JP2005108879A - Board mounting structure and method of electronic component - Google Patents
Board mounting structure and method of electronic component Download PDFInfo
- Publication number
- JP2005108879A JP2005108879A JP2003336183A JP2003336183A JP2005108879A JP 2005108879 A JP2005108879 A JP 2005108879A JP 2003336183 A JP2003336183 A JP 2003336183A JP 2003336183 A JP2003336183 A JP 2003336183A JP 2005108879 A JP2005108879 A JP 2005108879A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- substrate
- electrode
- recess
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
本発明は、電子部品の基板実装構造に関し、特に、接続体を用いてプリント配線基板に
実装する電子部品の基板実装構造及び電子部品の基板実装方法に関する。
The present invention relates to a board mounting structure for an electronic component, and more particularly to a board mounting structure for an electronic component that is mounted on a printed wiring board using a connection body and a board mounting method for the electronic component.
従来、電子部品をプリント配線基板に実装する場合、溶融させた半田を接続材料として
用い、電子部品の電極とプリント配線基板の電極とを接合させる方法が取られていた。ま
た、他の方法として、弾性物質を導電性物質で覆ったものを接続体として用い、この接続
体をプリント配線基板の電極と電子部品の電極の間に配置して、導電性接着剤で固定し、
接合させる方法が取られていた（例えば、特許文献１参照）。
Conventionally, when an electronic component is mounted on a printed wiring board, a method has been used in which molten solder is used as a connection material and the electrode of the electronic component and the electrode of the printed wiring board are joined. As another method, an elastic material covered with a conductive material is used as a connection body, and this connection body is placed between an electrode of a printed wiring board and an electrode of an electronic component and fixed with a conductive adhesive. And
The method of joining was taken (for example, refer patent document 1).
これらの方法によって、電子部品はプリント配線基板に電気的接続及び固定がなされて
いた。
上述した接続材料に半田を用いた方法では、先ず半田を溶融させるために１５０℃以上
の熱を半田に加える必要があり、特に無鉛半田を溶融させるためには、２５０℃前後の熱
を半田に加える必要がある。この際、熱を半田のみに加えることは困難であり、プリント
配線基板及び電子部品をも高温状態に置くことになってしまう。そのため、プリント配線
基板及び電子部品の性能劣化等を引き起こすという問題があった。
In the method using solder as the connecting material described above, it is necessary to apply heat of 150 ° C. or higher to the solder in order to melt the solder. In particular, in order to melt lead-free solder, heat of about 250 ° C. is applied to the solder. Need to add. At this time, it is difficult to apply heat only to the solder, and the printed wiring board and the electronic component are also placed in a high temperature state. For this reason, there has been a problem in that the printed wiring board and the electronic components are deteriorated in performance.
また、半田を必要な箇所にマスク印刷する方法であるため、接続対象である電子部品の
電極間ピッチが狭く（特に電極間ピッチ０．３ｍｍ以下）なると、印刷された半田同士が
接合してしまうことがある。この対策として半田の供給量を減らすと十分な接合強度が確
保できない。そのため、接続材料に半田を用いた方法は、高密度化が進む基板実装には不
向きである。
In addition, since the solder is mask-printed where necessary, when the pitch between the electrodes of the electronic component to be connected is narrow (particularly, the pitch between the electrodes is 0.3 mm or less), the printed solders are joined together. Sometimes. As a countermeasure, if the supply amount of solder is reduced, sufficient bonding strength cannot be ensured. For this reason, the method using solder as the connection material is not suitable for board mounting where the density increases.
また、他の問題を、図３を参照して説明する。プリント配線基板１００には、基板１０
１と基板１０１の表面又は内部に配置／配線された配線１０２から構成されており、さら
に基板１０１には凹部１０３が設けられ、この凹部１０３にメッキ処理を施し電極１０４
が設けられている。この凹部１０３は、プリント配線基板１００と電子部品２００相互に
電気信号を伝えるために設けられたものである。
Another problem will be described with reference to FIG. The printed wiring board 100 includes a board 10
1 and a wiring 102 disposed / wired on the surface or inside of the substrate 101. Further, the substrate 101 is provided with a concave portion 103, and the concave portion 103 is subjected to a plating process to provide an electrode 104.
