JP2004289114A - Packaging substrate and its manufacturing method - Google Patents

Packaging substrate and its manufacturing method Download PDF

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Publication number
JP2004289114A
JP2004289114A JP2003359249A JP2003359249A JP2004289114A JP 2004289114 A JP2004289114 A JP 2004289114A JP 2003359249 A JP2003359249 A JP 2003359249A JP 2003359249 A JP2003359249 A JP 2003359249A JP 2004289114 A JP2004289114 A JP 2004289114A
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carbon fiber
resin plate
carbon fibers
resin
carbon
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JP2003359249A
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Japanese (ja)
Inventor
Daisuke Mizutani
Katsusada Motoyoshi
Yasuhiro Yoneda
勝貞 本吉
大輔 水谷
泰博 米田
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Fujitsu Ltd
富士通株式会社
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Priority to JP2003359249A priority patent/JP2004289114A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a packaging substrate such as a package substrate with low thermal expansion permitting microfabrication and suited for packaging an electron device at a low cost, concerning the packaging substrate and its manufacturing method. <P>SOLUTION: There is provided a conductor circuit pattern 8 on at least one surface of a carbon fiber resin board 4 that is formed by laminating prepregs 1 with carbon fibers 2 arranged in one direction in such a manner that the directions in which the carbon fibers 2 are oriented differ. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a mounting board and a method of manufacturing the same, and particularly to a board configuration for configuring a mounting board such as a multilayer wiring circuit board or a package board used in an electronic device with a low thermal expansion coefficient and at a low cost. The present invention relates to a mounting board and a method for manufacturing the same.

  Conventionally, when a semiconductor device such as a semiconductor integrated circuit device is incorporated in an electronic device or the like, the semiconductor device is mounted on a multilayer wiring circuit board or the like. It is necessary to reduce the stress generated between the semiconductor device and the package substrate by reducing the expansion coefficient and the thermal expansion difference between the package substrate.

  Conventionally, as a method of reducing the difference in the coefficient of thermal expansion between the two, a composite material such as glass fiber reinforced resin is used for the insulating material of the package substrate, and a resin is used for electrical insulation, and an inorganic material such as glass fiber is used for reducing the thermal expansion. Although practical use has been carried out by being in charge, further reduction in thermal expansion is required as semiconductor devices become finer.

  As a special specification, a thin-film circuit using a resin as an insulating layer is formed on the surface of a low thermal expansion ceramic plate.

  As a new material, carbon fiber reinforced resin has been put to practical use by utilizing the low thermal expansion characteristics of carbon fiber (for example, see Patent Documents 1 to 5).

It has also been proposed to attach a carbon fiber reinforced resin layer to both sides of a core substrate made of glass epoxy resin (for example, see Patent Document 6).
At this time, the weaving method of the fiber includes a biaxial woven fabric, a triaxial woven fabric, and a quadriaxial woven fabric. In order to have a single layer of pseudo-isotropy, the direction of the fiber is shifted by 60 °. It is also known that a triaxial woven fabric is suitable (for example, see Patent Document 6).
JP 2001-177003 A JP 2001-044332 A JP 07-263586 A JP-A-11-297895 JP-A-58-015289 JP 2000-340895 A

  However, with the progress of miniaturization of semiconductor devices, in glass fiber reinforced resin, the presence of glass fibers hinders fine processing such as drilling. Since a supporting substrate such as ceramic is required for lowering the thermal expansion, cost reduction and weight reduction of the package substrate have been a problem.

  On the other hand, carbon fiber reinforced resin is promising as a material with low weight, high elasticity and low thermal expansion.However, since carbon fiber is conductive, it cannot be used as an insulating material directly as a substitute for glass reinforced resin. However, it has been difficult to apply it to a package substrate that requires the above.

  That is, in order to form a via hole for electrically connecting a plurality of layers, a through hole is mechanically formed in a carbon fiber reinforced resin plate in advance, the hole is filled with an insulating material such as resin, and then a new hole is formed. It is necessary to perform a process of forming holes for via holes in an insulating material that has been filled.In the process of filling holes with this insulating material, thermal stress is also applied, which may be a major factor in reducing the accuracy of forming holes by machining. At the same time, an increase in the number of operations has caused an increase in manufacturing costs.

  In addition, a hole that is filled with an insulating material needs to be formed to be 400 μm larger than the diameter of the via hole in order to ensure insulation, and there is a limit in increasing the density of via holes.

