JP2005227274A - Component analysis method and component analyzer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component analysis method and a component analyzer having a simple procedure of analysis operation, capable of analyzing in a short time, and performing analysis processing at low cost. <P>SOLUTION: In this component analysis method and this component analyzer, while supplying helium gas to an atmospheric pressure plasma source 2 arranged close to an analysis object body, a high-frequency power is supplied from a power source 4, and thereby plasma 5 is generated, and light is emitted from the analysis object body exposed to the plasma 5. The light is guided to a filter 7 and a photodiode 8 through an optical fiber 6, and subjected to photoelectric conversion. The analyzer is constituted so that a photoelectrically converted signal is transferred to a control device 9, and that the control device 9 determines whether a specific element is included in the analysis object body or not. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a component analysis method and component analysis apparatus for an element of an object.

  In general circuit boards used for electrical and electronic products, various circuit components mounted on a printed board or a film board are connected using solder. As a solder for connecting such a circuit component to a substrate, a tin-lead eutectic solder containing a large amount of lead has been widely used from the viewpoint of workability and product reliability.

When disposing of used electrical and electronic products with circuit boards that use such lead-containing solder, if they are left outdoors or disposed as landfills, the lead that has dissolved from the discarded products Groundwater may be contaminated and mixed with drinking water, which may adversely affect the human body. Therefore, used electrical and electronic products having circuit boards using solder containing lead are disposed of in a managed and managed disposal site so that contaminated water containing lead does not leak.
In order to more reliably prevent environmental pollution, it is preferable to disassemble and separate used electrical and electronic products, take out the circuit board, and then separate and collect lead from the circuit board. However, separation and recovery of lead requires time and labor, and recycled lead has a considerably high separation and recovery cost.

  In recent years, a circuit board to be discarded (hereinafter abbreviated as a waste circuit board) taken out after disassembling used electrical / electronic products is crushed, and then the obtained crushed material is dry-distilled and recovered. Recovery methods have been used. By this chemical recovery method, recycling for recovering relatively expensive metals (valuable metals) such as gold, silver, copper, and palladium used as wiring materials and plating materials has begun. At this time, a silicon compound such as glass usually contained in the waste circuit board is recovered as slag. This slag can be effectively recycled as, for example, a cement raw material. However, when the waste circuit board contains lead, lead is mixed into the slag. Therefore, in order to effectively use this slag as a cement raw material or the like, it is necessary to separate and recover lead. However, at present, due to the problem of lead separation and recovery cost, such slag containing lead is not yet recycled but is landfilled in a managed disposal site.

  Therefore, in recent years, switching from tin-lead eutectic solder to lead-free solder, so-called lead-free solder, has been promoted so as to reliably prevent environmental pollution and facilitate recycling. In particular, circuit board manufacturers are energetically switching from tin-lead eutectic solder to lead-free solder. If a waste circuit board using lead-free solder is crushed and dry-distilled, valuable metals can be recovered and slag containing no lead can be recovered. For this reason, the recovered slag can be effectively used as a cement raw material or the like.

  The currently known practical lead-free solder has a higher melting point than tin-lead eutectic solder. For example, Sn—Ag—Cu lead-free solder, which is currently considered to be the mainstream of lead-free solder, has a melting point of 216 to 220 ° C., and tin / lead eutectic solder has a melting point of about 183 ° C. Thus, since lead-free solder has a higher melting point than tin-lead eutectic solder, it is necessary to perform soldering work at a high temperature when lead-free solder is used. Therefore, even if some circuit components have heat resistance with respect to the conventional soldering operation temperature, there is a problem with heat resistance with respect to such a high soldering operation temperature. There are also circuit components. In addition, depending on the material and shape of the lead of the circuit component, confirmation by a reliability test may be necessary after soldering work.

  Therefore, it is difficult to replace all of the solder used in the circuit board and products using the same with lead-free solder, and lead-containing solder is used in some circuit boards. In addition, there are many products using lead-containing solder among electrical and electronic products that are already manufactured and used. For this reason, circuit boards using lead-containing solder and circuit boards using lead-free solder are mixed at the work site where used electrical and electronic products are disassembled and separated, and the circuit board is taken out. This is an unavoidable situation.

If there is no effective means of separating waste circuit boards that use lead-free solder, recycling and disposal will be performed while circuit boards using lead-containing solder and circuit boards using lead-free solder are mixed. Become. As a result of such processing, the following problems occur.
First, if only a waste circuit board using lead-free solder is used, slag obtained by crushing and dry distillation of the waste circuit board can be effectively used as, for example, a cement raw material. However, if a waste circuit board using lead-free solder and a circuit board using lead-containing solder are mixed, lead is mixed into the slag and cannot be effectively used as a cement raw material. Therefore, the circuit board using lead-free solder has to be buried in the management-type treatment plant together with the residue of the waste circuit board using lead-containing solder after recovering valuable metals.

In addition, when recovering lead from slag obtained by crushing waste circuit boards, dry distillation, and recovery of valuable metals, if lead-free solder is mixed in lead-containing solder, the lead content decreases. On the contrary, there is also a problem that the cost of separating and recovering lead becomes high.
Therefore, it is desired to realize a method for easily selecting a circuit board using lead-containing solder and a circuit board using lead-free solder at low cost.

  Since both lead-containing solder and lead-free solder are mainly composed of tin, there is a slight difference in gloss, but it is difficult to distinguish them visually. Therefore, a method of selecting a circuit board using lead-containing solder and a circuit board using lead-free solder by providing an identification mark, a bar code, or the like on the circuit board is disclosed in, for example, Japanese Unexamined Patent Publication No. 2000-269614. It is disclosed in the publication.

  However, the sorting method using identification marks, barcodes, etc., cannot secure space for providing identification marks, barcodes, etc. on circuit boards in electrical and electronic products that are required to be lighter, thinner, and smaller. There is. In addition, there may be a case where the identification mark, bar code, or the like becomes small and the identification becomes difficult. Further, in the circuit board manufacturing process, a process for providing an identification mark, a bar code, or the like is required, which raises a problem that the manufacturing cost increases.

  In addition, in the work of disassembling and separating used electrical / electronic products and taking out circuit boards, products and circuit boards of many manufacturing companies are mixed. Therefore, the sorting method disclosed in Japanese Patent Laid-Open No. 2000-269614 requires standardization of identification marks, barcodes, and the like. However, such standardization cannot be easily realized, and is not a reliable method that can be achieved at an early stage.

  Even among lead-free solders, there are many circuit components in which lead wires are plated with lead-containing solder. It is practically impossible to replace them all lead-free at the same time. Therefore, it is predicted that lead-containing solder-plated circuit components and lead-free plated circuit components coexist. However, it is practically impossible to represent these only with identification marks, bar codes, and the like.

Further, the waste circuit board has a problem related to bromine, which may cause dioxin generation in the waste incineration stage, in addition to lead.
An insulating material mainly composed of a synthetic resin is usually used for a printed circuit board on which circuit components in the circuit board are mounted. In general, in order to meet the safety requirements in use, for example, the flame retardance requirements set forth in UL standards (US safety standards), most of the insulating materials are halogen-based flame retardants containing bromine ( Brominated diphenyl ether compounds and brominated biphenyl compounds). Such a halogen-based flame retardant containing bromine may generate dioxins due to incomplete combustion when the circuit board is incinerated as waste. Therefore, such a circuit board containing bromine needs to be buried without being incinerated or subjected to incineration treatment under strictly controlled combustion conditions so as not to generate dioxins.

