JP2006078101A - Initiator using thin-film bridge - Google Patents

Initiator using thin-film bridge Download PDF

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JP2006078101A
JP2006078101A JP2004263575A JP2004263575A JP2006078101A JP 2006078101 A JP2006078101 A JP 2006078101A JP 2004263575 A JP2004263575 A JP 2004263575A JP 2004263575 A JP2004263575 A JP 2004263575A JP 2006078101 A JP2006078101 A JP 2006078101A
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thin film
electrode
embolus
film bridge
wire
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JP2004263575A
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JP4527478B2 (en
Inventor
Makoto Iwasaki
Hirotsuyo Kuraki
Shigeru Maeda
Hirochika Taguchi
繁 前田
誠 岩崎
大剛 椋木
博規 田口
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Nippon Kayaku Co Ltd
日本化薬株式会社
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Abstract

An initiator using a thin film bridge capable of efficiently igniting explosives without being affected by a use environment or the like.
SOLUTION: It is composed of an embolus 4 and a thin film bridge 5, and an electric current is supplied from the electrode pins 2 and 3 to the thin film bridge 5 through the electrode pad 21, and the thin film bridge 5 is operated to ignite explosives 6 and 7. The electrode pins 2 and 3 are the surfaces of the embolus 4 so that the electrode pads 21 on the surface of the thin film bridge 5 attached to the embolus 4 and the end surfaces of the electrode pins 2 and 3 are substantially the same surface. The electrode pad 21 and the electrode pins 2 and 3 are connected to each other by wire bonding, and one of the electrode pads 21 is connected to the header metal portion 24 of the embolus 4 by wire bonding. To do.
[Selection] Figure 1

Description

  The present invention relates to an initiator used for ignition of explosives.

  In this type of initiator, a thin-film bridge formed on a substrate of ceramics or the like is fixed to the embolus with epoxy resin, polyimide, ceramics, or the like. And this bridge | bridging has what is electrically joined with the electrode pin provided in the embolus with solder, wire bonding, a conductive epoxy resin, etc. (for example, refer patent document 1).

  Among these, the solder contains lead that leads to environmental pollution. Moreover, it is necessary to melt the solder at a high temperature. However, at that time, the bridge is exposed to a high temperature, and may be damaged by heat and may not operate normally.

  In addition, when bonded with conductive epoxy resin, when used as an initiator for automobile gas generators, etc., it will be exposed to high temperature heat generated under the hot summer heat for a long time. Resistance value may change. Further, even at the beginning of assembly, the resistance value is easily influenced by the state of the electrode surface, and there is a problem that the initial resistance value varies greatly.

Moreover, at the time of wire bonding, the problems of solder and conductive epoxy resin can be solved. In this case, there is a risk of disconnection if a pressing force is applied during loading of explosives.
US Pat. No. 6,324,979B1

  An object of this invention is to provide the initiator using the thin film bridge which can ignite an explosive efficiently, without being influenced by the use environment etc.

The initiator of the present invention for solving the above-mentioned problems is composed of an embolus having at least two or more electrode pins insulated from each other, and a thin film bridge that is embolized and has two electrode pads on the surface. An initiator that supplies current from the pin to the thin film bridge through the electrode pad and activates the thin film bridge to ignite the explosive,
The electrode pin protrudes from the surface of the embolus by a predetermined height so that the electrode pad on the surface of the thin film bridge attached to the embolus and the end surface of the electrode pin are substantially flush with each other. It is connected by bonding, and one of the electrode pads is further connected by wire bonding to the header metal part of the embolus.

  Since the electrode pin protrudes from the surface of the embolus by a predetermined height so that the electrode pad on the surface of the thin film bridge attached to the embolus and the end surface of the electrode pin are substantially flush with each other, it is connected at the end surface of the wire Instead of so-called standing, it is possible to use so-called lateral placement in which the wire is connected using the peripheral surface of the wire while lying down. As a result, the bonding wire can be connected with a low loop height. For this reason, even if it is a case where the pressure which presses a wire part acts, it becomes possible to prevent disconnection of a wire. Since at least one of the electrode pads is connected to the header metal portion of the embolus by wire bonding, malfunction of the thin film bridge due to static electricity or the like can be prevented.