  Further, when a cloth woven from carbon fibers as warp and weft is used as the reinforcing fiber, the elastic modulus of the resin and the carbon fiber are so different that the resin elastic modulus further decreases. Therefore, there is a problem that the distortion of the curved carbon fiber causes irregular dimensional behavior of the substrate, and the effect is particularly remarkable in a thin plate.

  Therefore, an object of the present invention is to provide a low-expansion mounting substrate such as a package substrate which can be finely processed and has low thermal expansion and is suitable for mounting electronic devices.

FIG. 1 is a schematic exploded perspective view of a carbon fiber resin plate showing a basic configuration of the present invention, and FIG. 2 is a schematic sectional view of a mounting substrate. Means for solving the problem in the present invention will be described.
See FIGS. 1 and 2
In order to solve the above-mentioned problem, the present invention provides a prepreg 1 in which carbon fibers 2 are arranged in one direction in a mounted circuit board by laminating the prepregs 1 so that the orientation directions of the carbon fibers 2 are different. A conductive circuit pattern 8 is provided on at least one surface of the carbon fiber resin plate 4.

  As described above, the prepreg 1 in which the carbon fibers 2 are aligned in one direction, that is, the unidirectional prepregs are laminated so that the orientation directions of the carbon fibers 2 are different, and the carbon fiber resin plate 4 is molded. A thin mounting board having a low coefficient of thermal expansion and a small dimensional behavior can be realized.

The term “prepreg” means “a sheet before the final curing in which various resins 3 are impregnated into a woven fabric of carbon fiber 2, glass fiber, or a fiber aligned in one direction”, and a unidirectional prepreg is laminated. The sheet itself is known, but the application is for aerospace equipment parts or building civil engineering material (if necessary, http: www.m-kagaku.co.jp/businesses/library/pripreg.htm, or There is no known example in which a thin plate having a thickness of 500 μm or less is used as a mounting substrate for electronic devices, particularly, a through via substrate.
The “carbon fiber resin substrate” in the present invention refers to a “carbon fiber reinforced resin substrate”.

  In this case, it is desirable to laminate the carbon fibers 2 so that the direction of the carbon fibers 2 is symmetrical with respect to the center of the laminating direction of the carbon fiber resin plates 4 as a center plane, thereby reducing the coefficient of thermal expansion and mechanical strength in the plane direction. In addition to being equal, warpage can be reduced.

Alternatively, a carbon fiber resin plate 4 formed by laminating prepregs 1 in which carbon fibers 2 are arranged in one direction and arranging them so that the orientation directions of the carbon fibers 2 are different from each other is formed by insulating a thicker than the carbon fiber resin plate 4. The conductive circuit pattern may be provided on at least one surface of the carbon fiber resin plate 4 while being superposed on the outside of the conductive fiber reinforced resin plate.
As described above, by adopting the three-layer structure of the carbon fiber resin plate 4 / insulating fiber reinforced resin plate / carbon fiber resin plate 4, a low thermal expansion plate can be provided at lower cost.

  In this case, even if the thickness of the carbon fiber resin plate 4 is 1/10 or less of the thickness of the insulating fiber reinforced resin plate, it is possible to match the thermal expansion coefficient of the semiconductor element as a whole mounting substrate. It becomes easy to cut only the plate, and at the same time, the rigidity of the plate is improved by forming a high elasticity layer on the outside of the plate.

  In addition, as the insulating fiber reinforced resin plate, a glass fiber reinforced resin plate is preferable, and particularly, in order to densely weave the glass fiber, it is preferable to use a flattened glass fiber cloth.

  Also, in the above mounting board, when the direction of the carbon fiber 2 is 0 ° in the direction of the outermost surface, four layers are laminated so as to have a laminated structure of 0 ° / 90 ° / 90 ° / 0 °. , A mounting board having a low coefficient of thermal expansion with a minimum thickness of 200 μm or less can be realized.

  Alternatively, at least five layers of three types of prepregs 1 in which the directions of the carbon fibers 2 differ by 60 ° may be sequentially laminated, thereby realizing a low thermal expansion plate having a more isotropic thermal expansion coefficient and elastic modulus. Can be.

  Conductive circuit patterns 8 are provided on both surfaces of the carbon fiber resin plate 4, and are electrically connected to each other by through vias 7 provided in the through holes 5 via the resin 6. A short circuit caused by the fiber 2 can be prevented.

