JP2004303268A - Liquid-cooling system and personal computer using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a personal computer equipped with a liquid-cooling system or structure capable of cooling a high heating element such as a semiconductor element used for a miniaturized and thinned electronic apparatus, with low power consumption. <P>SOLUTION: A reciprocating pump, a heat receiving jacket, a heat radiating pipe, and a connecting pipe for connecting these parts, are arranged in a closed loop to fill a liquid coolant. When defining the volumetric change caused by the reciprocating motion of a pump member, as ΔVp, pressure generated at the volumetric change ΔVp, as P and the volumetric change of the liquid-cooling system excluding the pump generated when applying the pressure P, as ΔVs, ΔVs is to be ΔVp or more. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a liquid cooling system for cooling a heating element, and more particularly to a liquid cooling system suitable for an ultra-small and thin structure.

  A semiconductor device used for an electronic device such as a computer generates heat during operation. In particular, the heat generation of recent highly integrated semiconductors is increasing. Since the semiconductor loses its function as a semiconductor when the temperature exceeds a certain temperature, it is necessary to cool a semiconductor device which generates a large amount of heat.

  As a method for cooling a semiconductor device of an electronic device, a method using heat conduction, a method using air cooling, a method using a heat pipe, and a method using liquid cooling are known.

  Cooling by heat conduction is achieved by using a material having high thermal conductivity in a heat radiation path from the semiconductor device to the outside of the electronic device. This method is suitable for a compact electronic device such as a notebook personal computer in which the heat value of the semiconductor device is relatively small.

  Cooling by air cooling is achieved by providing a blower inside the electronic device and forcibly convection cooling the semiconductor device. This method is widely used for cooling a semiconductor device having a certain amount of heat generation, and is also applied to a personal computer by reducing the size and thickness of a blower.

  Cooling using a heat pipe involves transferring heat to the outside of the electronic device by means of a refrigerant sealed in the pipe, and is described in JP-A-1-84699 and JP-A-2-244748. This method is efficient because it does not use components that consume power such as a blower, and is more efficient in cooling by heat conduction. However, this method was limited in the heat that could be transported.

  Cooling by liquid cooling is suitable for cooling a semiconductor device having a large amount of heat. Specific methods are described in JP-A-5-335454, JP-A-6-97338, JP-A-6-125188, and No. 213370. However, the use of the conventional liquid cooling system has been limited to a large computer. This is because the liquid cooling system requires many parts dedicated to cooling, such as pumps, piping systems, and radiating fins, so that the size of the device becomes large and the reliability of using the liquid for cooling is ensured compared to other methods. It depends. Another reason is that a semiconductor device that generates a large amount of heat so as to require liquid cooling has not been used except for a large computer.

  A technique for applying liquid cooling to a small electronic device including a notebook personal computer is described in JP-A-6-266474. In this known example, a header attached to a semiconductor device and a radiating pipe located away from the header are connected by a flexible tube, and heat is transported through a liquid flowing through the header and cooled.

JP-A-1-84699

JP-A-2-244748 JP-A-5-335454 JP-A-6-97338 JP-A-6-125188 JP-A-10-213370 JP-A-6-266474

  However, in recent years, the amount of heat generated by semiconductor devices used in electronic devices such as personal computers, servers, and workstations has increased dramatically, and in recent years electronic devices, especially notebook personal computers, have become smaller and thinner. It is not enough to apply the above-mentioned known example to the application to an electronic device which is required to be integrated.

  Accordingly, an object of the present invention is to provide a cooling system capable of cooling a high heat generating element such as a semiconductor element used in a small and thin electronic device with low power consumption, or a personal computer having the structure.

  The above object is achieved by configuring a personal computer equipped with an ultra-compact and thin liquid cooling system with high efficiency or a cooling system unique to a small and thin personal computer.

A liquid cooling system requires a pump that promotes the circulation of liquid, but it is difficult to realize a generally used rotary pump in terms of ultra-small size and thickness and low power consumption. For this reason, it is effective to use a pump that pressurizes the liquid by reciprocating members.
However, even when a reciprocating pump is used, it is necessary to satisfy the following conditions in order to configure a low power consumption system capable of efficiently cooling.

