JP2006096035A - Liquid transporting device and its manufacturing method - Google Patents

Liquid transporting device and its manufacturing method Download PDF

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JP2006096035A
JP2006096035A JP2005250473A JP2005250473A JP2006096035A JP 2006096035 A JP2006096035 A JP 2006096035A JP 2005250473 A JP2005250473 A JP 2005250473A JP 2005250473 A JP2005250473 A JP 2005250473A JP 2006096035 A JP2006096035 A JP 2006096035A
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piezoelectric layer
diaphragm
anisotropic conductive
liquid transfer
piezoelectric
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JP4784211B2 (en
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Hiroto Sugawara
宏人 菅原
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Brother Ind Ltd
ブラザー工業株式会社
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Abstract

<P>PROBLEM TO BE SOLVED: To simplify the constitution of electrical connection for applying a voltage to an electrode at a surface of a piezoelectric element, to enhance the reliability of the connection, and to reduce a parasitic capacity. <P>SOLUTION: In a piezoelectric actuator 3 which is arranged at one surface of a passage unit 2 where a plurality of pressure chambers 14 communicating with nozzles 20 are formed, and which changes volumes of the pressure chambers 14, an anisotropic conductive layer 53 is continuously formed over the plurality of pressure chambers 14 on an insulating layer 31 to hold a plurality of discrete electrodes 32 respectively formed at positions opposed to the plurality of pressure chambers 14 on the insulating layer 31. The anisotropic conductive layer 53 of regions respectively opposed to the plurality of pressure chambers 14 is contracted by being pressed by a plurality of piezoelectric layers 33, and has conduction properties. The anisotropic conductive layer 53 of the other region has insulation properties without being contracted. The piezoelectric layer 33 is deformed by a potential difference generated between the discrete electrode 32 and a common electrode 34 via the anisotropic conductive layer 53 of the conduction properties. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a liquid transfer device and a manufacturing method thereof.

  Conventionally, as an inkjet head that prints by ejecting ink to a recording medium, a flow path unit in which an ink flow path including a nozzle and a pressure chamber is formed, and a piezoelectric type that applies pressure to the ink in the pressure chamber Some have an actuator unit. For example, a piezoelectric actuator unit described in Patent Document 1 includes a diaphragm disposed on a head substrate so as to cover a pressure chamber, a metal conductive layer formed on the surface of the diaphragm, and the metal conductive layer. And a piezoelectric element formed through a terminal at a position facing the pressure chamber. Furthermore, a terminal is provided on the surface of each piezoelectric element, and this terminal is connected to a wiring member such as a flexible cable via an anisotropic conductive sheet. When a voltage is applied to a certain terminal via the wiring member, an electric field acts on the corresponding piezoelectric element to deform the piezoelectric element, and the diaphragm is also deformed along with the deformation of the piezoelectric element. Pressure is applied to the ink.

  The ink jet head described in Patent Document 2 includes a diaphragm as a common electrode, a piezoelectric element patterned on the surface of the diaphragm so as to face a plurality of pressure chambers, and individual electrodes. Further, a head body (flow path unit) in which a wiring (conductor portion) for supplying a driving voltage to the individual electrode is formed on the piezoelectric element on the upper side of the portion separating the pressure chambers adjacent to each other to form a plurality of pressure chambers. The electrical contacts are concentrated on the end of the. Therefore, wiring for these contacts is facilitated and a plurality of pressure chambers can be arranged densely.

JP-A-8-230182 Japanese Patent No. 3267937

  In the actuator unit of Patent Document 1, a wiring member is disposed so as to cover a plurality of piezoelectric elements, and the terminals of the wiring member are connected to a plurality of terminals respectively provided on the surfaces of the plurality of piezoelectric elements. Yes. Therefore, when an external force is applied to the wiring member, the wiring member is easily peeled off from the surface of the piezoelectric element, and the reliability of electrical connection between the terminal on the piezoelectric element surface and the wiring member is lowered. In addition, in order to reduce the size of the inkjet head while realizing high-speed printing and high-quality printing, a large number of nozzles are arranged with high density, and accordingly, pressure chambers, piezoelectric elements, and terminals corresponding to the large number of nozzles are also provided. In the case where the wiring members are arranged at a high density, it is necessary to reduce the wiring interval of the wiring members connected to the plurality of terminals arranged at a high density, which increases the manufacturing cost of the wiring members.

  Further, in the ink jet head of Patent Document 2, wiring is routed above the piezoelectric element in the partition wall that separates the pressure chambers adjacent to each other. Therefore, unnecessary capacitance (parasitic capacitance) is generated between the diaphragm as the common electrode and the wiring. In addition, the piezoelectric layer is deformed in a region not facing the pressure chamber, and the deformation causes deformation of the piezoelectric layer in the region facing the pressure chamber, which causes so-called crosstalk.

  An object of the present invention is to provide a liquid transfer device having a simple electrical connection configuration for applying a voltage to an electrode on the surface of a piezoelectric element and having a high connection reliability, and a method for manufacturing the same. Another object of the present invention is to provide a liquid transfer device capable of reducing parasitic capacitance and a method for manufacturing the same.

Means and effects for solving the problems

  According to the first aspect of the present invention, a plurality of pressure chambers communicating with the liquid discharge port are disposed along a plane, and the pressure chamber is disposed on one surface of the flow channel unit. A piezoelectric actuator that changes volume, and the piezoelectric actuator has a diaphragm having insulation properties on at least one surface, and a plurality of piezoelectric actuators extending from positions facing the plurality of pressure chambers on the one surface of the diaphragm. Are formed continuously over the plurality of pressure chambers on the one surface side of the diaphragm and in a plurality of regions opposed to the plurality of pressure chambers to be compressed and conductive. And an anisotropic conductive layer having no conductivity in other regions, a piezoelectric layer formed on the surface of the anisotropic conductive layer opposite to the diaphragm, and the piezoelectric layer Opposite to anisotropic conductive layer In face, the liquid transfer device having a first electrode, a continuously formed over a plurality of pressure chambers is provided.

  In the liquid transfer device of the present invention, since the wiring portion is provided on the surface of the diaphragm, for example, the wiring portion can be drawn out in one direction, and an electric field is applied to the piezoelectric layer at a position facing the pressure chamber. The structure of the electrical connection is simplified, and the reliability of the connection is further increased. In addition, an anisotropic conductive layer having conductivity in a region facing the pressure chamber and having no conductivity in the other region is provided on one surface side of the diaphragm. Therefore, a driving voltage is applied to the anisotropic conductive layer in the region facing the pressure chamber by the wiring portion, and the piezoelectric layer in this region is deformed. On the other hand, in a region that does not face the pressure chamber, an insulating anisotropic conductive layer is interposed between the wiring portion and the first electrode, so that a short circuit between the wiring portion and the first electrode is prevented. Can be prevented. Furthermore, it is possible to suppress the occurrence of parasitic capacitance in the piezoelectric layer between the wiring portion and the first electrode due to the interposed insulating anisotropic conductive layer, and the piezoelectric actuator can be driven at a lower voltage. Drive efficiency of the piezoelectric actuator is improved. Further, the crosstalk can be reduced by suppressing the deformation of the piezoelectric layer in the region not facing the pressure chamber.

  In the liquid transfer device of the present invention, the liquid may be ink, the discharge port may be a nozzle that discharges the ink, and the liquid transfer device may be an inkjet head. In this case, since the liquid transfer device of the present invention can transfer a minute amount of liquid, it can be applied to an inkjet head that ejects a minute amount of ink.

  In the liquid transfer device of the present invention, a plurality of second electrodes (individual electrodes) respectively connected to the plurality of wiring portions are provided at positions facing the plurality of pressure chambers on the one surface of the diaphragm. It may be formed. According to this, since the second electrode connected to the wiring portion is formed in a region facing the pressure chamber, an electric field can be reliably generated in the piezoelectric layer via the wiring portion and the second electrode. .

  In the liquid transfer device of the present invention, a plurality of third electrodes may be respectively formed between the piezoelectric layer and the anisotropic conductive layer in the plurality of regions. According to this, since the third electrode is formed between the piezoelectric layer and the anisotropic conductive layer in the region facing the pressure chamber, the piezoelectric layer is securely connected to the piezoelectric layer via the wiring portion and the third electrode. An electric field can be generated.

  The liquid transfer device according to the present invention is a driving device that supplies a driving voltage to a portion of the anisotropic conductive layer that is compressed and conductive at the ends of the plurality of wiring portions on the one surface of the diaphragm. A plurality of connection terminals may be formed, respectively. According to this, since the drive device can be arranged on the diaphragm and the drive device can be connected to the portion of the anisotropic conductive layer facing the pressure chamber via the connection terminal and the wiring portion, the flexible printed wiring board A wiring member such as (FPC) becomes unnecessary, and the manufacturing cost can be reduced. Further, since the wiring portion is directly provided on the insulating layer on the diaphragm by a screen printing method or the like, there is no movable part and there is no fear of disconnection.

