JP2005183702A - Composite electronic part and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a composite electronic part such as a laminated filter or the like having a coil and a capacitor wherein, even when a dielectric layer of the capacitor is decreased in thickness and the composite electronic part is miniaturized, the other characteristics are maintained with a high reliability, and to provide its manufacturing method. <P>SOLUTION: In the composite electronic part, the dielectric layer constituting the capacitor contains a Ti oxide, a Cu oxide and a Ni oxide as a main component, its thickness is 30 μm or less, its degree of dispersion of Ni is 80% or less, an average particle size of dielectric particles constituting the dielectric layer is 2.5 μm or less, and a standard deviation σ of a particle size distribution is 0.5 μm or less. A method for manufacturing the composite electronic part has the steps of preliminarily burning the composite electronic part and a dielectric ceramic composition material to obtain a granulation, pulverizing the granulation so that the average particle size is 0.1 to 0.8 μm and the degree of dispersion of Ni is 50% or less, to obtain a powder before burning, and burning the powder before burning. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a composite electronic component having a coil portion and a capacitor portion used for an electronic device or the like and a manufacturing method thereof, and more particularly to a composite electronic component having high reliability even when downsized and a manufacturing method thereof.

  With the demand for smaller and lighter electronic devices in which electronic components are incorporated, the demand for small multilayer electronic components has increased rapidly. A multilayer filter as a kind of a composite electronic component in which a coil and a capacitor are integrated is used for countermeasures against high-frequency noise on a circuit board in accordance with the arrangement of a plurality of such electronic components on a circuit board. It came to be able to.

  Since the multilayer filter is an electronic component having a coil portion and a capacitor portion at the same time, it is necessary to simultaneously fire the magnetic material constituting the coil portion and the dielectric ceramic composition constituting the capacitor portion in the manufacturing process. There is. In general, ferrite used as a magnetic material constituting the coil portion has a low sintering temperature of 800 to 900 ° C. Therefore, the material constituting the dielectric ceramic composition used for the capacitor part of the multilayer filter is required to be capable of low-temperature sintering.

Dielectric porcelain compositions containing TiO ₂ , CuO, NiO, MnO ₃ , NiO and Ag ₂ O and other dielectric porcelain compositions having improved sinterability at low temperatures (for example, Patent Documents 1 and 2), Dielectric ceramic compositions containing TiO ₂ , ZrO ₂ , CuO, and MnO ₃ (for example, Patent Document 3), and further dielectric ceramic compositions containing NiO (for example, Patent Document 4) have been proposed. .

  On the other hand, with the recent miniaturization of electronic devices, there is an increasing demand for miniaturization of multilayer filters. In order to reduce the size of the multilayer filter while maintaining its performance, a method of making the coil part smaller and thinner and a method of making the capacitor part smaller and thinner can be considered.

  The coil portion can be dealt with by thinning the magnetic layer and the coil conductor and increasing the number of turns of the coil conductor, so that the coil portion can be made relatively easily. However, in the capacitor part, if the dielectric layer and internal electrodes are simply thinned and the number of stacked layers is increased, the reliability tends to decrease significantly due to factors such as the distance between the internal electrodes being reduced. There was a limit to thinning the layer.

  In particular, in a multilayer filter for low frequency (for example, 10 to 300 MHz) noise, it is necessary that the inductance of the coil portion is high and the capacitance of the capacitor portion is also high. As a method for improving the capacitance of the capacitor portion, a method of increasing the relative dielectric constant of the dielectric ceramic composition used for the dielectric layer, or a method of thinning the dielectric layer and the internal electrode can be considered. However, the dielectric ceramic composition that can be used for the multilayer filter is required to have low-temperature sinterability for the reasons described above, and there is a limit to the material selection. Further, if the dielectric layer and the internal electrode are simply thinned, reliability such as deterioration of the IR (insulation) life under a direct current electric field occurs. Therefore, for the above reasons, the capacitor part of the multilayer filter has not been reduced in size and thickness, and the multilayer filter has not been downsized.

Japanese Patent Publication No.8-8198 Japanese Patent No. 2504725 Japanese Patent No. 3272740 Japanese Patent No. 2977632

  It is an object of the present invention to provide a composite electronic component such as a multilayer filter having a coil portion and a capacitor portion. Even when the dielectric layer of the capacitor portion is thinned and the composite electronic component is miniaturized, the dielectric constant, etc. It is to provide a composite electronic component having excellent reliability and IR (insulation) life characteristics under a direct current electric field while maintaining various characteristics, and a method for manufacturing the same.

Means for Solving the Problems and Effects of the Invention

  The inventors of the present invention have a dielectric layer thickness of 30 μm or less, a Ni dispersity of 80% or less, an average particle size of dielectric particles constituting the dielectric layer of 2.5 μm or less, and a particle size distribution. It was found that the object of the present invention can be achieved by setting the standard deviation σ of 0.5 μm or less, and the present invention has been completed.

That is, the composite electronic component according to the present invention is
A coil portion composed of a coil conductor and a magnetic layer;
A composite electronic component having a capacitor portion composed of an internal electrode and a dielectric layer;
The dielectric layer contains Ti oxide, Cu oxide and Ni oxide as main components, and has a thickness of 30 μm or less and a Ni dispersity of 80% or less,
The dielectric particles constituting the dielectric layer have an average particle size of 2.5 μm or less, and a standard deviation σ of particle size distribution is 0.5 μm or less.

  The composite electronic component according to the present invention is not particularly limited, and examples thereof include a multilayer filter and a multilayer noise filter.

  In the present invention, in particular, by setting the Ni dispersion degree of the dielectric layer and the standard deviation σ of the particle size distribution of the dielectric particles constituting the dielectric layer within the above range, the thickness of the dielectric layer is 30 μm or less. Even in this case, it is possible to obtain a composite electronic component such as a multilayer filter having high reliability, particularly excellent IR (insulation) life characteristics under a direct current electric field.

  In the composite electronic component according to the present invention, preferably, the thickness of the internal electrode is 35% or less of the thickness of the dielectric layer.

  In the present invention, it is possible to effectively prevent the delamination phenomenon called delamination by setting the thickness of the internal electrode to 35% or less of the thickness of the dielectric layer.

  In the composite electronic component according to the present invention, it is preferable that the magnetic layer is composed of Ni—Cu—Zn based ferrite or Cu—Zn based ferrite.

  In a composite electronic component such as a multilayer filter, various materials can be used as the magnetic material constituting the magnetic layer constituting the coil portion. Depending on the selected material, the composite electronic component such as the multilayer filter can be used. Although it is possible to control the frequency characteristics, in the present invention, it is preferable to use the ferrite.

  In the composite electronic component according to the present invention, preferably, a lumped constant circuit including the coil portion and the capacitor portion is formed.

  In the composite electronic component according to the present invention, preferably, the lumped constant circuit is any of an L-type, T-type, π-type, or double π-type circuit.

  In the composite electronic component of the present invention, the circuit configuration may be various depending on the purpose, and any of L-type, T-type, π-type, or double π-type lumped constant circuit may be formed. preferable.