  Specifically, a pump that supplies the coolant as a pulsating flow, a heat receiving jacket to which the coolant is supplied and receives heat from a heating element, and a radiating pipe that supplies the coolant through the heat receiving jacket and radiates heat, A path through which the cooling liquid that has passed through the heat radiating pipe circulates through the pump, wherein the cooling liquid circulates through a closed flow path, wherein the pump discharges a pulsating flow. Where ΔVp is the volume change of the coolant flow path excluding the pump section due to the pressure P, and ΔVs is ΔVp or more. And

  In addition, for example, the pump discharges the pulsating flow by reciprocating motion of a member in the pump, and reciprocating motion of the member of the pump can be caused by bending of a diaphragm. It is more preferable that the diaphragm itself or the driving source of the diaphragm is a piezo element from the viewpoint of small size, low power consumption, low noise, and the like. As a result, even with a small and thin computer, the flow rate of the transported coolant can be secured, and efficient cooling can be achieved.

  Further, a rubber pipe or a resin pipe is used for at least a part of the connection pipe which is a flow path for carrying the cooling liquid, and the surface of the resin or the rubber pipe is covered with a metal film or covered with a resin sheet covered with the metal film. In addition, the cooling liquid can be diffused through rubber or resin to suppress the release to the atmosphere and efficiently conduct heat.

  In the above, it is preferable from the viewpoint of pressure management and the like to have an accumulator in which the volume change of the cooling liquid held by the pressure P is equal to or more than ΔVp.

  The accumulator has a structure in which the amount of the coolant can be changed by holding the coolant inside. For example, the holding amount may be changed by own deformation. Alternatively, a structure in which gas is also held inside may be used.

  The accumulator is made of rubber or resin, for example, and is made movable by pressure change. Alternatively, a metal bellows structure can be used. Alternatively, a piston mechanism can be used.

  In the liquid cooling system, it is preferable that the cooling liquid is pressurized to a pressure higher than the atmospheric pressure.

  The accumulator includes a supply port through which the circulating coolant is supplied and a discharge port through which the coolant is discharged, and holds the coolant and the gas therein. The accumulator is preferably arranged in series with the heat receiving jacket and / or the heat radiating pipe in the coolant path.

  The personal computer having the cooling liquid system includes, for example, a semiconductor device, a signal input unit, and a display device, a pump that supplies the cooling liquid as a pulsating flow, and the cooling liquid is supplied. A heat-receiving jacket for receiving heat generated in the semiconductor element, a heat-dissipating pipe for supplying a coolant through the heat-receiving jacket and dissipating heat, and a path for circulating the coolant through the heat-dissipating pipe to the pump, A liquid cooling system that circulates through a flow path in which a cooling liquid is closed, wherein the internal volume change when the pump discharges a pulsating flow is ΔVp, and a pressure generated by the volume change. Is P, and ΔVs is equal to or greater than ΔVp, where ΔVs is a change in the volume of the coolant flow path excluding the pump section due to the pressure P.

  Note that, in a notebook personal computer, a display device having a main body including a semiconductor element and a signal input unit, a display unit communicating with the first member via a movable unit mechanism, and a pulsating flow of a coolant. And a heat receiving jacket disposed on the main body and receiving the heat generated by the semiconductor element when the cooling liquid is supplied thereto, and a cooling liquid passing through the heat receiving jacket is supplied to a back surface of the display unit of the display device. A personal computer comprising: a heat radiating pipe for radiating heat; and a path for circulating a coolant passing through the heat radiating pipe to the pump, and a liquid cooling system circulating in a flow path in which the coolant is closed. Wherein the display device has a supply port to which the coolant flowing through the flow path is supplied and a discharge port to discharge the supplied coolant, in the flow path of the coolant, Wherein a cooling liquid and an accumulator for holding the gas, corresponding to the discharge of the pulsating flow from the pump, so as to vary the amount of coolant retained in said accumulator.

  Further, as another specific mode, a semiconductor device, a signal input unit, a display device, a discharge pump using a reciprocating motion of a diaphragm having a piezo element as a pulsating flow of a coolant, and the coolant is supplied. A heat-receiving jacket that receives heat generated by the semiconductor element, a heat-dissipating pipe that is supplied with a coolant that has passed through the heat-receiving jacket and radiates heat, a coolant that is supplied through the heat-dissipating pipe, and a supply port and the supplied coolant A flow path in which the cooling liquid is closed, comprising: an accumulator for holding the cooling liquid and the gas therein; and a path for circulating the cooling liquid passing through the accumulator to the pump. A liquid cooling system that circulates the cooling liquid, wherein the cooling liquid is held in the accumulator in response to discharge of the pulsating flow from the pump. The to to change.

