JP2006216643A - Cmos image sensor - Google Patents

Cmos image sensor Download PDF

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JP2006216643A
JP2006216643A JP2005026032A JP2005026032A JP2006216643A JP 2006216643 A JP2006216643 A JP 2006216643A JP 2005026032 A JP2005026032 A JP 2005026032A JP 2005026032 A JP2005026032 A JP 2005026032A JP 2006216643 A JP2006216643 A JP 2006216643A
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photodiode
impurity region
conductivity type
diode
leakage current
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Tetsuo Shioura
哲郎 塩浦
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Seiko Instruments Inc
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Seiko Instruments Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a CMOS image sensor wherein the degradation of characteristic due to pixel leak current can be prevented. <P>SOLUTION: A diode for offsetting leak current is connected to a photo diode with pn junction, so that the pn junction backward leak current of the photo diode can be offset and noise elements conversion be also be reduced as added to signal charge through photoelectric. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、半導体基板に形成されたフォトダイオード及びMOSトランジスタにより構成されるCMOSイメージセンサに関するものである。   The present invention relates to a CMOS image sensor including a photodiode and a MOS transistor formed on a semiconductor substrate.

光電変換された信号電荷をMOSトランジスタによって読み出すCMOSイメージセンサでは、一般的に光電変換素子として半導体のPN接合からなるPN接合フォトダイオードを用い、前記PN接合フォトダイオードで蓄積した信号電荷をリセットする回路、及び前記信号電荷を転送し前記信号電荷を増幅する回路をMOSトランジスタにより構成する。   In a CMOS image sensor that reads out a photoelectrically converted signal charge by a MOS transistor, a circuit that generally uses a PN junction photodiode made of a semiconductor PN junction as a photoelectric conversion element and resets the signal charge accumulated in the PN junction photodiode. And a circuit for transferring the signal charge and amplifying the signal charge is constituted by a MOS transistor.

図2は、従来のCMOSイメージセンサの画素部の等価回路図である(例えば、特許文献1参照。)。図2において、PN接合を用いたフォトダイオード1のカソードに、フォトダイオード1を適当な電圧にリセットするためのリセット用MOSトランジスタ3と、フォトダイオード1で蓄積された光電荷を増幅するための増幅用MOSトランジスタ4が結線されている。リセット用NMOSトランジスタ3をオンし、フォトダイオード1が十分にリセット電圧となるリセット動作と、リセット用NMOSトランジスタ3をオフし、一定期間中フォトダイオード1にて光信号から変換された信号電荷を蓄積させる蓄積動作と、フォトダイオード1のカソードに蓄積された信号電荷を、増幅用MOSトランジスタ4を介して、増幅して読み出す読み出し動作で、連続的に光情報を読み取ることが出来る構成になっている。この時、フォトダイオード1のカソードに蓄積された信号電荷は、フォトダイオード1のPN接合を通して流れる逆方向リーク電流Irにより幾分かは流出する。特許文献1においては、リセット電圧を下げ、フォトダイオード1の逆バイアス電圧を下げることによって、逆方向リーク電流Irを減らす構成が開示されている。
特開2000−244818号公報
FIG. 2 is an equivalent circuit diagram of a pixel portion of a conventional CMOS image sensor (see, for example, Patent Document 1). In FIG. 2, a reset MOS transistor 3 for resetting the photodiode 1 to an appropriate voltage at the cathode of the photodiode 1 using a PN junction, and an amplification for amplifying the photocharge accumulated in the photodiode 1 The MOS transistor 4 is connected. The reset NMOS transistor 3 is turned on to reset the photodiode 1 to a sufficient reset voltage, and the reset NMOS transistor 3 is turned off, and the signal charge converted from the optical signal is accumulated in the photodiode 1 for a certain period. The optical information can be read continuously by the accumulating operation and the read operation of amplifying and reading out the signal charge accumulated at the cathode of the photodiode 1 through the amplification MOS transistor 4. . At this time, some of the signal charge accumulated at the cathode of the photodiode 1 flows out due to the reverse leakage current Ir flowing through the PN junction of the photodiode 1. Patent Document 1 discloses a configuration in which the reverse leakage current Ir is reduced by lowering the reset voltage and lowering the reverse bias voltage of the photodiode 1.
JP 2000-244818 A