Although such a mounting board can be used as a multilayer wiring circuit board, a package board, that is, a through via board is typical.
That is, the present inventors have conducted intensive studies in order to solve the above-described problems, and as a result, focusing on the fact that a through hole required in a package substrate is a pin pitch for mounting on a printed wiring board, etc. If a carbon fiber resin plate 4 having high stability is used, it is possible to manufacture a substrate with a low thermal expansion via for a package substrate using drilling and an existing printed wiring board manufacturing process.

  When such a mounting board is manufactured, a prepreg 1 in which carbon fibers 2 are arranged in one direction is laminated and cured so that the orientation direction of the carbon fibers 2 is different from each other, and is cured. The plate 4 may be molded, and then a conductive foil with resin may be laminated on at least one surface of the carbon fiber resin plate 4.

  In particular, when a printed circuit board or a package board is used, a through hole 5 is formed by drilling the carbon fiber resin plate 4, and then the through hole 5 is filled with a resin 6 for filling the hole. The body foil may be laminated on both sides of the carbon fiber resin plate 4.

  Alternatively, a through hole 5 is formed by drilling the carbon fiber resin plate 4, and then the through hole 5 is filled with a filling resin 6, and then a conductor circuit pattern 8 is plated on both surfaces of the carbon fiber resin plate 4 by plating. It may be formed.

  According to the present invention, by using a carbon fiber reinforced resin plate formed by laminating unidirectional prepregs with different orientation directions of carbon fibers as a base or a surface layer of a mounting substrate, an existing printed wiring board manufacturing process can be used. As a result, it is possible to easily manufacture a substrate with a low thermal expansion via used for a package substrate, and to provide a mounting substrate such as a package substrate that simultaneously realizes fine processing and a low coefficient of thermal expansion, light weight, and low cost.

  The present invention uses a prepreg in which carbon fibers are arranged in one direction when manufacturing a mounting substrate having low thermal expansion with a carbon fiber reinforced resin, and displaces the direction of the carbon fibers in each prepreg so that the prepreg has a symmetrical structure at the top and bottom. And a circuit pattern is formed on both sides or one side thereof.

Here, with reference to FIGS. 3 to 10, a manufacturing process of the mounting board according to the first embodiment of the present invention will be described.
See FIG.
First, after arranging carbon fibers 11 having a diameter of, for example, 7 μm in one direction and aligning them, a thermosetting resin, for example, an epoxy resin 12 is impregnated to form a unidirectional prepreg 13 having a thickness of, for example, 50 μm. Make it.

In this case, as the carbon fibers 11, carbon fibers having an elastic modulus of, for example, 60 × 10 3 kgf / mm 2 are used, and the resin content in the unidirectional prepreg 13 is 30 to 50% by weight, for example, 35% by weight. So that
If the resin content is less than 30% by weight, it becomes difficult to form a stable prepreg, and if it exceeds 50% by weight, it becomes difficult to obtain a mounting substrate having a low coefficient of thermal expansion.

See FIG.
Next, the unidirectional prepregs 13 are laminated such that the orientation directions of the carbon fibers 11 are sequentially 0 °, 90 °, 90 °, and 0 °. However, a carbon fiber reinforced resin plate 14 of 200 μm is formed, for example.

  By arranging the carbon fibers 11 in such a manner that the orientation direction of the carbon fibers 11 is symmetric about the center plane in the laminating direction of the carbon fiber reinforced resin plate 14, the warpage can be maintained while keeping the coefficient of thermal expansion in the plane direction uniform. And distortion can be eliminated.

See FIG.
Then, through holes 15 having a pitch of, for example, 500 μm are formed in the carbon fiber reinforced resin plate 14 using a drill having a diameter φ, for example, of 300 μm.
In this case, since the thickness of the carbon fiber reinforced resin plate 14 is as thin as 200 μm and has a regular pitch, the presence of the carbon fibers 11 does not hinder drilling, and the through holes 15 can be easily opened. Can be.

See FIG.
Next, an epoxy-based filling resin 16 is poured into the through-hole 15, thermally cured, and flattened by buffing.
The filling process itself is generally performed in a printed wiring board manufacturing process.

See FIG.
Next, on both surfaces of the carbon fiber reinforced resin plate 14 in which the through holes 15 are filled with the filling resin 16, a resin-coated copper foil 17 in which a resin 19 is adhered to a copper foil 18 is laminated to form an insulating layer and a conductor layer at the same time. .
In this case, the thickness of the resin 19 in the resin-coated copper foil 17 is, for example, 30 μm, and the thickness of the copper foil 18 is, for example, 12 μm.

See FIG.
Next, a through-hole 20 is newly formed at the center of the filling resin 16 in which the through-hole 15 is embedded, using a drill having a diameter φ of, for example, 200 μm.