  In recent years, development of halogen-free printed circuit boards containing no bromine has been progressing. With such a printed circuit board, there is no fear of generating dioxins during incineration. However, there are many products using halogen-based flame retardants containing bromine in electrical and electronic products that are already manufactured and used. For this reason, it is inevitable that circuit boards using halogen-based flame retardant containing bromine and halogen-free circuit boards coexist at the work site where used electrical and electronic products are disassembled and separated to take out the circuit boards. .

If a circuit board using a halogen-based flame retardant containing bromine is mixed in a halogen-free circuit board, dioxins may be generated during incineration. In addition, if processing that does not generate dioxins is performed, processing costs increase.
Therefore, from the viewpoint of preventing the generation of dioxins and reducing the processing cost, it is possible to separate and dispose of the circuit board containing bromine and the circuit board not containing bromine at the stage of disposal of the circuit board. desirable.
As a conventional waste sorting method, a sorting method using fluorescent X-rays is known. For example, Japanese Patent Laid-Open No. 10-267868 proposes a member identification device that irradiates waste with primary X-rays and identifies the waste based on unique X-rays generated from the waste. Japanese Patent Laid-Open No. 2002-310952 discloses that a waste circuit board surface is analyzed with a fluorescent X-ray analyzer, and whether or not lead is contained is determined based on the analysis result. A method for separating wastes that do not contain a specific element is proposed. These conventional devices are large devices that analyze and identify the waste on the belt conveyor in a sealed chamber.

Further, JP 2000-258347 A discloses an ICP (Inductively Coupled Plasma) emission analysis technique. In this emission analysis technique, a solder sample to be analyzed is prepared and used. A carrier gas mixed with the prepared solder sample is caused to flow through a tube, plasma is generated by flowing a high-frequency current through a coil wound around the tube, and the sample is allowed to emit light to perform spectroscopic analysis.
Japanese Patent Laid-Open No. 10-267868 JP 2002-310952 A JP 2000-258347 A

However, the above-described conventional analysis techniques have a problem that the procedure of the analysis operation is complicated, the analysis process takes a long time, and expensive analysis equipment is required. Moreover, since a vacuum process is required for analysis, a sturdy vacuum vessel and a vacuum pump therefor are required, and there is a problem that the apparatus becomes large.
In view of the above-described problems in the prior art, the present invention provides a component analysis method and a component analysis apparatus that have a simple analysis procedure, can perform analysis in a short time, and can realize analysis processing at low cost. The purpose is to provide.

In order to achieve the above object, the component analysis method according to the present invention has a specific emission intensity peak value from the relationship between the wavelength and emission intensity when a specific element is irradiated with plasma under atmospheric pressure. Selection step to select the wavelength,
A monitoring step of irradiating the object to be analyzed with plasma under atmospheric pressure, and measuring the light emission intensity of the object to be analyzed at the wavelength selected in the selection step; and the light emission intensity measured in the monitoring step; A determination step of comparing the emission intensity of the wavelength in the selection step to determine the presence or absence of the element contained in the object to be analyzed.
According to the component analysis method according to the present invention having the above processing steps, the analysis procedure is simple, analysis can be performed in a short time, and inexpensive analysis can be realized. Moreover, according to the component analysis method according to the present invention, it is possible to easily and reliably perform the separation of the object to be analyzed.

In order to achieve the above object, a component analyzer according to the present invention includes a sample stage on which an object to be analyzed is placed,
A discharge electrode having a gas flow path therein;
A gas supply unit for supplying gas to the discharge electrode;
A power source for supplying power to the discharge electrode;
It has a light emission input portion arranged close to the plasma generated between the discharge electrode and the object to be analyzed, and is formed of a translucent material that transmits light from the object to be analyzed generated by plasma irradiation. Translucent part,
A filter that transmits only light of a specific wavelength in the light from the light transmitting section, and a control for measuring the emission intensity of the light transmitted through the filter and determining the presence or absence of a specific element contained in the object to be analyzed Device.
According to the component analyzer according to the present invention configured as described above, the procedure of the analysis operation is simple, analysis can be performed in a short time, and low-cost analysis can be realized.

  As described above, according to the present invention, the analysis procedure is simple and the analysis can be performed in a short time with a small apparatus. Moreover, low-cost analysis can be realized by using the component analysis method and the component analysis apparatus of the present invention. Therefore, it is possible to easily sort printed boards at a site where waste such as home appliances is processed. Further, when a quantitative analysis is not required, it can be widely applied as a method for simply evaluating whether or not a certain element is included as a main component.

  Preferred embodiments of a component analysis method and a component analysis apparatus using the component analysis method of the present invention will be described below with reference to the accompanying drawings.

<< First Example >>
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a schematic configuration diagram showing a first component analyzer used in the first embodiment of the present invention. FIG. 2 is an enlarged cross-sectional view showing a portion where plasma is generated in the first component analyzer of the first embodiment. In the first embodiment, the case where the inspection target is a printed circuit board on the circuit board will be described, but the same applies to the case where the inspection target is a film substrate.

  FIG. 1 is a diagram illustrating a state in which a discarded printed circuit board 1 to be inspected is subjected to solder component analysis inspection by the first component analysis apparatus 200 of the first embodiment. As shown in FIG. 1, the first component analyzing apparatus 200 includes a plasma generating unit 200A that generates plasma and a component analyzing unit 200B that receives the plasma and analyzes the components. The plasma generation unit 200 </ b> A includes an atmospheric pressure plasma source 2, a gas supply device 3, a power source 4, and an exhaust device 55. The component analysis unit 200 </ b> B includes a light transmission unit 6, a filter 7, a photodiode 8, a control device 9, a speaker 10, and an indicator 11. In the first embodiment, plasma is generated at atmospheric pressure. Here, atmospheric pressure refers to a range between 0.8 atmospheric pressure and 1.2 atmospheric pressure [atm]. The same applies to the following embodiments.

  As shown in FIG. 2, the atmospheric pressure plasma source 2 of the plasma generating unit 200 </ b> A has a gas flow path 14 inside, and a discharge electrode 13 having a substantially cylindrical shape and a tip of the discharge electrode 13. It has a dielectric 12 to cover, an insulator 53 that covers the outer peripheral surface of the discharge electrode 13, and a metal cover 54 that covers the insulator 53. The atmospheric pressure plasma source 2 and the gas supply device 3 are connected by a stainless steel pipe 71 so that the gas flow path 73 in the stainless steel pipe 71 communicates with the gas flow path 14 in the atmospheric pressure plasma source 2. It is configured. The discharge electrode 13 of the atmospheric pressure plasma source 2 and the stainless steel tube 71 are connected by a bolt 50 through an insulator. The bolt 50 passes through the ceramic bush 51 attached to the flange of the stainless tube 71 and the ceramic ring 52 between the flange of the stainless tube 71 and the flange of the discharge electrode 13 and is screwed into the discharge electrode 13. In addition, a porous and air-permeable porous ceramic 72 is provided at the central portion of the ceramic ring 52. Since the porous ceramic 72 is thus provided, the atmospheric pressure plasma source 2 has an effect of preventing discharge in the pipe. As a result, the flange of the stainless steel tube 71 and the flange of the discharge electrode 13 are fixed to each other in an insulated state. As materials for the ceramic ring 52 and the porous ceramic 72 in the first embodiment, alumina (Al2O3) was used. However, other ceramics can be used as the material of the ceramic ring 52 and the porous ceramic 72, for example, zirconia (ZrO2), aluminum nitride (AlN), silicon nitride (SiN), and silicon carbide (SiC). It is possible to form using. In addition, there exists a structure shown in FIG. 3 as a structure which further improves the discharge prevention effect in piping near the joint in the atmospheric pressure plasma source 2 and the stainless steel pipe 71. FIG. 3 is different from the configuration shown in FIG. 2 in the shape of the porous ceramic 72A. As shown in FIG. 3, one end of a porous and air-permeable porous ceramic 72 </ b> A provided in the central portion of the ceramic ring 52 protrudes into the discharge electrode 13. The other end of the porous ceramic 72 </ b> A protrudes into the stainless tube 71. The porous ceramic 72A configured as described above has an excellent discharge preventing effect in the pipe near the joint.

