JP2006121540A - Waveguide-plane line change-over system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce an influence of dimensional accuracy of a short block and mounting accuracy on characteristics in a waveguide-plane line change-over system. <P>SOLUTION: A via hole 230 is provided at a transformation substrate 200, and a region surrounded by the via hole 230 forms a waveguide. A short block 100 provided in a connected way on the upper face of the transformation substrate 200 has a multi-layer substrate 110, and a conductive pattern 120 is formed on the upper face. In the multi-layer substrate 110, a via hole 130 is provided on an extension line from the via hole 230 of the transformation substrate 200, and a region surrounded with the via hole 130 forms a waveguide. A frame body 300 provided in a connected way on the rear face of the transformation substrate 200 is a metallic frame body, and a waveguide tube 310 connected to the waveguide in the transformation substrate 200 is formed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a waveguide / planar line converter, and more particularly to a waveguide / planar line converter that converts a transmission signal between a waveguide and a planar line for high frequencies such as microwaves and millimeter waves.

  In the transceiver, the high-frequency signal sent from the high-frequency circuit is converted from the planar line mode to the waveguide mode and output to the antenna, or the high-frequency signal received by the antenna is converted from the waveguide mode to the planar line mode. Thus, a waveguide / planar line converter is used for inputting to the high frequency circuit.

  FIG. 10 is a partial sectional perspective view schematically showing a conventional waveguide / planar line converter, and FIG. 11 is a partial sectional view taken along line II-II in the assembled state of the conventional waveguide / planar line converter. It is. The waveguide / planar line converter includes a conversion substrate 200, a housing 300, and a short block 900. The casing 300 disposed on the lower surface of the conversion substrate 200 is a metal casing, and a waveguide 310 including a through hole is formed. The short block 900 disposed on the upper surface of the conversion substrate 200 is a metal lid.

  The conversion substrate 200 is provided with a plurality of via holes 230, and a region surrounded by the via holes 230 forms a waveguide. A signal line 210 is arranged on the upper surface of the conversion substrate 200 so that the patch portion 211 protrudes from the waveguide. A ground plate 280 is formed on the lower surface of the conversion substrate 200 except for an opening corresponding to the waveguide 310 of the housing 300.

  The short block 900 reflects radio waves, and the bottom surface of the short block 900 is connected to the top surface of the via hole 230. A cutout 910 is formed on one side of the short block 900 so as not to short-circuit the signal line 210. In addition, the distance between the inner surface of the short block 900 and the patch portion 211 is set to approximately λ / 4 (where λ is a high-frequency wavelength).

In such a waveguide / planar line converter, the lower surface of the housing 300 receives external high frequency and outputs it to the waveguide 310 or transmits high frequency transmitted from the waveguide 310 to the outside. A planar antenna (not shown) for radiating is provided. Then, the high frequency signal received by the planar antenna propagates through the waveguide 310, reaches the inner surface of the short block 900, is reflected, and changes from the high frequency waveguide mode to the planar line mode via the patch unit 211. Converted. On the other hand, the high-frequency signal in the signal line 210 is radiated into the waveguide 310 and transmitted to the planar antenna after being converted from the planar line mode to the waveguide mode in the patch unit 211 (see, for example, Patent Document 1). .)
Japanese Patent Laying-Open No. 2004-96206 (FIG. 1)

  In the above-described prior art, a metal lid is used as the short block, and the distance between the inner surface of the short block and the patch portion is set to approximately λ / 4. For this reason, assuming a high frequency band such as the 60 GHz band, for example, the error in the installation position of the short block and the patch part and the dimensional accuracy of the short block greatly affect the characteristics of the waveguide / planar line converter. become.

  Accordingly, an object of the present invention is to reduce the influence of the dimensional accuracy and mounting accuracy of the short block by using a multilayer substrate as the short block in the waveguide / planar line converter.

