JP2005277348A - Pressure bonding equipment and terminal connection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To apply equal pressure on pressure bonding areas of a flexible wiring board by a pressure bonding bar and without damaging workability of the connection process of respective electrode terminals and lead terminals, and prevent displacement of each electrode terminal and lead terminal, thus easily pressure-bonding an electrode terminal to a lead terminal. <P>SOLUTION: A pressure equalizing member 9 has a bag body 10 with a length and size corresponding to the pressure-bonding region of an electrode terminal 7 and a lead terminal 8, and a pressure-equalizing fluid body that is tightly sealed inside the bag body 10, and is in a fluid state when a thermocompression bar 5 is pressed to the flexible wiring board 3. Inside the bag body 10, an equally pressurized fluid body that is 40 to 60% of the total volume of the bag body 10 is tightly sealed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a crimping apparatus and a terminal connection method, and in particular, crimps the electrode terminal and the lead terminal in order to electrically connect the electrode terminal of the optical display panel and the lead terminal of the wiring board via an adhesive. The present invention relates to a crimping device and a terminal connection method using the crimping device.

  Generally, each electrode terminal of a liquid crystal display panel is electrically connected to each lead terminal of a flexible wiring board such as TCP (Tape carrier Package) in order to supply predetermined power to each electrode terminal, Conventionally, a dedicated crimping apparatus has been used to connect each electrode terminal and each lead terminal.

  Such a crimping apparatus has a mounting table on which a liquid crystal display panel and a flexible wiring board are mounted, and a crimping bar is provided above the mounting table so as to be movable up and down.

  In order to connect each electrode terminal of the liquid crystal display panel and each lead terminal of the flexible wiring board, first, the liquid crystal display panel is placed on a mounting table so that each electrode terminal faces upward. Subsequently, a flexible wiring board is placed on each of the electrode terminals while aligning the electrode terminals and the lead terminals via a conductive adhesive such as an anisotropic conductive film (ACF). And the said crimping | compression-bonding bar is lowered | hung and the front end surface is press-contacted to the position corresponded to the crimping | compression-bonding area | region in the upper surface of the said flexible wiring board. Thereby, each electrode terminal and each lead terminal were crimped | bonded via the electrically conductive adhesive material, and the liquid crystal display panel and the flexible wiring board were electrically connected.

  Here, when the crimping bar is lowered and its tip surface is pressed against the upper surface of the flexible wiring board, the crimping bar is lowered while maintaining the parallelism between the tip surface of the crimping bar and the upper surface of the flexible wiring board. High pressure is required to pressurize the upper surface of the flexible wiring board at the front end surface, and much time is required for adjustment to maintain parallelism.

  Therefore, conventionally, when the flexible wiring board is press-contacted by the crimping bar, a cushioning member made of an elastic material such as silicone rubber is disposed between the tip surface of the crimping bar and the upper surface of the flexible wiring board, and the cushioning member The upper surface of the flexible wiring board is pressed by a pressure bar through the wire. Thus, pressure is applied evenly to the upper surface of the flexible wiring board by the crimping bar (see, for example, Patent Document 1).

  However, even when the crimping bar is pressed against the flexible wiring board through the buffer member made of an elastic material as described above, when the inclination of the tip surface of the crimping bar with respect to the upper surface of the flexible wiring board is large, It is difficult to apply pressure evenly to the flexible wiring board. For this reason, it is necessary to adjust the parallelism between the crimping bar and the flexible wiring board, and it takes time to lower the crimping bar while maintaining the parallelism.

  Further, the buffer member made of an elastic material such as silicone rubber has a large stretchability, and therefore, the buffer member expands when pressed by the pressure bar. Further, the flexible wiring board in contact with the buffer member may also be stretched by being pulled by the extension of the buffer member. In such a case, the position of each lead terminal is increased with the extension of the flexible wiring board. As a result of the movement, there is a possibility that a positional deviation between each lead terminal and each electrode terminal of the liquid crystal display panel may occur.