  Next, a description will be given with reference to FIG. FIG. 13 shows the flow path of the cooling system according to the present invention. The flow path is composed of a pump 1 and a connection pipe 3, and the inside is filled with a cooling liquid. The connection pipe 3 is connected to both the outlet and the inlet of the pump to form a closed loop. The pump 1 includes a reciprocating diaphragm 8, check valves 9a and 9b, and a case. Now, consider the case where the diaphragm comes to the position indicated by the solid line. Since the cooling liquid in the pump is pressurized, the check valve 9b is opened. By continuing this, a pulsating flow is discharged from the pump and circulates through the coolant path. At this time, in order for the coolant to move in the direction of the arrow, it is necessary that a part or all of the connection pipe 3 expands due to the pressure and the coolant that has been in the pump flows in.

FIG. 14 shows the relationship between the flow rate Q and the pressure P of the pump. Pmax indicates the maximum pressure generated when the outlet of the pump is closed and no coolant flows, and Qmax indicates the maximum flow rate when the pump outlet is opened to eliminate the pressure loss. Determines the relationship between the flow rate Q and pressure P in this diagram, for example, the flow rate when the pressure loss was connected to pipe P ₀ becomes Q _0.

In the cooling system of the present invention, since the coolant flow path is circulated by the pulsating flow by employing the reciprocating pump, the volume change ΔVp due to the supply (reciprocating) of the pulsating flow is obtained by the flow rate Q / frequency f. The relationship between the volume change ΔVp and the pressure P can be drawn as shown in FIG. Further, since the pressure P applied to the pipe and the change in volume ΔVs of the pipe are proportional, for example, a straight line (1) is obtained. In this case, the straight line (1) and determines the pressure P ₁ and the volume change [Delta] V ₁ at the intersection of characteristic diagram of the pump. In the case of an open loop, the volume change is determined by the pressure loss P ₀ of the pipe, and a volume change ΔV ₀ is obtained. However, when a hard pipe having a small volume change as in (2) is used, the volume change is ΔV smaller than ΔV _{0. You} get only _one . Therefore, the flow rate decreases and the cooling performance also decreases. On the other hand, when the volume change with respect to pressure is large as in (2), that is, when a soft pipe is used, the volume change at the intersection of the straight line (2) and the characteristic diagram of the pump is larger than ΔV ₀ , As for the original volume change, ΔV ₀ is obtained, and sufficient characteristics can be exhibited. That is, when the volume change due to the reciprocating motion of the pump member is defined as ΔVp, the pressure generated at the time of the volume change ΔVp is defined as P, and the volume change of the liquid cooling system excluding the pump generated when the pressure P is applied is defined as ΔVs, ΔVs Is equal to or greater than ΔVp, the characteristics of the cooling system can be derived with high efficiency, and a system with low power consumption can be configured.

  In addition, the above components are connected to two pumps for pressurizing the liquid by reciprocating members, a heat receiving jacket having a heat exchanger function for cooling the heating element, a radiating pipe for performing heat exchange with the outside world. In a liquid cooling system, which consists of a connecting pipe, two pumps, a heat receiving jacket, and a heat radiating pipe are arranged in a closed loop by the connecting pipe, and the pump, the heat receiving jacket, the heat radiating pipe, and the connecting pipe are filled with a cooling liquid. The same effect can be obtained by shifting the phase of the reciprocating motion of the members of the two pumps by 180 degrees, the characteristics of the cooling system can be extracted with high efficiency, and a system with low power consumption can be configured. it can.

  According to the present invention, it is possible to provide a cooling system capable of cooling a high heat generating element such as a semiconductor element used in a small and thin electronic device with low power consumption, or a personal computer including the cooling system.

  Hereinafter, embodiments of the present invention will be described.

  FIG. 1 shows a notebook personal computer using the cooling system of the present invention. The semiconductor element 5 mounted on the main body housing 6 is connected to the heat receiving jacket 2 provided with a coolant flow path therein. The pump 1 is also provided in the main body housing 6. A heat dissipation pipe 4 is provided on the rear surface of the display panel of the display device housing 7. The pump 1, the heat receiving jacket 2, and the heat radiating pipe 4 are connected in a closed loop as shown in the figure by a connecting pipe 3, and the inside thereof is filled with a cooling liquid.