A method for manufacturing a composite electronic component according to the present invention includes:
A coil portion composed of a coil conductor and a magnetic layer;
A method for manufacturing a composite electronic component having a capacitor portion composed of an internal electrode and a dielectric layer,
As a dielectric ceramic composition raw material constituting the dielectric layer, a dielectric ceramic composition raw material containing at least an oxide of Ti, Cu and Ni and / or a compound which becomes these oxides after firing is 500 to 850 ° C. A step of pre-baking to obtain granules,
Pulverizing the granules so that the average particle size is 0.1 to 0.8 μm and the Ni dispersity is 50% or less to obtain a powder before firing;
And a step of firing the pre-fired powder.

  In the method for producing a composite electronic component according to the present invention, the dielectric ceramic composition raw material is granulated by pre-baking at 500 to 850 ° C., the granules are pulverized, the average particle size is 0.1 to 0.8 μm, Ni It is particularly important to obtain a pre-fired powder having a dispersity of 50% or less and to fire the pre-fired powder. By setting the average particle size and Ni dispersion degree of the powder before firing within the above ranges, the Ni dispersion degree of the dielectric layer after firing of a composite electronic component such as a multilayer filter is 80% or less, and the dielectric layer after firing It is possible to make the standard deviation σ of the particle size distribution of the dielectric particles constituting the material 0.5 or less. And by doing in this way, composite electronic parts, such as a layer type filter excellent in the high reliability, especially the IR life characteristic under a direct current electric field, can be manufactured.

  In the method of manufacturing a composite electronic component according to the present invention, preferably, when the powder before firing is fired, the coil portion and the capacitor portion are fired simultaneously.

  In the method for manufacturing a composite electronic component according to the present invention, preferably, the dielectric ceramic composition raw material further contains, as the dielectric ceramic composition raw material, an oxide of Mn and / or a compound that becomes an oxide of Mn after firing. Is used.

In the method for manufacturing a composite electronic component according to the present invention, preferably, diffraction of TiO ₂ (210) plane of diffraction intensity of (200) plane of NiO by X diffraction measurement using CuKα of the powder before firing as a radiation source. The ratio NiO (200) / TiO ₂ (210) to strength is 100 or less, more preferably 80 or less, more preferably 50 or less,
NiTiO ₃ of (104) NiTiO ratio diffraction intensity of the TiO ₂ (210) plane of the diffraction intensity of surface _{3 (104) / TiO 2 (} 210) is not less than 1, more preferably 20 or more, more preferably 50 That's it.

In the method for producing a composite electronic component of the present invention, the pre-fired powder obtained by granulating the dielectric ceramic composition raw material by calcination and pulverizing the granule is a solid solution of NiO and TiO _2. It is preferable to contain a large amount of NiTiO ₃ .

Hereinafter, the present invention will be described based on embodiments shown in the drawings.
FIG. 1 is a perspective view of a multilayer filter according to an embodiment of the present invention.
2 is a cross-sectional view of the multilayer filter along the line II-II shown in FIG.
FIG. 3 is an exploded perspective view showing a multilayer structure of the multilayer filter according to one embodiment of the present invention,
4A is a circuit diagram of a T-type circuit, FIG. 4B is a circuit diagram of a π-type circuit, FIG. 4C is a circuit diagram of an L-type circuit,
FIG. 5 is a perspective view of a multilayer filter according to another embodiment of the present invention.
FIG. 6 is an exploded perspective view showing a multilayer structure of a multilayer filter according to another embodiment of the present invention,
FIG. 7 is a graph showing the relationship between the frequency and the insertion loss of the multilayer filter according to the embodiment of the present invention.

As shown in FIG. 1, a multilayer filter 1 according to an embodiment of the present invention has a main body multilayer portion 11 as a main part, and external electrodes 21, 22, 23 on the left side in the figure, External electrodes 24, 25, and 26 are provided on the right side. The shape of the multilayer filter 1 is not particularly limited, but is usually a rectangular parallelepiped shape. Also, there is no particular limitation on the size, and it may be an appropriate size according to the application. Usually, (0.6 to 5.6 mm) × (0.3 to 5.0 mm) × (0.3 ˜1.9 mm). First, the structure of the multilayer filter according to this embodiment will be described.

  FIG. 2 is a cross-sectional view of the multilayer filter 1 taken along the line II-II shown in FIG. 1, and has a capacitor portion 30 in the lower layer portion and a coil portion 40 in the upper layer portion. The capacitor unit 30 has a dielectric layer 32 formed between the internal electrodes 31 and is a multilayer capacitor. On the other hand, the coil part 40 has a coil conductor 41 formed in a magnetic layer 42.

  The dielectric layer 32 constituting the capacitor unit 30 contains a dielectric ceramic composition. The dielectric ceramic composition contains a Ti oxide, a Cu oxide, and a Ni oxide as main components, and other subcomponents can be added as necessary.

The content of titanium oxide in the main component is preferably 50～99.5Mol% in terms of TiO _2. If the content of titanium oxide is too small, the dielectric constant tends to decrease.

  Copper oxide in the main component has an effect of improving the sinterability and an effect of increasing the relative dielectric constant, and the content thereof is preferably 0.5 to 50 mol% in terms of CuO. If the content of copper oxide is too large, the loss Q value tends to deteriorate, and if it is too small, the above effects tend not to be obtained.

  Nickel oxide in the main component has an effect of improving the loss Q value, and its content is preferably 0 to 20 mol% (excluding 0 mol%) in terms of NiO, more preferably 0.5 to 20 mol%. When the content of nickel oxide is too large, the sinterability tends to decrease and the relative dielectric constant tends to decrease. When the content is too small, the above effects tend not to be obtained.

  The dielectric ceramic composition preferably contains an oxide of Mn as a subcomponent. The oxide of Mn has the effect of improving the sinterability and the effect of increasing the relative dielectric constant, and the content of Mn is preferably 0 to 3% by weight in terms of MnO. When the content of the Mn oxide is too large, the loss Q value tends to deteriorate, and when the content is too small, the above-described effect tends not to be obtained.

  The thickness of the dielectric layer is 30 μm or less. The lower limit of the thickness of the dielectric layer is not particularly limited, but is usually about 10 μm.

  The average particle diameter of the dielectric particles constituting the dielectric layer is 2.5 μm or less, preferably 2 μm or less. The lower limit of the average particle diameter is not particularly limited, but is usually about 0.5 μm. If the average particle diameter of the dielectric particles is too large, the insulation resistance tends to deteriorate.

  In this embodiment, the standard deviation σ of the particle size distribution of the dielectric particles is 0.5 μm or less, preferably 0.45 μm or less, more preferably 0.4 μm or less. The standard deviation σ of the particle size distribution of the dielectric particles is preferably as low as possible. When the standard deviation σ of the particle size distribution of the dielectric particles exceeds 0.5 μm, the insulation resistance tends to deteriorate.

  The average particle size of the dielectric particles and the standard deviation σ of the particle size distribution are calculated based on the measurement results obtained by cutting the dielectric layer, measuring the particle size of each dielectric particle by SEM observation of the cut surface. It is possible. At this time, regarding the particle diameter of each dielectric particle, the maximum particle width in the SEM image is defined as the particle diameter. In addition, when calculating the average particle size and the standard deviation σ, the number of particles for which the particle size is measured is usually 100 or more.