図2に示す回路では、上記リセット動作においてPN接合フォトダイオード1を逆バイアスにリセットすることが必要である。従って、リセット用MOSトランジスタ3をオフした信号電荷の蓄積動作中は、フォトダイオード1は逆バイアスとなる。逆バイアスにおける半導体のPN接合には、少数キャリアの拡散電流及び欠陥等による生成電流による逆方向リーク電流Irが存在するため、フォトダイオード1に蓄積される信号電荷は、光電変換された信号電荷にフォトダイオード1の逆方向リーク電流による電荷が加算されたものとなる。前記のリーク電流Irによる電荷は、ノイズ成分となるので画像読み取り性能を低下させる問題がある。   In the circuit shown in FIG. 2, it is necessary to reset the PN junction photodiode 1 to the reverse bias in the reset operation. Therefore, during the signal charge accumulation operation with the reset MOS transistor 3 turned off, the photodiode 1 is reverse-biased. Since a reverse leakage current Ir due to a minority carrier diffusion current and a current generated by a defect or the like exists in a PN junction of a semiconductor in reverse bias, the signal charge accumulated in the photodiode 1 is converted to a photoelectrically converted signal charge. The charge due to the reverse leakage current of the photodiode 1 is added. Since the charge due to the leakage current Ir becomes a noise component, there is a problem that the image reading performance is deteriorated.

本発明は、前記課題を解決するために、第1導電型の半導体基板に第2導電型の不純物を導入して形成されたフォトダイオード1を有するCMOSイメージセンサにおいて、フォトダイオード1を構成する第2導電型の不純物領域とは連続しない第2導電型の不純物領域内に、第1導電型の不純物を導入して、フォトダイオード1の逆方向リーク電流を相殺するPN接合ダイオード2を形成し、前記フォトダイオード1の第2導電型の不純物領域と前記リーク電流相殺用PN接合ダイオード2の第1導電型の不純物領域を接続する。   In order to solve the above-described problems, the present invention provides a CMOS image sensor having a photodiode 1 formed by introducing a second conductivity type impurity into a first conductivity type semiconductor substrate. Introducing a first conductivity type impurity into a second conductivity type impurity region that is not continuous with the two conductivity type impurity region to form a PN junction diode 2 that cancels the reverse leakage current of the photodiode 1; The impurity region of the second conductivity type of the photodiode 1 is connected to the impurity region of the first conductivity type of the leakage current canceling PN junction diode 2.

本発明により、フォトダイオード1のPN接合リーク電流Irと、リーク電流相殺用ダイオード2のPN接合リーク電流Ir1を相殺させることが可能となり、特別な製造工程や、リーク成分を除去するような回路を付加することなく、受光素子のリーク電流を大幅に低減することが出来る。本発明を適用することにより、イメージスキャナ、ファクシミリ等の画像入出力システムの高画質化を図ることが出来る。   According to the present invention, the PN junction leakage current Ir of the photodiode 1 and the PN junction leakage current Ir1 of the leakage current canceling diode 2 can be canceled out, and a special manufacturing process and a circuit for removing the leakage component can be realized. Without addition, the leakage current of the light receiving element can be greatly reduced. By applying the present invention, the image quality of an image input / output system such as an image scanner or a facsimile can be improved.

さらに、受光素子のリーク電流が低減することによりフォトダイオード1の逆バイアス電圧を上げることが可能となるため、フォトダイオード1の寄生容量値を小さくしてイメージセンサの感度を向上することが可能となる。   Furthermore, since the reverse bias voltage of the photodiode 1 can be increased by reducing the leakage current of the light receiving element, the parasitic capacitance value of the photodiode 1 can be reduced and the sensitivity of the image sensor can be improved. Become.

本発明を実施するための最良の形態について、図面を用いて説明する。   The best mode for carrying out the present invention will be described with reference to the drawings.

