JP2006048934A - 灯具光源用ledランプ - Google Patents
灯具光源用ledランプ Download PDFInfo
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- JP2006048934A JP2006048934A JP2004223707A JP2004223707A JP2006048934A JP 2006048934 A JP2006048934 A JP 2006048934A JP 2004223707 A JP2004223707 A JP 2004223707A JP 2004223707 A JP2004223707 A JP 2004223707A JP 2006048934 A JP2006048934 A JP 2006048934A
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- lamp
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- 229920002050 silicone resin Polymers 0.000 claims description 21
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 9
- 235000019589 hardness Nutrition 0.000 claims 2
- 229910052736 halogen Inorganic materials 0.000 abstract description 4
- 238000005286 illumination Methods 0.000 abstract 1
- 238000004020 luminiscence type Methods 0.000 abstract 1
- 229910052721 tungsten Inorganic materials 0.000 abstract 1
- 239000010937 tungsten Substances 0.000 abstract 1
- -1 tungsten halogen Chemical class 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010020649 Hyperkeratosis Diseases 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
- F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/151—Light emitting diodes [LED] arranged in one or more lines
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】 本発明により、回転放物面系反射面とした反射鏡11と組合わせて配光特性を得るヘッドライトに用いられる灯具光源用LEDランプ1であって、発光面の形状が短辺と長辺との比が1:2〜1:6の範囲とする略平面状としたことで、従来、発光源として使用されていた、フィラメントに類似する配光パターンの形成を可能とし、且つ、LEDランプから放射される光のほぼ全てを照明光として使用可能とし、実現性を向上させるものである。
【選択図】 図3
Description
2…LEDチップ
3…ベース
3a…キャビティ
3b…配線パターン
4…絶縁層
5…端子板
6…透明シリコーン樹脂
6a…蛍光体
6b…硬質しリコーン樹脂
6c…酸化シリコン(SiO2)
7…金線
8…フラットカバー
20…ヘッドライト
21…反射鏡
22…ヒートシンク
Claims (7)
- 車両用前照灯に用いられるLED光源であって、発光形状が矩形であり、その短辺と長辺との比が1:2〜1:6の範囲であることを特徴とする灯具光源用LEDランプ。
- 前記灯具光源用LEDランプは、1個が略正方形のLEDチップを2個〜6個直線状に整列させてベース上にマウントすることで構成されていることを特徴とする請求項1記載の灯具光源用LEDランプ。
- 前記灯具光源用LEDランプは、短辺と長辺との比が1:2〜1:6の範囲とした1個のLEDチップのマウントにより構成されていることを特徴とする請求項1記載の灯具光源用LEDランプ。
- 前記ベースの前記LEDチップをマウントする位置には、上記略正方形としたLEDチップの必要数、若しくは、短辺と長辺との比が1:2〜1:6の範囲内とされたと1個のLEDチップをマウントするのに適合するキャビティが設けられ、該キャビティも短辺と長辺との比が1:2〜1:6の範囲としてあることを特徴とする灯具光源用LEDランプ。
- 前記LEDチップがマウントされたキャビティ内には蛍光体が混和された透明シリコーン樹脂が充填されていることを特徴とする請求項4記載の灯具光源用LEDランプ。
- 前記キャビティ内に充填される透明シリコーン樹脂は、硬度の異なる2種類以上のシリコーン樹脂により、外側ほど高い硬度とする階層状として充填されていることを特徴とする請求項4又は請求項5何れかに記載の灯具光源用LEDランプ。
- 前記シリコーン樹脂内に混和される蛍光体は複数種類であることを特徴とする請求項4〜6何れかに記載の灯具光源用LEDランプ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004223707A JP4599111B2 (ja) | 2004-07-30 | 2004-07-30 | 灯具光源用ledランプ |
DE102005026949.4A DE102005026949B4 (de) | 2004-07-30 | 2005-06-10 | LED-Lampe als Lichtquelle für eine Beleuchtungseinheit |
US11/187,841 US7932523B2 (en) | 2004-07-30 | 2005-07-25 | LED lamp for light source of lighting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004223707A JP4599111B2 (ja) | 2004-07-30 | 2004-07-30 | 灯具光源用ledランプ |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010113408A Division JP4945658B2 (ja) | 2010-05-17 | 2010-05-17 | 車両用前照灯 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006048934A true JP2006048934A (ja) | 2006-02-16 |
JP4599111B2 JP4599111B2 (ja) | 2010-12-15 |
Family
