JP2006010232A - Heat pump device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat pump device capable of not only hot water supply but also heating operation. <P>SOLUTION: This heat pump device has a heat pump circuit for annularly connecting a compressor 11, a refrigerant side pipe 12a of a hot water supply heat exchanger, a refrigerant side pipe 13a of a first heating heat exchanger, an expansion valve 14 and an outdoor heat exchanger 15, a hot water storage circuit for heating water in a hot water storage tank 16 flowing in a water side pipe 12b of the hot water supply heat exchanger by a refrigerant flowing in the refrigerant side pipe 12a of the hot water supply heat exchanger, a first heating circuit for heating the water in a heating radiator 18 flowing in a water side pipe 13b of the first heating heat exchanger by the refrigerant flowing in the refrigerant side pipe 13a of the first heating heat exchanger, and a second heating circuit for heating the water of the heating radiator 18 flowing in a secondary side pipe 20b of a second heating heat exchanger by hot water of the hot water storage tank 16 flowing in a primary side pipe 20a of the second heating heat exchanger; and can perform various heating operations up to small capacity from large capacity. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a multifunctional heat pump apparatus that can perform not only hot water supply operation but also heating operation.

  Conventionally, there is one shown in FIG. 3 as a multifunctional heat pump water heater that can perform not only hot water supply operation but also other operation (heating operation) (for example, see Patent Document 1). As shown in FIG. 3, the heat pump water heater includes a hot water storage tank unit 101, a heat pump unit 102, and a hot water heating terminal 103. In the heat pump unit 102, a compressor 104, a refrigerant-to-water heat exchanger 105 as a condenser, an expansion valve 106, and an evaporator 107 are connected in an annular shape to form a refrigerant circuit through which the refrigerant flows in this order. Further, a hot water storage circuit is formed in which the water at the bottom of the hot water storage tank 108 is conveyed to the refrigerant-to-water heat exchanger 105 by the heating circulation pump 109 and heated and then returned to the upper part of the hot water storage tank 108. The hot water storage tank unit 101 has a primary circuit for returning hot water in the upper part of the hot water storage tank 108 to the lower part of the hot water storage tank 108 via the heating heat exchanger 110 and the heating primary pump 111, and a secondary pump 112 for heating the water at the outlet of the hot water heating terminal. And a secondary side circuit that returns to the hot water heating terminal 103 via the heating heat exchanger 110. The hot water in the hot water storage tank 108 heats the water in the secondary circuit in the heating heat exchanger 110 to warm water, and the hot water heats the room air in the hot water heating terminal 103 to heat the room.

For this reason, not only can the hot water stored in the hot water storage tank 108 stored in the highly efficient heat pump cycle be used for hot water supply, but also a heating operation using the hot water storage heat becomes possible.
JP 2004-36958 A

  However, since the room cannot be directly heated by the heat pump unit 102 in the conventional configuration, the room heating operation cannot be performed when there is no hot water in the hot water storage tank 108, and the heating capacity is insufficient when there is little hot water. Had.

  The present invention solves the above-described conventional problems, and an object thereof is to provide a multifunctional heat pump device that can perform not only heating operation using hot water in a hot water storage tank but also heating operation by a highly efficient heat pump cycle. To do.

  In order to solve the conventional problems, a heat pump device according to the present invention includes a compressor, a refrigerant side pipe of a hot water supply heat exchanger, a refrigerant side pipe of a first heating heat exchanger, an expansion valve, and an outdoor heat exchanger. A heat pump circuit connected to the hot water storage circuit, a hot water storage circuit that heats the water in the hot water storage tank flowing in the water side pipe of the hot water heat exchanger with the refrigerant flowing in the refrigerant side pipe of the hot water supply heat exchanger, and heating with the hot water of the hot water storage tank The second heating heat exchanger that heats the water in the radiator, and the water in the heating radiator that flows in the water-side pipe of the first heating heat exchanger with the refrigerant flowing in the refrigerant-side pipe of the first heating heat exchanger A first heating circuit for heating the heating radiator, and the heating radiator flowing in the secondary side pipe of the second heating heat exchanger with hot water of the hot water storage tank flowing in the primary side pipe of the second heating heat exchanger And a second heating circuit for heating water.

  Thereby, not only heating operation by a highly efficient heat pump cycle but also large-capacity heating operation using hot water in the hot water storage tank can be performed.

