JP2006055870A - Structure for installing superplastic forming die on opening/closing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the structure for installation of a superplastic forming die on an opening/closing device by which the thermal expansion of the forming die is absorbed by a small-sized and simple structure. <P>SOLUTION: In the structure for installation of the forming die 12 consisting of upper and lower dies 14, 13 which are thermally expanded at superplastic forming on the opening and closing device 36, in detail, a ram 21, the upper die 14 is arranged movably on at least one side of the vertical direction or the horizontal direction to the opening/closing device 36 while following the thermal expansion of the lower die 13. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a structure for installing a superplastic forming mold such as an aluminum alloy in a switchgear.

As a conventional superplastic forming mold, there is known a mold in which a mold is positioned with a single positioning pin and the mold is stopped with an engaging pin (see, for example, Patent Document 1).
Japanese Patent Laid-Open No. 7-214196

FIG. 1 of Patent Document 1 will be described with reference to FIG. In addition, the code | symbol used what was described in the gazette.
FIG. 7 is a cross-sectional view of a conventional superplastic forming mold. The mold M is positioned on a fixed block 2 fixed to the bolster 1.

  That is, a positioning pin 10 is attached to the bolster 1 so as to be movable vertically, a positioning hole 30 is formed in the center of the mold M, and the positioning pin 10 is fitted into the positioning hole 30 so that it can be moved horizontally to the fixed block 2. A plurality of engagement pins 20 are attached, a plurality of engagement grooves 40 are formed on the side surface of the mold M, and the tips of the engagement pins 20 are engaged with the engagement grooves 40 so that the mold M with respect to the fixed block 2 is engaged. The mold M is positioned with respect to the bolster 1 by preventing the rotation. Further, by adopting such a positioning structure, a positioning error does not occur even after the mold M is thermally expanded.

  As shown in FIG. 7, the plurality of engagement pins 20 arranged around the mold M are members arranged so as to extend in the horizontal direction to the side of the mold M, and thus the engagement pins 20 are moved. The fixed block 2 that is freely supported occupies a large space around the mold M. That is, the apparatus for superplastic forming becomes large. Further, since the plurality of engagement pins 20 are each biased toward the engagement groove 40 by a spring, and the engagement portion 20a at the tip is a separate member from the main body of the engagement pin 20, the apparatus is complicated. become.

  An object of the present invention is to provide a structure for installing a superplastic molding die on an opening / closing device that can absorb thermal expansion of the molding die with a small and simple structure.

  The invention according to claim 1 is an installation structure in which a molding die composed of an upper and lower mold that thermally expands at the time of superplastic molding is installed in the switchgear thereof, and the upper mold is made into a switchgear following the thermal expansion of the lower mold. On the other hand, it is arranged to be movable in at least one of the vertical direction and the horizontal direction.

  According to a second aspect of the present invention, the lower die is provided with a first positioning portion for the opening / closing device at the first corner, and the lower die is provided at the second corner located diagonally to the first corner. On the other hand, when the thermal expansion is performed, a second positioning portion for the opening / closing device that can move by the expansion amount is provided.

  In the invention according to claim 1, the upper mold is arranged so as to be movable in at least one of the vertical direction and the horizontal direction with respect to the switchgear following the thermal expansion of the lower mold. The thermal expansion of the upper mold with respect to the switchgear can be absorbed. Therefore, it is not necessary to provide an upper mold positioning mechanism for the switchgear, and the installation structure for installing the mold on the switchgear can be made small and simple while absorbing the thermal expansion of the mold.

  In the invention which concerns on Claim 2, the 1st positioning part was provided in the 1st corner part of the lower mold | type, and the 2nd positioning part which made it possible to absorb thermal expansion in the 2nd corner part which is a diagonal position with respect to a 1st corner part Since it is provided, the distance between the first positioning part and the second positioning part in the diagonal position can be increased, and for example, the positioning accuracy can be further improved as compared with the case where the distance between the two positioning parts is small. be able to.