The discharge electrode 13 of the atmospheric pressure plasma source 2 is connected to the power source 4 and is supplied with high frequency power. On the other hand, the cover 54 serving as the outer skin of the atmospheric pressure plasma source 2 is grounded, and the stainless steel tube 71 is also grounded. Therefore, the atmospheric pressure plasma source 2 has an excellent operability that can be operated by an inspector by hand with respect to the printed circuit board 1 to be inspected, and can be easily disposed at a desired position on the printed circuit board 1. .
As shown in FIG. 2, the translucent part 6 in the component analyzing part 200B is composed of an optical fiber 6A, a buffer coating layer 6B covering the outer peripheral surface thereof, and a metal cover 6C. The translucent part 6 configured as described above has flexibility and can be placed at a desired position by an inspector by hand.

Next, a method for performing a component analysis inspection of solder on the printed circuit board 1 discarded using the first component analyzer 200 of the first embodiment configured as described above will be described.
The discarded printed circuit board 1 to be inspected is placed on the sample stage 18. The sample stage 18 is a belt conveyor, and is configured such that the printed circuit board 1 to be inspected is sequentially conveyed to the inspection position.

  As shown in FIG. 2, an electronic component 16 is mounted on the printed circuit board 1, and terminals of the electronic component 16 are connected to lands 15 of the printed circuit board 1 by solder 17. Using the solder 17 as an object to be analyzed, the inspector places the tip of the atmospheric pressure plasma source 2 in proximity to the land 15 to which the solder 17 is attached. Further, the tip of the translucent part 6 is also arranged close to the land 15. At this time, the exhaust nozzle of the exhaust device 55 is also arranged toward the land 15. The printed circuit board 1 is placed on the sample stage 18 so that the solder 17 faces upward. The sample stage 18 will be described with an example of being formed of a resin, but may be a conductor structure. In that case, the sample stage 18 is used while being grounded.

  As shown in FIG. 2, in the atmospheric pressure plasma source 2, a portion that contacts the plasma 5 closest to the solder 17 that is an object to be analyzed is constituted by a dielectric 12. The dielectric 12 is provided at the plasma-side tip of the discharge electrode 13 so that the discharge electrode 13 to which high-frequency power is supplied does not directly face the object to be analyzed. An inert gas such as helium gas from the gas supply device 3 flows through the gas flow path 73 of the stainless steel pipe 71, the porous ceramic 72 having air permeability, and the gas flow path 14 in the discharge electrode 13 as indicated by arrows.

  As described above, after disposing the atmospheric pressure plasma source 2, the translucent unit 6, and the exhaust nozzle of the exhaust device 55, an inert gas such as helium gas is supplied to the atmospheric pressure plasma source 2 from the gas supply device 3 by 1000 sccm (100 sccm or more). A high frequency power of 200 W (preferably 10 W or more and 500 W or less) having a frequency of 13.56 MHz is supplied from the power source 4 while supplying an amount of 10 slm or less. As a result, plasma 5 is generated between the atmospheric pressure plasma source 2 and the land 15. The light from the object to be analyzed irradiated by the plasma 5 is guided to the filter 7 that transmits light having a wavelength of 666 nm through the optical fiber 6A of the light transmitting portion 6. The light that has passed through the filter 7 is guided to the photodiode 8 and monitored. The tip of the light transmitting portion 6 on the plasma side of the optical fiber 6 </ b> A serves as a light emission input portion 100 to which light from the object to be analyzed irradiated by the plasma 5 is incident.

  A signal that is photoelectrically converted by the photodiode 8 through the optical fiber 6A is sent to the control device 9 of the component analysis unit 200B. The control device 9 discriminates elements contained in the solder 17 that is the object to be analyzed from the light emission of the plasma 5. Heavy metal elements are excited and emit light when heated to high temperatures. The wavelength is unique to the element and its intensity is proportional to the content. Therefore, by analyzing the light of the plasma 5 generated when the solder 17 is excited, it is determined whether the object to be analyzed is a solder containing lead or a lead-free solder. That is, if the emission intensity of the plasma 5 at a specific wavelength is higher than a predetermined value, it is determined that the solder 17 that is the object to be analyzed contains lead. At the same time, if it is determined that the solder contains lead, a detection sound is emitted from the speaker 10 and the indicator 11 is lit to notify the inspector accordingly. That is, in the first component analysis apparatus 200 shown in FIG. 1, when a specific element, for example, lead is detected, a notification unit for notifying the inspector by sound and / or light is provided to the component analysis unit 200B. Is provided.

The first component analysis apparatus 200 shown in FIG. 1 can be used when an emission peak of an element for determining whether or not it is contained in an object to be analyzed is known in advance. In the first component analyzer 200, light having a specific wavelength is extracted by the filter 7, and the light emission intensity of the light is measured. Therefore, the first component analyzer 200 can be configured as a component analyzer at a very low cost and is a small device that can be easily handled.
Note that the second component analyzer 300 shown in FIG. 4 is used to clarify in advance the emission peak of the element to be determined in the object to be analyzed. The second component analyzer 300 differs from the first component analyzer 200 described above in the configuration of the component analyzer 300B. Therefore, the plasma light emitting unit 300A of the second component analyzer 300 has the same configuration as the plasma light emitter 200A of the first component analyzer 200. For this reason, in the 2nd component analyzer 300, what has the same function as the composition of the 1st component analyzer 200 is attached with the same numerals, and the explanation is omitted.

In the second component analyzer 300 shown in FIG. 4, the light from the optical fiber of the translucent unit 6 is supplied to the spectroscope 19 as it is, and the emission intensity in a wider wavelength range than that of the first component analyzer 200 is measured. To do. Note that the second component analyzer 300 can also be used for component analysis of an object whose component is completely unknown.
FIG. 5 is an emission spectrum when the second component analyzer 300 analyzes a printed circuit board on which electronic components are mounted using solder containing lead. FIG. 6 shows an emission spectrum when the second component analyzer 300 analyzes a printed circuit board on which electronic components are mounted using lead-free solder (having tin-silver-copper as a main component). is there. Comparing FIG. 5 and FIG. 6, it can be seen that there are some emission peaks that can be seen only in the case of solder containing lead. That is, the wavelengths are 427 nm (peaks surrounded by “A” in FIG. 5), 666 nm (peaks surrounded by “B” in FIG. 5), and 730 nm (peaks surrounded by “C” in FIG. 5). These wavelengths are considered to be light emission specific to lead. Therefore, by monitoring any of these wavelengths, it is possible to determine whether the solder used in the printed circuit board to be inspected is lead-containing solder or lead-free solder. In order to make the determination more easily, the transmission wavelength of the filter 7 may be set to 427 nm, 666 nm, or 730 nm using the apparatus having the configuration shown in FIG.
In addition, although the emission peak of silver or copper does not appear in FIG. 6, since the boiling point of silver or copper is higher than lead, it is thought that there was little quantity volatilized in plasma. The boiling point of lead is 1750 ° C., the boiling point of silver is 2184 ° C., and the boiling point of copper is 2580 ° C.

