JP2004296989A - Substrate for light emitting diode device - Google Patents

Substrate for light emitting diode device Download PDF

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Publication number
JP2004296989A
JP2004296989A JP2003090400A JP2003090400A JP2004296989A JP 2004296989 A JP2004296989 A JP 2004296989A JP 2003090400 A JP2003090400 A JP 2003090400A JP 2003090400 A JP2003090400 A JP 2003090400A JP 2004296989 A JP2004296989 A JP 2004296989A
Authority
JP
Japan
Prior art keywords
substrate
led
emitting diode
thermoelectric module
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003090400A
Other languages
Japanese (ja)
Inventor
Noriyuki Kudo
Kenichi Miyazaki
兼一 宮崎
徳行 工藤
Original Assignee
Tanaka Kikinzoku Kogyo Kk
田中貴金属工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo Kk, 田中貴金属工業株式会社 filed Critical Tanaka Kikinzoku Kogyo Kk
Priority to JP2003090400A priority Critical patent/JP2004296989A/en
Publication of JP2004296989A publication Critical patent/JP2004296989A/en
Application status is Pending legal-status Critical

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for LED which is adaptive to higher luminance of an LED element. <P>SOLUTION: The substrate for light emitting diode device is equipped with a substrate with heat conductivity, one or more pedestals where light emitting diode elements are mounted, and a thermoelectric module composed of at least one thermoelectric transducing element; and the pedestals are directly pressed or worked in the substrate and the thermoelectric module and substrate, and/or the pedestals are in contact. The substrate for LED uses the thermoelectric module to use heat generated by LED elements for power generation by the thermoelectric module and also use the generated electric power for LED driving. Consequently, the efficiency of the energy for the LED driving is improved. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate provided for manufacturing a device to which a light emitting diode is applied, and more particularly, to a substrate capable of efficiently removing heat generated by a high-brightness light emitting diode.
[0002]
[Prior art]
Light emitting diodes (hereinafter, referred to as LEDs) have excellent driving characteristics, are resistant to vibration and repeated lighting, and have the advantages of being small, having a long life, and having low power consumption. It's being used. Recently, the practical application of blue LEDs is expected to expand their application range, and the development of full-color LED displays is in progress. Another trend is to increase the brightness, and applications to traffic sign lights (stop lamps, direction indicators, etc.), signals, and outside lights are also being studied. In the field of these LED devices, rapid growth is expected in the future.
[0003]
FIG. 5 schematically shows an example of the structure of an LED package which is a component of the LED device. In FIG. 5, the LED package 20 includes an LED element 100 and a pedestal 101 for fixing the LED element 100, and these are fixed by a resin 102. The pedestal 101 also has a function as a heat sink that cools the LED element 100 by absorbing and radiating heat generated by the LED element 100 generated by driving the apparatus. The light emitted from the LED element 100 is transmitted through the transmission plastic 103 and emitted to the outside. Further, the LED element 100 and the lead frame 104 are connected, and the driving and control of the LED element are performed via the lead frame 104 (Patent Document 1 discloses the structure of the LED package). . The various LED devices are manufactured by appropriately mounting an LED package on a substrate.
[0004]
[Patent Document 1] Japanese Patent Application Laid-Open No. 2001-150967
By the way, as described above, in the field of LEDs, higher luminance is in progress. However, higher luminance of LEDs involves a problem of heat generation. That is, the operating environment becomes more severe due to the increase in the amount of generated heat, and driving stability is a concern. Further, as the luminance of the LED element increases, the heat radiation may be insufficient. If the cooling and heat radiation of the LED element become insufficient, the heat is transmitted to the wiring as it is, and the LED lens may be softened, the terminal may be broken, and the wiring board itself may be softened or damaged.
[0006]
