JP2005175640A - Solid state imaging device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid state imaging device capable of reducing the number of components and the cost. <P>SOLUTION: On the inside of a base 9 constituting a fixing part, a square frame-like holder 2 having an upper end being fixed with a solid state image sensor 1 is arranged. On the inside of the holder 2, its central resilient supporting part fixing end 2a, resilient supporting parts 2b and 2c having one end being coupled therewith and extended in the X direction, and resilient supporting parts 2d and 2e having one ends being coupled with the other ends of the resilient supporting parts 2b and 2c and extended in the Y direction and the other ends being coupled with the inner surface of the holder 2 are formed by integral molding. Lower end of the resilient supporting part fixing end 2a is fixed to the fitting hole 9e of the base 9 thus realizing a structure for driving the movable part electromagnetically while reducing the number of components and the cost. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an optical information recording / reproducing apparatus that records / reproduces information on / from an optical information recording medium using a solid-state imaging device, and drives a solid-state imaging device and a solid-state imaging device that drive a movable part on which the solid-state imaging device is mounted. Regarding the method.

In recent years, solid-state imaging devices have been mounted on a wide range of electronic devices such as optical information recording / reproducing devices in addition to video devices. For example, Japanese Patent Laid-Open No. 7-46613 discloses a solid-state imaging device used for electronic video equipment such as a three-plate TV camera and an electronic still camera.
When the light from the photographic lens is separated into colors and imaged on the solid-state image sensor for each color component, the pixels of the three solid-state image sensors that image each color component are obtained in order to obtain good color reproduction. A registration adjustment mechanism for accurately matching is required.
In this conventional example, a structure is disclosed in which minute driving means is provided on the back surface or the peripheral portion of the imaging device and fixed in an aligned state.
Japanese Patent Laid-Open No. 7-46613

  In the above-mentioned conventional example, although it is a micro drive means for alignment, there is a disadvantage that the number of parts is increased and therefore the cost is increased.

(Object of invention)
The present invention has been made in view of the above-described points, and an object of the present invention is to provide a solid-state imaging device capable of reducing the number of parts and reducing the cost.

The present invention includes a solid-state imaging device that captures an optical image obtained through an optical system, a holding member that holds the solid-state imaging device, a drive coil that is fixed to the holding member that drives the holding member, A magnetic member that acts on the drive coil to generate a magnetic flux; and a support member that supports the solid-state imaging device to be displaceable with respect to the fixed member by fixing one end to the holding member and the other end to the fixed member. In a solid-state imaging device,
The support member has a plurality of elastic support portions so that the solid-state imaging device can be displaced in at least two axial directions, and these elastic support members are integrally formed and arranged on the back surface of the imaging surface of the solid-state imaging device. The solid-state imaging device is moved by an electromagnetic action between the drive coil and the magnetic member.

  According to the present invention, the number of parts can be reduced and the cost can be reduced.

BEST MODE FOR CARRYING OUT THE INVENTION

  Embodiments of the present invention will be described below with reference to the drawings.

1 to 6 relate to a first embodiment of the present invention, FIG. 1 shows a solid-state imaging device according to the first embodiment of the present invention in a perspective view, and FIG. 2 shows a solid-state imaging device according to the first embodiment in a plan view. FIG. 3 is an exploded perspective view of the solid-state imaging device according to the first embodiment, and FIGS. 4 to 6 are explanatory diagrams of operations when the solid-state imaging device is driven in the X direction, the Y direction, and the θ direction, respectively.
As shown in FIGS. 1 to 3, the solid-state imaging device 10 of the present embodiment includes a solid-state imaging device 1 that performs imaging, a holder 2 that holds the solid-state imaging device 1 attached to an upper surface, and a side surface of the holder 2. A movable part composed of four coils 3 to 6 attached to the magnet, and around the movable part, there are eight magnets 7a to 7d and 8a to 8d, and these magnets 7a to 7d and 8a to 8d. And a fixed part constituted by a base 9 that movably holds the movable part.