FIG. 2 schematically shows a first embodiment of the cooling system for the notebook personal computer shown in FIG. The pump 1, the heat receiving jacket 2 connected to the semiconductor element 5 mounted on the printed board 11, and the heat radiating pipe 4 are connected by the connecting pipe 3. The pump 1 includes a reciprocating diaphragm 8, check valves 9a and 9b, and a case. A part of the connection pipe 3 is made of a soft material, and serves as an expansion portion 10. When the diaphragm 8 reaches the position shown in the figure, the coolant is pressurized, and the check valve 9b opens. Then, the expansion portion 10 expands as indicated by 10a by the pressure of the coolant, and the coolant moves in the direction of the arrow. Next, when the diaphragm 8 comes to the position indicated by the broken line, the pressure decreases, so that the check valve 9a opens and the coolant in the connection pipe flows into the pump, and the expansion section 10 returns to the position indicated by the broken line. By repeating this operation, the coolant circulates in the flow path. The cooling liquid warmed in the heat receiving jacket 2 is cooled by the heat radiating pipe 4 and flows into the heat receiving jacket again via the pump 1. By repeating this, even a semiconductor element having a large amount of heat can be efficiently cooled.
(Especially, it is effective when used in a personal computer having a semiconductor element that generates heat exceeding 30 W.)
In this embodiment, when the volume change due to the reciprocating motion of the pump member is defined as ΔVp, the pressure generated at the time of the volume change ΔVp is defined as P, and the volume change of the expansion section 10 generated when the pressure P is applied is defined as ΔVs, Is ΔVp or more. For this reason, as described in the section of “Means for Solving the Problems”, the characteristics of the cooling system can be extracted with high efficiency, and a system with low power consumption can be configured.

  The value can be measured, for example, as follows. The connecting pipe 3 for collecting the cooling liquid in the pump 1 is cut immediately before the pump. A pressure gauge is installed downstream of the pump 1 and directly below the pump 1. The pump 1 is driven by supplying a coolant from the coolant supply source to the pump 1. Then, the flow rate and the pressure P0 are measured. Next, from the frequency of the pulsation of the pump 1 (reciprocation of the internal member), the volume change (ΔVp), which is the flow rate per time, is determined.

  Next, the end of the cut connection pipe opposite to the pump 1 is sealed, and a personal computer or the like is arranged so that the flow path of the coolant is as horizontal as possible. Then, a water column is connected to the pump side of the cut connection pipe, and the volume change ΔVs and the pressure P1 of the cooling water flow path other than the pump are measured based on the height change and height of the water column. Vs and P1 are plotted in the ΔV-P diagram, and a straight line is drawn from the origin. When the straight line is compared with the plot points of P0 and ΔVp, when the pressures at ΔVp are compared, P0 has a larger value.

  In the present embodiment, a part of the connection pipe 3 is soft and plays a role in which ΔVs becomes equal to or more than ΔVp. However, the entire connection pipe may be soft and plays a role in which ΔVs becomes equal to or more than ΔVp. In addition, as a material of the connection pipe 3, rubber or resin having low rigidity can be used.

  FIG. 3 schematically shows a cooling system according to a second embodiment of the present invention. The configuration of the system is almost the same as that of the first embodiment, but an accumulator 12 whose inside is filled with a cooling liquid is attached instead of the expansion section 10 of the first embodiment. Also in this figure, the solid line and the broken line of the diaphragm 8 correspond to the solid line and the broken line of the accumulator 12. When the inside of the pump 1 is pressurized by the diaphragm 8, the check valve 9b is opened, the pressure is transmitted to the accumulator 12, and the pump expands as indicated by the solid line. This expansion allows the coolant to flow in the direction of the arrow. In the present embodiment, the change in volume of the accumulator 12 when the pressure P is applied is ΔVs, and ΔVs is equal to or greater than ΔVp. Therefore, the characteristics of the cooling system can be brought out with high efficiency, and a system with low power consumption can be configured.

  In this embodiment, the accumulator 12 is branched and attached to the connection pipe 3, but as shown in FIG. 4, even if the accumulator 13 is connected in series to the connection pipe 3 and incorporated in a closed loop, if ΔVs is equal to or greater than ΔVp, The same effect can be obtained.

