JP2005257848A - Thermal transfer sheet, light shielding substrate, color filter and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermal transfer sheet for forming a light shielding layer excellent in solvent resistance, a light shielding substrate having the light shielding layer excellent in solvent resistance, a color filter having the light shielding layer by which chipping is hardly produced in a pattern and its manufacturing method. <P>SOLUTION: The thermal transfer sheet 40 has a transferring layer 2' containing a light shielding material, a binder resin and a silane coupling agent on one surface of a base material 41 for the thermal transfer sheet. The thermal transfer sheet 40 is made of an epoxy resin in which a binder resin has two or more epoxy groups in a molecule, preferably the transferring layer 2' further contains a hardening agent having a functional group with reactivity with the epoxy group and more preferably the silane coupling agent has the epoxy group. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a thermal transfer sheet, a light-shielding substrate, a color filter, and a method for manufacturing the same, and more particularly to a thermal transfer sheet that is preferably used for manufacturing a color filter.

  In recent years, color liquid crystal display devices including a liquid crystal display panel have been rapidly spread. FIG. 6 is a cross-sectional view showing an example of a simple matrix driving type liquid crystal panel 100 used in a general color liquid crystal display device. As shown in FIG. 6, the liquid crystal panel 100 is provided with a gap portion 10 of about 1 to 10 μm facing a color filter 30 and a counter substrate 50 such as a TFT substrate in which a pattern electrode 8 is provided on a glass substrate 11. The gap 10 is filled with a liquid crystal compound. Further, in the liquid crystal panel 100, the pearls 7 having a constant particle diameter as shown in FIG. 6A are dispersed in the gap 10 so that the cell gap between the color filter 30 and the counter substrate 50 is constant and uniform. Further, a sealing material 9 is provided so as to surround the edge portions of the color filter 30 and the counter substrate 50, and the liquid crystal compound filled in the gap 10 is sealed.

  As the color filter 30, as shown in FIG. 6, a light shielding layer 2 (generally referred to as a black matrix) formed on a glass substrate 1 in a predetermined pattern for shielding a boundary portion between pixels. A structure in which a plurality of colors (usually, three primary colors of red (R), green (G), and blue (B) light) are arranged in a predetermined order to form each pixel is formed. What you have is used. Further, as recent color filters 30, the protective film 4 and the transparent electrode film 5 are provided on the colored layer 3 in this order from the side close to the glass substrate 1, or the gap portion 10 is filled. In some cases, an alignment film 6 is provided on the surface in contact with the liquid crystal compound. Further, as shown in FIG. 6B, the color filter 30 overlaps with the position where the light shielding layer 2 is formed on the inner surface of the color filter 30 instead of the pearl 7 being dispersed in the gap 10. Some regions have columnar spacers 7 'having a height corresponding to the cell gap.

  Since the light shielding layer 2 included in the color filter 30 has a role of absorbing external light and improving the contrast of the liquid crystal display, a good light shielding property is required. Further, in the manufacturing process of the color filter 30, after the light shielding layer 2 is formed on the glass substrate 1, the colored layer coating liquid, the protective film coating liquid, or the alignment film coating liquid is formed on the light shielding layer 2. Or the glass substrate 1 is washed with a cleaning liquid (for example, isopropyl alcohol, γ-butyllactone, N-methyl-pyrrolidone, propylene glycol monomethyl ether acetate, warm pure water, etc.). Solvent property is required.

  Such a light shielding layer 2 is generally formed by an etching method. Formation of the light shielding layer 2 by the etching method is performed by applying a coating liquid containing a light shielding material and a binder resin on the glass substrate 1 and forming a pattern using photolithography. Usually, in order to improve the light shielding property of the light shielding layer 2 which is a thin film, the content of the light shielding material needs to be relatively large. However, since light (for example, ultraviolet rays) used in photolithography hardly penetrates into a resin having a high content of the light shielding material, it is difficult to obtain the light shielding layer 2 according to the pattern. On the other hand, when the content of the light shielding material is reduced in order to obtain the light shielding layer 2 according to the pattern, there is a problem that the light shielding property of the light shielding layer 2 is lowered.

In order to solve such a problem, it has been proposed to use a transfer method for forming the light shielding layer 2 (see, for example, Patent Document 1). The transfer method uses a thermal transfer sheet having an entire solid layer (hereinafter referred to as a transfer layer) made of a light-shielding material and a binder resin for transferring the light-shielding layer 2, and the surface of the thermal transfer sheet on the transfer layer side. Is brought into contact with the glass substrate 1, and heat is applied to the thermal transfer sheet by irradiating a laser beam or the like in accordance with a pattern corresponding to the formation pattern of the light shielding layer 2, and the transfer layer is melted to form a molten transfer layer. In this method, the light shielding layer 2 is formed by being transferred onto the glass substrate 1. Here, “melting” means that a solid substance is softened and deformed by heating. According to this method, it is easy to form the light shielding layer 2 according to a desired pattern without reducing the light shielding property. Such a transfer method has been used in the formation of the colored layer 3 (see, for example, Patent Documents 2 and 3).
Special table 2003-502585 gazette JP-A-7-104113 JP-A-10-206625

  However, generally, since the light shielding layer is formed of an organic material such as a binder resin, the adhesiveness with a glass substrate formed of an inorganic material is low. In particular, in the etching method, a coating film serving as a light-shielding layer is formed on a glass substrate by applying a liquid coating solution, whereas in the transfer method, a molten semi-solid transfer layer is formed on a glass substrate. Transfer onto the material. Therefore, the wettability between the melted transfer layer and the glass substrate in the transfer method is lower than the wettability between the coating liquid and the glass substrate in the etching method. Therefore, the light shielding layer formed by the transfer method has lower adhesion to the glass substrate than the light shielding layer formed by the etching method.

  As a result, in the color filter manufacturing process, when the light shielding layer is formed on the glass substrate by the transfer method, the glass substrate is washed with a cleaning solution or a colored layer coating solution or the like is formed on the light shielding layer. When applied, the light shielding layer is easily peeled off, and there is a problem that a pattern is easily lost in the light shielding layer of the obtained color filter.

  The present invention has been made to solve the above-mentioned problems, and a first object of the present invention is to provide a thermal transfer sheet for forming a light-shielding layer having excellent solvent resistance. A second object of the present invention is to provide a light shielding substrate having a light shielding layer excellent in solvent resistance. A third object of the present invention is to provide a color filter having a light-shielding layer that is less prone to pattern chipping. A fourth object of the present invention is to provide a method for producing a color filter having a light-shielding layer that hardly causes pattern chipping.

  The thermal transfer sheet of the present invention for achieving the first object has a transfer layer containing a light-shielding material, a binder resin, and a silane coupling agent on one side of a base material for a thermal transfer sheet ( Hereinafter, this thermal transfer sheet may be referred to as “thermal transfer sheet I”).