Is provided. The recess 103 is provided to transmit an electrical signal between the printed wiring board 100 and the electronic component 200.
電子部品２００は、半導体２０１と電極２０２で構成されている。この電極１０４と電極
２０２とを半田３００を用いて接合することで、プリント配線基板１００と電子部品２０
０を電気的に接続させるのだが、半田３００が凹部１０３に流れ込む際に、凹部１０３に
溜まっていた空気が半田３００の中で気泡４００となり、この気泡４００が半田３００の
外部に排出される前に半田３００が固化してしまうことがある。そのため、気泡４００が
半田３００の内部に残り、電極１０４と電極２０２の電気的接続性能の劣化及び接合強度
の劣化等の問題を引き起こすことがあった。
The electronic component 200 includes a semiconductor 201 and an electrode 202. By joining the electrode 104 and the electrode 202 with the solder 300, the printed wiring board 100 and the electronic component 20 are connected.
0 is electrically connected, but when the solder 300 flows into the recess 103, the air accumulated in the recess 103 becomes bubbles 400 in the solder 300, and before the bubbles 400 are discharged to the outside of the solder 300. In addition, the solder 300 may solidify. For this reason, the bubbles 400 remain inside the solder 300 and may cause problems such as deterioration in electrical connection performance between the electrode 104 and the electrode 202 and deterioration in bonding strength.
一方、上述の弾性物質を導電性物質で覆った弾性体を用いて接合する方法では、プリン
ト配線基板、電子部品及び接続体とを固定するのに導電性接着剤を用いるため、プリント
配線基板又は電子部品をリペアーする場合、プリント配線基板からの電子部品の取り外し
が困難であるという問題があった。
On the other hand, in the method of joining using an elastic body in which the elastic material is covered with a conductive material, a conductive adhesive is used to fix the printed wiring board, the electronic component, and the connection body. When repairing an electronic component, there is a problem that it is difficult to remove the electronic component from the printed wiring board.
そこで、本発明は、電極間の電気的接続性能及び接合強度を確保すると共に、プリント
配線基板から電子部品を容易に取外しすることができる電子部品の基板実装構造及び電子
部品の基板実装方法を提供することを目的とする。また、プリント配線基板と電子部品と
の電極間の接続に際し、熱によるプリント配線基板及び電子部品の性能劣化を抑制するこ
とができる電子部品の基板実装構造及び電子部品の基板実装方法を提供することを目的と
する。
Therefore, the present invention provides an electronic component board mounting structure and an electronic component board mounting method capable of ensuring electrical connection performance and bonding strength between electrodes and easily removing an electronic component from a printed wiring board. The purpose is to do. Also provided are a board mounting structure for an electronic component and a board mounting method for an electronic component that can suppress performance deterioration of the printed wiring board and the electronic component due to heat when connecting the electrodes of the printed wiring board and the electronic component. With the goal.
上記目的を達成するために、本発明による電子部品の基板実装構造は、第１の凹部を有
する第１の基板と、前記第１の基板の前記第１の凹部上に設けられた第１の電極と、第２
の凹部を有する第２の基板と、前記第１の基板と接続する面に前記第２の基板を有する電
子部品と、前記第２の基板の前記第２の凹部上に設けられた第２の電極と、導電性を有す
る弾性体とで構成され、前記弾性体の一端が前記第１の電極に圧入され、もう一端が前記
第２の電極に圧入されることで前記第１の基板と前記電子部品を電気的に接続させること
を特徴とする。
In order to achieve the above object, an electronic component mounting structure according to the present invention includes a first substrate having a first recess, and a first substrate provided on the first recess of the first substrate. The electrode and the second
A second substrate having a recess, an electronic component having the second substrate on a surface connected to the first substrate, and a second provided on the second recess of the second substrate An electrode and an elastic body having conductivity; one end of the elastic body is press-fitted into the first electrode, and the other end is press-fitted into the second electrode; An electronic component is electrically connected.