  High-efficiency heating operation using the heat pump cycle and large-capacity heating operation using hot water in the hot water storage tank are possible, and energy saving and responsiveness improvement of the heating operation can be achieved.

  1st invention is the heat pump circuit which connected the refrigerant | coolant side piping of the compressor, the hot water supply heat exchanger, the refrigerant | coolant side piping of the 1st heating heat exchanger, the expansion valve, and the outdoor heat exchanger, and the said hot water supply heat exchange A hot water storage circuit for heating the water in the hot water storage tank flowing in the water side pipe of the hot water supply heat exchanger with the refrigerant flowing in the refrigerant side piping of the heater, and the second heating heat for heating the water in the heating radiator with the hot water of the hot water storage tank An exchanger, a first heating circuit for heating water in the heating radiator flowing in the water-side pipe of the first heating heat exchanger with a refrigerant flowing in the refrigerant-side pipe of the first heating heat exchanger, and the first A second heating circuit for heating water of the heating radiator flowing in the secondary side pipe of the second heating heat exchanger with hot water of the hot water storage tank flowing in the primary side pipe of the 2 heating heat exchanger; High efficiency heating operation by heat pump cycle and hot water storage tank Large capacity of the heating operation using the hot water becomes possible, energy-saving heating operation, it is possible to achieve a response improvement.

  The second invention is a heat pump cycle in which the water side piping of the first heating heat exchanger of the heat pump device of the first invention and the secondary side piping of the second heating heat exchanger are connected in parallel. The first heating circuit using the hot water, the second heating circuit using the hot water in the hot water tank alone, and the first heating circuit and the second heating circuit can be operated simultaneously. Heating operation can be performed.

  In particular, the flow rate of the water flowing through the water side pipe of the first heating heat exchanger and the secondary side pipe of the second heating heat exchanger of the heat pump device according to the first or second invention is the third invention. A heating flow rate control device to be controlled is provided, and the operation efficiency of the first heating circuit and the second heating circuit can be improved.

  In particular, the fourth invention is provided with a heating radiator fan for supplying room air to the heating radiator of the heat pump device according to any one of the first to third inventions, the indoor air and the heating radiator. Heat exchange with hot water can be promoted and large capacity heating operation can be performed.

  In particular, the fifth invention controls the rotation speed of the heating radiator fan of the heat pump device of the fourth invention so that the temperature difference between the heating radiator inlet water temperature and the heating radiator outlet water temperature is within a predetermined range. Therefore, heat exchange between the hot water of the heating radiator and the room air can be performed with high efficiency.

  The sixth invention is particularly necessary for heating the heating flow rate control device of the heat pump device according to any one of the third to fifth inventions to heat the heat storage amount of the hot water storage tank and the room air to the set room air temperature. The flow rate of water is controlled in accordance with the amount of heat for heating indoor air, and heating operation according to the situation can be performed.

  In the seventh invention, in particular, the heat storage amount of the hot water storage tank of the heat pump device of the sixth invention is detected by a plurality of temperature sensors installed on the wall surface of the hot water storage tank. It can be detected.

  In the eighth invention, in particular, the required indoor air heating heat quantity of the heat pump device of any one of the sixth or seventh invention is detected by a temperature difference between the current indoor air temperature and the set indoor air temperature. The required amount of heat for heating the indoor air can be accurately detected at a relatively low cost.

  The ninth aspect of the invention is particularly the heating flow rate control device of the heat pump device of any one of the first to eighth aspects of the invention, wherein the amount of heat stored in the hot water storage tank is greater than or equal to a predetermined amount of heat and the amount of heat required for heating the indoor air is greater than or equal to a predetermined amount of heat. In such a case, the heating operation is performed by the first heating circuit and the second heating circuit, and the room can be quickly heated by the large-capacity heating operation.

  The tenth aspect of the invention is particularly the heating flow rate control device of the heat pump device according to any one of the first to ninth aspects of the invention, wherein the amount of heat stored in the hot water storage tank is greater than or equal to a predetermined amount of heat and the amount of heat required for heating the indoor air is less than the predetermined amount of heat. In this case, the heating operation is performed only by the second heating circuit without using the first heating circuit, and the heating operation can be quickly started.

