JP2005084931A - Ic card and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To increase the surface smoothness of an IC card and enhance the strength of the IC card against bending and impact. <P>SOLUTION: The IC card comprises a card base with either a module hole or an embedding recess in which to mount an IC module 5 having an IC chip, and an over sheet affixed to the card base in such a way as to close the IC module hole or the embedding recess. At least the IC chip of the IC module is an elastic body with a 2% elastic modulus of 0.05 to 50 kgf/mm<SP>2</SP>and sealed in the IC module hole or the embedding recess. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an IC card and an IC card manufacturing method.

  In recent years, IC cards equipped with semiconductor elements for recording and processing data are becoming widespread from the viewpoint of efficiency of information processing and security. Such an IC card includes a contact type that connects an external terminal of the card and a terminal of an external processing device to transmit and receive data, an antenna that transmits and receives data by electromagnetic waves, and a semiconductor element for data processing. There is a non-contact type that can implement reading and writing with an external processing device by a so-called wireless method.

  Recently, the driving power of the IC circuit is supplied by electromagnetic induction, and the demand for a non-contact type IC card that does not incorporate a battery is increasing. In these IC cards, external components such as semiconductor elements, coils, capacitors, and batteries are mounted on a substrate, and a module is processed by a casting method using an epoxy resin or the like. In general, it is laminated and embedded with ABS or UV resin to form a card. Of these, the hot press laminating method includes, for example, a hard vinyl chloride resin in which module holes are punched in advance on the oversheet made of hard vinyl chloride resin having a thickness of about 100 μm in accordance with the outer shape of the IC module package. A card core sheet with a thickness of about 560 μm is installed, a non-contact IC module package packaged with a thermosetting epoxy resin is inserted into the module hole, and an oversheet made of hard polyvinyl chloride resin with a thickness of about 100 μm There is a method called a punching method in which a non-contact type IC card is formed by press laminating, and finally punching into a card mold.

  Also, a countersink process is performed on the card core sheet in accordance with the shape of the non-contact IC module to form an embedded recess, the IC module is inserted into the embedded recess, and the counterseat is thermally bonded to the card core sheet. There is also a method called a method.

  However, in any of these methods, a gap for mounting the IC module package is formed, and the IC module package is inserted into the gap. Therefore, in the obtained IC card, if the size of the gap portion with respect to the module package is inappropriate, a gap is generated between the IC module package and the gap portion, and a recess is formed in the oversheet at the gap portion. When the sheet is exposed to light, the irregularities are visible, and the appearance of the card is impaired. Further, there may be a case where printing failure occurs in the recessed portion of the oversheet during printing. In this case, strictly increasing the size of the recessed portion for embedding, the hole for the module, or the size of the module package so as not to generate a gap causes an increase in cost.

  In addition, these IC cards are stored and used by an unspecified number of people under various circumstances. For example, it is stored in a case with unevenness, such as a wallet or a pocket, and is carried around. Furthermore, it is conceivable to hit the IC card against other objects or drop the IC card while it is stored in the case.

In this way, in order to improve the strength against impact when the IC card is subjected to external forces in various directions and is bent or bumped or dropped, a buffer member (for example, between the IC chip and the IC module substrate) By loading the reinforcing material (Patent Document 1) or attaching the reinforcing material to a surface different from the terminal surface of the IC chip (Patent Document 2), the bending stress is released without concentrating on one point. An IC module for an IC card having the above structure has been proposed, but even an IC card using these IC modules is insufficient in strength against bending and impact.
JP-A-8-300862 JP-A-8-324166

  The present invention has been made in view of such circumstances, and provides an IC card and an IC card manufacturing method having high surface smoothness, and further improves the strength against bending and impact of the IC card and the IC card. The object is to provide a manufacturing method.

  In order to solve the above-described problems and achieve the object, the present invention is configured as follows.

The invention according to claim 1 is a card substrate having a module hole or embedded recess for mounting an IC module having an IC chip;
An oversheet bonded to the card base so as to close the IC module hole or the embedded recess,
An IC card, wherein at least the IC chip of the IC module is an elastic body having a 2% elastic modulus of 0.05 to 50 kgf / mm ² and is sealed in the IC module hole or the embedded recess. is there.