  According to the present invention, since the transfer layer contains a silane coupling agent having a functional group showing compatibility with organic matter and a functional group showing reactivity with inorganic matter, the transfer system using this thermal transfer sheet I When the light shielding layer is formed by this, the organic transfer layer melted by the heat at the time of transfer and the inorganic glass substrate are easily bonded. As a result, the light-shielding layer formed using this thermal transfer sheet I has high adhesion to the glass substrate and improves solvent resistance.

  The thermal transfer sheet of the present invention is the above thermal transfer sheet I, wherein the binder resin is an epoxy resin having two or more epoxy groups in one molecule, and the transfer layer has a functional group having reactivity with the epoxy group. It is preferable to further contain a cured agent (hereinafter, this thermal transfer sheet may be referred to as “thermal transfer sheet II”).

  According to this invention, since the transfer layer contains an epoxy resin and its curing agent, the transfer layer is transferred to the glass substrate using the thermal transfer sheet II, and then the light blocking layer is formed. Can be cured to form a strong layer. As a result, the light-shielding layer formed using this thermal transfer sheet II has improved solvent resistance and heat resistance.

  In the thermal transfer sheet of the present invention, in the thermal transfer sheet II described above, the silane coupling agent preferably has an epoxy group (hereinafter, this thermal transfer sheet may be referred to as “thermal transfer sheet III”).

  According to this invention, since the transfer layer contains the epoxy resin as the binder resin and the silane coupling agent having an epoxy group, the compatibility between the binder resin and the silane coupling agent is improved. As a result, the light-shielding layer formed using this thermal transfer sheet III has higher adhesion to the glass substrate and further improves solvent resistance.

  In the thermal transfer sheet of the present invention, in the thermal transfer sheets I to III, the light-shielding material is preferably carbon black or titanium black.

  The light-shielding substrate of the present invention for achieving the second object is a light-shielding substrate in which a light-shielding layer having a predetermined pattern is provided on one side of a glass substrate, and the light-shielding layer comprises a light-shielding material and a binder. A resin and a silane coupling agent are included (hereinafter, this light shielding substrate may be referred to as “light shielding substrate I”).

  According to the present invention, since the silane coupling agent is contained in the light shielding layer, the adhesion between the organic light shielding layer and the inorganic glass substrate is improved. As a result, it has excellent solvent resistance, and even if it is later washed with a washing solution or a colored layer coating solution is applied, the light shielding layer is hardly peeled off from the glass substrate.

  In the light-shielding substrate of the present invention, in the light-shielding substrate I, it is preferable that the binder resin is an epoxy resin having two or more epoxy groups in one molecule, and the epoxy resin is cured by a curing agent ( Hereinafter, this light shielding substrate may be referred to as “light shielding substrate II”).

  In the light-shielding substrate of the present invention, in the light-shielding substrate II, the silane coupling agent preferably has an epoxy group (hereinafter, this light-shielding substrate may be referred to as “light-shielding substrate III”).

  The color filter of the present invention for achieving the third object is a color filter having the light shielding substrates I to III described above, wherein the light shielding layer has an opening, and the opening of the light shielding layer is colored. A layer is provided.

  The method for producing a color filter of the present invention for achieving the fourth object is a method for producing a color filter in which a light shielding layer and a colored layer are sequentially formed in a predetermined pattern on a glass substrate, and a thermal transfer sheet A step of preparing a thermal transfer sheet having a transfer layer containing a light-shielding material, a binder resin, and a silane coupling agent on one side of the substrate, and contact for bringing the transfer layer of the thermal transfer sheet and the glass substrate into contact with each other According to a step and a pattern corresponding to the predetermined pattern of the light shielding layer, the heat transfer sheet is heated from the substrate side for the thermal transfer sheet to transfer the transfer layer onto the glass substrate to form a light shielding layer. A heat transfer step, a peeling step for peeling the thermal transfer sheet from the glass substrate, and a predetermined pattern on the surface of the glass substrate on the side where the light shielding layer is formed. Characterized in that it comprises a colored layer forming step of forming the colored layer of the emission (hereinafter, this production method may be referred to as "production method I".).

  The color filter manufacturing method of the present invention is the above color filter manufacturing method I, wherein the binder resin is an epoxy resin having two or more epoxy groups in one molecule, and the transfer layer reacts with an epoxy group. It is preferable to further include a curing step of curing the light-shielding layer by heating the light-shielding layer after the peeling step (hereinafter referred to as “this production method”). Sometimes referred to as “Production Method II”).

  In the method for producing a color filter of the present invention, in the above-described color filter production method II, the silane coupling agent preferably has an epoxy group (hereinafter, this production method may be referred to as “production method III”). ).

  The method for producing a color filter of the present invention is the above color filter production methods I to III, wherein (a) the light-shielding material is carbon black or titanium black, and (b) heating in the heat transfer step, It is preferably performed by laser light irradiation.

  According to the thermal transfer sheet of the present invention, it is possible to form a light shielding layer having high adhesion to a glass substrate and excellent solvent resistance.

  According to the light shielding substrate of the present invention, the solvent resistance of the light shielding layer is improved. As a result, this light-shielding substrate is unlikely to be peeled off even when a coating liquid is applied or washed with a cleaning liquid in a process (colored layer forming process or the like) for manufacturing a color filter to be applied later. .

  According to the color filter of the present invention, the solvent resistance of the light shielding layer is improved, and the pattern is not easily chipped in the light shielding layer.

  According to the method for producing a color filter of the present invention, it is possible to form a light-shielding layer which is excellent in solvent resistance and hardly causes pattern chipping.

  Hereinafter, the thermal transfer sheet, the light-shielding substrate, the color filter, and the manufacturing method thereof according to the present invention will be described in detail with reference to the drawings.

  As shown in FIG. 1, the light shielding substrate 20 of the present invention has a structure in which a light shielding layer 2 having a predetermined pattern is formed on a glass substrate 1. In addition, as shown in FIG. 2, the color filter 30 of the present invention has a plurality of colors (usually red (R), green (G), blue (B ), A colored layer 3 in which the three primary colors of light) are arranged in a predetermined order. The light shielding layer 2 is disposed so as to surround the colored layer 3 forming each pixel in order to shield the boundary between the pixels. Hereinafter, configurations of the light shielding substrate 20 and the color filter 30 will be described.

(Glass substrate)
As a material of the glass substrate 1, glass made of various inorganic substances can be used. For example, silicate glass, phosphate glass, borate glass, quartz glass, and the like can be used. The glass substrate 1 preferably has a degree of transparency that is normally required for a color filter substrate. The thickness of the glass substrate 1 is usually 0.1 to 5.0 mm.

(Light shielding layer)
The light shielding layer 2 is provided at the boundary between the pixels on the glass substrate 1 and has a function of absorbing external light and improving the contrast of the liquid crystal display. The light-shielding substrate 20 of the present invention and the light-shielding layer 2 of the color filter 30 use a thermal transfer sheet 40 having a solid transfer layer 2 'on one side of a thermal transfer sheet base 41 as shown in FIG. It is formed by transferring the transfer layer 2 ′ onto the pattern 1.

