JP2004506324A5 - - Google Patents

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Publication number
JP2004506324A5
JP2004506324A5 JP2002518518A JP2002518518A JP2004506324A5 JP 2004506324 A5 JP2004506324 A5 JP 2004506324A5 JP 2002518518 A JP2002518518 A JP 2002518518A JP 2002518518 A JP2002518518 A JP 2002518518A JP 2004506324 A5 JP2004506324 A5 JP 2004506324A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002518518A
Other versions
JP2004506324A (ja
JP4959904B2 (ja
Filing date
Publication date
Priority claimed from US09/633,931 external-priority patent/US6468889B1/en
Application filed filed Critical
Publication of JP2004506324A publication Critical patent/JP2004506324A/ja
Publication of JP2004506324A5 publication Critical patent/JP2004506324A5/ja
Application granted granted Critical
Publication of JP4959904B2 publication Critical patent/JP4959904B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2002518518A 2000-08-08 2001-07-26 集積回路のための背面コンタクトを形成する方法 Expired - Lifetime JP4959904B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/633,931 2000-08-08
US09/633,931 US6468889B1 (en) 2000-08-08 2000-08-08 Backside contact for integrated circuit and method of forming same
PCT/US2001/023571 WO2002013258A2 (en) 2000-08-08 2001-07-26 Backside contact for integrated circuit and method of forming same

Publications (3)

Publication Number Publication Date
JP2004506324A JP2004506324A (ja) 2004-02-26
JP2004506324A5 true JP2004506324A5 (ja) 2008-09-04
JP4959904B2 JP4959904B2 (ja) 2012-06-27

Family

ID=24541739

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002518518A Expired - Lifetime JP4959904B2 (ja) 2000-08-08 2001-07-26 集積回路のための背面コンタクトを形成する方法

Country Status (8)

Country Link
US (1) US6468889B1 (ja)
EP (1) EP1307916B1 (ja)
JP (1) JP4959904B2 (ja)
KR (1) KR100819191B1 (ja)
CN (1) CN100459097C (ja)
AU (1) AU7802601A (ja)
DE (1) DE60127271T2 (ja)
WO (1) WO2002013258A2 (ja)

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US7345350B2 (en) * 2003-09-23 2008-03-18 Micron Technology, Inc. Process and integration scheme for fabricating conductive components, through-vias and semiconductor components including conductive through-wafer vias
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US7271482B2 (en) 2004-12-30 2007-09-18 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
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US7863187B2 (en) 2005-09-01 2011-01-04 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
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US7629249B2 (en) 2006-08-28 2009-12-08 Micron Technology, Inc. Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
US7902643B2 (en) 2006-08-31 2011-03-08 Micron Technology, Inc. Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
JP2010503986A (ja) * 2006-09-18 2010-02-04 エヌエックスピー ビー ヴィ 半導体基板に垂直方向接点を製造する方法
US8212331B1 (en) * 2006-10-02 2012-07-03 Newport Fab, Llc Method for fabricating a backside through-wafer via in a processed wafer and related structure
US7544605B2 (en) * 2006-11-21 2009-06-09 Freescale Semiconductor, Inc. Method of making a contact on a backside of a die
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JP5609144B2 (ja) * 2010-02-19 2014-10-22 ソニー株式会社 半導体装置および貫通電極のテスト方法
JP5400964B2 (ja) * 2010-07-01 2014-01-29 東京エレクトロン株式会社 半導体装置の製造方法
US8664040B2 (en) * 2011-12-20 2014-03-04 Taiwan Semiconductor Manufacturing Company, Ltd. Exposing connectors in packages through selective treatment
WO2016136222A1 (ja) * 2015-02-23 2016-09-01 凸版印刷株式会社 印刷配線板及びその製造方法
EP3340284A4 (en) * 2015-08-21 2019-03-20 Hitachi Automotive Systems, Ltd. SEMICONDUCTOR ELEMENT, INTEGRATED SEMICONDUCTOR AND LOAD CONTROL
JP6963396B2 (ja) * 2017-02-28 2021-11-10 キヤノン株式会社 電子部品の製造方法
US11018024B2 (en) * 2018-08-02 2021-05-25 Nxp Usa, Inc. Method of fabricating embedded traces
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CN115312493A (zh) * 2021-05-08 2022-11-08 中芯国际集成电路制造(上海)有限公司 半导体结构及其形成方法

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