a frequency of 0.01 Hz and a frequency of 10 Hz using a rheometer at a frequency of 0.01 Hz and a frequency of 10 Hz, respectively, less than 4000 Pa and 4000 Pa or more. Preferably they are less than 3000 Pa and 5000 Pa or more, respectively, and particularly preferably less than 2000 Pa and 6000 Pa or more, respectively. When the storage elastic modulus measured at a frequency of 0.01 Hz is 4000 Pa or more, the embedding property at the time of printing tends to be inferior, and when the storage elastic modulus measured at 10 Hz is less than 4000 Pa, the shape retention after printing tends to be inferior. Further, the ratio of the storage elastic modulus measured at a frequency of 0.01 Hz and the storage elastic modulus measured at a frequency of 10 Hz under the condition of a shear stress of 10 Pa (storage elastic modulus at a frequency of 0.01 Hz (Pa) / storage elastic modulus at a frequency of 10 Hz). (Pa)) is preferably less than 0.20, more preferably less than 0.18, and particularly preferably less than 0.16. If this ratio is 0.20 or more, it tends to be difficult to achieve both embeddability during printing and shape retention after printing.

  Furthermore, the resin composition of the present invention preferably has a viscosity measured at a frequency of 0.01 Hz and a frequency of 10 Hz using a rheometer at a frequency of 0.01 Hz and a frequency of 10 Hz, respectively, of 4000 Pa · s or more and less than 500 Pa · s. More preferably, they are 5000 Pa · s or more and less than 400 Pa · s, respectively, and particularly preferably 6000 Pa · s or more and less than 300 Pa · s, respectively. If the viscosity measured at a frequency of 0.01 Hz is less than 4000 Pa · s, the shape retention after printing tends to be poor, and if the viscosity measured at a frequency of 10 Hz is 800 Pa · s or more, the embedding property at the time of printing tends to be poor. . Further, the ratio of the viscosity measured at a frequency of 0.01 Hz to the viscosity measured at a frequency of 10 Hz (viscosity at a frequency of 0.01 Hz (Pa · s) / viscosity at a frequency of 10 Hz (Pa · s)) under the condition of a shear stress of 10 Pa. , 20 or more, more preferably 25 or more, and particularly preferably 30 or more. If this ratio is less than 20, it tends to be difficult to achieve both embedding during printing and shape retention after printing.

  The resin composition of the present invention has a value of tan δ (δ = loss elastic modulus (Pa) / storage elastic modulus (Pa)) measured at a frequency of 1 Hz or higher using a rheometer under a shear stress of 10 Pa. It is preferably 1 or more and less than 2, more preferably 1.0 to 1.8, and particularly preferably 1.1 to 1.7. When the value of tan δ is less than 1, the embedding property at the time of printing tends to be inferior, and when it is 2 or more, the shape retention after printing tends to be inferior.

  The storage elastic modulus and viscosity of the resin composition of the present invention at a frequency of 1 Hz under a shear stress of 10 Pa, and the viscosity at a frequency of 0.01 Hz under the condition of a shear stress of 10 Pa respectively constitute the resin composition of the present invention. It can be increased by increasing the weight average molecular weight of the component (A) or the component (B), and can also be increased by reducing the amount of the component (D) used. Moreover, it can also enlarge by using the solvent which is excellent in the solubility of (A) component as one component of (D) component.

  The storage elastic modulus at a frequency of 0.01 Hz under the condition of the shear stress of 10 Pa of the resin composition of the present invention is the weight average molecular weight of the component (A) or the component (B) constituting the resin composition of the present invention. It can be made smaller by making it smaller, and it can also be made smaller by increasing the amount of component (D) used. Moreover, it can be made small also by using the solvent which is excellent in the solubility of (A) component as one component of (D) component.

  The storage elastic modulus and viscosity at a shear stress of 1000 Pa under the condition of a frequency of 1 Hz, and the viscosity at a frequency of 10 Hz under the condition of a shear stress of 10 Pa, respectively, of the resin composition of the present invention constitute the resin composition of the present invention. It can be reduced by reducing the weight average molecular weight of the component (A) and the component (B), and can also be reduced by increasing the amount of the component (D) used. Moreover, it can be made small also by using the solvent which is excellent in the solubility of (A) component as one component of (D) component.

  The storage elastic modulus at a frequency of 10 Hz under the condition of the shear stress of 10 Pa of the resin composition of the present invention increases the weight average molecular weight of the component (A) and the component (B) constituting the resin composition of the present invention. It can also be increased by reducing the amount of component (D) used. Moreover, it can also enlarge by using the solvent which is excellent in the solubility of (A) component as one component of (D) component.

  The value of the tan δ at a frequency of 1 Hz or higher under the condition of the shear stress of 10 Pa of the resin composition of the present invention increases the weight average molecular weight of the component (A) or component (B) constituting the resin composition of the present invention. (D) It can adjust by reducing the usage-amount of a polar solvent.

  In addition, the above storage elastic modulus and viscosity can be measured at room temperature using a rheometer (dynamic viscoelasticity measuring device). As such a device, for example, manufactured by BOHLIN INSTRUMENTS Examples thereof include a rheometer and a CSR-10 type.