  The piezoelectric layer of the liquid transfer device of the present invention may be formed only in the plurality of regions. According to this, since the piezoelectric layer is formed only in the region facing the pressure chamber, parasitic capacitance is generated between the wiring portion and the first electrode (common electrode) in the region not facing the pressure chamber. It can be reliably prevented. Furthermore, since the deformation of the piezoelectric layer does not occur in the region that does not face the pressure chamber, and the deformation does not propagate to the region that faces the pressure chamber, crosstalk can be more reliably reduced. The piezoelectric layer may be provided only in a part of the region facing the pressure chamber, for example, only in the region facing the second electrode.

  The piezoelectric layer of the liquid transfer device of the present invention may be thicker in the plurality of regions than in other regions. According to this, since the thickness of the piezoelectric layer in the region facing each of the plurality of pressure chambers is larger than the thickness of the piezoelectric layer in the other region, the piezoelectric layers in the regions facing each of the plurality of pressure chambers have different conductivity. The piezoelectric layer in other regions can be prevented from being deformed through the insulating anisotropic conductive layer while being deformed through the isotropic conductive layer. Further, since the first electrode can be formed on the surface of the piezoelectric layer without a step, the formation thereof is simplified.

  The diaphragm of the liquid transfer device of the present invention may be thicker in the plurality of regions than in other regions. In this case, the region where the anisotropic conductive layer is pressed and made conductive can be easily defined by the portion of the diaphragm having a larger thickness.

  The piezoelectric layer of the liquid transfer device of the present invention may have a trapezoidal shape in which a cross-sectional shape in a direction perpendicular to the surface of the piezoelectric layer extends toward the diaphragm side. In addition, the piezoelectric layer of the liquid transfer device of the present invention may have a protruding portion that protrudes in a direction parallel to the surface at a portion opposite to the diaphragm. Due to the trapezoidal shape and the protruding portion, when the anisotropic conductive layer is pressed by applying pressure from above the piezoelectric layer, the anisotropic conductive layer protruding from the lower surface of the piezoelectric layer is formed on the side surface of the piezoelectric layer. It can be prevented from rising.

  The ink jet printer of the present invention may include the liquid transfer device. In this case, since the liquid transfer device is an inkjet head, it is possible to provide a printer having an inkjet head with high piezoelectric actuator driving efficiency, low crosstalk, and high electrical connection reliability.

The liquid transfer device of the present invention may include a valve that regulates the flow of liquid flowing through the flow path unit. In this case, since the back flow of the liquid is prevented, the liquid transfer device can operate stably.

  According to the second aspect of the present invention, a plurality of pressure chambers communicating with the liquid discharge port are disposed along a plane, and the pressure chamber is disposed on one surface of the flow channel unit. A method of manufacturing a liquid transfer device including a piezoelectric actuator that changes a volume, wherein a diaphragm laminating step of arranging a diaphragm having insulation on at least one surface of the one surface of the flow path unit; A wiring step of forming a plurality of wiring portions extending from positions facing the plurality of pressure chambers on the one surface of the diaphragm; and the pressure chambers on the one surface side of the diaphragm. An anisotropic conductive layer forming step for continuously forming the anisotropic conductive layer, and a piezoelectric layer forming step for forming a piezoelectric layer on the surface of the anisotropic conductive layer opposite to the diaphragm, Each of the plurality of pressure chambers of the piezoelectric layer; Compressing the plurality of regions facing each other toward the diaphragm side to compress the plurality of regions facing the plurality of pressure chambers of the anisotropic conductive layer, and the piezoelectric layer And a sixth electrode forming step of continuously forming a first electrode across the plurality of pressure chambers on a surface opposite to the anisotropic conductive layer. Is done.

  According to the method for manufacturing a liquid transfer device of the present invention, since the wiring portion is provided on the surface of the diaphragm, the configuration of electrical connection for applying an electric field to the piezoelectric layer at a position facing the pressure chamber is simple. And the reliability of the connection becomes high. In addition, by pressing the portion of the anisotropic conductive layer in the region facing the pressure chamber, the anisotropic conductive layer of this portion has conductivity, and other portions no longer have conductivity. A short circuit between the wiring part and the first electrode can be prevented. Furthermore, it is possible to suppress the generation of parasitic capacitance in the piezoelectric layer between the wiring portion and the first electrode, and the piezoelectric actuator can be driven at a lower voltage, so that the driving efficiency of the piezoelectric actuator is improved.

In the method of manufacturing a liquid transfer device according to the present invention, the liquid is ink, the discharge port is a nozzle that discharges the ink, the liquid transfer device is an inkjet head, and in the compression step, the piezoelectric layer A plurality of regions respectively facing the plurality of pressure chambers may be pressed toward the diaphragm side. In this case, it is possible to manufacture an ink jet head that can drive a piezoelectric actuator efficiently at a low voltage without crosstalk.

  The method for manufacturing a liquid transfer device according to the present invention includes a plurality of wiring portions connected to the plurality of wiring portions respectively in positions facing the plurality of pressure chambers on the one surface of the diaphragm in the wiring step. A second electrode may be formed. According to this, an electric field can be reliably generated in the piezoelectric layer via the wiring portion and the second electrode.

  In the method for manufacturing a liquid transfer device of the present invention, in the wiring step, the anisotropic conductive layer having conductivity by being compressed at the end of the plurality of wiring portions on the one surface of the diaphragm. A plurality of connection terminals to which a driving device for supplying a driving voltage to the portion is connected may be formed. According to this, an electric field can be reliably generated in the piezoelectric layer via the wiring portion and the third electrode.

  In the method for manufacturing a liquid transfer device of the present invention, in the piezoelectric layer forming step, the piezoelectric layer may be formed only in a region facing the pressure chamber. According to this, in the area | region which does not oppose a pressure chamber, it can suppress reliably that an unnecessary electrostatic capacitance arises between a wiring part and a 1st electrode. Furthermore, since the piezoelectric layer is not deformed in a region not facing the pressure chamber, crosstalk can be reduced.

  In the method for manufacturing a liquid transfer device of the present invention, in the compression step, the piezoelectric layer formed in a region facing each of the plurality of pressure chambers is maintained in a state in which the piezoelectric layer protrudes from the anisotropic conductive layer. May be pressed. According to this, when a plurality of piezoelectric layers are pressed at once with a flat plate or the like, the anisotropic conductive layer in a region not facing the pressure chamber is not pressed with the flat plate or the like. Further, the anisotropic conductive layer can be prevented from rising and adhering to the surface of the piezoelectric layer, and the first electrode can be formed on the entire surface of the piezoelectric layer.

  In the method for manufacturing a liquid transfer device of the present invention, the cross-sectional shape in a direction perpendicular to the surface of the piezoelectric layer may be a trapezoid that widens toward the diaphragm side. According to this, in the sixth compression step, it is easy to form the first electrode on the side surface of the piezoelectric layer protruding from the anisotropic conductive layer.

  In the method for manufacturing a liquid transfer device of the present invention, the piezoelectric layer may have an overhanging portion that protrudes in a direction parallel to the surface at a portion opposite to the diaphragm. According to this, when the piezoelectric layer is pressed, the anisotropic conductive layer rises on the surface of the piezoelectric layer and becomes difficult to adhere.

  In the method for manufacturing a liquid transfer device of the present invention, a liquid repellent film may be formed on a side surface of the piezoelectric layer in the piezoelectric layer forming step. According to this, since the wettability of the side surface of the piezoelectric layer becomes low, when the piezoelectric layer is pressed, the anisotropic conductive layer rises on the surface of the piezoelectric layer and becomes difficult to adhere.

  In the method for manufacturing a liquid transfer device of the present invention, in the vibration plate laminating step, a vibration plate in which the thickness of the plurality of regions is larger than the other regions may be used. A region where the anisotropic conductive layer is pressed and made conductive can be easily defined by the thick portion of the diaphragm.

  Hereinafter, embodiments of an inkjet head according to the present invention will be described with reference to the drawings.

[First Embodiment]
A first embodiment of the present invention will be described. In the serial printer 50 shown in FIG. 1, the inkjet head 1 is disposed below the carriage 5 that reciprocates in the left-right direction in the drawing, and ejects ink toward the paper 4 discharged in the direction of the arrow by the paper feed roller 6. . As shown in FIG. 2, such an ink jet head 1 includes a flow path unit 2 in which an ink flow path is formed, and a piezoelectric actuator 3 stacked on the upper surface of the flow path unit 2.

  First, the flow path unit 2 will be described. FIG. 3 is a schematic plan view of the right half of the inkjet head 1 of FIG. 4 is a sectional view taken along line IV-IV in FIG. 3, FIG. 5 is a sectional view taken along line VV in FIG. 3, and FIG. 6 is a sectional view taken along line VI-VI in FIG. As shown in FIGS. 3 to 6, the flow path unit 2 includes a cavity plate 10, a base plate 11, a manifold plate 12, and a nozzle plate 13, and these four plates 10 to 13 are bonded in a laminated state. Yes. Among these, the cavity plate 10, the base plate 11, and the manifold plate 12 are substantially rectangular stainless steel plates. Therefore, ink flow paths such as a manifold 17 and a pressure chamber 14 described later can be easily formed on these three plates 10 to 12 by etching. The nozzle plate 13 is formed of, for example, a polymer synthetic resin material such as polyimide, and is bonded to the lower surface of the manifold plate 12. Or this nozzle plate 13 may be formed with metal materials, such as stainless steel, similarly to the three plates 10-12.