  When the accumulators 12 and 13 are variable in size and size, the accumulators 12 and 13 may be made of low-rigidity rubber or resin. On the other hand, instead, it is also conceivable to adopt a structure having a gas portion (air and the like) and a cooling liquid retaining portion inside the accumulator. A supply port for supplying the coolant to the accumulators 12 and 13 and a discharge port (not shown) for discharging the coolant retained in the accumulators 12 and 13 may be provided.

  In this embodiment, the accumulator is installed in the path between the pump 1 and the heat receiving jacket 2, but is more preferably in the path between the heat receiving jacket 2 and the pump 1; 7 is preferable from the viewpoint of efficient miniaturization and the like. It is more preferable to install the heat radiation pipe 4 downstream of the area where the heat radiating pipe 4 is installed from the viewpoint of corrosion and the like.

  FIG. 5 schematically shows a cooling system according to a third embodiment of the present invention. The configuration of the system is almost the same as that of FIG. 3 of the second embodiment, except that a metal bellows 14 is attached as an accumulator. Also in this figure, the solid line and the broken line of the diaphragm 8 correspond to the solid line and the broken line of the metal bellows 14. When the inside of the pump 1 is pressurized by the diaphragm 8, the check valve 9 b opens, the pressure is transmitted to the metal bellows 14, and the pump expands as shown by a solid line. This expansion allows the coolant to flow in the direction of the arrow. In the present embodiment, the change in volume of the metal bellows 14 when the pressure P is applied is ΔVs, and ΔVs is equal to or greater than ΔVp. For this reason, the characteristics of the cooling system can be extracted with high efficiency, and a low power consumption system can be configured.

  In this embodiment, the metal bellows 14 is branched and attached to the connection pipe 3. However, even if the metal bellows 15 is connected in series to the connection pipe 3 as shown in FIG. If so, the same effect can be obtained. Examples of the material of the metal bellows 14 include stainless steel and phosphor bronze for spring.

  FIG. 7 schematically shows a cooling system according to a fourth embodiment of the present invention. The configuration of the system is almost the same as in the second and third embodiments, except that a piston mechanism 16 is used as an accumulator. The piston mechanism 16 has a structure like a syringe, and one end of the piston is pressed by a spring. When the inside of the pump 1 is pressurized by the diaphragm 8, the check valve 9b is opened, the pressure is transmitted to the piston mechanism 16, and the piston moves upward in FIG. This movement allows the coolant to flow in the direction of the arrow. In this embodiment, the change in volume of the piston mechanism 16 that occurs when the pressure P is applied is ΔVs, and ΔVs is equal to or greater than ΔVp by adjusting the strength of the spring. For this reason, the characteristics of the cooling system can be brought out with high efficiency, and a system with low power consumption can be configured. Examples of the material of the piston mechanism 16 include metal, resin, and glass, but a commercially available syringe may be used as it is. Examples of the spring used in the piston mechanism 16 include a leaf spring, an air spring, and the like in addition to the coil spring shown in FIG.

  FIG. 8 schematically shows a cooling system according to a fifth embodiment of the present invention. The configuration of the system is the same as that of the second embodiment, but in this embodiment, the cooling liquid is filled under pressure. Also in this figure, the solid and broken lines of the diaphragm 8 correspond to the solid and broken lines of the accumulator 17. The original shape of the accumulator 17 (shape when there is no difference between the internal pressure and the external pressure) is indicated by a dashed line. Since the cooling liquid is filled under pressure, the shape of the accumulator 17 is larger than the original shape even when the diaphragm 8 of the pump 1 comes to the position indicated by the broken line. Even if the coolant is pressurized and filled, if the volume change Vs of the accumulator 17 that occurs when the pressure P is applied is equal to or greater than ΔVp, the same effect as in the first embodiment can be obtained, and the characteristics of the cooling system can be obtained. Can be extracted with high efficiency, and a system with low power consumption can be configured.

  As an effect peculiar to the present embodiment, it is possible to prevent bubbles in the system caused by a long-term decrease in the coolant. When rubber or resin is used as the material of the connection pipe 3 or the accumulator 17, although a small amount, the molecules of the cooling liquid diffuse through the rubber or resin and escape into the atmosphere. If the pressure in the system is lower than atmospheric pressure, air may diffuse through the rubber or resin and enter the flow path, creating bubbles. It is important for the present system to prevent air bubbles, which can interfere with the check valve or impede heat transfer.