  In the eleventh aspect of the invention, in particular, the heating flow rate control device of the heat pump apparatus according to any one of the first to tenth aspects of the invention is not used when the heat storage amount of the hot water storage tank is less than a predetermined amount of heat. In addition, the heating operation is performed only by the first heating circuit, and the highly efficient heating operation using the heat pump cycle can be performed even when the heat storage amount of the hot water storage tank is small.

  In a twelfth aspect of the invention, in particular, the heat pump circuit of any one of the first to eleventh aspects of the invention includes a hot water supply heat exchanger bypass that bypasses the refrigerant side piping of the hot water supply heat exchanger. 1 Operation start of a heating circuit can be performed rapidly.

  In a thirteenth aspect of the invention, in particular, the heat pump circuit of the heat pump device according to any one of the first to twelfth aspects of the invention includes a first heating heat exchanger bypass that bypasses the refrigerant side piping of the first heating heat exchanger. Therefore, the hot water storage circuit can be started up quickly.

  The fourteenth invention is characterized in that, in the heat pump circuit of the twelfth invention, when the operation by the first heating circuit is performed, the hot water supply heat exchanger bypass for bypassing the refrigerant side piping of the hot water supply heat exchanger is opened. Therefore, the heating capacity responsiveness of the heating radiator can be improved.

  The fifteenth invention is characterized in that, in the heat pump circuit of the thirteenth invention, when the operation by the hot water storage circuit is performed, the first heating heat exchanger bypass for bypassing the refrigerant side piping of the first heating heat exchanger is opened. Thus, the heating capacity response of the hot water storage tank can be improved.

  In a sixteenth aspect of the invention, in particular, the refrigerant circuit of the heat pump device according to any one of the first to fifteenth aspects is a supercritical heat pump cycle in which the pressure of the refrigerant is equal to or higher than the critical pressure, and the refrigerant is pressurized to the critical pressure or higher. By heating the water in the water side pipe of the hot water heat exchanger with the refrigerant in the refrigerant side pipe of the hot water heat exchanger is pressurized to a critical pressure or higher, the water side of the hot water heat exchanger Condensation does not occur even if the temperature is lowered due to heat deprived by the water in the pipe. Therefore, it becomes easy to form a temperature difference between the refrigerant and the water in the entire area of the hot water heat exchanger, so that hot water can be obtained and the heat exchange efficiency can be increased.

  In the seventeenth aspect of the invention, in particular, in the heat pump apparatus of the sixteenth aspect of the invention, the refrigerant to be used is carbon dioxide, and the product cost is suppressed by using relatively inexpensive and stable carbon dioxide as the refrigerant. At the same time, reliability can be improved. In addition, carbon dioxide has an ozone depletion coefficient of zero and a global warming coefficient of about 1/700 of the alternative refrigerant HFC-407C, which is very small.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the present invention is not limited to the embodiments.

(Embodiment 1)
FIG. 1 is a configuration diagram of a heat pump device according to a first embodiment of the present invention.

  In FIG. 1, a compressor 11, a refrigerant side pipe 12 a of a hot water supply heat exchanger, a refrigerant side pipe 13 a of a first heating heat exchanger, an expansion valve 14, and an outdoor heat exchanger 15 are annularly connected to form a heat pump circuit. is doing. The blower 34 sends outdoor air to the outdoor heat exchanger 15. The heat pump device according to the first embodiment of the present invention heats the water in the hot water storage tank 16 that flows in the water side pipe 12b of the hot water heat exchanger with the refrigerant that flows in the refrigerant side pipe 12a of the hot water heat exchanger. The hot water storage circuit, the second heating heat exchanger 20 that heats the water in the heating radiator 18 with the hot water in the hot water storage tank 16, and the first heating heat exchanger with the refrigerant flowing in the refrigerant side pipe 13a of the first heating heat exchanger The first heating circuit for heating the water of the heating radiator 18 flowing in the water-side pipe 13b and the hot water in the hot water storage tank 16 flowing in the primary-side pipe 20a of the second heating heat exchanger are used for the second heating heat exchanger. And a second heating circuit that heats water of the heating radiator 18 that flows in the secondary side pipe 20b. The hot water storage circuit is formed by annularly connecting the hot water storage tank 16, the stacking pump 17, and the water side pipe 12b of the hot water supply heat exchanger. The first heating circuit is formed by annularly connecting the heating radiator 18, the first heating pump 19, the flow rate adjusting valve 23, and the water side pipe 13b of the first heating heat exchanger. The second heating circuit is formed by annularly connecting the heating radiator 18, the first heating pump 19, the flow rate adjusting valve 23, and the secondary piping 20b of the second heating heat exchanger.