See FIG.
Next, by applying copper plating, through vias 21 are formed on the side surfaces of the through holes 20 and electrically connected to the copper foils 18 of the resin-coated copper foils 17 on both surfaces.

See FIG.
Finally, similarly to a normal double-sided circuit board manufacturing process, the copper foil 18 of the resin-coated copper foil 17 on both sides is formed by an etching process on a wiring pattern 22 for connecting to a semiconductor element and a printed wiring board, respectively. The basic configuration of the through via substrate is obtained.

  The thermal expansion coefficient of the through-via substrate manufactured in this manner was 4 ppm / ° C. in the plane direction of the substrate, which was almost the same value as Si as a semiconductor element material.

Next, with reference to FIG. 11, a description will be given of a manufacturing process of the mounting board according to the second embodiment of the present invention.
See FIG.
First, a carbon fiber 31 having a diameter of, for example, 7 μm is arranged in one direction and then, for example, impregnated with an epoxy resin 32 having a glass transition temperature of 250 ° C. to have a thickness of, for example, about 45 μm in one direction. A prepreg 33 is manufactured.
In this case, as the carbon fiber 31, a carbon fiber having an elastic modulus of, for example, 250 GPa is used, and the resin content in the one-way prepreg 33 is set to 30 to 50% by weight, for example, 30% by weight.

  Next, the unidirectional prepregs 33 are laminated such that the orientation directions of the carbon fibers 31 are sequentially 60 °, 120 °, 0 °, 0 °, 120 °, and 60 °. The carbon fiber reinforced resin plate 34 having a thickness of, for example, 250 μm is formed by pressure and heat molding.

  In this manner, the carbon fibers 31 are arranged so that the orientation direction of the carbon fibers 31 is rotationally symmetric about the center plane in the laminating direction of the carbon fiber reinforced resin plates 34 and the total carbon fiber cross-sectional area is equal in three directions. Thereby, the isotropy of the thermal expansion coefficient and the elastic modulus in the plane direction can be further improved, and the warpage and distortion can be eliminated.

  20 ° C. to 200 ° C. in 15 ° increments of 0 °, 15 °, 30 °, 45 °, 60 °, 75 °, 90 ° with respect to the orientation direction of the carbon fibers 31 in the outermost layer of the carbon fiber reinforced resin plate 34. As a result of measuring the anisotropy of the coefficient of thermal expansion in the temperature range of, it was confirmed that the coefficient of thermal expansion was isotropic at 2 ppm / ° C at all measurement angles.

  For comparison, a carbon fiber reinforced resin plate obtained by laminating eight unidirectional prepregs 33 in the directions of 90 °, 0 °, 0 °, 90 °, 90 °, 0 °, 0 °, 90 ° to 350 μm was used. The carbon fiber reinforced resin sheet was manufactured and measured for the anisotropy of the coefficient of thermal expansion in the same manner. The results were 2.2 ppm / ° C at 0 ° and 90 °, 2 ppm / ° C at 15 ° and 75 °, and 30 °. At 60 °, 1.5 ppm / ° C. and at 45 °, 0 ppm / ° C., a clear anisotropy was observed.

  Although not shown hereafter, by forming through holes and through vias and the like in the same steps as in the first embodiment, the appearance is the same as that in the first embodiment. It is possible to obtain a mounting substrate having excellent thermal expansion coefficient and elasticity isotropy.

Next, with reference to FIGS. 12 to 18, a description will be given of a manufacturing process of the mounting board according to the third embodiment of the present invention.
See FIG.
First, after arranging carbon fibers 41 having a diameter of, for example, 7 μm in one direction and arranging them in one direction, for example, impregnating an epoxy resin 42 having a glass transition temperature of 250 ° C. to form a unidirectional prepreg having a thickness of, for example, 50 μm 43 is manufactured.
In this case, as the carbon fiber 41, an elastic modulus of, for example, 650 GPa is used, and the resin content in the one-way prepreg 43 is set to 30 to 50% by weight, for example, 30% by weight.