  As a reference for determining whether or not a specific element is contained in the object to be analyzed, a predetermined emission intensity value at a specific wavelength is used. For example, whether or not a specific element is included is determined based on whether the measured light emission intensity value is larger or smaller than a predetermined threshold value. Alternatively, it is possible to measure the emission intensities at two or more wavelengths and determine whether or not a specific element is included depending on whether the emission intensity ratio is larger or smaller than a predetermined threshold value. . In this case, as an emission peak serving as a reference for the emission intensity ratio, an emission peak of an inert gas supplied from the gas supply device 3, for example, helium (eg, 706 nm) can be used. In this case, the emission intensity at two wavelengths is measured using two optical fibers, two filters, and two photodiodes. Alternatively, the light taken into one optical fiber 6 may be split into two by an optical divider and monitored using a filter and a photodiode. When the emission intensity ratio is calculated in this way, the indicator may be configured to display the magnitude.

  Further, when the emission peak of the inert gas is used as a reference, the value of the emission intensity is not zero, and therefore it is possible to determine whether or not the discharge has occurred normally by calculating the emission intensity ratio. For this reason, there exists an advantage that the reliability of a component analysis increases.

<< Second Embodiment >>
Hereinafter, the component analyzer of the second embodiment of the present invention will be described with reference to FIG.
FIG. 7 is an enlarged cross-sectional view of a portion where plasma is generated in the component analyzer of the second embodiment of the present invention. In the second embodiment, components having the same functions and configurations as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. The component analyzer of the second embodiment is different from the component analyzer of the first embodiment in the configuration of the atmospheric pressure plasma source 2A.

As shown in FIG. 7, the atmospheric pressure plasma source 2 </ b> A is provided with a discharge electrode 13 to which high-frequency power is supplied at a portion closest to the object to be analyzed (solder 17), that is, a portion in contact with the plasma 5. . That is, in the second embodiment, the dielectric is not formed at the tip of the discharge electrode 13.
In the component analyzer of the second embodiment, the inert gas flows through the gas flow path 14 in the discharge electrode 13 as indicated by the arrow, and is sprayed directly onto the solder 17 from the opening. The terminals of the electronic component 16 mounted on the printed circuit board 1 to be inspected are joined to the lands 15 formed on the printed circuit board 1 by solder 17. The printed circuit board 1 is placed on the sample stage 18.

  The component analyzer of the second embodiment configured as described above has a characteristic that the generated plasma 5 tends to be arc discharge. Arc discharge is difficult to control due to its instability. However, by using arc discharge, a part of the solder 17 used for joining is ejected in a relatively large amount into the plasma 5, so that there is an advantage that analysis sensitivity can be improved. However, in order to prevent damage to the atmospheric pressure plasma source 2 and the power source 4 due to a high discharge current, it is preferable that the continuous discharge time is 1 second or less. In the component analysis, it is possible to analyze sufficiently even in such a short time.

  In the component analyzer of the second embodiment, the discharge electrode 13 of the atmospheric pressure plasma source 2A is connected to the power source 4. High frequency power is supplied. On the other hand, the cover 54 serving as the outer skin of the atmospheric pressure plasma source 2A is grounded. Therefore, the atmospheric pressure plasma source 2 </ b> A is configured to be moved by an inspector by hand with respect to the printed circuit board 1 to be inspected, and has a structure that can be easily arranged at a desired position on the printed circuit board 1. .

<< Third embodiment >>
Hereinafter, a component analyzer according to a third embodiment of the present invention will be described with reference to FIG. FIG. 8 is a schematic configuration diagram showing a component analyzer of the third embodiment of the present invention. In the third embodiment, components having the same functions and configurations as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. The component analyzer 400 of the third embodiment is different from the first component analyzer 200 of the first embodiment in the configuration of the component analyzer 400B. The atmospheric pressure plasma source 400A has the same configuration as the atmospheric pressure plasma source 200A of the first embodiment.

  As shown in FIG. 8, in the component analyzer 400 of 3rd Example, the exit of translucent part 6D has branched to three. Filters 20, 22, and 24 are provided at the respective outlets in accordance with the respective optical axes, and light that has passed through the filters 20, 22, and 24 is guided to the photodiodes 21, 23, and 25, respectively, and monitored. . The signals photoelectrically converted by the photodiodes 21, 23, 25 are sent to the control device 9 of the component analysis unit 400B. In the component analyzer 400 of the third embodiment, the three filters 20, 22, and 24 pass light of different wavelengths. The control device 9 can determine the presence or absence of the three elements in the object to be analyzed from the light emission intensities relating to the three wavelengths from the light emission of the plasma 5. When it is determined that the object to be analyzed contains each element, detection sounds are emitted from the corresponding speakers 26, 28, and 30, and the corresponding indicators 27, 29, and 31 are turned on.

Hereinafter, a specific operation of the component analyzer 400 of the third embodiment configured as described above will be described.
As shown in FIG. 8, with the solder on the printed circuit board 1 as an object to be analyzed, an atmospheric pressure plasma source 2B is arranged in the vicinity of the land to which the solder is attached. A high-frequency power 200 W having a frequency of 13.56 MHz is supplied from the power supply 4 while supplying 1000 sccm of an inert gas, for example, helium gas, from the gas supply device 3 to the atmospheric pressure plasma source 2B. As a result, plasma 5 is generated between the atmospheric pressure plasma source 2B and the land. The generated light of the plasma 5 is guided to the optical fiber of the translucent part 6D and branched into three on the way. The light guided to the first filter 20 by the optical fiber passes through the first filter 20 and reaches the first photodiode 21 for monitoring.

  The light guided to the second filter 22 by the optical fiber passes through the second filter 22 and reaches the second photodiode 23 to be monitored. The light guided to the third filter 24 by the optical fiber passes through the third filter 24 and reaches the third photodiode 25 to be monitored. Note that the tip of the optical fiber on the plasma side is the light emission input unit 100. The signals photoelectrically converted by the photodiodes 21, 23 and 25 are sent to the control device 9 of the component analysis unit 400B, and the control device 9 determines the element contained in the object to be analyzed from the light of the plasma 5. Here, the presence or absence of the three elements can be determined by using the three filters 20, 22, and 24 having different transmission wavelengths. When it is determined that a specific element is included, a detection sound is emitted from the first speaker 26, and the first indicator 27 is turned on, and the inspector includes the element. To be notified. When another element is detected, a detection sound is emitted from the second speaker 28, and the second indicator 29 is turned on to notify the inspector that the element is contained. When another element is detected, a detection sound is emitted from the third speaker 30 and the third indicator 31 is lit to notify the inspector that the element is contained.