The best mode for carrying out the present invention will be described below with reference to the accompanying drawings. The drawings are viewed in the direction of the reference numerals.
FIG. 1 is a cross-sectional view showing an installation structure of a superplastic molding die according to the present invention in an opening / closing device. The superplastic molding device 10 is a device for blow-molding a heated plate material 11 in a molding die 12. A molding die 12, specifically a lower die 13 and an upper die 14, a bolster 16 that supports the lower die 13, a plurality of lower connecting members 18 that connect the bolster 16 to a bolster support portion 17, and an upper die A ram 21 that opens and closes 14 and transmits pressure to the upper mold 14, a plurality of upper connecting members 23 that connect the ram 21 to the ram support 22, and a lower mold 13 and an upper mold 14 that are heated during molding are kept warm. The figure which heats the heat retention member 24, specifically, the lower heat retention member 26 and the upper heat retention member 27, the pressurized gas supply device 28 for supplying the pressurized gas into the molding die 12, and the lower mold 13 and the upper mold 14. It consists of a heater not shown. Reference numeral 13 a denotes a peak provided in the lower mold 13, and reference numeral 14 a denotes a recess provided in the upper mold 14.

  The plate 11 is, for example, a 5000 series (No. 5083, No. 5182) aluminum alloy plate having a length of 1700 mm, a width of 1300 mm, and a plate thickness of 1.3 mm, and is heated to 450 to 550 ° C. (for example, 540 ° C.).

The upper mold 14 includes protrusions 33 and 34 that are locked by locking portions 31 and 32 provided on the lower surface of the ram 21, and is movable in the vertical direction and the horizontal direction with respect to the ram 21.
The bolster 16, the bolster support portion 17, the lower connection member 18, the ram 21, the ram support portion 22, and the upper connection member 23 described above are parts that constitute a part of the press machine, and the bolster 16 and the ram 21 are molded. It is a member constituting an opening / closing device 36 for opening and closing the mold 12.
The high-pressure gas supply device 28 extends a pipe 43 from a pressurized gas supply source 41 to a gas passage 42 formed in the lower mold 13, and is provided with a valve 44 in the middle of the pipe 43.

FIG. 2 is a sectional view showing the positioning structure of the molding die according to the present invention.
The lower mold 13 and the bolster 16 are positioned by the first positioning unit 51 and the second positioning unit 52.

The first positioning portion 51 includes a first pin 54 press-fitted into the bolster 16 and a first fitting hole 55 opened in the lower mold 13 for fitting with the first pin 54.
The second positioning portion 52 includes a second pin 56 press-fitted into the bolster 16 and a long hole 57 provided in the second pin 56 so as to be movable during thermal expansion of the lower mold 13.

The lower mold 13 and the upper mold 14 are loosely fitted with the first fitting portion 61 to the fourth fitting portion 64 (the fourth fitting portion 64 is not shown) to such an extent that a difference in thermal expansion can be absorbed.
The first fitting portion 61 includes a third pin 66 press-fitted into the lower mold 13 and a third fitting hole 67 that fits loosely into the third pin 66. In addition, the 2nd fitting part 62-the 4th fitting part 64 are the same as the 1st fitting part 61, and abbreviate | omit description.

FIG. 3 is a perspective view showing the positioning structure of the lower mold according to the present invention.
The lower mold 13 includes a base portion 71 and a mold main body 72 integrally formed on the upper portion of the base portion 71. A rectangular portion is formed on the upper surface 72a of the mold main body 72 on the periphery of the peak portion 13a. Are formed, and a plurality of third pins 66 are embedded on the outer sides of these peak portions 74 and 75. Reference numerals 77 and 78 denote the inlet and outlet of the gas passage 42 (see FIG. 1).
The first pin 54 and the second pin 56 embedded in the bolster 16 are arranged substantially diagonally of the bolster 16 having a rectangular shape in plan view.

FIG. 4 is a plan view of the lower die and the bolster according to the present invention. First fitting holes 55 and elongated holes 57 are formed on the diagonal line 13b of the lower die 13, and these first fitting holes 55 and elongated holes 57 are formed. 1 shows that the first positioning portion 51 and the second positioning portion 52 are provided by fitting the first pin 54 and the second pin 56, respectively. The long hole 57 is a hole opened along the diagonal line 13b.
The above-described diagonal line 13b is a line drawn to the first corner part 71A of the base part 71 that is rectangular in plan view and the second corner part 71B that is a diagonal of the first corner part 71A.

