JP2004297033A - Semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a relative positional deviation between a semiconductor module and a cooling tube when a semiconductor device is assembled. <P>SOLUTION: In the semiconductor device, there are pinched a plurality of semiconductor modules 10 having a main body, one end terminals 15, 17, and the other end terminal 19 projecting from one end side and/or the other end side respectively, between a primary cooling tube 25 having a medium circulation space and a secondary cooling tube 45. The main body sticks to the primary cooling tube and the secondary cooling tube. At one side edge of the primary cooling tube and one side edge of the secondary cooling tube, there is formed one side positioning portion 30 engaging with one end surface of the semiconductor module. At the other side edge of the primary cooling tube and the other side edge of the secondary cooling tube, there is formed the other side positioning portion 60 engaging with the other end surface of the semiconductor module. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a semiconductor device in which a plurality of units each including a plurality of juxtaposed semiconductor modules and a pair of cooling tubes on both sides thereof are stacked.

  The semiconductor device is used, for example, as a switching element of an inverter of an electric vehicle. In order to suppress heat generation of the semiconductor module during operation, the front and back surfaces of the semiconductor module are brought into close contact with the upper cooling tube and the lower cooling tube, respectively, and the semiconductor module is cooled by the refrigerant flowing in the cooling tube.

A conventional semiconductor module (see Patent Document 1) includes a main body in which a semiconductor chip is sealed, and terminals extending from an end surface of the main body. The upper cooling tube and the lower cooling tube have an elongated rectangular tube shape. The upper tube and the lower tube sandwich the main body of the semiconductor module in a sandwich manner via the upper insulating material and the lower insulating material.
JP-A-2001-320005

  However, in the above-mentioned conventional semiconductor device, no positive positioning means for determining a relative position between the semiconductor module and the cooling tube is provided. For this reason, when a plurality of semiconductor modules are placed on the cooling tube and another cooling tube is put thereon, and when these are integrated, a specific semiconductor module may be displaced with respect to the cooling tube. . Great care must be taken to prevent displacement, and it takes time to assemble the semiconductor device.

  In addition, when the semiconductor module is operated, electromagnetic waves leak outward from one end face and the other end face of the main body, and are likely to cause noise to peripheral devices. However, there was no shielding means on the one end face and the other end face of the main body, and it was difficult to say that it was satisfactory.

  The present invention has been made in view of the above circumstances, and can prevent a relative displacement between a semiconductor module and a cooling tube at the time of assembling a semiconductor device, and if necessary, from the end face of a main body from which a terminal extends to the outside of the device. It is an object of the present invention to provide a semiconductor device capable of preventing leakage of electromagnetic waves.

The inventor of the present application has provided a positioning portion on at least one of a semiconductor module and a cooling tube that sandwiches the semiconductor module, and a positioning and shielding that prevents leakage of electromagnetic waves at a side edge of the cooling tube that sandwiches the semiconductor module as necessary. The present invention was completed with the idea of forming a part.
(1) In the semiconductor module according to the first invention of the present application, as described in claim 1, each of the semiconductor module is provided between a first cooling tube and a second cooling tube each having a rectangular cylindrical shape having a cooling medium circulation space. A plurality of semiconductor modules having a thin rectangular plate-shaped main body and one end terminal and / or another end terminal protruding from one end surface and / or the other end surface thereof are sandwiched, and the main body is formed by the first cooling tube and the second cooling device. Closely attached to the tube. A first side positioning portion is formed on at least one side first edge of each semiconductor module so as to engage with one side surface of the first cooling tube, and one side second edge is formed with one side engaging with one side surface of the second cooling tube. The second side positioning portion is formed.

  According to this semiconductor module, the one-side first positioning part and the one-side second positioning part position the first cooling tube and the second cooling tube, and determine a relative position with respect to the semiconductor module.

  In the semiconductor module according to the second aspect, the other first positioning portion is formed at the other first edge of each semiconductor module to be engaged with the other side surface of the first cooling tube, and the other second positioning edge is formed at the other second edge. A second positioning portion on the other side engaging with the other side surface of the second cooling tube is formed.

 (2) In the semiconductor device according to the second aspect of the present invention, a thin rectangular member is provided between the first cooling tube and the second cooling tube each having a rectangular cylindrical shape, both having a cooling medium circulation space. A plurality of semiconductor modules having a plate-shaped main body and one end terminal and / or another end terminal protruding from one end surface and / or the other end surface thereof are sandwiched, and the main body is brought into close contact with the first cooling tube and the second cooling tube. I have. One side positioning and shielding portions are formed on one side edge of the first cooling tube and one side edge of the second cooling tube to cover one end surface of the main body, and the other side edge of the first cooling tube and the other side of the second cooling tube. The other side positioning / shielding portion that covers the other end surface of the main body is formed on the edge.