本発明によれば、プリント配線基板及び電子部品の凹部上に設けられた電極に接続体を
圧入することによって、プリント配線基板と電子部品の電気的接続性能及び接合強度の確
保を満たすと共に、プリント配線基板から電子部品を容易に取外しすることができる。ま
た、熱を加えることなく圧力のみでプリント配線基板と電子部品を接続するので、熱によ
るプリント配線基板及び電子部品の性能劣化を抑制することができる。
According to the present invention, the connection body is press-fitted into the electrodes provided on the concave portions of the printed wiring board and the electronic component, thereby satisfying the securing of the electrical connection performance and the bonding strength between the printed wiring board and the electronic component, and the printing. Electronic components can be easily removed from the wiring board. Further, since the printed wiring board and the electronic component are connected only by pressure without applying heat, the performance deterioration of the printed wiring board and the electronic component due to heat can be suppressed.
以下に、本発明に係る電子部品の基板実装構造及び電子部品の基板実装方法の実施の形
態を、図１乃至図２を参照して説明する。
DESCRIPTION OF EMBODIMENTS Embodiments of an electronic component board mounting structure and an electronic component board mounting method according to the present invention will be described below with reference to FIGS.
図１は、本発明を適用した電子部品の基板実装構造において、電子部品を基板実装する
前の状態を示したものである。図２は、本発明を適用した電子部品の基板実装構造におい
て、電子部品を基板実装した後の状態を示したものである。
FIG. 1 shows a state before an electronic component is mounted on a substrate in a substrate mounting structure for an electronic component to which the present invention is applied. FIG. 2 shows a state after the electronic component is mounted on the substrate in the electronic component substrate mounting structure to which the present invention is applied.
先ず、本発明の電子部品の基板実装構造について説明する。 First, a substrate mounting structure for an electronic component according to the present invention will be described.
プリント配線基板１には、基板１１と基板１１の表面に配置／配線された配線１２及び
内部に配置／配線された配線１３から構成されており、さらに基板１１には凹部１４が設
けられ、この凹部１４にメッキ処理を施し電極１５が設けられている。電極１５は、配線
１３と接続しており、電子部品２から伝えられる電気信号をプリント配線基板１に伝える
。本実施例においては、電極１５は、配線１２と接続していない構成を取っている。
The printed wiring board 1 includes a substrate 11, a wiring 12 disposed / wired on the surface of the substrate 11 and a wiring 13 disposed / wired inside, and the substrate 11 is provided with a recess 14. An electrode 15 is provided by plating the recess 14. The electrode 15 is connected to the wiring 13 and transmits an electrical signal transmitted from the electronic component 2 to the printed wiring board 1. In this embodiment, the electrode 15 is not connected to the wiring 12.
電子部品２には、半導体２０、基板２１と基板２１の表面に配置／配線された配線２２
及び内部に配置／配線された配線２３から構成されており、さらに基板２１には凹部２４
が設けられ、この凹部２４にメッキ処理を施し電極２５が設けられている。電極２５は、
配線２３と接続しており、プリント配線基板１から伝えられる電気信号を電気部品２に伝
える。この凹部１４及び凹部２４は、プリント配線基板１の配線１３及び電子部品２の配
線２３に電気信号を伝えるために設けられたものである。本実施例においては、電極２５
は、配線２２と接続していない構成を取っている。
The electronic component 2 includes a semiconductor 20, a substrate 21, and a wiring 22 disposed / wired on the surface of the substrate 21.
And a wiring 23 arranged / wired inside, and a recess 24 in the substrate 21.