According to a second aspect of the present invention, after laminating a first oversheet on one surface side of a card core sheet having a module hole for mounting an IC module having an IC chip, the IC module is inserted into the module hole. Inserting an IC module into the embedded recess of the card base having a process or embedded recess; and
Filling the module hole or the embedded recess with a liquid resin by injecting a liquid resin having a cured 2% elastic modulus of 0.05 to 50 kgf / mm ² into the module hole or the embedded recess;
Curing the liquid resin;
And a step of bonding a second oversheet to the card core sheet or the card base and closing the module hole or the embedded recess.

In the invention according to claim 3, in the concave portion of the card base sheet in which the concave portion is formed,
After inserting the sealing module formed by sealing the IC module with an elastic body having a 2% elastic modulus of 0.05 to 50 kgf / mm ² after curing,
An IC card manufacturing method, wherein an oversheet is joined to the card base sheet to close an opening surface of the recess.

  With the above configuration, the present invention has the following effects.

In the invention according to claim 1, at least the IC chip of the IC module is an elastic body having a 2% elastic modulus of 0.05 to 50 kgf / mm ² and is sealed in the hole for the IC module or the embedded recess, and the surface is flat. In addition, the appearance is good, defects do not easily occur during printing, the quality is high, and the strength against bending and impact of the IC card can be improved.

In the invention according to claim 2, the IC module is inserted into the module hole, or the IC module is inserted into the embedded recess, and the 2% elastic modulus after curing in the module hole or embedded recess is 0.05 to 50 kgf / Injecting the liquid resin of mm ² to fill the module holes or embedded recesses with the liquid resin, curing the liquid resin and closing the module holes or embedded recesses, the surface is flat, the appearance is good, It is possible to manufacture an IC card that is difficult to cause defects during printing, has high quality, and has strength against bending and impact of the IC card.

  In the invention according to claim 3, a sealing module formed by sealing an IC module with an elastic body having a 2% elastic modulus of 0.05 to 50 kgf / mm after curing is inserted into the concave portion of the card base sheet. Then, by closing the opening surface of the recess, the IC card has a flat surface, good appearance, hardly causes defects during printing, is of high quality, and has strength against bending and impact of the IC card. Can be manufactured.

  Hereinafter, embodiments of the IC card and IC card manufacturing method of the present invention will be described, but the present invention is not limited to this embodiment. The embodiment of the present invention shows the most preferable mode of the present invention, and the terminology of the present invention is not limited to this.

FIG. 1 is a cross-sectional view showing an embodiment of an IC card according to the present invention. First, an IC card according to claim 1 will be described. The IC card 1 of this embodiment is regulated to 0.76 mm in thickness according to the ISO standard. The IC card 1 is manufactured by a punching method. For example, the first and second cards made of hard vinyl chloride resin and having a thickness of about 100 μm are formed on both sides of a card core sheet 3 made of hard vinyl chloride resin and having a thickness of about 560 μm. The oversheets 2 and 4 are heat-sealed. An IC module hole 3a is formed at a predetermined position of the card core sheet 3, and the IC module hole 3a is sealed with first and second oversheets 2 and 4 on both sides. In this embodiment, the IC module 5 is enclosed in the IC module hole 3a, and the remaining portion excluding the portion occupied by the IC module 5 has an elastic body having a 2% elastic modulus of 0.05 to 50 kgf / mm ² . 6 is filled, and the IC module hole 3 a is completely filled with the elastic body 6.

The IC module 5 has at least an IC chip, and the IC module 5 is completely embedded in the IC module hole 3a with an elastic body 6 having a 2% elastic modulus of 0.05 to 50 kgf / mm ² . In the IC card 1 of this embodiment, the surface of the card core sheet 3 is flat. Therefore, the surfaces of the first and second oversheets 2 and 4 are not uneven, and the appearance is good. Defects hardly occur and high quality. Further, the strength against bending and impact of the IC card 1 is improved.

In this embodiment, a card base having a module hole 3a for mounting the IC module 5 is constituted by the card core sheet 3 and the first oversheet 2, and the IC module hole 3a is constituted by the second oversheet 4. The oversheet adhered to the card substrate is configured so as to close the card. Also, using a card substrate having an embedded recess, at least the IC chip of the IC module is sealed in the embedded recess with an elastic body having a 2% elastic modulus of 0.05 to 50 kgf / mm ² and adhered to the card substrate. The embedded recess may be closed with an oversheet.

  Next, an IC card manufacturing method according to claim 2 will be described with reference to FIG. First, the module hole 3a is punched into a predetermined position of the card core sheet 3 made of hard vinyl chloride resin having a thickness of about 560 μm (FIG. 2A).