  FIG. 4 is a plan view showing an example of the light shielding substrate 20 on which the light shielding layer 2 is formed in a pattern. The illustrated light shielding layer 2 is formed at one corner of a color filter used in an active matrix driving type liquid crystal panel, and is a straight line provided so as to surround a portion 3 ′ for forming the colored layer 3. It is formed with a lattice pattern. The light shielding layer 2 has a large number of regions 2a protruding from the intersections of the straight lines forming the lattice pattern in order to prevent light degradation of the active element. Moreover, the pattern outer peripheral part of the light shielding layer 2 is thicker than the line width inside the pattern of the light shielding layer 2 (parts other than the pattern outer peripheral part) in order to prevent external light from entering from the edge of the liquid crystal display. . In addition, the alignment mark 35 may be formed in the site | part in which the light shielding layer 2 and the colored layer 3 of the glass base material 1 are not formed. The alignment mark 35 is a mark serving as a reference for forming the colored layer 3 and the like at an appropriate position on the glass substrate 1.

  FIG. 5 is a process diagram showing an example of the formation process of the light shielding layer 2. The light shielding layer 2 includes a contact step (FIG. 5A) in which the surface of the thermal transfer sheet 40 on the transfer layer 2 ′ side and the glass substrate 1 are in contact with each other, and the thermal transfer sheet 40 from the thermal transfer sheet substrate 41 side to the light shielding layer. The heating transfer step (FIG. 5B) for transferring the transfer layer 2 ′ onto the glass substrate 1 by heating according to the pattern according to the pattern 2 and the thermal transfer sheet 40 and the glass substrate 1 are peeled off. It is formed by the peeling step (FIG. 5C). Moreover, the formation process of this light shielding layer 2 may include the hardening process (FIG.5 (D)) which hardens the light shielding layer 2 as needed after a peeling process. In addition, the arrow of FIG. 5 (B) shows a mode that the thermal transfer sheet 40 is heated according to the pattern. Hereinafter, the thermal transfer sheet, the contact process, the heat transfer process, and the curing process will be described in detail.

(1) Thermal transfer sheet:
As shown in FIG. 3, the thermal transfer sheet 40 of the present invention is a sheet in which a solid transfer layer 2 ′ is uniformly formed on a thermal transfer sheet substrate 41. In the thermal transfer sheet 40, as shown in FIG. 3B, a photothermal conversion layer 42 that absorbs light and converts heat may be provided between the thermal transfer sheet substrate 41 and the transfer layer 2 ′. . Further, as shown in FIG. 3B, a release layer 43 may be provided under the transfer layer 2 ′ for the purpose of improving the transferability of the transfer layer 2 ′. Further, for the same purpose, a release layer may be provided under the transfer layer 2 ′ instead of the release layer 43.

  Examples of the thermal transfer sheet substrate 41 include a polyester film, a polyethylene terephthalate film, a polyethylene naphthalate film, and a polyarylate film. When using the photothermal conversion method using laser light in the heat transfer step, the heat transfer sheet base material 41 preferably has a light transmittance at the laser wavelength of the laser light of 60% or more, more preferably 80% or more. preferable.

  The thickness of the thermal transfer sheet substrate 41 is preferably 3 to 200 μm, and more preferably 50 to 125 μm. When the thickness of the thermal transfer sheet substrate 41 is less than 3 μm, the adhesion to the glass substrate 1 is deteriorated when the vacuum contact method is used in the contact step, and the transfer sensitivity is lowered. Moreover, when the thickness of the base material 41 for thermal transfer sheets exceeds 200 micrometers, the conveyance property of the base material 41 for thermal transfer sheets will worsen. When the photothermal conversion layer 42 or the release layer 43 is provided on the thermal transfer sheet 40, it is preferable that the surface of the thermal transfer sheet base material 41 is subjected to an easy adhesion treatment or a corona treatment. By performing such treatment, the adhesion between the thermal transfer sheet substrate 41 and the adjacent photothermal conversion layer 42 or release layer 43 is improved, and the transferability of the transfer layer 2 'is improved.

  The transfer layer 2 ′ is a layer that is transferred to the glass substrate 1 and becomes the light shielding layer 2 by being heated and melted in accordance with the pattern of the light shielding layer 2 in the production of the light shielding substrate 20 and the color filter 30. It is. The transfer layer 2 ′ of the thermal transfer sheet 40 of the present invention is mainly formed of a light shielding material and a binder containing a binder resin and a silane coupling agent.

  As the light-shielding material, inorganic particles such as carbon black and titanium black are preferably used. Carbon black and titanium black are both light-shielding materials and infrared-absorbing materials that absorb laser beams. Therefore, when using the photothermal conversion method with laser beams in the heat transfer process, they absorb laser beams well and efficiently. Heat conversion is possible. Therefore, the transfer layer 2 ′ formed using such a material is efficiently melted even if the photothermal conversion layer 42 is not provided on the thermal transfer sheet 40. The particle size of the light shielding material is preferably 0.01 to 1.0 μm, and more preferably 0.03 to 0.3 μm.

  The binder is mainly composed of a binder resin and a silane coupling agent.

  As the binder resin, a resin that melts by heat is used. As such a resin, not only a thermoplastic resin but also an uncured curable resin can be used, and among them, an uncured curable resin is preferably used. When the binder includes an uncured curable resin, the light shielding layer 2 can be made a strong layer by curing the light shielding layer 2 formed by melting and transferring the transfer layer 2 ′. Therefore, the solvent resistance of the light shielding layer 2 is improved. Moreover, since the heat resistance of the light shielding layer 2 is improved by the light shielding layer 2 becoming a strong layer, for example, in the manufacturing process of the color filter 30, the glass substrate 1 is heated when the transparent electrode 5 is formed and fired. However, the light shielding layer 2 is difficult to peel off.

  Examples of the thermoplastic resin include polyester resin, acrylic resin, styrene-acrylic copolymer resin, polyarylate resin, chlorinated polypropylene resin, polycarbonate resin, polyamideimide resin, polyvinyl butyral resin, polyvinyl acetal resin, and the like, or these A mixture, these copolymer resins, these modified resins are mentioned.

  Examples of the uncured curable resin include an uncured thermosetting resin and an uncured ionizing radiation curable resin. Here, the thermosetting resin is a resin that has a reactive functional group and is cured by heating in the presence of a curing agent. The ionizing radiation curable resin is a resin composed of a polyfunctional monomer and an oligomer and cured by irradiation with ionizing radiation such as ultraviolet rays and electron beams.

  Examples of the thermosetting resin include an epoxy resin, a thermosetting acrylic resin, and a urethane resin, and it is preferable to use an epoxy resin. The epoxy resin is a resin having two or more epoxy groups in one molecule, and the epoxy group here may be a structure having an oxirane ring structure, for example, a glycidyl group, an oxyethylene group, an epoxycyclohexyl group. Etc.

  As the epoxy resin, an epoxy polymer compound such as a polymer or copolymer of a monomer having an epoxy group, or a copolymer of at least one monomer having an epoxy group and a monomer having no epoxy group is used. Can be mentioned.