  In the present invention, (A) an aromatic thermoplastic resin that is soluble in a polar solvent at room temperature, and (B) an aromatic thermoplastic resin that is insoluble in a polar solvent at room temperature but is soluble by heating, Although not limited, it is preferably a polyamide resin, a polyimide resin, a polyamideimide resin, or a precursor thereof. The component (B) imparts thixotropy to the resin composition of the present invention, and enables precise pattern formation by screen printing, dispensing application, or the like. The “room temperature” refers to a temperature condition in the case where the solvent temperature is not specified or adjusted, and is left indoors, and is not particularly limited, but a temperature within a range of 10 to 40 ° C. It is preferable that Further, “heating” means raising the temperature of the solvent to 80 ° C. or higher, preferably 80 ° C. to 200 ° C., more preferably 100 to 180 ° C. When the heating temperature is less than 80 ° C., the (C) filler is not sufficiently dispersed, and the surface flatness of the resulting coating film tends to decrease.

  Examples of the method for obtaining the polyamide resin, polyimide resin, polyamideimide resin, or precursors thereof include aromatic, aliphatic or alicyclic diamine compounds, dicarboxylic acids or reactive acid derivatives thereof and / or tricarboxylic acids. Or it may be based on well-known methods, such as the method by the reaction with the reactive acid derivative and / or tetracarboxylic dianhydride, and it does not specifically limit. The reaction can be carried out in the absence of a solvent or in the presence of an organic solvent, the reaction temperature is preferably 25 ° C. to 250 ° C., and the reaction time is appropriately selected depending on the scale of the batch, the reaction conditions employed, etc. Can do.

  The organic solvent for producing the component (A) and the component (B) is not particularly limited, and examples thereof include ether solvents such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, triethylene glycol dimethyl ether, and triethylene glycol diethyl ether. Sulfur-containing solvents such as dimethyl sulfoxide, diethyl sulfoxide, dimethyl sulfone and sulfolane, ester solvents such as γ-butyrolactone and cellosolve acetate, ketone solvents such as cyclohexanone and methyl ethyl ketone, N-methylpyrrolidone, dimethylacetoacetate, 1, Examples thereof include nitrogen-containing solvents such as 3-dimethyl-3,4,5,6-tetrahydro-2 (1H) -pyrimidinone, and aromatic hydrocarbon solvents such as toluene and xylene. Combinations or more types can be used, preferably used to select a solvent which dissolves the resulting resin.

  Moreover, there is no restriction | limiting in particular also in the method of spin-drying | dehydrating and ring-closing a polyimide resin precursor or a polyamideimide resin precursor, and a general method can be used. For example, a thermal ring closure method in which dehydration ring closure is performed by heating under normal pressure or reduced pressure, a chemical ring closure method using a dehydrating agent such as acetic anhydride in the presence or absence of a catalyst, and the like can be used.

  In the case of the thermal ring closure method, it is preferably carried out while removing water generated by the dehydration reaction out of the system. At this time, it is carried out by heating the reaction solution to 80 to 400 ° C, preferably 100 to 250 ° C. At this time, a solvent that azeotropes with water such as benzene, toluene, xylene or the like may be used in combination to remove water azeotropically.

  In the case of the chemical ring closure method, the reaction is carried out at 0 to 120 ° C., preferably 10 to 80 ° C. in the presence of a chemical dehydrating agent. As the chemical dehydrating agent, for example, acid anhydrides such as acetic anhydride, propionic anhydride, butyric anhydride, and benzoic acid, and carbodiimide compounds such as dicyclohexylcarbodiimide are preferably used. At this time, it is preferable to use together a substance that promotes the cyclization reaction, such as pyridine, isoquinoline, trimethylamine, triethylamine, aminopyridine, imidazole. The chemical dehydrating agent is used in an amount of 90 to 600 mol% based on the total amount of the diamine compound, and the substance that promotes the cyclization reaction is used in an amount of 40 to 300 mol% based on the total amount of the diamine compound. Further, a dehydration catalyst such as triphenyl phosphite, tricyclohexyl phosphite, triphenyl phosphate, phosphorus compounds such as phosphoric acid and phosphorus pentoxide, and boron compounds such as boric acid and boric anhydride may be used.

  The reaction solution that has been imidized by the dehydration reaction is poured into a large excess solvent that is compatible with the above organic solvent such as a lower alcohol such as methanol, water, or a mixture thereof, and is a poor solvent for the resin. A precipitate of resin is obtained, this is filtered off, and the solvent is dried to obtain a polyimide resin or a polyamideimide resin. Considering reduction of remaining ionic impurities, etc., the above-described thermal ring closure method is preferable.

  In the resin composition of the present invention, the blending amounts of the component (A) and the component (B) are not particularly limited and may be arbitrary, but preferably (B) with respect to 100 parts by weight of the component (A) 10 to 300 parts by weight of component, more preferably 10 to 200 parts by weight of component (B) is added to 100 parts by weight of component (A). When the blending amount of the component (B) is less than 10 parts by weight, the thixotropic property of the obtained resin composition tends to be lowered, and when it is more than 300 parts by weight, the obtained film properties tend to be lowered.

  The filler having rubber elasticity (C) in the present invention is not particularly limited, and examples thereof include elastic fillers such as acrylic rubber, fluorine rubber, silicone rubber, and butadiene rubber, and liquid rubber thereof. In consideration of the heat resistance of the resin composition of the present invention, silicone rubber is preferable. For example, Trefill E series (trade name, manufactured by Toray Dow Corning Silicone Co., Ltd.) can be used. (C) It is preferable that the average particle diameter of a component is 0.1-6 micrometers, It is more preferable that it is 0.2-5 micrometers, It is especially preferable that it is 0.3-4 micrometers. When the average particle size is less than 0.1 μm, aggregation between particles occurs, and it tends to be difficult to sufficiently disperse the filler. When the average particle size exceeds 6 μm, it is difficult to introduce a filtration step, There is a tendency for surface flatness to decrease. The shape is preferably finely divided into a spherical shape or an indefinite shape. Furthermore, the particle size distribution of the component (C) is preferably 0.01 to 15 μm, more preferably 0.02 to 15 μm, and particularly preferably 0.03 to 15 μm. When particles having a particle size of less than 0.01 μm are present, aggregation between particles tends to occur, and it is difficult to sufficiently disperse the filler. When particles having a particle size exceeding 15 μm are present, a filtration step may be introduced. It becomes difficult and the surface flatness of the resulting coating film tends to be lowered.