  In the present embodiment, the Ni dispersion degree of the dielectric layer is 80% or less, preferably 70% or less, and more preferably 60% or less. The lower the Ni dispersion degree of the dielectric layer, the better. If the Ni dispersion degree of the dielectric layer exceeds 80%, even if the temperature of the preliminary firing of the dielectric composition raw material is within the range of the present invention, for example, about 750 ° C., the IR life characteristics and the like deteriorate, and the reliability Tend to decrease.

  The Ni dispersion degree (CV value) is obtained by conducting EPMA (Electron Probe Micro Analysis) analysis of the cut surface of the dielectric layer, creating a histogram of the count value of the spectrum of Ni element, and calculating its standard deviation σ and The average value x is obtained, and C.I. V. (%) = (Standard deviation σ / average value x) × 100

  The conductive material contained in the internal electrode 31 constituting the capacitor unit 30 is not particularly limited, but it is preferable to use silver as the conductive material.

  The thickness of the internal electrode 31 is not particularly limited, and may be appropriately determined according to the thickness of the dielectric layer 32. The ratio to the thickness of the dielectric layer is preferably 35% or less, and more preferably 30% or less. It is. Thus, by making the thickness of the internal electrode 35% or less of the thickness of the dielectric layer, and further 30% or less, it becomes possible to effectively prevent the delamination phenomenon called delamination. By setting it to 30% or less, the occurrence rate of delamination can be reduced to approximately 0%.

  The magnetic layer 42 constituting the coil unit 40 contains a magnetic material having magnetism. The magnetic material is not particularly limited, but is preferably a ferrite containing an oxide of Ni, Cu, Zn or Mn as a main component. Examples of such ferrite include Ni—Cu—Zn ferrite, Cu—Zn ferrite, Ni—Cu ferrite, Ni—Cu—Zn—Mg ferrite, among others, Ni—Cu—. It is preferable to use Zn-based ferrite or Cu—Zn-based ferrite. In addition to the main component, the magnetic layer 42 may contain subcomponents as necessary.

  As the conductive material contained in the coil conductor 41 constituting the coil portion 40, the same material as that of the internal electrode 31 can be used.

  The external electrodes 21 to 26 are not particularly limited. For example, silver electrodes subjected to electroplating can be used. The electroplating is preferably performed with Cu—Ni—Sn, Ni—Sn, Ni—Au, Ni—Ag or the like.

Manufacturing method of multilayer filter The multilayer filter according to the present embodiment is similar to the conventional multilayer filter, in which a dielectric green sheet and a magnetic green sheet are produced, and these green sheets are stacked to form a green body stack. This is manufactured by forming an external electrode after forming a part and firing it. Hereinafter, the manufacturing method will be specifically described.

Production of Dielectric Green Sheet First, each main component material constituting the dielectric ceramic composition material and, if necessary, other subcomponent materials are prepared.

  As the main component material, Ti, Cu, Ni oxides and mixtures thereof, and complex oxides can be used. In addition, various compounds that become oxides and complex oxides by firing, such as carbonates, An oxalate salt, nitrate salt, hydroxide, organometallic compound, or the like can be selected as appropriate and used in combination.

  In addition, various subcomponent raw materials can be used as the subcomponent raw material, but in the present embodiment, it is preferable to use at least an oxide of Mn or a compound that becomes an oxide of Mn by firing.

  Next, each main component raw material and subcomponent raw material are mixed to prepare a mixed powder. The method of mixing each main component raw material and subcomponent raw material is not particularly limited. For example, the raw material powder may be dry-mixed in a powder state, or water or an organic solvent is added to the raw material powder. Alternatively, it may be performed by wet mixing using a ball mill or the like.

  Next, the mixed powder obtained above is pre-baked and granulated. In the pre-baking, the holding temperature is preferably 500 to 850 ° C., more preferably 600 to 850 ° C., and the temperature holding time is preferably 1 to 15 hours. This pre-baking may be performed in the air, or may be performed in an atmosphere having a higher oxygen partial pressure or in a pure oxygen atmosphere than in the air.

  Next, the granule obtained by preliminary baking is pulverized to prepare a powder before baking. The method for pulverizing the granule is not particularly limited. For example, water or an organic solvent can be added to the granule, and a ball mill or the like can be used for wet mixing.

  The pulverization is performed so that the average particle size of the pulverized powder before firing is 0.1 to 0.8 μm, preferably 0.3 to 0.6 μm. If the average particle size of the powder before firing is too large, the sinterability tends to deteriorate, and if it is too small, handling tends to be difficult.

  The grinding time is preferably 12 to 72 hours, more preferably 16 to 48 hours. If the pulverization time is too short, the pulverization tends to be insufficient, and the Ni dispersion degree tends to increase.

  In this embodiment, the Ni dispersion degree of the pre-fired powder after pulverization is 50% or less, preferably 45% or less, and more preferably 25% or less. The lower the Ni dispersion degree of the powder before firing, the better. When the Ni dispersity of the pre-fired powder exceeds 50%, even when the pre-baking temperature is within the range of the present invention, for example, about 750 ° C., the IR life characteristics and the like tend to deteriorate and the reliability tends to decrease. It is in.

  The Ni dispersion degree of the powder before firing after pulverization is measured by EPMA analysis on the powder surface of the powder before firing, similarly to the measurement of Ni dispersion degree of the dielectric layer.

In the present embodiment, the ratio of the diffraction intensity of the (200) plane of NiO to the diffraction intensity of the (210) plane of TiO _{2 in} the X-ray diffraction measurement using CuKα of the pre-fired powder after pulverization as a radiation source. NiO (200) / TiO ₂ (210) is preferably 100 or less, more preferably 80 or less, further preferably 50 or less, particularly preferably 20 or less, and most preferably 10 or less. Further, the ratio NiTiO _{3 (104)} with respect to the diffraction intensity of (104) of the plane diffraction intensity of the TiO ₂ in the (210) plane NiTiO _{3 /} TiO 2 is (210), preferably 1 or more, more preferably 20 or more, further Preferably it is 50 or more, Especially preferably, it is 80 or more, Most preferably, it is 100 or more. When NiO (200) / TiO ₂ (210) exceeds 100, it tends to be difficult to reduce the Ni dispersion degree of the powder before firing. Similarly, when NiTiO ₃ (104) / TiO ₂ (210) is less than 1, it tends to be difficult to lower the Ni dispersion degree of the powder before firing.

The pre-fired powder after pulverization preferably has a high content of NiTiO ₃ which is a solid solution of NiO and TiO _{2. If} the content of NiTiO _{3 in} the pre-fired powder is high, It tends to be possible to reduce the Ni dispersion degree of the body relatively easily. The reason for this is not necessarily clear, but the dispersibility of Ni is higher in the form of NiTiO ₃ which is a solid solution with TiO ₂ having a higher content than in the form of NiO having a lower content. ₂ is easily affected by dispersibility. Therefore, it is considered that NiTiO ₃ which is a solid solution has better Ni dispersibility. In addition, the X-ray diffraction measurement of the powder before firing after pulverization is performed by irradiating the powder before firing with X-rays using CuKα as a radiation source and measuring the diffraction intensity.