The solid-state imaging device 1 is composed of an image receiving device such as a CCD or CMOS, and an imaging surface 1a is provided at the center thereof, and a subject image is formed on the imaging surface 1a via an optical system (not shown). Is done.
The back surface of the solid-state imaging device 1 is bonded and fixed to the upper end surface 2 g of the holder 2 that is a holding member of the solid-state imaging device 1.
The holder 2 has a quadrangular frame shape, and four coils 3 to 6 are bonded and fixed at substantially the center of each of the four opposing side surfaces on the outside of the holder 2.
The holder 2 is provided with an elastic support portion fixed end 2a, elastic support portions 2b and 2c, and elastic support portions 2d and 2e for supporting the movable portion in a displaceable manner.
This elastic support part fixed end 2a is arrange | positioned in the center of the holder 2, and is arrange | positioned in a column shape in the height direction (Z direction). One end is coupled to the elastic support portion fixed end 2a, and elastic support portions 2b and 2c extend in the X direction shown in the drawing parallel to the imaging surface 1a.

The other ends of the elastic support portions 2b and 2c are respectively coupled to one ends of elastic support portions 2d and 2e extending in the Y direction orthogonal to the elastic support portions 2b and 2c.
The other ends of the elastic support portions 2 d and 2 e that are parallel to the imaging surface 1 a and extend in the Y direction perpendicular to the X direction are coupled to the inner side surface of the holder 2.
The elastic support portions 2b and 2c have a dimension in the Z direction, which is the normal direction of the imaging surface 1a, larger than the dimension in the Y direction, and the elastic support portions 2d and 2e also have a Z direction dimension in the X direction. It is set so as to be larger than the above, and has a structure that is difficult to be displaced by disturbances such as vibrations and shocks in the Z direction.
The protrusion 2f for fitting formed at the base of the elastic support portion fixing end 2a is fitted into the fitting hole 9e of the base 9 and is fixed by adhesion. With the above configuration, the holder 2 to which the solid-state imaging device 1 is fixed is fixed to the base 9 via the elastic support portions 2b, 2c, 2d, and 2e, the elastic support portion fixing end 2a, and the fitting convex portion 2f. Will be.

Here, the holder 2, the elastic support portions 2b, 2c, 2d, and 2e, the elastic support portion fixed end 2a, and the fitting convex portion 2f are formed by integral molding of resin. Thereby, the number of parts is reduced, and the solid-state imaging device 10 can be provided at low cost.
The base 9 that is a fixed portion is formed by pressing a metal plate having magnetism, and has four raised portions 9a to 9d and a fitting hole 9e at the center. Eight magnets 7a to 7d and 8a to 8d are fixed to the inner side surfaces of the four rising portions 9a to 9d.
Two magnets 7i, 8i (i = a to d) are arranged for one rising portion, and the two magnets 7i, 8i are arranged adjacent to each other with their polarities reversed as shown in FIG. The Thus, for example, the direction of the magnetic flux generated by the magnets 7a and 8a is an arrow 11, the direction of the magnetic flux generated by the magnets 7b and 7b is an arrow 12, the direction of the magnetic flux generated by the magnets 7c and 8c is an arrow 13, and the magnet 7d And the direction of the magnetic flux generated by 8d is an arrow 14.

In the assembly of the solid-state imaging device 10 of the present embodiment, after the four coils 3 to 6 are bonded and fixed to the holder 2, the solid-state imaging device 1 is bonded and fixed to the holder 2 to form a sub-assembly of the movable part. On the other hand, eight magnets 7a to 7d and 8a to 8d are fixed to the base 9 to form a sub-assembly of the fixing portion. Thereafter, the sub-assembly of the movable part and the sub-assembly of the fixed part are fitted into the fitting convex part 2f of the holder 2 and the fitting hole 9e of the base 9, and are adhesively fixed to complete.
Next, the driving operation in the solid-state imaging device 10 of the present embodiment will be described with reference to FIG. The solid-state imaging device 10 according to the present embodiment is triaxially driven in the θ direction (optical axis rotation direction) around the X direction, the Y direction, and the Z direction.
As described above, the directions of the magnetic flux generated by the base 9 and the eight magnets 7a to 7d and 8a to 8d are the arrows 11 to 14, and the four coils 3 to 6 are wires that can supply power independently. By changing the directions of the currents of the four coils 3 to 6, it can be driven in a desired direction.