Japanese Patent Laid-Open No. 11-311799

  The present invention has been made in view of these points, and uniformly pressurizes the crimping region of the flexible wiring board with the crimping bar without impairing the workability of the connection process between each electrode terminal and each lead terminal. Provided are a crimping device capable of easily crimping each electrode terminal and each lead terminal by preventing occurrence of displacement between each electrode terminal and each lead terminal, and a terminal connecting method using this crimping device The purpose is to do.

  In order to achieve the above object, the crimping apparatus according to the first aspect of the present invention is characterized in that a lead terminal of a wiring board is overlapped with an electrode terminal of an optical display panel via a conductive adhesive, and the electrode terminal in the wiring board is overlapped. A crimping bar that presses a portion corresponding to a crimping region between the crimping bar and the lead terminal, and a pressure equalizing member that is interposed between the crimping bar and the wiring board during the crimping operation of the crimping bar. The pressure equalizing member has a bag body and a pressure equalizing fluid that is sealed inside the bag body and that is fluid when the pressure-bonding bar is pressed against the flexible wiring board.

  According to the first aspect of the present invention, when the pressure equalizing member comes into contact with the wiring board and pressure is applied to the pressure equalizing member by the pressure bonding bar, the pressure equalizing fluid flows inside the bag body, and the inclination of the pressure bonding bar is increased. Regardless, the internal pressure of the bag is uniform. And since a wiring board is pressurized via the pressure equalizing member with uniform internal pressure, a pressure can be equally applied with respect to the part which a pressure equalizing member contact | abuts.

  A feature of the crimping apparatus according to the invention of claim 2 resides in that 40 to 60% pressure equalizing fluid is sealed inside the bag body with respect to the total capacity of the bag body.

  According to the second aspect of the present invention, when the pressure equalizing member is pressurized, the pressure equalizing fluid is more in the bag body than in the case where the total capacity of the bag body is sealed. It becomes easy to flow. For this reason, the internal pressure of the bag body can be made uniform more quickly, and the pressure from the crimping bar is evenly applied in the crimping region on the upper surface of the wiring board, so that each electrode terminal and each lead terminal are crimped uniformly. be able to.

  According to a third aspect of the present invention, the crimping apparatus is characterized in that the crimping bar is a thermocompression bonding bar for thermocompression bonding the electrode terminal and the lead terminal, and the bag body is the heat applied during the crimping. It has heat resistance with respect to the temperature of the crimping bar.

  According to the third aspect of the present invention, it is possible to extend the life of the buffer member by configuring the bag body with a material having heat resistance with respect to a predetermined temperature of the thermocompression bonding bar at the time of crimping. it can.

  Furthermore, the crimping apparatus according to the invention described in claim 4 is characterized in that the pressure equalizing fluid has high thermal conductivity.

  According to the invention described in claim 4, by using a material having high thermal conductivity at the time of pressure bonding as the pressure equalizing fluid, the heat from the thermocompression bonding bar is conductively bonded through the flexible wiring board through the pressure equalizing member. When transmitting to the material, the conductive adhesive can be heated with less decrease in the temperature heated by the thermocompression bonding bar. Thereby, the low temperature of the heating temperature of a thermocompression-bonding bar can be aimed at.

  A feature of the terminal connection method according to the invention of claim 5 is that the lead terminal of the wiring board is superimposed on the electrode terminal of the optical display panel via a conductive adhesive, and the pressure equalizing member is placed on the wiring board. A terminal connection method in which the pressure equalizing member is sealed inside the bag body and the bag body and presses the crimp bar against the wiring board. The pressure equalizing fluid.

  According to the fifth aspect of the present invention, when the pressure equalizing member abuts against the wiring board and pressure is applied to the pressure equalizing member by the pressure bonding bar, the pressure equalizing fluid flows inside the bag body, and the inclination of the pressure bonding bar is increased. Regardless, the internal pressure of the bag is uniform. And since a wiring board is pressurized via the pressure equalizing member with uniform internal pressure, a pressure can be equally applied with respect to the part which a pressure equalizing member contact | abuts.