  In this semiconductor device, one side positioning / shielding portion and the other side positioning / shielding portion of the first cooling tube and the second cooling tube are engaged with the side surface of the semiconductor module to position the semiconductor module in the longitudinal direction. In addition, both positioning and shielding portions cover one end face and the other end face of the semiconductor module, and prevent electromagnetic waves and heat leaking from the end face of the main body during operation of the semiconductor module from leaking out of the semiconductor device.

  According to a fourth aspect of the present invention, in the semiconductor device according to the third aspect, the one-side positioning / shielding part is formed on one side edge of the first cooling tube and one side edge of the second cooling tube. A second side projection formed, the other side positioning and shielding part being formed on the other side edge of the first cooling tube and the other side edge of the second cooling tube. And a second other-side protrusion.

  According to a fifth aspect of the present invention, in the semiconductor device according to the third aspect, the semiconductor module is brought into contact with one side surface of the main body at the first longitudinal position of the first cooling tube and the second cooling tube and the width of the first cooling tube and the second cooling tube. One side positioning part for positioning in the direction is formed, and the semiconductor module is brought into contact with the other side surface of the main body at the second longitudinal position of the first cooling tube and the second cooling tube, and the width direction of the first cooling tube and the second cooling tube. The other side positioning part which positions by is formed.

  The semiconductor device according to claim 6 further includes, between the one end surface and the other end surface of the main body, the one-side terminal and the other-side terminal, and the one-side positioning and shielding part and the other-side positioning and shielding part. An insulating part is formed. According to a seventh aspect of the present invention, in the semiconductor device according to the third aspect, a first insulating plate is interposed between the first surface of the main body and the first cooling tube, and is provided between the second surface of the main body and the second cooling tube. A second insulating plate is interposed. In a semiconductor device according to an eighth aspect, in the seventh aspect, the first insulating plate is held by a first holding portion provided on one side positioning / shielding portion, and the second insulating plate is provided on the other side positioning / shielding portion. It is held by the second holding unit.

  As described above, according to the semiconductor module of the first invention, the first cooling tube is provided to the semiconductor module in one direction of the length of the semiconductor module by the one side first positioning portion and the one side second positioning portion. And the second cooling tube is positioned at a predetermined relative position.

  According to the semiconductor module of the second aspect, the first cooling tube and the second cooling tube are positioned at predetermined relative positions with respect to the semiconductor module in both directions of the length of the semiconductor module.

  According to the semiconductor device of the second invention, leakage of electromagnetic waves and heat leaking from the end face of the main body during operation of the semiconductor module to the outside of the device is caused by the positioning and shielding portions on one side of the first cooling tube and the second cooling tube and on the other side. Prevented by positioning and shielding. Therefore, adverse effects due to electromagnetic waves, such as malfunctions of peripheral devices, are suppressed. The one-side positioning and shielding part and the other-side positioning and shielding part determine a relative position between the semiconductor module, the first cooling tube, and the second cooling tube.

  According to the semiconductor device of the fourth aspect, the one-side positioning and shielding part and the other-side positioning and shielding part can be easily formed. According to the semiconductor device of the fifth aspect, the positioning of the semiconductor module with respect to the first and second cooling tubes is facilitated.

  According to the semiconductor device of the sixth and seventh aspects, the insulation between the semiconductor module and the cooling tube can be reliably ensured. According to the semiconductor device of the eighth aspect, the insulating plate is securely held.

The semiconductor device of the present invention includes a semiconductor module and a pair of cooling tubes on both sides of the semiconductor module as one unit.
<Semiconductor module>
The semiconductor module has a thin rectangular main body defined by a first surface (front surface) and a second surface (back surface), a pair of side surfaces, and a pair of end surfaces, and extends from one end surface and / or the other end surface. One terminal and / or the other terminal are included. Hereinafter, the direction connecting the both side surfaces is called “width”, and the direction connecting both end surfaces is called “length”.