  In the first, third and fourth embodiments, it is needless to say that the same effect as in the present embodiment can be obtained by filling the coolant by pressurizing.

  FIG. 9 schematically shows a cooling system according to a sixth embodiment of the present invention. The configuration of the system is the same as that of the first embodiment, but in this embodiment, a soft rubber or resin is used for the connection pipe 3. Then, the surface of the connection pipe 3 was covered with a metal film 18 as shown in FIG. As an effect peculiar to this embodiment, since the connection pipe 3 is soft, other parts such as a pump, a heat receiving jacket, and a heat radiating pipe can be freely arranged. Further, it is also possible to repeatedly bend a part of the heat radiation path. However, when rubber or resin is used, the molecules of the coolant may diffuse in the rubber or resin and escape into the atmosphere as described in the fifth embodiment. In the present embodiment, since the surface of the connection pipe 3 is covered with the metal film 18, it is possible to prevent a decrease in the cooling liquid. Also, as shown in FIG. 11, the same effect can be obtained by covering the connection pipe with a resin sheet 19 composed of a metal film 19b and a resin film 19a. At this time, there may be a gap between the resin sheet 19 and the connection pipe 3, but both ends of the resin sheet 19 must be in close contact with the connection pipe 3.

  FIG. 12 schematically shows a cooling system according to a seventh embodiment of the present invention. In this embodiment, two pumps are arranged in series to form a closed loop flow path. The solid and broken lines of the diaphragms 8 and 8 'correspond to each other. When the diaphragm 8 of the pump 1 is at the position indicated by the solid line and pressurizes the coolant, the diaphragm 8 'of the pump 1' is at the position indicated by the solid line, so that the coolant discharged from the pump 1 flows into the pump 1 '. . As described above, since the phases of the reciprocating motions of the diaphragms of the two pumps are shifted by 180 degrees, the coolant can smoothly move in the direction of the arrow, so that the same effect as in the other embodiments can be obtained. The characteristics of the cooling system can be extracted with high efficiency, and a low power consumption system can be configured.

  In this embodiment, it is not necessary to provide a portion in which the flow path expands as in the other embodiments. However, it may be used in combination with the other embodiments.

  Further, in this embodiment, since two pumps are used, the pressing force is increased and the flow rate is increased, so that there is a specific effect that the cooling efficiency is improved as compared with the cooling systems of the other embodiments.

  As described above, according to the present embodiment, it is possible to draw out the characteristics of the cooling system with high efficiency, so that it is possible to provide a cooling system that is ultra-small, thin, and has low power consumption. Is applied to a personal computer, it becomes possible to mount a semiconductor element with high heat generation.

A notebook personal computer using a cooling system according to one embodiment of the present invention. 1 is a cooling system according to an embodiment of the present invention. 1 is a cooling system according to an embodiment of the present invention. 4 is another cooling system according to an embodiment of the present invention. 1 is a cooling system according to an embodiment of the present invention. 4 is another cooling system according to an embodiment of the present invention. 1 is a cooling system according to an embodiment of the present invention. 1 is a cooling system according to an embodiment of the present invention. 1 is a cooling system according to an embodiment of the present invention. The connecting pipe used in one embodiment of the present invention. The connecting pipe used in one embodiment of the present invention. 1 is a cooling system according to an embodiment of the present invention. FIG. 1 is a principle diagram of a cooling system for explaining a basic principle of the present invention. 4 is a graph showing a relationship between a flow rate and a pressure of a pump used in the cooling system according to the embodiment of the present invention. 4 is a graph showing a relationship between a pressure change and a pressure of a pump used in the cooling system according to the embodiment of the present invention.

Explanation of reference numerals

1, 1 'pump, 2 heat receiving jacket, 3 connection pipe, 4 radiating pipe, 5 semiconductor element, 6 body casing, 7 display casing, 8, 8' diaphragm, 9a, 9b 9a ', 9b' ... check valve, 10 ... expansion section, 11 ... printed circuit board, 12 ... accumulator (branch type), 13 ... accumulator (serial type), 14 ... metal bellows 1 (branch type), 15 ... metal Bellows 1 (series type), 16: piston mechanism, 17: accumulator (pressure type), 18: metal film, 19: resin sheet covered with metal film.