  The present invention has been made to solve the above-mentioned problems. The first side of the present invention has a housing having a waveguide, a signal line for propagating a high-frequency signal on one main surface side, and another main surface. A conversion substrate having a ground plate connected to the waveguide by an opening on the surface side, wherein the first via hole is connected to the ground plate around the opening and shields high frequency in the opening. A plurality of conversion substrates, and a short substrate having a conductor pattern on the surface side facing the conversion substrate that is disposed on the one main surface side of the conversion substrate, the first via hole and the conductor pattern And a short substrate provided with a second via hole for connecting to a waveguide / planar line converter. This brings about the effect of reducing the influence of the dimensional accuracy and mounting accuracy of the short block. In addition, the waveguide / planar line converter is reduced in weight and size, and the assembly process is simplified.

  In the first aspect, the short substrate may be formed of a multilayer substrate. At this time, it is desirable to form the ceramic multilayer substrate or a substrate having a relative dielectric constant of about 7 or more. In particular, according to the low-temperature fired ceramic substrate, the shrinkage control at the time of firing is easy, and the advantage of excellent positional accuracy can be obtained.

  In the first aspect, the conversion substrate and the short substrate can be integrally formed of a multilayer substrate. As a result, it is not necessary to attach the short substrate and the conversion substrate, and the influence due to the accuracy of attaching the short substrate can be eliminated.

  In addition, in the first side surface, a through hole in which a conductor layer is formed on the inner wall surface may be provided instead of the second via hole. Thereby, the leakage of the high frequency in a short board | substrate can be prevented and the effect | action of suppressing the fall of a transmission characteristic is brought about.

  The second aspect of the present invention is a conversion substrate having a signal line that propagates a high-frequency signal on one main surface side and a ground plate that can be connected to a planar antenna by an opening on the other main surface side, A conversion board provided with a plurality of first via holes connected to the ground plate in the periphery of the opening, and a conductor pattern arranged on the one main surface side of the conversion board and facing the conversion board And a short substrate provided with a second via hole for connecting the first via hole and the conductor pattern. is there. As a result, the conversion substrate and the planar antenna are directly connected without using a metal housing, so that mechanical parts are not required, and the weight and size are reduced. Further, by reducing the number of parts, the assembly process can be simplified.

  Further, in the second aspect, the short substrate can be formed of a multilayer substrate, and the conversion substrate and the short substrate can be integrally formed of a multilayer substrate. This is the same as in the first aspect.

  According to a third aspect of the present invention, there is provided a grounding substrate having a waveguide substrate having a waveguide and a signal line for propagating a high-frequency signal on one main surface side, and connected to the waveguide by an opening on the other main surface side. A conversion board having a plate, the conversion board having a plurality of first via holes connected to the ground plate around the opening and shielding high frequencies in the opening; and the main board of the conversion board A short substrate having a conductor pattern arranged on a surface side and having a conductor pattern on the surface side facing the conversion substrate, the second substrate having a second via hole connecting the first via hole and the conductor pattern And the waveguide substrate has a plurality of third via holes provided around the waveguide and shielding high frequencies in the waveguide. A line converter. Thereby, it replaces with a housing | casing, the effect of making a mechanical component unnecessary using a multilayer substrate and reducing in weight and size is brought about. Further, by reducing the number of parts, the assembly process can be simplified.

  Further, in the third aspect, the short substrate can be formed of a multilayer substrate, and the conversion substrate and the short substrate can be integrally formed of a multilayer substrate. This is the same as in the first aspect. In the third aspect, not only the conversion substrate and the short substrate, but also the waveguide substrate may be integrally formed of a multilayer substrate. As a result, the number of parts is reduced and the assembly process is simplified.

  Further, in the third side surface, a through hole in which a conductor layer is formed on the inner wall surface may be provided instead of the third via hole. As a result, high-frequency leakage in the waveguide substrate can be prevented, and an effect of suppressing deterioration in transmission characteristics is brought about.

  According to the present invention, in a waveguide / planar line converter, by using a multilayer substrate as a short block, an excellent effect of reducing the influence of the dimensional accuracy and mounting accuracy of the short block can be obtained. Further, by integrally molding the short block and the conversion substrate with the multilayer substrate, an excellent effect of realizing higher mounting accuracy can be achieved.