  Moreover, it is preferable that the surface of the filler which is (C) component is chemically modified with the functional group. Examples of such a functional group include an epoxy group, an amino group, an acrylic group, a vinyl group, and a phenyl group, and an epoxy group is preferable. For example, the trefill E-series silicone rubber of Trefill E series has a surface modified with an epoxy group and is suitable as the component (C).

  The component (C) is preferably used in an amount of 5 to 900 parts by weight, preferably 5 to 800 parts by weight, based on 100 parts by weight of the total amount of the aromatic thermoplastic resin including the component (A) and the component (B). More preferably it is used. By adding such a filler (C) to a thermoplastic resin having heat resistance, it becomes possible to make the resin composition low elastic without impairing the heat resistance and adhesion of the resin composition, and its elastic modulus. Can be controlled.

  The (D) polar solvent in the present invention is not particularly limited as long as it is a solvent composed of polar molecules. For example, N-methylpyrrolidone, dimethylacetamide, dimethylformamide, 1,3-dimethyltetrahydro- Nitrogen-containing compounds such as 2 (1H) -pyrimidinone, sulfur-containing compounds such as sulfolane and dimethyl sulfoxide, γ-butyrolactone, γ-valerolactone, γ-caprolactone, γ-heptalactone, α-acetyl-γ-butyrolactone, ε- Lactones such as caprolactone, ketones such as methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, acetophenone, ethylene glycol, glycerin, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether Diethylene glycol dibutyl ether, triethylene glycol dimethyl ether, triethylene glycol diethyl ether, triethylene glycol dipropyl ether, triethylene glycol dibutyl ether, tetraethylene glycol dimethyl ether, tetraethylene glycol diethyl ether, tetraethylene glycol dipropyl ether, tetraethylene Examples include glycol dibutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, tetraethylene glycol monomethyl ether, and tetraethylene glycol monoethyl ether.

  The blending amount of the component (D) may be appropriately determined in consideration of the storage elastic modulus and viscosity of the resin composition of the present invention, and is not particularly limited, but the total resin total amount in the resin composition of the present invention is 100 parts by weight. The blending amount is preferably 100 to 3500 parts by weight, and more preferably 150 to 1000 parts by weight.

  Moreover, you may add additives, such as a coloring agent and a coupling agent, and a resin modifier to the resin composition of this invention as needed. Examples of the colorant include carbon black, dyes, and pigments. Examples of the coupling agent include silane-based, titanium-based, and aluminum-based, and silane-based coupling agents are most preferable.

  The silane coupling agent is not particularly limited, and examples thereof include vinyltrichlorosilane, vinyltris (β-methoxyethoxy) silane, vinyltriethoxysilane, vinyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, and γ-methacrylate. Roxypropylmethyldimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropylmethyldiethoxy Silane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltri Toxisilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, 3-aminopropylmethyldiethoxysilane, 3-ureidopropyltriethoxysilane, 3-ureidopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane 3-aminopropyl-tris (2-methoxy-ethoxy-ethoxy) silane, N-methyl-3-aminopropyltrimethoxysilane, triaminopropyl-trimethoxysilane, 3-4,5-dihydroimidazol-1-yl -Propyltrimethoxysilane, 3-methacryloxypropyl-trimethoxysilane, 3-mercaptopropyl-methyldimethoxysilane, 3-chloropropyl-methyldimethoxysilane, 3-chloropropyl-dimethoxysilane 3-cyanopropyl-triethoxysilane, hexamethyldisilazane, N, O-bis (trimethylsilyl) acetamide, methyltrimethoxysilane, methyltriethoxysilane, ethyltrichlorosilane, n-propyltrimethoxysilane, isobutyltrimethoxysilane, Amyltrichlorosilane, octyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, methyltri (methacryloyloxyethoxy) silane, methyltri (glycidyloxy) silane, N-β (N-vinylbenzylaminoethyl) -γ-aminopropyl Trimethoxysilane, octadecyldimethyl [3- (trimethoxysilyl) propyl] ammonium chloride, γ-chloropropylmethyldichlorosilane, γ-chloropropylmethyl Methoxysilane, γ-chloropropylmethyldiethoxysilane, trimethylsilyl isocyanate, dimethylsilyl isocyanate, methylsilyl triisocyanate, vinylsilyl triisocyanate, phenylsilyl triisocyanate, tetraisocyanate silane, ethoxysilane isocyanate, etc. can be used. These may be used alone or in combination of two or more.