The main body is formed by integrally sealing a semiconductor chip and a front-side electrode plate and a back-side electrode plate that are in close contact with the front and rear surfaces thereof with a resin mold. A part of the electrode plate is exposed on the front surface and the back surface of the semiconductor module, and the electrode plate has a terminal at a tip.
<Cooling tube>
(1) General The cooling tube is made of aluminum or other metal. It has an elongated rectangular tube shape, and has a thin rectangular cross section. It is divided into an inner surface and an outer surface, one side surface, the other side surface, and one end surface and the other end surface. Hereinafter, the direction connecting the both side surfaces is called “width”, and the direction connecting both end surfaces is called “length”.

The width of the cooling tube is substantially equal to the length of the main body of the semiconductor module, and the length is determined by the number of semiconductor modules to be inserted and the distance between adjacent semiconductor modules. The longitudinal direction of the semiconductor module is orthogonal to the longitudinal direction of the cooling tube.
<Positioning part>
The positioning portion determines the relative positions of the first and second cooling tubes and the semiconductor module when assembling the semiconductor device. At least relative positioning is performed in the longitudinal direction of the semiconductor module, that is, in the width direction of the cooling tube. It may be provided on one of the semiconductor module and both of the cooling tubes, and may be provided on the semiconductor module (first type) or on the cooling tube (second type).
(1) In the first type, the semiconductor module has at least one side first edge and one side second edge, one side first positioning portion and one side which engage with one side surface of the cooling tube and extend in the longitudinal direction of the cooling tube. It has a second positioning section. In addition, the other-side first edge and the other-side second edge can have another-side first positioning portion and another-side second positioning portion. The semiconductor module and the cooling tube are relatively positioned in the length direction of the semiconductor module. In addition, it may have a positioning portion in the width direction of the semiconductor module.
(2) In the second type, the first cooling tube and the second cooling tube have positioning portions on one side edge and the other side edge. The positioning portion extends in the longitudinal direction of the cooling tube, abuts on the end face of the semiconductor module, and performs relative positioning in the length direction of the semiconductor module.

  This positioning part also serves as a shielding part described below. In this sense, in the specification of the present application, it is called “positioning / shielding portion”. The positioning portion is preferably composed of protrusions formed on both of the opposed cooling tubes, but may be composed only of protrusions formed on only one of the cooling tubes.

  The one-side positioning part, that is, the one-side positioning and shielding part, includes a protruding part formed on one opposite side of the first cooling tube and the second cooling tube, and the other-side positioning part, that is, the other-side positioning and shielding part is the first cooling tube. The cooling tube and the second cooling tube comprise protrusions formed on the other opposite sides. The projecting portion may be formed over the entire length of the cooling tube, or may be formed only in a part of the longitudinal direction.

In addition, the cooling tube may have a positioning portion on the upper surface (front surface) and the lower surface (back surface), which extends in the width direction of the cooling tube and contacts the side surface of the semiconductor module.
(3) Shielding part In the second type, the first cooling tube and the second cooling tube have shielding parts on one side edge and the other side edge. The shield prevents leakage of electromagnetic waves and the like from the semiconductor module. The positioning part also functions as a shielding part.
<Insulator>
In any of the first, second, and third types, an insulating portion made of Al ₂ O ₃ or SiN (bonding of an insulating plate, insulating material) is provided between an end face of the main body of the semiconductor module and the terminal and the positioning and shielding portion. By thermal spraying). A first insulating plate is bonded between the first surface of the semiconductor module and the first cooling tube, or an insulator is interposed by thermal spraying. A second insulating plate is bonded between the second surface and the second cooling tube, or an insulator is interposed by thermal spraying.

  A first insulating plate between the first surface of the semiconductor module and the first cooling tube is interposed, and the first cooling tube is held by first holding portions formed on the first one-side protrusion and the first other-side protrusion. A second insulating plate may be interposed between the second surface and the second cooling tube and held by the second holding portions formed on the second one-side protrusion and the second other-side protrusion of the second cooling tube. it can.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
A. The first to fourth embodiments are intended for the relative positioning of the components of the semiconductor device and the prevention of leakage of electromagnetic waves.
<First embodiment>
(Constitution)
In FIG. 1 showing a perspective view of the semiconductor device of the first embodiment, the semiconductor device is a plurality (two shown here) of juxtaposed semiconductor modules 10 (10L, 10R), and the semiconductor module 10 is sandwiched from both sides. , And has a so-called double-sided cooling structure.
(1) Semiconductor Module As shown in FIGS. 1 and 2, the left semiconductor module 10L has a thin rectangular plate-shaped main body 11, a control pin 19 protruding from one end surface 13a, and a collector terminal protruding from the other end surface 13b. 15 and an emitter terminal 17. The main body 11 has a semiconductor chip, a first electrode plate (radiator plate) adhered to the surface thereof, a second electrode plate (radiator plate) adhered to the back surface thereof, and a resin mold for integrally sealing these. (All are well-known and not shown).