ID=35731116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004223707A Expired - Fee Related JP4599111B2 (ja) | 2004-07-30 | 2004-07-30 | 灯具光源用ledランプ |
Country Status (3)
Country | Link |
---|---|
US (1) | US7932523B2 (ja) |
JP (1) | JP4599111B2 (ja) |
DE (1) | DE102005026949B4 (ja) |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008010228A (ja) * | 2006-06-28 | 2008-01-17 | Koito Mfg Co Ltd | 車両用灯具 |
JP2008131027A (ja) * | 2006-11-22 | 2008-06-05 | Lighthouse Technology Co Ltd | ハイパワーダイオードホルダー構造とパッケージ組合わせ |
EP1930651A1 (en) | 2006-12-05 | 2008-06-11 | Stanley Electric Co., Ltd. | Light source device and vehicle lighting device |
JP2010529645A (ja) * | 2007-06-01 | 2010-08-26 | ワッカー ケミー アクチエンゲゼルシャフト | 発光体を有するシリコン成形部材 |
US7806538B2 (en) | 2007-05-25 | 2010-10-05 | Stanley Electric Co., Ltd. | Light source device and vehicle lighting device |
JP2011040714A (ja) * | 2009-08-06 | 2011-02-24 | Everlight Electronics Co Ltd | 発光ダイオード |
JP2011124608A (ja) * | 2011-02-16 | 2011-06-23 | Toshiba Lighting & Technology Corp | 照明装置 |
JP2012504342A (ja) * | 2008-09-29 | 2012-02-16 | ブリッジラックス インコーポレイテッド | 効率的なledアレイ |
KR101164368B1 (ko) | 2009-09-28 | 2012-07-09 | 한국광기술원 | 발광다이오드 패키지 및 이의 제조방법 |
US8373182B2 (en) | 2010-09-09 | 2013-02-12 | Stanley Electric Co., Ltd. | Semiconductor light-emitting device and manufacturing method |
US8432088B2 (en) | 2011-01-03 | 2013-04-30 | Crs Electronics | Permanent conversion adapter for lighting fixtures |
US8455907B2 (en) | 2010-06-16 | 2013-06-04 | Stanley Electric Co., Ltd. | Semiconductor light emitting device having an optical plate including a meniscus control structure and method of manufacturing |
US8461610B2 (en) | 2010-06-16 | 2013-06-11 | Stanley Electric Co., Ltd. | Semiconductor light emitting device having a reflective material with a side slant surface and method of manufacturing |
US8581287B2 (en) | 2011-01-24 | 2013-11-12 | Stanley Electric Co., Ltd. | Semiconductor light emitting device having a reflective material, wavelength converting layer and optical plate with rough and plane surface regions, and method of manufacturing |
EP2709171A2 (en) | 2012-09-18 | 2014-03-19 | Stanley Electric Co., Ltd. | LED array |
US8921877B2 (en) | 2010-08-02 | 2014-12-30 | Stanley Electric Co., Ltd. | Semiconductor light-emitting device for producing wavelength-converted light and method for manufacturing the same |
US9368690B2 (en) | 2013-01-24 | 2016-06-14 | Stanley Electric Co., Ltd. | Semiconductor light-emitting device |
JP2016225374A (ja) * | 2015-05-27 | 2016-12-28 | 四国計測工業株式会社 | Led発光装置 |
JP2018518039A (ja) * | 2015-04-27 | 2018-07-05 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | オプトエレクトロニクス部品アレイおよび複数のオプトエレクトロニクス部品アレイを製造する方法 |
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Also Published As
Publication number | Publication date |
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US7932523B2 (en) | 2011-04-26 |
DE102005026949B4 (de) | 2021-02-11 |
DE102005026949A1 (de) | 2006-03-23 |
US20060022211A1 (en) | 2006-02-02 |
JP4599111B2 (ja) | 2010-12-15 |
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