  The water-side piping 13b of the first heating heat exchanger and the secondary-side piping 20b of the second heating heat exchanger are connected in parallel, and the distribution of the water flow rate flowing through both is based on the amount of heat stored in the hot water storage tank 16 and the indoor space. It is controlled by the heating flow rate control device 22 via the flow rate adjusting valve 23 according to the necessary indoor air heating heat amount necessary for heating the air to the set indoor air temperature. The amount of heat stored in the hot water storage tank 16 is detected by a plurality of temperature sensors (residual hot water amount sensors) 24 a to 24 c installed on the wall surface of the hot water storage tank 16, and the required indoor air heating heat amount is detected by the indoor air temperature sensor 25. Detection is based on the temperature difference between the air temperature and the set indoor air temperature.

  Further, the heating radiator 18 includes a heating radiator fan 28 that supplies room air, and heat exchange between the room air and hot water of the heating radiator 18 can be promoted to perform a high-performance heating operation. The heating radiator fan control device 35 is connected to the heating radiator fan 28, the heating radiator inlet temperature sensor 26, and the heating radiator outlet temperature sensor 27, and the heating radiator inlet temperature sensor 26 and the heating radiator outlet temperature sensor. The number of revolutions of the heating radiator fan 28 is controlled based on the detected temperature 27. The heating radiator fan control device 35 may be formed integrally with the heating flow rate control device 22. The number of revolutions of the heating radiator fan 28 is such that the temperature difference between the heating radiator inlet water temperature detected by the heating radiator inlet temperature sensor 26 and the heating radiator outlet water temperature detected by the heating radiator outlet temperature sensor 27 is within a predetermined range. The heat exchange between the hot water of the heating radiator 18 and the room air can be performed with high efficiency.

  Check valves 29 a to 29 c for preventing the backflow of water are installed at various locations of the water piping, and a water supply valve 30 and a drain valve 31 are installed at the hot water storage tank 16. In addition, a mixing valve 32 for obtaining a predetermined hot water supply temperature by mixing hot water and hot water in the hot water storage tank 16 is provided in the upstream portion of the hot water supply terminal 33 such as a curan.

  About the heat pump apparatus comprised as mentioned above, the operation | movement and an effect | action are demonstrated below.

  As the heating operation mode, the first heating circuit (highly efficient operation by the heat pump cycle) is operated independently, the second heating circuit (the operation that uses the hot water in the hot water storage tank 16 is quick), the first heating circuit, Two types of simultaneous operation (high-capacity operation) of the two heating circuits are possible, and these heating operation modes are switched by the heating flow rate control device 22 in accordance with the heat storage amount of the hot water storage tank 16 and the required indoor air heating heat amount. .

  First, the amount of heat stored in the hot water storage tank 16 is not less than a predetermined amount of heat (for example, the temperature detected by the remaining hot water sensor 24b in the central portion of the hot water storage tank 16 is 45 ° C. or more) and the required indoor air heating heat amount is not less than a predetermined amount of heat (for example, indoor heating setting). When the temperature difference between the temperature and the room air temperature is 10K or more), the heating operation is performed in the first heating circuit and the second heating circuit. Specifically, the heating flow rate control device 22 has a temperature difference between the temperature detected by the indoor air temperature sensor 25 and the indoor heating preset temperature, and the temperature detected by the remaining hot water sensor 24 is equal to or higher than a predetermined temperature. When the temperature difference is equal to or more than a predetermined temperature difference, the second heating pump 21 and the compressor 11 are controlled to operate, and the flow rate adjustment valve 23 is used for the first heating heat exchange with the water in the heating radiator 18. It controls so that it may flow through the water side piping 13b of a heater, and the secondary side piping 20b of a 2nd heating heat exchanger, and it controls to perform heating operation by the 1st heating circuit and the 2nd heating circuit. That is, when the amount of heat required for heating the indoor air is large (for example, when heating a low-temperature room), the highly efficient first heating circuit by the heat pump cycle and the second heating with quick response using the hot water of the hot water storage tank 16 are fast. The room can be quickly heated by the circuit with a large capacity heating operation.

