JP2004184027A - Cooling system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance heat recovery efficiency with cooling water. <P>SOLUTION: This double pipe type cooling system 30 comprises double cooling water pipelines 38 consisting of an inside cooling passage 32 having a plurality of lines arranged in parallel to encircle a peripheral portion of a reaction chamber 12, an outside cooling passage 34 having a plurality of lines arranged in parallel to encircle an outer peripheral portion of the inside cooling passage 32, and a plurality of communication lines 36 for communicating the inside cooling passage 32 with the outside cooling passage 34. The double cooling water pipelines 38 are constructed to supply cooling water to the plurality of lines arranged in parallel for cooling all peripheral portions of a silica bell-jar 20 and a Si wafer 18, therefore enhancing the heat recovery efficiency with the cooling water. A heat insulating material 40 is laid between the inside cooling passage 32 and the outside cooling passage 34 for insulating the heat of the cooling water flowing in the inside cooling passage 32 even when temperature rise occurs therein. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a cooling system, and more particularly to a cooling system configured to increase cooling efficiency when cooling a heating element heated to a high temperature by supplying cooling water.
[0002]
[Prior art]
As a cooling system for cooling a high-temperature heating element with cooling water, for example, there is a cooling device used in a semiconductor manufacturing apparatus. In this semiconductor manufacturing apparatus, a reaction chamber (storage chamber) surrounded by quartz glass is depressurized, a reaction gas is supplied to the reaction chamber, and the reaction chamber is housed in a high temperature environment (about 800 ° C.) heated by a heater. A thin film is formed on the surface of the subjected Si (silicon) wafer. Therefore, in the semiconductor manufacturing apparatus, since the Si wafer on which the thin film is formed is heated to a high temperature, the Si wafer is cooled and then taken out of the reaction chamber.
[0003]
FIG. 1 is a longitudinal sectional view showing a schematic configuration of a semiconductor manufacturing apparatus to which a conventional cooling system is attached.
As shown in FIG. 1, the conventional cooling system 10 has a cooling water pipe 11 (indicated by a broken line in FIG. 1) formed by bending one copper pipe as described later. The cooling water conduit 11 has an upper part held by an upper holding part 13a formed in a ring shape, and a lower part held by a lower holding part 13b formed in a ring shape.
[0004]
Further, in the cooling system 10, an aluminum cylindrical member 19a having a thickness of 1 mm is provided inside the cooling water pipe 11 adjacent to the Si wafer 18 serving as a heating element, and the outer diameter of the cylindrical member 19a is 3/8 inch. The cooling water pipe 11 is formed of a copper pipe, and the periphery of the cooling water pipe 11 is further surrounded by a cylindrical member 19b made of an aluminum plate having a thickness of 1 mm.
[0005]
The semiconductor manufacturing apparatus 14 to which the cooling system 10 is attached has a configuration using a vertical furnace of a batch processing system, and a plurality of Si wafers 18 are placed on a quartz board 16a of a stage 16 which can be moved up and down in a predetermined manner. The thin film is formed in a state of being stacked at intervals.
[0006]
Further, the semiconductor manufacturing apparatus 14 includes a plurality of bar heaters 22 provided around the reaction chamber 12 by inserting the plurality of Si wafers 18 into the reaction chamber 12 surrounded by the quartz bell jar 20 by raising the stage 16. Heats the reaction chamber 12. In the reaction chamber 12, the pressure is reduced and heated to a high temperature to form a thin film on the surface of the Si wafer 18.
[0007]
Further, the periphery of the quartz bell jar 20 is surrounded by a heat insulating material 24 so that the heat of the reaction chamber 12 is not radiated to the periphery. The cooling water pipe 11 of the cooling system 10 is provided on the outer periphery of the heat insulating material 24.
[0008]
The cooling water pipe 11 is supported by a lifting base 26 on which the quartz bell jar 20 is mounted, and is moved up and down together with the quartz bell jar 20 by an elevator mechanism (not shown).
[0009]
In the cooling system 10, when the thin film forming process in the reaction chamber 12 is completed, the stage 16 is lowered, and the elevating base 26 on which the quartz bell jar 20 and the cooling water pipe 11 are mounted is lowered, and the quartz bell jar 20 and the Si wafer Cool 18 from ambient.