The applicant of the present application has filed an application relating to the prior patent application 1 as an LED substrate in consideration of application of a high-brightness LED. In this LED substrate, instead of applying the above-mentioned conventional LED package, a pedestal is directly embedded in the substrate and an LED element is mounted thereon. The purpose of this substrate is to improve the degree of integration of the LED element. However, copper or a copper alloy having high thermal conductivity is used as a base material, and the heat radiation efficiency from the LED element is further increased by installing a heat sink. Are also considered.
[0007]
[Prior Patent Application 1] Japanese Patent Application No. 2002-302902
[0008]
[Problems to be solved by the invention]
The demand for higher brightness of LED elements is expected to increase in the future. The above-mentioned LED substrate of the applicant of the present application responds to this, but it can be more effectively responded to this demand by further improvement. The present invention has been made in view of the above background, and has as its object to provide a substrate capable of supporting high-brightness LED elements.
[0009]
[Means for Solving the Problems]
The inventors of the present invention basically use a form in which a pedestal that has already been developed is directly embedded in a substrate. As a means for improving this, a thermoelectric module including a thermoelectric conversion element that converts heat into electric power is used.
[0010]
That is, the present invention provides a substrate for a light-emitting diode device including a substrate having thermal conductivity, one or more pedestals on which the light-emitting diode elements are mounted, and a thermoelectric module including at least one thermoelectric conversion element. The pedestal is a substrate for a light emitting diode device which is directly pressed or processed into a substrate, and in which the thermoelectric module is in contact with the substrate and / or the pedestal.
[0011]
The present invention is intended to absorb heat generated from an LED element by a thermoelectric module, thereby protecting the LED element and the substrate. In the LED substrate according to the present invention, the use of the thermoelectric module improves the energy efficiency for driving the LED. That is, in the conventional LED device, the heat generated by the LED elements is simply dissipated as waste heat, but in the present invention, the generated heat is used for power generation by the thermoelectric module, and the generated power is used for driving the LED. . In this regard, since the driving power of the high-brightness LED element also increases, the present invention can supplement the increased driving power. Therefore, the present invention can maintain the advantage of low power consumption of the LED device in addition to solving the problem of heat generation.
[0012]
In the present invention, the thermoelectric conversion element constituting the thermoelectric module used for heat radiation of the LED element refers to a material capable of changing an external temperature difference into electric power by a so-called Seebeck effect. Various materials having a thermoelectric conversion effect are known, and telluride (tellurium compounds such as bismuth / tellurium and lead / tellurium) and silicide (silicon / germanium, silicon compounds such as iron silicide) ), Silver / antimony / tellurium (TAGS), lead / tin / tellurium (TEGS), etc., but LED devices are usually used at room temperature (room temperature), so they have excellent power generation efficiency at room temperature. Preferred are those containing a bismuth / tellurium system. Further, there are two types of bismuth / tellurium-based thermoelectric conversion elements, i.e., p-type and n-type, depending on the direction of current at the time of heating. As a p-type material, (Bi 0.25 Sb 0.75 ) 2 (Te 0. 95 Se 0.05 ) 3 and Bi 2 (Te 0.95 Se 0.05 ) 3 as an n-type material. )It has been known.
[0013]
Further, the thermoelectric module preferably includes a plurality of thermoelectric conversion elements. This is for effectively absorbing the heat generated by the LED elements and securing the power generation amount. As a structure of the power generation module, for example, there is one as shown in FIG. In this power generation module, a plurality of n-type and p-type thermoelectric conversion elements are alternately combined and arranged, and these are sandwiched between two upper and lower heat-absorbing heat-absorbing plates. Then, one of the metal plates is brought into contact with the substrate or the pedestal to absorb the heat generated by the LED and to perform thermoelectric conversion to take out electric power through a lead wire. The advantage of this structural example is that by combining the n-type and p-type thermoelectric conversion elements, the direction of current can be controlled in one direction, and the lead wire configuration for extracting power is simplified, and more thermoelectric conversion is performed. The point is that elements can be arranged. In addition to this example, a device in which only an n-type or p-type thermoelectric conversion element is disposed may be used.