  The first fitting hole 55 is provided near and inside the first corner portion 71A, and the vicinity of the position where the first fitting hole 55 is provided is referred to as a first corner portion 71C here. The long hole 57 is provided in the vicinity of the second corner portion 71B and inside thereof, and the vicinity of the position where the long hole 57 is provided is referred to as a second corner portion 71D here.

The operation of the installation structure of the molding die 12 described above on the opening / closing device 36 will be described.
FIG. 5 is a first operation diagram showing the operation of the installation structure of the molding die according to the present invention to the switchgear.
In addition, the cross-hatching was given to the pin concerning positioning, and the hole concerning positioning was shown with the thick line (same also in FIG. 6).
At normal temperature, the lower mold 13 is positioned with respect to the bolster 16 by the first positioning part 51 and the second positioning part 52.

  Further, at normal temperature, the upper die 14 can be moved horizontally by a predetermined distance with respect to the lower die 13 by the first fitting portion 61 to the fourth fitting portion 64, and the locking portion 31 with respect to the ram 21. , 32 and protrusions 33, 34 enable horizontal movement and vertical movement.

  When the molding die 12 is heated, the lower die 13 and the upper die 14 expand with respect to the bolster 16 and the ram 21. Here, it shows that the lower mold | type 13 and the upper mold | type 14 expanded by the same amount to the right side of a figure, for example.

  That is, at normal temperature, the distance between the first pin 54 and the third pin 66 of the third fitting portion 63 is L1, the distance between the first pin 54 and the second pin 56 is L2, and the first pin 54 and the upper die. The distance between the end surface 34a of the 14 projecting portions 34 is L3, and during heating, the distance between the first pin 54 and the third pin 66 of the third fitting portion 63 is L4, and the first pin 54 and the upper die 14 When the distance from the end surface 34a is L5, L4> L1 and L5> L3. Here, it is assumed that the bolster 16 and the ram 21 are lower in temperature than the lower mold 13 and the upper mold 14 and do not thermally expand. Therefore, the distance L2 does not change between normal temperature and heating.

  Thus, during heating, the lower mold 13 is positioned with respect to the bolster 16 by the first positioning portion 51 and the second positioning portion 52, and the second positioning portion 52 causes the thermal expansion of the lower mold 13 relative to the bolster 16. If the temperature of the upper die 14 is equal to that of the lower die 13, the upper die 14 is thermally expanded following the thermal expansion of the lower die 13 and absorbs thermal expansion in the vertical and horizontal directions with respect to the ram 21. Is done. When a difference occurs between the temperatures of the upper mold 14 and the lower mold 13, the first fitting portion 61 to the fourth fitting portion 64 absorb the difference in thermal expansion due to the temperature difference.

FIG. 6 is a second operation diagram showing the operation of the installation structure of the molding die according to the present invention on the opening / closing device.
The distance between the first pin 54 and the end surface 71a of the base portion 71 of the lower mold 13 at the normal temperature (the distance in the left-right direction in the figure) is L6, and the first pin 54 and the base portion 71 of the lower mold 13 are heated. When the distance from the end surface 71a (the distance in the left-right direction in the figure) is L7, L7> L6 is satisfied due to the thermal expansion of the lower mold 13.

  Further, the distance between the first pin 54 and the second pin 56 (the vertical distance in the figure) at the normal temperature is L11, and the distance between the first pin 54 and the end surface 71b of the base portion 71 of the lower mold 13 (in the figure). When the distance between the first pin 54 and the end surface 71b of the base portion 71 of the lower mold 13 (the vertical distance in the figure) is L13 during heating, the distance between the first pin 54 and the lower mold 13 is L13. L13> L12. The distance L11 does not change between normal temperature and heating.

  The positioning of the lower mold 13 by the second positioning portion 52 at this time is positioning in a direction perpendicular to the diagonal line 13b at normal temperature and during heating, and the second positioning portion 52 is positioned with respect to the first positioning portion 51. The lower mold 13 is prevented from rotating. Furthermore, since the first and second positioning portions 51 and 52 are provided on the diagonal line of the lower mold 13, for example, in the present invention, the first positioning portion 51 and the second positioning portion 51 and 52 are provided in the vicinity of two sides facing each other. The distance between the first and second positioning portions 51 and 52 can be increased, and the positioning accuracy can be further improved.