  The titanium-based coupling agent is not particularly limited. For example, isopropyl trioctanoyl titanate, isopropyl dimethacrylisostearoyl titanate, isopropyl tridodecylbenzenesulfonyl titanate, isopropyl isostearoyl diacryl titanate, isopropyl tri (dioctyl phosphate) titanate, Isopropyltricumylphenyl titanate, isopropyltris (dioctylpyrophosphate) titanate, isopropyltris (n-aminoethyl) titanate, tetraisopropylbis (dioctylphosphite) titanate, tetraoctylbis (ditridecylphosphite) titanate, tetra (2, 2-Diallyloxymethyl-1-butyl) bis (ditridecyl) phosphite titane , Dicumylphenyloxyacetate titanate, bis (dioctylpyrophosphate) oxyacetate titanate, tetraisopropyl titanate, tetranormal butyl titanate, butyl titanate dimer, tetra (2-ethylhexyl) titanate, titanium acetylacetonate, polytitanium acetate Nitrate, Titanium Octylene Glycolate, Titanium Lactate Ammonium Salt, Titanium Lactate, Titanium Lactate Ethyl Ester, Titanium Chileethanol Aminate, Polyhydroxy Titanium Stearate, Tetramethyl Orthotitanate, Tetraethyl Orthotitanate, Tetarapropyl Orthotitanate, Tetraisobutyl Ortho Titanate, stearyl titanate, cresyl titanate monomer, cresyl Nate polymer, diisopropoxy-bis (2,4-pentadionate) titanium (IV), diisopropyl-bis-triethanolamino titanate, octylene glycol titanate, tetra-n-butoxytitanium polymer, tri-n-butoxytitanium A monostearate polymer, tri-n-butoxytitanium monostearate, etc. can be used, and these 1 type (s) or 2 or more types can also be used together.

  The aluminum coupling agent is not particularly limited. For example, ethyl acetoacetate aluminum diisopropylate, aluminum toys (ethyl acetoacetate), alkyl acetoacetate aluminum diisopropylate, aluminum monoacetyl acetate bis (ethyl acetoacetate), Aluminum tris (acetylacetonate), aluminum = monoisopropoxymonooroxyethyl acetoacetate, aluminum-di-n-butoxide-mono-ethylacetoacetate, aluminum-di-iso-propoxide-mono-ethylacetoacetate, etc. Aluminum chelate compound, aluminum isopropylate, mono-sec-butoxyaluminum diisopropylate, aluminum-sec- Chireto, aluminum alcoholates of aluminum ethylate or the like can be used, may be used in combination one or more of them.

  The additive is preferably used in an amount of 50 parts by weight or less based on 100 parts by weight of the total amount of the aromatic thermoplastic resin including the component (A) and the component (B). When there is more addition amount of the said additive than 50 weight part, there exists a tendency for the coating-film physical property obtained to fall.

  The method for forming a precise pattern using the resin composition of the present invention is not particularly limited, for example, screen printing method, dispensing method, potting method, curtain coating method, letterpress printing method, intaglio printing method, Examples include lithographic printing.

  The semiconductor device using the resin composition of the present invention is, for example, after applying the resin composition of the present invention to a substrate or a lead frame or pasting a resin film made of the resin composition of the present invention to form a resin layer, It is obtained by bonding a chip on a resin layer. Needless to say, the resin composition of the present invention may be applied to the chip surface or a resin film made of the resin composition of the present invention may be attached to the chip surface and then adhered to the substrate or the lead frame. The coating and drying can be performed by a known method. Under the present circumstances, a coating film can be obtained by the process of solvent drying of 250 degrees C or less without imidation. It is preferable that the glass transition temperature Tg of the formed coating film is 180 ° C. or higher and the thermal decomposition temperature is 300 ° C. or higher because it has sufficient heat resistance. Moreover, since the elasticity modulus of a coating film can be controlled in the range of 0.2-3.0 GPa, it can respond to all semiconductor devices.

  The semiconductor device using the resin composition of the present invention includes, for example, a step of forming a resin layer by applying and drying the resin composition of the present invention on a semiconductor substrate on which a plurality of wirings having the same structure is formed, Forming a rewiring electrically connected to the electrode on the semiconductor substrate, forming a protective layer on the rewiring, forming an external electrode terminal on the protective layer, and then if necessary It is manufactured by performing a dicing process. Although it does not restrict | limit especially as said semiconductor substrate, For example, a silicon wafer etc. are mentioned. The method for applying the resin layer is not particularly limited, but screen printing or dispensing application is preferable. The drying method of a resin layer can be performed by a well-known method. Further, since it has sputtering resistance, plating resistance, alkali resistance, etc. required in the process of forming the rewiring, it can be applied to any semiconductor device. In addition, the amount of warpage of the silicon wafer can be reduced. A semiconductor device manufactured by this method can be expected to improve yield, and productivity can be improved.

  EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited to these.

(Synthesis Example 1)
2,2-bis [4- (4-aminophenoxy) phenyl] propane in a 0.5 liter four-necked flask equipped with a thermometer, stirrer, nitrogen inlet tube, and cooling tube with an oil / water separator under a nitrogen stream 45.92 g (112 mmol) (hereinafter referred to as BAPP) was added, and 50 g of N-methyl-2-pyrrolidone (hereinafter referred to as NMP) was added and dissolved. Next, 23.576 g (112 mmol) of trimellitic anhydride chloride (hereinafter referred to as TAC) was added while cooling so as not to exceed 20 ° C. After stirring at room temperature for 1 hour, 13.5744 g (134.4 mmol) of triethylamine (hereinafter referred to as TEA) was added while cooling so as not to exceed 20 ° C., and reacted at room temperature for 3 hours to produce a polyamic acid varnish. did. The obtained polyamic acid varnish was further subjected to a dehydration reaction at 190 ° C. for 6 hours to produce a polyamideimide resin varnish. A precipitate obtained by pouring the varnish of the polyamideimide resin into water was separated, pulverized and dried to obtain a polyamideimide resin powder (PAI-1) soluble in a polar solvent at room temperature.
It was 88,000 when the weight average molecular weight of the obtained polyamidoimide resin (PAI-1) was measured in standard polystyrene conversion using gel permeation chromatography (henceforth GPC).

