JP2006199825A - Anisotropic conductive adhesive tape and anisotropic conductive bonded wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive tape having high adhesion strength, enabling anisotropically conductive bonding of two wiring boards and giving an anisotropic conductive bonded circuit board keeping stable insulation properties and conductive properties even after the exposure of the board to wet heat conditions and provide a bonded wiring board member. <P>SOLUTION: The anisotropic conductive adhesive tape is produced by casting a coating liquid containing (A) an acrylic binder resin containing an acetoacetoxy group, (B) a monofunctional reactive diluent, (C) a polyfunctional oligomer, (D) a silane coupling agent, (E) a thermal polymerization initiator and (F) a conductive filler. A β-dikenone structure capable of forming a 6-membered ring structure together with a metal in the adherend is formed in the adhesive layer of the anisotropic conductive adhesive tape. The anisotropic conductive bonded wiring board is produced by the anisotropic conductive bonding of two wiring boards with the anisotropic conductive adhesive tape. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an anisotropic conductive adhesive tape for anisotropically bonding and bonding wiring boards to each other, and a wiring board anisotropically bonded to the anisotropic conductive adhesive tape.

An anisotropic conductive adhesive is used to connect a circuit board to a liquid crystal display device or the like. In general, anisotropic conductive adhesive is obtained by dispersing conductive powder in a thermosetting resin, sandwiching this anisotropic conductive adhesive between two circuit boards, and applying heat and pressure. An adhesive that establishes a selective electrical connection between the electrodes in the pressure direction. Conventionally, epoxy resins, phenol resins, and the like have been used as thermosetting resins used in such anisotropic conductive adhesives, and more recently acrylic adhesives have also been used. For example, in Patent Document 1 (Japanese Patent Laid-Open No. 10-338844), an anisotropic conductive film adhesive is a heat or photo-curing adhesive mainly composed of a polymer obtained by polymerizing a (meth) acrylic monomer. An invention of an anisotropic conductive film as an agent is disclosed.

Patent Document 2 (JP-A-8-325543) discloses that an anisotropic conductive adhesive includes an acrylic adhesive component as an adhesive component, and a reactive component having two (meth) acryloyl groups, An invention of an anisotropic conductive adhesive containing a polymerization initiator is disclosed.

However, anisotropic conductive adhesives that are generally used, including the anisotropic conductive adhesives described above, are those that join two substrates by the adhesive force or adhesive strength of the adhesive component. Such an adhesive component does not form a chemical bond with the electrode formed on the substrate and does not develop an adhesive force.

By the way, in claim 18 of Patent Document 3 (Japanese Patent Application Laid-Open No. 64-36669), a polymer composed of acetoacetoxyethyl methacrylate, acetoacetoxy acrylate, and a combination thereof is used as a pressure-sensitive adhesive having a normal adhesive property. Is disclosed. However, Patent Document 3 does not include a description regarding an anisotropic conductive adhesive containing a conductive metal.
Japanese Patent Laid-Open No. 10-338844 JP-A-8-325543 JP-A 64-36669

An object of this invention is to provide the anisotropic conductive adhesive tape which can express high adhesive strength by couple | bonding the adhesive component with the metal terminal formed in the wiring board.
Another object of the present invention is to provide a wiring board that is anisotropically conductively bonded using the anisotropic conductive adhesive tape as described above.

The anisotropic conductive adhesive tape of the present invention is
(A) an acetoacetoxy group-containing acrylic binder resin having a weight average molecular weight in the range of 10,000 to 50 and a glass transition temperature in the range of 0 to 80 ° C;
(B) a monofunctional reactive diluent;
(C) a polyfunctional oligomer;
(D) a silane coupling agent;
(E) a thermal polymerization initiator;
(F) An anisotropic conductive adhesive tape formed by applying a coating liquid containing a conductive filler,
The adhesive layer of the anisotropic conductive adhesive tape is characterized in that a β-diketone structure capable of forming a 6-membered ring structure in cooperation with the metal contained in the adherend is formed.

In addition, the anisotropic conductive adhesive body of the present invention comprises two wiring boards having a plurality of connection terminals made of conductive metal on the surface, and the connection terminals are connected via an anisotropic conductive adhesive tape. The connection terminals of the wiring boards arranged to face each other are electrically connected by a conductive filler via an anisotropic conductive adhesive tape, and adjacent connections in the same wiring board A wiring board anisotropic conductive adhesive in which no electrical connection is formed between the terminals,
The anisotropic conductive adhesive tape is
(A) an acetoacetoxy group-containing acrylic binder resin having a weight average molecular weight in the range of 10,000 to 500,000 and a glass transition temperature in the range of 0 to 80 ° C;
(B) a monofunctional reactive diluent;
(C) a polyfunctional oligomer;
(D) a silane coupling agent;
(E) a thermal polymerization initiator;
(F) An anisotropic conductive adhesive tape formed by applying a coating liquid containing a conductive filler,
The anisotropic conductive adhesive tape is composed of at least a part of the surface metal of the connection terminal and at least a part of the β-diketone structure contained in the adhesive component of the anisotropic conductive adhesive tape. It is characterized in that the two wiring boards are bonded by forming a ring structure.

Thus, the adhesive component contained in the anisotropic conductive adhesive tape of the present invention is a three-dimensional formed by reacting an acetoacetoxy group-containing acrylic binder resin, and a monofunctional reactive diluent and a polyfunctional oligomer. A component unit having a β-dikenton structure is formed on the acrylic binder resin, preferably both the acrylic binder resin and the three-dimensional crosslinked resin, and the terminal portions of the two wiring boards are connected to each other. When facing anisotropically with the anisotropic conductive adhesive tape of the present invention, the component unit having the β-dikenton structure forms a stable six-membered ring with the surface metal of the terminal portion of the wiring board. And glue. Such a bond has a higher bonding force and is more stable than the hydrogen bond used for general adhesion. Moreover, since such a bond is formed under a certain reaction condition, the adhesive component in the anisotropic conductive adhesive tape of the present invention shows a high fluidity in a normal state, but a high reaction under a certain condition. Therefore, high adhesive strength is exhibited, and therefore high adhesion reliability can be obtained by using the anisotropic conductive adhesive tape of the present invention. Furthermore, since the anisotropic conductive adhesive tape of the present invention is bonded to the surface of the terminal portion by expressing a chemical bonding force, it is difficult to cause positional displacement after bonding, and fine pitch wiring. Suitable for anisotropic conductive bonding of substrates to each other.