  It is also possible to detect whether or not the object to be analyzed contains one specific element, for example, lead, using the component analysis apparatus 400 of the third embodiment. That is, if the emission intensity of the plasma 5 at the three specified wavelengths is higher than a predetermined value, it can be determined that the specific element is surely included in the object to be analyzed. For example, if the object to be analyzed is solder and the determination element is lead, the three wavelengths are 427 nm (“A” in FIG. 5), 666 nm (“B” in FIG. 5), and 730 nm (“C” in FIG. 5). )). As described above, by determining the object to be analyzed based on the emission intensities at the three wavelengths, it is possible to perform determination with higher accuracy.

<< 4th Example >>
Hereinafter, a component analyzer according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 9 is an enlarged cross-sectional view of a portion where plasma is generated in the component analyzer of the fourth embodiment of the present invention. In the fourth embodiment, components having the same functions and configurations as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted. In the component analyzer of the fourth embodiment, the difference from the first component analyzer 200 of the first embodiment is the configuration of the atmospheric pressure plasma source 2C in the plasma generator. In the component analyzer of the fourth embodiment, a light transmitting part is provided in the atmospheric pressure plasma source 2C.

  In FIG. 9, the atmospheric pressure plasma source 2 </ b> C has a tip portion 32 that is closest to an object and contacts the plasma 5, and is made of a transparent material such as quartz glass. The tip 32 is fixed to the plasma side end of the discharge electrode 13, and power is supplied to the discharge electrode 13. An inert gas, for example, helium gas, flows through the gas flow path 14 in the discharge electrode 13 as indicated by an arrow. The terminals of the electronic component 16 positioned and mounted on the lands 15 provided on the printed circuit board 1 are joined to the lands 15 by solder 17. The printed circuit board 1 is placed on the sample stage 18. A transparent tube 33 is provided around the discharge electrode 13. The distal end portion 32 has a function as the light emitting input unit 100, and the transparent tube 33 has a function as an optical path. Light from the plasma 5 incident on the transparent cylinder 33 is guided to an optical fiber (not shown) connected to the transparent cylinder 33. Then, the light guided to the optical fiber reaches the photodiode through the filter and is photoelectrically converted. The photoelectrically converted signal is input to the control device, and the emission intensity of a specific wavelength is measured. Alternatively, the light guided to the optical fiber can enter the spectroscopic device so that the emission intensity in a wide wavelength range can be monitored.

  In the component analyzer of the fourth embodiment configured as described above, it is not necessary to apply the atmospheric pressure plasma source 2C obliquely to the object to be analyzed, and the light emission input unit 100 is surely brought close to the plasma 5. It becomes possible to make it. For this reason, the component analyzer of the fourth embodiment can further improve the reliability of the analysis result.

<< 5th Example >>
Hereinafter, a component analyzer according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 10 is a schematic configuration diagram showing a component analyzer of the fifth embodiment of the present invention.
In the fifth embodiment, components having the same functions and configurations as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted. The component analyzer of the fifth embodiment is different from the first component analyzer 200 of the first embodiment in the configuration of the atmospheric pressure plasma source in the plasma generator. The component analyzer of the fifth embodiment has a configuration in which an atmospheric pressure plasma source is arranged in a housing.

  In FIG. 10, the printed circuit board 1 is placed as an object to be analyzed in a vacuum vessel 34. Then, while supplying 1000 sccm of helium gas as an inert gas into the vacuum vessel 34, the pump 35 as an exhaust device exhausts the inside of the vacuum vessel 34, and high frequency power with a frequency of 13.56 MHz is supplied from the power source 4 to the sample electrode. 300 W is supplied to 18. As a result, plasma 5 is generated in the vacuum vessel 34. The light emitted from the plasma 5 is guided to the optical fiber of the light transmitting portion 6 and is guided to the filter 7 that transmits light having a wavelength of 666 nm through the optical fiber. The light that has passed through the filter 7 is guided to the photodiode 8 and monitored. The tip of the optical fiber on the plasma side is disposed in a hole formed in the wall surface of the vacuum vessel 34. The tip of the optical fiber provided in the hole in the wall surface of the vacuum vessel 34 is the light emission input unit 100.

  The signal photoelectrically converted by the photodiode 8 is sent to the control device 9 of the component analysis unit, and the control device 9 determines the element contained in the object to be analyzed from the light of the plasma 5. That is, if the emission intensity is higher than a predetermined value, it is determined that the object to be analyzed contains a specific element such as lead. When it is determined that a specific element is contained, a detection sound is emitted from the speaker 10 and the indicator 11 is lit to notify the inspector accordingly. That is, the component analyzer of the fifth embodiment is provided with a notifying unit for notifying the inspector by sound or light when a specific element is detected.

  In the configuration of the component analyzer of the fifth embodiment, there is no need for a sealed container or a pump, which is an advantage when using atmospheric pressure plasma, extremely low cost, easy local analysis, and analysis in a short time is lost. However, there is an excellent advantage that the plasma 5 can be stably generated for an object to be analyzed having an arbitrary shape. In other words, the component analyzer of the fifth embodiment does not need to set the positions of the atmospheric pressure plasma source and the light emission input unit 100 according to the object to be analyzed, and stably supplies the plasma 5 to the object to be analyzed. And can be easily generated, and a highly reliable component analysis can be performed.

<< Sixth embodiment >>
Hereinafter, a component analyzing apparatus and a component analyzing method according to a sixth embodiment of the present invention will be described with reference to FIG. The component analyzer of the sixth embodiment has the same configuration as the component analyzer of the first embodiment described above. The difference from the first embodiment is the component analysis method performed using the component analyzer. Accordingly, components having the same functions and configurations as the elements in the first embodiment described above are denoted by the same reference numerals and description thereof is omitted.

  In FIG. 11, the atmospheric pressure plasma source 2 is provided with a dielectric 12 in a portion closest to the solder that is an object to be analyzed, that is, a portion in contact with the plasma 5. The dielectric 12 is provided at the plasma side end of the discharge electrode 13. The high frequency power is supplied to the discharge electrode 13. An inert gas, for example, helium gas, flows through the gas flow path 14 in the discharge electrode 13 as indicated by an arrow. The printed circuit board 1 to be inspected is placed on the sample stage 18 and transported. The terminals of the electronic component 16 positioned and mounted on the lands 15 provided on the printed circuit board 1 are joined to the lands 15 by solder 17.

  In the component analysis method of the sixth embodiment, first, the solder 17 that is the object to be analyzed is polished, and polishing scraps 36 are formed on the surface of the solder 17 (polishing step). Next, as described in the first embodiment, the component 17 is used to excite the solder 17 that is the object to be analyzed to emit the plasma 5. In the component analysis method of the sixth embodiment, since the polishing debris 36 adheres to the surface of the solder 17 in the polishing step, the polishing debris 36 on the surface of the solder 17 is excited to generate plasma as shown in FIG. Make it emit light.

As described above, in the component analysis method using the component analyzer of the sixth embodiment, the surface area of the object to be analyzed that contacts the plasma 5 is increased, and the detection sensitivity is further improved.
In the component analysis method of the sixth embodiment, the example performed using the component analyzer of the first embodiment has been described. However, the second to fourth embodiments described above and the eighth embodiment described later are described. It is also possible to carry out by using the component analyzer of the eleventh embodiment.

<< Seventh embodiment >>
Hereinafter, a component analyzing apparatus and a component analyzing method according to a seventh embodiment of the present invention will be described with reference to FIG. The component analyzer of the seventh embodiment has the same configuration as the component analyzer of the first embodiment described above. The difference from the first embodiment is the component analysis method performed using the component analyzer. Accordingly, components having the same functions and configurations as the elements in the first embodiment described above are denoted by the same reference numerals and description thereof is omitted.