図2は、本発明実施例のCMOSイメージセンサの一画素を示す回路図である。第1導電型、例えば、P型導電型の半導体基板であるアノードが接地されたフォトダイオード1のカソードが、リーク電流相殺用に設けたダイオード2のアノード、リセット用MOSトランジスタ3のドレイン、及び増幅用MOSトランジスタ4のゲートに配線5を介して接続されている。ダイオード2のカソードは、リセット電圧よりも高い電源線に接続されている。本実施例の構成によれば、フォトダイオード1のPN接合逆方向リーク電流Irと、ダイオード2のPN接合逆方向リーク電流Ir1は、矢印の向きとなる。この時、信号電荷が蓄積されるフォトダイオード1のカソードにおいては、電流が相反する向きとなり、互いに相殺されリーク電流によるノイズ成分を低減することが可能となる。   FIG. 2 is a circuit diagram showing one pixel of the CMOS image sensor of the embodiment of the present invention. A cathode of a photodiode 1 whose anode is grounded, which is a semiconductor substrate of a first conductivity type, for example, a P-type conductivity type, is an anode of a diode 2 provided for canceling a leakage current, a drain of a reset MOS transistor 3, and amplification The MOS transistor 4 is connected to the gate via the wiring 5. The cathode of the diode 2 is connected to a power line higher than the reset voltage. According to the configuration of this embodiment, the PN junction reverse leakage current Ir of the photodiode 1 and the PN junction reverse leakage current Ir1 of the diode 2 are in the directions of the arrows. At this time, in the cathode of the photodiode 1 in which the signal charge is accumulated, the currents are in opposite directions and are canceled out to reduce the noise component due to the leakage current.

図1は、図2に示した本発明によるCMOSイメージセンサの断面模式図である。図1には、本発明の重要な構成であるフォトダイオード1とダイオード2のみ示し、トランジスタ3とトランジスタ4は省略してある。図1では、第1導電型の半導体基板6をアノードとし第2導電型の不純物領域8をカソードとするフォトダイオード1を点線で囲み、第1導電型の不純物領域7をアノードとし第2導電型の不純物領域8をカソードとするダイオード2を点線で囲んで示している。フォトダイオード1のカソードである第2導電型の不純物領域8と、ダイオード2のアノードである第1導電型の不純物領域7とをアルミなどの配線5を介して接続している。ここで、リーク電流相殺用ダイオード2の不純物濃度や面積を、フォトダイオード1のリーク電流に合せて調整すれば、リーク電流によるノイズ成分を更に除去することが可能である。また、ダイオード2のカソードが接続される電源線の電圧を調整することによってもダイオード2のリーク電流を調整することが可能である。   FIG. 1 is a schematic cross-sectional view of the CMOS image sensor according to the present invention shown in FIG. In FIG. 1, only the photodiode 1 and the diode 2 which are important components of the present invention are shown, and the transistor 3 and the transistor 4 are omitted. In FIG. 1, a photodiode 1 having a first conductivity type semiconductor substrate 6 as an anode and a second conductivity type impurity region 8 as a cathode is surrounded by a dotted line, and a first conductivity type impurity region 7 as an anode and a second conductivity type. The diode 2 having the impurity region 8 as a cathode is surrounded by a dotted line. A second conductivity type impurity region 8 which is a cathode of the photodiode 1 and a first conductivity type impurity region 7 which is an anode of the diode 2 are connected via a wiring 5 such as aluminum. Here, if the impurity concentration and area of the leakage current canceling diode 2 are adjusted in accordance with the leakage current of the photodiode 1, it is possible to further remove noise components due to the leakage current. It is also possible to adjust the leakage current of the diode 2 by adjusting the voltage of the power supply line to which the cathode of the diode 2 is connected.

以上、本実施例ではP導電型の半導体基板を用いて実施例を説明したが、N導電型の半導体基板を用い、カソードが電源線に接続されたフォトダイオード1のアノードに、アノードが接地されたリーク電流相殺用ダイオード2のカソードを接続しても、同様な効果が得られる。   As described above, the embodiment has been described using the P-conductivity type semiconductor substrate, but the N-conductivity type semiconductor substrate is used, and the anode is grounded to the anode of the photodiode 1 whose cathode is connected to the power supply line. Even if the cathode of the leakage current canceling diode 2 is connected, the same effect can be obtained.

本発明の実施形態1のCMOSイメージセンサの断面模式図である。It is a cross-sectional schematic diagram of the CMOS image sensor of Embodiment 1 of this invention. 本発明の実施形態1のCMOSイメージセンサの画素部の等価回路図である。It is an equivalent circuit schematic of the pixel part of the CMOS image sensor of Embodiment 1 of the present invention. 従来技術のCMOSイメージセンサの画素部の等価回路図である。It is the equivalent circuit schematic of the pixel part of the CMOS image sensor of a prior art.