The β-diketone structure contained in the adhesive component of the anisotropic conductive adhesive tape of the present invention is incorporated in advance in the acrylic binder resin (A), and the monofunctional reaction diluent contains an acetoacetoxy group. When it contains a monomer, it is also incorporated into a three-dimensional crosslinked resin formed by copolymerization of this monofunctional reaction diluent and a polyfunctional oligomer.

According to the anisotropic conductive adhesive tape of the present invention, it is possible to establish a highly reliable anisotropic conductive adhesive between wiring boards. Moreover, the anisotropic conductive adhesive formed by the anisotropic conductive adhesive tape of the present invention is expressed by the adhesive component in the same manner as the conventional adhesive, but in addition to this, it was formed on the wiring board under certain conditions. The wiring substrate that contributes to adhesion also by the complex structure formed by the metal of the terminal and the β-diketone structure formed in the adhesive component, and that is bonded by the anisotropic conductive adhesive tape of the present invention The strength does not change with time and has high moisture resistance stability.

  In particular, a three-dimensional crosslinked structure resin is formed separately from the acetoacetoxy group-containing acrylic binder resin, and this three-dimensional crosslinked structure resin forms a robust structure. Adhesive tape forms a strong adhesive structure. In addition, when an acetoacetoxy group-containing monomer is used as this monofunctional reaction diluent, the formed three-dimensional crosslinked structure itself also forms a metal chelate structure, and adheres to the metal of the terminal portion of the wiring board with high adhesive strength To do.

Next, the anisotropic conductive adhesive tape of the present invention and the wiring substrate anisotropic conductive adhesive using the anisotropic conductive adhesive tape will be described in detail.
The anisotropic conductive adhesive tape of the present invention includes a specific acrylic binder resin (A), a monofunctional reactive diluent (B), a polyfunctional oligomer (C), a silane coupling agent (D), It can be formed from a coating solution containing a thermal polymerization initiator (E) and a conductive filler (F).

The acrylic binder resin (A) used in the present invention has a weight average molecular weight measured by gel permeation chromatography (GPC) in the range of 10,000 to 500,000, preferably in the range of 50,000 to 300,000. Use acrylic binder resin. Furthermore, the acrylic binder resin (A) used in the present invention is an acrylic binder resin having a glass transition temperature (Tg) in the range of 0 to 80 ° C, preferably in the range of 30 to 60 ° C.

The acrylic binder resin (A) used in the present invention is a copolymer of an acrylic monomer and an acetoacetoxy group-containing monomer.
In the present invention, examples of monomers that form such an acrylic binder resin include (meth) acrylic acid esters, styrene monomers, and vinyl monomers.

Examples of acrylic acid esters include methyl methacrylate, ethyl methacrylate, n-propyl (meth) acrylate, n-butyl (meth) acrylate, n-butyl (meth) acrylate, n-pentyl (meth) acrylate, Has linear alkyl groups such as n-hexyl (meth) acrylate, n-octyl (meth) acrylate, n-nonyl (meth) acrylate, decyl (meth) acrylate, dodecyl (meth) acrylate, styryl (meth) acrylate (Meth) acrylate;
Branched alkyls such as iso-propyl (meth) acrylate, iso-butyl (meth) acrylate, tert-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate and t-butyl (meth) acrylate (Meth) acrylic acid alkyl ester having a group;
(Meth) acrylates having an alkyl group such as (meth) acrylic acid alkyl esters having a cyclic alkyl group such as isobornyl (meth) acrylate and cyclohexyl (meth) acrylate; 2-hydroxyethyl (meth) acrylate, ( Hydroxyl group-containing vinyl such as 2-hydroxypropyl (meth) acrylate, monoesters and lactones of (meth) acrylic acid with polypropylene glycol or polyethylene glycol and 2-hydroxyethyl (meth) acrylate Hydroxyl group-containing compounds such as compounds; carboxyl group-containing (meth) acrylic monomers such as (meth) acrylic acid, itaconic acid, crotonic acid, maleic acid and fumaric acid; amino such as N, N-dimethylaminoethyl (meth) acrylate Group-containing (meth) acrylic monomer, Beauty, and (meth) acrylamide, containing an amide group such as N- methylacrylamide (meth) acrylic monomer.

Examples of styrenic monomers include styrene, methyl styrene, dimethyl styrene, trimethyl styrene, ethyl styrene, diethyl styrene, triethyl styrene, propyl styrene, butyl styrene, hexyl styrene, heptyl styrene, octyl styrene, and other alkyl styrenes; Mention may be made of halogenated styrenes such as chlorostyrene, bromostyrene, dibromostyrene and iodostyrene; nitrostyrene, acetylstyrene and methoxystyrene.

  Examples of vinyl monomers include vinyl pyridine, vinyl pyrrolidone, vinyl carbazole, divinyl benzene, vinyl acetate and acrylonitrile; conjugated diene monomers such as butadiene, isoprene and chloroprene; vinyl halides such as vinyl chloride and vinyl bromide; vinylidene chloride And vinylidene halides such as

In the acrylic binder resin (A) of the present invention, in addition to the above monomers, other monomers copolymerizable with the above acrylic monomers as described below may be copolymerized.

  Examples of such other monomers include epoxy group-containing (meth) acrylates such as glycidyl (meth) acrylate; methylolpropane, alkoxy (meth) acrylate, and allyl (meth) acrylate. These monomers can be used alone or in combination.

The acrylic binder resin (A) used in the present invention is copolymerized with an acetoacetoxy group-containing monomer, and the acetoacetoxy group-containing monomer is copolymerized to form a β- A diketone structure can be introduced.

Examples of the acetoacetoxy group-containing monomer used here include acetoacetoxyalkyl (meth) acrylates such as acetoacetoxymethyl methacrylate, acetoacetoxyethyl methacrylate, acetoacetoxymethyl acrylate, and acetoacetoxyethyl acrylate. The acetoacetoxyalkyl (meth) acrylate as described above is a β-diketone compound.
By copolymerizing (meth) acrylate, a β-diketone structure capable of forming a stable six-membered ring structure by chelating with a metal in the acrylic binder resin (A) can be formed.

In the present invention, the acetoacetoxy group-containing monomer as described above is 2 to 60 parts by weight, preferably 5 to 5 parts by weight based on 100 parts by weight of all monomers forming the acrylic binder resin (A).
Used in an amount within the range of 40 parts by weight. By using the acetoacetoxy group-containing monomer in such an amount, the wiring substrate can be anisotropically conductively bonded with higher adhesive strength.