  As shown in FIG. 3, the cavity plate 10 is formed with a plurality of pressure chambers 14 arranged along a plane. The plurality of pressure chambers 14 are open on the surface of the flow path unit 2 (the upper surface of the cavity plate 10 to which a diaphragm 30 described later is joined). FIG. 3 shows a part (ten) of the plurality of pressure chambers 14. Each pressure chamber 14 is formed in a substantially elliptical shape in plan view, and is arranged so that the major axis direction thereof is parallel to the longitudinal direction of the cavity plate 10.

  Communication holes 15 and 16 are formed at positions overlapping the both ends in the long axis direction of the pressure chamber 14 in plan view of the base plate 11, respectively. Further, the manifold plate 12 is formed with a manifold 17 extending in two rows in the short side direction of the manifold plate (vertical direction in FIG. 3) and overlapping the right half of the pressure chamber 14 in FIG. Ink is supplied to the manifold 17 from an ink tank (not shown) through an ink supply port 18 formed in the cavity plate 10. Further, a communication hole 19 is also formed at a position overlapping the end of the pressure chamber 14 on the side close to the ink supply port 18 in FIG. 3 in plan view. Further, the nozzle plate 13 is formed with a plurality of nozzles 20 at positions overlapping the end portions of the plurality of pressure chambers 14 near the ink supply port 18 in FIG. The nozzle 20 is formed, for example, by performing excimer laser processing on a polymer synthetic resin substrate such as polyimide.

  As shown in FIG. 4, the manifold 17 communicates with the pressure chamber 14 through the communication hole 15, and the pressure chamber 14 communicates with the nozzle 20 through the communication holes 16 and 19. As described above, an individual ink flow path from the manifold 17 to the nozzle 20 through the pressure chamber 14 is formed in the flow path unit 2.

  Next, the piezoelectric actuator 3 will be described. As shown in FIGS. 2 to 6, the piezoelectric actuator 3 includes a diaphragm 30 disposed on the surface of the flow path unit 2, an insulating layer 31 formed on the surface of the diaphragm 30, and a surface of the insulating layer 31. And a plurality of individual electrodes (second electrodes) 32 respectively corresponding to the plurality of pressure chambers 14 and the surface of the insulating layer 31 on which the individual electrodes 32 are formed, continuously across the plurality of pressure chambers 14. The anisotropic conductive layer 53 formed on the surface, the plurality of piezoelectric layers 33 formed on the surface of the anisotropic conductive layer 53 so as to face the plurality of pressure chambers 14, respectively, and the plurality of piezoelectric layers 33 And the upper surface 53a (simply referred to as the upper surface 53a), which is the surface of the anisotropic conductive layer 53 in the region where the plurality of piezoelectric layers 33 are not formed, and extends over the plurality of individual electrodes 32. Common electrode (first electrode) 34 provided in common It is equipped with a.

  The vibration plate 30 is a substantially rectangular stainless steel plate in plan view, and is joined to the upper surface of the cavity plate 10 so as to close the openings of the plurality of pressure chambers 14. Here, since the vibration plate 30 is formed of stainless steel having a relatively high elastic modulus, the rigidity of the vibration plate 30 is increased when the piezoelectric layer 33 is deformed during the ink ejection operation as described later. As a result, the responsiveness of the piezoelectric actuator 3 is increased. Further, since the diaphragm 30 is joined to the surface of the cavity plate 10 which is also formed of stainless steel, the thermal expansion coefficients of the diaphragm 30 and the cavity plate 10 become equal, and the joint strength between them is improved. Furthermore, the ink in the flow path unit 2 comes into contact with the flow path unit 2 and the vibration plate 30 formed of stainless steel having excellent corrosion resistance against the ink. Therefore, no matter what kind of ink is selected, there is no possibility that a local battery is formed in the flow path unit 2 or on the diaphragm 30, and the ink selection is not restricted by the corrosive surface. The degree is increased.

  On the surface of the diaphragm 30, an insulating layer 31 is formed which is made of a ceramic material having a high elastic modulus such as alumina, zirconia, or silicon nitride, and the surface thereof is flat. Examples of the method for forming the insulating layer 31 include an aerosol deposition method (AD method), a sol-gel method, a CVD method, and a sputtering method. Thus, since the insulating layer 31 is formed of a ceramic material having a high elastic modulus, the rigidity of the actuator is increased and the responsiveness is further increased. Thus, since the insulating layer 31 is formed on the surface of the diaphragm 30, even when the diaphragm 30 is not formed of an insulating material but is formed of stainless steel which is the above-described suitable material, the insulating layer 31 is interposed therebetween. Thus, a plurality of individual electrodes 32 can be formed on the diaphragm 30.

  Further, a plurality of individual electrodes 32 having an elliptical planar shape that is slightly smaller than the pressure chamber 14 are formed on the surface of the insulating layer 31 by screen printing or the like. The individual electrode 32 is formed at a position overlapping the central portion of the corresponding pressure chamber 14 in plan view. The individual electrode 32 is made of a conductive material such as gold. The adjacent individual electrodes 32 are electrically insulated from each other by the insulating layer 31.

  On the surface of the insulating layer 31, a plurality of wiring portions 35 extend in parallel with the long axis direction of the individual electrode 32 from one end portion (the right end portion in FIG. 3) of the plurality of individual electrodes 32. A terminal portion 36 is formed at each end of the wiring portion 35. The height positions of the plurality of terminal portions 36 are all the same. An output terminal 37a of a driver IC (drive device) 37 that selectively supplies a drive voltage to the plurality of individual electrodes 32 is connected to a plurality of terminal portions 36 respectively corresponding to the plurality of individual electrodes 32. The driver ICs 37 are disposed on the surface of the insulating layer 31 through bonding with bumps 38 made of a conductive brazing material. As described above, since the wiring portion 35 formed on the same plane as the individual electrode 32 can directly connect the plurality of individual electrodes 32 and the driver IC 37 without using a high-cost wiring member such as an FPC. The cost of the electrical connection can be reduced, and the reliability of the electrical connection is increased.

  Furthermore, a plurality of connection terminals 40 that are joined to the input terminals 37 b of the driver IC 37 are also formed on the insulating layer 31. The plurality of connection terminals 40 and the input terminals 37b of the driver IC 37 are joined via bumps 39 made of solder or the like, thereby connecting the driver IC 37 and a control device (not shown) for controlling the driver IC 37. It can be easily connected via the terminal 40.

  On the surface of the insulating layer 31 on which the plurality of individual electrodes 32 are formed, an anisotropic conductive film (ACF (Anisotropic Conductive Film)) is a sealing resin in which conductive particles are dispersed in a thermosetting epoxy resin. An anisotropic conductive layer 53 is formed. The anisotropic conductive layer 53 is formed as one continuous layer over the entire region (including the region where the individual electrode 32 is formed) on the insulating layer 31 facing the plurality of pressure chambers 14 respectively. ing. The anisotropic conductive layer 53 may be configured to transfer a single sheet of ACF onto the surface of the insulating layer 31, or may be configured to transfer a plurality of ACFs continuously without gaps. Alternatively, a paste-like anisotropic conductive paste (ACP (Anisotropic Conductive Paste)) may be uniformly applied.

  Lead zirconate titanate (PZT), which is a solid solution and a ferroelectric substance of lead titanate and lead zirconate, is formed on the surface of the anisotropic conductive layer 53 and faces each of the plurality of individual electrodes 32. A plurality of piezoelectric layers 33 containing as a main component are formed. Here, in the present embodiment, the piezoelectric layer 33 is configured to be formed only in a region facing the individual electrode 32 which is a part of the region facing the pressure chamber 14. Thus, the region where the piezoelectric layer 33 is formed includes the case where it is a part of the plurality of regions (here, the regions facing the individual electrodes 32) that respectively face the plurality of pressure chambers 14. Needless to say, the piezoelectric layer 33 may be formed over the entire range of the region facing the pressure chamber 14. The piezoelectric layer 33 is formed by laser cutting a piezoelectric sheet formed by firing a green sheet at about 1100 ° C. to a predetermined size, and is heated from the upper surface 33a of the piezoelectric layer 33 in the direction of the insulating layer 31. Is transferred onto the anisotropic conductive layer 53. When the piezoelectric layer 33 is heated and pressed, the anisotropic conductive layer 53 between the piezoelectric layer 33 and the insulating layer 31 is compressed, and the plurality of conductive particles in the anisotropic conductive layer 53 are compressed. Yes. That is, the anisotropic conductive layer 53 is compressed in a region that is part of a region facing the pressure chamber 14. The compressed conductive particles are in contact with each other and pressed against the individual electrode 32 and the piezoelectric layer 33, thereby electrically connecting the individual electrode 32 and the piezoelectric layer 33. That is, the anisotropic conductive layer 53 between the piezoelectric layer 33 and the insulating layer 31 has conductivity. The heated and pressed anisotropic conductive layer 53 is cured in a compressed state. On the other hand, since the anisotropic conductive layer 53 in a region that does not face the plurality of individual electrodes 32 is not heated and pressed, the plurality of conductive particles therein are not in contact with each other. Therefore, it has no electrical conductivity, has an insulating property, and is naturally cured. The plurality of piezoelectric layers 33 are fixed in a state where the upper surface 33 a protrudes from the upper surface 53 a of the anisotropic conductive layer 53. In this way, the anisotropic conductive layer 53 compressed by heating, pressing and compressing has electrical conductivity and electrically connects the individual electrode 32 and the piezoelectric layer 33. Therefore, the piezoelectric layer is used during the ink discharge operation described later. It is possible to cause the electric field 33 to be deformed by applying an electric field. Further, the piezoelectric layer 33 does not exist in a region that does not face the plurality of individual electrodes 32, and due to the deformation, the piezoelectric layer 33 in a region that faces the individual electrode 32 is deformed during an ink discharge operation described later. Therefore, crosstalk can be reliably reduced.