In FIG. 12, the atmospheric pressure plasma source 2 is provided with a dielectric 12 in a portion closest to the solder that is an object to be analyzed, that is, a portion in contact with the plasma 5. The dielectric 12 is provided at the plasma side end of the discharge electrode 13. The high frequency power is supplied to the discharge electrode 13. An inert gas, for example, helium gas, flows through the gas flow path 14 in the discharge electrode 13 as indicated by an arrow.
In the seventh embodiment, the printed circuit board 1 to be inspected is not directly inspected, but the solder that is the object to be analyzed on the printed circuit board 1 is polished, and the polishing waste is used as the inspection object.

In the component analysis method of the seventh embodiment, first, the solder that is the object to be analyzed is polished (polishing step). Polishing debris 36 is formed on the surface of the polishing pad 37 used in this polishing step. The polishing pad 37 used here is a cloth file, but it is also possible to use a grindstone that does not contain lead.
Next, as shown in FIG. 12, the plasma 5 is generated for the polishing dust 36 formed on the surface of the polishing pad 37 using the atmospheric pressure plasma source 2. In order to generate the plasma 5, the dielectric 12 is provided at the plasma side end of the discharge electrode 13, and power is supplied to the discharge electrode 13. An inert gas, for example, helium gas, flows through the gas flow path 14 in the discharge electrode 13 as indicated by an arrow. The light generated by the generation of the plasma 5 is spectrally analyzed to inspect the object to be analyzed.

  By using such an analysis method, the surface area of the substance (polishing waste) made of the same material as the object to be analyzed that comes into contact with the plasma 5 is increased, so that the detection sensitivity for the object to be analyzed is greatly improved.

<< Eighth embodiment >>
The component analyzer according to the eighth embodiment of the present invention will be described below with reference to FIG. FIG. 13 is an enlarged cross-sectional view of a portion where plasma is generated in the component analyzer used in the eighth embodiment of the present invention.

  In the eighth embodiment, components having the same functions and configurations as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. The component analyzer of the eighth embodiment is different from the first component analyzer 200 of the first embodiment in the configuration of the atmospheric pressure plasma source 2D in the plasma generator.

  In FIG. 13, the atmospheric pressure plasma source 2D in the component analyzer of the eighth embodiment has a tip 32 that is closest to the object to be analyzed and contacts the plasma 5 made of a transparent material such as quartz glass. Yes. Quartz glass contains less impurities, so the emission spectrum is not disturbed and high-precision inspection is possible. Moreover, since quartz glass resists etching by the plasma 5, it can be used for a long time. The tip 32 made of quartz glass is provided at the plasma side end of the discharge electrode 12, and power is supplied to the discharge electrode 13. An inert gas, for example, helium gas, flows through the gas flow path 14 in the discharge electrode 13 as indicated by an arrow. The terminals of the electronic component 16 positioned and mounted on the lands 15 provided on the printed circuit board 1 are joined to the lands 15 by solder 17. The printed circuit board 1 is placed on the sample stage 18. A transparent tube 33 made of a resin material that transmits transparent light is provided around the discharge electrode 13, and the tip 32 and the transparent tube 33 have the function of the light emitting input unit 100. The light that has entered the transparent tube 33 through the tip 32 is guided to an optical fiber (not shown) and monitors the light emission state, that is, the filter 7, the photodiode 8, and the control device 9 shown in FIG. The component analysis unit 200B configured or the component analysis unit 300B configured by the spectroscopic device shown in FIG. In addition, a coating layer 56 is formed on the outer peripheral surface of the transparent cylinder 33 with a resin having translucency that is different in material so that light incident on the transparent cylinder 33 does not leak, and the outer peripheral surface is grounded. A conductor cylinder 38A is provided.

  In the component analyzing apparatus of the eighth embodiment configured as described above, the discharge electrode 13 is surrounded by the tip 32, the transparent tube 33, the grounded conductor tube 38A, and the like. Leakage is suppressed, and safety for the inspector is improved.

<< Ninth embodiment >>
The component analyzer according to the ninth embodiment of the present invention will be described below with reference to FIG. FIG. 14 is an enlarged cross-sectional view showing a portion generating plasma that is an atmospheric pressure plasma source in the component analyzer of the ninth embodiment of the present invention. In the ninth embodiment, components having the same functions and configurations as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. As shown in FIG. 14, the atmospheric pressure plasma source 2E in the component analyzer of the ninth embodiment has a shape in which the tip of the conductor cylinder 38A extends in the component analyzer of the eighth embodiment of the present invention shown in FIG. Have. That is, the conductor cylinder 38B in the component analyzer of the ninth embodiment protrudes in the plasma generation direction and is configured to come into contact with the printed circuit board surface to be inspected.

  As described above, in the component analyzer of the ninth embodiment, since the tip of the conductor cylinder 38B of the atmospheric pressure plasma source 2E is in contact with the surface to be inspected, the printed circuit board 1 to be inspected and A constant distance (L) is always maintained between the discharge electrode 13 and the discharge electrode 13. As a result, a predetermined distance can be maintained between the object to be analyzed and the discharge electrode, and plasma processing can be performed with an appropriate discharge gap. That is, the tip portion of the conductor tube 38B in the component analyzer of the ninth embodiment functions as a spacer for maintaining a predetermined discharge gap. For this reason, according to the component analyzer of the ninth embodiment, there is an advantage that the plasma processing can be performed reliably and stably.

  FIG. 15 is an external view of a component type analyzer according to the ninth embodiment configured as a handy type that can be carried. An atmospheric pressure plasma source 2E in the handy-type component analyzer shown in FIG. 15 is a detection head, and is connected to the main body 80 by a flexible cable 70. In the flexible cable 70, a gas flow path of an inert gas, an optical path using an optical fiber, and electrical wiring are provided. The main body 80 in this component analyzer is provided with a speaker 10 and an indicator 11 as a notification unit. By using the handy-type component analyzer configured in this way, it becomes possible to easily inspect an object to be analyzed without selecting time and place.

  FIG. 16 is a diagram showing an example in which a start switch 120 is provided in the atmospheric pressure plasma source 2E of the component analyzer of the ninth embodiment. As shown in FIG. 16, the start switch 120 is provided with a button 121 protruding downward. This button 121 is pressed when the atmospheric pressure plasma source 2E comes into contact with the inspection object as a detection head, and turns on the component analyzer. When the component analyzer is turned on, the inert gas is discharged from the detection head, and high-frequency power is applied to the discharge electrode in the detection head. In the component analyzer configured as described above, since the start switch 120 is provided in the atmospheric pressure plasma source 2E that is the detection head, when the inspector operates the detection head by hand, the component analysis processing is performed. It is possible to carry out surely and easily. In addition, the component analyzer of the ninth embodiment has an excellent effect of shortening the use time of the expensive inert gas and minimizing the power consumption.

<< Tenth embodiment >>
The component analyzer according to the tenth embodiment of the present invention will be described below with reference to FIG. FIG. 17 is an enlarged cross-sectional view of a portion where plasma is generated in the component analyzer of the tenth embodiment of the present invention. The component analyzer of the tenth embodiment shown in FIG. 17 is provided with an exhaust mechanism in the atmospheric pressure plasma source 2D in the component analyzer of the eighth embodiment of the present invention shown in FIG.