First, when the solid-state imaging device 1 is driven in the X direction, the current direction in the left and right sides of the coil 4 is set to 4a (−Z direction) and 4b (+ Z direction), and the current in the left and right sides of the coil 6 is changed. Is fed to the direction of 6a (−Z direction) and 6b (+ Z direction), driving forces 16 and 18 are generated in the coils 4 and 6, respectively, and the solid-state imaging device 1 is moved in the + X direction. Driven.
When the solid-state imaging device 1 is driven in the Y direction, the current direction in the upper and lower sides of the coil 5 is set to the current direction 3a (−Z direction) and 3b (+ Z direction) in the upper and lower sides of the coil 3. By supplying power in the directions 5a (−Z direction) and 5b (+ Z direction), driving forces 15 and 17 are generated in the coils 3 and 5, respectively, and the solid-state imaging device 1 is driven in the + Y direction. .

When the solid-state imaging device 1 is driven in the θ direction, the feeding of the coils 3 to 6 is changed so that the balance between the driving forces 15 and 17 or the driving forces 16 and 18 is changed or the direction is reversed. As a result, the solid-state imaging device 1 is driven in the θ direction. Further, by changing the direction of the current of the coils 3 to 6, the reversing operation in the X direction, the Y direction, and the θ direction can be performed.
Next, deformation of the elastic support portions 2b, 2c, 2d, and 2e when the solid-state imaging device 1 is driven will be described.
FIG. 4 shows a case where the solid-state imaging device 1 is driven in the X direction, FIG. 5 shows a case where it is driven in the Y direction, and FIG. 6 shows a case where it is driven in the θ direction.

In the case of FIG. 4, the driving forces 16 and 18 in the + X direction are generated. In the case of FIG. 5, the driving forces 15 and 17 in the + Y direction are generated. In the case of FIG. 6, the driving force 15 in the counterclockwise direction of the Z axis, the driving force 20 in the opposite direction to the driving force 16, the driving force 21 in the opposite direction to the driving force 17, and the driving force 18 are obtained. It is trying to generate.
In each figure, the dotted line indicates the neutral state of the elastic support portions 2b, 2c, 2d, and 2e, and the solid line indicates the deformation of the elastic support portions 2b, 2c, 2d, and 2e. As can be seen from FIGS. 4 to 6, the solid-state imaging device 1 is elastically supported by elastic support portions 2b, 2c, 2d, and 2e so as to be displaceable in the X direction, the Y direction, and the θ direction.

According to the solid-state imaging device 10 of the present embodiment or the solid-state imaging device support device configured by the solid-state imaging device 10, the following effects can be obtained.
The holder 2 as a holding member that holds the solid-state imaging device 1 so as to be displaceable, and the elastic support portion fixed end 2a and the elastic support portions 2b to 2e as support members that support the holder 2 so as to be displaceable are made simple shapes. At the same time, since it is formed by integral molding with resin, the solid-state imaging device 10 can be provided at low cost.
Further, according to the solid-state imaging device 10, it can be supported so as to be displaceable in the directions of two orthogonal axes, and can also be driven around an axis perpendicular to these two axes. Can be applied.
Moreover, the solid-state image sensor supporting apparatus which supports the solid-state image sensor 1 as an optical element in the solid-state image sensor 10 can also be provided at low cost.