  Next, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a partially exploded cross-sectional view schematically showing a main part of a waveguide / planar line converter according to a first embodiment of the present invention, and FIG. 2 is a diagram according to the first embodiment of the present invention. It is a fragmentary sectional view in the assembly state which showed typically the principal part of the waveguide / plane line converter. The cross-sectional portion is the same as that of the conventional waveguide / planar line converter shown in FIG.

  The waveguide / planar line converter includes a conversion substrate 200, a housing 300, and a short block 100. The short block 100 disposed on the upper surface of the conversion substrate 200 is formed by the multilayer substrate 110. The casing 300 disposed on the lower surface of the conversion substrate 200 is a metal casing, and a waveguide 310 formed of a through hole is formed.

  The conversion substrate 200 is provided with a plurality of via holes 230, and a region surrounded by the via holes 230 forms a waveguide. That is, the via hole 230 shields high frequencies in the waveguide. A signal line 210 is disposed on the upper surface of the conversion substrate 200, and one end of the signal line 210 protrudes into the waveguide. A conductor pattern 220 is disposed on the upper surface of the conversion substrate 200 so as to cover the entire via hole 230.

  A ground plate 280 is formed on the lower surface of the conversion substrate 200 except for the opening 290 corresponding to the waveguide 310 of the housing 300. The via hole 230 is connected to the conductor pattern 220 on the upper surface of the conversion substrate 200 and is connected to the ground plate 280 on the lower surface of the conversion substrate 200.

  The short block 100 reflects radio waves. The short block 100 includes a multilayer substrate 110, and a conductor pattern 120 is formed on the upper surface of the multilayer substrate 110. The multilayer substrate 110 is provided with via holes 130 arranged on the extension lines of the via holes 230 in the conversion substrate 200, and a region surrounded by the via holes 130 forms a waveguide. That is, the via hole 130 shields high frequencies in the waveguide. The via hole 130 is connected to the conductor pattern 120 on the upper surface of the short block 100 and is connected to the conductor pattern 220 on the conversion substrate 200 on the lower surface.

  A planar antenna (not shown) is connected to the lower surface of the housing 300. This planar antenna receives high-frequency waves from the outside and outputs them to the waveguide 310 or radiates high-frequency waves transmitted from the waveguide 310 to the outside. The high frequency signal received by the planar antenna propagates through the waveguide 310 and reaches the conductor pattern 120 on the upper surface of the short block 100 and is short-circuited, and is guided through the one end of the signal line 210. Conversion from tube mode to planar line mode. On the other hand, the high-frequency signal in the signal line 210 is converted from the planar line mode to the waveguide mode at one end thereof, then radiated into the waveguide 310 and transmitted to the planar antenna.

ここで、λoは時空間波長であり、εrは誘電体の比誘電率を表す。従って、多層基板１１０の材料として比誘電率の高い誘電体を用いた方が波長短縮効果が顕著になり、多層基板１１０の上面の導体パターン１２０までの距離を短くすることができる。 The distance between one end of the signal line 210 and the conductor pattern 120 on the upper surface of the short block 100 is approximately a quarter wavelength. However, in the embodiment of the present invention, the wavelength is shortened because the waveguide is filled with a dielectric. The wavelength λg when this wavelength shortening effect occurs is approximated by the following equation.

Here, λo is a spatio-temporal wavelength, and εr represents the dielectric constant of the dielectric. Therefore, the use of a dielectric having a high relative dielectric constant as the material of the multilayer substrate 110 makes the wavelength shortening effect more remarkable, and the distance to the conductor pattern 120 on the upper surface of the multilayer substrate 110 can be shortened.

  Various dielectrics can be used as the material of the multilayer substrate 110. Here, for example, the relative permittivity of polyimide resin is about 3.4. On the other hand, in the case of ceramic, the relative dielectric constant is higher than that of polyimide, for example, a value of 7 or more. Therefore, the material of the multilayer substrate 110 is preferably ceramic rather than polyimide because the waveguide / planar line converter can be miniaturized.