The recess 24 is plated and an electrode 25 is provided. The electrode 25 is
It is connected to the wiring 23 and transmits an electrical signal transmitted from the printed wiring board 1 to the electrical component 2. The recess 14 and the recess 24 are provided to transmit an electrical signal to the wiring 13 of the printed wiring board 1 and the wiring 23 of the electronic component 2. In this embodiment, the electrode 25
Are not connected to the wiring 22.
プリント配線基板１の凹部１４及び電子部品２の凹部２４はレーザー等により表面に孔
をあけることにより形成される。また、レーザーで孔を空け銅めっきで層間接続されるビ
ルドアップ基板を用いる場合には、そのプロセス上で出来る窪みを利用する。
The concave portion 14 of the printed wiring board 1 and the concave portion 24 of the electronic component 2 are formed by making holes in the surface with a laser or the like. In addition, when using a build-up substrate in which holes are formed by laser and an interlayer connection is made by copper plating, a recess formed in the process is used.
接続体３は、弾性物質３１と導電性物質３２から構成されおり、弾性物質３１の表面に
導電性物質３２をメッキ処理等によって付着させることで作られる。弾性物質３１には、
主にシリコンゴムやプラスチック粒子の集合体等が使用されるが、弾性を有しているもの
であればこれらに限らない。導電性物質３２には、主に金、ニッケル等の金属が使用され
るが、電気的導通を確保できるものであれば金属に限らない。また、導電性ゴムを使用す
ることで、弾性物質３１と導電性物質３２を１つの部材とすることもできる。
The connection body 3 includes an elastic material 31 and a conductive material 32, and is made by attaching the conductive material 32 to the surface of the elastic material 31 by plating or the like. The elastic material 31 includes
Silicon rubber, aggregates of plastic particles, and the like are mainly used, but are not limited to these as long as they have elasticity. The conductive material 32 is mainly made of metal such as gold or nickel, but is not limited to metal as long as electrical continuity can be secured. Moreover, the elastic substance 31 and the conductive substance 32 can also be made into one member by using conductive rubber.
次に、本発明の実装方法を説明する。 Next, the mounting method of the present invention will be described.
先ず、図１に示すように、接続体３を電極１５に合わせて配置する。電極１５の配置は
、接続体３をエアによって吸着して行うことが考えられる。また、接続材料３をシートに
取り込み、接続体３を電極１５に合わせるようにこのシートを配置することことが考えら
れる。
First, as shown in FIG. 1, the connection body 3 is arranged according to the electrode 15. It is conceivable that the electrode 15 is arranged by adsorbing the connection body 3 with air. It is also conceivable that the connection material 3 is taken into the sheet and the sheet is arranged so that the connection body 3 is aligned with the electrode 15.
次に、電子部品２を電極１５と電極２５が向い合う所定の位置に配置する。そして、接
続体３を挟む方向に電子部品２を移動させる。所定の位置までに電子部品２を移動させる
と、図２に示すように、弾性物質３１が変形することによって接続体３が凹部１４及び凹
部２４に圧入される。
Next, the electronic component 2 is disposed at a predetermined position where the electrode 15 and the electrode 25 face each other. Then, the electronic component 2 is moved in a direction in which the connection body 3 is sandwiched. When the electronic component 2 is moved to a predetermined position, as shown in FIG. 2, the elastic body 31 is deformed, so that the connection body 3 is pressed into the recess 14 and the recess 24.
凹部１４と凹部２４に圧入された弾性物質３１は元の形状に戻ろうとするため、弾性物
質３１から凹部１４及び凹部２４の側壁部分に対して抗力Ａが発生する。この抗力Ａによ
って凹部１４及び凹部２４の側壁部分には摩擦力Ｂがプリント配線基板１と電子部品２を
引き合わす方向に生じる。これによって、プリント配線基板１と電子部品２は容易に外れ
ないという効果を得ることができる。また、プリント配線基板と電子部品の電気的接続が
可能になるという効果を得ることができる。
Since the elastic material 31 press-fitted into the recess 14 and the recess 24 tends to return to its original shape, a drag A is generated from the elastic material 31 to the recess 14 and the side wall portions of the recess 24. Due to this drag A, a frictional force B is generated in the direction in which the printed wiring board 1 and the electronic component 2 are attracted to the side walls of the recess 14 and the recess 24. As a result, an effect that the printed wiring board 1 and the electronic component 2 are not easily detached can be obtained. Further, it is possible to obtain an effect that electrical connection between the printed wiring board and the electronic component becomes possible.