  Next, the amount of heat stored in the hot water storage tank 16 is greater than or equal to a predetermined amount of heat (for example, the temperature detected by the remaining hot water sensor 24b at the center of the hot water storage tank 16 is 45 ° C. or higher) and the required indoor air heating heat amount is less than the predetermined amount of heat (for example, indoor heating When the temperature difference between the set temperature and the room air temperature is less than 2K), the heating operation is performed only by the second heating circuit without using the first heating circuit. Specifically, the heating flow rate control device 22 has a temperature difference between the temperature detected by the indoor air temperature sensor 25 and the indoor heating preset temperature, and the temperature detected by the remaining hot water sensor 24 is equal to or higher than a predetermined temperature. When the temperature difference is smaller than the predetermined temperature difference, the second heating pump 21 is controlled to operate, and the flow rate adjusting valve 23 is controlled so that the water in the heating radiator 18 is the secondary of the second heating heat exchanger. It controls so that it may flow into the side piping 20b, and it controls to perform heating operation only by a 2nd heating circuit. That is, when the required amount of heat for heating the indoor air is small (for example, in the case of keeping the room warm), the room air can be quickly heated to the set room temperature by the second heating circuit having quick response. In such a case, if the first heating circuit is operated, the temperature difference between the indoor heating set temperature and the indoor air temperature is relatively small, so the compressor 11 and the like of the heat pump circuit are operated intermittently. This is contrary to the energy saving of the heating operation. However, if the heating operation is performed only by the second heating circuit as in the present embodiment, this problem can be solved, and the energy saving of the heating operation is achieved. be able to.

  Furthermore, when the heat storage amount of the hot water storage tank 16 is less than a predetermined heat amount (for example, the temperature detected by the remaining hot water amount sensor 24a above the hot water storage tank 16 is lower than 45 ° C.), the first heating circuit is not used without using the second heating circuit. Just perform heating operation. Specifically, the heating flow rate control device 22 controls the compressor 11 to operate when the detected temperature of the remaining hot water amount sensor 24 is lower than a predetermined temperature, and the flow rate adjustment valve 23. Is controlled so that the water in the heating radiator 18 flows through the water-side pipe 13b of the first heating heat exchanger, and the heating operation is performed only by the first heating circuit. That is, even if there is no hot water in the hot water storage tank 16, although the response is somewhat inferior, the highly efficient heating operation of the first heating circuit by the heat pump cycle can be performed.

  As described above, in the first embodiment, according to the heat storage amount of the hot water storage tank 16 and the required indoor air heating heat amount, the heating operation by the high-efficiency heat pump cycle and the high capacity using the hot water in the hot water storage tank 16 are possible. Heating operation is possible, and energy saving and responsiveness improvement of the heating operation can be achieved.

  Note that the amount of heat stored in the hot water storage tank 16 is equal to or greater than a predetermined amount of heat (for example, the temperature detected by the remaining hot water amount sensor 24a above the hot water storage tank 16 is 45 ° C. or more, and the required indoor air heating heat amount is within a predetermined range (for example, indoor heating setting). When the temperature difference between the temperature and the room air temperature is 2K or more and less than 10K), the heating operation is controlled only by the second heating circuit.

  Next, the operation of the heating radiator fan 28 will be described.

  When the detected temperature difference between the heating radiator inlet temperature sensor 26 and the heating radiator outlet temperature sensor 27 exceeds the upper limit value within a predetermined range, the heating radiator fan control device 35 rotates the number of rotations of the heating radiator fan 28. When the detected temperature difference between the heating radiator inlet temperature sensor 26 and the heating radiator outlet temperature sensor 27 is less than the lower limit of the predetermined range, the number of rotations of the heating radiator fan 28 is controlled. Control to raise. By controlling in this way, it is possible to control so that the detected temperature difference between the heating radiator inlet temperature sensor 26 and the heating radiator outlet temperature sensor 27 falls within a predetermined range. Heat exchange with air can be performed with high efficiency.

(Embodiment 2)
FIG. 2 is a configuration diagram of the heat pump apparatus according to the second embodiment of the present invention. In FIG. 2, the same components as those of the heat pump apparatus according to the first embodiment of the present invention are denoted by common reference numerals, and detailed description thereof is omitted.