  As shown in FIGS. 4 to 6, the common electrode 34 common to the plurality of individual electrodes 32 has a step on the top surface 33 a of the plurality of piezoelectric layers 33 and the top surface 53 a of the anisotropic conductive layer 53. Is formed. As shown in FIG. 3, one wiring portion 41 extends from the common electrode 34, and this wiring portion 41 is formed so as to extend over the surface of the insulating layer 31. Further, the terminal portion 42 provided at the end of the wiring portion 41 is in contact with a terminal (not shown) of the driver IC 37. Thereby, the common electrode 34 is grounded via the wiring portion 41 and the driver IC 37 and is held at the ground potential. The common electrode 34 is also made of a conductive material such as gold. The common electrode 34, the wiring portion 41, and the terminal portion 42 are formed using screen printing, vapor deposition, sputtering, or the like. Note that the height position of the terminal portion 42 is the same as the height position of the terminal portion 36. Since the anisotropic conductive layer 53 having an insulating property is interposed between the common electrode 34 formed in this way and the plurality of wiring portions 35, the common electrode 34 and the wiring portion 35 may be short-circuited. Absent. Further, when a voltage is applied to the wiring part 35, parasitic capacitance is not generated between the common electrode 34 and the wiring part 35, and the driving efficiency of the piezoelectric actuator 3 is improved.

  Since the common electrode 34 is formed over all the individual electrodes 32, only one wiring portion 41 is required to connect the common electrode 34 to the driver IC 37. Therefore, it is not necessary to use a wiring member such as FPC in order to connect the common electrode 34 to the driver IC 37, and since there is only one terminal, electrical connection is easy using a conductive paste or the like. And the connection reliability is high.

  In FIG. 3, a plurality of terminal portions 36 corresponding to the plurality of individual electrodes 32 and a single terminal portion 42 corresponding to the common electrode 34 are both formed on the surface of the insulating layer 31. The height positions of 36 and 42 can all be the same. Accordingly, the joining operation between the output terminal of the driver IC 37 and the terminal portions 36 and 42 is facilitated, and the reliability of the electrical connection after joining is increased. Furthermore, when all of the plurality of terminal portions 36 and one terminal portion 42 are formed on the surface of the insulating layer 31, it is only necessary to form the plurality of wiring portions 35 and one wiring portion 41 on the surface of the insulating layer 31. Therefore, the height positions of the terminal portions 36 and 42 can be matched with a simple wiring structure that does not employ a complicated structure such as a through hole.

  When the wiring portion 41 is formed from the common electrode 34 to the insulating layer 31 at a time, the thickness of the portion corresponding to the step is reduced, so that the reinforcing portion 43 is provided in this portion as shown in FIG. The reliability can be improved.

  Next, the operation of the inkjet head 1 during ink ejection will be described with reference to FIG. When a drive voltage is selectively supplied from the driver IC 37 to the plurality of individual electrodes 32 respectively connected to the driver IC 37 via the plurality of wiring sections 35, the lower side of the piezoelectric layer 33 to which the drive voltage is supplied is provided. The potentials of the individual electrodes 32 and the common electrode 34 on the upper side of the piezoelectric layer 33 held at the ground potential become different, and an electric field in the vertical direction is generated in the piezoelectric layer 33 sandwiched between the electrodes 32 and 34. Then, a portion of the piezoelectric layer 33 immediately above the individual electrode 32 to which the drive voltage is applied contracts in a horizontal direction orthogonal to the vertical direction that is the polarization direction. Here, since the insulating layer 31 and the diaphragm 30 on the lower side of the piezoelectric layer 33 are fixed to the cavity plate 10, the portion of the piezoelectric layer 33 sandwiched between both electrodes 32 and 34 is the pressure chamber 14. As the piezoelectric layer 33 is partially deformed, the portion covering the pressure chamber 14 of the diaphragm 30 is also deformed to be convex toward the pressure chamber 14. Then, since the volume in the pressure chamber 14 decreases, the ink pressure rises, and ink is ejected from the nozzle 20 communicating with the pressure chamber 14.

  Next, the manufacturing method of the inkjet head 1 is demonstrated using FIG. FIG. 7 is an enlarged view of the main part A of FIG. 6, and is a cross-sectional view showing the manufacturing process of the ink jet head in the order of steps. First, the three stainless steel plates 10 to 12 are joined by diffusion bonding or the like.

<Diaphragm lamination process>
In FIG. 7A, the diaphragm 30 is joined to the upper surface of the cavity plate 10 by diffusion joining or the like so as to close the opening of the pressure chamber 14. Further, an insulating layer 31 made of a ceramic material such as alumina, zirconia, or silicon nitride is continuously formed on the upper surface of the vibration plate 30. As a method for forming the insulating layer 31, for example, if an aerosol deposition method (AD method) in which ultrafine particle materials are collided at high speed and deposited is used, a very thin and dense layer can be formed. In addition, the insulating layer 31 can be formed using a sol-gel method, a sputtering method, or a CVD method.

<Wiring process>
In FIG. 7B, the individual electrode 32 is formed by screen printing on the surface of the insulating layer 31 at a position facing the central portion of the pressure chamber 14. Further, simultaneously with the individual electrodes 32, a wiring part 35 (see FIGS. 3 and 4) extending in the vertical direction of the drawing, and a terminal part 36 (FIG. 3) connected to the bumps of the driver IC 37 at the end of the wiring part 35. 4), a plurality of connection terminals 40 (see FIGS. 3 and 4) joined to the input terminal 37 a of the driver IC 37, a wiring portion 41 for connecting the common electrode 34 to the driver IC 37, and its terminal portion 42 ( 3 and 4) are formed by screen printing. At this time, for example, the conductive paste is screen-printed on the surface of the insulating layer 31 so that the patterned individual electrode 32, wiring portion 35, terminal portion 36, connection terminal 40, wiring portion 41, and terminal portion 42 are formed at a time. Can be formed. Alternatively, after forming a conductive layer on the entire surface of the insulating layer 31 by plating, sputtering, vapor deposition, or the like, the conductive layer is partially removed by laser, mask, resist method, etc. The part 35, the terminal part 36, the connection terminal 40, the wiring part 41, and the terminal part 42 may be patterned.

<Anisotropic conductive layer forming step>
In FIG. 7C, 1 continuous over the entire surface of the insulating layer 31 (including the region where the individual electrode 32 is formed) on the insulating layer 31 facing the plurality of pressure chambers 14. An anisotropic conductive layer 53 as one layer is formed. As a method of forming the anisotropic conductive layer 53, a method of transferring one film-like ACF or transferring a plurality of ACFs continuously without a gap may be used. The method of apply | coating may be sufficient. The individual electrode 32 and the wiring part 35 are sandwiched between the insulating layer 31 and the anisotropic conductive layer 53, but the terminal part 36 is protruded from the anisotropic conductive layer 53. The driver IC 37 arranged on the surface can be connected via the bump 38. Further, the connection terminal 40, the wiring part 41, and the terminal part 42 are not covered with the anisotropic conductive layer 53.

<Piezoelectric layer forming process>
In FIG. 7D, the piezoelectric layer 33 formed by firing a PZT green sheet by laser cutting into a predetermined size is formed on the surface of the anisotropic conductive layer 53 and individually. Transfer to a position facing the electrode 32.

<Compression process>
In FIG. 7 (e), the piezoelectric layer 33 is pressed from the upper surface 33 a of the piezoelectric layer 33 toward the insulating layer 31 using the pressing plate 55. The pressing of the piezoelectric layer 33 is performed while heating the piezoelectric layer 33. In addition, the piezoelectric layer 33 is pressed from the anisotropic conductive layer 53 by the plurality of piezoelectric layers 33 formed in a plurality of regions facing the plurality of pressure chambers 14 (regions respectively facing the plurality of individual electrodes 32). It is performed while maintaining the protruding state. Then, the anisotropic conductive layer 53 is compressed in a plurality of portions sandwiched between the individual electrode 32 and the piezoelectric layer 33, and accordingly, the plurality of conductive particles in the anisotropic conductive layer 53 of each portion are also compressed. Compressed. The individual electrode 32 and the piezoelectric layer 33 are electrically connected through the conductive particles compressed in this way. Further, the heated and pressed anisotropic conductive layer 53 is cured. The pressed piezoelectric layer 33 is fixed with its upper surface 33 a protruding from the anisotropic conductive layer 53. In this way, the piezoelectric layer 33 is pressed while maintaining the state in which the upper surface 33 a protrudes from the upper surface 53 a of the anisotropic conductive layer 53, so that the anisotropic conductive layer in a region that does not face the individual electrodes 32. 53 is not pressed, and the anisotropic conductive layer 53 does not rise and adhere to the upper surface 33a of the piezoelectric layer 33. The anisotropic conductive layer 53 in a region not sandwiched between the individual electrode 32 and the piezoelectric layer 33 has an insulating property and is naturally cured. The curing may be accelerated by heating the anisotropic conductive layer 53 in a region not sandwiched between the individual electrode 32 and the piezoelectric layer 33.