  The IC module 5 in this case is a module in which components such as an antenna, an IC chip, and a capacitor are mounted on a substrate. The antenna is used for data transmission / reception with an external device and power reception. The thickness of the IC module 5 is equal to or less than the thickness of the card core sheet 3.

  Then, the card core sheet 3 provided with the module hole 3a and the first oversheet 2 are temporarily fixed to form a card substrate, whereby the module hole 3a is provided with a bottom portion with the first oversheet 2 and is used for the module. A recess 10 is formed (FIG. 2B). The temporary fixing is partially bonded by bonding with an adhesive or a solvent such as cyclohexanone, or by fusion. Bonding may be performed entirely by heat fusion or the like instead of temporary fixing. However, since it becomes asymmetric in the thickness direction, the card substrate may be warped, so that temporary fixing is preferable. It is sufficient if the liquid resin to be injected later can be prevented from flowing out.

Next, the IC module 5 is mounted in the module recess 10 formed by the temporary fixing step. Next, the liquid resin 11 is injected into the module recess 10 so that the entire module recess 10 is filled with the liquid resin 11, in other words, the module recess 10 is flattened with the liquid resin 11 (FIG. 2 (C)). Therefore, all of the IC modules 5 are filled with the liquid resin 11, which is a casting method in which the module recess 10 is used as a mold. At this time, it is preferable to inject the liquid resin 11 slightly more than the necessary equivalent amount. The liquid resin 11 used here is an elastic body having a 2% elastic modulus after curing of 0.05 to 50 kgf / mm ² . The method for measuring the 2% elastic modulus is defined in ASTM D638.

  Next, after injecting the liquid resin 11, the second oversheet 4 is covered, and the excess of the air and the liquid resin 11 are sufficiently discharged and temporarily fixed by the roller press process. Wear it to make a card (FIG. 2D). The liquid resin 11 is cured before being covered with the second oversheet 4 or is simultaneously cured at the time of hot press lamination. Alternatively, a separate curing step can be provided after hot press lamination. Finally, the IC card 1 is completed by punching to a desired size.

  A method for manufacturing an IC card according to claim 3 will be described with reference to FIG. In one embodiment of the IC card manufacturing method according to claim 3, as shown in FIG. 3A, the card core sheet 3 and the elastic body 6 in which the elastic body 6 is exposed on the surface. The sealing module 30 is formed by sealing the IC module 5 and the first and second oversheets 2 and 4.

  The card base sheet having the recesses according to claim 3 is obtained by adhering the first oversheet 2 so that one end face of the hole 3b of the card core sheet 3 having the through hole 3b is closed, or the like. As an example of this, although not shown in the figure, a flat card base material that is not penetrated with a drill or the like, is formed by forming a recess by cutting with a router end mill or the like, or is integrally formed into a shape having a recess Can be mentioned.

  Examples of the method of bonding the first oversheet 2 to the card core sheet 3 include a method using an adhesive and a method of bonding the first oversheet 2 to the card core sheet 3 by heat welding. In addition, when heating to bond the card core sheet 3 and the second oversheet 4 in a later step, if heat welding is possible, it is sufficient to bond at that time, so before inserting the sealing module, The card base sheet in which the recesses are formed may be one in which the first oversheet 2 and the card core sheet 3 are simply stacked.

  The material of the card substrate sheet 31 (including the card core sheet, the first and second oversheets 2 and 4) used in the present invention is not particularly limited, and is used as various card substrates. Examples thereof include thermoplastic resins such as vinyl chloride resin, ABS (acrylonitrile-butadiene-styrene copolymer) resin, polyethylene resin and polyethylene terephthalate resin, and thermosetting resins such as epoxy resin and phenol resin. Among these, white PET is particularly preferable because it has a relatively low load on the environment and is excellent in whiteness and durability. In the case of a thermoplastic resin, the obtained IC card is preferably excellent in bendability. Note that it is preferable to use the same material for the first oversheet 2 and the second oversheet 4 because the structure of the IC card is almost symmetrical, so that the warp of the obtained IC card is reduced.

According to a method for forming a sealing module of claim 3, the IC module 5 in which components such as an antenna, an IC chip, and a capacitor are mounted on a substrate to form a module has a 2% elastic modulus of 0. a method of immersing the 05~50kgf / mm ² and comprising a resin composition, 2% elastic modulus after curing to the IC module 5 may include a method of spraying a resin composition comprising a 0.05~50kgf / mm ² The sealing module 30 is formed by forming a layer of an elastic body having a 2% elastic modulus after curing of 0.05 to 50 kgf / mm ^{2 on} the surface of the IC module 5.