  Next, the powder before firing that has been mixed, pre-fired, and pulverized as described above is made into a paint to prepare a dielectric layer paste.

  The dielectric layer paste may be an organic paint obtained by kneading the pre-fired powder and the organic vehicle, or may be a water-based paint.

  The internal electrode layer paste is prepared, for example, by kneading a conductive material such as silver and the above-described organic vehicle.

  There is no restriction | limiting in particular in content of the organic vehicle in each above-mentioned paste, A binder is about 5-15 weight% with respect to normal content, for example, 100 weight% of powders before baking, and a solvent is 50-150 weight. It may be about%. Each paste may contain an additive selected from various dispersants, plasticizers and the like as necessary. The total content of these is preferably 10% by weight or less.

  Next, the dielectric layer paste is formed into a sheet by a doctor blade method or the like to form a dielectric green sheet.

  Next, an internal electrode is formed on the dielectric green sheet. The internal electrode is formed by forming the internal electrode paste on the dielectric green sheet by a method such as screen printing. The formation pattern of the internal electrode may be appropriately selected according to the circuit configuration of the multilayer filter to be manufactured, but in the present embodiment, each pattern is described later.

Production of Magnetic Green Sheet First, a magnetic material contained in the magnetic layer paste is prepared, and this is made into a paint to prepare the magnetic layer paste.

  The magnetic layer paste may be an organic paint obtained by kneading a magnetic material and an organic vehicle, or may be a water-based paint.

  As magnetic raw materials, as starting materials of main components, oxides of Ni, Cu, Zn, Mg or various compounds that become these oxides after firing, such as carbonates, oxalates, nitrates, hydroxides, It can also be suitably selected from organometallic compounds and the like and used in combination. Further, as a magnetic material, in addition to the above-mentioned main component, a subcomponent starting material may be contained as necessary.

  The magnetic material may be reacted in advance with each starting material constituting the magnetic material by calcining synthesis or the like before making the magnetic layer paste.

  The coil conductor paste is prepared by kneading, for example, a conductive material such as silver and the above-described organic vehicle.

  Next, the magnetic layer paste is formed into a sheet by a doctor blade method or the like to form a magnetic green sheet.

  Next, a coil conductor is formed on the magnetic green sheet produced above. The coil conductor is formed by forming a coil conductor paste on the magnetic green sheet by a method such as screen printing. The formation pattern of the coil conductor may be appropriately selected according to the circuit configuration of the multilayer filter to be manufactured. In the present embodiment, the pattern will be described later.

  Next, a through hole is formed in the coil conductor on the magnetic green sheet. A method for forming the through hole is not particularly limited, and can be performed by, for example, laser processing. The formation position of the through hole is not particularly limited as long as it is on the coil conductor, but it is preferably formed at the end portion of the coil conductor.

Lamination of Green Sheets Next, each of the dielectric green sheets and magnetic green sheets produced above are laminated in order to form the green body laminate 11.

  In the present embodiment, as shown in FIG. 3, the green body stacking unit 11 is formed by laminating a plurality of dielectric green sheets on which internal electrodes constituting the capacitor unit are formed, and a coil unit is formed thereon. It is manufactured by laminating a plurality of magnetic green sheets on which the coil conductors to be formed are formed. In addition, as shown in FIG. 3, a dielectric green sheet in which no internal electrode is formed may be laminated on the lowermost layer of the capacitor unit, or between the capacitor unit and the coil unit and on the uppermost layer of the coil unit. You may laminate | stack the magnetic body green sheet in which the coil conductor is not formed.

Hereinafter, the lamination process of a green sheet is explained in full detail.
First, the dielectric green sheet 32c in which no internal electrode is formed is disposed in the lowermost layer. The dielectric green sheet 32c on which no internal electrode is formed is used to protect the capacitor portion, and its thickness may be adjusted as appropriate.

  Next, on the dielectric green sheet 32c on which no internal electrode is formed, a pair of lead-out portions 24a projecting from the inner side of the dielectric green sheet in the short direction X to the end of the dielectric green sheet; A dielectric green sheet 32a on which an internal electrode 31a having 26a is formed is laminated.

  Next, on the dielectric green sheet 32a on which the internal electrode 31a is formed, a pair of lead-out portions projecting from the front side and the back side in the short direction X of the dielectric green sheet to the end portions of the dielectric green sheet, respectively. A dielectric green sheet 32b on which internal electrodes 31b having 22a and 25a are formed is laminated.

  The dielectric green sheet 32a on which the internal electrode 31a is formed in this manner and the dielectric green sheet 32b on which the internal electrode 31b is formed are stacked to constitute the internal electrodes 31a and 31b and the dielectric green sheet 32b. Thus, a single layer capacitor 30b in a green state is formed.

  Next, the dielectric green sheet 32a on which the internal electrode 31a is formed is laminated on the dielectric green sheet 32b on which the internal electrode 31b is formed. Similarly, the internal electrodes 31a, 31b, the dielectric green sheet 32a, A single-layer capacitor 30a in a green state is formed.

  Similarly, a plurality of green single-layer capacitors 30a and 30b are formed by alternately laminating dielectric green sheets 32a on which internal electrodes 31a are formed and dielectric green sheets 32b on which internal electrodes 31b are formed. Can be formed alternately. In the present embodiment, the single-layer capacitors 30a and 30b are stacked so as to have a total of six layers. However, the number of stacked layers is not particularly limited, and may be appropriately selected depending on the purpose.

  Next, a green coil portion is formed on the green capacitor portion formed by lamination as described above.

  First, a magnetic green sheet 42e on which no coil conductor is formed is laminated on the capacitor portion. The magnetic green sheet 42e on which the coil conductor laminated on the capacitor part is not formed is used for the purpose of separating the capacitor part and the coil part, and the thickness thereof may be adjusted as appropriate. In the present embodiment, the magnetic green sheet is used to separate the capacitor portion and the coil portion. However, a dielectric green sheet can be used instead of the magnetic green sheet.

  Next, on the magnetic green sheet 42e on which no coil conductor is formed, a pair of coils each having lead-out portions 21a and 23a, one end of which protrudes from the front end in the short direction X of the magnetic green sheet The magnetic green sheet 42a on which the conductor 41a is formed is laminated.

  A magnetic green sheet 42b on which a pair of substantially C-shaped coil conductors 41b is formed is laminated thereon. The substantially C-shaped coil conductor 41b is arranged so that the curved portion is on the front side in the longitudinal direction Y of the magnetic green sheet, and is further passed through one end on the near side in the short direction X of the magnetic green sheet. A hole 51b is formed.

  In addition, when laminating the magnetic green sheets 42b on which a pair of substantially C-shaped coil conductors 41b is formed, a conductor paste is used to join the coil conductors 41a and 41b through the through holes 51b. In addition, the conductor paste used when joining the through holes is not particularly limited, but is preferably a silver paste.

