JP2006093216A - 半導体装置 - Google Patents
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- JP2006093216A JP2006093216A JP2004273509A JP2004273509A JP2006093216A JP 2006093216 A JP2006093216 A JP 2006093216A JP 2004273509 A JP2004273509 A JP 2004273509A JP 2004273509 A JP2004273509 A JP 2004273509A JP 2006093216 A JP2006093216 A JP 2006093216A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
- H01L29/7853—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET the body having a non-rectangular crossection
- H01L29/7854—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET the body having a non-rectangular crossection with rounded corners
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42384—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42384—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
- H01L29/42392—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor fully surrounding the channel, e.g. gate-all-around
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
- H01L29/66795—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
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- Thin Film Transistor (AREA)
Abstract
【解決手段】 チャネルの形成される領域が稜を持つ電界効果トランジスターに於いて、稜の近傍に於いてはゲート絶縁膜が他の領域よりも厚く形成されている、ないしゲート絶縁膜は積層であり、積層を形成する層の内で誘電率の低い層が稜の近傍に於いて他の領域よりも厚く形成されている。それ故、チャネル領域の電位に対するゲート電極の制御性は良好に保たれたままでゲート絶縁膜中に生ずる電場強度の緩和が図られ、その結果として高電流駆動能力且つ高信頼性の高性能微細半導体装置を実現する。
【選択図】 図22
Description
図22は本発明のトライゲート型電界効果トランジスターの模式図である。本実施形態ではNチャネル電界効果トランジスターを例に取って示す。不純物の導電型を逆にすればPャネル電界効果トランジスターの場合にもまったく同様であり、また光蝕刻法等の方法を用いて基板内の特定の領域にのみ不純物を注入する等の方法を用いれば相補型電界効果トランジスターの場合も全く同様の効果が得られる。
36に示した従来構造の半導体装置に比べてゲート絶縁膜中の電場が緩和される。その結果として、十分な高速動作が可能で且つ高い信頼性を有する高性能の微細半導体装置が実現される。
なお、本実施形態ないし変形例に於いては単一のトランジスターのみの構造を示したが、ここに示した実施形態は単一のトランジスターの場合に限定されるものではなく、かつ同様の効果が得られる事は無論である。
次に本発明の電界効果トランジスターの他の製造方法を説明する。
次に本発明の電界効果トランジスターの更に他の製造方法を説明する。
次に本発明の電界効果トランジスターの更に他の製造方法を説明する。
2…チャネルの形成される半導体領域
3…ゲート絶縁膜
4…ゲート電極
5…ソース・ドレイン領域
6…HfO2(二酸化ハフニウム)膜[金属酸化物よりなるゲート絶縁膜]
7…酸化シリコン膜
8…支持基板
9…埋め込み絶縁膜
10…SOI層
11…半導体基板
12…HfO2(二酸化ハフニウム)膜
13…酸化シリコン膜
14…シリコンを過剰に含むハフニウムシリケート膜
15…酸化シリコン膜
16…酸化シリコン膜
17…酸素を過剰に含むハフニウムシリケート膜
18…酸化シリコン膜
Claims (6)
- 半導体層と、前記半導体層上に形成され且つ前記半導体層と少なくとも二つの面で接する絶縁体層と、前記絶縁体層を介して前記半導体層と対向して形成された導電体層と、を有し、且つ前記半導体層と前記絶縁体層との接する前記少なくとも二つの面の境界線の近傍に於ける前記絶縁体層の厚さが、前記境界線近傍以外の領域に於ける厚さよりも厚い電界効果トランジスターを備えることを特徴とする半導体装置。
- 前記半導体層中に、前記導電体と一部が重なり且つ前記導電体層を挟む様に形成された二つの金属領域を有する事を特徴とする請求項1に記載の半導体装置。
- 前記境界線の近傍に於いては前記絶縁体層が少なくとも二層の積層からなり、且つ積層を成す層の内で最も誘電率の低い層の前記境界線の近傍に於ける厚さが、前記境界線の近傍以外の領域に於ける厚さよりも厚い事を特徴とする請求項1ないし2に記載の半導体装置。
- 前記誘電率の最も低い層よりも前記半導体層に近いところに、前記積層絶縁体層を成す層の内で最も誘電率の高い層が存在する事を特徴とする請求項3に記載の半導体装置。
- 前記境界線の近傍に於いては前記絶縁体層が少なくとも三層の積層からなり、且つ積層を成す層の内で最も誘電率の低い層の前記境界線の近傍に於ける厚さが、前記境界線の近傍以外の領域に於ける厚さよりも厚く、且つ前記積層絶縁体層を成す層の内で最も誘電率の低い層よりも前記半導体層に近いところにも前記導電体層に近いところにも、前記積層絶縁体層を成す層の内で前記最も誘電率の低い層以外の層が存在する事を特徴とする請求項1ないし2に記載の半導体装置。
- 前記絶縁体層が金属を含む事を特徴とする請求項1ないし5いずれかに記載の半導体装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2004273509A JP2006093216A (ja) | 2004-09-21 | 2004-09-21 | 半導体装置 |
US11/144,697 US7465998B2 (en) | 2004-09-21 | 2005-06-06 | Semiconductor device |
US12/289,145 US7816242B2 (en) | 2004-09-21 | 2008-10-21 | Semiconductor device and method of manufacturing the same |
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JP2004273509A JP2006093216A (ja) | 2004-09-21 | 2004-09-21 | 半導体装置 |
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JP2006093216A true JP2006093216A (ja) | 2006-04-06 |
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JP2004273509A Pending JP2006093216A (ja) | 2004-09-21 | 2004-09-21 | 半導体装置 |
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US (2) | US7465998B2 (ja) |
JP (1) | JP2006093216A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014513416A (ja) * | 2011-03-31 | 2014-05-29 | 東京エレクトロン株式会社 | 固相拡散により極浅ドーピング領域を形成する方法 |
US11670675B2 (en) | 2020-12-04 | 2023-06-06 | United Semiconductor Japan Co., Ltd. | Semiconductor device |
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DE102005039365B4 (de) * | 2005-08-19 | 2022-02-10 | Infineon Technologies Ag | Gate-gesteuertes Fin-Widerstandselement, welches als pinch - resistor arbeitet, zur Verwendung als ESD-Schutzelement in einem elektrischen Schaltkreis und Einrichtung zum Schutz vor elektrostatischen Entladungen in einem elektrischen Schaltkreis |
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-
2004
- 2004-09-21 JP JP2004273509A patent/JP2006093216A/ja active Pending
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2005
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JP2014513416A (ja) * | 2011-03-31 | 2014-05-29 | 東京エレクトロン株式会社 | 固相拡散により極浅ドーピング領域を形成する方法 |
US11670675B2 (en) | 2020-12-04 | 2023-06-06 | United Semiconductor Japan Co., Ltd. | Semiconductor device |
Also Published As
Publication number | Publication date |
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US7465998B2 (en) | 2008-12-16 |
US20090061610A1 (en) | 2009-03-05 |
US20060063319A1 (en) | 2006-03-23 |
US7816242B2 (en) | 2010-10-19 |
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