JP2005096164A - Booklet with ic label - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a highly pliable booklet with an outstanding IC function which can be manufactured at a lower cost than a conventional booklet with an IC function and is modified to avoid a failure of an IC chip. <P>SOLUTION: This booklet 7 with an IC label 1 has a recessed part 11 for accommodating the IC chip, formed beforehand at a specified position of the booklet 7. In addition, an IC label 1 with the IC chip 2 capable of sending information to the outside/receiving information from the outside in a non-contact fashion and an antenna 3, is embedded in the recessed part 11 and the IC label 1 and the cover of the booklet 7 are wrapped with a protecting sheet 14. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a booklet used for identification such as a passport, a bank passbook, an employee ID card, a student ID card, etc., in which an IC label having an IC chip and an antenna capable of exchanging information with the outside without contact is built. .

For IC booklets with built-in IC chips that can exchange information with the outside, IC cards with antennas, etc. in the booklet that proves the status of passport, bankbook, employee ID card, student ID card, etc., the booklet and IC card are independent of each other. There has been proposed an IC booklet that can guarantee quality, confirm that the IC card attached to the booklet has been replaced, and prevent forgery and alteration (for example, see Patent Document 1).

Since this IC booklet is premised on an IC card configured by sandwiching an IC chip and an antenna with resin or cardboard, the IC card is pasted on the front cover or back cover of the booklet and a part of a plurality of pages in the booklet. If attached, the flexibility of the booklet will be lost.

When this booklet is used, most of the issuer and ATM booklet transport mechanisms used in the stage of giving personal information are mechanisms that transport the booklet by roller driving, and further open the page by providing a bent portion Due to the mechanism, the booklet cannot be transported and the IC chip is damaged, and the booklet is required to be flexible.

As a method for solving this problem, it has been proposed to provide a notch in a region near the corner of the text sheet so that the IC chip portion and the text sheet bound inside the booklet do not overlap (for example, Patent Document 2). reference).

  However, in the case of the booklet described in this proposal, the text sheet is cut out at a position (in the literature, near the corner) facing the surface on which the IC chip is built, so the IC chip and the text sheet overlap. In this state, there is an advantage of protecting the IC chip from pressure. However, when the booklet is used in an open state, the IC chip is in a state of being bulged from the surface and is in a bare state. When the user handles the IC chip, there is a risk that the IC chip is pressed and damaged.

  Further, in the case of this booklet form, since a notch is provided in a part of the text sheet, there is a problem that an effective description area inherent in the text sheet is limited.

Japanese Patent Laid-Open No. 11-348469 JP 2000-153681 A

  Therefore, the present invention provides a booklet that prevents damage to the IC chip during the manufacture and use of the booklet without impairing the effective description area inherent in the booklet, and is highly convenient and flexible when carried. The purpose is that.

In order to solve the above-mentioned problems and achieve the object, a booklet provided with the IC label of the present invention is provided with a recess capable of storing an IC chip in a predetermined position of the booklet in advance, so that information can be communicated to the outside without contact. An IC label having an IC chip and an antenna capable of receiving and receiving is fitted into the recess, and the cover of the IC label and the booklet is covered with a protective sheet.

In addition, the recess is formed with a recess larger than the IC chip, and when the IC label is superimposed on the booklet, the IC chip is completely stored in the recess, and the IC chip is interposed between the booklet and the IC chip. A gap portion is provided.

Moreover, the said recessed part is provided in the front cover part or back cover part of the said booklet, It is characterized by the above-mentioned.

Further, the concave portion is filled with an impact buffering material, and the IC chip is fitted therein.

Further, the IC label is flexible, and the booklet is made flexible by protecting the IC chip between the cover of the booklet and the IC label.

Further, information unique to the booklet is given to a part of the IC label.

Furthermore, the protective sheet is a transparent film, and is characterized in that the IC label and the cover of the booklet are bonded together.

And the cut | notch is provided in a part of said resin film, It is characterized by the above-mentioned.

  The booklet provided with the IC label of the present invention is not a form called an inlay in which an IC chip is sandwiched between resin or cardboard, like an IC card that is generally used, but an IC label having excellent flexibility. Thus, a booklet can be provided at a low manufacturing cost.

  That is, the IC card is not inserted into the booklet, and the IC label is pasted at the end of the booklet manufacturing process. Therefore, the IC card insertion device and the glue application device for fixing the IC card in the middle of the booklet manufacturing apparatus. The current manufacturing process does not need to be complicatedly changed.

  In addition, since the booklet itself is flexible, there is no problem that the bent portion cannot be transported in the issuing machine or the ATM booklet transport mechanism used at the stage of giving personal information in the booklet. There is no need to modify the transport mechanism. In addition, there is an effect that the convenience at the time of carrying is excellent.