  Specific examples of the monomer having an epoxy group include glycidyl acrylate, glycidyl methacrylate, acrylic glycidyl ether, 4-vinylcyclohexane monoepoxide, and the like. Specific examples of the monomer having no epoxy group include styrene, vinyl toluene, ethylene, t-butyl styrene, methyl methacrylate, methyl acrylate, ethyl methacrylate, ethyl acrylate, hexyl methacrylate, hexyl acrylate, cyclohexyl acrylate, cyclohexyl methacrylate, para -T-butylcyclohexyl methacrylate, dicyclopentenyl methacrylate, stearyl acrylate, acrylonitrile, methacrylonitrile, divinylbenzene, N.I. N-methylenebis (acrylamide), ethylene diacrylate, ethylene dimethacrylate and the like can be mentioned. The polymerization ratio of the monomer having an epoxy group and the monomer having no epoxy group (a monomer having an epoxy group / a monomer having no epoxy group) is 1/9 to 9/1 in terms of a weight ratio when each monomer is charged. It is preferable that it exists in the range.

  The epoxy resin is preferably a resin in which the epoxy polymer compound exemplified above is mixed with an epoxy skeleton resin having two or more epoxy groups in one molecule. When such an epoxy-based skeleton resin is mixed with the above-described epoxy-based polymer compound, the crosslinking density of the epoxy resin is increased, and the solvent resistance and heat resistance of the light shielding layer 2 are improved. Examples of such epoxy skeleton resins include bisphenol A type epoxy resin, bisphenol F type epoxy resin, brominated bisphenol A type epoxy resin, bisphenol S type epoxy resin, diphenyl ether type epoxy resin, hydroquinone type epoxy resin, and naphthalene type epoxy. Resin, biphenyl type epoxy resin, fluorene type epoxy resin, phenol novolak type epoxy resin, orthocresol novolak type epoxy resin, trishydroxyphenylmethane type epoxy resin, trifunctional type epoxy resin, tetraphenylolethane type epoxy resin, dicyclopentadiene Phenol type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol A nucleated polyol type epoxy resin, polypropylene glycol type epoxy resin , Mention may be made of glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, glyoxal type epoxy resin, alicyclic epoxy resin, a heterocyclic epoxy resin or the like.

  In the case of using an epoxy-based polymer compound mixed with an epoxy-based polymer compound, the weight ratio (epoxy polymer compound / epoxy-based resin) is preferably 20/1 to 1/20. When the mixing ratio of the epoxy polymer compound is increased within this range, the transfer layer 2 ′ is easily melted and the transfer property of the transfer layer 2 ′ can be improved. Further, when the mixing ratio of the epoxy skeleton resin is increased, the crosslink density of the light shielding layer 2 is improved, and the solvent resistance and heat resistance of the light shielding layer 2 can be increased.

  Such an epoxy resin has two or more epoxy groups in one molecule. When the number of epoxy groups in one molecule is 2 or more, the epoxy resin is sufficiently crosslinked, and the solvent resistance and heat resistance of the light shielding layer 2 are improved. The upper limit of the number of epoxy groups in one molecule is appropriately set to such an extent that the obtained light shielding layer 2 does not shrink too much due to curing.

  The softening point of the binder resin is preferably in the range of 50 ° C. or higher and 150 ° C. or lower, and more preferably in the range of 60 ° C. or higher and 120 ° C. or lower. When the softening point of the binder resin is lower than 50 ° C., the adhesiveness of the transfer layer 2 ′ increases, blocking occurs during storage of the thermal transfer sheet 40, and the storage stability of the thermal transfer sheet 40 decreases, and the transfer layer 2 ′ When the is transferred, background stains, black defects, etc. are likely to occur on the glass substrate 1. On the other hand, when the softening point of the binder resin is higher than 150 ° C., the transfer sensitivity of the transfer layer 2 ′ is lowered because it is difficult to be melted by heat during the heat transfer process. The softening point here is measured according to JIS-K7196-1991 using a thermomechanical analyzer (manufactured by Rigaku Corporation, model number: TMA8310).

  The binder resin preferably has a weight average molecular weight in the range of 3000 to 100,000, and particularly preferably in the range of 5000 to 20000. If the weight average molecular weight of the binder resin is less than 3000, the coating film strength becomes weak, so that blocking is likely to occur during storage of the thermal transfer sheet 40. Is likely to occur. On the other hand, when the weight average molecular weight of the binder resin is larger than 100,000, the coating strength is increased, so that the transferability is deteriorated.

A silane coupling agent is a compound generally represented by a chemical formula of X—Si (OR) ₃ , and has an alkoxysilyl group (—OR group) that reacts with an organic functional group (—X group) and an inorganic substance in the molecule. . The -X group of the silane coupling agent is a functional group that is compatible with the binder resin of the organic transfer layer 2 '. For example, epoxy group, amino group, vinyl group, styryl group, methacryloxy group, acryloxy group, mercapto group Group, sulfide group and the like. The —OR group is a functional group that hydrolyzes to form a silanol group and hydrogen bonds or dehydrates and condenses with the hydroxyl group present on the glass substrate 1. Examples of the —OR group include a methoxy group and an ethoxy group. Since the transfer layer 2 ′ contains such a silane coupling agent, the transferred transfer layer 2 ′ (light-shielding layer 2), which is an organic material, and an inorganic material by two types of functional groups of the silane coupling agent. The glass substrate 1 is firmly bonded.

  Specific examples of the silane coupling agent include vinyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropyltri Examples include methoxysilane, 3-acryloxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, and bis (triethoxysilylpropyl) tetrasulfide. When the binder resin of the transfer layer 2 ′ is an epoxy resin, as a silane coupling agent, an —X group such as 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane is an epoxy group. It is preferable to use a certain silane coupling agent. When the binder resin is an epoxy resin, if a silane coupling agent whose -X group is an epoxy group is used, the compatibility between the binder resin and the silane coupling agent is improved. Therefore, the light shielding layer 2 and the glass substrate 1 Adhesiveness can be increased.

  The blending ratio of the silane coupling agent in the binder is preferably 3% or more and 20% or less, and particularly preferably 5% or more and 10% or less, in terms of weight% in the binder. When the compounding ratio of the silane coupling agent is less than 3%, sufficient adhesion between the light shielding layer 2 and the glass substrate 1 cannot be obtained, and the solvent resistance is lowered. If the blending ratio of the silane coupling agent exceeds 20%, the amount of the binder resin is too small and the coating film strength becomes weak, and blocking is likely to occur during storage of the thermal transfer sheet 40, and the transfer layer 2 ′ When this is transferred, soiling is likely to occur on the glass substrate 1.

  When the binder resin is a thermosetting resin, a binder is preferably added to the binder. For example, as the curing agent when the binder resin is an epoxy resin, an amine curing agent and a carboxylic acid curing agent can be used.