  In the initiator of the present invention, the material of the electrode pad surface of the thin film bridge is gold, aluminum, nickel, or titanium in the above-described invention.

  Since the material of the electrode pad surface of the thin film bridge is gold, aluminum, nickel, or titanium, the current is reliably supplied to the thin film bridge by being connected to the electrode pin by wire bonding.

  In the initiator of the present invention, the wire used for wire bonding is gold or aluminum and has a wire diameter of 10 μm to 500 μm.

  Since the wire used for wire bonding is gold or aluminum, it is possible to reliably supply current from the electrode pin to the thin film bridge. Further, by setting the wire diameter to 10 μm to 500 μm, preferably 20 μm to 500 μm, and more preferably 100 μm to 500 μm, it becomes possible to more reliably supply current from the electrode pin to the thin film bridge.

  In the initiator of the present invention, the loop height of the wire bonding wire is 1 mm or less in the above-described invention.

  Since the wire loop height is 1 mm or less, preferably 0.5 mm or less, more preferably 0.2 mm or less, the wire is prevented from being disconnected even when pressing force is applied to the wire when explosives are loaded. can do.

  In addition, the initiator of the present invention has a predetermined height of more than 0.2 mm and 1 mm or less in the above-described invention.

  Since the predetermined height is more than 0.2 mm and 1 mm or less, the electrode pad on the surface of the thin film bridge attached to the embolus and the end surface of the electrode pin protruding from the surface of the embolus should be surely flush with each other. Can do.

  Hereinafter, an example of an embodiment of an initiator according to the present invention will be described with reference to the drawings.

  In FIG. 1, an initiator 1 according to the present embodiment example has an embolus 4 having a pair of mutually insulated electrode pins 2 and 3, and is attached to the embolus 4 and has two electrode pads 2 and 3 on the surface. It consists of a thin film bridge 5. Then, current is supplied from the electrode pins 2 and 3 to the thin film bridge 5 through the electrode pads 2 and 3 to activate the thin film bridge 5 to ignite the explosives 6 and 7 loaded in the first tube body 9. It has a structure to do.

  The embolus 4 is made of a metal such as stainless steel, aluminum, copper, or iron. In addition, the pair of electrode pins 2 and 3 extending from the embolus 4 is formed of a metal such as stainless steel, aluminum, copper, and iron, as with the embolus 4. The electrode pins 2 and 3 are covered with an insulator 11 such as glass or resin in the embolus 4 and insulated from each other. Moreover, the end surfaces of these electrode pins 2 and 3 are arranged so as to protrude from the surface 15 of the embolus 4 by a predetermined height (h) (see FIG. 3).

  FIG. 2 is an enlarged plan view of a portion where the thin film bridge 5 is attached to the surface 15 of the embolus 4 and connected to the electrode pins 2 and 3 by the wire 8. 3 is a diagram showing a cross section taken along line AA in FIG.

  The thin film bridge 5 is attached to the surface 15 of the embolus 4 as shown in FIGS. The electrode pins 2 and 3 have a predetermined height (h) so that the electrode pads 21 on the surface of the thin film bridge 5 attached to the embolus 4 and the surfaces of the electrode pins 2 and 3 are substantially flush with each other. Projects from the surface 15 of the embolus 4. The predetermined height (h) is usually more than 0.2 mm and less than 1 mm, preferably more than 0.2 mm and less than 0.75 mm, more preferably more than 0.2 mm and less than 0.5 mm. The loop height can be lowered. As shown in FIG. 3, so-called lateral attachment in which the wire 8 is laid down and connected using the peripheral surface of the wire 8 can be easily performed. Thus, since the loop height of the wire is usually 1 mm or less, preferably 0.5 mm or less, more preferably 0.2 mm or less, even when pressing pressure is applied to the wire 8 during loading of gunpowder or the like. The wire 8 can be prevented from being disconnected, and the electrode pins 2 and 3 and the thin film bridge 5 can be reliably connected. The wire 8 is preferably gold or aluminum. This makes it possible to reliably supply current from the electrode pins 2 and 3 to the thin film bridge 5. The wire 8 has a wire diameter of usually 10 μm to 500 μm, preferably 20 μm to 500 μm, and more preferably 100 μm to 500 μm, so that the current can be supplied from the electrode pins 2 and 3 to the thin film bridge 5 more reliably. It becomes.