  As described above, according to the crimping apparatus and the terminal connection method according to the present invention, pressure from the crimping bar can be applied evenly in the crimping region on the upper surface of the flexible wiring board regardless of the inclination of the crimping bar. Each electrode terminal and each lead terminal can be crimped uniformly and easily. In addition, it is not necessary to lower the crimping bar while adjusting the parallelism between the tip end surface of the crimping bar and the upper surface of the flexible wiring board, so that advanced technology is not required for the crimping operation and the time required for the crimping operation is shortened. As a result, the working efficiency can be greatly improved.

  Hereinafter, an embodiment of a crimping apparatus according to the present invention will be described with reference to FIGS. 1 to 3.

  FIG. 1 is a schematic side view showing the crimping apparatus according to the present embodiment, and FIG. 2 is a schematic side view showing the case where the crimping apparatus of FIG. 1 is viewed from the A direction.

  As shown in FIGS. 1 and 2, a mounting table 4 on which a liquid crystal display panel 2 and a flexible wiring board 3 are mounted is provided at the lower part of the crimping apparatus 1.

  Above the mounting table 4, a thermocompression bar 5 is provided so as to be movable up and down, and a heater (not shown) for heating the thermocompression bar 5 to a predetermined temperature is provided in the vicinity of the thermocompression bar 5. ing.

  The thermocompression bonding bar 5 has a plurality of electrode terminals 7 provided in alignment with the liquid crystal display panel 2 mounted on the mounting table 4 and a plurality of electrode terminals 7 provided in alignment with the flexible wiring board 3. It arrange | positions so that the crimping | compression-bonding area | region with the lead terminal 8 may be opposed, and when it descend | falls, the upper surface of the flexible wiring board 3 and the part corresponded to the said crimping | compression-bonding area will be pressed.

  A pressure equalizing member 9 is applied to the front end portion of the thermocompression bonding bar 5 so as to apply pressure evenly to the entire crimping region on the upper surface of the flexible wiring board 3 by the front end surface of the thermocompression bonding bar 5.

  The pressure equalizing member 9 has a tube-like bag body 10 having a length corresponding to the pressure-bonding region, and the bag body 10 has heat resistance against a predetermined temperature applied to the thermocompression-bonding bar 5. It is comprised by the film etc. which have. The bag body 10 preferably has low stretchability, and for example, a liquid crystal polymer film having a thickness of 10 to 50 μm, a wholly aromatic polyester film, or the like is used. And the said bag body 10 is sealed by the clip 12 at both ends, and the inside is sealed.

  The pressure equalizing fluid that is fluid when the thermocompression bonding bar 5 is pressed against the flexible wiring board 3 is sealed inside the bag body 10 so that air does not enter. Is enclosed by about 40 to 60% with respect to the total capacity of the bag body 10.

  In the present embodiment, since each electrode terminal 7 and each lead terminal 8 are pressed while being heated, the pressure equalizing fluid is fluid at a predetermined temperature heated by the thermocompression bonding bar 5. It is preferable that the thermal conductivity is good and the volatility is low. As the pressure equalizing fluid, for example, mercury having a boiling point of 360 ° C., and solder when the predetermined temperature is 180 ° C. or higher may be used.

  Furthermore, in the crimping apparatus 1 that crimps the electrode terminals 7 and the lead terminals 8 without applying heat, if the pressure equalization fluid is fluid at room temperature, the thermal conductivity and volatility are low. For example, silicone oil having a low thermal conductivity but liquid at room temperature may be used. The pressure equalizing fluid is not limited to the liquid as described above, and may be a gas such as air, or may be composed of a liquid and a gas.

  Next, a terminal connection method using the present crimping apparatus will be described.

  First, the liquid crystal display panel 2 was placed on the top surface of the mounting table 4 such that each electrode terminal 7 faced upward, and conductive particles were contained in each thermosetting resin as a conductive adhesive on each electrode terminal 7. ACF11 is arranged. In addition, when each electrode terminal 7 and each lead terminal 8 are pressure-bonded without heating, an anisotropic conductive material containing conductive particles in, for example, an ultraviolet curable resin is used as the conductive adhesive.