  Also, a part of the cover of the booklet is provided with a recess for fitting the IC chip, and a slight gap is formed between the cover of the booklet and the IC chip. The IC chip can be protected from impact without any external pressure being transmitted, and by providing a shock absorbing material such as a gel-like silicone resin or elastic rubber in the slight gap, it is more effective for protecting the IC chip. Is.

  Moreover, even if personal information is given to the booklet contents with a issuing machine or ATM by forming a recess in a part of the cover of the booklet, the area to be written is flat, so the necessary items are described without any problems. The effective function of the booklet is not impaired.

  Furthermore, since the information specific to the booklet is given to the surface of the IC label and the surface is completely covered with the protective sheet, the unique information can be read by the reading device, and a part of the protective sheet is temporarily cut. Even if the protective sheet is peeled off and the IC label is replaced, it can be easily confirmed, and the effect of preventing forgery / tampering is excellent.

Hereinafter, the booklet provided with the IC label of the present invention will be described in detail with reference to the drawings.
First, the first invention of the present invention will be described. 1 and 2 are diagrams showing an IC label. The IC label 1 is provided on a resin sheet 4 with an IC chip 2 and an antenna 3 that can exchange information with the outside without contact.
The antenna 3 may be affixed with copper produced by etching, or may be directly formed on the resin sheet 4 by screen printing or the like using conductive ink. Thereafter, the pressure-sensitive adhesive sheet 5 is produced by overlapping so as to cover the surface on which the antenna 3 is formed. At this time, the adhesive sheet 5 and the resin sheet 4 can be completely adhered to each other by providing the adhesive sheet 5 with an opening 6 in advance so as to avoid the IC chip.
In the embodiment, the pressure-sensitive adhesive sheet 5 is used as the pressure-sensitive adhesive layer, but the pressure-sensitive adhesive may be directly applied onto the resin sheet 4 to form the pressure-sensitive adhesive layer.

  Next, a booklet having an IC label will be described. As shown in FIG. 3, the booklet 7 is composed of a front cover part 8, a back cover part 9, and a text sheet 10. The back cover part 9 overlaps the cover sheet 9a and the facing paper b as shown in FIG. (Although not shown, the front cover 8 is also formed in the same manner.)

  A concave portion 11 in which an IC chip can be stored is provided in a predetermined position of the booklet 7, and the concave portion 11 is provided with a cover paper 9b after a hole is provided in advance in the cover 9a as shown in FIG. Are stacked and bonded, and the IC label is stacked and bonded so that the IC chip 2 is fitted in the recess 11, and then the surface of the IC label is spread over the front cover portion 8, The entire booklet 7 is covered with a protective sheet 14 to produce a booklet having an IC label.

  The predetermined position of the recess 11 is illustrated near the center of the back cover portion 9 in the embodiment of FIG. 3, but is not limited to this. That is, it is clear from the above description that the recess 11 is associated with a position where the IC chip 2 of the IC label 1 can be stored, and the IC chip 2 is provided in the vicinity of the four corners of the IC label 1. In this case, the concave portion 11 is also near the four corners of the back cover portion 9, and when the IC label 1 is overlapped on the front cover portion 8, the concave portion 11 is provided in the front cover portion 8.

  Next, the second invention in the present invention will be described. As shown in FIG. 5, when the back cover portion 9 and the IC label 1 are polymerized and adhered, a slight gap portion 12 is provided between the surface of the IC chip 2 and the surface of the facing paper 9 b constituting the back cover portion 9. Is formed. That is, by providing the gap 12, even if an external pressure is applied to the facing paper 9b, the direct external pressure is not transmitted to the surface of the IC chip 2, and the IC chip 2 can be protected from an impact.

  The third invention in the present invention will be described. As shown in FIG. 3, a recess 11 for accommodating the IC chip 2 is provided in the back cover portion 9. As shown in FIG. 5, the back cover part is composed of two sheets, a cover sheet 9a and a facing sheet 9b. A through hole is provided in the cover sheet 9a, and a recess 11 is formed by overlapping with the facing sheet 9b. 2 can be stored.

  As shown in FIG. 4, the front cover portion 8 and the back cover portion 9 are configured by superposing two base materials, and in the embodiment, the concave portion 11 is provided in the back cover portion 9. However, the present invention is not limited to this, and the concave portion 11 may be provided in the front cover portion 9 according to the use of the booklet.

  As another embodiment, the fourth aspect of the present invention will be described. In a slight gap 12 between the surface of the IC chip 2 and the surface of the facing paper 9b constituting the back cover portion 9, The IC chip 2 can be protected by providing a shock absorbing material such as a gel-like silicon resin or elastic rubber.