また、図２に示すように、接続体３の圧入方向の長さＬが、プリント配線基板１の凹部
１４の深さＤ１と基板２１の凹部２４の深さＤ２を加えた場合の長さよりも長くなるよう
、接続体３を構成している。これによって、プリント配線基板１及び電子部品２の基板２
１に接続体３が圧入された場合にもプリント配線基板１の配線１２と電子部品２の配線２
２が直接接続しないようにすることができ、不必要な電気的接続を防止するという効果を
得ることができる。
Further, as shown in FIG. 2, the length L of the connecting body 3 in the press-fitting direction is longer than the length when the depth D1 of the concave portion 14 of the printed wiring board 1 and the depth D2 of the concave portion 24 of the substrate 21 are added. The connection body 3 is configured to be long. Thereby, the printed wiring board 1 and the board 2 of the electronic component 2
Even when the connection body 3 is press-fitted into the wiring 1, the wiring 12 of the printed wiring board 1 and the wiring 2 of the electronic component 2 are also shown.
2 can be prevented from being directly connected, and an effect of preventing unnecessary electrical connection can be obtained.
もっとも、プリント配線基板１及び電子部品２の基板２１に接続体３が圧入された場合に
おいても、プリント配線基板１の配線１２と電子部品２の配線２２が直接接続しない構成
である場合又は直接接続しても不具合が発生しない場合は、接続体３の圧入方向の長さを
プリント配線基板１の凹部１４の深さと基板２１の凹部２４の深さを加えた場合の長さよ
りも長くする必要はない。
However, even when the connection body 3 is press-fitted into the printed wiring board 1 and the board 21 of the electronic component 2, the wiring 12 of the printed wiring board 1 and the wiring 22 of the electronic component 2 are not directly connected or directly connected. If no problem occurs, the length of the connection body 3 in the press-fitting direction needs to be longer than the length when the depth of the concave portion 14 of the printed wiring board 1 and the depth of the concave portion 24 of the substrate 21 are added. Absent.
なお、弾性物質３１は、高温状態に置かれたとき軟化する素材を使用することができる
。この高温状態で軟化する弾性物質３１を使用した接続体３で接続されたプリント配線基
板１と電子部品２とを取り外す場合、これらを高温状態にして弾性物質３１を軟化させる
ことによって、抗力Ａ及び摩擦力Ｂを小さくすることができるので、プリント配線基板１
から電子部品２を取り外す際に加える力を小さくすることができるという効果を得ること
ができる。
The elastic material 31 may be made of a material that softens when placed in a high temperature state. When removing the printed wiring board 1 and the electronic component 2 connected by the connection body 3 using the elastic material 31 that softens in this high temperature state, the elastic material 31 is softened by bringing them into a high temperature state, and thereby the drag A and Since the frictional force B can be reduced, the printed wiring board 1
Therefore, it is possible to obtain an effect that the force applied when the electronic component 2 is removed from the device can be reduced.
弾性物質３１が軟化する高温状態とは、このプリント配線基板１等が使用される電子機器
の通常使用状態（一般的に３０℃位）を下限とし、プリント配線基板１及び電子部品２の
電気的特性及び機械的な特性に影響を与えない温度（一般的に１５０℃位）を上限とした
温度範囲内であることが好ましい。
The high temperature state in which the elastic material 31 is softened refers to the normal use state (generally about 30 ° C.) of an electronic device in which the printed wiring board 1 or the like is used, and the electrical wiring of the printed wiring board 1 and the electronic component 2 The temperature is preferably within the temperature range with the upper limit being a temperature (generally about 150 ° C.) that does not affect the characteristics and mechanical characteristics.