Next, a second embodiment of the present invention will be described with reference to FIGS. FIG. 7 is a perspective view showing the structure of the movable part 31 in the second embodiment, and FIG. 8 is a plan view showing the structure of the movable part 31.
The solid-state imaging device according to the present embodiment includes a fixed portion configured on the base 9 side in Embodiment 1 and a movable portion 31 illustrated in FIG. However, the shape of the fitting hole for fitting and fixing an elastic support portion fixing member 38 (described later) of the movable portion 31 in the base 9 is a square.
The movable portion 31 includes a solid-state imaging device 1 that performs imaging, a first holder 32 that holds the solid-state imaging device 1 attached to the upper surface, a second holder 33 that is stacked on the bottom surface side of the first holder 32, The four coils 3 to 6 are attached to the side surfaces of the first holder 32 and the second holder 33.
The first holder 32 and the second holder 33 are integrated by overlapping the same structure formed of resin or the like.

Further, inside the first holder 32 and the second holder 33, square frame-shaped elastic support portion fixing members 37 and 38 are arranged at the center.
The elastic support portion fixing member 37 is provided with elastic support portions 39a, 39b and 40a, 40b made of a conductive metal plate or the like so that one end thereof is coupled and extends in the X direction.
Also, one end of each of the elastic support portions 39c, 39d, 40c, 40d extending in the Y direction orthogonal to the X direction is coupled to the other end of each of the elastic support portions 39a, 39b and 40a, 40b. The other ends of the support portions 39c, 39d, 40c, and 40d are coupled to the inner surface of the holder 32.

The elastic support portions 39 a and 39 c and the elastic support portions 39 b and 39 d are formed so as to be mirror symmetric with respect to the YZ plane passing through the center O of the elastic support portion fixing member 37. The elastic support portions 40 a and 40 c and the elastic support portions 40 b and 40 d are formed so as to be mirror symmetric with respect to the YZ plane passing through the center O of the elastic support portion fixing member 37.
The elastic support portions 39 a and 39 c and the elastic support portions 40 a and 40 c are formed so as to be mirror-symmetric with respect to the XZ plane passing through the center O of the elastic support portion fixing member 37.

The elastic support portions 39b and 39d and the elastic support portions 40b and 40d are formed so as to be mirror-symmetric with respect to the XZ plane passing through the center O of the elastic support portion fixing member 37.
Connection terminals 39e, 39f, 40e, and 40f are provided at the ends of the elastic support portions 39c, 39d, 40c, and 40d that are coupled to the inner surface of the holder 32. For example, the connection terminals 39 e and 39 f are connected to both ends of the coil 4, and the connection terminals 40 e and 40 f are connected to both ends of the coil 6.
The connection terminal 39e is electrically connected to the power supply terminal 39g of the elastic support portion fixing member 37 through elastic support portions 39c and 39a made of a conductive metal plate, and the connection terminal 39f is made of a conductive metal plate. The power supply terminal 39h of the elastic support portion fixing member 37 is electrically connected through the elastic support portions 39d and 39b.

Similarly, the connection terminal 40e is electrically connected to the power supply terminal 40g of the elastic support portion fixing member 37 via elastic support portions 40c and 40a made of a conductive metal plate, and the connection terminal 40f is a conductive metal plate. The elastic support portions 40d and 40b are electrically connected to the power supply terminal 40h of the elastic support portion fixing member 37.
Also, on the holder 33 side provided below the holder 32, the elastic support portion fixing is performed in the same manner as the elastic support portions 39a to 39d and 40a to 40d provided with one end coupled to the elastic support portion fixing member 37. One end is coupled to the member 38, and elastic support portions 41a to 41d and 42a to 42d are provided.
Further, connection terminals 41e, 41f, 42e, and 42f are provided at end portions of the elastic support portions 41c, 41d, 42c, and 42d, and power supply terminals 41g, 41h, 42g, and 42h of the elastic support portion fixing member 38 are provided. Conduct.