  The difference from Embodiment 1 is that in FIG. 2, the heat pump circuit bypasses the hot water supply heat exchanger bypass 201 for bypassing the refrigerant side pipe 12a of the hot water supply heat exchanger and the refrigerant side pipe 13a of the first heating heat exchanger. The first heating heat exchanger bypass 202 is provided.

  About the heat pump apparatus comprised as mentioned above, the operation | movement and an effect | action are demonstrated below.

  First, when starting the operation by the first heating circuit (heating operation by the heat pump cycle), the hot water supply heat exchanger bypass 201 is opened. Specifically, the heating flow rate control device 22 may be configured to open the hot water supply heat exchanger bypass 201 using a signal when the first heating circuit is operated. Accordingly, since the high-temperature and high-pressure refrigerant discharged from the compressor 11 does not pass through the refrigerant-side pipe 12a of the hot water supply heat exchanger, the refrigerant is not absorbed by the hot water supply heat exchanger 12 and the first heating is maintained while maintaining the high temperature and high pressure state. Heat of the heating radiator 18 is heated by exchanging heat with the water in the water-side pipe 13b of the first heating heat exchanger through the refrigerant-side pipe 13a of the heat exchanger. Therefore, the heating capability responsiveness of the heating radiator 18 can be improved.

  Moreover, when starting the operation by the hot water storage circuit (water heating operation in the hot water storage tank 16 by the heat pump cycle), the first heating heat exchanger bypass 202 is opened. Thus, the refrigerant after heat exchange with the water in the water side pipe 12b of the hot water heat exchanger in the refrigerant side pipe 12a of the hot water heat exchanger does not pass through the refrigerant side pipe 13a of the first heating heat exchanger. Is not absorbed by the first heating heat exchanger 13, and a pressure drop due to a pressure loss of the first heating heat exchanger 13 can also be prevented. Therefore, the heating capacity response of the hot water storage tank 16 can be improved.

  As described above, in the second embodiment, by bypassing the refrigerant side pipe 12a of the hot water supply heat exchanger and the refrigerant side pipe 13a of the first heating heat exchanger, the amount of heat of the refrigerant can be reduced to the hot water supply heat exchanger 12 or It is possible to prevent the first heating heat exchanger 13 from absorbing heat wastefully and to improve the responsiveness of the heating operation and the hot water tank heating operation.

  Here, the heating radiator 18 is configured to exchange heat between the indoor air and the hot water of the heating radiator 18 by the heating radiator fan 28. However, if this is used as a floor heating panel, the heating radiator 18 is developed for floor heating applications. Is also possible.

  In the first and second embodiments, the heat pump cycle is a supercritical heat pump cycle in which the refrigerant pressure is equal to or higher than the critical pressure. However, a heat pump cycle having a general critical pressure or lower may be used. In this case, chlorofluorocarbon, ammonia, or the like may be used as the refrigerant.

  As described above, the heat pump device according to the present invention is effective for not only hot water supply operation but also heating operation, as well as multifunctional heat pump cycles such as bath heating operation and bathroom drying operation.

Configuration diagram of heat pump device in Embodiment 1 of the present invention The block diagram of the heat pump apparatus in Embodiment 2 of this invention Configuration diagram of a conventional heat pump device

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Compressor 12 Hot-water supply heat exchanger 12a Refrigerant-side piping of hot-water supply heat exchanger 12b Water-side piping of hot-water supply heat exchanger 13 First heating heat exchanger 13a Refrigerant-side piping of first heating heat exchanger 13b First heating heat exchange Water side piping 14 Expansion valve 15 Outdoor heat exchanger 16 Hot water storage tank 17 Stack pump 18 Heating radiator 19 First heating pump 20 Second heating heat exchanger 20a Primary heating piping 20b 2nd heating heat exchanger Secondary piping of heating heat exchanger 21 Second heating pump 22 Heating flow rate control device 23 Flow rate adjusting valve 24a, 24b, 24c Remaining hot water amount sensor 25 Indoor air temperature sensor 26 Heating radiator inlet temperature sensor 27 Heating radiator outlet temperature sensor 28 Heating radiator fan 29a, 29b, 29c Check valve 30 Water supply valve 31 Drain valve 32 Mixing valve 33 Hot water supply terminal 34 Blower 35 Heating release Heater fan control device 201 Hot water supply heat exchanger bypass 202 First heating heat exchanger bypass

Claims (17)