(Synthesis Example 2)
Under a nitrogen stream, 45.92 g (112 mmol) of BAPP was placed in a 0.5 liter four-necked flask equipped with a thermometer, a stirrer, a nitrogen introducing tube, and a cooling tube with an oil / water separator, and NMP 50 g was added and dissolved. Next, while cooling so as not to exceed 20 ° C., 14.1456 g (67.2 mmol) of TAC and 14.2566 g of 3,4,3 ′, 4′-benzophenonetetracarboxylic dianhydride (hereinafter referred to as BTDA) (44 .8 mmol) was added. After stirring at room temperature for 1 hour, 8.145 g (80.64 mmol) of TEA was added while cooling so as not to exceed 20 ° C., and reacted at room temperature for 3 hours to produce a polyamic acid varnish. The obtained polyamic acid varnish was further subjected to a dehydration reaction at 190 ° C. for 6 hours to produce a polyamideimide resin varnish. A precipitate obtained by pouring the varnish of the polyamideimide resin into water is separated, pulverized and dried, and is insoluble in a polar solvent at room temperature, but is soluble in polyamideimide resin powder by heating (PAI-2) Got. It was 90,000 when the weight average molecular weight of the obtained polyamidoimide resin (PAI-2) was measured in standard polystyrene conversion using GPC.

(Synthesis Example 3)
Under a nitrogen stream, 45.92 g (112 mmol) of BAPP was placed in a 0.5 liter four-necked flask equipped with a thermometer, a stirrer, a nitrogen introducing tube, and a cooling tube with an oil / water separator, and NMP 50 g was added and dissolved. Next, 14.1456 g (67.2 mmol) of TAC and 14.256 g (44.8 mmol) of BTDA were added while cooling so as not to exceed 20 ° C. After stirring at room temperature for 1 hour, 8.145 g (80.64 mmol) of TEA was added while cooling so as not to exceed 20 ° C., and reacted at room temperature for 3 hours to produce a polyamic acid varnish. The resulting polyamic acid varnish was further subjected to a dehydration reaction at 190 ° C. for 3 hours to produce a polyamideimide resin varnish. A precipitate obtained by pouring the varnish of polyamideimide resin into water is separated, pulverized and dried, and is insoluble in a polar solvent at room temperature, but is soluble by heating to a polyamideimide resin powder (PAI-3) Got. It was 60,000 when the weight average molecular weight of the obtained polyamidoimide resin (PAI-3) was measured in standard polystyrene conversion using GPC.

Example 1
110 g of polyamideimide resin powder (PAI-1) soluble in room temperature obtained in Synthesis Example 1 in a 1 liter four-necked flask equipped with a thermometer, stirrer, nitrogen inlet tube and cooling tube in a nitrogen stream , 33 g of polyamideimide resin powder (PAI-2) obtained in Synthesis Example 2 that is insoluble at room temperature in the polar solvent but soluble by heating, 300 g of γ-butyrolactone (hereinafter referred to as γ-BL), and 129 g of triethylene glycol dimethyl ether (hereinafter referred to as DMTG) was added and the temperature was raised to 130 ° C. with stirring. After stirring at 130 ° C. for 2 hours, heating was stopped and the mixture was allowed to cool to room temperature with stirring to obtain a yellow resin composition. To the obtained yellow resin composition, Trefill E-601 (trade name, silicone rubber powder manufactured by Toray Dow Corning Silicone Co., Ltd., average particle size: about 2 μm, particle size distribution 1 to 10 μm) 61.3 g and 1, After adding 114.55 g of 3-dimethyltetrahydro-2 (1H) -pyrimidinone (hereinafter referred to as DMPU) and kneading and dispersing with a planetary mixer, this was charged into a filter KST-47 (manufactured by Advantech Co., Ltd.). Then, a silicon rubber piston was inserted and pressure filtered at a pressure of 3.0 kg / cm ² to obtain a resin composition (P-1).

  About the obtained resin composition (P-1), the storage elastic modulus and viscosity (rheological characteristic) were measured. For these measurements, a rheometer manufactured by BOHLIN INSTRUMENTS, model CSR-10, was used. Frequency fluctuation measurement was performed by applying a shear stress of 10 Pa for 60 seconds and then fixing the shear stress to 10 Pa. Measured by varying up to 1. At this time, the number of sampling points during measurement was 16 points, and each measurement waiting time was 5 seconds. The shear stress fluctuation measurement was performed by fixing the frequency to 1 Hz and applying a 10 Pa shear stress for 60 seconds, and then changing the shear stress from 10 Pa to 2400 Pa. At this time, the number of sampling points during measurement was 30 points, and each measurement waiting time was 5 seconds. The results are shown in Table 1.

<Resin paste characteristics>
Further, the obtained resin composition was subjected to screen printing on a semiconductor substrate (pitch size 5.3 mm × 6.3 mm, scribe line 100 μm) on which wirings were formed (LS-34GX with alignment device, manufactured by Nylung Seimitsu Kogyo Co., Ltd.). ), Nickel alloy laser etching metal plate (manufactured by Process Lab Micron Co., Ltd., thickness 200 μm, opening size 5 mm × 6 mm, pitch size 5.3 mm × 6.3 mm) and Permalex metal squeegee (imported by Sakai Kogyo Co., Ltd.) Was used for printing, and the printability (paste characteristics) was evaluated. The evaluation was performed by evaluating the paste embedding property in the wiring and the shape retention after printing using the following criteria using an optical microscope. Moreover, several g of the obtained resin composition was weighed on a metal petri dish, and the nonvolatile content concentration (hereinafter referred to as NV) was measured and calculated as follows. The results are shown in Table 1.