The IC module 5 only needs to have at least an IC chip sealed. The sealing module 30 has a shape of the concave portion 32 of the card base sheet 31 in which the concave portion 32 is formed during curing of the resin composition having a 2% elastic modulus of 0.05 to 50 kgf / mm ² after curing. You may shape | mold by pressurizing so that it may become substantially the same shape, and you may shape | mold so that it may become a shape substantially the same as the shape of a recessed part after hardening.

  The sealing module 30 thus obtained is inserted into the recess 32 of the card base sheet 31 in which the recess 32 is formed, as shown in FIG. Subsequently, the second oversheet 4 is stacked on the card base sheet 31 on which the recess 32 into which the sealing module 30 is inserted is formed, and the opening surface of the recess 32 is closed with the second oversheet 4.

  Here, it is preferable that the second oversheet 4 and the sealing module 30 are in contact with each other, but there may be a slight gap as long as adhesion is possible in the next step.

  Next, by heating and welding the second oversheet 4, the second oversheet 4 and the card base sheet 31 formed with the recess 32 in which the sealing module 30 is inserted are bonded, When the IC card 1 is manufactured by bonding the card base sheet 31 formed with the recess 32 and the sealing module 30, the bonding strength of the sealing module 30, the card core sheet 3 and the second oversheet 4 is high. An IC card with excellent strength can be obtained.

  Finally, the IC card 1 is completed by punching to a desired size.

In the present invention, as the material of the elastic body 2% elastic modulus after curing it is 0.05~50kgf / mm ^2, as long as 2% elastic modulus of 0.05~50kgf / mm ² is obtained after curing However, it is not basically limited, and elastomers such as silicone rubber, polyisobutylene, butyl rubber, polysulfide rubber, elastic epoxy resin, hot melt adhesive, and the like can be used. In addition, when an epoxy resin-based elastic body is used, an IC card having excellent electrical characteristics can be obtained.
[Example]
(Example 1)
A vinyl chloride resin sheet [manufactured by Chubu Plastic Co., Ltd., trade name PRN485] was processed to form a 0.6 mm thick vinyl chloride resin card core sheet having a 20 mm diameter hole therethrough. In addition, a vinyl chloride resin sheet [manufactured by Chuchu Plastic Co., Ltd., trade name PRG432] was processed to form a vinyl chloride resin bottom material having a thickness of 0.1 mm and a vinyl chloride resin sheet material having a thickness of 0.1 mm.

And the base material made from a vinyl chloride resin was piled up so that one end face of the hole of a card core sheet might block up, and the card base sheet which has a concave part for modules was formed. Next, an IC module (size: 16 × 16 mm) was placed in the concave portion, and then an elastic epoxy adhesive wultite 1540 manufactured by Toho Kasei Kogyo Co., Ltd. (2% elastic modulus after curing, 0.4 kgf / mm ² ) in the concave portion for the IC module. The module recess was filled with an adhesive and the module recess was flattened with an adhesive, and the adhesive was cured to seal the IC module.

  Next, the vinyl chloride resin sheet material is stacked on the card core sheet around the module recess where the sealing module is formed, and the opening surface of the recess is closed with the sheet material. The sheet material is sandwiched between stainless steel flat plates from the bottom material side, and then heated and pressed at a temperature of 150 ° C. and a pressure of 2 MPa for 10 minutes to bond the sheet material and the card core sheet together. An IC card was manufactured by adhering a stop module, simultaneously adhering a card core sheet and a bottom material forming a card base sheet, and punching into a card shape.

  The bending strength, impact strength and smoothness of the obtained IC card were evaluated. The bending strength was measured according to JIS standard X6303, and the impact strength was measured by using a falling body impact tester of JIS standard K5600-5-3, with an IC chip centered on a cradle with an inner diameter of 27 mm. The card is firmly fixed by sandwiching the card from above and below, and a weight (S45C steel) with a tip diameter of 20 mm and a weight of 100 g is dropped freely on the IC chip at the center of the cradle from a height of 10 cm, and then the operation and deformation Confirmed damage.