  As shown in FIG. 17, an exhaust path 130 is formed outside the conductor cylinder 38A in the atmospheric pressure plasma source 2F of the component analyzer of the tenth embodiment. The outer peripheral surface of the atmospheric pressure plasma source 2F is configured by a resin outer cylinder 110. The outer cylinder 110 protrudes from a tip portion 32 made of quartz glass, and is configured to be able to inspect the tip portion of the atmospheric pressure plasma source 2F in contact with an inspection object.

  As described above, in the component analyzer of the tenth embodiment, since the tip of the outer cylinder 110 of the atmospheric pressure plasma source 2F is in contact with the surface to be inspected, the printed circuit board 1 to be inspected and the discharge are discharged. A predetermined distance between the electrodes 13 is always maintained. As a result, the component analyzer of the tenth embodiment can perform plasma processing with an appropriate discharge gap. That is, the outer cylinder 110 in the component analyzer of the tenth embodiment forms the exhaust passage 130, and the tip portion has a function as a spacer for maintaining the discharge gap. For this reason, the component analyzer of the tenth embodiment has an excellent advantage that the exhaust is surely performed and stable plasma processing can be performed.

<< Eleventh embodiment >>
The component analyzer according to the eleventh embodiment of the present invention will be described below with reference to FIG. FIG. 18 is an enlarged cross-sectional view of a portion where plasma is generated in the component analyzer of the eleventh embodiment of the present invention.

As shown in FIG. 18, the atmospheric pressure plasma source 2G in the component analyzer of the eleventh embodiment includes a mirror in the atmospheric pressure plasma source 2D of the component analyzer in the eighth embodiment of the present invention shown in FIG. 39 is provided. The atmospheric pressure plasma source 2G is configured to receive the light from the object to be analyzed reflected by the mirror 39 by the CCD 41 through the lens 40. A monitor unit 50 is constituted by the mirror 39, the lens 40, and the CCD 41 in the component analyzer of the eleventh embodiment. In the component analyzing apparatus of the eleventh embodiment configured as described above, the monitor unit 50 is used to record the state of the object to be analyzed by combining the image and the measured value with the recording unit (not shown). ) Can be recorded. In addition, it is possible to inspect while directly observing the light of the plasma 5.
Since the component analyzer of the eleventh embodiment configured as described above can monitor the measurement location, it can measure the light emission state in real time or record the analysis result and the image in combination.

  In the component analyzer of the eleventh embodiment, as shown in FIG. 15, the atmospheric pressure plasma source 2G can be a handy detection head having a diameter of 10 to 50 mm. In this case, the optical fiber and the electrical wiring led out from the detection head are composed of a flexible cable 70 as shown in FIG.

In each of the embodiments according to the present invention described above, several configuration examples are shown as the plasma source. However, various other plasma generators can be used.
In each embodiment, the case of helium gas, which is an inert gas, is illustrated as the discharge gas. However, it is also possible to use a gas in which another rare gas, for example, a rare gas such as neon, argon, or xenon is mixed. By using a rare gas, there are advantages such as a simple emission peak, easy generation of atmospheric pressure plasma, and safety.

  In each embodiment, the case where plasma is generated using high frequency power of 13.56 MHz is exemplified, but it is possible to generate plasma using high frequency power of several hundred kHz to several GHz. Or the structure which supplies DC power with respect to the discharge electrode 13 may be sufficient, and it is also possible to supply pulsed power. When pulse power is used, there is an advantage that an inert gas is unnecessary (can be discharged even with air) in the generation of atmospheric pressure plasma. When DC power is used, it is preferable that the sample stage 18 is made of a conductor and grounded.

In each embodiment, the case where power is supplied to the discharge electrode is mainly exemplified, but it is also possible to configure the sample stage as a sample electrode and supply power to the sample electrode. Further, a configuration in which power is directly supplied to the object to be analyzed is also possible.
In the first embodiment described above, 427 nm, 666 nm, and 730 nm are exemplified as emission wavelengths suitable for detecting lead. However, other wavelengths such as 220 nm used in ICP emission analysis may be used. Is possible.

In the third embodiment described above, the case where a plurality of elements are analyzed by branching an optical fiber is exemplified. However, by sequentially switching a plurality of filters having different transmission wavelengths without branching the optical path, the plurality of elements are changed. It can also be configured to be analyzed.
In each of the above-described embodiments, the case where atmospheric pressure plasma is used and the case where vacuum plasma is used (fifth embodiment) are exemplified. When plasma generated near atmospheric pressure is used, there are many advantages such as no need for an airtight container or pump, extremely low cost, easy local analysis, and short analysis.

  In the present invention, the object to be analyzed is polished, and the surface of the object to be analyzed is formed with polishing scraps is placed in a vacuum vessel, and plasma is generated in the vacuum vessel to monitor plasma emission. It is also possible to determine the element contained in the object from the light emission of the plasma. In this case, since the surface area of the object in contact with the plasma is increased as compared with the case where the object is placed in the vacuum vessel without being polished, the detection sensitivity is improved. In this case, a polishing unit provided with a polishing pad, a vacuum vessel, a sample electrode for placing a sample in the vacuum vessel, a power source for supplying power to the sample electrode, a light emitting input unit, and a light emission A component analyzer equipped with an analysis unit can be used.

In each embodiment, the case of detecting lead has been exemplified, but the element to be detected may be silver, bismuth, or indium. When configured for this purpose, it is possible to separate and collect printed circuit boards containing these expensive elements.
In the component analysis method and component analysis apparatus of the present invention, the element to be detected may be bromine. In this case, the object to be analyzed is, for example, an insulating material on a circuit board to be discarded, and the insulating material is directly irradiated with plasma. By performing component analysis of circuit boards and the like in this way, it becomes possible to separate and collect those that do not generate dioxins when the circuit boards to be discarded are incinerated.

  In the present invention, it is possible to improve operability at the time of analysis by forming an analysis land specially provided for analyzing a solder component on a printed circuit board or the like of a circuit board to be inspected. In this case, it is desirable that the size of the analysis land is larger than a circle having a diameter of 0.5 mm and smaller than a circle having a diameter of 10 mm. If the analysis land is too small, it becomes difficult to position the atmospheric pressure plasma source. Conversely, if the analysis land is too large, for example, an unnecessary area increases on the printed circuit board, which is not economical.

  The optical fiber used in each of the above embodiments is composed of a glass core with a high refractive index and a resin clad. However, in the present invention, a plastic optical fiber can be used. For example, it is possible to use a plastic optical fiber composed of an acrylic resin core and a fluorine resin clad. Thus, by using a plastic optical fiber, it becomes a component analysis apparatus with low cost and further excellent operability.

In each of the above embodiments, the indicator 11 of the notification unit may be composed of a plurality of light emitting diodes. With this configuration, the intensity of light emission at a predetermined wavelength can be indicated by a plurality of light emitting diodes in the component analysis result. The fire analysis target object with low emission intensity can be confirmed by performing component analysis again.
In addition, after the component analysis is performed, according to the identified element, a specific mark uniquely assigned to the element is applied to the printed circuit board, so that the analysis result can be reliably left on the inspection object. For the mark, it is possible to select a simple method such as application of a paint or sticking of a seal.