The acrylic binder resin (A) used in the present invention is heated in a reactor in which the raw material is dissolved or dispersed in, for example, an organic solvent, and the solution or dispersion is replaced with an inert gas such as nitrogen gas. Acrylic binder resin can be manufactured by manufacturing by making it react in presence of a polymerization initiator. Organic solvents used here include aromatic hydrocarbons such as toluene and xylene, aliphatic hydrocarbons such as n-hexane, esters such as ethyl acetate and butyl acetate, n-propyl alcohol and i-propyl. Mention may be made of aliphatic alcohols such as alcohol, and ketones such as methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone. In the above reaction, the organic solvent is usually used in an amount of 50 to 300 parts by weight with respect to 100 parts by weight of the total raw material monomers.

The above reaction is carried out by heating in the presence of a thermal polymerization initiator. Thermal polymerization initiators include azobisisobutyronitrile, benzoyl peroxide, di-tert-butyl peroxide, 2,2′-azobis (2,4-diethylvaleric acid nitrile), cumene hydroperoxide, and the like. be able to. This thermal polymerization initiator is usually used in an amount of 0.01 to 10 parts by weight with respect to 100 parts by weight of the total raw material monomers.

  In the organic solvent as described above, the reaction temperature is usually 50 to 90 ° C., and the reaction time is usually 2 to 20 hours, preferably 4 to 12 hours. The acrylic binder resin thus produced can be used after being separated from the reaction solvent, but it is preferable to use the produced resin in a state where it is dissolved or dispersed in an organic solvent. The acrylic binder resin thus obtained is a chain acrylic binder resin, and such an acrylic binder resin does not have radical polymerizability.

The acrylic binder resin thus obtained has a weight average molecular weight (Mw) measured by gel permeation chromatography (GPC) in the range of 10,000 to 500,000, preferably 5 to 300,000. The binder resin has a relatively low molecular weight. In addition, the glass transition temperature (Tg) of the acrylic binder resin (A) can be obtained by actual measurement, and the single weight formed using the monomer constituting the acrylic binder resin (A). The glass transition temperature (Tg) of the coalesced product can be obtained, and from this value, it can be obtained by the Fox equation.

The acrylic binder resin (A) as described above does not have radical polymerizability, and therefore does not react with the monofunctional reaction diluent (B), polyfunctional oligomer (C), etc., which will be described later. The acrylic binder resin (A) has a chain structure. Therefore, the gel fraction of the acrylic binder resin (A) is substantially 0%, and the acrylic binder resin (A ) In which no cross-linked structure is formed.

The acrylic binder resin (A) produced as described above is a reaction product of the above components and is supplied as an organic solvent solution or an organic solvent dispersion such as toluene. Such an organic solvent can be removed to use the acrylic binder resin (A), or the reaction solvent formed as described above can be directly used as a dispersion solvent in the next step.

The coating composition for forming the anisotropic conductive adhesive tape of the present invention includes a monofunctional reaction diluent (B).
Is blended.
The monofunctional reactive diluent (B) blended in the coating composition reacts with the polyfunctional oligomer to form a three-dimensional cross-linked resin, and also serves as a solvent in the production of the anisotropic conductive film It is. As such a monofunctional reactive diluent (B), the molecular weight is 150-10.
Those in the range of 00 are preferably used. The molecular weight is a molecular weight in terms of standard polystyrene measured by GPC method (column: HXL-H, G7000HXL, GMHXL-L, G2500HXL (above, trade name, manufactured by Tosoh Corporation), detector: differential refractometer). It is. Further, the monofunctional reactive diluent is preferably a compound having one reactive double bond copolymerizable with a polyfunctional oligomer and a functional group in the same molecule. Examples of these include an epoxy group, an active methylene group, a hydroxyl group, a carboxyl group, an isocyanate group, an amino group, and an amide group. Examples of monofunctional reactive diluents having such functional groups include epoxidized monofunctional reactive diluents such as glycidyl acrylate and glycidyl methacrylate (GMA), acetoacetoxyethyl acrylate, acetoacetoxyethyl methacrylate (AAEM ) Acetoacetoxyalkyl (meth) acrylates such as 2-methacryloxyethyl isocyanate and other isocyanate group-containing (meth) acrylates and hydroxyl-containing monofunctional compounds such as t-butyl alcohol, methyl lactate and phenyl glycol Reaction products of hydroxyl group-containing (meth) acrylates such as 2-hydroxyethyl (meth) acrylate and isocyanate group-containing monofunctional compounds such as propyl isocyanate and butyl isocyanate, such as glycidyl (meth) acrylate Reaction product of epoxy group-containing (meth) acrylate and amino group-containing monofunctional compound such as n-propylamine or n-butylamine, amino group-containing (meth) acrylate such as dimethylaminoethyl (meth) acrylate and glycidyl methyl ether And reaction products with an epoxy group-containing monofunctional compound.

Further, a hydroxyl group-containing (meth) acrylate, silane group-containing (meth) acrylate or the like obtained by ring-opening addition reaction of ε-caprolactone can also be used as the monofunctional reactive diluent (B). As a hydroxyl group-containing (meth) acrylate obtained by ring-opening addition reaction of ε-caprolactone,
Examples include adducts of 1 to 10 mol of ε-caprolactone of hydroxyethyl (meth) acrylate such as PLACCEL F series (trade name, manufactured by Daicel Chemical Industries, Ltd.). Silane group-containing (meth) acrylates include vinyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, Examples include 3-methacryloxypropyltriethoxysilane and 3-acryloxypropyltrimethoxysilane.

In addition to the monofunctional reactive diluent (B) exemplified above, isooctyl acrylate, lauryl acrylate, stearyl acrylate, isobornyl acrylate, cyclohexyl acrylate, tetrahydrofurfuryl alcohol oligoacrylate, ethyl carbitol oligoacrylate, methoxytril. Ethylene glycol acrylate, tetrahydrofurfuryl acrylate, benzyl acrylate, ethyl carbitol acrylate, phenoxyethyl acrylate, 2,2,2-trifluoroethyl acrylate, 2,2,2-trifluoroethyl methacrylate, 2,2,3, 3-tetrafluoropropyl acrylate, 1H, 1H, 5H-octafluoropentyl acrylate, 1H, 1H, 5H-octafluoropentyl methacrylate, and the following formula

Can also be used as a monofunctional reactive diluent. These monofunctional reactive diluents can be used alone or in combination.
Particularly in the present invention, it is preferable to use glycidyl acrylate, glycidyl methacrylate (GMA), acetoacetoxyethyl acrylate, or acetoacetoxyethyl methacrylate (AAEM) as the monofunctional reactive diluent (B). These can be used alone or in combination. In particular, in the present invention, by using acetoacetoxyethyl acrylate and / or acetoacetoxyethyl methacrylate (AAEM) as a monofunctional reactive diluent, a bonding force to a terminal formed on a wiring board is imparted to a three-dimensional crosslinked resin. Can be granted.