  The collector terminal 15 is formed at the tip of the first electrode plate, and the emitter terminal 17 and the control pin 19 are formed at the tip of the second electrode plate. Part of the outer surfaces of the first and second electrode plates are not covered with the mold resin, and are exposed on the front and back surfaces of the semiconductor module 10.

The right semiconductor module 10R has the same configuration as the left semiconductor module 10L, but is given a different number for convenience of explanation.
(2) Cooling Tube As shown in FIGS. 1 and 2, the first cooling tube 25 has a rectangular tube shape as a whole, and has a flat cross section whose height is lower than the width (the vertical dimension in FIG. 1). It has a rectangular shape and has an inner surface 26 and an outer surface 33. Its width is almost the same as the width of the main body 11 of the semiconductor module 10, and its height is slightly smaller than the height of the main body 11.

  A plurality of refrigerant passages 39 are provided in the first cooling tube 25 in parallel in the width direction. Each refrigerant passage 39 has a rectangular cross-sectional shape and penetrates from one end of the first cooling tube 25 to the other end.

  One side inward projection 28 is formed on one side edge (left side edge in FIG. 1) 27 of the inner surface 26, and the other side inward projection 31 is formed on the other side edge 29. The one-side inward protruding portion 28 and the other-side inward protruding portion 31 protrude at right angles to the inner surface 26, have a constant thickness, and have a height of about half the height of the main body 11 of the semiconductor module 10. One side outward projection 35 is formed on one side edge 34 of the outer surface 33 of the first cooling tube 25, and the other side outward projection 37 is formed on the other side edge 36. The shape and size of the one-side outward projection 35 and the other-side outward projection 37 are the same as those of the one-side inward projection 28 and the other-side inward projection 31.

  The one-side inward projecting portion 28, the other-side inward projecting portion 31, the one-side outward projecting portion 35, and the other-side outward projecting portion 37 are integrally formed when the first cooling tube is formed.

  The second cooling tube 45 has the same configuration as the first cooling tube 25, and has a one-side inward projecting portion 48 and the other-side inward projecting portion 51 formed on the inner surface 46, and a one-side outward projecting portion 55 on the outer surface 53. The other side outwardly projecting portion 57 is formed. The reason why the second cooling tube 45 is assigned a different number from that of the first cooling tube 25 is for convenience of explanation.

  One side inward projection 28 of the first cooling tube 25 and one side inward projection 48 of the second cooling tube 45 constitute one side positioning / shielding part 30, and the other side outward projection 31 and the other side. The inwardly protruding portion 51 constitutes the other side positioning / shielding portion 60.

  As shown in FIG. 3, the first cooling tube 25 and the second cooling tube 45 are formed with a one-side positioning part 66 and another-side positioning part 67 in a region where the semiconductor module 10 is sandwiched. Among them, a first one-side rib 42 and a first other-side rib 43 extending in the width direction at a predetermined distance are formed on the inner surface 26 of the first cooling tube 25. The distance between the first one-side rib 42 and the first other-side rib 43 is substantially equal to the width of the main body 11, and the length is substantially equal to the length of the main body 11. The first one-side rib 42 and the first other-side rib 43 are formed integrally when the first cooling tube 25 is formed.

Also on the inner surface of the second cooling tube 45, a second one-side rib 62 is formed at a position facing the first one-side rib 42, and a second other-side rib 63 is formed at a position facing the first other-side rib 43. Is formed. The first one-side rib 42 and the second one-side rib 62 constitute one-side positioning part 66, and the first other-side rib 43 and the second other-side rib 63 constitute another-side positioning part 67. .
(3) Assembly The semiconductor device is assembled as follows. The main body 11 of the semiconductor module 10 is set between the second one-side rib 62 and the second other-side rib 63 of the second cooling tube 45, and the first cooling tube 25 is mounted thereon. A pressing force is applied inward from the outer surface 33 of the first cooling tube 25 and the outer surface 53 of the second cooling tube 45. The first one-side rib 42 and the first other-side rib 43 of the first cooling tube 25 abut on the second one-side rib 62 and the second other rib 63. Thereafter, both ends of the first cooling tube 25 and the second cooling tube 45 are fastened.