  As the curing agent, it is preferable to use a latent curing agent. A latent curing agent has no reactivity with a thermosetting resin below a predetermined temperature, but when it reaches a predetermined temperature (hereinafter referred to as an activation temperature) by heating, its molecular structure changes. It is a curing agent that exhibits reactivity with the thermosetting resin. When the thermal transfer sheet 40 containing such a latent curing agent is used as the curing agent, the light shielding layer 2 excellent in solvent resistance and heat resistance can be easily formed in a desired pattern. That is, when forming the light shielding layer 2 using the thermal transfer sheet 40, the transfer layer 2 ′ can be melted without being cured by setting the heating temperature in the heat transfer step to be lower than the activation temperature. It becomes easy to transfer the transfer layer 2 ′ according to a desired pattern. Moreover, by setting the heating temperature in the curing step to be equal to or higher than the activation temperature, the curing reaction can be activated and the light shielding layer 2 can be made a strong layer.

  As the latent curing agent, an acidic compound or a basic compound block compound (hereinafter referred to as a block compound) having reactivity with a thermosetting resin that is a binder resin is preferably exemplified. A blocking compound is a compound in which a blocking agent that dissociates at a predetermined temperature or higher is bound to a functional group having reactivity with the reactive functional group of the thermosetting resin, and the blocking agent is bonded This temporarily suppresses the reactivity of the curing agent with the thermosetting resin. Further, as a latent curing agent, a neutral salt of an acidic compound or a basic compound having reactivity with a thermosetting resin, a complex of such a compound, a high melting point of such a compound, or such A compound encapsulated in microcapsules can also be mentioned.

  For example, as a latent curing agent when the binder resin is an epoxy resin, a compound having two or more carboxyl groups in a molecule to which a blocking agent that dissociates at a predetermined temperature or more is bonded (hereinafter referred to as a carboxyl group blocking compound). .). Examples of the carboxyl group blocking compound include those obtained by converting a polyvalent carboxylic acid into a hemiacetal form with an alkyl vinyl ether (blocking agent). As polyvalent carboxylic acids, isophthalic acid, 1,2,4-trimellitic acid, pyromellitic acid, tris (2-carboxylethyl) isocyanurate, adipic acid, maleic acid, itaconic acid, fumaric acid, 1,2 -Cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid or 1,2,3,4-butanetetracarboxylic acid. Examples of the alkyl vinyl ether include ethyl vinyl ether, n-propyl vinyl ether, i-propyl vinyl ether, n-butyl vinyl ether, i-butyl vinyl ether, t-butyl vinyl ether, and 2-ethylhexyl vinyl ether.

  The curing agent is such that the equivalent ratio of the total of the functional groups of the curing agent in the binder and the total of the reactive functional groups of the thermosetting resin that is the binder resin is 0.2 to 2.0. It is preferable to mix | blend, and it is preferable to mix | blend so that this equivalent ratio may be 0.4-0.8 especially. When the equivalent ratio is less than 0.2, the crosslink density of the light shielding layer 2 is decreased, and the effect (improved solvent resistance and heat resistance) by curing the light shielding layer 2 cannot be sufficiently obtained. On the other hand, if the equivalent ratio is larger than 2.0, blocking is likely to occur during storage of the thermal transfer sheet 40 due to the unreacted curing agent.

  The transfer layer 2 ′ may contain an additive as long as the effects of the present invention are not impaired. Examples of the additive include a release agent, an adhesion aid, an antioxidant, and a dispersant. Further, when the binder resin is a resin that is cured by ultraviolet rays, the transfer layer 2 ′ contains a photopolymerization initiator.

  The transfer layer 2 ′ preferably has a light shielding property with a transmission density of 2.5 or more, particularly 3.0 or more. The transmission density is a logarithm of a value obtained by dividing the intensity of light incident on the transfer layer 2 ′ by the intensity of light transmitted through the transfer layer 2 ′. When the transmission density of the transfer layer 2 ′, that is, the light shielding layer 2 is high, the contrast of the liquid crystal display using the color filter 30 having the light shielding layer 2 is increased and the performance is improved. The transmission density here is a value measured by a transmission densitometer D200-II (without polarizing filter) manufactured by GretagMacbeth. The light shielding density (light shielding property) is determined by adjusting the ratio between the light shielding material and the binder of the transfer layer 2 ′ and the thickness of the transfer layer 2 ′.

  The weight ratio of the light shielding material to the binder (light shielding material / binder) is preferably 3/7 to 2/1. When this weight ratio is smaller than 3/7, the ratio of the light shielding material is too small, and the light shielding property of the light shielding layer 2 becomes insufficient. On the other hand, if the weight ratio is larger than 2/1, the ratio of the resin that melts during the heat transfer process is reduced, so that the transferability of the transfer layer 2 ', particularly when transferring at high speed, is lowered. Further, when the binder resin is a curable resin, the ratio of the resin that is cured during the curing process is reduced, so that the effect (improved solvent resistance and heat resistance) by curing the light shielding layer 2 can be sufficiently obtained. Absent.

  The thickness of the transfer layer 2 ′ is 0.5 to 10.0 μm, preferably 0.8 to 5.0 μm. When the thickness of the transfer layer 2 ′ is smaller than 0.5 μm, the light shielding property of the light shielding layer 2 becomes insufficient. On the other hand, if the thickness of the transfer layer 2 ′ is larger than 10.0 μm, the coating strength of the transfer layer 2 ′ becomes too large, and the thermal transfer sheet 40 is peeled off from the glass substrate 1 after heat transfer (FIG. 5 ( C))), the transfer layer 2 ′ melted and the transfer layer 2 ′ not melted are hardly separated. As a result, the edge of the transfer layer 2 ′ after the bending is bent, so that the light shielding layer 2 having a linear pattern cannot be formed, and transferability is deteriorated.

  For the transfer layer 2 ′, a transfer layer coating solution in which the above-described light-shielding material and binder are dissolved or dispersed in a solvent is applied to one side of the thermal transfer sheet substrate 41, and the solvent of the coating film is applied. Formed by drying. As the solvent, methyl ethyl ketone, isobutyl ketone, ethyl acetate, butyl acetate, toluene, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, etc. can be used, and these may be used alone or in an appropriate blending ratio. It may be used as a mixture. As a coating method, a bar coating method, a gravure coating method, a die coating method, or the like can be used.

  The photothermal conversion layer 42 is provided between the thermal transfer sheet substrate 41 and the transfer layer 2 ′ when the photothermal conversion method is used in the heat transfer process. The photothermal conversion layer 42 has a role of absorbing light (for example, laser light) and converting it into heat, transferring heat to the transfer layer 2 ′, and efficiently melting the transfer layer 2 ′. For example, when the photothermal conversion method using a laser beam is used in the heat transfer process, the photothermal conversion layer 42 is configured by a laser beam absorbing material that absorbs a laser wavelength beam and a binder.

  Examples of the laser beam absorbing material include an infrared absorber, and inorganic particles such as carbon black and titanium black are particularly preferably used. As binders, polyester resin, acrylic resin, polyurethane resin, polyarylate resin, chlorinated polypropylene resin, polycarbonate resin, polyamideimide resin, epoxy resin, polyvinyl butyral resin, polyvinyl acetal resin, polyvinyl alcohol resin, cellulose resin, etc. These copolymer resins or these modified resins, thermosetting resins, or ionizing radiation curable resins may be used. Among these resins, it is particularly preferable to use a resin having a thermal decomposition temperature of 200 ° C. or higher. Since the photothermal conversion layer 42 formed of such a resin has high heat resistance, ablation hardly occurs during transfer.