・ Paste embedding in wiring ◎: No voids due to poor embedding (pass)
○: Slightly generated voids due to poor filling (pass)
Δ: Slightly generated voids due to imbedding defects ×: Occurrence of voids due to embedding defects almost all over

・ Shape retention after printing ◎: Scribe line formation (pass)
○: Scribe line crushing occurs slightly (pass)
Δ: Scribe line collapse occurs in part ×: Scribe line collapse (almost the entire surface)

Nonvolatile content concentration NV (%) = (resin composition amount after heat drying (g) / resin composition amount before heat drying (g)) × 100
Drying conditions: 150 ° C.-1 hour + 250 ° C.-2 hours

<Resin film characteristics>
Furthermore, the obtained resin composition was applied onto a Teflon (registered trademark) substrate, heated at 250 ° C. to dry the organic solvent, and a coating film having a thickness of 25 μm was formed. About the said coating film, the tensile elasticity modulus (25 degreeC, 10 Hz) and the glass transition temperature (frequency 10 Hz, temperature increase rate 2 degree-C / min) were measured with the dynamic viscoelasticity spectrometer (made by Iwamoto Seisakusho Co., Ltd.). Further, the thermal decomposition starting temperature was measured with a thermobalance under the conditions of a temperature rising rate: 10 ° C./min and an atmosphere: air. The results are shown in Table 1.

<Manufacture and evaluation of semiconductor devices>
Applying the obtained resin composition on a semiconductor substrate on which wiring is formed by screen printing and drying to form a resin layer, rewiring electrically connected to the electrode on the semiconductor substrate on the resin layer A semiconductor device was manufactured through a process of forming a protective layer on the rewiring, a process of forming an external electrode terminal on the protective layer, and a process of dicing the substrate.

  The obtained semiconductor device was subjected to a heat cycle test (1000 cycles of −55 ° C./30 min and 125 ° C./30 min) to examine whether cracks occurred in the resin layer. The semiconductor device was evaluated by ◯ indicating that no crack was generated and × indicating that the crack was generated. The results are shown in Table 1.

(Example 2)
110 g of polyamideimide resin powder (PAI-1) soluble at room temperature obtained in Synthesis Example 1 under a nitrogen stream in a 1 liter four-necked flask equipped with a thermometer, stirrer, nitrogen introducing tube and cooling tube, 33 g of polyamideimide resin powder (PAI-2), 300 g of γ-BL and 129 g of DMTG, which are insoluble at room temperature in the polar solvent obtained in Synthesis Example 2, but heated to 130 ° C. with stirring. Warm up. After stirring at 130 ° C. for 2 hours, heating was stopped and the mixture was allowed to cool to room temperature with stirring to obtain a yellow resin composition. To the obtained yellow resin composition, Trefill E-601 (trade name, silicone rubber powder, average particle size: about 2 μm, particle size distribution 1 to 10 μm, manufactured by Toray Dow Corning Silicone Co., Ltd.) 61.3 g and DMPU157. After adding 5 g and kneading and dispersing with a planetary mixer, this is filled into a filter KST-47 (manufactured by Advantech Co., Ltd.), a silicon rubber piston is inserted, and pressure is applied at a pressure of 3.0 kg / cm ^2. The resin composition (P-2) was obtained by pressure filtration.

  The resin composition (P-2) obtained was evaluated in exactly the same way as in Example 1. The results are shown in Table 1.

(Example 3)
110 g of polyamideimide resin powder (PAI-1) soluble at room temperature obtained in Synthesis Example 1 under a nitrogen stream in a 1 liter four-necked flask equipped with a thermometer, stirrer, nitrogen introducing tube and cooling tube, 33 g of polyamideimide resin powder (PAI-3), 300 g of γ-BL and 129 g of DMTG, which are insoluble at room temperature in the polar solvent obtained in Synthesis Example 3, but heated to 130 ° C. with stirring. Warm up. After stirring at 130 ° C. for 2 hours, heating was stopped and the mixture was allowed to cool to room temperature with stirring to obtain a yellow resin composition. To the obtained yellow resin composition, 61.3 g of Trefill E-601 (trade name, silicone rubber powder, average particle size: about 2 μm, particle size distribution 1 to 10 μm, manufactured by Toray Dow Corning Silicone Co., Ltd.) and DMPU 52. After adding 5 g and kneading and dispersing with a planetary mixer, this is filled into a filter KST-47 (manufactured by Advantech), and a silicon rubber piston is inserted and applied at a pressure of 3.0 kg / cm ^2. The resin composition (P-3) was obtained by pressure filtration.

  The resin composition (P-3) obtained was evaluated in exactly the same way as in Example 1. The results are shown in Table 1.