  In addition, since the dielectric loss tangent of ceramic is low, heat generation due to frictional resistance at the molecular level hardly occurs even in a high frequency region, and energy loss is small. In particular, low temperature co-fired ceramics (LTCC) are advantageous in that the shrinkage control during firing is easy and the positional accuracy is excellent. This LTCC is a ceramic multilayer technology that enables firing at a low temperature of 900 ° C. or less by adding a glass-based material to alumina.

  FIG. 3 is an example of an exploded plan view schematically showing the main part of the waveguide / planar line converter according to the first embodiment of the present invention. In this example, the shape of the housing 300 viewed from the top surface of the waveguide 310 is rectangular, and the via hole 130 in the multilayer substrate 110 and the via hole 230 in the conversion substrate 200 of the short block 100 are rectangular in accordance with this. Has been placed. These via holes 130 and 230 are preferably formed so as to be inscribed on the same plane as the inner wall surface of the waveguide 310, and are formed at a predetermined interval so as to surround the waveguide 310. The central portion of the conductor pattern 220 is cut out along the via hole 230 as shown in the figure.

  FIG. 4 is another example of an exploded plan view schematically showing the main part of the waveguide / planar line converter in the first embodiment of the present invention. In this example, the shape seen from the upper surface of the waveguide 310 in the housing 300 is circular, and the via hole 130 in the multilayer substrate 110 and the via hole 230 in the conversion substrate 200 of the short block 100 are circularly shaped accordingly. Has been placed. The central portion of the conductor pattern 220 is cut out along the via hole 230 as shown in the figure.

  As described above, according to the waveguide / planar line converter in the first embodiment of the present invention, the short block 100 is configured by arranging the via hole 130 in the multilayer substrate 110, and therefore, due to the wavelength shortening effect. Miniaturization can be realized. This effect is particularly noticeable in ceramics having a high relative dielectric constant. Also, by not using a metal lid as the short block, it is possible to avoid the use of mechanical parts and reduce the influence of the dimensional accuracy and mounting accuracy of the short block. Further, the waveguide / planar line converter can be reduced in weight and size, and the assembly process can be simplified.

  FIG. 5 is a partial cross-sectional view in an assembled state schematically showing the main part of the waveguide / planar line converter in the second embodiment of the present invention. The cross-sectional portion is the same as that of the waveguide / planar line converter in the first embodiment, and the same components as those of the waveguide / planar line converter in the first embodiment are the same. Reference numerals are assigned, and the description thereof is omitted here.

  In the waveguide / planar line converter according to the first embodiment, the conversion substrate 200 and a planar antenna (not shown) are connected via the housing 300, whereas this second The waveguide / planar line converter in the embodiment is different in that the conversion substrate 200 is directly connected to the planar antenna 400.

  The planar antenna 400 includes a via hole 430 disposed on an extension line of the via hole 230 in the conversion substrate 200. A ground plate 280 is formed between the conversion substrate 200 and the planar antenna 400 except for the opening 290 corresponding to the waveguide formed by the via holes 230 and 430.

  A conductor pattern 420 is disposed on the lower surface of the planar antenna 400 so as to cover the entire via hole 430. That is, the via hole 430 is connected to the ground plate 280 on the upper surface of the planar antenna 400 and is connected to the conductor pattern 420 on the lower surface of the planar antenna 400. Further, a rectangular or circular antenna pattern 410 for emitting and receiving radio waves is disposed on the lower surface of the planar antenna 400, and a terminal portion thereof is disposed in the waveguide.

  Thus, according to the waveguide / planar line converter in the second embodiment of the present invention, by directly connecting the conversion substrate 200 and the planar antenna 400 without using a metal casing, Mechanical parts are not required, and the weight can be reduced and the size can be reduced. Further, the assembly process can be simplified by reducing the number of parts.

  FIG. 6 is a partial cross-sectional view in an assembled state schematically showing the main part of the waveguide / planar line converter in the third embodiment of the present invention. The cross-sectional portion is the same as that of the waveguide / planar line converter in the first embodiment, and the same components as those of the waveguide / planar line converter in the first embodiment are the same. Reference numerals are assigned, and the description thereof is omitted here.