  The fifth aspect of the present invention will be described. As shown in FIG. 5, the IC chip 2 has a flexible cover sheet 9a that forms the back cover portion 9 and a resin sheet 4 that is the base material of the IC label. It is polymerized by a high material, and is formed so that the upper surface of the IC chip 2 is turned back and covered with paper 9b.

  That is, the IC chip is protected by embedding the IC chip with resin or cardboard as in the case of a commonly used IC card, whereas the IC label is protected with a highly flexible material. It is said.

In addition, although the resin sheet 4 was used as a base material, if it has a softness | flexibility, paper and a film may be sufficient.

  The sixth invention of the present invention will be described in detail. As shown in FIG. 3, on the surface of the IC label (the surface overlapping the protective sheet 14), the booklet management number is displayed as bar code information 13 as information unique to the booklet. As shown in FIG. In the embodiment, the booklet specific information is printed as the barcode management information of the booklet as the barcode information 13, but when used as a passport, the unique information assigned to each passport issuing office is barcoded. You may give as information, Furthermore, you may print a pattern (not shown) by various printing systems, such as offset printing, intaglio printing, gravure printing, and screen printing.

  Further, the seventh invention of the present invention will be described in detail. As shown in FIG. 3, the IC label 1 is overlapped and adhered to the booklet 7, and thereafter, the cover sheet portion is formed from the IC label 1 using the protective sheet 14. A booklet having an IC label is prepared by adhering the entire surface up to 8. At this time, if a transparent film is used as the protective sheet 14, the barcode information 13 and the symbols printed on the surface of the IC label 1 can be visually recognized, and the barcode information 13 uses a dedicated reader. And machine processing is also possible.

  Furthermore, when the protective sheet 14 used in the present invention is a transparent sheet, when the transparent sheet 14 is peeled off and the IC label 1 is replaced with another IC label, the specific information of the booklet is broken and the information is altered. Can be easily distinguished from both human vision and machine processing.

In addition, by providing the cut 15 in a part of the protective sheet 14, when the protective sheet 14 is peeled off, a part of the protective sheet 14 remains in the booklet, so that it is completely impossible to replace or restore the protective sheet 14. This is possible and more effective in preventing tampering.

In the present embodiment, a transparent sheet is used as the protective sheet 14 for the purpose of preventing tampering, and further anti-peeling measures are taken. However, the present invention is not limited to this, and the IC label 1 and the booklet 7 are not limited thereto. A colored sheet may be used as long as it protects the whole.

  Since the booklet according to the present invention has an IC function and is excellent in flexibility, it has no influence on the issuing machine or ATM booklet transport mechanism used in the stage of giving personal information in the booklet, and is further portable. Due to its high convenience, it can be widely used for identification purposes such as passports, bankbooks, employee ID cards, and student ID cards.

It is a side view which shows the structure of the IC label which concerns on one Embodiment of this invention. It is a top view which shows the structure of an IC label. It is a perspective view which shows the state which superimposes the IC label which concerns on this invention on a booklet. It is sectional drawing which shows the booklet provided with the IC label of this invention. It is sectional drawing which shows the A section of FIG. 4 in detail.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC label 2 IC chip 3 Antenna 4 Resin sheet 5 Adhesive sheet 6 Opening part 7 Booklet 8 Front cover part 9 Back cover part 9a Front cover 9b Reversing paper 10 Body paper 11 Recess 12 Gap part 13 Barcode information 14 Protection sheet 15 Cut

Claims (8)

At a predetermined position of the booklet, a concave portion capable of accommodating an IC chip is provided in advance, and an IC label having an IC chip and an antenna capable of exchanging information with the outside without contact is fitted into the concave portion, and the IC label and the A booklet characterized by covering the cover of the booklet with a protective sheet. The recess is formed with a recess larger than the IC chip, and when the IC label is superimposed on the booklet, the IC chip is completely stored in the recess, and a gap is formed between the booklet and the IC chip. The booklet according to claim 1, wherein a portion is provided. The booklet according to claim 1 or 2, wherein the concave portion is provided in a front cover part or a back cover part of the booklet. 4. The booklet according to claim 1, wherein the recess is filled with an impact buffering material and the IC chip is fitted. 5. The IC booklet according to claim 1, wherein the IC label is flexible, and the booklet is made flexible by protecting the IC chip between a cover of the booklet and the IC label. booklet 6. The booklet according to claim 1, wherein information specific to the booklet is given to a part of the IC label. The booklet according to claim 1, wherein the protective sheet is a transparent film, and the IC label and the cover of the booklet are bonded together. The booklet according to claim 1, wherein a cut is provided in a part of the protective sheet.

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