See FIG.
Then, the unidirectional prepreg 43 is formed on both surfaces of the glass-reinforced fiber resin substrate 44 having a thickness of, for example, 2 mm and having an uncured resin on the surface, in which the orientation directions of the carbon fibers 41 are sequentially 90 °, 0 °, 0 °. , 90 °, and then heat-molded in vacuum at, for example, 200 ° C. to form a low thermal expansion substrate 46 having a carbon fiber reinforced resin layer 45 having a thickness of, for example, 200 μm. To form

See FIG.
Next, using an end mill, openings 47 having a diameter of 350 μm and a pitch of 500 μm are formed only in the carbon fiber reinforced resin layer 45.
Also in this case, since the thickness of the carbon fiber reinforced resin layer 45 is as thin as 200 μm and has a regular pitch, the presence of the carbon fibers 41 does not hinder the formation of the openings, and the openings 47 can be easily formed. Can be.

See FIG.
Next, a glass fiber reinforced resin prepreg 48 having a thickness of, for example, 100 μm and a copper foil 49 having a thickness of, for example, 18 μm are attached to both surfaces of the low thermal expansion substrate 45 by vacuum heating press.

See FIG.
Next, through holes 50 of 200 μm are formed at a pitch of 500 μm corresponding to the openings 47 by drilling.

See FIG.
Next, by performing electroless Cu plating and electrolytic Cu plating sequentially, a through via 51 is formed on the side surface of the through hole 50 to be electrically connected to the copper foil 49 on both surfaces.

See FIG.
Finally, similarly to the normal double-sided circuit board manufacturing process, the copper foils 49 on both surfaces of the low thermal expansion substrate 46 are formed by an etching process so as to become the wiring patterns 52 for connecting to the semiconductor element and the printed wiring board, respectively. Thereby, a basic configuration of the through via substrate is obtained.

As a result of measuring the thermal expansion coefficient of this molded through via substrate in a temperature range of 20 ° C to 200 ° C, it was confirmed that it was 2.2 ppm / ° C.
By changing the thickness of the carbon fiber reinforced resin layer 45, the elastic modulus of the carbon fiber 41, or the thickness of the glass fiber reinforced resin plate 44, this value is in the range of 0 ppm / ° C. to 15 ppm, which is the range of the thermal expansion coefficient of both materials. It can be adjusted in the range of / ° C.

  In the third embodiment, an inexpensive glass fiber reinforced resin plate 44 is used as a thick base layer, and a carbon fiber reinforced resin layer 45 having a low coefficient of thermal expansion is used at a connection portion with a semiconductor element or the like. The expansion substrate can be manufactured at lower cost.

The embodiments of the present invention have been described above. However, the present invention is not limited to the configurations described in the embodiments, and various modifications are possible.
For example, in the description of each of the above embodiments, an epoxy resin is used as a resin constituting the prepreg. However, the resin is not limited to the epoxy resin, and may be a thermosetting resin.
In addition, general so-called photo-curable resins are also cured by heating, and thus fall into the category of the thermo-curable resin of the present invention.

  Further, in each of the above-described embodiments, the carbon fiber having a diameter of 7 μm is used as the carbon fiber constituting the unidirectional prepreg, but the diameter of the carbon fiber is not limited to 7 μm. The diameter of the carbon fiber may be appropriately determined according to the thickness of the conductive prepreg.

  The carbon fiber is not limited to a single carbon fiber having a diameter of 7 μm, but may be a carbon fiber bundle. For example, a bundle of 92 carbon fibers having a diameter of 4.7 μm may be used to form a hexagonal column. May be used as a carbon fiber bundle.

  Further, in the first embodiment, in order to form a thin carbon fiber reinforced resin plate, four layers of prepreg are formed by heating under pressure. However, the present invention is not limited to four layers. An eight-layer structure manufactured for comparison with Example 2 may be used, and the number of layers is arbitrary.

  In the case of an odd-numbered layer, for example, five layers, when the orientation direction of the carbon fibers in the unidirectional prepreg of the uppermost layer is 0 °, 0 ° / 90 ° / 0 ° / 90 ° / 0 °. The layers may be stacked symmetrically with respect to the center plane in the stacking direction.

  In the second embodiment, six unidirectional prepregs are stacked, but a five-layer structure may be employed in which the intermediate 0 ° layer is further omitted.

  Further, the combination of the orientation directions of the carbon fibers is not limited to the orthogonal direction or the three directions shifted by 60 °. For example, in the case of eight layers, 0 ° / 45 ° / 90 ° / 135 ° / The layers may be stacked in the order of 135 ° / 90 ° / 45 ° / 0 °.

  Further, in each of the above embodiments, in order to form a wiring pattern, a copper foil such as a resin-coated copper foil is used.However, the present invention is not limited to the copper foil, and various conductive foils may be used depending on the application. A conductor foil such as a conductor foil with a resin adhered to a resin may be used.