  A magnetic green sheet 42c on which a pair of coil conductors 41c having a pattern opposite to that of the coil conductor 41b is laminated on a magnetic green sheet 42b on which a pair of substantially C-shaped coil conductors 41b is formed. That is, the substantially C-shaped coil conductor 41c is arranged so that the curved portion is on the back side in the longitudinal direction Y of the magnetic green sheet. Further, the coil conductor 41c has a through hole 51c formed at one end of the magnetic green sheet in the short side direction X, and a conductor paste is used through the through hole 51c to connect the coil conductor 41b to the coil conductor 41c. The conductor 41c is joined.

  Similarly, a plurality of magnetic green sheets 42b on which the coil conductors 41b are formed and magnetic green sheets 42c on which the coil conductors 41c are formed are alternately stacked. Then, a pair of coil conductors each having lead-out portions 24b and 26b, one end projecting from the end on the back side in the lateral direction X of the magnetic green sheet, on the magnetic green sheet 42b on which the coil conductor 41b is formed. A magnetic green sheet 42d on which 41d is formed is laminated. The coil conductor 41d has a through hole 51d formed at one end on the front side in the short direction X of the magnetic green sheet. A conductor paste is used through the through hole 51d to connect the coil conductor 41b to the coil conductor 41b. The coil conductor 41d is joined.

  Finally, the magnetic green sheet 42f without the coil conductor is laminated on the magnetic green sheet 42d with the coil conductor 41d. The magnetic green sheet 42f on which the coil conductor is not formed is used to protect the coil portion and to adjust the thickness dimension of the multilayer filter. The thickness of the multilayer filter is a desired thickness. It may be adjusted as appropriate so that.

  As described above, by joining the coil conductors on the magnetic green sheets through the through holes, a coil of one turn is formed with two magnetic green sheets.

Baking of the main body laminated portion and formation of the external electrode Next, the green main body laminated portion produced by sequentially laminating the dielectric green sheet and the magnetic green sheet is fired. As firing conditions, the rate of temperature rise is preferably 50 to 500 ° C./hour, more preferably 200 to 300 ° C./hour, the holding temperature is preferably 840 to 900 ° C., and the temperature holding time is preferably 0.5 to 8 hours. More preferably, it is 1 to 3 hours, and the cooling rate is preferably 50 to 500 ° C./hour, more preferably 200 to 300 ° C./hour.

  Next, end firing is performed on the fired main body laminated portion by, for example, barrel polishing or sand blasting, and external electrode paste is applied and dried on both side surfaces of the main body laminated portion, and then baking is performed in FIG. External electrodes 21 to 26 as shown are formed. The external electrode is electroplated. The electroplating is preferably performed with Cu—Ni—Sn, Ni—Sn, Ni—Au, Ni—Ag or the like.

  When forming the external electrode, the external electrodes 21 and 23 are connected to the lead-out portions 21a and 23a of the coil portion to serve as input / output terminals. The external electrode 24 is connected to each lead-out part 24a of the capacitor part and the lead-out part 24b of the coil part, and serves as an input / output terminal for connecting the capacitor part and the coil part. Similarly, the external electrode 26 is connected to each lead-out part 26a of the capacitor part and the lead-out part 26b of the coil part, and serves as an input / output terminal for connecting the capacitor part and the coil part. The external electrodes 22 and 25 are connected to the lead-out portions 22a and 25a of the capacitor portion, respectively, and serve as ground terminals.

As described above, by forming the external electrodes 21 to 26 in the main body laminated portion 11, the laminated filter of this embodiment forms a T-type circuit shown in FIG.
The multilayer filter of the present embodiment manufactured as described above is mounted on a printed circuit board by soldering or the like, and used for various electronic devices.

  As mentioned above, although embodiment of this invention has been described, this invention is not limited to the embodiment mentioned above at all, and can be variously modified within the range which does not deviate from the summary of this invention.

  For example, in the above-described embodiment, the multilayer filter is exemplified as the composite electronic component according to the present invention. However, the composite electronic component according to the present invention is not limited to the multilayer filter, and has a dielectric layer having the above configuration. Anything can be used.

  In the above-described embodiment, the multilayer filter in which the T-type circuit is formed is illustrated, but a multilayer filter in which another lumped constant circuit is formed is also possible. For example, the other lumped constant circuit may be a π type shown in FIG. 4B, an L type shown in FIG. 4C, or a double π type formed by two π type circuits. 5 and 6 may be a multilayer filter in which four L-type circuits are formed.

  5 and 6, the multilayer filter formed with four L-shaped circuits can use the same material as that used in the above-described embodiment to form the dielectric layer and the magnetic layer. What is necessary is just to produce a magnetic body green sheet similarly to embodiment mentioned above. Hereinafter, a process subsequent to the process of laminating the dielectric green sheet and the magnetic green sheet will be described for the method of manufacturing the multilayer filter in which four L-type circuits are formed.

  First, a dielectric green sheet 132f having no internal electrode formed thereon is disposed in the lowermost layer, and an end portion of the dielectric green sheet is formed on the dielectric green sheet from the front and back sides in the longitudinal direction Y of the dielectric green sheet. A dielectric green sheet 132a on which an internal electrode 131a having a pair of lead-out portions 120a and 129a projecting is formed is laminated.

  Next, on the dielectric green sheet 132a on which the internal electrode 131a is formed, there is a lead-out portion 125a that protrudes from the inner side of the dielectric green sheet in the lateral direction X to the end of the dielectric layer. A dielectric green sheet 132b on which the internal electrode 131b is formed is laminated.

  Next, the dielectric green sheet 132a on which the internal electrode 131a is formed is laminated, and the dielectric green sheet 132a is led out from the inner side of the dielectric green sheet in the short side direction X to the end of the dielectric layer. A dielectric green sheet 132c on which an internal electrode 131c having a portion 126a is formed is laminated. In addition, the derivation | leading-out part 126a is arrange | positioned in the back | inner side along the longitudinal direction Y of a dielectric material green sheet from the derivation | leading-out part 125a.

  Next, the dielectric green sheet 132a on which the internal electrode 131a is formed is laminated, and the lead-out portion 127a is disposed on the back side along the longitudinal direction Y of the dielectric green sheet from 126a. A dielectric green sheet 132d on which the internal electrode 131d is formed is laminated.

  Next, the dielectric green sheet 132a on which the internal electrode 131a is formed is laminated, and the lead-out portion 128a is disposed on the back side along the longitudinal direction Y of the dielectric green sheet from 127a. A dielectric green sheet 132e on which the internal electrode 131e is formed is laminated.

  Finally, a dielectric green sheet 132a on which the internal electrode 131a is formed is laminated, and the respective lead-out portions are formed in different positions along the longitudinal direction Y of the dielectric green sheet. 130e is formed.

  Next, a coil portion is formed on the green capacitor portion formed by lamination as described above.

  First, a magnetic green sheet 142g on which no coil conductor is formed is stacked on the capacitor part, and one lead-out part projects from the back side in the short direction X of the magnetic green sheet to the end part on the magnetic green sheet 142g. A magnetic green sheet 142a on which four coil conductors 141a each having 125b, 126b, 127b, and 128b are formed is laminated.