Such a monofunctional reactive diluent (B) is usually 1 to 100 parts by weight, preferably 5 to 5 parts per 100 parts by weight of the solid content of the acrylic binder resin (A) in the anisotropic conductive film.
It is contained in an amount of 0 part by weight. By containing the monofunctional reactive diluent (B) in the above amount,
High adhesive strength can be expressed.

A polyfunctional oligomer (C) is blended in the coating composition used when the anisotropic conductive adhesive tape of the present invention is produced.
The polyfunctional oligomer (C) used in the present invention is a compound having two or more active double bonds in the same molecule, and the molecular weight measured by the above method is usually in the range of 200 to 5000, preferably Is a compound in the range of 500-3000.

Such a polyfunctional oligomer (C) reacts with the monofunctional reactive diluent (B) to form a three-dimensional crosslinked structure. Examples of such polyfunctional oligomers (C) include polytetramethylene glycol di (meth) acrylate, EO-modified trimethylolpropane tri (meth) acrylate, perfluorooctylethyl (meth) acrylate, trimethylolpropane tri (meth) ) Acrylate, EO-modified trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, neopentyl glycol (meth) acrylic acid benzoate , Triethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, neopentylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanegio Distearate (meth) acrylate, dimethylol tricyclo tricyclodecane (meth) acrylate, 1,10-decanediol di (meth) acrylate, dibromoneopentyl glycol di (meth) acrylate. These polyfunctional oligomers can be used alone or in combination.

Such a polyfunctional oligomer (C) is usually 2 parts per 100 parts by weight of the acrylic binder resin in the coating composition used for producing the anisotropic conductive adhesive tape of the present invention.
It is used in an amount in the range of -50 parts by weight, preferably 5-30 parts by weight. By using the polyfunctional oligomer (C) in such an amount, a three-dimensional network structure is formed in the anisotropic conductive adhesive, so that the adhesive strength is increased and the anisotropic conductive adhesive tape is used. Even if the wiring substrate that is anisotropically conductively bonded is exposed to wet heat conditions, the insulation and conductivity between the substrates are less likely to fluctuate.

A silane coupling agent (D) is further blended in the coating composition used in producing the anisotropic conductive adhesive tape of the present invention. Examples of silane coupling agents used herein include polymerizable unsaturated group-containing silicon compounds such as vinyltrimethoxysilane, vinyltriethoxysilane, and methacryloxypropyltrimethoxysilane; 3-glycidoxypropyltrimethoxysilane , Silicon compounds having an epoxy structure such as 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane; 3-aminopropyltrimethoxysilane, N- (2-aminoethyl) Amino group-containing silicon compounds such as 3-aminopropyltrimethoxysilane and N- (2-aminoethyl) 3-aminopropylmethyldimethoxysilane; 3-chloropropyltrimethoxysilane and the like. These silane coupling agents can be used alone or in combination.

The silane coupling agent (D) is usually 0.0 with respect to 100 parts by weight of the solid content of the acrylic binder resin (A) in the coating composition used for producing the anisotropic conductive adhesive tape.
It is contained in an amount of 1 to 10 parts by weight, preferably 0.05 to 5 parts by weight. By containing the silane coupling agent (D) in the above amount, the adhesion of the anisotropic conductive adhesive tape can be improved.

Furthermore, the thermal polymerization initiator (E) is mix | blended with the composition for application | coating used when manufacturing the anisotropically conductive adhesive tape of this invention. Examples of the thermal polymerization initiator (E) used here include organic peroxides, inorganic peroxides, and azo thermal polymerization initiators. Examples of organic peroxides include benzoyl peroxide, lauroyl peroxide, octanoyl peroxide and 3,5,5-trimethylhexanoyl peroxide. Examples of inorganic peroxides include potassium persulfate and ammonium persulfate. Further, azo-based thermal polymerization initiators include 2,2′-azobisisobutyronitrile, 2,2′-azobis-2-methylbutyronitrile, 2,2′-azobis (2,4-dimethyl ester). Valeric acid nitrile) and 4,4-azobis-4-cyanovaleric acid.

These thermal polymerization initiators (E) can be used alone or in combination of two or more, and can be cured in a short time by selecting appropriately depending on the heating temperature at the time of thermocompression bonding. Become.

The thermal polymerization initiator (E) is usually 0.1 to 10 parts by weight with respect to 100 parts by weight of the solid content of the acrylic binder resin (A) in the coating composition for producing the anisotropic conductive adhesive tape. , Preferably 0.2 to 5 parts by weight. By containing the thermal polymerization initiator in the above amount, the monofunctional reactive diluent (B) and polyfunctional oligomer (C) in the anisotropic conductive adhesive tape react while maintaining appropriate fluidity during thermocompression bonding. Therefore, the anisotropic conductive adhesive tape can adhere the substrate with an excellent adhesive force without protruding from the end of the printed circuit board. Here, “appropriate fluidity” means fluidity to such an extent that the adhesive component sufficiently spreads to every corner of the bonding surface of the substrate during thermocompression bonding, but the adhesive component does not protrude from the edge of the substrate. .

In the coating composition for forming the anisotropic conductive adhesive tape of the present invention, the conductive filler (F)
Are distributed. The conductive filler (F) is not particularly limited as long as it is a conductive filler used in anisotropic conductive adhesives. For example, conductive metal particles, conductive inorganic particles, and the surface of a resin core material can be used as a conductive material. And composite particles coated with. The conductive metal particles, the conductive inorganic particles, and the conductive material are generally conductive metals and alloys containing these metals that exhibit an electric resistance value of 10 ⁰ Ω or less, preferably 10 ⁻¹ Ω or less, and conductive materials. Conductive ceramics, conductive metal oxides or other conductive materials.

Examples of the conductive metal include Zn, Al, Sb, U, Cd, Ga, Ca, Au, Ag, Co, Sn, Se, Fe, Cu, Th, Pb, Ni, Pd, Be, and Mg. . The said metal may be used independently, 2 or more types may be used, and another element, a compound (for example, solder) etc. may be added. Examples of conductive ceramics that are conductive inorganic materials include VO ₂ , Ru ₂ O, SiC, ZrO ₂ , Ta ₂ N, ZrN, NbN, VN, and TiB _2.
, Mention may be made of _{ZrB, HfB 2, TaB 2,} MoB 2, CrB 2, B 4 C, MoB, ZrC, a VC and TiC. In addition, examples of the conductive filler other than the above include carbon particles such as carbon and graphite, and ITO.