[0014]
Regarding the configuration on the substrate side, the pedestal on which the LED element is mounted is preferably made of copper or a copper alloy, and the substrate is preferably made of aluminum or an aluminum alloy or copper or a copper alloy. The pedestal is made of copper or a copper alloy in consideration of thermal conductivity and workability. The substrate is made of aluminum or the like because it is lightweight and has high thermal conductivity. In addition, wiring for driving the LED elements is required on this substrate, but when aluminum or the like is applied to the substrate, it is preferable to coat a resin for wiring on the substrate. Considering the heat generation of the LED element, those having excellent heat resistance are preferable, and polyimide or the like is preferably used.
[0015]
The joining between the thermoelectric module and the substrate is preferably brazed by solder or joined by silver paste. The bonding between the thermoelectric module and the substrate may be performed after the wiring resin is coated on the substrate, or may be performed before the resin coating.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
[0017]
FIG. 2 shows the appearance of the substrate for an LED device according to the present embodiment. The substrate 1 for an LED device of FIG. 2 has a polyimide resin layer 11 formed on an aluminum substrate 10 (dimensions: 50 mm × 50 mm, thickness 0.3 mm), on which a predetermined wiring pattern 12 is printed. Have been. The pedestals 13 are pressed into the substrate 1 at intervals of 5 mm. A thermoelectric module 14 is joined to the back surface of the substrate 1. Note that the polyimide resin layer 11 is also formed on the back surface.
[0018]
The pedestal 13 is made of copper and has a cylindrical shape having a concave portion in the center. FIG. 3 shows the appearance of the pedestal 13. The pedestal 13 is provided with a hard silver plating as a base and a nickel hard plating with a total thickness of 3 μm.
[0019]
The LED substrate 1 according to the present embodiment was manufactured by the steps described below (FIG. 4). First, a polyimide is applied to predetermined regions on both sides of the aluminum substrate 10 to form a polyimide resin layer 11, and a wiring pattern 12 is formed by etching (FIG. 4A). Next, a hole 15 is formed at a position corresponding to the press-fit position of the pedestal of the substrate 10 (FIG. 4B). At this time, the diameter of the hole 15 was substantially the same as the diameter of the pedestal 13.
[0020]
Then, as shown in FIG. 4C, the pedestal 13 was press-fitted into the hole 15 of the substrate 10 and fixed, and the thermoelectric module 14 was joined to the back surface of the substrate by soldering to obtain the LED device substrate 1.
[0021]
With respect to this LED device substrate 1, an LED element was mounted and connected, and further, a lens was attached to manufacture an LED display device. Then, this was connected to a power supply system and driven continuously for 1000 hours. As a result, stable driving was confirmed during driving, and excessive heat generation and substrate deformation were not observed even after driving.
[0022]
【The invention's effect】
As described above, according to the substrate for an LED device according to the present invention, it is possible to efficiently absorb the heat generated by the LED element, and further convert this into power for driving the LED. The present invention is also applicable to high-brightness LED elements, and can be applied to various devices to which LEDs are newly applied, such as vehicle sign lights, signals, and LED displays.
[Brief description of the drawings]
FIG. 1 is a diagram showing an example of the structure of a thermoelectric module.
FIG. 2 is a view schematically showing an LED substrate according to the embodiment.
FIG. 3 is a diagram showing an appearance and a cross-sectional shape of a pedestal used in the embodiment.
FIG. 4 is a diagram illustrating a process of manufacturing the LED substrate manufactured in the embodiment.
FIG. 5 is a diagram showing a structure of a conventional LED package.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 LED substrate 10 aluminum substrate 11 polyimide resin layer 12 wiring pattern 13 pedestal 14 thermoelectric module 20 LED package 100 LED element 101 pedestal 102 resin 103 transparent plastic 104 lead frame