  In the waveguide / planar line converter in the first embodiment, the metal casing 300 including the waveguide 310 is used, whereas in the waveguide / planar in the third embodiment. In the line converter, a multilayer substrate 320 is used instead of the housing 300.

  The multilayer substrate 320 is provided with via holes 330 arranged on the extension lines of the via holes 230 in the conversion substrate 200, and a region surrounded by the via holes 330 forms a waveguide. That is, the via hole 330 shields high frequencies in the waveguide. The via hole 330 is connected to the ground plate 280 on the upper surface of the multilayer substrate 320.

  As the material of the multilayer substrate 320, various dielectric materials can be used as in the multilayer substrate 110. In view of the high relative dielectric constant and low dielectric loss tangent, ceramic is preferable to polyimide. In particular, a low-temperature fired ceramic substrate (LTCC) is preferable in that it has excellent positional accuracy.

  As described above, according to the waveguide / planar line converter in the third embodiment of the present invention, the mechanical component is obtained by using the multilayer substrate 320 including the via hole 330 instead of the housing 300. It is unnecessary and can be reduced in weight and size. Further, the assembly process can be simplified by reducing the number of parts. Furthermore, the conversion substrate 200 and the multilayer substrate 320 can be integrally formed with the same multilayer substrate, and the number of parts can be further reduced to simplify the assembly process.

  FIG. 7 is a partial cross-sectional view in an assembled state schematically showing the main part of the waveguide / planar line converter in the fourth embodiment of the present invention. Note that the cross-sectional portion is the same as that of the waveguide / planar line converter in the third embodiment, and the same components as those in the waveguide / planar line converter in the third embodiment are the same. Reference numerals are assigned, and the description thereof is omitted here.

  In the waveguide / planar line converter in the third embodiment, the via hole 330 is used to form the waveguide in the multilayer substrate 320, whereas the waveguide in the fourth embodiment. In the planar line converter, a through-hole in which a conductor layer 340 is provided on the inner wall surface in the multilayer substrate 320 instead of the via hole 330 is formed. As the conductor layer 340, for example, a metal plating layer is provided.

  The conductor layer 340 is connected to the via hole 230 in the conversion substrate 200. A waveguide that shields high frequencies is formed by the through hole surrounded by the conductor layer 340 and the via hole 230.

  As described above, according to the waveguide / planar line converter in the fourth embodiment of the present invention, the through hole surrounded by the conductor layer 340 functions as a waveguide in the multilayer substrate 320. High frequency leakage can be prevented, and deterioration of transmission characteristics can be suppressed.

  FIG. 8 is a partial cross-sectional view in an assembled state schematically showing the main part of a waveguide / planar line converter in a fifth embodiment of the present invention. The cross-sectional portion is the same as that of the waveguide / planar line converter in the first embodiment, and the same components as those of the waveguide / planar line converter in the first embodiment are the same. Reference numerals are assigned, and the description thereof is omitted here.

  In the waveguide / planar line converter in the first embodiment, the via hole 130 is used to form the waveguide in the multilayer substrate 110, whereas the waveguide in the fifth embodiment. In the planar line converter, a through-hole in which the conductor layer 140 is provided on the inner wall surface in the multilayer substrate 110 instead of the via hole 130 is formed. As the conductor layer 140, for example, a metal plating layer is provided.

  The conductor layer 140 is connected to the via hole 230 in the conversion substrate 200. A waveguide that shields high frequencies is formed by the through hole surrounded by the conductor layer 140 and the via hole 230.

  As described above, according to the waveguide / planar line converter in the fifth embodiment of the present invention, the through hole surrounded by the conductor layer 140 functions as a waveguide in the multilayer substrate 110. High frequency leakage can be prevented, and deterioration of transmission characteristics can be suppressed.