The conductive metal particles and the conductive inorganic particles have an average particle diameter of usually 1 to 50 μm, preferably 2 to 20 μm, more preferably 5 to 15 μm.
The composite particles are particles obtained by coating the surface of an inorganic core material such as glass and alumina or the surface of a resin core material with a conductive material such as the conductive metal particles or the conductive inorganic material. The resin core material may be formed of either a thermosetting resin or a thermoplastic resin. Such resins include phenolic resins, urea resins, melamine resins, allyl resins, furan resins, polyester resins, epoxy resins, silicone resins, polyamide-imide resins, polyimide resins, polyurethane resins, fluorine resins, polyolefin resins (for example, Polyethylene, polypropylene, polybutylene), polyalkyl (meth) acrylate resin, poly (meth) acrylic acid resin, polystyrene resin, acrylonitrile-styrene-butadiene resin, vinyl resin, polyamide resin, polycarbonate resin, polyacetal resin, ionomer resin, polyether Mention may be made of sulfone resins, polyphenyl oxide resins, polysulfone resins, polyvinylidene fluoride resins, ethyl cellulose and cellulose acetate.

The average particle diameter of the inorganic core material and the resin core material is usually 1 to 48 μm, preferably 2 to 20 μm, more preferably 5 to 10 μm. The thickness of the coating layer made of a conductive material is usually in the range of 0.01 to 5 μm, preferably 0.1 to 2 μm, and more preferably 0.2 to 1 μm.

Such composite particles can be produced by a conventionally known method, for example, a method described in JP-A-8-3529.
These conductive fillers can be used alone or in combination of two or more.

The conductive filler (F) is usually 1 to 50 parts by weight, preferably 100 parts by weight of the solid content of the acrylic binder resin (A) in the coating composition used for producing the anisotropic conductive adhesive tape, preferably It is contained in an amount of 2 to 20 parts by weight. By containing the conductive filler in the above-mentioned amount, an anisotropic conductive adhesive tape having excellent electrical conductivity in the pressing direction and insulation in the substrate plane direction and high connection reliability without accompanying reduction in adhesive strength. be able to.

  Furthermore, the coating composition used when producing the anisotropic conductive adhesive tape of the present invention may contain insulating organic particles such as silicone resin particles and / or insulating inorganic particles. As the insulating organic particles used here, usually, silicone resin particles having an average particle diameter in the range of 0.01 to 5 μm are used.

Such silicone resin particles are usually used in an amount of 1 to 50 parts by weight with respect to 100 parts by weight of the acrylic binder resin (A) in the coating composition for producing the anisotropic conductive adhesive tape. . By using specific silicone resin particles in this way, the fluidity of the adhesive component can be adjusted more appropriately, and even if heated after bonding, the adhesive component can flow backwards and inhibit conductivity. Less.

  Examples of the insulating inorganic particles include silica, titanium oxide, silicon dioxide, calcium carbonate, calcium phosphate, aluminum oxide, and antimony trioxide. These particles can be used alone or in combination. Further, these particles usually have an average particle diameter of 0.01 to 5 μm.

The insulating inorganic particles are usually used in an amount of 1 to 50 parts by weight with respect to 100 parts by weight of the acrylic binder resin (A) in the coating composition for forming the anisotropic conductive adhesive tape. By blending the insulating inorganic particles in the above amount, the fluidity of the adhesive component can be adjusted more appropriately, and even if heated after bonding, the adhesive component may flow backwards and inhibit conductivity. Less. Further, it is possible to prevent the adhesive component from protruding from the end of the printed circuit board during bonding.

The anisotropic conductive adhesive tape of the present invention comprises an acrylic binder resin (A) prepared as described above, a monofunctional reactive diluent (B), a polyfunctional oligomer (C), and a silane coupling agent. (D), thermal polymerization initiator (E), conductive filler (F), and, if necessary, other components such as silicone resin particles and insulating particles are mixed to prepare a coating composition, The coating composition is applied to a support film, dried, and further cut into a tape if necessary. Usually, a support film is further bonded and stored on the coating layer of the formed anisotropic conductive adhesive tape. The anisotropic conductive adhesive film thus formed has a thickness of usually 10 to 60 μm, preferably 10 to 50 μm, more preferably 10 to 30 μm.

  The two supporting films are not particularly limited as long as they can be easily peeled when using an anisotropic conductive film, and examples thereof include a polyester release film. In addition, this support film turns into a peeling film, when using an anisotropic conductive film. The mixture is applied to the support film using a knife coater, reverse roll coater or gravure coater. The obtained coating film is dried at a temperature of usually 100 ° C. or lower, preferably 80 ° C. or lower.

For example, anisotropic conductive adhesive tapes manufactured as described above can be used for IT such as flexible printed circuit boards (FPC) and liquid crystal displays (LCD) plus plasma dipsley (PDP).
Used for bonding that requires electrical conductivity, such as an O substrate.

  First, a sheet made of the release film / anisotropic conductive film / release film produced by the above method is cut into a desired size to produce a tape. Next, one release film is peeled off from the tape, placed on the wiring pattern forming surface of the substrate, and thermobonded to temporarily bond the substrate and the anisotropic conductive adhesive tape. The thermocompression bonding temperature at the time of temporary joining is usually 20 to 100 ° C., preferably 40 to 80 ° C., and the pressure is usually 0.1 to 5 MPa, preferably 0.1 to 3 MPa, more preferably 0.1 to 1 MPa. And the time is usually less than 10 seconds.

  Thereafter, the remaining release film is peeled off and attached to the wiring pattern forming surface of another substrate, and bonded by thermocompression bonding. The thermocompression bonding temperature at the time of joining is usually 180 ° C. or less, preferably 120 to 140 ° C. as the resin temperature, the pressure is usually 3 MPa or less, preferably 1 MPa or less, and the time is usually 20 seconds or less, preferably 5 to 10 seconds.

In this manner, the two substrates are joined so that the wiring patterns of the substrates face each other with the anisotropic conductive adhesive tape interposed therebetween.
By anisotropically bonding as described above, a part of the β-dikenton component in the anisotropically conductive adhesive tape of the present invention is a terminal metal formed on the substrate (this terminal metal is usually
A 6-membered ring structure by incorporating at least one metal selected from the group consisting of copper, tin, nickel, zinc, aluminum, zirconium and titanium. The β-diketone component that incorporates this terminal metal to form a six-membered ring structure is composed of an acrylic binder resin (A) or monofunctional reactive diluent (B) having a β-diketone structure and a polyfunctional oligomer. Since it is derived from the reaction product with (C), the wiring substrate anisotropic conductive adhesive formed using the anisotropic conductive adhesive tape of the present invention is not simply a bonding force that generally acts on adhesion, such as a hydrogen bonding force. Are also joined by a chelate bond that incorporates the terminal metal.
Anisotropic conductive bonding with very high adhesive strength.