  The photothermal conversion layer 42 preferably has an absorbance at a laser wavelength of 0.3 or more, more preferably 0.4 to 2.0. Absorbance is the logarithm of a value obtained by dividing the intensity of light incident on the photothermal conversion layer 42 by the intensity of light transmitted through the photothermal conversion layer 42. When the absorbance of the photothermal conversion layer 42 is lower than 0.3, the efficiency of photothermal conversion becomes low and energy loss increases. When the absorbance is higher than 2.0, the optimum transfer energy range is narrowed, so that the drawing accuracy is deteriorated and it is difficult to transfer the transfer layer 2 ′ in a desired pattern. Here, the absorbance is a value measured with a spectrophotometer UV-3100PC manufactured by Shimadzu Corporation. The absorbance is determined by adjusting the ratio between the laser beam absorbing material and the binder of the photothermal conversion layer 42 and the thickness of the photothermal conversion layer 42.

  The weight ratio of the laser beam absorbing material to the binder (laser beam absorbing material / binder) is preferably 1/20 to 2/1, and particularly preferably 1/10 to 1/1. . If this weight ratio is less than 1/20, the light absorption efficiency is lowered, so that the laser beam cannot be sufficiently absorbed and transferability is lowered. On the other hand, if the weight ratio is larger than 2/1, the ratio of the binder is reduced, so that the coating film strength is lowered and ablation is likely to occur. As a result, the entire photothermal conversion layer 42 is transferred to the glass substrate 1 and the glass substrate 1 is easily contaminated.

  The thickness of the photothermal conversion layer 42 is usually 0.3 to 5.0 μm, preferably 1.0 to 3.0 μm. If the thickness of the light-to-heat conversion layer 42 is less than 0.3 μm, the absorbance becomes low and the energy loss increases. Further, if the thickness of the photothermal conversion layer 42 is larger than 5.0 μm, the thermal conductivity is lowered, so that the transfer sensitivity of the transfer layer 2 ′ can be lowered or the transfer layer 2 ′ having a desired line width can be transferred. The transfer accuracy is reduced.

  The light-to-heat conversion layer 42 is coated with a coating solution for a light-to-heat conversion layer, in which the above materials are dissolved or dispersed in a solvent, on the substrate 41 for a thermal transfer sheet, and the solvent of the coating film is dried. It is formed by curing accordingly. As the solvent, methyl ethyl ketone, isobutyl ketone, ethyl acetate, butyl acetate, toluene, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, etc. can be used, and these may be used alone or in an appropriate blending ratio. It may be used as a mixture. As a coating method, a bar coating method, a gravure coating method, a die coating method, or the like can be used.

  The release layer 43 is provided adjacent to the lower side of the transfer layer 2 ′, has relatively low adhesiveness to the transfer layer 2 ′, and remains in the thermal transfer sheet 40 without being melted and transferred in the heat transfer step. It is a resin layer. Such a release layer 43 can be easily peeled off at the interface with the transfer layer 2 ′ in the heat transfer process, and can easily transfer the molten transfer layer 2 ′ to the glass substrate 1.

  The release layer 43 is preferably formed mainly of a resin having high heat resistance. When the release layer 43 is formed of a resin having high heat resistance, it is not transferred in the heat transfer process and remains on the thermal transfer sheet 40, and the surface shape of the formed light shielding layer 2 can be flattened. Examples of such resins include polyarylate resins, chlorinated polypropylene resins, polycarbonate resins, polyamideimide resins, epoxy resins, polyvinyl butyral resins, polyvinyl acetal resins, polyvinyl alcohol resins, cellulose resins, silicone resins and the like, and copolymer resins thereof. Or these modified resins. The release layer 43 may be formed of a thermosetting resin cured product or an ionizing radiation curable resin cured product composed of a polyfunctional monomer and an oligomer. Among these resins, resins having a softening point of 200 ° C. or higher are particularly preferably used. In addition, the thickness of the mold release layer 43 is 0.01-3.0 micrometers normally.

  The release layer is provided adjacent to the lower side of the transfer layer 2 ′ and has a relatively low adhesiveness to the thermal transfer sheet base 41 (or the photothermal conversion layer 42 when the photothermal conversion layer 42 is provided). The resin layer is melted and transferred together with the transfer layer 2 ′ in the heat transfer step. Such a release layer is melted together with the transfer layer 2 ′ in the thermal transfer step, and peeling is likely to occur at the interface with the thermal transfer sheet base material 41 and the like, so that the transferred transfer layer 2 ′ is transferred to the glass substrate 1. Can be made easier. The release layer is formed as it is on the transfer layer 2 ′ after transfer to constitute the light shielding substrate 20. The release layer is preferably formed of a binder used for forming the transfer layer 2 'from the viewpoint of transferability. In addition, the thickness of a peeling layer is 0.01-3.0 micrometers normally.

(2) Contact process:
A contact process is performed by sticking the thermal transfer sheet 40 and the glass base material 1 using the pressurization method by a roll etc., or a vacuum contact | adherence method.

(3) Heat transfer process:
In the heat transfer step, the heat transfer sheet 40 in close contact with the glass substrate 1 is heated according to a pattern corresponding to the pattern of the light shielding layer 2 to melt the transfer layer 2 ′ and transfer it to the glass substrate 1. It is. In this step, the alignment mark 35 (see FIG. 4) described above can be formed on the glass substrate 1. Specifically, the alignment mark 35 is formed by heating the thermal transfer sheet 40 in close contact with the glass substrate 1 and transferring the transfer layer 2 ′ to the glass substrate 1 in accordance with the alignment mark formation pattern. .

  Examples of the heating method include a photothermal conversion method in which light is irradiated and light energy is converted into heat energy to heat, a method in which a thermal head provided with a heating element is contacted and heated, or a hot stamping method. Of these, a photothermal conversion method using a laser beam can be preferably exemplified. When heat transfer is performed by a photothermal conversion method using laser light (hereinafter referred to as laser transfer method), transfer resolution is improved and transfer speed is increased.

  Heating by the laser transfer method is performed by a mask imaging method in which a desired pattern is drawn on the thermal transfer sheet 40 in close contact with the glass substrate 1 with a laser beam having a light diameter set to the line width of the pattern of the light shielding layer 2. Moreover, it can also carry out by irradiating through a desired mask.

  Examples of laser light used in the laser transfer method include a semiconductor laser having a wavelength of 780 nm, a YAG laser having a wavelength of 1084 nm, and the like.

  The energy of the laser light is preferably determined so that the heating in the heat transfer process is performed at a temperature equal to or higher than the softening point of the binder resin contained in the binder of the transfer layer 2 ′. Further, when the transfer layer 2 ′ contains a curing agent, the energy of the laser light is determined so that the heating in the heating transfer process is performed at a temperature lower than the activation temperature of the curing agent. preferable. When the transfer is performed in this temperature range, the transfer layer 2 'melts without being cured, so that the transfer property is improved. The energy of the laser beam is determined by adjusting the laser beam drawing speed, irradiation output, and irradiation time.