(Comparative Example 1)
110 g of polyamideimide resin powder (PAI-1) soluble at room temperature obtained in Synthesis Example 1 under a nitrogen stream in a 1 liter four-necked flask equipped with a thermometer, stirrer, nitrogen introducing tube and cooling tube, 33 g of polyamideimide resin powder (PAI-2), 300 g of γ-BL and 129 g of DMTG, which are insoluble at room temperature in the polar solvent obtained in Synthesis Example 2, but heated to 130 ° C. with stirring. Warm up. After stirring at 130 ° C. for 2 hours, heating was stopped and the mixture was allowed to cool to room temperature with stirring to obtain a yellow resin composition. To the obtained yellow resin composition was added 61.3 g of Trefill E-601 (trade name, silicone rubber powder, average particle size: about 2 μm, particle size distribution 1 to 10 μm, manufactured by Toray Dow Corning Silicone Co., Ltd.). After kneading and dispersing with a planetary mixer, this is filled into a filter KST-47 (manufactured by Advantech Co., Ltd.), a silicon rubber piston is inserted, and pressure filtration is performed at a pressure of 3.0 kg / cm ^2. A resin composition (P-4) was obtained.

  The resin composition (P-4) obtained was evaluated in exactly the same way as in Example 1. The results are shown in Table 1.

(Comparative Example 2)
110 g of polyamideimide resin powder (PAI-1) soluble at room temperature obtained in Synthesis Example 1 under a nitrogen stream in a 1 liter four-necked flask equipped with a thermometer, stirrer, nitrogen introducing tube and cooling tube, 33 g of polyamideimide resin powder (PAI-2), 300 g of γ-BL and 129 g of DMTG, which are insoluble at room temperature in the polar solvent obtained in Synthesis Example 2, but heated to 130 ° C. with stirring. Warm up. After stirring at 130 ° C. for 2 hours, heating was stopped and the mixture was allowed to cool to room temperature with stirring to obtain a yellow resin composition. To the obtained yellow resin composition, 61.3 g of Trefill E-601 (trade name, silicone rubber powder, average particle size: about 2 μm, particle size distribution 1 to 10 μm, manufactured by Toray Dow Corning Silicone Co., Ltd.) and DMPU 52. After adding 5 g and kneading and dispersing with a planetary mixer, this is filled into a filter KST-47 (manufactured by Advantech Co., Ltd.), a silicon rubber piston is inserted, and pressure is applied at a pressure of 3.0 kg / cm ^2. The resin composition (P-5) was obtained by pressure filtration.

  The resin composition (P-5) obtained was evaluated in exactly the same way as in Example 1. The results are shown in Table 1.

(Comparative Example 3)
110 g of polyamideimide resin powder (PAI-1) soluble at room temperature obtained in Synthesis Example 1 under a nitrogen stream in a 1 liter four-necked flask equipped with a thermometer, stirrer, nitrogen introducing tube and cooling tube, 33 g of polyamideimide resin powder (PAI-2), 300 g of γ-BL and 129 g of DMTG, which are insoluble at room temperature in the polar solvent obtained in Synthesis Example 2, but heated to 130 ° C. with stirring. Warm up. After stirring at 130 ° C. for 2 hours, heating was stopped and the mixture was allowed to cool to room temperature with stirring to obtain a yellow resin composition. 61.3 g of Trefill E-601 (trade name manufactured by Toray Dow Corning Silicone Co., Ltd., silicone rubber powder, average particle size: about 2 μm, particle size distribution 1 to 10 μm) and DMPU 189 g were added to the obtained yellow resin composition. After adding and kneading and dispersing with a planetary mixer, this is filled into a filter KST-47 (manufactured by Advantech), a silicon rubber piston is inserted, and pressure filtration is performed at a pressure of 3.0 kg / cm ^2. Thus, a resin composition (P-6) was obtained.

  The resin composition (P-6) obtained was evaluated in exactly the same way as in Example 1. The results are shown in Table 1.

(Comparative Example 4)
110 g of polyamideimide resin powder (PAI-1) soluble at room temperature obtained in Synthesis Example 1 under a nitrogen stream in a 1 liter four-necked flask equipped with a thermometer, stirrer, nitrogen introducing tube and cooling tube, 33 g of polyamideimide resin powder (PAI-2), 300 g of γ-BL and 129 g of DMTG, which are insoluble at room temperature in the polar solvent obtained in Synthesis Example 2, but heated to 130 ° C. with stirring. Warm up. After stirring at 130 ° C. for 2 hours, heating was stopped and the mixture was allowed to cool to room temperature with stirring to obtain a yellow resin composition. To the obtained yellow resin composition, Trefill E-601 (trade name, silicone rubber powder manufactured by Toray Dow Corning Silicone Co., Ltd., average particle size: about 2 μm, particle size distribution 1 to 10 μm) 61.3 g, γ − After adding 36.75 g of BL and 15.75 g of DMTG and kneading and dispersing with a planetary mixer, this was filled into a filter KST-47 (manufactured by Advantech Co., Ltd.), a silicon rubber piston was inserted, and 3.0 kg / The resin composition (P-7) was obtained by pressure filtration at a pressure of cm ² .

  The resin composition (P-7) obtained was evaluated in exactly the same way as in Example 1. The results are shown in Table 1.

(Comparative Example 5)
110 g of polyamideimide resin powder (PAI-1) soluble at room temperature obtained in Synthesis Example 1 under a nitrogen stream in a 1 liter four-necked flask equipped with a thermometer, stirrer, nitrogen introducing tube and cooling tube, 33 g of polyamideimide resin powder (PAI-2), 300 g of γ-BL and 129 g of DMTG, which are insoluble at room temperature in the polar solvent obtained in Synthesis Example 2, but heated to 130 ° C. with stirring. Warm up. After stirring at 130 ° C. for 2 hours, heating was stopped and the mixture was allowed to cool to room temperature with stirring to obtain a yellow resin composition. To the obtained yellow resin composition, Trefill E-601 (trade name, silicone rubber powder manufactured by Toray Dow Corning Silicone Co., Ltd., average particle size: about 2 μm, particle size distribution 1 to 10 μm) 61.3 g, γ − BL80.19 g and DMTG 34.36 g were added and kneaded and dispersed with a planetary mixer, and then charged into a filter KST-47 (manufactured by Advantech Co., Ltd.), and a silicon rubber piston was inserted, and 3.0 kg / The resin composition (P-8) was obtained by pressure filtration at a pressure of cm ² .