In this way, it is formed by anisotropically bonding two wiring boards using the anisotropic conductive adhesive tape of the present invention. The wiring board anisotropic conductive adhesive of the present invention has a β-diketone structure in the acrylic binder resin in which the metal forming the terminal formed on the surface of the wiring board is added to the adhesive force developed by a normal adhesive. It forms a 6-membered ring structure that has been incorporated and is also adhered by adhesive force, and is usually 400 to 3000 N / m, preferably 500, as shown by a 90 degree peel test.
A high adhesive strength of ˜2000 N / m, particularly preferably 700 to 2,000 N / m is developed. Furthermore, by adopting such a form of adhesion, fluctuations in electrical insulation and electrical conductivity of the anisotropic conductive adhesive portion after being exposed to wet heat conditions are reduced.

The formation of a 6-membered ring structure in which metal is incorporated into the β-diketone structure in the acrylic binder resin is the infrared absorption of the adhesive layer in the anisotropic conductive adhesive tape of the present invention before contact with the metal. This can be confirmed by comparing the spectrum (IR spectrum) with the infrared absorption spectrum (IR spectrum) of the adhesive layer after contact with a metal to form a 6-membered ring structure.

For example, the IR spectrum shown in FIG. 1 is an example of the IR spectrum of the radical polymerizable acrylic binder resin (A) produced in Example 1, and FIG. 2 shows the acrylic binder resin with a chelate structure formed. It is an IR spectrum. Comparing FIG. 1 with FIG. 2, in FIG. 2, absorption due to stretching between C═O of enol-type β-diketone in the vicinity of 1690 cm ⁻¹ is strongly observed by chelation reaction. From these IR spectrum analysis results, hydrogen bound to a β-diketone skeleton contained in a repeating unit derived from acetoacetoxyethyl methacrylate (AAEM) copolymerized with radically polymerizable acrylic binder resin (A) It can be seen that at least a part of the atoms is replaced with a metal atom to form a 6-membered ring chelate structure formed by a β-diketone and a metal atom.

〔Example〕
Next, the anisotropic conductive adhesive tape and the wiring board anisotropic conductive adhesive of the present invention will be described with reference to examples, but the present invention is not limited thereto.

A four-necked flask capable of nitrogen substitution is charged with 60 parts by weight of methyl acrylate (MA), 30 parts by weight of iso-butyl methacrylate (iBMA), 10 parts by weight of acetoacetoxyethyl methacrylate (AAEM) and 70 parts by weight of toluene. The temperature was raised to 78 ° C. in a nitrogen atmosphere. Next, a solution prepared by dissolving 1 part by weight of 2,2′-azobisisobutyronitrile (AIBN) in 5 parts by weight of toluene was dropped into the mixed solution over 5 minutes. With this drop start time as the reaction start time, the reaction was terminated at 480 minutes from the start of the reaction to prepare a toluene solution of an acrylic binder resin.

About the obtained acrylic binder resin, gel permeation chromatography (GPC, column: HXL-H, G7000HXL, GMHL-L, G2500HXL (above, trade name: manufactured by Tosoh Corporation))
) Was 15,000 in terms of standard styrene. The acrylic binder resin had a glass transition temperature (Tg) of 20.5 ° C.

10 parts by weight of acetoacetoxyethyl methacrylate (AAEM) as a monofunctional reactive diluent and trimethylol as a polyfunctional oligomer with respect to 100 parts by weight of acrylic binder resin as described above (weight in terms of solid content in toluene solution). 20 parts by weight of propane triacrylate (TMPA), 2,2'-azobis (2,4-dimethylvaleric nitrile) as thermal polymerization initiator
0.2 parts by weight (trade name V-65, manufactured by Wako Pure Chemical Industries, Ltd.), conductive filler (polymethacrylic acid methyl ester particles coated with gold-nickel, particle size 5 μm, Nippon Chemical Industry (
Co., Ltd., Bright GNR series), 10 parts by weight, silicone resin particles (Tospearl 120,
Composition with a particle size of 2.0 μm, 40 parts by weight of Toshiba Silicone Co., Ltd. and 0.2 parts by weight of a silane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM403) are mixed and mixed uniformly. A product was prepared.

The coating composition obtained as described above was applied to the surface of a polyester release film MRX38 (trade name, manufactured by Mitsubishi Chemical Polyester Film Co., Ltd.), and the solvent was removed by heating. An anisotropic conductive adhesive layer was formed, and a polyester release film MRF25 (trade name, manufactured by Mitsubishi Chemical Polyester Film Co., Ltd.) was adhered to the surface to produce an anisotropic conductive adhesive sheet.

A tape having a width of 1.5 mm and a length of 30 mm was cut out from the anisotropic conductive adhesive sheet thus obtained to obtain an anisotropic conductive adhesive tape.
The adhesive layer was separated from the anisotropic conductive adhesive tape produced as described above, and the IR spectrum of the resin forming the adhesive layer was measured. This IR spectrum is shown in FIG.

From this anisotropic conductive adhesive tape, the polyester release film MRF25 is peeled off and placed on the vapor deposition surface of the ITO vapor-deposited glass substrate, and heated for 2 seconds at a temperature of 80 ° C. and a pressure of 0.1 MPa. The surface and the anisotropic conductive adhesive tape (A) were temporarily bonded. Next, the polyester release film MRX38 of the anisotropic conductive adhesive tape is peeled off, and a wiring pattern made of copper is formed on the polyimide film substrate on the anisotropic conductive adhesive tape. Flexible printed circuit board (FPC) with tin plating layer on the terminal area
) Contact the terminal part, and heat-press for 5 seconds under the conditions of temperature 130 ° C and pressure 0.2MPa to anisotropically bond the ITO vapor-deposited glass substrate and flexible printed circuit board (FPC). A directionally conductive adhesive was obtained.

The wiring board anisotropic conductive adhesive thus obtained was subjected to a conduction test (A1) in a normal state (23 ° C., 65% RH) between the substrates subjected to anisotropic conductive bonding, and the result was 2Ω. Also, the normal state between the wiring patterns of the flexible printed circuit board (FPC) bonded anisotropically (23
When an insulation test was performed at a temperature of 65 ° C., the resistance value between the wiring patterns was ∞, and it was found that insulation was ensured between the adjacent wiring patterns.

  Furthermore, after moist heat (left at 80 ° C. and 90 RH% for 500 hours), left for 1 hour in the normal state and conducted the continuity test (B1) in the normal state. As a result, the resistance value between the wiring patterns was ∞.