(4) Curing process:
In the curing step, when the transfer layer 2 ′ is formed of a curable resin, the light shielding layer 2 formed on the glass substrate 1 is cured, and the solvent resistance and heat resistance of the resulting light shielding layer 2 are improved. It is a process for improving. The curing step is a heating step when the binder of the transfer layer 2 ′ includes a thermosetting resin, and an irradiation step of ionizing radiation when the binder of the transfer layer 2 ′ includes an ionizing radiation curable resin. It becomes. When this process is a heating process, it is preferable that heating temperature is more than the activation temperature of the hardening | curing agent contained in transfer layer 2 '. The light shielding layer 2 thus formed becomes a strong layer by the action of the curing agent.

(Colored layer)
The colored layer 3 is a red (R), green (G), or blue (B) layer formed in the opening (pixel portion) of the light shielding layer 2 of the light shielding substrate 20. The colored layer 3 is usually formed in a matrix pattern, and examples of the arrangement of the colored layer 3 include a red pattern, a green pattern, and a blue pattern in a mosaic type, a stripe type, a triangle type, and a four pixel arrangement type. For the formation of the colored layer 3, for example, a transfer method, a pigment dispersion method, or an ink jet method similar to the formation of the light shielding layer 2 can be used.

  Formation of the colored layer 3 by the pigment dispersion method is performed by applying a colored layer coating material in which a colored pigment is dispersed in a photocurable resin composition onto the light shielding layer 2 of the light shielding substrate 20, and then applying ultraviolet rays through a photomask. The film is exposed to a desired pattern by irradiating, and after alkali development, it is heated and cured in a clean oven or the like. The formation of the colored layer 3 by the ink jet method is performed by applying a water-based ink liquid in which a color pigment is dispersed in a photocurable resin composition or a thermosetting resin composition to an opening (pixel portion) of the light shielding layer 2 of the light shielding substrate 20. It is performed by discharging and drying and curing the coating film. In this case, it is preferable to treat the light shielding substrate 20 in advance so that the exposed surface of the light shielding substrate 20 in the opening of the light shielding layer 2 is hydrophilic and the upper surface of the light shielding layer 2 is hydrophobic. The thickness of the colored layer 3 is usually about 1.0 to 5.0 μm.

(Color filter)
Since the color filter 30 of the present invention is manufactured as described above, the color filter 30 includes the light shielding layer 2 having high adhesion to the glass substrate 1. As a result, since this light shielding layer 2 is excellent in solvent resistance, it is difficult to peel off from the glass substrate 1 during the manufacturing process of the color filter 30 and the pattern is not easily chipped.

  The color filter 30 of the present invention is used as a color filter for a display device such as a liquid crystal display device. When used as a color filter of a liquid crystal display device, as shown in FIGS. 6A and 6B, a protective film 4, a transparent electrode 5 and an alignment film are provided so as to cover the light shielding layer 2 and the colored layer 3. 6 may be formed, and a column spacer 7 'as shown in FIG. 6B may be formed.

  Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples. In addition, a part is a weight reference | standard of solid content in a sentence.

(Example 1)
(1) Preparation of thermal transfer sheet:
First, the thermal transfer sheet 40 was produced. A 75 μm-thick polyethylene terephthalate (PET) film (trade name: Lumirror T-60, manufactured by Toray Industries, Inc.) was used as the thermal transfer sheet base 41, and the following composition was formed on one surface of the thermal transfer sheet base 41. The release layer coating liquid A was applied by a bar coating method, dried by heating at 90 ° C. for 2 minutes, and then cured by irradiation with ultraviolet rays to form a release layer 43 having a thickness of 1.0 μm. .

  Next, a transfer layer coating solution B having the following composition was applied by a bar coating method and dried by heating at 90 ° C. for 2 minutes to form a transfer layer 2 ′ having a thickness of 1.5 μm. The transmission density of the thermal transfer sheet base material 41 at the time when the transfer layer 2 ′ was formed was 3.0.

[Release layer coating liquid A]
・ Trifunctional acrylate resin (manufactured by Nippon Kayaku Co., Ltd., product name: KAYARAD TMPTA) 20 parts ・ Photopolymerization initiator (manufactured by Ciba Specialty Chemicals Co., Ltd., product name: IRUGACURE904) ・ Methyl ethyl ketone / methyl isobutyl ketone (weight) Ratio: 1/1) 78 parts

[Coating fluid B for transfer layer]
・ Binder resin: Epoxy group-containing acrylic resin (manufactured by NOF Corporation, product name: Blemmer CP-50M, glass transition point: 71 ° C.) 10 parts ・ Silane coupling agent: 3-glycidoxypropyltrimethoxysilane (Shin-Etsu) Chemical Co., Ltd., product name: KBM403) 1 part Light-shielding material: carbon black 12 parts Curing agent 1 part Methyl ethyl ketone / toluene (weight ratio: 1/1) 76 parts

(2) Production of light shielding substrate:
Next, transfer of the transfer layer 2 ′ of the thermal transfer sheet 40 to the glass substrate 1 was performed using a laser drawing apparatus. The glass substrate 1 was a 0.7 mm thick glass substrate (product name: 1737 glass, manufactured by Corning), and the laser drawing apparatus was an apparatus configured using a mask imaging method. This laser drawing apparatus has a drawing system as shown in FIG. 7, and includes a YAG laser having a laser wavelength of 1084 nm as a laser oscillator 71.

  First, the glass substrate 1 is placed on the XY stage 77 in the laser drawing apparatus, and the thermal transfer sheet 40 is laminated on the glass substrate 1 so that the transfer layer 2 ′ is on the inside. The material 1 was vacuum-adhered so as to be covered with the thermal transfer sheet 40.

  Next, while the XY stage is scanned in the Y-axis direction at a stage speed of 300 mm / sec, the cross section of the laser beam at the imaging focal point is a substantially square shape with a side of 20 μm (this substantially square shape is represented as □ 20 μm). Then, the laser beam was irradiated to the thermal transfer sheet 40 side of the glass substrate 1 on which the thermal transfer sheet 40 was laminated. At this time, the laser output per cross-sectional area of the laser beam at the imaging focal point was set to 40 mW. As shown in FIG. 7, the laser light L emitted from the laser oscillator 71 is spread by the beam expander lenses 72 and 73 and is incident on the telecentric optical system lens 74 as shown in FIG. Thereafter, the beam is shaped into a top-hat shaped beam by the beam shape shaping mask 75 and condensed by the lens 76 so that the transfer layer 2 ′ of the transfer sheet 40 becomes an imaging focus.

  Thus, a glass substrate 1 on which a transfer layer 2 ′ having a lattice-like (line width of 20 μm) pattern was obtained in plan view was obtained.

  Next, the obtained glass substrate 1 to which the transfer layer 2 ′ has been transferred is heated in a heating furnace at 230 ° C. for 30 minutes to cure the transfer layer 2 ′ to form a light shielding layer 2 (transmission density 3.0). A light shielding substrate 20 was obtained.