  As shown in FIG. 2, the wire 8 that joins the thin film bridge 5 and the electrode pins 2 and 3 is connected so as to span the surface of the electrode pad 21 of the thin film bridge 5. Further, in this case, grounding can be easily performed by connecting the wire 8 from one electrode pad 21 to the header metal portion 24 of the embolus 4. In addition, the electrode pad 21 wire-bonded to the electrode pins 2 and 3 by the wire 8 is a laminate 23 in which a reactive metal, such as titanium, and a reactive insulator, such as boron, are alternately laminated. It is made of gold, aluminum, nickel, titanium or the like formed on the surface by thermal evaporation or the like.

The thin film bridge 5 can be any of a heating resistor, a reactive bridge using a reactive substance, a shock bridge, and the like. These are formed on a ceramic substrate such as an Si substrate or Al 2 O 3 by a known technology such as a LIGA (Lithographie Galvano-formung, Abfprmung (fine processing technology using X-ray)) process or sputtering. In particular, the reactive bridge is preferable in that it operates stably with small energy.

  As shown in FIG. 3, the reactive thin film bridge 5 shown in the present embodiment includes a reactive metal formed on the surface of the substrate 22 such as titanium and a reactive insulator such as boron. It is comprised by the bridge | bridging by the laminated body 23 laminated | stacked alternately, and the electrode pad 21 formed with electroconductive materials, such as a metal which covers the surface. 2 and 3, the electrode pad 21 is located on the stacked body 23.

  Examples of the reactive metal used for the laminate 23 include aluminum, magnesium, zirconium and the like in addition to titanium. In addition to boron, the reaction insulator includes calcium, manganese, silicon, and the like. When the thin film bridge 5 having such a laminate 23 is activated by a current flowing through the bridge portion, the reactive metal reacts with the reactive insulator and is released as hot plasma. And this plasma can ignite the loaded explosive efficiently.

  As shown in FIG. 1, the initiator 1 according to the present embodiment is first loaded with explosives 6 and 7 in the first tubular body 9, and then the thin film bridge 5 is attached to the surface of the embolus 4, and the electrode pin 2 3 and the wire 8 are connected by wire bonding, and then fitted to the first tubular body 9. At this time, even when the embolus 4 is pressed against the explosive 6 side, as described above, the thin film bridge 5 is connected to the electrode pins 2 and 3 by so-called lateral bonding. There is no risk of disconnection. In this way, after the embolus 4 is fitted to the first tubular body 9, the first tubular body 9 is inserted into the second tubular body 10 and insert-molded into the holder 20. Thus, it can be suitably used for an igniter for a gas generator used for various safety devices such as automobiles.

  In the initiator 1 configured as described above, when a current is supplied to the electrode pins 2 and 3, the thin film bridge 5 is activated, and the gunpowder 6 and 7 can be efficiently ignited in units of several μ seconds. Become.

  Note that the initiator according to the present invention is not limited to the above-described embodiment, and the electrode pins 2 and 3 and the thin film bridge 5 can be reliably connected by wire bonding. It is also possible to connect an ASIC (Application Specific Integrated Circuit) or the like between any one of 3 and the thin film bridge 5 and similarly connect them by wire bonding.

  The initiator of the present invention is configured as described above, and the electrode pin is attached to the surface of the embolus so that the electrode pad on the surface of the thin film bridge attached to the embolus and the end surface of the electrode pin are substantially flush with each other. The electrode pins and the thin film bridges can be connected by wire bonding, which is so-called lateral attachment, by arranging them so as to protrude by a predetermined height. For this reason, it is possible to suppress the occurrence of disconnection of the wire, that is, disconnection of the conduction between the thin film bridge and the electrode pin, even in the case of wire bonding or when pressing pressure or the like acts on the wire part. Become. Moreover, it becomes possible to ignite explosives efficiently.