<First electrode forming step>
In FIG. 7F, the common electrode 34 common to the plurality of individual electrodes 32 is continuously formed on the upper surface 53a of the anisotropic conductive layer 53 and the upper surface 33a of the piezoelectric layer 33 with a step. Examples of the method for forming the common electrode 34 include screen printing, vapor deposition, and sputtering.

  After that, as shown in FIG. 4, the driver IC 37 is disposed on the insulating layer 31, and the output terminal 37 a of the driver IC 37 is joined to the terminal portion 36 and the terminal portion 42 via the bump 38, and the input terminal of the driver IC 37 37 b is bonded to the connection terminal 40 via the bump 39. Finally, the nozzle plate 13 is bonded to the lower surface of the manifold plate 12.

  As described above, in the inkjet head 1 according to the present embodiment, the plurality of individual electrodes 32 are provided on the surface of the insulating layer 31 facing the plurality of pressure chambers 14, and different from each other, facing the plurality of individual electrodes 32. The piezoelectric layer 33 is provided on the surface of the isotropic conductive layer 53. In the region facing the individual electrode 32, the anisotropic conductive layer 53 compressed by heating and pressing the piezoelectric layer 33 has conductivity. In the region not facing the individual electrode 32, the anisotropic conductive layer 53 that is not compressed has an insulating property. As a result, in a region facing the pressure chamber 14 (more specifically, the individual electrode 32), between the individual electrode 32 to which the drive voltage is applied and the common electrode 34 provided with the piezoelectric layer 33 interposed therebetween. The piezoelectric layer 33 can be deformed by the potential difference. In addition, in a region that does not face the pressure chamber 14 (more specifically, the individual electrode 32), the generation of parasitic capacitance between the wiring portion 35 formed on the insulating layer 31 and the common electrode 34 can be suppressed. Therefore, the driving efficiency of the piezoelectric actuator 3 can be improved. Further, a short circuit between the wiring portion 35 and the common electrode 34 is prevented by the anisotropic conductive layer 53 having insulating properties. Furthermore, since the piezoelectric layer 33 is not formed in the region that does not face the pressure chamber 14 and deformation does not occur, crosstalk generated in the piezoelectric layer 33 in the region that faces the pressure chamber 14 can be reduced.

  In addition, since the wiring portion 35 formed on the same plane as the individual electrode 32 (on the insulating layer 31), the plurality of individual electrodes 32 and the driver IC 37 can be directly connected without using a costly wiring member such as an FPC. The cost of electrical connection can be reduced, and the reliability of electrical connection can be increased.

  In addition, since the piezoelectric layer 33 protrudes from the anisotropic conductive layer 53, the anisotropic conductive layer 53 in a region not facing the pressure chamber 14 is not pressed to cause conductivity. Further, since the anisotropic conductive layer 53 does not rise and adhere to the surface of the piezoelectric layer 33, the common electrode can be formed over the entire surface.

The order of the steps performed in this embodiment is not limited to the order shown in this embodiment. For example, the diaphragm laminating process may be performed after the wiring process, or the diaphragm laminating process may be performed after the wiring process, the anisotropic conductive layer forming process, and the piezoelectric layer forming process.

[Second Embodiment]
A second embodiment of the present invention will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the member same as 1st Embodiment, and the description is abbreviate | omitted. FIG. 8 is a cross-sectional view corresponding to FIG. The configuration of the second embodiment is different from that of the first embodiment in that the cross-sectional shape in the direction perpendicular to the surface of the piezoelectric layer 133 is a trapezoid that expands toward the diaphragm 30 side (lower side). According to this configuration, in the first electrode formation step described in the first embodiment, the side surface 133b of the piezoelectric layer 133 having the upper surface 133a protruding from the upper surface 53a of the anisotropic conductive layer 53 is inclined. Therefore, it becomes easy to continuously form the common electrode 34 with a step on the upper surface 53a of the anisotropic conductive layer 53, the upper surface 133a of the piezoelectric layer 133, and the side surface 133b. Since other configurations, operations, and effects are the same as those in the first embodiment, the description thereof is omitted.

[Third Embodiment]
A third embodiment of the present invention will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the member same as 1st Embodiment, and the description is abbreviate | omitted. FIG. 9 is a cross-sectional view corresponding to FIG. The configuration of the third embodiment is different from that of the first embodiment in that the piezoelectric layer 233 has a projecting portion 233c that projects in a direction parallel to the surface at a portion opposite to the diaphragm 30 (upper side in the drawing). It is a point. According to this configuration, when the piezoelectric layer 233 is heated and pressed in the compression step described in the first embodiment, the anisotropic conductive layer 53 is not easily raised and attached to the upper surface 233a of the piezoelectric layer 233. Since other configurations, operations, and effects are the same as those in the first embodiment, the description thereof is omitted.

[Fourth Embodiment]
A fourth embodiment of the present invention will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the member same as 1st Embodiment, and the description is abbreviate | omitted. FIG. 10 is a cross-sectional view corresponding to FIG. The configuration of the fourth embodiment is different from that of the first embodiment in that a water repellent film 54 is formed on a side surface 333b of the piezoelectric layer 333. The water-repellent film 54 is formed at the stage before transferring the piezoelectric layer 333 formed by firing and laser cutting the piezoelectric sheet to the anisotropic conductive layer 53 in the piezoelectric layer forming step described in the first embodiment. The side surface 333b is formed by sticking, coating, or the like. According to this configuration, when the piezoelectric layer 333 is heated and pressed in the compression step described in the first embodiment, the anisotropic conductive layer 53 that contacts the water-repellent film 54 on the side surface 333b of the piezoelectric layer 333 is repelled. As a result, the anisotropic conductive layer 53 rises on the upper surface 333a of the piezoelectric layer 333 and becomes difficult to adhere. Since other configurations, operations, and effects are the same as those in the first embodiment, the description thereof is omitted.

[Fifth Embodiment]
A fifth embodiment of the present invention will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the member same as 1st Embodiment, and the description is abbreviate | omitted. FIG. 11 is a cross-sectional view corresponding to FIG. The configuration of the fifth embodiment is different from that of the first embodiment in that an electrode (third electrode) 56 is formed between the piezoelectric layer 433 and the anisotropic conductive layer 53. The electrode 56 is formed in advance on the surface of the piezoelectric layer 433 in contact with the anisotropic conductive layer 53 before transferring the piezoelectric layer 433 to the anisotropic conductive layer 53 in the piezoelectric layer forming step described in the first embodiment. Keep it. The electrode 56 is formed by forming a conductive paste on the surface of the piezoelectric sheet by screen printing, sputtering, vapor deposition, or the like before laser cutting the piezoelectric sheet to a predetermined size. Alternatively, a conductive layer is formed on the entire surface of the piezoelectric sheet cut by a plating method, a sputtering method, or an evaporation method, and then a surface other than the surface in contact with the anisotropic conductive layer 53 by a laser, a mask, a resist method, or the like. The electrode 56 may be formed by removing the conductive layer. According to this configuration, an electric field can be reliably generated in the piezoelectric layer 433 through the electrode 56.

[Sixth Embodiment]
A sixth embodiment of the present invention will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the member same as 1st Embodiment, and the description is abbreviate | omitted. FIG. 12 is a cross-sectional view corresponding to FIG. The configuration of the sixth embodiment is different from that of the first embodiment in that the piezoelectric layer 533 is continuously formed on the anisotropic conductive layer 53 so as to include a region facing each of the plurality of pressure chambers 14. It is formed as one layer, and the common electrode 534 is formed on the surface of the piezoelectric layer 533 without any step, and the thickness in the region facing each of the plurality of individual electrodes 32 is larger than the thickness in the other region. It is a point that has been.