  FIG. 9 is a partial cross-sectional view in an assembled state schematically showing the main part of a waveguide / planar line converter according to a sixth embodiment of the present invention. Note that the cross-sectional portion is the same as that of the waveguide / planar line converter in the third embodiment, and the same components as those in the waveguide / planar line converter in the third embodiment are the same. Reference numerals are assigned, and the description thereof is omitted here.

  In the waveguide / planar line converter according to the third embodiment, the multilayer substrate 110 independent of the conversion substrate 200 is disposed as the short block 100, whereas the waveguide according to the sixth embodiment. In the planar line converter, the multilayer substrate 110 and the conversion substrate 200 are integrally formed as the same multilayer substrate.

  As a material for the integrally formed multilayer substrate, various dielectrics can be used as in the multilayer substrate 110 in the first embodiment. In consideration of the high relative dielectric constant and low dielectric loss tangent, ceramic is more preferable than polyimide. In particular, a low-temperature fired ceramic substrate (LTCC) is preferable in that it has excellent positional accuracy.

  Further, in addition to the multilayer substrate 110 and the conversion substrate 200, the multilayer substrate 320 may be integrally molded as the same multilayer substrate. Thereby, the entire main part of the waveguide / planar line converter is provided as one multilayer substrate.

  As described above, according to the waveguide / planar line converter in the sixth embodiment of the present invention, the multilayer block 110 and the conversion substrate 200 are integrally molded as the same multilayer substrate. The mounting with the conversion substrate 200 is not necessary, and the influence due to the mounting accuracy of the short block can be eliminated. Further, by integrally molding the multilayer substrate 320 as the same multilayer substrate, the number of parts can be reduced and the assembly process can be simplified.

  The embodiment of the present invention is an example for embodying the present invention and has a corresponding relationship with the invention-specific matters in the claims as shown below, but is not limited thereto. However, various modifications can be made without departing from the scope of the present invention.

  That is, in claim 1, the housing corresponds to the housing 300, for example. The conversion board corresponds to the conversion board 200, for example. The short substrate corresponds to the multilayer substrate 110, for example. The first via hole corresponds to the via hole 230, for example. The second via hole corresponds to the via hole 130, for example.

  In claim 7, the conductor layer corresponds to the conductor layer 140, for example.

  Further, in claim 8, the planar antenna corresponds to the planar antenna 400, for example. The conversion board corresponds to the conversion board 200, for example. The short substrate corresponds to the multilayer substrate 110, for example. The first via hole corresponds to the via hole 230, for example. The second via hole corresponds to the via hole 130, for example.

  In claim 11, the waveguide substrate corresponds to the multilayer substrate 320, for example. The conversion board corresponds to the conversion board 200, for example. The short substrate corresponds to the multilayer substrate 110, for example. The first via hole corresponds to the via hole 230, for example. The second via hole corresponds to the via hole 130, for example. The third via hole corresponds to the via hole 330, for example.

  In claim 15, the conductor layer corresponds to, for example, the conductor layer 340.

  As an application example of the present invention, for example, the present invention can be applied when converting a transmission signal between a waveguide and a planar line for high frequencies such as microwaves and millimeter waves handled in a transceiver.

It is the fragmentary exploded sectional view showing typically the principal part of the waveguide / plane line converter in a 1st embodiment of the present invention. It is a fragmentary sectional view in the assembly state which showed typically the principal part of the waveguide / planar line converter in the 1st Embodiment of this invention. It is an example of the exploded top view which showed typically the principal part of the waveguide / planar line converter in the 1st Embodiment of this invention. It is another example of the exploded plan view which showed typically the principal part of the waveguide / planar line converter in the 1st Embodiment of this invention. It is the fragmentary sectional view in the assembly state which showed typically the principal part of the waveguide / planar line converter in the 2nd Embodiment of this invention. It is the fragmentary sectional view in the assembly state which showed typically the principal part of the waveguide / planar line converter in the 3rd Embodiment of this invention. It is the fragmentary sectional view in the assembly state which showed typically the principal part of the waveguide / planar line converter in the 4th Embodiment of this invention. It is the fragmentary sectional view in the assembly state which showed typically the principal part of the waveguide / planar line converter in the 5th Embodiment of this invention. It is the fragmentary sectional view in the assembly state which showed typically the principal part of the waveguide / planar line converter in the 6th Embodiment of this invention. It is the partial cross section perspective view which showed typically the conventional waveguide / planar line converter. It is the II-II line | wire partial sectional view in the assembly state of the conventional waveguide / planar line converter.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Short block 110 Multilayer substrate 120 Conductor pattern 130 Via hole 140 Conductor layer 200 Conversion substrate 210 Signal line 211 Patch part 220 Conductor pattern 230 Via hole 280 Ground plate 290 Opening 300 Housing 310 Waveguide 320 Multilayer substrate 330 Via hole 340 Conductor layer 400 Planar antenna 410 Antenna pattern 420 Conductor pattern 430 Via hole 900 Short block 910 Notch