  Next, a magnetic green sheet 142b on which four substantially U-shaped coil conductors 141b are formed is laminated thereon. In addition, the substantially U-shaped coil conductor 141b is disposed so that the curved portion is on the front side in the short direction X of the magnetic green sheet. As shown in FIG. 6, the coil conductor 141b is formed with a through hole 151b at one end of the coil conductor 141b. A conductor paste is used through the through hole 151b to connect the coil conductor 141a and the coil conductor. 141b is joined.

  Next, a magnetic green sheet 142c on which four substantially C-shaped coil conductors 141c are formed is laminated thereon. In addition, the substantially C-shaped coil conductor 141c is disposed so that the curved portion is on the front side in the longitudinal direction Y of the magnetic green sheet. As shown in FIG. 6, the coil conductor 141c is formed with a through hole 151c at one end of the coil conductor 141c. A conductor paste is used through the through hole 151c to connect the coil conductor 141b and the coil conductor. 141c is joined.

  Next, a magnetic green sheet 142d on which four substantially C-shaped coil conductors 141d are formed is laminated thereon. The substantially C-shaped coil conductor 141d is arranged so that the curved portion is on the front side in the longitudinal direction Y of the magnetic green sheet. As shown in FIG. 6, the coil conductor 141d has a through hole 151d formed at one end of the coil conductor 141d, and a conductor paste is used through the through hole 151d to connect the coil conductor 141c and the coil conductor. 141d is joined.

  Next, a magnetic green sheet 142e on which four substantially U-shaped coil conductors 141e are formed is laminated thereon. In addition, the substantially U-shaped coil conductor 141e is arranged so that the curved portion is on the back side in the lateral direction X of the magnetic green sheet. As shown in FIG. 6, the coil conductor 141e has a through hole 151e formed at one end of the coil conductor 141e, and a conductor paste is used through the through hole 151e to connect the coil conductor 141d and the coil conductor. 141e is joined.

  Next, a magnetic body on which four coil conductors 141f each having lead-out portions 121b, 122b, 123b, and 124b each projecting toward the end from the near side in the lateral direction X of the magnetic green sheet are formed. The green sheets 142f are stacked. A through hole 151f is formed at one end of the lead-out portion of the coil conductor 141f, and the coil conductor 141e and the coil conductor 141f are joined through the through hole 151f using a conductor paste.

  Finally, the magnetic green sheet 142h without the coil conductor is laminated on the magnetic green sheet 142f with the coil conductor 141f formed thereon.

  As described above, the coil is formed by joining the coil conductors on the magnetic green sheets through the through holes.

  Next, the green main body laminated portion produced by sequentially laminating the dielectric green sheet and the magnetic green sheet is fired and subjected to end face polishing to form an external electrode.

  When forming the external electrodes, the external electrodes 121 to 124 are connected to the respective lead-out portions 121a to 124a of the coil portion to serve as input / output terminals. The external electrodes 125 to 128 are connected to the derivation portions 125a to 128a of the capacitor portion and the derivation portions 125b to 128b of the coil portion, respectively, and serve as input / output terminals for connecting the capacitor portion and the coil portion. The external electrodes 120 and 129 are connected to the lead-out portions 120a and 129a of the capacitor portion, respectively, and serve as ground terminals.

  As described above, by forming the external electrodes 120 to 129 in the main body laminated portion 111, the laminated filter of the present embodiment has a configuration in which four L-type circuits shown in FIG. 4C are formed. Become.

  Hereinafter, although this invention is demonstrated based on a more detailed Example, this invention is not limited to these Examples.

Example 1
In this example, first, a dielectric green sheet was produced.
TiO ₂ , CuO, and NiO were prepared as the main component materials constituting the dielectric ceramic composition material, and MnCO ₃ was prepared as the subcomponent material, and each powder material was wet mixed. Wet mixing was performed by adding pure water to the prepared main component material and subcomponent material and mixing for 16 hours in a ball mill containing zirconia media.
The amount of each compound added is
TiO ₂ : 92 mol%,
CuO: 3 mol%,
NiO: 5 mol%,
MnCO ₃ : 1% by weight (based on the whole main component raw material).

  Next, the mixed raw material that was wet-mixed as described above was dried, and then samples 2 to 7 shown in Table 1 were pre-fired and granulated.

  Pre-baking conditions were performed at each temperature shown in Table 1 with a temperature holding time of 2 hours. For sample 1 in Table 1, no pre-firing was performed.

  Next, the granule obtained by preliminary baking was pulverized to produce a powder before baking. The pulverization was performed in a ball mill in which pure water was added to the granules and zirconia media was added. In Samples 1 to 6, the grinding time was 18 hours, and in Sample 7, the grinding time was 10 hours.

  The pre-firing powder obtained above was subjected to Ni dispersion degree and X-ray diffraction measurement.

Measurement of Ni dispersity (CV value) of pre-fired powder Ni dispersity (CV value) of the pre-fired powder was measured by EPMA analysis of the obtained pre-fired powder. A histogram of the count value of the spectrum of the element is created, and its standard deviation σ and average value x are obtained. V. (%) = (Standard deviation σ / average value x) × 100. The measurement conditions in the EPMA analysis were a visual field of 200 μm × 200 μm and a sampling number of 200 × 200. The results are shown in Table 1.

X-ray diffraction measurement of the powder before firing X-ray diffraction measurement is performed on the obtained powder before firing with an X-ray diffractometer using CuKα as a radiation source. From the measurement results, the diffraction intensity of the (200) plane of NiO the ratio of the diffraction intensity of the TiO ₂ in the (210) plane NiO _{(200) /} TiO 2 (210) and, NiTiO ₃ of (104) NiTiO ratio diffraction intensity of (210) plane of TiO ₂ of the diffraction intensity of the surface ₃ (104) / TiO ₂ (210) was determined. The results are shown in Table 1.

  Next, a resin binder, a solvent, a plasticizer, and a dispersant were added to the powder before firing obtained above, and a dielectric green sheet was produced by a doctor blade method. The thickness of the dielectric green sheet was about 20 μm.

  Next, a paste for internal electrodes containing silver as a main component was used, and internal electrodes were formed on a dielectric green sheet to produce a dielectric green sheet having a desired electrode pattern. In this example, a dielectric green sheet having a plurality of patterns was prepared so that the pattern of the internal electrodes was as shown in FIG.

Next, a magnetic green sheet was produced.
First, NiO, CuO, ZnO, and Fe ₂ O ₃ were prepared as raw materials constituting the magnetic material powder, and these raw materials were blended, and calcined and pulverized to prepare a magnetic material powder. Incidentally, the amount of each compound, NiO: 25mol%, CuO: 11mol%, ZnO: 15mol%, the remainder was _Fe 2 _{O 3.}

  A resin binder, a solvent, a plasticizer and a dispersant were added to the obtained magnetic material powder, and a magnetic green sheet was produced by a doctor blade method. The thickness of the magnetic green sheet was about 20 μm.

  Next, a coil conductor paste containing silver as a main component is used, the coil conductor is formed on a magnetic green sheet, and a through hole is formed by laser processing to have a desired conductor pattern and through hole. A magnetic green sheet was prepared. In this example, a magnetic green sheet having a plurality of patterns was produced so that the positions of the coil conductor patterns and the through holes were as shown in FIG.