  The piezoelectric layer 533 is formed by firing a piezoelectric sheet having irregularities. The thickness of a region (a region where the thickness is large) facing each of the plurality of individual electrodes 32 of the piezoelectric layer 533 and the thickness of the other region (a region where the thickness is small) are that the region where the thickness is small is the anisotropic conductive layer 53. When contacted, the region having a large thickness is adjusted so that the anisotropic conductive layer 53 is sufficiently compressed. The common electrode 534 may be formed in the first electrode forming step described in the first embodiment, but in this embodiment, the uneven surface of the piezoelectric layer 533 is formed after the piezoelectric layer forming step. By adding a step of forming the common electrode 534 on the opposite surface, the first electrode formation step can be omitted. According to this configuration, when the piezoelectric layer 533 is pressed in the compression step described in the first embodiment, the anisotropic conductive layer 53 compressed by the region having a large thickness has conductivity, but the region having a small thickness. The anisotropic conductive layer 53 in contact with is not compressed and remains insulative. Therefore, as in the first embodiment, the common electrode provided with the piezoelectric layer 533 sandwiched between the individual electrode 32 to which the drive voltage is applied in the region having a large thickness, which is a region facing each of the plurality of individual electrodes 32. The piezoelectric layer 533 can be deformed by a potential difference between the electrode 534 and the wiring portion 35 formed on the insulating layer 31 and the common electrode 534 in a region having a small thickness that is not opposed to the individual electrode 32. The generation of parasitic capacitance between the wiring portion 35 and the common electrode 534 is prevented by the insulating anisotropic conductive layer 53 interposed therebetween. In addition, since the insulating anisotropic conductive layer 53 is interposed between the individual electrode 32 and the common electrode 534, the region where the thickness of the piezoelectric layer 533 is small is not deformed. Crosstalk generated in the piezoelectric layer 533 in the opposing region can also be reduced. In addition, since there is no step in the common electrode 534, it is easy to form the common electrode 534. Since other configurations, operations, and effects are the same as those in the first embodiment, the description thereof is omitted.

  In the sixth embodiment, the piezoelectric layer 533 may have a flat plate shape with no unevenness. In this case, in the piezoelectric layer 533, only the regions facing each of the plurality of pressure chambers 14 are heated and pressed, thereby compressing and compressing the anisotropic conductive layer 53 in the region facing each of the plurality of pressure chambers 14. Only the regions facing each of the plurality of pressure chambers 14 are made conductive and insulated without compressing the anisotropic conductive layer 53 in other regions, that is, by partially deforming the piezoelectric layer 533 into a concave shape. Can be the piezoelectric layer 533 that is deformed by the driving voltage.

[Seventh Embodiment]
A seventh embodiment of the present invention will be described with reference to FIG. In the diaphragm 630 in the present embodiment, a convex portion having a rectangular cross section is formed at a portion where the individual electrode 632 is formed. In the sixth embodiment, the convex portion is formed on the piezoelectric layer. However, the sixth embodiment is different from the sixth embodiment except that the convex portion is formed on the diaphragm 630 and the piezoelectric layer 633 is flat. It is the same as the form.

  Since the portion where the individual electrode 632 of the diaphragm 630 is formed is a convex portion, the anisotropic conductive layer 653 in the region in contact with the convex portion is sufficiently compressed and conductive in the compression process, The anisotropic conductive layer that comes into contact with the portion other than the convex portion of the plate 630 is not strongly compressed and therefore remains insulative. When the anisotropic conductive layer 653 is heated and pressed, only the portion of the anisotropic conductive layer 653 in contact with the convex portion is sufficiently compressed when the height of the convex portion formed on the diaphragm 630 is heated. It is the height which can have electroconductivity.

  In this embodiment, pressure is applied to the anisotropic conductive layer 653 by pressing the piezoelectric layer 633 from the upper surface 633 a of the piezoelectric layer 633 toward the insulating layer 631 using a pressing plate. By adding, the diaphragm 630 can be curved toward the piezoelectric layer side and the anisotropic conductive layer 653 can be pressed. At this time, pressure can be applied in the pressure chamber 14 by filling the pressure chamber 14 with gas or liquid and applying pressure thereto. Even in this case, the height of the convex portion formed on the diaphragm 630 is such that only the anisotropic conductive layer 653 in contact with the convex portion is sufficiently compressed when the anisotropic conductive layer 653 is pressed. It is the height which can be in the state and can have electroconductivity.

[Eighth Embodiment]
In the present embodiment, as shown in FIG. 14, the individual electrode 932 has a large thickness. This embodiment is the same as the sixth embodiment except that the individual electrode 932 has a large thickness and the piezoelectric layer 933 is flat.

  In the present embodiment, by increasing the thickness of the individual electrode 932, only the portion of the anisotropic conductive layer 953 that faces the individual electrode 932 can be pressed. In this case, the piezoelectric layer 933 and the diaphragm 930 do not need to be provided with projections as in the sixth and seventh embodiments, and the flat and continuous piezoelectric layer 933 and diaphragm 930 can be used. Can be reduced. In addition, since the piezoelectric layer 933 and the vibration plate 930 are flat, the process of forming the common electrode 934 and the insulating layer 931 is facilitated. The thickness of the individual electrode is usually about 0.8 μm, but by increasing the thickness to 1 μm or more, particularly 2 μm or more, the same effect as in the case of forming a convex portion on the piezoelectric layer or the diaphragm is obtained.

[Ninth Embodiment]
In the present embodiment, a liquid transfer device 700 shown in FIGS. 15 and 16 will be described. As shown in FIG. 15, the liquid transfer device 700 includes three liquid transfer units 700 a to 700 c having the same structure, and these three liquid transfer units 700 a to 700 c are connected in parallel via a common manifold 717. ing. The manifold 717 communicates with a liquid supply port 720 formed in the cavity plate 712.

  As shown in FIG. 16, the liquid transfer unit 700 b includes a flow path unit 702 and a piezoelectric actuator 703. The flow path unit 702 includes a cavity plate 710, a base plate 711, a manifold plate 712, and a second base plate 713. These four plates are all made of metal, and a piezoelectric actuator 703 is disposed on a flow path unit 702 formed by stacking these metal plate sets. The piezoelectric actuator 703 is made of metal and has a diaphragm 730 having an insulating layer 731 formed on one surface, an individual electrode 732 formed at a position corresponding to the pressure chamber 714, a wiring portion 735, a piezoelectric layer 733, an anisotropic conductive material. A common electrode 734 is provided over the top surface of the layer 753 and the anisotropic conductive layer 753.

  In the flow path unit 702, the cavity plate 710 has a rectangular hole that forms the pressure chamber 714, and the manifold plate 712 has a rectangular hole that forms the manifold 717. A communication hole 718 communicating with the pressure chamber 714 and the manifold 717 is formed in the base plate 711. The base plate 711, the manifold plate 712, and the second base plate 713 are formed with a discharge channel 719 that penetrates from the pressure chamber 714 to the lower surface of the second base plate 713.

  A method for manufacturing the liquid transfer device 700 having such a structure will be described below. First, the flow path units 702 are stacked in the order shown in FIG. 16, and a metal diaphragm 730 is further stacked on the upper surface. After the laminated metal plates are bonded by diffusion bonding, the insulating layer 731 is formed on the upper surface of the vibration plate 730 by the aerosol deposition method described in the first embodiment.

  An individual electrode 732 and a wiring portion 735 are formed on the surface of the insulating layer 731 by a screen printing method. The individual electrode 732 is positioned corresponding to the plurality of pressure chambers 714, and the wiring portion 735 electrically connects each individual electrode 732 and a driver IC (not shown).

  An anisotropic conductive layer 753 is formed on the insulating layer 731 on which the individual electrode 732 and the wiring portion 735 are formed, and a baked green sheet is formed to a predetermined size at a position corresponding to the individual electrode 732 thereon. A piezoelectric layer 733 formed by laser cutting is disposed. Next, the anisotropic conductive layer 753 is cured by heating while pressing the piezoelectric layer 733. When the anisotropic conductive layer 753 is cured, the pressed portion, that is, the portion sandwiched between the piezoelectric layer 733 and the individual electrode 732 has conductivity, and the other portions remain insulated. Become.

  Finally, the common electrode 734 and the wiring portion 741 are formed on the upper surfaces of the plurality of piezoelectric layers 733 and the anisotropic conductive layer 753 by a screen printing method. The common electrode 734 is formed so as to cover the entire plurality of piezoelectric layers 733. Since the common electrode 734 is electrically connected to a driver IC (not shown) through the wiring portion 741 and is grounded through the driver IC, the common electrode 734 is kept at the ground potential.

  The operation of the liquid transfer device 700 thus manufactured will be described below. Before the liquid transfer device 700 is operated, all the flow path units 702 of the three liquid transfer units 700a to 700c are filled with the liquid via the liquid supply port 720. Further, the liquid supply port 720 is connected to a liquid tank (not shown) and can always supply liquid to the flow path unit 702.

  An electric field is generated in the vertical direction of the piezoelectric layer 733 by applying a voltage to the individual electrode 732 in contact with the piezoelectric layer 733 via a driver IC (not shown). At this time, the piezoelectric layer 733 contracts in a direction orthogonal to the direction of the electric field (here, the left-right direction in FIG. 16). Here, since the insulating layer 731 and the diaphragm 730 below the piezoelectric layer 733 are fixed to the cavity plate 710, the piezoelectric layer 733 sandwiched between the electrodes 732 and 734 is located on the pressure chamber 714 side. Deform to be convex. Along with this deformation, the portion of the diaphragm 730 covering the pressure chamber 714 is also deformed so as to protrude toward the pressure chamber 714. As a result, the volume in the pressure chamber 714 decreases, so that the pressure of the liquid filled therein rises, and the liquid is discharged through the discharge passage 719 communicating with the pressure chamber.