Claims (15)

A housing having a waveguide;
A conversion substrate having a signal line for propagating a high-frequency signal on one main surface side and having a ground plate connected to the waveguide by an opening on the other main surface side, the conversion substrate having a ground plate around the opening A conversion board provided with a plurality of first via holes that are connected to shield high frequencies in the openings;
A short substrate disposed on the one main surface side of the conversion substrate and having a conductor pattern on a surface facing the conversion substrate, the second substrate connecting the first via hole and the conductor pattern A waveguide / planar line converter comprising a short substrate provided with a via hole.   2. The waveguide / planar line converter according to claim 1, wherein the short substrate is formed of a multilayer substrate.   3. The waveguide / planar line converter according to claim 2, wherein the short substrate is formed of a ceramic multilayer substrate.   3. The waveguide / planar line converter according to claim 2, wherein the short substrate has a relative dielectric constant of about 7 or more.   5. The waveguide / planar line converter according to claim 4, wherein the short substrate is formed of a low-temperature fired ceramic substrate.   2. The waveguide / planar line converter according to claim 1, wherein the conversion substrate and the short substrate are integrally formed of a multilayer substrate.   2. The waveguide / planar line converter according to claim 1, wherein a through hole having a conductor layer formed on an inner wall surface is formed in the short substrate instead of the second via hole. A conversion board having a signal line that propagates a high-frequency signal on one main surface side and having a ground plate that can be connected to a planar antenna by an opening on the other main surface side, and connected to the ground plate around the opening A conversion substrate provided with a plurality of first via holes to be
A short substrate disposed on the one main surface side of the conversion substrate and having a conductor pattern on a surface facing the conversion substrate, the second substrate connecting the first via hole and the conductor pattern A waveguide / planar line converter comprising a short substrate provided with a via hole.   9. The waveguide / planar line converter according to claim 8, wherein the short substrate is formed of a multilayer substrate.   9. The waveguide / planar line converter according to claim 8, wherein the conversion substrate and the short substrate are integrally formed of a multilayer substrate. A waveguide substrate having a waveguide;
A conversion board having a signal line for propagating a high-frequency signal on one main surface side and a ground plate connected to the waveguide by an opening on the other main surface side, and connected to the ground plate around the opening A conversion substrate provided with a plurality of first via holes for shielding high frequency in the opening;
A short substrate disposed on the one main surface side of the conversion substrate and having a conductor pattern on a surface facing the conversion substrate, the second substrate connecting the first via hole and the conductor pattern And a short substrate provided with a via hole,
The waveguide / planar line converter characterized in that the waveguide substrate has a plurality of third via holes provided around the waveguide to shield high frequencies in the waveguide.   12. The waveguide / planar line converter according to claim 11, wherein the short substrate is formed of a multilayer substrate.   12. The waveguide / planar line converter according to claim 11, wherein the conversion substrate and the short substrate are integrally formed of a multilayer substrate.   12. The waveguide / planar line converter according to claim 11, wherein the waveguide substrate, the conversion substrate, and the short substrate are integrally formed of a multilayer substrate. 12. The waveguide / planar line converter according to claim 11, wherein in the waveguide substrate, a through hole having a conductor layer formed on an inner wall surface is formed instead of the third via hole.

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