  Next, the flexible wiring board 3 is positioned on the liquid crystal display panel 2 via the ACF 11 so that the electrode terminals 7 and the lead terminals 8 are aligned so that the electrode terminals 7 and the lead terminals 8 face each other. Place it.

  Subsequently, the thermocompression bonding bar 5 is heated to a predetermined temperature by a heater, and the heat of the thermocompression bonding bar 5 is transmitted so that the pressure equalizing member 9 is also heated to the same temperature as the thermocompression bonding bar 5.

  Then, as shown in FIG. 3, the thermocompression bonding bar 5 is lowered to the crimping region on the upper surface of the flexible wiring board 3, and the upper surface of the flexible wiring board 3 is pressed by the thermocompression bonding bar 5 via the pressure equalizing member 9.

  At this time, when the pressure equalizing member 9 comes into contact with the upper surface of the flexible wiring board 3 in the crimping operation of the thermocompression bonding bar 5, pressure is applied from the thermocompression bonding bar 5 to the pressure equalizing member 9, and the pressure inside the bag body 10 increases. Thus, the pressure from the thermocompression bonding bar 5 is transmitted to the upper surface of the flexible wiring board 3. At this time, since the pressure equalizing fluid is a fluid at the time of pressure bonding, when the pressure is applied to the pressure equalizing member 9, the pressure equalizing fluid flows inside the bag body 10 and the bag body regardless of the inclination of the thermocompression bonding bar 5. The internal pressure of 10 becomes uniform. Since the pressure is applied to the flexible wiring board 3 through the pressure equalizing member 9 having a uniform internal pressure, the pressure is evenly applied to the portion where the pressure equalizing member 9 abuts, that is, on the upper surface of the flexible wiring board 3. In the crimping region, the pressure from the thermocompression bar 5 is evenly applied.

  Then, the ACF 11 is cured by pressing the electrode terminals 7 and the lead terminals 8 with the thermocompression bonding bar 5 through the pressure equalizing member 9 to cure the electrode terminals 7 and the lead terminals 8. Thereby, the liquid crystal display panel 2 and the flexible wiring board 3 are electrically connected.

  According to the present embodiment, the pressure equalizing fluid contained in the bag body 10 of the pressure equalizing member 9 is a fluid at the time of pressure bonding, and the pressure equalizing member 9 contacts the flexible wiring board 3 and is equalized by the thermocompression bonding bar 5. When pressure is applied to the pressure member 9, the equalized fluid flows inside the bag body 10, and the internal pressure of the bag body 10 becomes uniform regardless of the inclination of the thermocompression bonding bar 5. Since the flexible wiring board 3 is pressed through the pressure equalizing member 9 having a uniform internal pressure, it is possible to apply pressure evenly to the portion where the pressure equalizing member 9 abuts.

  Therefore, since the pressure from the thermocompression bonding bar 5 can be applied uniformly in the crimping region on the upper surface of the flexible wiring board 3 regardless of the inclination of the thermocompression bonding bar 5, each electrode terminal 7 and each lead terminal can be uniformly and easily applied. 8 can be crimped together. In addition, since it is not necessary to lower the thermocompression bonding bar 5 while adjusting the parallelism between the front end surface of the thermocompression bonding bar 5 and the upper surface of the flexible wiring board 3, no high technology is required for the crimping operation. The working time can be shortened, and the working efficiency can be greatly improved.

  Further, since the pressure equalizing fluid of 40 to 60% of the total capacity is enclosed inside the bag body 10, when the pressure equalizing member 9 is pressurized, the pressure equalizing fluid is the total of the bag body 10. Compared with the case where the capacity is filled, the bag body 10 can flow more easily. For this reason, the internal pressure of the bag body 10 can be made even more easily and quickly, and the pressure from the thermocompression bonding bar 5 is equalized in the crimping region on the upper surface of the flexible wiring board 3 regardless of the inclination of the thermocompression bonding bar 5. In addition, each electrode terminal 7 and each lead terminal 8 can be crimped more uniformly.