  On one side of the first cooling tube 25 and the second cooling tube 45, the one-side inward protruding portion 28 and the one-side inward protruding portion 48 are opposed to each other with a slight gap therebetween, and the entire one end surface 13 a of the main body 11 is formed. , And the control pin 19 protrudes from the gap.

  Similarly, on the other side, the first other side inwardly protruding portion 31 and the second other side inwardly protruding portion 51 are opposed to each other with a slight gap left therebetween, cover the entire other end surface 13b of the main body 11, and move from the gap to the collector. The terminal 15 and the emitter terminal 17 protrude.

  1 and 2 show only one unit. In an actual semiconductor device, a plurality of semiconductor modules 10L and 10R are juxtaposed on a cooling tube 45, a cooling tube 25 is placed thereon, and then a plurality of The semiconductor modules 10L and 10R and the cooling tubes 25 and 45 are alternately stacked. Part of the first electrode plate of the semiconductor modules 10L and 10R is in close contact with the inner surface 26 of the first cooling tube 25, and part of the second electrode plate is in close contact with the inner surface 46 of the second cooling tube 45.

Further, when assembling the semiconductor device, a plurality of cooling tubes 45 are stacked at both ends at predetermined intervals via intervening objects, and the semiconductor module 10L is inserted into a space in the vertical direction. You may tighten it.
(Effect)
In this embodiment, while the semiconductor module 10 operates as a switching element, a refrigerant flows through the refrigerant passage 39 of the first cooling tube 25 and the refrigerant passage 59 of the second cooling tube 45, and the first and the second of the semiconductor module 10. Cool the electrode plate.

  According to this embodiment, first, leakage of electromagnetic waves and heat from the one end surface 13a and the other end surface 13b of the main body 11 to the outside of the device during operation of the semiconductor module 10 is caused by the first cooling tube 25 and the second cooling tube. This is prevented by the one-side positioning and shielding part 30 and the other-side positioning and shielding part 60 formed at 45. As can be seen from FIG. 2, the one side positioning and shielding part 30 covers one end surface 13a of the main body 11, and the other side positioning and shielding part 60 covers the other side surface 13b.

  Second, in the width direction of the first and second cooling tubes 25 and 45, that is, in the longitudinal direction of the semiconductor module 10, the one-side positioning and shielding unit 30 and the other-side positioning and shielding unit 60 The relative positions of the module 10 and the first insulating plate 41 are determined. Similarly, the relative positions of the semiconductor module 10 and the second insulating plate 46 with respect to the second cooling tube 45 are determined.

Third, the positioning of the semiconductor module 10 on the first cooling tube 25 and the second cooling tube 45 is facilitated. As can be seen from FIG. 3, when the semiconductor module 10 is pressed by the first cooling tube 25 and the second cooling tube 45, the one-side positioning rib 66 and the other-side positioning rib 67 move the semiconductor module 10 in the width direction, that is, the cooling tube. This is because positioning is performed in the longitudinal direction of 25 and 40. As a result, it is possible to set the first cooling tube 25 and the second cooling tube 45 in the vertical direction and pressurize the semiconductor module 10 from the left and right directions.
<Second embodiment>
The second embodiment shown in FIG. 4 differs from the first embodiment in the configuration of the one-side positioning and shielding unit and the other-side positioning and shielding unit, and includes three modes.

  In the first embodiment of FIG. 4A, a one-side corrugated plate member 72 is attached to one side of the first cooling tube 70. The one side corrugated plate member 72 has a predetermined width and a predetermined length, and the convex portions 73 and the concave portions 74 are alternately formed in the length direction.

  The other side corrugated plate member 76 is also attached to the other side of the first cooling tube 70. One side corrugated plate member 82 is attached to one side of the second cooling tube 80, and another side corrugated plate member 86 is attached to the other side.

  In the second embodiment shown in FIG. 4B, the positioning / shielding portion 112 and the like are attached only to the portion corresponding to the region where the semiconductor module 10 is sandwiched among the one side portion and the other side portion of the first cooling tube 90. ing. The one-side shielding plate 92 attached to one side is formed of an elongated rectangular plate, and the width thereof is larger than the thickness of the first cooling tube 90. As a result, both side edges 93 and 94 protrude from the first cooling tube 90 from the front surface and the back surface.

  On the other side, another side shielding plate (not shown) made of an elongated rectangular plate is attached, and one side edge and the other side edge protrude from the front surface and the back surface. One side shield plate 102 and the other side shield plate 106 are also attached to one side portion and the other side portion of the second cooling tube 100, respectively.