  When the voltage application to the individual electrode 732 is stopped, the piezoelectric layer 733 and the diaphragm 730 return to their original shapes, and the internal pressure of the pressure chamber 714 decreases. At this time, since the diameter of the discharge channel 719 is very small compared to the communication hole 718, the conductance of the discharge channel 719 is smaller than that of the communication hole 718. Therefore, the liquid that flows into the pressure chamber 714 as the capacity of the pressure chamber 714 is restored is supplied from the manifold 717 through the communication hole 718. Further, since the liquid is constantly supplied to the manifold 717 through the liquid supply port 720, the manifold 717, the communication hole 718, and the pressure chamber 714 are always filled with the liquid. Therefore, the liquid transfer device 700 can transfer the liquid from the manifold 717 to the outside of the liquid transfer device 700 through the discharge channel 719.

  In the present embodiment, the individual electrode 732, the common electrode 734, and the wiring part 741 may be formed using a vapor deposition method or a sputtering method. The insulating layer 731 may be formed using a sol-gel method, a sputtering method, or a CVD method. Further, the voltage applied to the individual electrode 732 only needs to fluctuate with time, and parameters of the voltage waveform such as the voltage magnitude and frequency can be arbitrarily set.

[Tenth embodiment]
In the present embodiment, a liquid transfer device capable of individually transferring different types of liquids will be described.

  As shown in FIG. 17, the liquid transfer apparatus 800 of this embodiment includes a first transfer section 800A and a second transfer section 800B. The first and second transfer sections 800A and 800B have the same structure, and include a piezoelectric actuator 803 and a flow path unit 802, respectively.

  The flow path unit 802 includes a cavity plate 810 and a base plate 811. The cavity plate 810 has a rectangular hole forming the pressure chamber 814, and the base plate 811 has an inlet channel 812 and an outlet channel 813 communicating with the pressure chamber.

  A flexible inlet side tube 818 is attached to each of the inlet flow paths 812 of the first transfer section 800A and the second transfer section 800B, and a flexible outlet side tube 815 is attached to the outlet flow path 813. It is attached. The inlet side tubes 818 of the transfer sections 800A and 800B are connected to the liquid tanks 850A and 850B, respectively, and the outlet side tubes 815 are connected to a discharge destination (not shown). Further, check valves 816 and 817 are attached to the inlet side tube 818 and the outlet side tube 815, respectively.

  The piezoelectric actuator 803 provided on the upper part of the flow path unit 802 has the same structure as that of the ninth embodiment, and is manufactured using the anisotropic conductive layer 853 by the same method.

  When operating the liquid transfer apparatus 800 of this embodiment, first, the liquid to be transferred is supplied to the liquid tanks 850A and 850B. Next, a pulsed voltage is continuously supplied to the individual electrode 832 through a driver IC (not shown). As described in the eighth embodiment, the pressure in the pressure chamber 814 can be varied by applying a voltage that varies with time to the individual electrode 832. As a result, the pressure chamber 814 serves as a kind of pump, so that the liquid in the liquid tanks 850A and 850B can be transferred toward the outlet channel 813. At this time, since the inlet side tube 818 and the outlet side tube 815 are each provided with the check valves 816 and 817, there is no fear that the liquid flows backward, and the liquid transfer device 800 can be operated stably.

  The liquid transfer device 800 of this embodiment has two independent transfer sections 800A and 800B, which are connected to the liquid tanks 850A and B, respectively. Accordingly, two different types of liquids, for example, liquids having different colors and compositions, can be selectively transferred by system. The liquid tanks 850A and 850B, the check valves 816 and 817, the inlet side tube 818, and the outlet side tube 815 may use facilities on the site where the liquid transfer device 800 is used. Therefore, the liquid tanks 850A and 850B, the check valves 816 and 817, the inlet side tube 818, and the outlet side tube 815 are not necessarily required for the liquid transfer device 800.

  The liquid transfer device described in the ninth embodiment and the tenth embodiment has a plurality of transfer sections or transfer units, but the number is not limited to two or three, and more than that. Alternatively, they may be connected in series and / or in parallel inside the liquid transfer device.

  The liquid transfer device of the present invention can transfer a liquid selectively with a simple structure through a plurality of liquid discharge ports without causing crosstalk between adjacent pressure chambers. Further, the individual electrodes and the wiring part are formed on an insulating layer provided on the diaphragm, and since there are no movable parts, there is little risk of disconnection. Further, since the individual electrodes and the wiring portion are formed by a screen printing method, a vapor deposition method, or a sputtering method, the wiring interval and the electrode interval can be formed very densely. Furthermore, since the individual electrodes and the wiring part are covered with an anisotropic conductive layer and cannot be directly touched, the reliability of electrical connection is high, and the anisotropy of the part not in contact with the individual electrode Since the conductive layer is an insulator, parasitic capacitance between individual electrodes and between wires is suppressed, and crosstalk does not occur.

  The liquid transfer device of the present invention can be used as a unit module for circulating cooling water through a cooling water passage formed in an electric circuit board. In addition, since it can be used as an extremely small pump, for example, it is attached to the tip of an endoscope to apply a plurality of liquid medicines to an affected part in the body, or a plurality of kinds of medicines in a predetermined amount and a predetermined amount in a patient's body It can be used as a micro pump for supplying with a time schedule of

  So far, the present invention has been described based on preferred embodiments. However, the present invention is not limited to these embodiments, and the present invention can be modified without departing from the scope of the present invention. For example, the individual electrode 32 is not necessarily provided, and the individual electrode 32 may not be provided. In this case, a region where a plurality of conductive particles sandwiched between the insulating layer 31 and the piezoelectric layer 33 and crushed in the anisotropic conductive layer 53 compressed by the piezoelectric layer 33 is opposed to the piezoelectric layer 33. If it has conductivity throughout, the anisotropic conductive layer 53 and a compressed region facing the piezoelectric layer 33 can be used instead of the individual electrode 32. At this time, the plurality of wiring portions 35 have one end portion (the end portion opposite to the terminal portion 36) overlapping the corresponding pressure chamber 14 and the anisotropic conductive layer 53 serving as a substitute for the individual electrode 32. It must be formed to occupy a position where it can be connected to the compressed area.

  In each embodiment, the material of the plate material constituting the flow path unit and the diaphragm is not limited to stainless steel, and may be another metal plate such as copper or aluminum, for example, a non-metallic plate material such as synthetic resin. It may be. In each embodiment, the pressure is applied to the anisotropic conductive layer from a specific direction. However, the pressure may be applied from the piezoelectric layer side toward the pressure chamber side. Conversely, for example, the pressure inside the pressure chamber is increased. Accordingly, the pressure may be pressed from the pressure chamber side toward the piezoelectric layer side.

It is a schematic diagram of a serial printer. It is a perspective view of an inkjet head. FIG. 3 is a schematic plan view of the right half of the inkjet head of FIG. 2. It is the IV-IV sectional view taken on the line of FIG. FIG. 5 is a cross-sectional view taken along line VV in FIG. 3, and is a cross-sectional view of the ink jet head according to the first embodiment of the present invention. FIG. 4 is a cross-sectional view taken along line VI-VI in FIG. 3, and is a cross-sectional view of the inkjet head according to the first embodiment of the present invention. FIG. 7 is an enlarged view of a main part A of FIG. 6, which is a cross-sectional view illustrating the manufacturing process of the inkjet head, arranged from top to bottom in the order of processes. It is sectional drawing corresponding to FIG. 6, Comprising: It is sectional drawing of the inkjet head which concerns on 2nd Embodiment of this invention. It is sectional drawing corresponding to FIG. 6, Comprising: It is sectional drawing of the inkjet head which concerns on 3rd Embodiment of this invention. It is sectional drawing corresponding to FIG. 6, Comprising: It is sectional drawing of the inkjet head which concerns on 4th Embodiment of this invention. It is sectional drawing corresponding to FIG. 6, Comprising: It is sectional drawing of the inkjet head which concerns on 5th Embodiment of this invention. FIG. 7 is a cross-sectional view corresponding to FIG. 6, and is a cross-sectional view of an inkjet head according to a sixth embodiment of the present invention. FIG. 9 is a cross-sectional view corresponding to FIG. 6, and is a cross-sectional view of an inkjet head according to a seventh embodiment of the present invention. FIG. 10 is a cross-sectional view corresponding to FIG. 6, and is a cross-sectional view of an inkjet head according to an eighth embodiment of the present invention. It is a top view of the liquid transfer apparatus which concerns on 9th Embodiment of this invention. FIG. 15 is a cross-sectional view taken along line XVI-XVI in FIG. 14, and is a cross-sectional view of a liquid transfer device according to a ninth embodiment of the present invention. It is sectional drawing of the liquid transfer apparatus which concerns on 10th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Inkjet head 2 Flow path unit 3 Piezoelectric actuator 4 Paper 5 Carriage 6 Paper feed roller 10 Cavity plate 11 Base plate 12 Manifold plate 13 Nozzle plate 14 Pressure chamber 15, 16 Communication hole 17 Manifold 18 Ink supply port 19 Communication hole 20 Nozzle 30 Vibration Plate 31 Insulating layer 32 Individual electrode (second electrode)
33 Piezoelectric layer 33a Upper surface 33b Side surface 33c Overhang portion 34 Common electrode (first electrode)
35 Wiring part 36 Terminal part 37 Driver IC (driving device)
37a Output terminal 37b Input terminal 38, 39 Bump 40 Connection terminal 41 Wiring part 42 Terminal part 43 Reinforcement part 50 Serial printer 53 Anisotropic conductive layer 53a Upper surface 54 Water repellent film 55 Press plate 56 Electrode (third electrode)