  Furthermore, since the bag body 10 of the pressure equalizing member 9 has low stretchability, the expansion of the bag body 10 can be reduced even when the pressure equalizing member 9 is pressed against the upper surface of the flexible wiring board 3. It is possible to prevent the flexible wiring board 3 that is in contact with the member 9 from extending, thereby preventing misalignment between each electrode terminal 7 and each lead terminal 8 and more precisely each electrode terminal 7. And the respective lead terminals 8 can be crimped, and as a result, the crimping of the narrow pitch electrode terminals 7 and the lead terminals 8 can be handled.

  Furthermore, the life of the pressure equalizing member 9 can be extended by configuring the bag 10 with a material having heat resistance with respect to a predetermined temperature of the thermocompression bonding bar 5 at the time of crimping.

  Further, by using a material having high thermal conductivity at the time of pressure bonding as the pressure equalizing fluid, when the heat from the thermocompression bonding bar 5 is transmitted to the ACF 11 through the flexible wiring board 3 through the pressure equalizing member 9, the pressure bonding bar 5 The ACF 11 can be heated by reducing a decrease in the temperature of the heat. Thereby, the low temperature of the heating temperature of the crimping | compression-bonding bar 5 can be aimed at.

  In addition, this invention is not limited to the said embodiment, A various change is possible as needed.

  For example, in the present embodiment, the pressure equalizing member 9 is fixed to the front end portion of the thermocompression bonding bar 5, but is not limited to this, and the pressure equalizing member is interlocked with the lowering operation of the thermocompression bonding bar 5. 9 may be interposed between the front end surface of the thermocompression bonding bar 5 and the flexible wiring board 3, and the pressure equalizing member 9 may be crimped on the upper surface of the flexible wiring board 3 before the lowering operation. You may make it mount in an area | region.

  Furthermore, although the liquid crystal display panel was illustrated as an optical display panel, optical display panels, such as an organic EL display panel and a plasma display panel, may be sufficient.

The typical side view showing one embodiment of the crimping device concerning the present invention. 1 is a schematic side view showing a case where the crimping apparatus of FIG. 1 is viewed from the A direction. 1 is a schematic side view showing a process of pressing the upper surface of a flexible wiring board in the crimping apparatus of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Crimping device 2 Liquid crystal display panel 3 Flexible wiring board 5 Thermocompression bonding bar 7 Electrode terminal 8 Lead terminal 9 Pressure equalizing member 10 Bag body

Claims (5)

A pressure bar that overlaps a lead terminal of the wiring board on an electrode terminal of the optical display panel via a conductive adhesive, and presses a portion corresponding to a pressure-bonding region between the electrode terminal and the lead terminal on the wiring board; A crimping device having a pressure equalizing member interposed between the crimping bar and the wiring board during the crimping operation of
The pressure equalizing member includes a bag body, and a pressure equalizing fluid that is sealed inside the bag body and is fluid when the pressure bonding bar is pressed against the wiring board. .   The pressure bonding apparatus according to claim 1, wherein a pressure equalizing fluid of 40 to 60% is sealed inside the bag body with respect to a total capacity of the bag body.   The said crimping bar is a thermocompression-bonding bar for thermocompression-bonding the said electrode terminal and the said lead terminal, The said bag body has heat resistance with respect to the temperature of the said thermocompression-bonding bar at the time of crimping | compression-bonding. 2. The crimping apparatus according to 2.   The pressure bonding apparatus according to any one of claims 1 to 3, wherein the pressure equalizing fluid has high thermal conductivity. It is a terminal connection method in which a lead terminal of a wiring board is superimposed on an electrode terminal of an optical display panel via a conductive adhesive, and pressed by a crimping bar via a pressure equalizing member from above the wiring board,
The terminal connection, wherein the pressure equalizing member includes a bag and a pressure equalizing fluid that is sealed inside the bag and is fluid when pressing the crimping bar against the wiring board. Method.