Claims (3)

  1. A substrate for a light-emitting diode device, comprising: a substrate having thermal conductivity; one or more pedestals on which the light-emitting diode elements are mounted; and a thermoelectric module including at least one thermoelectric conversion element.
    The pedestal is directly pressed or processed into the substrate,
    A substrate for a light emitting diode device, wherein the thermoelectric module is in contact with a substrate and / or a pedestal.
  2. The substrate for a light-emitting diode device according to claim 1, wherein the thermoelectric conversion element constituting the thermoelectric module is made of a Bi / Te-based material.
  3. 3. The substrate for a light emitting diode device according to claim 1, wherein the pedestal is made of copper or a copper alloy, and the substrate is made of aluminum or an alloy thereof, copper or a copper alloy.
JP2003090400A 2003-03-28 2003-03-28 Substrate for light emitting diode device Pending JP2004296989A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003090400A JP2004296989A (en) 2003-03-28 2003-03-28 Substrate for light emitting diode device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003090400A JP2004296989A (en) 2003-03-28 2003-03-28 Substrate for light emitting diode device

Publications (1)

Publication Number Publication Date
JP2004296989A true JP2004296989A (en) 2004-10-21

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006337642A (en) * 2005-06-01 2006-12-14 Micronics Japan Co Ltd Device for inspecting liquid crystal panel
WO2007061033A1 (en) * 2005-11-28 2007-05-31 Sharp Kabushiki Kaisha Illuminating device and method for manufacturing same
WO2007069399A1 (en) * 2005-12-12 2007-06-21 Nichia Corporation Light emitting device, semiconductor device, and its manufacturing method
JP2010130001A (en) * 2008-12-01 2010-06-10 Kuei-Fang Chen Radiation bed
US20110235328A1 (en) * 2010-03-25 2011-09-29 Jian Xu Energy harvester for led luminaire
JP2011253945A (en) * 2010-06-02 2011-12-15 Okano Electric Wire Co Ltd Peltier module arrangement device and inside of housing cooling device using the same
EP2553320A2 (en) * 2010-03-26 2013-02-06 iLumisys, Inc. Led light with thermoelectric generator
CN102934245A (en) * 2010-06-14 2013-02-13 尹东汉 Buried-type photonic device package module using a thermocouple
US20130083516A1 (en) * 2010-06-04 2013-04-04 Dong Han Yoon High-power optical element street lamp using thermocouple
US9829188B2 (en) 2016-03-16 2017-11-28 Samsung Electronics Co., Ltd. Light-emitting diode driving apparatus and lighting device
KR101823840B1 (en) * 2017-11-22 2018-01-31 주식회사 세한이노테크 Eco friendly LED road traffic sign

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006337642A (en) * 2005-06-01 2006-12-14 Micronics Japan Co Ltd Device for inspecting liquid crystal panel
WO2007061033A1 (en) * 2005-11-28 2007-05-31 Sharp Kabushiki Kaisha Illuminating device and method for manufacturing same
JPWO2007061033A1 (en) * 2005-11-28 2009-05-07 シャープ株式会社 Lighting device and its manufacturing method
WO2007069399A1 (en) * 2005-12-12 2007-06-21 Nichia Corporation Light emitting device, semiconductor device, and its manufacturing method
US7910946B2 (en) 2005-12-12 2011-03-22 Nichia Corporation Light emitting apparatus and semiconductor apparatus, and method for manufacturing the same
JP2010130001A (en) * 2008-12-01 2010-06-10 Kuei-Fang Chen Radiation bed
JP2012089869A (en) * 2008-12-01 2012-05-10 Kuei-Fang Chen Heat radiation base
US20110235328A1 (en) * 2010-03-25 2011-09-29 Jian Xu Energy harvester for led luminaire
EP2553320A2 (en) * 2010-03-26 2013-02-06 iLumisys, Inc. Led light with thermoelectric generator
EP2553320A4 (en) * 2010-03-26 2014-06-18 Ilumisys Inc Led light with thermoelectric generator
JP2011253945A (en) * 2010-06-02 2011-12-15 Okano Electric Wire Co Ltd Peltier module arrangement device and inside of housing cooling device using the same
US20130083516A1 (en) * 2010-06-04 2013-04-04 Dong Han Yoon High-power optical element street lamp using thermocouple
CN102934245A (en) * 2010-06-14 2013-02-13 尹东汉 Buried-type photonic device package module using a thermocouple
US9163821B2 (en) * 2010-06-14 2015-10-20 Dong Han Yoon High-power optical element street lamp using thermocouple
US9829188B2 (en) 2016-03-16 2017-11-28 Samsung Electronics Co., Ltd. Light-emitting diode driving apparatus and lighting device
KR101823840B1 (en) * 2017-11-22 2018-01-31 주식회사 세한이노테크 Eco friendly LED road traffic sign

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