  Next, the plurality of dielectric green sheets and the plurality of magnetic green sheets prepared as described above were laminated as shown in FIG. 3 and baked at 870 ° C. to produce a main body laminated portion. The external electrode paste was applied and dried on both side surfaces of the fired main body laminated portion, and the external electrodes were baked by firing to produce samples 1 to 7 of the multilayer filter as shown in FIG. The dimensions of the multilayer filter were 1.6 mm in length, 0.8 mm in width, and 0.8 mm in height.

  For samples 1 to 7 of the obtained multilayer filter, the thickness of the dielectric layer of the capacitor portion, the internal electrode thickness, the average particle size of the dielectric particles and the standard deviation σ of the particle size distribution, the Ni dispersion degree of the dielectric layer, The relative dielectric constant and the IR lifetime under a direct current electric field were measured.

Measurement of dielectric layer thickness and internal electrode thickness Cut the multilayer filter sample prepared above with a surface perpendicular to the internal electrode, polish the cut surface, and observe multiple points on the polished surface with a metal microscope Thus, the thickness of the dielectric layer and the thickness of the internal electrode were measured. The results are shown in Table 2.
Moreover, the ratio of the thickness of the internal electrode to the thickness of the dielectric layer was calculated at a 100 fraction from the results of the thickness measurement of the dielectric layer and the internal electrode. The results are shown in Table 2.

Measurement of average particle size of dielectric particles and standard deviation σ of particle size distribution As a method of measuring average particle size of dielectric particles and standard deviation σ of particle size distribution, first cut the multilayer filter sample in the same manner as above. The cut surface was polished. And the particle diameter of each dielectric particle was measured by SEM observation of the polished surface, and the average value and the standard deviation σ were obtained. In addition, the particle diameter of each dielectric particle at this time made the maximum particle width in the SEM image the particle diameter. The particle diameter of the dielectric particles was measured for 100 to 150 particles, and the average particle diameter and the standard deviation σ of the particle diameter distribution were obtained from the measurement results. Moreover, as a measurement condition of the particle diameter by SEM observation, magnification was set to 10,000 times, and image analysis was performed with an image analysis apparatus with respect to a visual field of 16 μm × 16 μm of the SEM image, and the particle diameter of each particle was measured. The results are shown in Table 2.

Measurement of Ni Dispersity (CV Value) of Dielectric Layer Measurement of Ni dispersion degree (CV value) of a dielectric layer is performed by first cutting a multilayer filter sample in the same manner as described above. EPMA analysis of the cut surface of the layer is performed, a histogram of the count value of the spectrum of Ni element is created, its standard deviation σ and average value x are obtained, and C.I. V. (%) = (Standard deviation σ / average value x) × 100. The measurement conditions in the EPMA analysis were a visual field of 50 μm × 50 μm and a sampling number of 250 × 250. The results are shown in Table 2.

Measurement of relative dielectric constant (ε _r ) With respect to the capacitor part of the multilayer filter sample, at a reference temperature of 20 ° C., with a digital LCR meter (4274A manufactured by YHP), frequency 1 MHz, input signal level (measurement voltage) 0.7 Vrms The capacitance C was measured under the conditions of / μm. And when the relative dielectric constant (unitless) was calculated from the obtained capacitance, the relative dielectric constant (ε _r ) of each sample was about 100.

Measurement of IR life under DC electric field (high temperature load life)
The measurement of the IR lifetime under a DC electric field was performed by applying a DC electric field of 10 V to the obtained multilayer filter sample in a thermostatic chamber at 85 ° C., and performing each of 500 hours, 1000 hours, 1500 hours and 2000 hours. This was done by measuring the insulation resistance during the application time. As an evaluation of the IR life under a direct current electric field, 20 samples were tested, and those having an insulation resistance of 10 ⁸ Ω or less at each application time were set to “impossible”. Table 2 shows the number of “impossible” samples with respect to the number of samples tested (20) at each application time.

Evaluation 1
Table 1 shows the pre-baking temperature, pre-baking time, average particle size, Ni dispersity, X-ray diffraction measurement results of the pre-fired powder samples 1 to 7 prepared above, and the pre-fired powder samples. The average particle size of the dielectric particles of the dielectric layers of the multilayer filter samples 1 to 7 produced in this way, the standard deviation σ of the particle size distribution, and the Ni dispersion degree are shown.

  The pre-firing powder samples 3 to 6 of the examples that were pre-fired at 550 to 800 ° C. for 2 hours had Ni dispersity after grinding of 50% or less, and the Ni dispersity increased as the firing temperature increased. There was a tendency to decrease. In addition, the Ni dispersity of the dielectric layers of the multilayer filter samples 3 to 6 produced using the powder samples 3 to 6 before firing is 80% or less, as in the case of the powder samples before firing. The Ni dispersity tended to decrease with increasing pre-baking temperature.

  On the other hand, the pre-firing powder sample 1 and the pre-firing powder sample 2 with a pre-firing temperature of 450 ° C., which were not pre-fired, both had Ni dispersities exceeding 50%. The Ni dispersion degree of the dielectric layer of the sample of the multilayer filter produced using the previous powder sample exceeded 80% in all cases.

  From this result, there is a certain relationship between the Ni dispersion degree of the dielectric layer of the multilayer filter and the Ni dispersion degree of the powder before firing, in order to reduce the Ni dispersion degree of the dielectric layer after firing. It was confirmed that it was effective to reduce the Ni dispersion degree of the powder before firing. Further, in order to set the Ni dispersion degree of the powder before firing to 50% or less and the Ni dispersion degree of the dielectric layer after firing to 80% or less, the pre-baking temperature is 500 to 850 ° C., preferably Was confirmed to be 600 to 850 ° C.

  Further, the standard deviation σ of the particle size distribution of the dielectric particles constituting the dielectric layer after firing decreases as the Ni dispersion degree of the powder before firing and the Ni dispersion degree of the dielectric layer after firing are lowered. The result was confirmed. From this result, it was confirmed that it was effective to reduce the Ni dispersion degree of the powder before firing in order to reduce the standard deviation σ of the particle size distribution.

Further, when the Ni degree of dispersion of pre-fired powder is lowered, the ratio NiO ₍₂₀₀₎ for the diffraction intensity of the (210) plane of TiO ₂ of the diffraction intensity of the (200) plane of the NiO _/ TiO 2 (210) is reduced, NiTiO ₃ of (104) NiTiO ratio diffraction intensity of the TiO ₂ (210) plane of the diffraction intensity of surface _{3 (104) / TiO 2 (} 210) that is greater was confirmed. From this result, it was confirmed that when the Ni dispersity was lowered, solid solution of NiO into TiO ₂ progressed, and the proportion of NiTiO _{3 as} a solid solution increased.