符号の説明Explanation of symbols

1 フォトダイオード
2 リーク電流相殺用ダイオード
3 リセット用MOSトランジスタ
4 増幅用MOSトランジスタ
5 配線
6 半導体基板
7 第1導電型の不純物領域
8 第2導電型の不純物領域 Ir フォトダイオード1のリーク電流 Ir1 ダイオード2のリーク電流
DESCRIPTION OF SYMBOLS 1 Photodiode 2 Leakage current cancellation diode 3 Reset MOS transistor 4 Amplification MOS transistor 5 Wiring 6 Semiconductor substrate 7 First conductivity type impurity region 8 Second conductivity type impurity region Ir Leakage current Ir1 of diode 1 Ir2 Diode 2 Leakage current

Claims (3)

第1導電型の半導体基板および前記半導体基板の表面に形成された第2導電型の第1の不純物領域とからなるフォトダイオードと、
前記第1の不純物領域とは連続しない第2導電型の第2の不純物領域および前記第2の不純物領域内に形成された第1導電型の第3の不純物領域とからなるダイオードとを有し、
前記フォトダイオードの第2導電型の前記第1の不純物領域と前記ダイオードの第1導電型の前記第3の不純物領域とが接続されたCMOSイメージセンサ。
A photodiode comprising a semiconductor substrate of a first conductivity type and a first impurity region of a second conductivity type formed on the surface of the semiconductor substrate;
A diode composed of a second impurity region of a second conductivity type that is not continuous with the first impurity region and a third impurity region of the first conductivity type formed in the second impurity region; ,
A CMOS image sensor in which the first impurity region of the second conductivity type of the photodiode is connected to the third impurity region of the first conductivity type of the diode.
前記フォトダイオードの前記半導体基板および前記第1の不純物領域と前記ダイオードの前記第2の不純物領域および前記第3の不純物領域は、前記フォトダイオードのPN接合逆方向リーク電流の大きさと、前記ダイオードの逆方向リーク電流との大きさとがほぼ等しくなるような不純物濃度をそれぞれ有する請求項1記載のCMOSイメージセンサ。   The semiconductor substrate and the first impurity region of the photodiode, the second impurity region and the third impurity region of the diode have a PN junction reverse leakage current magnitude of the photodiode, 2. The CMOS image sensor according to claim 1, wherein each of the CMOS image sensors has an impurity concentration such that the magnitude of the reverse leakage current is substantially equal. 前記フォトダイオードおよび前記ダイオードは、前記フォトダイオードのPN接合逆方向リーク電流の大きさと、前記ダイオードの逆方向リーク電流の大きさとがほぼ等しくなるような大きさをそれぞれ有する請求項1記載のCMOSイメージセンサ。   2. The CMOS image according to claim 1, wherein each of the photodiode and the diode has a magnitude such that a magnitude of a PN junction reverse leakage current of the photodiode is substantially equal to a magnitude of a reverse leakage current of the diode. Sensor.
JP2005026032A 2005-02-02 2005-02-02 Cmos image sensor Withdrawn JP2006216643A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009158569A (en) * 2007-12-25 2009-07-16 Seiko Instruments Inc Photodetection semiconductor device, photodetector, and image display device
JP2009158570A (en) * 2007-12-25 2009-07-16 Seiko Instruments Inc Photodetection semiconductor device, photodetector, and image display device
JP2012074995A (en) * 2010-09-29 2012-04-12 Asahi Kasei Electronics Co Ltd Switch circuit
US10154212B2 (en) 2015-11-20 2018-12-11 Seiko Epson Corporation Imaging device, electronic apparatus, and imaging method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08335712A (en) * 1995-04-05 1996-12-17 Matsushita Electron Corp Photodetector and its manufacture
JP2001144318A (en) * 1999-11-18 2001-05-25 Ricoh Co Ltd Photoelectric conversion element and manufacturing method therefor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08335712A (en) * 1995-04-05 1996-12-17 Matsushita Electron Corp Photodetector and its manufacture
JP2001144318A (en) * 1999-11-18 2001-05-25 Ricoh Co Ltd Photoelectric conversion element and manufacturing method therefor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009158569A (en) * 2007-12-25 2009-07-16 Seiko Instruments Inc Photodetection semiconductor device, photodetector, and image display device
JP2009158570A (en) * 2007-12-25 2009-07-16 Seiko Instruments Inc Photodetection semiconductor device, photodetector, and image display device
JP2012074995A (en) * 2010-09-29 2012-04-12 Asahi Kasei Electronics Co Ltd Switch circuit
US10154212B2 (en) 2015-11-20 2018-12-11 Seiko Epson Corporation Imaging device, electronic apparatus, and imaging method
US10321074B2 (en) 2015-11-20 2019-06-11 Seiko Epson Corporation Imaging device, electronic apparatus, and imaging method

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