When a 90 ° peel test was performed on the ITO vapor-deposited glass substrate of the flexible printed circuit board (FPC) on which anisotropic conductive bonding was performed as described above, the adhesive strength was 700 N / m 2.
Table 1 shows the composition, continuity test (A1), (B1), insulation test (A2), (B2), and adhesive strength.

  The adhesive layer was separated from the anisotropic conductive adhesive tape produced as described above, and the IR absorption spectrum of the resin forming this adhesive layer was measured. This IR absorption spectrum is shown in FIG. FIG. 2 shows the IR absorption spectrum of the resin forming the adhesive layer after contacting the resin forming the adhesive layer and tin forming the surface plating layer of the wiring pattern.

From a comparison between FIG. 1 and FIG. 2, in FIG. 2, absorption due to stretching vibration between C═O of enol type β-diketone in the vicinity of 1690 cm −1 is strongly observed due to chelation reaction. From these results, it can be seen that the β-diketone structure in the adhesive reacts with the wiring pattern forming metal by thermocompression bonding during anisotropic conductive bonding to form a 6-membered ring structure.

An anisotropic conductive adhesive tape was produced in the same manner as in Example 1, except that 10 parts by weight of glycidyl methacrylate (GMA) was used instead of acetoacetoxyethyl methacrylate (AAEM) used as a monofunctional diluent. did.

Conductivity tests (A1), (B1) in the same manner as in Example 1 except that this anisotropic conductive adhesive tape was used.
), Insulation tests (A2), (B2) and adhesive strength were measured.
Table 1 shows the composition, continuity test (A1), (B1), insulation test (A2), (B2), and adhesive strength.
Shown in
[Comparative Example 1]
A four-necked flask capable of nitrogen substitution is charged with 50 parts by weight of methyl acrylate (MA), 48 parts by weight of iso-butyl methacrylate (iBMA), 2 parts by weight of acrylic acid (AA) and 70 parts by weight of toluene. The temperature was raised to 78 ° C. under an atmosphere. Next, a solution prepared by dissolving 1 part by weight of 2,2′-azobisisobutyronitrile (AIBN) in 5 parts by weight of toluene was dropped into the mixed solution over 5 minutes. With this drop start time as the reaction start time, the reaction was terminated at 480 minutes from the start of the reaction to prepare a toluene solution of an acrylic binder resin. The obtained acrylic binder resin had a weight average molecular weight of 150,000 and a glass transition temperature (Tg) of 30.8 ° C.

2,2'-azobis (2,4-dimethylvaleric acid nitrile) (manufactured by Wako Pure Chemical Industries, Ltd.) with respect to 100 parts by weight of acrylic binder resin as described above (weight in terms of solid content in toluene solution) , 0.2 parts by weight of trade name V-65) and 20 parts by weight of Plaxel FA-3 (trade name, unsaturated fatty acid hydroxyalkyl ester modified ε-caprolactone, manufactured by Daicel Chemical Industries, Ltd.) as a reactive diluent , 10 parts by weight of conductive filler (polymethacrylic acid methyl ester particles coated with gold-nickel, particle size 5 μm, Nippon Chemical Industry Co., Ltd., Bright GNR series), silicone resin particles (Tospearl 120, particle size 2 0.0 μm, 40 parts by weight of Toshiba Silicone Co., Ltd.) and 0.2 parts by weight of silane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM403) are added to form a polyfunctional oligomer. A coating composition was prepared in the same manner as in Example 1 except that 20 parts by weight of trimethylolpropane triacrylate (TMPA) was blended, and different from that in Example 1 except that this coating composition was used. A directionally conductive adhesive tape was produced.

Conductivity tests (A1), (B1) in the same manner as in Example 1 except that this anisotropic conductive adhesive tape was used.
), Insulation tests (A2), (B2) and adhesive strength were measured.
Table 1 shows the composition, continuity test (A1), (B1), insulation test (A2), (B2), and adhesive strength.

Separate the adhesive layer from the anisotropic conductive adhesive tape manufactured as described above, measure the IR absorption spectrum of the resin that forms this adhesive layer, and the resin and wiring that form this adhesive layer. After contacting the tin that forms the surface plating layer of the pattern, the IR absorption spectrum of the resin that forms this adhesive layer was measured and compared in the same manner as in Example 1; There was no change in peak as suggested.
[Comparative Example 2]
In Example 1, the amount of toluene used as a reaction solvent in the reaction with methyl acrylate (MA), iso-butyl methacrylate (iBMA) and acetoacetoxyethyl methacrylate (AAEM) was changed from 70 parts by weight to 150 parts by weight. And 10 parts by weight of 2,2′-azobisisobutyronitrile (AIBN) as a polymerization initiator is used in an amount of 1 to 3 parts by weight.
An acrylic binder resin was produced in the same manner except that the amount was changed to 0 part by weight, and an anisotropic conductive adhesive tape was produced in the same manner except that this acrylic binder resin was used. The weight average molecular weight of the acrylic binder resin obtained here was 8,000.

Conductivity tests (A1), (B1) in the same manner as in Example 1 except that this anisotropic conductive adhesive tape was used.
), Insulation tests (A2), (B2) and adhesive strength were measured.
Table 1 shows the composition, continuity test (A1), (B1), insulation test (A2), (B2), and adhesive strength.
[Comparative Example 3]
In Example 1, instead of 70 parts by weight of toluene used as a reaction solvent in the reaction with methyl acrylate (MA), iso-butyl methacrylate (iBMA) and acetoacetoxyethyl methacrylate (AAEM), 70 parts by weight of ethyl acetate An acrylic binder resin was produced in the same manner except that a mixed solvent of 30 parts by weight of toluene and 30 parts by weight of toluene was used. An anisotropic conductive adhesive tape was produced in the same manner except that this acrylic binder resin was used. The acrylic binder resin obtained here had a weight average molecular weight of 600,000.

Conductivity tests (A1), (B1) in the same manner as in Example 1 except that this anisotropic conductive adhesive tape was used.
), Insulation tests (A2), (B2) and adhesive strength were measured.
Table 1 shows the composition, continuity test (A1), (B1), insulation test (A2), (B2), and adhesive strength.
[Comparative Example 4]
In Example 1, instead of methyl acrylate (MA), iso-butyl methacrylate (iBMA) and acetoacetoxyethyl methacrylate (AAEM), 90 parts by weight of methyl methacrylate (MMA) and 10 parts by weight of acetoacetoxyethyl methacrylate (AAEM) Acrylic binder resin was produced in the same manner except that was used, and an anisotropic conductive adhesive tape was produced in the same manner except that this acrylic binder resin was used. The acrylic binder resin obtained here had a glass transition temperature (Tg) of 91 ° C. and a weight average molecular weight of 90,000.