  In addition, the pre-baking powder sample 7 of the comparative example in which the pre-baking temperature was set to 750 ° C., which is the same as the sample 5 of the example, and the pulverization after granulation was shortened to 10 hours, was not sufficiently dispersed in the pulverization process. Therefore, the Ni dispersion degree exceeded 50%, resulting in a high result. In addition, the multilayer filter sample 7 produced using the pre-fired powder sample 7 has a result that the standard deviation σ of the particle size distribution of the dielectric layer exceeds 0.5 μm and the Ni dispersion degree exceeds 80%. It was.

Evaluation 2
Table 2 shows the thickness of the dielectric layer, the thickness of the internal electrode, the ratio of the thickness of the internal electrode to the thickness of the dielectric layer, the average particle size of the dielectric particles, and the standard deviation of the particle size distribution. σ, Ni dispersion degree of the dielectric layer, and IR lifetime under a direct current are shown.

  From Table 2, the ratio of the thickness of the internal electrode to the thickness of the dielectric layer was 35% or less in any multilayer filter sample, and no delamination occurred. It was also confirmed that the IR lifetime under a direct current electric field was improved as the standard deviation σ of the particle size distribution of the dielectric particles constituting the dielectric layer and the decrease in the Ni dispersion degree. In particular, the samples 3 to 6 of Examples in which the standard deviation σ of the particle size distribution is 0.5 μm or less and the Ni dispersity is 80% or less were confirmed to have an extreme decrease in insulation resistance even at an application time of 1500 hours. None of the samples were “impossible”.

  From this result, even when the thickness of the dielectric layer is 30 μm or less and further 20 μm or less, the standard deviation σ of the particle size distribution is 0. 0 in order to have excellent IR life characteristics under a direct current electric field. It was confirmed that the dispersion was 5 μm or less, preferably 0.45 μm or less, and the Ni dispersion degree of the dielectric layer was 80% or less, preferably 70% or less.

Example 2
The magnetic green sheet is prepared using CuO, ZnO and Fe ₂ O ₃ as starting materials constituting the magnetic material, the blending amounts being CuO: 11 mol%, ZnO: 40 mol%, and the balance being Fe ₂ O ₃ Then, a multilayer filter sample 8 was produced in the same manner as the sample 6 of Example 1 except that the magnetic body layer of the coil portion was made of Cu—Zn ferrite.

  Next, with respect to the multilayer filter sample 6 in which the magnetic layer of the coil portion is Ni—Cu—Zn-based ferrite and the multilayer filter sample 8 in which the magnetic layer is Cu—Zn-based ferrite, insertion loss is performed under the following conditions. Was measured.

Measurement of Insertion Loss Insertion loss was measured for the frequency band of 10 MHz to 5 GHz using a network analyzer for the multilayer filter samples 6 and 8. The relationship between the frequency obtained by the measurement and the insertion loss is shown in FIG.

  As shown in FIG. 7, the sample of the example of the present invention has a frequency band of 50 MHz to 3 GHz, particularly when Ni—Cu—Zn based ferrite or Cu—Zn based ferrite is used as the magnetic layer. It was confirmed that a sufficient noise removal effect can be realized at 800 MHz to 2.2 GHz.

FIG. 1 is a perspective view of a multilayer filter according to an embodiment of the present invention. 2 is a cross-sectional view of the multilayer filter taken along the line II-II shown in FIG. FIG. 3 is an exploded perspective view showing the multilayer structure of the multilayer filter according to one embodiment of the present invention. 4A is a circuit diagram of a T-type circuit, FIG. 4B is a circuit diagram of a π-type circuit, and FIG. 4C is a circuit diagram of an L-type circuit. FIG. 5 is a perspective view of a multilayer filter according to another embodiment of the present invention. FIG. 6 is an exploded perspective view showing a multilayer structure of a multilayer filter according to another embodiment of the present invention. FIG. 7 is a graph showing the relationship between the frequency and the insertion loss of the multilayer filter according to the embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Multilayer filter 11 ... Main body laminated part 21-26 ... External electrode 21a-26a, 24b, 26b ... Derivation part 30 ... Capacitor part 30a, 30b ... Capacitor 31 ... Internal electrode 31a, 31b ... Internal electrode 32 ... Dielectric layer 32a, 32b, 32c ... Dielectric green sheet 40 ... Coil portion 41 ... Coil conductors 41a, 41b, 41c, 41d ... Coil conductor 42 ... Magnetic body layers 42a-42f ... Magnetic body green sheets 51b, 51c, 51d ... Through hole 101 ... multilayer filter 111 ... main body laminated parts 120 to 129 ... external electrodes 120a to 129a, 125b to 128b ... lead parts 130a to 130e ... capacitors 131a to 131e ... internal electrodes 132a to 132f ... dielectric green sheets 141a to 141f ... coil conductors 142a-142h ... Magnetic Sexual green sheets 151b-151f ... Through hole

Claims (9)

A coil portion composed of a coil conductor and a magnetic layer;
A composite electronic component having a capacitor portion composed of an internal electrode and a dielectric layer,
The dielectric layer contains Ti oxide, Cu oxide and Ni oxide as main components, and has a thickness of 30 μm or less and a Ni dispersity of 80% or less,
A composite electronic component characterized in that the dielectric particles constituting the dielectric layer have an average particle size of 2.5 μm or less and a standard deviation σ of a particle size distribution of 0.5 μm or less.   The composite electronic component according to claim 1, wherein the thickness of the internal electrode is 35% or less of the thickness of the dielectric layer.   The composite electronic component according to claim 1, wherein the magnetic layer is composed of Ni—Cu—Zn-based ferrite or Cu—Zn-based ferrite.   The composite electronic component according to claim 1, wherein a lumped constant circuit including the coil portion and the capacitor portion is formed.   The composite electronic component according to claim 4, wherein the lumped constant circuit is any one of an L-type, T-type, π-type, or double π-type circuit. A coil portion composed of a coil conductor and a magnetic layer;
A method for manufacturing a composite electronic component having a capacitor portion composed of an internal electrode and a dielectric layer,
As a dielectric ceramic composition raw material constituting the dielectric layer, a dielectric ceramic composition raw material containing at least an oxide of Ti, Cu and Ni and / or a compound which becomes these oxides after firing is 500 to 850 ° C. A step of pre-baking to obtain granules,
Pulverizing the granules so that the average particle size is 0.1 to 0.8 μm and the Ni dispersity is 50% or less to obtain a powder before firing;
And a step of firing the pre-fired powder.   The method for manufacturing a composite electronic component according to claim 6, wherein when the powder before firing is fired, the coil part and the capacitor part are fired simultaneously.   The dielectric ceramic composition material according to claim 6 or 7, wherein the dielectric ceramic composition material further includes a Mn oxide and / or a compound that becomes a Mn oxide after firing. Production method. The ratio NiO (200) / TiO ₂ (210) of the diffraction intensity of the (200) plane of NiO to the diffraction intensity of the (210) plane of TiO ₂ by X diffraction measurement using CuKα of the powder before firing as a radiation source is 100. And
9. The composite electronic component according to claim 6, wherein a ratio of the diffraction intensity of the (104) plane of NiTiO _{3 to} the diffraction intensity of the (210) plane of TiO ₂ is NiTiO ₃ (104) / TiO ₂ (210) is 1 or more. Manufacturing method.

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