ここで、接続体３を配置するのは、電極１５としたが、電極２５でもよく、移動するの
は電子部品２としたが、プリント配線基板１が移動してきても良い。
Here, the connection body 3 is disposed on the electrode 15, but may be the electrode 25, and the electronic component 2 may be moved, but the printed wiring board 1 may be moved.
また、プリント配線基板１及び電子部品２に設けられた凹部１４及び凹部２４の数量は
単数でも複数でもよく、また、その底面は平面であると球面であるとプリント配線基板１
を貫通した穴形状であることを問わない。
Further, the number of the concave portions 14 and the concave portions 24 provided in the printed wiring board 1 and the electronic component 2 may be singular or plural, and if the bottom surface is a plane, the printed wiring board 1 is a spherical surface.
It does not ask | require that it is the hole shape which penetrated.
また、基板１は、フェノール樹脂、ガラスエポキシ樹脂等から成り、電子機器等に用い
られるあらゆる基板が含まれ、また、単層であると多層であることを問わない。
Moreover, the board | substrate 1 consists of a phenol resin, a glass epoxy resin, etc., and includes all the board | substrates used for an electronic device etc. Moreover, it is not ask | required that it is a multilayer if it is a single layer.
１ プリント配線基板、１１ 基板、１２ 配線、１３ 配線、１４ 凹部、１５ 電極
、２ 電子部品、２１ 基板、２２ 配線、２３ 配線、２４ 凹部、２５ 電極、２５
半導体、３ 接続体、３１ 弾性物質、３２ 導電性物質、１００ プリント配線基板
、１０１ 基板、１０２ 配線、１０３ 凹部、１０４ 電極、２００ 電子部品、２０
１ 半導体、２０２ 電極、３００ 半田、４００ 気泡、Ａ 抗力、Ｂ 摩擦力
DESCRIPTION OF SYMBOLS 1 Printed wiring board, 11 board | substrate, 12 wiring, 13 wiring, 14 recessed part, 15 electrode, 2 electronic components, 21 board | substrate, 22 wiring, 23 wiring, 24 recessed part, 25 electrode, 25
Semiconductor, 3 connection body, 31 elastic material, 32 conductive material, 100 printed wiring board, 101 substrate, 102 wiring, 103 recess, 104 electrode, 200 electronic component, 20
1 Semiconductor, 202 Electrode, 300 Solder, 400 Bubble, A Drag, B Friction
Claims (6)
前記第１の基板の前記第１の凹部上に設けられた第１の電極と、
第２の凹部を有する第２の基板と、
前記第１の基板と接続する面に前記第２の基板を有する電子部品と、
前記第２の基板の前記第２の凹部上に設けられた第２の電極と、
導電性を有する弾性体とで構成され、
前記弾性体の一端が前記第１の電極に圧入され、もう一端が前記第２の電極に圧入され
ることで前記第１の基板と前記電子部品を電気的に接続させること
を特徴とする電子部品の基板実装構造。 A first substrate having a first recess;
A first electrode provided on the first recess of the first substrate;
A second substrate having a second recess;
An electronic component having the second substrate on a surface connected to the first substrate;
A second electrode provided on the second recess of the second substrate;
It is composed of an elastic body having conductivity,
One end of the elastic body is press-fitted into the first electrode, and the other end is press-fitted into the second electrode to electrically connect the first substrate and the electronic component. PCB mounting structure for components.