For smoothness, the surface roughness of the sheet material corresponding to the IC card sealing module was measured according to JIS standard X6305. There was no problem with the bending strength of the obtained IC card, and when the impact strength was evaluated, no abnormality occurred in the IC function without deformation and peeling. The IC card had a surface roughness of 19 μm and good smoothness.
(Example 2)
A vinyl chloride resin sheet [manufactured by Chubu Plastic Co., Ltd., trade name PRN485] was processed to form a 0.6 mm thick vinyl chloride resin card core sheet having a 20 mm diameter hole therethrough. In addition, a vinyl chloride resin sheet [manufactured by Chuchu Plastic Co., Ltd., trade name PRG432] was processed to form a vinyl chloride resin bottom material having a thickness of 0.1 mm and a vinyl chloride resin sheet material having a thickness of 0.1 mm.

And the base material made from a vinyl chloride resin was piled up so that one end face of the hole of a card core sheet might block up, and the card base sheet which has a concave part for modules was formed. The IC module (size 16 × 16 mm) was immersed in a trade name Bond E set L (2% elastic modulus 0.1 kgf / mm ² after curing) manufactured by Konishi Co., Ltd. and then cured. Furthermore, a sealing module was formed by molding so as to have substantially the same shape as the above-mentioned concave portion for module, and this sealing module was inserted into the concave portion for module of the card base sheet.

  Next, the vinyl chloride resin sheet material is overlaid on the card core sheet around the module recess, into which the sealing module is inserted, and the opening surface of the recess is closed with the sheet material. The sheet material is sandwiched between stainless steel flat plates from the bottom material side, and then heated and pressed at a temperature of 150 ° C. and a pressure of 2 MPa for 10 minutes to bond the sheet material and the card core sheet together. An IC card was manufactured by adhering a stop module, simultaneously adhering a card core sheet and a bottom material forming a card base sheet, and punching into a card shape.

When the bending strength of the obtained IC card was evaluated, there was no problem, and when the impact strength was evaluated, no abnormality occurred in the IC function without deformation and peeling. The surface roughness of the IC card was 28 μm and the smoothness was good.
(Comparative Example 1)
After placing the IC module in the IC module recess, inject semi-coat 220H (2% elastic modulus 300 kgf / mm ² ) manufactured by Shin-Etsu Chemical Co., Ltd. to make the module recess flat with an adhesive and cure the adhesive. An IC card was manufactured in the same manner as in Example 1 except that the IC module was sealed.

  When the bending strength of the obtained IC card was evaluated, irregularities were generated in the portion corresponding to the sealing module of the IC card, and the sheet material was peeled off. Moreover, when the impact strength was evaluated, the drop part of the weight was deformed, and the IC function was lost.

  The surface roughness of the IC card was 56 μm, and the smoothness was clearly inferior to the examples.

  The present invention is widely applicable to IC cards and IC card manufacturing methods that can transmit and receive data from the viewpoint of efficiency of information processing and security, have high surface smoothness, and require strength against bending and impact. Applicable.

It is sectional drawing which shows one Embodiment of an IC card. It is a figure explaining the manufacturing method of the IC card which concerns on Claim 2. It is a figure explaining the manufacturing method of the IC card which concerns on Claim 3.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC card 2 1st oversheet 3 Card core sheet 4 2nd oversheet 5 IC module

Claims (3)

A card substrate having a module hole or embedded recess for mounting an IC module having an IC chip;
An oversheet bonded to the card base so as to close the IC module hole or the embedded recess,
An IC card, wherein at least the IC chip of the IC module is an elastic body having a 2% elastic modulus of 0.05 to 50 kgf / mm ² and is sealed in the IC module hole or the embedded recess. A step of inserting an IC module into the module hole after laminating a first oversheet on one side of a card core sheet having a module hole for mounting an IC module having an IC chip, or a card base having an embedded recess Inserting an IC module into the embedded recess of the material;
Filling the module hole or the embedded recess with a liquid resin by injecting a liquid resin having a cured 2% elastic modulus of 0.05 to 50 kgf / mm ² into the module hole or the embedded recess;
Curing the liquid resin;
A method of manufacturing an IC card, comprising: a step of bonding a second oversheet to the card core sheet or the card base and closing the module hole or the embedded recess. In the concave portion of the card base sheet in which the concave portion is formed,
After inserting the sealing module formed by sealing the IC module with an elastic body having a 2% elastic modulus of 0.05 to 50 kgf / mm ² after curing,
An IC card manufacturing method, wherein an oversheet is joined to the card base sheet to close an opening surface of the recess.

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