  In the third mode shown in FIG. 4C, a plurality (four in this example) of small rectangles are provided on one side and the other side of the first cooling tube 110 at a portion corresponding to the holding region of the semiconductor module 10. One side positioning and shielding part 112 and another side positioning and shielding part (not shown) composed of a plate 113 are formed. Each rectangular plate piece 113 has the same shape, and both side edges protrude from the front surface and the back surface of the semiconductor module 10. A gap is formed between adjacent rectangular plate pieces 113. The second cooling tube 120 is also formed with a one-side positioning / shielding part 122 and another side positioning / shielding part 124.

According to the second and third aspects, a specific effect of reducing the weight of the semiconductor device can be obtained.
<Third embodiment>
The third embodiment shown in FIG. 5 is different from the first embodiment in the shape of the shield and the configuration of the positioning part of the semiconductor module 10 formed in the first cooling tube (not shown) and the second cooling tube 130. Are different.

  The positioning portion includes a second one-side positioning protrusion 131 and a second other-side positioning protrusion 136 separated in the width direction of the second cooling tube 130. The second one-side positioning projection 131 includes a long part 132 extending in the longitudinal direction of the second cooling tube 130 and a pair of short parts 133 extending at right angles from both ends thereof. Holes are formed to allow the passage of

  The second other-side positioning projection 136 includes a long portion 137 extending in the longitudinal direction of the second cooling tube 130 and a pair of short portions 138 extending at right angles from both ends thereof. A hole is formed to allow passage. The first cooling tube (not shown) also has a first one-side positioning protrusion and a first other-side positioning protrusion similar to the second one-side positioning protrusion 131 and the second other-side positioning protrusion 136.

According to this embodiment, the positioning of the semiconductor module at the time of assembling the semiconductor device becomes easy and reliable. One side positioning portion comprising a first one side positioning projection (not shown) and a second one side positioning projection 131, and a first other side positioning projection (not shown) and a second other side positioning projection 136. The other-side positioning portion positions the semiconductor module 10 in the longitudinal direction and the width direction of the first cooling tube 140 and the second cooling tube 140.
<Fourth embodiment>
The fourth embodiment shown in FIG. 6 is different from the first embodiment in that an insulator is interposed between the semiconductor module 10 and the cooling tube in addition to the positioning and shielding portion, and the three embodiments are different from those of the first embodiment. including.

  In the first mode shown in FIG. 6A, the other-side insulating part 162 is formed at the base of the collector terminal 15 and the emitter terminal 17 of the semiconductor module 10, and the one-side insulating part 163 is formed at the base of the control pin 19. I have. The insulating portions 162 and 163 insulate the collector terminal 15, the emitter terminal 17, and the control pin 19 from the positioning and shielding portion.

  In the second embodiment shown in FIG. 6B, one-side insulating portion 167 is formed between one end surface 13 a of main body 11 of semiconductor module 10, control pin 19, and protrusions 28 and 48. Similarly, another-side insulating portion 168 is formed between the other end surface 13 b, the collector terminal 15 and the emitter terminal 17, and the protruding portions 31 and 51.

  These insulating parts 167 and 168 insulate the end faces 13a and 13b of the main body, the collector terminal 15, the emitter terminal 17, the control pin 19, and the positioning and shielding part.

  In the third embodiment shown in FIG. 6C, a front-side insulating plate 172 is interposed between the surface of the main body 11 and the inner surface of the first cooling tube 170, and the back surface of the main body 11 and the inner surface of the second cooling tube 185 The back side insulating plate 187 is interposed between them. These insulating plates 172 and 187 have the same rectangular plate shape as the front and back surfaces of the main body 11.

  The first cooling tube 170 has a one-side holding portion 174 formed on the one-side protrusion 173 and a second-side holding portion 177 formed on the other-side protrusion 176. The second cooling tube 185 has a one-side holding portion 189 formed on the one-side protrusion 188 and a second-side holding portion 192 formed on the other-side protrusion 191.

The insulating plates 172 and 187 held by the holding portions 174 and 189 insulate the front and back surfaces of the main body 11 from the cooling tube.
B The fifth and sixth embodiments intend the relative positioning of the components of the semiconductor module.
<Fifth embodiment>
(Constitution)
In the fifth embodiment shown in FIG. 7, positioning portions are formed on both sides of each of a plurality of semiconductor modules. More specifically, as can be seen from FIGS. 7A and 7B, one side first positioning portion 203 and one side second positioning portion 206 are provided on the upper edge 202 and the lower edge 205 of one side 201 of the semiconductor module 200, respectively. Is formed. The other side first positioning portion 213 and the other side second positioning portion 216 are formed on the upper edge 212 and the lower edge 215 of the other side 211, respectively. As a result, the semiconductor module 200 has an H-shaped cross section.