Conductivity tests (A1), (B1) in the same manner as in Example 1 except that this anisotropic conductive adhesive tape was used.
), Insulation tests (A2), (B2) and adhesive strength were measured.
Table 1 shows the composition, continuity test (A1), (B1), insulation test (A2), (B2), and adhesive strength.
[Comparative Example 5]
In Example 1, instead of methyl acrylate (MA), iso-butyl methacrylate (iBMA) and acetoacetoxyethyl methacrylate (AAEM), 90 parts by weight of ethyl acrylate (EA) and 10 parts by weight of acetoacetoxyethyl methacrylate (AAEM) were added. An acrylic binder resin was produced in the same manner except that it was used, and an anisotropic conductive adhesive tape was produced in the same manner except that this acrylic binder resin was used. The glass transition temperature (Tg) of the acrylic binder resin obtained here was −21.8 ° C., and the weight average molecular weight was 200,000.

Conductivity tests (A1), (B1) in the same manner as in Example 1 except that this anisotropic conductive adhesive tape was used.
), Insulation tests (A2), (B2) and adhesive strength were measured.
Table 1 shows the composition, continuity test (A1), (B1), insulation test (A2), (B2), and adhesive strength.

  The anisotropic conductive adhesive tape of the present invention has a β-diketone structure in which a 6-membered ring is formed by bonding a metal to an acrylic binder resin forming an adhesive layer. By contacting the metal, a 6-membered ring structure is formed between the adhesive layer and the metal forming the terminal. By using the anisotropic conductive adhesive tape of the present invention capable of forming such a new structure, very high adhesive strength is exhibited, and in particular, the insulation resistance value and conductivity after wet heat hardly change.

  Therefore, it is possible to perform anisotropic conductive bonding with high reliability by using the anisotropic conductive adhesive tape of the present invention, and the formed wiring board anisotropic conductive adhesive has very high reliability. is doing.

FIG. 1 is an infrared absorption spectrum (IR absorption spectrum) of the adhesive layer of the anisotropic conductive adhesive tape of the present invention before contact with metal. FIG. 2 is an infrared absorption spectrum (IR spectrum) of the adhesive layer of the anisotropic conductive adhesive tape of the present invention after contact with metal.

Claims (13)

(A) an acetoacetoxy group-containing acrylic binder resin having a weight average molecular weight in the range of 10,000 to 500,000 and a glass transition temperature in the range of 0 to 80 ° C;
(B) a monofunctional reactive diluent;
(C) a polyfunctional oligomer;
(D) a silane coupling agent;
(E) a thermal polymerization initiator;
(F) An anisotropic conductive adhesive tape formed by applying a coating liquid containing a conductive filler,
An anisotropic structure characterized in that a β-diketone structure capable of forming a 6-membered ring structure in cooperation with the metal contained in the adherend is formed on the adhesive layer of the anisotropic conductive adhesive tape Conductive adhesive tape. 2. The anisotropic conductive adhesive tape according to claim 1, wherein the (B) monofunctional reaction diluent contains a compound having an acetoacetoxy group. 3. The anisotropic conductive adhesive tape according to claim 2, wherein the acetoacetoxy group-containing monomer contained in the monofunctional reaction diluent is acetoacetoxyalkyl (meth) acrylate. The metal that forms a β-diketone structure capable of forming a six-membered ring structure in cooperation with the metal contained in the adherend is selected from the group consisting of copper, tin, nickel, zinc, aluminum, zirconium, and titanium. The at least one kind of metal selected
Item 2. An anisotropic conductive adhesive tape according to item 2. 2. The thickness of the adhesive layer of the anisotropic conductive adhesive tape is in the range of 5 to 100 μm, and the surface of the adhesive layer is protected with a peelable film. Anisotropic conductive adhesive tape. 2. The anisotropic conductive adhesive tape according to claim 1, wherein a 90 ° peel strength of the anisotropic conductive adhesive tape is in a range of 400 to 3000 N / m. Two wiring boards having a plurality of connection terminals made of conductive metal formed on the surface are arranged so that the connection terminals face each other via an anisotropic conductive adhesive tape, and are arranged to face each other. A wiring board in which connection terminals of the wiring board are electrically connected by a conductive filler via an anisotropic conductive adhesive tape, and no electrical connection is formed between adjacent connection terminals in the same wiring board An anisotropic conductive adhesive,
The anisotropic conductive adhesive tape is
(A) an acetoacetoxy group-containing acrylic binder resin having a weight average molecular weight in the range of 10,000 to 500,000 and a glass transition temperature in the range of 0 to 80 ° C;
(B) a monofunctional reactive diluent;
(C) a polyfunctional oligomer;
(D) a silane coupling agent;
(E) a thermal polymerization initiator;
(F) An anisotropic conductive adhesive tape formed by applying a coating liquid containing a conductive filler,
The anisotropic conductive adhesive tape is composed of at least a part of the surface metal of the connection terminal and at least a part of the β-diketone structure contained in the adhesive component of the anisotropic conductive adhesive tape. A wiring board anisotropic conductive adhesive, wherein the two wiring boards are bonded together by forming a ring structure. 8. The wiring board anisotropic conductive adhesive according to claim 7, wherein the acrylic binder resin (A) contains a component unit derived from an acetoacetoxy group-containing monomer.   The wiring board anisotropic conductive adhesive according to claim 7, wherein the acetoacetoxy group-containing monomer contained in the monofunctional reaction diluent is acetoacetoxyalkyl (meth) acrylate.   The metal contained in the connection terminal forming a β-diketone structure capable of forming a 6-membered ring structure jointly is at least one selected from the group consisting of copper, tin, nickel, zinc, aluminum, zirconium and titanium. The wiring board anisotropic conductive adhesive according to claim 7, wherein the wiring board anisotropic conductive adhesive is made of metal. 8. The wiring substrate anisotropic conduction according to claim 7, wherein one of the two wiring substrates is a display substrate of a display device, and the other is a semiconductor device substrate for driving the display substrate. Glue. 8. The wiring board anisotropic conductive adhesive according to claim 7, wherein the thickness of the adhesive layer for anisotropically conductively bonding the two wiring boards is in the range of 5 to 100 [mu] m. 8. The wiring board according to claim 7, wherein the 90 [deg.] Peel strength of the two wiring boards bonded anisotropically with the anisotropic conductive adhesive tape is in the range of 400 to 3000 N / m. Anisotropic conductive adhesive.

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