A heat pump circuit in which a compressor, a refrigerant side pipe of a hot water supply heat exchanger, a refrigerant side pipe of a first heating heat exchanger, an expansion valve, and an outdoor heat exchanger are connected in an annular shape, and a refrigerant side pipe of the hot water supply heat exchanger A hot water storage circuit that heats the water in the hot water storage tank flowing in the water-side piping of the hot water supply heat exchanger with the refrigerant flowing through the second heating heat exchanger, the second heating heat exchanger that heats the water in the heating radiator with the hot water in the hot water storage tank, A first heating circuit for heating water in the heating radiator flowing in the water-side pipe of the first heating heat exchanger with a refrigerant flowing in the refrigerant-side pipe of the one heating heat exchanger; and the second heating heat exchanger A heat pump device comprising: a second heating circuit that heats water of the heating radiator flowing in the secondary side pipe of the second heating heat exchanger with hot water of the hot water storage tank flowing in the primary side pipe. The heat pump device according to claim 1, wherein the water side pipe of the first heating heat exchanger and the secondary side pipe of the second heating heat exchanger are connected in parallel. The heat pump apparatus of Claim 1 or 2 provided with the heating flow control apparatus which controls the water flow rate which flows through the water side piping of a 1st heating heat exchanger, and the secondary side piping of a 2nd heating heat exchanger. The heat pump device according to any one of claims 1 to 3, wherein the heating radiator includes a heating radiator fan that supplies room air to the heating radiator. The heat pump device according to claim 4, wherein the number of fan rotations of the heating radiator fan is controlled so that a temperature difference between the heating radiator inlet water temperature and the heating radiator outlet water temperature is within a predetermined range. The heating flow rate control device includes a water side pipe and a second heating heat exchanger in accordance with a heat storage amount of the hot water storage tank and a necessary indoor air heating heat amount necessary for heating the indoor air to the set indoor air temperature. The heat pump device according to any one of claims 3 to 5, wherein a flow rate of water flowing through the secondary side pipe of the heating heat exchanger is controlled. The heat pump device according to claim 6, wherein the heat storage amount of the hot water storage tank is detected by a plurality of temperature sensors installed on the wall surface of the hot water storage tank. The heat pump apparatus according to claim 6 or 7, wherein the required indoor air heating heat quantity is detected by a temperature difference between a current indoor air temperature and a set indoor air temperature. The heating flow control device performs heating operation with the first heating circuit and the second heating circuit when the heat storage amount of the hot water storage tank is equal to or greater than a predetermined heat amount and the required indoor air heating heat amount is equal to or greater than the predetermined heat amount. The heat pump device according to any one of the above. The heating flow control device performs heating operation only with the second heating circuit without using the first heating circuit when the heat storage amount of the hot water storage tank is equal to or greater than the predetermined heat amount and the required indoor air heating heat amount is less than the predetermined heat amount. Item 10. The heat pump device according to any one of Items 1 to 9. The heating flow control device according to any one of claims 1 to 10, wherein when the amount of heat stored in the hot water storage tank is less than a predetermined amount of heat, the heating operation is performed only by the first heating circuit without using the second heating circuit. Heat pump device. The heat pump device according to any one of claims 1 to 11, wherein the heat pump circuit includes a hot water supply heat exchanger bypass that bypasses a refrigerant side pipe of the hot water supply heat exchanger. The heat pump device according to any one of claims 1 to 12, wherein the heat pump circuit includes a first heating heat exchanger bypass that bypasses a refrigerant side pipe of the first heating heat exchanger. The heat pump apparatus according to claim 12, wherein the heat pump circuit opens the hot water supply heat exchanger bypass to bypass the refrigerant side piping of the hot water supply heat exchanger when the operation by the first heating circuit is performed. The heat pump device according to claim 13, wherein the heat pump circuit opens a first heating heat exchanger bypass for bypassing a refrigerant side pipe of the first heating heat exchanger when the hot water storage circuit is operated. The heat pump circuit is a supercritical heat pump cycle in which the refrigerant pressure on the high-pressure side becomes equal to or higher than the critical pressure, and heats water in the water-side piping of the hot water supply heat exchanger with the refrigerant whose pressure is increased to the critical pressure or higher. The heat pump device according to any one of 15. The heat pump apparatus according to claim 16, wherein the refrigerant to be used is carbon dioxide.

Images