  The one-side first positioning part 203, the one-side second positioning part 206, the other-side first positioning part 213, and the other-side second positioning part 216 are formed in a resin mold of the main body 210. By forming depressions corresponding to these positioning portions 203 and the like in a mold for molding a resin mold, the mold can be easily formed. However, after the resin molding without recesses, the square pieces corresponding to the positioning portions may be bonded with an adhesive.

  The distance between the one-side first positioning part 203 and the other-side first positioning part 213 is substantially equal to the width of the first cooling tube 220, and the distance between the one-side second positioning part 206 and the other-side second positioning part 216. Is about the same as the width of the second cooling tube 225.

The plurality of semiconductor modules 200 are mounted on the second cooling tube 225 via the insulating plate 229, and the first cooling tube 210 is mounted thereon via the insulating plate 224. One side first positioning portion 203 is engaged with one side surface 221 of the first cooling tube 220, and the other side first positioning portion 213 is engaged with the other side surface 222. Similarly, one side second positioning portion 206 is engaged with one side surface 226 of the second cooling tube 225, and the other side second positioning portion 216 is engaged with the other side surface 227.
(Assembly)
In assembling the semiconductor device, a plurality of cooling tubes 220, 225, etc. are stacked at both ends at predetermined intervals via intervening objects, and the semiconductor module 200 is inserted into a space in the vertical direction. Tighten the semiconductor module 200 and the like.
(Effect)
According to this embodiment, one side first positioning portion 203 and the other side first positioning portion 213 are formed by the semiconductor module 200 and the first cooling tube 220 in the length direction of the semiconductor module 200 (the width direction of the cooling tubes 220 and 225). ) To determine the relative position. The one-side second positioning part 206 and the other-side second positioning part 216 determine the relative position between the semiconductor module 200 and the second cooling tube 225 in the length direction (the width direction of the cooling tubes 220 and 225).

  In particular, since the positioning portions 203 and 206 and the positioning portions 213 and 216 are provided on one side 201 and the other side 211 of the semiconductor module 200, positioning can be performed in both longitudinal directions (left and right directions in FIG. 7B).

At the same time, the relative position between the semiconductor module 200 and the insulating plate 224 is determined by the first side positioning portion 203 and the second side positioning portion 213. Similarly, the relative position between the semiconductor module 220 and the insulating plate 229 is determined by the second positioning portion 213 on one side and the second positioning portion 216 on the other side.
<Sixth embodiment>
In the sixth embodiment shown in FIGS. 8A and 8B, the first positioning portion 253 is formed on the upper edge 252 of one side 251 of the semiconductor module 250, and the second positioning portion 256 is formed on the lower edge 255. ing. However, no positioning portion is formed on the other side 261.

  According to this embodiment, the relative positions of the semiconductor module, the first cooling tube and the second cooling tube, and the position of the semiconductor module 250 in one longitudinal direction of the semiconductor module 250 (the right direction in FIG. 8B). The relative position with respect to the insulating members 224 and 229 is determined.

In addition, since the positioning portions 253 and 256 need only be formed on one side 251 of the semiconductor module 250, manufacturing time and labor can be reduced. The relative positioning of the semiconductor module 250 in the left direction may be achieved by using an appropriate auxiliary member (for example, an urging member for urging the semiconductor module to the right).
<Modification>
In the fifth embodiment, a positioning portion for positioning the semiconductor module in the width direction can be provided as necessary. That is, as shown in FIG. 9A, on the side surfaces of the first cooling tube 300 and the second cooling tube 305, positioning portions 310 and 315 made of a rectangular bar and extending in the width direction are provided. The positioning portions 310 and 315 are in contact with the side surfaces of the semiconductor module 320, and determine relative positions in the width direction of the semiconductor module 320, that is, in the length direction of the cooling tubes 300 and 305.

  As shown in FIG. 9B, positioning portions 330 and 335 formed of rectangular pieces and extending in the thickness direction are provided on the end surfaces of the first cooling tube 300 and the second cooling tube 305. The positioning portions 330 and 335 are in contact with the side surfaces of the semiconductor module 320 and determine relative positions in the width direction of the semiconductor module 320, that is, in the length direction of the cooling tubes 300 and 305.