前記第１の基板の前記第１の凹部上に設けられた第１の電極と、
第２の凹部を有する第２の基板と、
前記第１の基板と接続する面に前記第２の基板を有する電子部品と、
前記第２の基板の前記第２の凹部上に設けられた第２の電極と、
導電性物質を表面に施した弾性体とで構成され、
前記弾性体の一端が前記第１の電極に圧入され、もう一端が前記第２の電極に圧入され
ることで前記第１の基板と前記電子部品を電気的に接続させること
を特徴とする電子部品の基板実装構造。 A first substrate having a first recess;
A first electrode provided on the first recess of the first substrate;
A second substrate having a second recess;
An electronic component having the second substrate on a surface connected to the first substrate;
A second electrode provided on the second recess of the second substrate;
It consists of an elastic body with a conductive material on the surface,
One end of the elastic body is press-fitted into the first electrode, and the other end is press-fitted into the second electrode to electrically connect the first substrate and the electronic component. PCB mounting structure for components.
２のいずれか１項に記載の電子部品の基板実装構造。 The board mounting structure for an electronic component according to claim 1, wherein the elastic body is softened at a high temperature.
前記第１の基板と接続する面に第２の基板を有する電子部品とを接続する電子部品の基
板実装方法において、
第１の基板に第１の凹部を形成すると共に、当該第１の凹部上に第１の電極を形成し、
第２の基板に第２の凹部を形成すると共に、当該第２の凹部上に第２の電極を形成し、
導電性を有する弾性体を、前記第１の電極と前記第２の電極との間に配置し、
前記第２の基板を前記第１の基板に対して前記弾性体を挟む方向に移動させることによ
り、前記弾性体を前記第１の電極と前記第２の電極に圧入すること
を特徴とする電子部品の基板実装方法。 A first substrate;
In the electronic component substrate mounting method for connecting the electronic component having the second substrate on the surface connected to the first substrate,
Forming a first recess in the first substrate and forming a first electrode on the first recess;
Forming a second recess in the second substrate and forming a second electrode on the second recess;
An elastic body having conductivity is disposed between the first electrode and the second electrode,
An electron that press-fits the elastic body into the first electrode and the second electrode by moving the second substrate in a direction in which the elastic body is sandwiched with respect to the first substrate. How to mount components on a board.
前記第１の基板と接続する面に第２の基板を有する電子部品とを接続する電子部品の基
板実装方法において、
第１の基板に第１の凹部を形成すると共に、当該第１の凹部上に第１の電極を形成し、
第２の基板に第２の凹部を形成すると共に、当該第２の凹部上に第２の電極を形成し、
導電性物質を表面に施した弾性体を、前記第１の電極と前記第２の電極との間に配置し
、
前記第２の基板を前記第１の基板に対して前記弾性体を挟む方向に移動させることによ
り、前記弾性体を前記第１の電極と前記第２の電極に圧入すること
を特徴とする電子部品の基板実装方法。 A first substrate;
In the electronic component substrate mounting method for connecting the electronic component having the second substrate on the surface connected to the first substrate,
Forming a first recess in the first substrate and forming a first electrode on the first recess;
Forming a second recess in the second substrate and forming a second electrode on the second recess;
An elastic body having a conductive material applied on the surface is disposed between the first electrode and the second electrode,
An electron that press-fits the elastic body into the first electrode and the second electrode by moving the second substrate in a direction in which the elastic body is sandwiched with respect to the first substrate. How to mount components on a board.
５のいずれか１項に記載の電子部品の基板実装方法。 6. The electronic component board mounting method according to claim 4, wherein the elastic body is softened at a high temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003336183A JP4300087B2 (en) | 2003-09-26 | 2003-09-26 | Electronic component board mounting structure and electronic component board mounting method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003336183A JP4300087B2 (en) | 2003-09-26 | 2003-09-26 | Electronic component board mounting structure and electronic component board mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005108879A true JP2005108879A (en) | 2005-04-21 |
| JP4300087B2 JP4300087B2 (en) | 2009-07-22 |
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ID=34532398
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Cited By (1)
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|---|---|---|---|---|
| CN113496979A (en) * | 2020-04-08 | 2021-10-12 | 深圳市柔宇科技有限公司 | Electronic assembly, preparation method thereof and electronic equipment |
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Cited By (1)
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|---|---|---|---|---|
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|---|---|
| JP4300087B2 (en) | 2009-07-22 |
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