  Further, the detection sensitivity or S / N in the analysis can be obtained by irradiating the part to be analyzed with plasma for several seconds to several minutes, and removing the organic matter, flux, and other contaminants attached to the surface of the part to be analyzed, and then performing emission analysis. It is also possible to improve the ratio. In this case, the simplicity of analysis can be improved by performing both the removal (cleaning and cleaning) and the spectroscopic analysis using one atmospheric pressure plasma source. It is also effective to increase the removal rate of dirt by irradiating plasma of a gas containing oxygen or fluorine when removing the dirt.

  INDUSTRIAL APPLICABILITY The component analysis method and the component analysis apparatus of the present invention are useful because component analysis can be realized at low cost, and printed circuit boards and the like can be easily separated at a site where waste such as home appliances is processed.

The figure which shows schematic structure of the 1st component analyzer used in 1st Example of this invention. The expanded sectional view which shows the part which has generated the plasma in the 1st component analyzer of 1st Example of this invention The expanded sectional view which shows another structure of the 1st component analyzer of 1st Example The figure which shows schematic structure of the 2nd component analyzer used in 1st Example of this invention. Emission spectrum when analyzing printed circuit board with electronic components mounted using lead solder Emission spectrum when analyzing printed circuit board with electronic components mounted using lead-free solder The expanded sectional view of the part which has generated the plasma of the component analyzer of 2nd Example of this invention The figure which shows schematic structure of the component analyzer of 3rd Example of this invention. The expanded sectional view of the part which has generated the plasma of the component analyzer of 4th Example of this invention The figure which shows schematic structure of the component analyzer of 5th Example of this invention. The expanded sectional view of the part which has generated the plasma of the component analyzer used in 6th Example of this invention The expanded sectional view of the part which has generated the plasma of the component analyzer of 7th Example of this invention The expanded sectional view of the part which has generated the plasma of the component analyzer of 8th Example of this invention The expanded sectional view of the part which has generated the plasma of the component analyzer of 9th Example of this invention The figure which shows the structure of the component analyzer of 9th Example of this invention. The figure which shows another structure of the component analyzer of 9th Example of this invention. The expanded sectional view of the part which has generated the plasma of the component analyzer of 10th Example of this invention The expanded sectional view of the part which has generated the plasma of the component analyzer of 11th Example of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Atmospheric pressure plasma source 3 Gas supply apparatus 4 Power supply 5 Plasma 6 Translucent part 7 Filter 8 Photodiode 9 Control apparatus 10 Speaker 11 Indicator 55 Exhaust apparatus 71 Stainless steel tube 200 Component analyzer 200A Plasma generation part 200B Component analysis part

Claims (20)

A selection step of selecting a specific wavelength having a peak value of emission intensity from the relationship between the wavelength and emission intensity when plasma is irradiated to a specific element under atmospheric pressure;
A monitoring step of irradiating the object to be analyzed with plasma under atmospheric pressure, and measuring the light emission intensity of the object to be analyzed at the wavelength selected in the selection step; and the light emission intensity measured in the monitoring step; A determination step of comparing the emission intensity of the wavelength in the selection step to determine the presence or absence of the element contained in the object to be analyzed;
The component analysis method characterized by having.   When the specific element is a lead element, the specific wavelength is 427 nm, 666 nm, or 730 nm, and the emission intensity has an emission peak at the specific wavelength, it is determined that the object to be analyzed contains a lead element. The component analysis method according to claim 1.   The component analysis method according to claim 1, wherein in the monitoring step, light emission intensity of the object to be analyzed is measured by arc discharge of the discharge electrode.   2. In the monitoring step, each of the emission intensities of the object to be analyzed at a plurality of wavelengths is measured, and in the determination step, the presence or absence of each of a plurality of elements included in the object to be analyzed is determined. The component analysis method described.   2. The component analysis method according to claim 1, further comprising a polishing step of polishing the object to be analyzed in a stage prior to the monitoring step, wherein polishing powder is dispersedly arranged on a surface of the object to be analyzed in the polishing step. .   In the pre-stage of the monitoring step, the method includes a polishing step of polishing the object to be analyzed using a polishing tool, and in the monitoring step, the analysis target on the polishing surface of the polishing tool used in the polishing step The component analysis method according to claim 1, wherein the object is irradiated with the plasma, and the emission intensity of the object to be analyzed by the plasma is measured.   The component analysis method according to claim 1, further comprising a notifying step of notifying the outside in accordance with the determination result after determining the presence or absence of the element in the determining step.   The component analysis method according to claim 1, further comprising: a mark step of applying a specific mark to the object to be analyzed according to the determination result after determining the presence or absence of the element in the determination step.   2. The component analysis method according to claim 1, further comprising a step of irradiating plasma on the object to be analyzed to remove dirt on the surface of the object to be analyzed before the monitoring step. A sample stage on which an object to be analyzed is placed,
A discharge electrode having a gas flow path therein;
A gas supply unit for supplying gas to the discharge electrode;
A power source for supplying power to the discharge electrode;
It has a light emission input portion arranged close to the plasma generated between the discharge electrode and the object to be analyzed, and is formed of a translucent material that transmits light from the object to be analyzed generated by plasma irradiation. Translucent part,
A filter that transmits only light of a specific wavelength in the light from the light transmitting section, and a control for measuring the emission intensity of the light transmitted through the filter and determining the presence or absence of a specific element contained in the object to be analyzed apparatus,
A component analyzing apparatus comprising:   When the specific element is a lead element, the specific wavelength is 427 nm, 666 nm, or 730 nm, and the emission intensity has a light emission peak at the specific wavelength, the control device detects the lead element as the object to be analyzed. The component analysis apparatus according to claim 10, wherein the component analysis apparatus is configured to determine that the data is included and to store the data.   The component analysis apparatus according to claim 10, wherein the discharge electrode is an electrode to which high frequency power is supplied from the power source, and a dielectric is formed at an end of the discharge electrode facing the plasma.   The translucent part is configured to make light from an object to be analyzed enter each of a plurality of filters having different transmission wavelengths, and the emission intensity is measured by the control device for each light that has passed through the filter, The component analyzer according to claim 10, configured to detect the presence or absence of each of a plurality of elements to be detected included in the analysis target object.   A light-transmitting portion formed of a material that transmits light is provided on the outer peripheral surface of the discharge electrode, and a light-emitting input portion formed of a material that transmits light is formed at an end portion of the discharge electrode facing the plasma. The component analysis apparatus according to claim 10, wherein light from the light emitting input unit is incident on a filter through the light transmitting unit.   Light emission formed of a cylindrical light-transmitting portion formed of a material that transmits light so as to cover the outer peripheral surface of the discharge electrode, and formed of a material that transmits light at the end of the discharge electrode facing the plasma The component analysis apparatus according to claim 10, wherein an input unit is formed, and a conductor unit that is grounded so as to cover an outer peripheral surface of the translucent unit is provided.   The component analyzer according to claim 10, wherein a spacer is provided on the discharge electrode so that an end of the discharge electrode facing the plasma has a desired distance from the object to be analyzed.   The component analyzer according to claim 10, wherein a switch is provided at an end portion of the discharge electrode facing the plasma, and the switch is brought into contact with an object to be analyzed at the time of inspection to perform an analysis process.   The component analysis apparatus according to claim 10, wherein the component analysis apparatus is configured integrally with an exhaust path outside the discharge electrode.   The component analysis apparatus according to claim 10, wherein a monitor unit having a mirror, a lens, and a light detection element is provided at an end of the discharge electrode facing the plasma. The component analysis apparatus according to claim 10, further comprising a notification unit configured to notify the outside according to the determination result after the control device determines the presence or absence of the element.

Images