Claims (10)

A pump for supplying the cooling liquid as a pulsating flow, a heat receiving jacket to which the cooling liquid is supplied and receiving heat from a heating element, a radiating pipe to which the cooling liquid supplied through the heat receiving jacket is supplied to radiate heat, and a heat radiating pipe. A path through which the coolant circulates through the pump, and a liquid cooling system that circulates through the closed flow path of the coolant,
When the internal volume change when the pump discharges a pulsating flow is ΔVp, the pressure caused by the volume change is P, and the volume change of the coolant flow path excluding the pump unit due to the pressure P is ΔVs. In addition, ΔVs is equal to or greater than ΔVp.   The liquid cooling system according to claim 1, further comprising an accumulator in which a change in volume of the cooling liquid held by the pressure P due to the pressure P is equal to or more than ΔVp.   2. The liquid cooling system according to claim 1, wherein the cooling liquid is pressurized to a pressure higher than the atmospheric pressure.   3. The liquid cooling system according to claim 2, wherein the accumulator includes a supply port to which the circulating cooling liquid is supplied and a discharge port to discharge the cooling water, and holds the cooling liquid and the gas inside. Liquid cooling system characterized by the following. A semiconductor device, a signal input unit, and a display device, a pump that supplies a coolant as a pulsating flow, a heat receiving jacket to which the coolant is supplied and receives heat generated in the semiconductor device, and a heat receiving jacket. A cooling pipe that is supplied with a cooling liquid and radiates heat, and a path through which the cooling liquid that has passed through the cooling pipe circulates through the pump, and a liquid cooling system that circulates through a closed flow path of the cooling liquid; A personal computer with
When the internal volume change when the pump discharges a pulsating flow is ΔVp, the pressure caused by the volume change is P, and the volume change of the coolant flow path excluding the pump unit due to the pressure P is ΔVs. In addition, ΔVs is equal to or larger than ΔVp.   6. The personal computer according to claim 5, further comprising an accumulator in which a change in volume of the cooling liquid held by the pressure P due to the pressure P is equal to or more than ΔVp.   6. The personal computer according to claim 5, wherein the coolant is pressurized to a pressure higher than the atmospheric pressure. A semiconductor device, a main body including a signal input unit, a display device including a display unit that communicates with the first member via a movable unit mechanism, a pump that discharges a coolant as a pulsating flow, and the main body. A heat receiving jacket that is disposed and receives the heat generated in the semiconductor element when the cooling liquid is supplied thereto, and a radiating pipe that is supplied with a cooling liquid that has passed through the heat receiving jacket and radiates heat to the back surface of the display unit of the display device; A path through which a cooling liquid circulating through the heat radiating pipe circulates through the pump, and a liquid cooling system that circulates through a closed flow path of the cooling liquid,
The display device has a supply port through which the cooling liquid flowing through the flow path is supplied and a discharge port through which the supplied cooling liquid is discharged, and the cooling liquid and the gas therein. A personal computer, comprising: an accumulator for retaining the pressure, and changing an amount of the coolant retained in the accumulator in response to discharge of the pulsating flow from the pump.   9. The personal computer according to claim 8, wherein the internal volume change when the pump discharges a pulsating flow is ΔVp, and the pressure generated due to the volume change is P, and the pressure is held in the accumulator by the pressure P. 10. A personal computer characterized in that ΔVs is equal to or greater than ΔVp, where ΔVs is the volume change of the cooling liquid. A semiconductor device, a signal input unit, a display device, a discharge pump using coolant as a pulsating flow by using a reciprocating motion of a diaphragm having a piezo element, and a heat receiving jacket to which the coolant is supplied and receives heat generated in the semiconductor device. A cooling pipe that is supplied with the cooling liquid through the heat receiving jacket and radiates heat, a cooling liquid is supplied through the cooling pipe, and a supply port and a discharge port that discharges the supplied cooling liquid are provided. An accumulator that holds the coolant and gas, and a path through which the coolant that has passed through the accumulator circulates through the pump, and a liquid cooling system that circulates through a flow path in which the coolant is closed, Personal computer,
A personal computer, wherein the amount of cooling liquid held in the accumulator is changed in response to discharge of a pulsating flow from the pump.

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