  In each of the above embodiments, a copper foil such as a resin-coated copper foil is etched to form a wiring pattern. However, a wiring pattern may be formed by copper plating instead of etching. .

  Further, in each of the above embodiments, the drilling is performed using a normal mechanical drill. However, the drilling is not limited to such a mechanical drilling, and the laser drilling using a laser beam may be used. Good thing.

  In each of the above embodiments, the package substrate is described as having a constant through-hole pitch in order to facilitate drilling. However, the present invention is not limited to the package substrate, and is applicable to a double-sided printed wiring board. Is what is done.

  Further, in each of the above embodiments, all the through vias are used as the electrical connection means, but some of the through holes are not embedded with the resin, and the through holes provided on the side walls of the through holes and the carbon fibers exposed on the side walls are provided. May be used as thermal vias by short-circuiting, thereby improving the heat radiation characteristics.

  Further, in each of the above embodiments, the wiring pattern is provided on both surfaces of the carbon fiber reinforced resin plate, but may be provided on only one surface and used as a simple mounting board similar to a single-sided printed wiring board. is there.

Further, in the first and second embodiments, the carbon fiber reinforced resin plate is constituted by one sheet, but when the copper foil with the resin is attached, the copper foil is previously patterned into a predetermined wiring pattern. Alternatively, a multilayered circuit board may be formed by laminating carbon fiber reinforced resin plates having the above-mentioned resin-attached copper foil adhered to one side.
The lowermost layer and the uppermost layer may be formed by attaching a copper foil with resin and then patterning to form a wiring pattern.

  Further, in the third embodiment, a glass fiber reinforced resin plate is used as the base layer. In this case, a glass fiber reinforced resin plate using a flattened glass fiber cloth may be used. Thereby, the glass fiber density can be increased.

  In the third embodiment, the thickness ratio between the glass fiber reinforced resin plate and the carbon fiber reinforced resin layer as the base layer is 200 μm / 2 mm = 1/10, but is not limited to 1/10. Although it is optional, it is desirable to make it smaller than 1/10 for cost reduction.

Here, the detailed features of the present invention will be described with reference to FIGS. 1 and 2 again.
Again, see FIGS. 1 and 2
(Supplementary Note 1) A conductor circuit pattern is formed on at least one surface of a carbon fiber resin plate 4 formed by laminating prepregs 1 in which carbon fibers are arranged in one direction and arranging them so that the carbon fibers 2 have different orientations. A mounting substrate, characterized by having:
(Supplementary Note 2) A carbon fiber resin plate 4 formed by laminating prepregs 1 in which carbon fibers 2 are arranged in one direction and arranging them so that the orientation direction of the carbon fibers 2 is different from the carbon fiber resin plate 4 A mounting board, which is placed outside a thick insulating fiber reinforced resin plate and provided with a conductor circuit pattern on at least one surface of the carbon fiber resin plate 4.
(Supplementary Note 3) The mounting board according to Supplementary Note 2, wherein the thickness of the carbon fiber resin plate 4 is 1/10 or less of the thickness of the insulating fiber reinforced resin plate.
(Supplementary Note 4) The mounting substrate according to Supplementary Note 2 or 3, wherein the insulating fiber-reinforced resin plate is made of a glass fiber-reinforced resin plate.
(Supplementary Note 5) The mounting substrate according to Supplementary Note 4, wherein a flattened glass fiber cloth is used as the glass fiber reinforced resin plate.
(Supplementary Note 6) The carbon fibers 2 are characterized in that four layers are laminated so that the direction of the outermost surface is 0 °, and the carbon fibers 2 have a laminated structure of 0 ° / 90 ° / 90 ° / 0 °. 6. The mounting board according to any one of supplementary notes 1 to 5, wherein
(Supplementary Note 7) The mounting substrate according to any one of Supplementary Notes 1 to 5, wherein at least five layers of three types of prepregs 1 in which the directions of the carbon fibers 2 are different by 60 ° are sequentially laminated.
(Supplementary Note 8) A supplementary note characterized in that conductor circuit patterns are provided on both surfaces of the carbon fiber resin plate 4 and they are electrically connected to each other by through vias 7 provided in the through holes 5 via the resin 6. 8. The mounting board according to any one of 1 to 7.
(Supplementary Note 9) A step of forming a carbon fiber resin plate 4 by laminating and curing prepregs 1 in which carbon fibers 2 are aligned and arranged in one direction so that the orientation directions of the carbon fibers 2 are different; Laminating a conductive foil with resin on at least one surface of the resin plate 4.
(Supplementary Note 10) The through hole 5 is formed by drilling the carbon fiber resin plate 4, and then the through hole 5 is filled with a resin 6 for filling the hole. The method for manufacturing a mounting board according to claim 9, wherein the mounting is performed on both surfaces of the plate 4.