Claims (22)

  1. A liquid transfer device comprising:
    A flow path unit in which a plurality of pressure chambers communicating with a liquid discharge port are arranged along a plane;
    A piezoelectric actuator arranged on one surface of the flow path unit to change the volume of the pressure chamber;
    The piezoelectric actuator is
    A diaphragm having insulating properties on at least one surface;
    A plurality of wiring portions extending from positions facing each of the plurality of pressure chambers on the one surface of the diaphragm;
    The diaphragm is continuously formed over the plurality of pressure chambers on the one surface side, and is compressed in a plurality of regions opposed to the plurality of pressure chambers, and has conductivity. An anisotropic conductive layer that does not have conductivity in a region other than
    A piezoelectric layer formed on the surface of the anisotropic conductive layer opposite to the diaphragm;
    A liquid transfer device comprising: a first electrode formed continuously over the plurality of pressure chambers on a surface of the piezoelectric layer opposite to the anisotropic conductive layer.
  2.   The liquid transfer device according to claim 1, wherein the liquid is ink, the discharge port is a nozzle that discharges the ink, and the liquid transfer device is an inkjet head.
  3.   3. The liquid transfer according to claim 2, wherein a plurality of second electrodes respectively connected to the plurality of wiring portions are formed at positions facing the plurality of pressure chambers on the one surface of the diaphragm. device.
  4.   The liquid transfer device according to claim 2, wherein a plurality of third electrodes are respectively formed between the piezoelectric layer and the anisotropic conductive layer in the plurality of regions.
  5.   A plurality of connections in which the driving device that supplies a driving voltage to a portion of the anisotropically conductive layer that is compressed and conductive is connected to the ends of the plurality of wiring portions on the one surface of the diaphragm The liquid transfer device according to claim 2, wherein each terminal is formed.
  6.   The liquid transfer device according to claim 2, wherein the piezoelectric layer is formed only in the plurality of regions.
  7.   The liquid transfer device according to claim 2, wherein the piezoelectric layer is thicker in the plurality of regions than in other regions.
  8.   The liquid transfer device according to claim 2, wherein the vibration plate has a thickness larger in the plurality of regions than in other regions.
  9.   The liquid transfer device according to claim 2, wherein the piezoelectric layer has a trapezoidal shape in which a cross-sectional shape in a direction perpendicular to the surface of the piezoelectric layer is widened toward the diaphragm side.
  10.   The liquid transfer device according to claim 2, wherein the piezoelectric layer has a projecting portion that projects in a direction parallel to the surface of the piezoelectric layer at a portion opposite to the diaphragm.
  11.   An inkjet printer comprising the liquid transfer device according to claim 2.
  12.   The liquid transfer device according to claim 1, further comprising a valve that regulates a flow of the liquid flowing through the flow path unit.
  13. A liquid comprising a flow path unit in which a plurality of pressure chambers communicating with a liquid discharge port are arranged along a plane, and a piezoelectric actuator arranged on one surface of the flow path unit to change the volume of the pressure chamber. A method for manufacturing a transfer device, comprising:
    A diaphragm laminating step of disposing a diaphragm having insulation on at least one surface on the one surface of the flow path unit;
    Forming a plurality of wiring portions extending from positions facing the plurality of pressure chambers on the one surface of the diaphragm;
    An anisotropic conductive layer forming step of continuously forming an anisotropic conductive layer over the plurality of pressure chambers on the one surface side of the diaphragm;
    A piezoelectric layer forming step of forming a piezoelectric layer on a surface of the anisotropic conductive layer opposite to the diaphragm;
    The plurality of regions of the piezoelectric layer respectively opposed to the plurality of pressure chambers are pressed against the diaphragm, and the plurality of regions of the anisotropic conductive layer respectively opposed to the plurality of pressure chambers are compressed. A compression process;
    A first electrode forming step of continuously forming a first electrode across the plurality of pressure chambers on a surface of the piezoelectric layer opposite to the anisotropic conductive layer. Method.
  14.   The liquid is ink, the discharge port is a nozzle that discharges the ink, and the liquid transfer device is an ink jet head, and a plurality of pressure chambers facing the plurality of pressure chambers of the piezoelectric layer in the compression step, respectively. The method of manufacturing a liquid transfer device according to claim 13, wherein the region is pressed toward the diaphragm.
  15.   15. In the wiring step, a plurality of second electrodes respectively connected to the plurality of wiring portions are formed on the one surface of the diaphragm at positions facing the plurality of pressure chambers, respectively. A method for producing the liquid transfer device as described.
  16.   In the wiring step, a driving device that supplies a driving voltage to a portion of the anisotropic conductive layer that is compressed and conductive is connected to an end of the plurality of wiring portions on the one surface of the diaphragm. The method for manufacturing a liquid transfer device according to claim 14, wherein a plurality of connection terminals are formed.
  17.   The method for manufacturing a liquid transfer device according to claim 14, wherein in the piezoelectric layer forming step, the piezoelectric layer is formed only in a region facing the pressure chamber.
  18.   18. The liquid transfer according to claim 17, wherein in the compression step, the piezoelectric layer formed in a region facing each of the plurality of pressure chambers presses the piezoelectric layer while maintaining a state of protruding from the anisotropic conductive layer. Device manufacturing method.
  19.   The method for manufacturing a liquid transfer device according to claim 18, wherein a cross-sectional shape in a direction perpendicular to the surface of the piezoelectric layer is a trapezoid spreading toward the diaphragm side.
  20.   The method of manufacturing a liquid transfer device according to claim 18, wherein the piezoelectric layer has an overhanging portion that protrudes in a direction parallel to the surface at a portion opposite to the vibration plate.
  21.   The method for manufacturing a liquid transfer device according to claim 18, wherein a liquid repellent film is formed on a side surface of the piezoelectric layer in the piezoelectric layer forming step.
  22. The method for manufacturing a liquid transfer device according to claim 14, wherein in the vibration plate stacking step, a vibration plate having a thickness of the plurality of regions larger than that of the other regions is used.

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008055900A (en) * 2006-08-01 2008-03-13 Brother Ind Ltd Liquid droplet ejection device and manufacturing method of liquid droplet ejection device
JP2012228816A (en) * 2011-04-26 2012-11-22 Kyocera Corp Piezoelectric actuator, and liquid ejection head using the same, and recording apparatus

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08230182A (en) * 1995-02-28 1996-09-10 Rohm Co Ltd Ink jet print head and manufacture thereof
JP2000117978A (en) * 1998-10-20 2000-04-25 Sony Corp Printer and manufacture thereof
JP2000158645A (en) * 1998-11-25 2000-06-13 Matsushita Electric Ind Co Ltd Ink jet head
JP2002234158A (en) * 1992-03-18 2002-08-20 Seiko Epson Corp Ink jet recording head
JP2003145758A (en) * 2001-11-19 2003-05-21 Brother Ind Ltd Ink jet head and method for joining its constituting member
JP2003145778A (en) * 1993-12-24 2003-05-21 Seiko Epson Corp Lamination type ink-jet recording head
JP2003191466A (en) * 2001-12-26 2003-07-08 Kyocera Corp Ink-jet recording head
JP2004066496A (en) * 2002-08-01 2004-03-04 Seiko Epson Corp Liquid ejection head and liquid ejector

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002234158A (en) * 1992-03-18 2002-08-20 Seiko Epson Corp Ink jet recording head
JP2003145778A (en) * 1993-12-24 2003-05-21 Seiko Epson Corp Lamination type ink-jet recording head
JPH08230182A (en) * 1995-02-28 1996-09-10 Rohm Co Ltd Ink jet print head and manufacture thereof
JP2000117978A (en) * 1998-10-20 2000-04-25 Sony Corp Printer and manufacture thereof
JP2000158645A (en) * 1998-11-25 2000-06-13 Matsushita Electric Ind Co Ltd Ink jet head
JP2003145758A (en) * 2001-11-19 2003-05-21 Brother Ind Ltd Ink jet head and method for joining its constituting member
JP2003191466A (en) * 2001-12-26 2003-07-08 Kyocera Corp Ink-jet recording head
JP2004066496A (en) * 2002-08-01 2004-03-04 Seiko Epson Corp Liquid ejection head and liquid ejector

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008055900A (en) * 2006-08-01 2008-03-13 Brother Ind Ltd Liquid droplet ejection device and manufacturing method of liquid droplet ejection device
JP2012228816A (en) * 2011-04-26 2012-11-22 Kyocera Corp Piezoelectric actuator, and liquid ejection head using the same, and recording apparatus

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