It is a perspective view showing a 1st example of the present invention. FIG. 3 is a side view of the first embodiment. It is sectional drawing of FIG. Example 2 shows a second example, in which (a) shows the first mode, (b) shows the second mode, and (c) shows the third mode. It is a top view showing a 3rd example. 4A and 4B show a fourth embodiment, in which (a) is a sectional view of a first embodiment, (b) is a sectional view of a second embodiment, and (c) is a sectional view of a third embodiment. 5A and 5B show a fifth embodiment, in which FIG. 5A is an overall perspective view, and FIG. 6A and 6B show a sixth embodiment, in which FIG. 7A is an overall perspective view, and FIG. FIGS. 7A and 7B show a modification of the fifth embodiment, in which FIG. 7A is a partial perspective view of a first modification, and FIG. 7B is a partial perspective view of a second modification.

Explanation of reference numerals

10: Semiconductor module 11: Main body 13a, 13b: End surface 15, 17, 19: Terminal, pin 25: First cooling tube 26: Inner surface 28, 31: Projecting portion 39: Refrigerant passage 45: Second cooling tube 46: Inner surface 48 , 51: Projecting portion 50: Refrigerant passage 30: One-side positioning and shielding portion 60: Other-side positioning and shielding portion 203: One-side first positioning portion 205: One-side second positioning portion

Claims (8)

A thin rectangular plate-shaped main body and one end terminal and / or one end protruding from one end face and / or the other end face thereof are respectively provided between the first cooling tube and the second cooling tube each having a rectangular tube shape having a cooling medium circulation space. Or a semiconductor device in which a plurality of semiconductor modules having a terminal with the other end are sandwiched, and the main body is in close contact with the first cooling tube and the second cooling tube,
At least one first edge of each of the semiconductor modules is formed with one side first positioning portion which is engaged with one side of the first cooling tube, and one side second edge is connected to one side of the second cooling tube. A semiconductor device, wherein a first side positioning portion that fits is formed.   Further, the other first side of the first cooling tube is formed at the other side of the first side of the first cooling tube at the other side of the first side of the semiconductor module. The semiconductor device according to claim 1, wherein a second positioning portion on the other side to be engaged is formed. A thin rectangular plate-shaped main body and one end terminal and / or one end protruding from one end face and / or the other end face thereof are respectively provided between the first cooling tube and the second cooling tube each having a rectangular tube shape having a cooling medium circulation space. Or a semiconductor device in which a plurality of semiconductor modules having a terminal with the other end are sandwiched, and the main body is in close contact with the first cooling tube and the second cooling tube,
One side positioning and shielding portions are formed at one side edge of the first cooling tube and one side edge of the second cooling tube to cover one end surface of the main body, and the other side edge and the second side of the first cooling tube are formed. A semiconductor device, wherein another side positioning and shielding portion for covering the other end surface of the main body is formed on the other side edge of the cooling tube.   The one-side positioning and shielding part includes a first one-side protrusion formed on one side edge of the first cooling tube, and a second one-side protrusion formed on one side edge of the second cooling tube. Wherein the other-side positioning / shielding portion includes a first other-side protrusion formed on the other side edge of the first cooling tube, and a second other-side protrusion formed on the other side edge of the second cooling tube. The semiconductor device according to claim 3, further comprising:   One side that abuts one side surface of the main body at a first longitudinal position of the first cooling tube and the second cooling tube, and positions the semiconductor module in a width direction of the first cooling tube and the second cooling tube. A positioning portion is formed and abuts the other side surface of the main body at a second longitudinal position of the first cooling tube and the second cooling tube, and connects the semiconductor module to a width of the first cooling tube and the second cooling tube. 4. The semiconductor device according to claim 3, wherein another side positioning portion for positioning in the direction is formed.   Further, an insulating portion is formed between one end surface and the other end surface of the main body, the one-side terminal and the other-side terminal, and the one-side positioning and shielding portion and the other-side positioning and shielding portion. 4. The semiconductor device according to 3.   Further, a first insulating plate is interposed between the first surface of the main body and the first cooling tube, and a second insulating plate is interposed between the second surface of the main body and the second cooling tube. The semiconductor device according to claim 3.   The first insulating plate is held by a first holding portion provided on the one-side shielding plate, and the second insulating plate is held by a second holding portion provided on the other-side positioning and shielding portion. Item 8. The semiconductor device according to item 7.

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