  A typical example of the application of the present invention is a package substrate on which a semiconductor element or the like is directly mounted, but may be used as a normal circuit board such as a printed wiring board or a multilayer wiring circuit board.

1 is a schematic exploded perspective view of a carbon fiber resin plate showing a basic configuration of the present invention. FIG. 2 is a schematic cross-sectional view of a mounting board showing a basic configuration of the present invention. FIG. 5 is an explanatory diagram of a manufacturing process of the mounting board according to the first embodiment of the present invention halfway; FIG. 5 is an explanatory diagram of a manufacturing process of the mounting board according to the first embodiment of the present invention up to the middle of FIG. 3; FIG. 6 is an explanatory diagram of a manufacturing process of the mounting board according to the first embodiment of the present invention up to the middle of FIG. 4. FIG. 6 is an explanatory diagram of a manufacturing process of the mounting board according to the first embodiment of the present invention up to the middle of FIG. 5; FIG. 7 is an explanatory diagram of a manufacturing process of the mounting board according to the first embodiment of the present invention up to the middle of FIG. 6. FIG. 8 is an explanatory diagram of a manufacturing process of the mounting board according to the first embodiment of the present invention up to the middle of FIG. 7. FIG. 9 is an explanatory diagram of a manufacturing process of the mounting board according to the first embodiment of the present invention up to the middle of FIG. 8. FIG. 10 is an explanatory diagram of a manufacturing process of the mounting substrate according to the first embodiment of the present invention after FIG. 9. FIG. 9 is an explanatory diagram of a manufacturing process of the mounting board according to the second embodiment of the present invention. It is an explanatory view of a manufacturing process of the mounting board according to the third embodiment of the present invention halfway. FIG. 13 is an explanatory diagram of a manufacturing process of the mounting board according to the third embodiment of the present invention up to the middle of FIG. 12. FIG. 14 is an explanatory diagram of a manufacturing process of the mounting board according to the third embodiment of the present invention up to the middle of FIG. FIG. 15 is an explanatory diagram of a manufacturing process of the mounting board according to the third embodiment of the present invention up to the middle of FIG. 14. FIG. 16 is an explanatory diagram of a manufacturing process of the mounting board according to the third embodiment of the present invention up to the middle of FIG. 15. FIG. 17 is an explanatory diagram of a manufacturing process of the mounting board according to the third embodiment of the present invention in the middle of FIG. 16 and subsequent steps. FIG. 18 is an explanatory diagram of a manufacturing process of the mounting substrate according to the third embodiment of the present invention after FIG. 17.

Explanation of reference numerals

Reference Signs List 1 prepreg 2 carbon fiber 3 resin 4 carbon fiber resin plate 5 through hole 6 resin 7 through via 8 conductor circuit pattern 11 carbon fiber 12 epoxy resin 13 one-way prepreg 14 carbon fiber reinforced resin plate 15 through hole 16 hole filling resin 17 copper with resin Foil 18 Copper foil 19 Resin 20 Through hole 21 Through via 22 Wiring pattern 31 Carbon fiber 32 Epoxy resin 33 Unidirectional prepreg 34 Carbon fiber reinforced resin plate 41 Carbon fiber 42 Epoxy resin 43 Unidirectional prepreg 44 Glass fiber reinforced resin plate 45 Carbon fiber reinforced Resin layer 46 Low thermal expansion substrate 47 Opening 48 Glass fiber reinforced resin prepreg 49 Copper foil 50 Through hole 51 Through via 52 Wiring pattern

Claims (5)

  1. A prepreg in which carbon fibers are aligned and arranged in one direction, a conductor circuit pattern is provided on at least one surface of a carbon fiber resin plate molded by laminating such that the orientation direction of the carbon fibers is different. Mounting board.
  2. A carbon fiber resin plate formed by laminating prepregs in which carbon fibers are aligned in one direction and laminating the carbon fibers so that the orientation directions of the carbon fibers are different from each other is formed on the outside of an insulating fiber reinforced resin plate thicker than the carbon fiber resin plate. And a conductor circuit pattern provided on at least one surface of the carbon fiber resin plate.
  3. 3. The mounting according to claim 1, wherein conductive circuit patterns are provided on both surfaces of the carbon fiber resin plate, and they are electrically connected to each other by through vias provided in the through holes via a resin. substrate.
  4. A prepreg in which carbon fibers are aligned in one direction, a step of laminating and curing the carbon fibers so that the orientation directions of the carbon fibers are different, and molding a carbon fiber resin plate, on at least one surface of the carbon fiber resin plate. Laminating a conductive foil with resin.
  5. Drilling the carbon fiber resin plate to form a through hole, and then filling the through hole with a resin for filling the hole, and laminating the conductive foil with resin on both surfaces of the carbon fiber resin plate. The method for manufacturing a mounting board according to claim 4, wherein:
JP2003359249A 2003-03-03 2003-10-20 Packaging substrate and its manufacturing method Pending JP2004289114A (en)