(3) Production of color filter:
Next, the colored layer 3 was formed on the obtained light shielding substrate 20 as described below, and the color filter 30 was produced.

  First, R layer coating liquid C having the following composition was applied onto the light-shielding substrate 20 by a spin coating method, and the coating film was dried. Thereafter, the coating film was patterned by photolithography so that R layers were formed every two rows. Next, this light-shielding substrate 20 was placed in a heating furnace at 230 ° C. to cure the coating film, thereby forming an R layer.

  In the same manner, using the G layer coating solution D having the following composition, G layers are formed in every two rows in the row where the R layer is not formed, and the B layer coating solution E having the following composition is formed. The color filter 30 having the colored layer 3 in which the R layer, the G layer, and the B layer are arranged in a stripe shape was formed by forming the B layer in a row where the R layer and the B layer were not formed.

[R layer coating solution C]
-10 parts of red pigment-20 parts of UV curable resin-1 part of photopolymerization initiator-79 parts of propylene glycol monomethyl ether acetate

[G layer coating solution D]
Green pigment 10 parts UV curable resin 20 parts Photopolymerization initiator 1 part Propylene glycol monomethyl ether acetate 79 parts

[B layer coating solution E]
Blue pigment 10 parts UV curable resin 20 parts Photopolymerization initiator 1 part Propylene glycol monomethyl ether acetate 79 parts

(Example 2)
In preparation of the thermal transfer sheet of Example 1, 3-glycidoxypropyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name: KBM402) was used instead of the silane coupling agent in the transfer layer coating solution B. Produced a thermal transfer sheet in the same manner as in Example 1.

  Next, in the production of the light shielding substrate of Example 1, a light shielding substrate was produced in the same manner as in Example 1 except that this thermal transfer sheet was used.

(Comparative Example 1)
In the production of the thermal transfer sheet of Example 1, a thermal transfer sheet was produced in the same manner as in Example 1 except that the transfer layer coating liquid B did not contain a silane coupling agent and 77 parts of methyl ethyl ketone / toluene was used. .

  Next, in the production of the light shielding substrate of Example 1, a light shielding substrate was produced in the same manner as in Example 1 except that this thermal transfer sheet was used.

(Evaluation of transferability)
By visually observing the light-shielding substrates produced in the examples and comparative examples, the transferability of the thermal transfer sheets of the examples and comparative examples was evaluated. As a result, the light shielding substrates of Examples 1 and 2 and Comparative Example 1 were formed with light shielding layers according to the pattern, and the thermal transfer sheets of Examples 1 and 2 and Comparative Example 1 had good transferability.

(Evaluation of solvent resistance)
The light-shielding substrates prepared in the Examples and Comparative Examples were immersed in isopropyl alcohol, γ-butyrolactone, propylene glycol monomethyl ether acetate, and warm pure water (60 ° C.) for 30 minutes, and then the presence or absence of peeling of the light-shielding layer was visually observed. By observing, the solvent resistance of the light shielding substrate was evaluated.

  As a result, the light-shielding substrates of Examples 1 and 2 were excellent in solvent resistance without peeling off the light-shielding layer even when immersed in any solvent. On the other hand, even if the light shielding substrate of Comparative Example 1 was immersed in any solvent, the light shielding layer was partially peeled off, and was inferior in solvent resistance as compared with the light shielding substrates of Examples 1 and 2.

It is sectional drawing which shows an example of the light-shielding board | substrate of this invention. It is sectional drawing which shows an example of the color filter of this invention. FIG. 3A is a sectional view showing an example of the thermal transfer sheet of the present invention, and FIG. 3B is a sectional view showing another example of the thermal transfer sheet of the present invention. It is a top view which shows an example of the light-shielding board | substrate of this invention. FIGS. 5A to 5D are process diagrams for explaining a partial process of the method for producing a color filter of the present invention. 6A is a cross-sectional view illustrating an example of a liquid crystal panel, and FIG. 6B is a cross-sectional view illustrating another example of a liquid crystal panel. It is a schematic diagram which shows an example of the laser beam drawing system of a laser drawing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Glass base material 2 Light-shielding layer 2 'Transfer layer 3 Colored layer 4 Protective layer 5 Transparent electrode 6 Alignment film 7' Column spacer 20 Light-shielding substrate 30 Color filter 40 Thermal transfer sheet 41 Thermal transfer sheet base material 42 Photothermal conversion layer 43 Release layer

Claims (13)

  A thermal transfer sheet comprising a transfer layer containing a light-shielding material, a binder resin, and a silane coupling agent on one surface of a substrate for a thermal transfer sheet.   The binder resin is an epoxy resin having two or more epoxy groups in one molecule, and the transfer layer further includes a curing agent having a functional group having reactivity with the epoxy group. The thermal transfer sheet described in 1.   The thermal transfer sheet according to claim 2, wherein the silane coupling agent has an epoxy group.   The thermal transfer sheet according to claim 1, wherein the light shielding material is carbon black or titanium black.   A light-shielding substrate, wherein a light-shielding layer having a predetermined pattern is provided on one side of a glass substrate, wherein the light-shielding layer contains a light-shielding material, a binder resin, and a silane coupling agent.   6. The light-shielding substrate according to claim 5, wherein the binder resin is an epoxy resin having two or more epoxy groups in one molecule, and the epoxy resin is cured by a curing agent.   The light shielding substrate according to claim 6, wherein the silane coupling agent has an epoxy group.   It is a color filter which has a light-shielding substrate of any one of Claims 5-7, Comprising: The said light shielding layer has an opening part, The colored layer is provided in the opening part of the said light shielding layer, It is characterized by the above-mentioned. Color filter. A method for producing a color filter in which a light shielding layer and a colored layer are sequentially formed in a predetermined pattern on a glass substrate,
A preparation step of preparing a thermal transfer sheet having a transfer layer containing a light-shielding material, a binder resin, and a silane coupling agent on one side of the base material for the thermal transfer sheet;
A contact step of bringing the transfer layer of the thermal transfer sheet into contact with the glass substrate;
A heat transfer step of forming the light shielding layer by transferring the transfer layer onto the glass substrate by heating the thermal transfer sheet from the thermal transfer sheet substrate side according to a pattern corresponding to the predetermined pattern of the light shielding layer. When,
A peeling step of peeling the thermal transfer sheet from the glass substrate;
And a colored layer forming step of forming the colored layer of a predetermined pattern on the surface of the glass substrate on the side where the light shielding layer is formed. The binder resin is an epoxy resin having two or more epoxy groups in one molecule, and the transfer layer further includes a curing agent having a functional group having reactivity with the epoxy group,
The method for producing a color filter according to claim 9, further comprising a curing step of curing the light shielding layer by heating the light shielding layer after the peeling step.   The method for producing a color filter according to claim 10, wherein the silane coupling agent has an epoxy group.   The method for producing a color filter according to claim 9, wherein the light shielding material is carbon black or titanium black.   The color filter manufacturing method according to claim 9, wherein the heating and transferring step is performed by laser light irradiation.

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