The first holder 32 and the second holder 33 can be fixed so as to be stacked with the same structure, and elastic support portions 39a to 39d as support members provided inside the first holder 32 and the second holder 33. , 40a to 40d, connection terminals 39e, 39f, 40e, and 40f can be easily formed by etching or punching a metal plate.
Note that the lower end of the elastic support portion fixing member 38 is fitted into a fitting hole of the base 9 that fits in accordance with the shape of the lower end of the elastic support portion fixing member 38 and fixed by adhesion or the like.
In addition, by connecting both ends of the coils 3 to 6 to the connection terminals 39e, 39f, 40e, 40f, etc., power is supplied from the power supply terminals 39g, 39h, 40g, 40h, etc. of the elastic support portion fixing member 37 and driven. And stable drive characteristics can be realized.
In addition, the movable part 31 in a present Example can be driven to the 2 axis direction orthogonal to Example 1, and the periphery of the axis | shaft orthogonal to these 2 axes.

According to the present embodiment, the support structure that supports the movable portion 31 (holders 32 and 33) so as to be displaceable is realized by a symmetric structure higher than that of the first embodiment. Can be driven around the axis.
In addition, by forming the support member using a metal, for example, the dimension in the height direction and the like can be made smaller than when formed using a resin, and a more compact solid-state imaging device can be realized.
In the above description, the coils 3 to 6 are attached to the movable part side, and the magnets 7a to 7d and 8a to 8d are attached to the fixed part side. However, the present invention is directed to the magnets 7a to 7d on the movable part side. This includes the case where 7d and 8a to 8d are attached and the coils 3 to 6 are attached to the fixed portion side.
In the above description, the case where the solid-state imaging device 1 is attached to the movable part has been described. However, the present invention is also applied to the case where an optical element other than the solid-state imaging element 1 is attached to drive the movable part. Can do.

  It can be used in an optical information recording / reproducing apparatus that optically records or reproduces information using a solid-state imaging device, and is suitable for a case where a solid-state imaging device is attached to a movable portion and the movable portion is electromagnetically driven.

[Appendix]
1. In Claim 1, the said drive coil is attached to the said holding member which comprises a movable part, and the said magnetic member is attached to the said fixed member.
2. In Claim 1, the said magnetic member is attached to the said holding member which comprises a movable part, and the said drive coil is attached to the said fixed member.

1 is a perspective view showing a solid-state imaging device according to Embodiment 1 of the present invention. 1 is a plan view showing a solid-state imaging device according to Embodiment 1. FIG. 1 is an exploded perspective view showing a solid-state imaging device according to Embodiment 1. FIG. Explanatory drawing which shows the case where a solid-state imaging device is driven to a X direction. Explanatory drawing which shows the case where a solid-state imaging device is driven to a Y direction. Explanatory drawing which shows the case where a solid-state imaging device is driven to (theta) direction. The perspective view which shows the structure of the movable part in Example 2 of this invention. The top view which shows a movable part.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Solid-state image sensor 1a ... Imaging surface 2 ... Holder 2a ... Elastic support part fixed end 2b-2e ... Elastic support part 3-6 ... Coil 7a-7d, 8a-8d ... Magnet 9 ... Base 10 ... Solid-state imaging device 9a- 9d ... Rising part 9e ... Fitting hole 15-18 ... Driving force Agent Patent attorney Susumu Ito

Claims (3)

A solid-state imaging device that captures an optical image obtained via an optical system; a holding member that holds the solid-state imaging device; and one end fixed to the holding member and the other end fixed to a fixing member to In a solid-state imaging device having a support member that is displaceably supported with respect to a fixing member, and a magnetic member that acts on the drive coil and generates a magnetic flux to drive the holding member.
The support member has a plurality of elastic support portions so that the solid-state imaging device can be displaced in at least two axial directions, and these elastic support members are integrally formed and arranged on the back surface of the imaging surface of the solid-state imaging device. The solid-state imaging device is characterized in that the solid-state imaging device is moved by an electromagnetic action of the drive coil and the magnetic member.   The solid-state imaging device according to claim 1, wherein the support member and the holding member are formed by integral molding of resin.   The said support member is formed with the metal which has electroconductivity, connects the terminal of the said drive coil to the end of the said support member, and supplies electric power to the said drive coil via the said support member. The solid-state imaging device described.

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