Priority Applications (2)

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100723298B1 (en) 2005-08-23 2007-05-30 (주) 나노텍 Heat sink using prepreg
JP2008085106A (en) * 2006-09-28 2008-04-10 Kyocera Corp Printed wiring board
JP2008277415A (en) * 2007-04-26 2008-11-13 Kyocera Corp Substrate having built-in electronic component and manufacturing method thereof
JP2009021470A (en) * 2007-07-13 2009-01-29 Fujitsu Ltd Circuit substrate
JP2009146988A (en) * 2007-12-12 2009-07-02 Fujitsu Ltd Method of singulating circuit board and package circuit board
JP2009152535A (en) * 2007-12-18 2009-07-09 Samsung Electro Mech Co Ltd Method of manufacturing semiconductor package, and semiconductor plastic package using the same
JP2009302459A (en) * 2008-06-17 2009-12-24 Fujitsu Ltd Wiring board, and manufacturing method thereof
KR101054652B1 (en) 2009-05-19 2011-08-04 주식회사 영일프레시젼 Manufacturing method of LED heat dissipation board coated with heat dissipation paint
JP2013140907A (en) * 2012-01-06 2013-07-18 Ibiden Co Ltd Printed wiring board and manufacturing method of the same
US8754333B2 (en) 2010-10-22 2014-06-17 Fujitsu Limited Printed circuit board incorporating fibers

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JPH06157139A (en) * 1992-11-13 1994-06-03 Toho Rayon Co Ltd Production of carbon fiber reinforced carbon composite material
JPH1140902A (en) * 1997-07-18 1999-02-12 Cmk Corp Printed wiring board and manufacture thereof
WO2002047899A1 (en) * 2000-12-12 2002-06-20 Shri Diksha Corporation Lightweight circuit board with conductive constraining cores
JP2002232145A (en) * 2001-01-30 2002-08-16 Densei Lambda Kk Multilayer printed board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06157139A (en) * 1992-11-13 1994-06-03 Toho Rayon Co Ltd Production of carbon fiber reinforced carbon composite material
JPH1140902A (en) * 1997-07-18 1999-02-12 Cmk Corp Printed wiring board and manufacture thereof
WO2002047899A1 (en) * 2000-12-12 2002-06-20 Shri Diksha Corporation Lightweight circuit board with conductive constraining cores
JP2002232145A (en) * 2001-01-30 2002-08-16 Densei Lambda Kk Multilayer printed board

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100723298B1 (en) 2005-08-23 2007-05-30 (주) 나노텍 Heat sink using prepreg
JP2008085106A (en) * 2006-09-28 2008-04-10 Kyocera Corp Printed wiring board
JP2008277415A (en) * 2007-04-26 2008-11-13 Kyocera Corp Substrate having built-in electronic component and manufacturing method thereof
JP2009021470A (en) * 2007-07-13 2009-01-29 Fujitsu Ltd Circuit substrate
JP2009146988A (en) * 2007-12-12 2009-07-02 Fujitsu Ltd Method of singulating circuit board and package circuit board
JP2009152535A (en) * 2007-12-18 2009-07-09 Samsung Electro Mech Co Ltd Method of manufacturing semiconductor package, and semiconductor plastic package using the same
JP2009302459A (en) * 2008-06-17 2009-12-24 Fujitsu Ltd Wiring board, and manufacturing method thereof
KR101054652B1 (en) 2009-05-19 2011-08-04 주식회사 영일프레시젼 Manufacturing method of LED heat dissipation board coated with heat dissipation paint
US8754333B2 (en) 2010-10-22 2014-06-17 Fujitsu Limited Printed circuit board incorporating fibers
JP2013140907A (en) * 2012-01-06 2013-07-18 Ibiden Co Ltd Printed wiring board and manufacturing method of the same

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