It is sectional drawing which shows an example of embodiment of the initiator which concerns on this invention. It is a figure which shows the principal part plane which expanded a part of FIG. It is a figure which shows the A-A 'line cross section in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Initiator 2, 3 Electrode pin 4 Embolization 5 Thin film bridge 6, 7 Gunpowder 8 Wire 9 1st pipe body 10 2nd pipe body 11 Insulator 15 Surface 21 Electrode pad 22 Board | substrate 23 Laminated body 24 Header metal part

Claims (5)

  1. An embolus (4) having at least two or more mutually insulated electrode pins (2, 3), and a thin film bridge (5) attached to the embolus (4) and having two electrode pads (21) on the surface An initiator configured to supply current from the electrode pins (2, 3) to the thin film bridge (5) via the electrode pad (21) and to activate the thin film bridge (5) to ignite the explosives (6, 7). There,
    The electrode pins (2, 3) are arranged so that the electrode pads (21) on the surface of the thin film bridge (5) attached to the embolus (4) and the end faces of the electrode pins (2, 3) are substantially flush with each other. , Protruding from the surface of the embolus (4) by a predetermined height, the electrode pad (21) and the electrode pins (2, 3) are connected by wire bonding, and one of the electrode pads (21) is connected to the embolus (4) An initiator connected to the header metal part (24) by wire bonding.
  2.   The initiator according to claim 1, wherein the material of the surface of the electrode pad (21) of the thin film bridge (5) is gold, aluminum, nickel, or titanium.
  3.   The initiator according to claim 1, wherein the wire (8) used for wire bonding is gold or aluminum and has a wire diameter of 10 µm to 500 µm.
  4.   The initiator according to claim 1, wherein the loop height of the wire (8) for wire bonding is 1 mm or less.
  5.   The initiator according to claim 1, wherein the predetermined height is more than 0.2 mm and 1 mm or less.
JP2004263575A 2004-09-10 2004-09-10 Initiator using thin-film bridge Expired - Fee Related JP4527478B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008050860A1 (en) * 2006-10-26 2008-05-02 Nipponkayaku Kabushikikaisha Squib, gas generation device for airbag, and gas generation device for seat belt pretensioner
JP2011145129A (en) * 2010-01-13 2011-07-28 Denso Corp Physical quantity sensor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4729315A (en) * 1986-12-17 1988-03-08 Quantic Industries, Inc. Thin film bridge initiator and method therefor
US5544585A (en) * 1993-05-05 1996-08-13 Ncs Pyrotechnie Et Technologies Electro-pyrotechnical initiator
JP2000500856A (en) * 1996-09-03 2000-01-25 テレダイン・インダストリーズ・インコーポレーテッド Thin film bridge type initiator and manufacturing method thereof
JP2004077117A (en) * 1993-02-26 2004-03-11 Quantic Industries Inc Semiconductor bridge die, semiconductor bridge initiation device and manufacturing method of semiconductor bridge die

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4729315A (en) * 1986-12-17 1988-03-08 Quantic Industries, Inc. Thin film bridge initiator and method therefor
JP2004077117A (en) * 1993-02-26 2004-03-11 Quantic Industries Inc Semiconductor bridge die, semiconductor bridge initiation device and manufacturing method of semiconductor bridge die
US5544585A (en) * 1993-05-05 1996-08-13 Ncs Pyrotechnie Et Technologies Electro-pyrotechnical initiator
JP2000500856A (en) * 1996-09-03 2000-01-25 テレダイン・インダストリーズ・インコーポレーテッド Thin film bridge type initiator and manufacturing method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008050860A1 (en) * 2006-10-26 2008-05-02 Nipponkayaku Kabushikikaisha Squib, gas generation device for airbag, and gas generation device for seat belt pretensioner
JP2008107029A (en) * 2006-10-26 2008-05-08 Nippon Kayaku Co Ltd Squib, gas generator for air bag and gas generator for seat belt pre-tensioner
JP4705550B2 (en) * 2006-10-26 2011-06-22 日本化薬株式会社 Gas generator for squib and airbag and gas generator for seat belt pretensioner
US8096242B2 (en) 2006-10-26 2012-01-17 Nipponkayaku Kabushikikaisha Squib, gas generator for air bag and gas generator for seat belt pretensioner
JP2011145129A (en) * 2010-01-13 2011-07-28 Denso Corp Physical quantity sensor
US8578774B2 (en) 2010-01-13 2013-11-12 Denso Corporation Physical quantity sensor including bonding wire with vibration isolation performance characteristics

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