  The resin composition (P-8) obtained was evaluated in exactly the same way as in Example 1. The results are shown in Table 1.

(Comparative Example 6)
110 g of polyamideimide resin powder (PAI-1) soluble at room temperature obtained in Synthesis Example 1 under a nitrogen stream in a 1 liter four-necked flask equipped with a thermometer, stirrer, nitrogen introducing tube and cooling tube, 33 g of polyamideimide resin powder (PAI-2), 300 g of γ-BL and 129 g of DMTG, which are insoluble at room temperature in the polar solvent obtained in Synthesis Example 2, but heated to 130 ° C. with stirring. Warm up. After stirring at 130 ° C. for 2 hours, heating was stopped and the mixture was allowed to cool to room temperature with stirring to obtain a yellow resin composition. To the obtained yellow resin composition, Trefill E-601 (trade name, silicone rubber powder manufactured by Toray Dow Corning Silicone Co., Ltd., average particle size: about 2 μm, particle size distribution 1 to 10 μm) 61.3 g, γ − After adding BL132.3g and DMTG 56.7g and kneading and dispersing with a planetary mixer, this was filled into a filter KST-47 (manufactured by Advantech Co., Ltd.), a silicon rubber piston was inserted, and 3.0 kg / The resin composition (P-9) was obtained by pressure filtration at a pressure of cm ² .

  The resin composition (P-9) obtained was evaluated in exactly the same way as in Example 1. The results are shown in Table 1.

FIGS. 1A and 1B are schematic diagrams when a resin composition is screen-printed on a semiconductor substrate on which wiring is formed, in which FIG. 1A is before printing and FIG. 1B is after printing. It is sectional drawing which shows an example of the semiconductor package which used the heat resistant resin composition of this invention for the stress relaxation layer.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Resin composition 2 Squeegee 3 Mask for printing 4 Wiring formation part 5 Scribe line part 6 Silicon wafer 11 Stress relaxation layer 12 Solder ball 13 Electrode 14 Silicon wafer 15 Polyimide system insulating film 16 Aluminum pad

Claims (9)

  (A) Aromatic thermoplastic resin soluble in polar solvent at room temperature, (B) Aromatic thermoplastic resin insoluble in polar solvent at room temperature, but soluble by heating, (C) Average particle size In a resin composition comprising a rubber-elastic filler having a particle size distribution of 0.1 to 6 μm and a particle size distribution of 0.01 to 15 μm, and (D) a polar solvent, a condition of a frequency of 1 Hz using a rheometer Below, the storage modulus measured at a shear stress of 10 Pa and 1000 Pa is 1600 Pa or more and less than 1000 Pa, respectively, and the ratio of the storage modulus (storage modulus (Pa) at a shear stress of 10 Pa / storage at a shear stress of 1000 Pa) A resin composition having an elastic modulus (Pa) of 2 or more.   The viscosity measured at a shear stress of 10 Pa and 1000 Pa under the condition of a frequency of 1 Hz using a rheometer is 400 Pa · s or more and less than 400 Pa · s, respectively, and the ratio of the viscosities (viscosity at a shear stress of 10 Pa (Pa The resin composition according to claim 1, wherein the viscosity (Pa · s) at a shear stress of 1000 Pa is 1.6 or more.   The storage elastic modulus measured at a frequency of 0.01 Hz and 10 Hz using a rheometer at a frequency of 0.01 Hz and a frequency of 10 Hz is less than 4000 Pa and 4000 Pa or more, respectively, and the ratio of the storage elastic modulus (at a frequency of 0.01 Hz). The resin composition according to claim 1 or 2, wherein the storage elastic modulus (Pa) / storage elastic modulus (Pa) at a frequency of 10 Hz is less than 0.20.   The viscosity measured at a frequency of 0.01 Hz and a frequency of 10 Hz using a rheometer at a frequency of 0.01 Hz and a frequency of 10 Hz is 4000 Pa · s or more and less than 500 Pa · s, respectively, and the ratio of the viscosities (at a frequency of 0.01 Hz) The resin composition according to claim 1, wherein the viscosity (Pa · s) / viscosity (Pa · s) at a frequency of 10 Hz is 20 or more.   The value of tan δ (δ = loss elastic modulus (Pa) / storage elastic modulus (Pa)) measured at a frequency of 1 Hz or higher using a rheometer at a shear stress of 10 Pa is 1 or more and less than 2. 5. The resin composition according to any one of 4 above.   (A) an aromatic thermoplastic resin that is soluble in a polar solvent at room temperature, and (B) an aromatic thermoplastic resin that is insoluble in a polar solvent at room temperature but soluble by heating is a polyamide resin, The resin composition according to claim 1, which is a polyimide resin, a polyamideimide resin, or a precursor thereof.   The resin composition according to any one of claims 1 to 6, wherein a surface of the filler (C) having rubber elasticity is chemically modified.   The resin composition according to claim 7, wherein the chemical modification is modification with an epoxy group. The semiconductor device using the resin composition of any one of Claims 1-8.

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