  As described above, even if the lower mold 13 is thermally expanded in the horizontal direction and the vertical direction in the drawing with respect to the bolster 16, the positioning is performed by the first positioning unit 51 and the second positioning unit 52, and further the second positioning unit The amount of thermal expansion can be absorbed by 52.

  As described with reference to FIGS. 2 and 4 above, the present invention firstly forms the molding die 12 composed of the upper and lower molds 14 and 13 that are thermally expanded at the time of superplastic molding. In the installation structure to be installed, the upper mold 14 is arranged so as to be movable in at least one of the vertical direction and the horizontal direction with respect to the switchgear 36 following the thermal expansion of the lower mold 13.

  Since the upper mold 14 is arranged so as to be movable in at least one of the vertical direction and the horizontal direction with respect to the opening / closing device 36 following the thermal expansion of the lower mold 13, the upper mold 14 is moved along with the thermal expansion of the lower mold 13. The thermal expansion of the upper mold 14 with respect to the opening / closing device 36 can be absorbed. Therefore, the opening / closing device 36, that is, the positioning mechanism of the upper die 14 with respect to the ram 21 may not be provided, and the installation structure for installing the molding die 12 in the opening / closing device 36 while absorbing the thermal expansion of the molding die 12. Can be made small and simple.

  In the second aspect of the present invention, the lower mold 13 is provided with the opening / closing device 36 at the first corner 71C, specifically, the first positioning portion 51 with respect to the bolster 16, and the second corner located diagonally to the first corner 71C. When the lower mold 13 is thermally expanded with respect to the opening / closing device 36, a second positioning portion 52 for the opening / closing device 36 is provided in the corner portion 71D.

  The first positioning portion 51 is provided at the first corner portion 71C of the lower mold 13, and the second positioning portion 52 that can absorb thermal expansion is provided at the second corner portion 71D that is diagonal to the first corner portion 71C. Therefore, the distance between the first positioning part 51 and the second positioning part 52 in the diagonal position can be increased. For example, in the present invention, the bolster is compared with the case where the distance between the two positioning parts is small. The positioning accuracy of the lower mold 13 with respect to 16 can be further improved.

  In the present embodiment, as shown in FIG. 3, the first fitting hole 55 and the long hole 57 are opened, and the first pin 54 and the second pin 56 are press-fitted into the bolster 16. The first pin 54 and the second pin 56 may be press-fitted into the lower mold 13, and the first fitting hole 55 and the long hole 57 may be opened in the bolster 16.

  The installation structure of the molding die in the switchgear according to the present invention is suitable for molding in which the mold is heated.

It is sectional drawing which shows the installation structure to the switchgear of the superplastic forming metal mold | die which concerns on this invention. It is sectional drawing which shows the positioning structure of the shaping die concerning this invention. It is a perspective view which shows the positioning structure of the lower mold | type which concerns on this invention. It is a top view of the lower model and bolster concerning the present invention. It is a 1st operation | movement figure which shows the effect | action of the installation structure to the opening / closing apparatus of the molding die concerning this invention. It is a 2nd operation | movement figure which shows the effect | action of the installation structure to the opening / closing apparatus of the molding die concerning this invention. It is sectional drawing of the conventional superplastic forming metal mold | die.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 12 ... Molding die, 13 ... Lower die, 14 ... Upper die, 36 ... Opening / closing device, 51 ... 1st positioning part, 52 ... 2nd positioning part, 71C ... 1st corner part, 71D ... 2nd corner part.

Claims (2)

In an installation structure in which a molding die consisting of an upper and lower mold that thermally expands during superplastic molding is installed in the switchgear,
The upper mold is arranged so as to be movable in at least one of a vertical direction and a horizontal direction with respect to the switchgear following the thermal expansion of the lower mold. Installation structure.   The lower mold is provided with a first positioning portion for the switchgear at a first corner, and the lower mold is thermally expanded with respect to the switchgear at a second corner opposite to the first corner. 2. The structure for installing the superplastic molding die in the switchgear according to claim 1, further comprising a second positioning portion for the switchgear that can absorb the thermal expansion.

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