[0010]
In the cooling system 10, water having the same temperature (about 23 ° C.) as the room temperature is supplied to the cooling water pipe 11 to lower the temperature of the Si wafer 18 heated to a high temperature (about 800 ° C.) and to reduce the temperature of the surroundings (clean room). Inside).
[0011]
The cooling water discharged to the outside after passing through the cooling water pipe 11 absorbs the heat of the reaction chamber 12 and the temperature rises to about 27.5 ° C. and is discharged to the outside. Then, the cooling water discharged from the cooling water pipe 11 is cooled to about 23 ° C. by a heat exchanger (not shown) installed outside and returned to the cooling water pipe 11 again.
[0012]
Here, an example of a cooling facility to which the conventional cooling system 10 is applied will be described with reference to FIG.
[0013]
As shown in FIG. 2, the conventional cooling equipment 28 has a configuration in which a large-sized refrigerator R is provided in a cooling path on the primary side. The refrigerator R is a facility that recovers and cools the heat load from all the heat generating parts in the factory using water as a medium. For example, when the refrigerator R is a centrifugal refrigerator using electricity as energy, the refrigerator R has a capability of cooling cold water at 10 ° C. to cold water at 5 ° C.
[0014]
The heat recovered by the refrigerator R is transmitted to the cooling water, and the cooling water is supplied to the cooling building CT by the water supply pump P1 and the water supply line L1 to be released outside. The cold water of 5 ° C. produced by the refrigerator R is stored in the cold water tank CWT on the primary side. And the cooling water of the cold water tank CWT is supplied to the primary side of the heat exchanger HEX via the water supply pump P3 and the water supply line L3.
[0015]
The secondary side of the heat exchanger HEX is connected to a cooling water supply line 29 that supplies cooling water to the cooling water pipe 11 and other heat generating parts. Therefore, the heat recovered through the cooling water pipe 11 and the like is transmitted to the cooling water on the primary side through the heat exchanger HEX.
[0016]
The 5 ° C. cold water supplied from the cold water tank CWT becomes water whose temperature has been raised to 10 ° C. in the heat exchanger HEX, returned to the cold water tank CWT, and sent to the refrigerator R via the water pump P2 and the water line L2. Returned and cooled to 5 ° C cold water. The cooling water on the secondary side supplied to the cooling water pipe 11 is cooled to water at 23 ° C. by the heat exchanger HEX, and is cooled by the water pump P4 and the water line L4. And other heating elements.
[0017]
In the cooling system 10, the cooling water that has recovered heat from the Si wafer 18 that is the heating element and has become high temperature (for example, 27.5 ° C.) is stored in the secondary-side buffer tank Bu. The water is supplied from the buffer tank Bu to the secondary side of the heat exchanger HEX by the water supply line L4, and becomes cooling water at 23 ° C.
[0018]
As described above, in the conventional cooling equipment 28, a number of equipments requiring energy, such as the refrigerator R and the water supply pumps P1 to P4, are installed, and a large number of cooling water supply paths are required. Costs and operating costs were enormous.
[0019]
FIG. 3 is a developed view showing a cooling water path 11 used in the conventional cooling system 10.
As shown in FIG. 3, the cooling water pipeline 11 of the conventional cooling system 10 is formed by bending a single copper pipe, and communicates a plurality of straight pipes 11a with ends of adjacent straight pipes 11a. And the bent portions 11b are formed alternately. In the cooling water pipe 11, one end of the cooling water pipe 11 is an inlet 11c of the cooling water, and the other end of the cooling water pipe 11 is an outlet 11d of the cooling water. Therefore, the cooling water supplied from the inflow port 11c passes through the plurality of straight pipes 11a and the bent portions 11b, and is then discharged to the outside from the outflow port 11d.
[0020]
FIG. 4 is a perspective view showing an attached state of the cooling water pipe 11.
As shown in FIG. 4, the cooling water pipe 11 is formed in an annular shape so as to surround the outer periphery of the quartz bell jar 20 from the developed state as described above. Therefore, the cooling system 10 is configured to cool the cooling water by flowing around the heating element upward, downward, and upward, and orbiting the periphery.
[0021]
In the conventional cooling system 10 configured to circulate the cooling water as described above, it is necessary to supply a large amount of cooling water in order to process a huge amount of heat generated from the semiconductor manufacturing apparatus 14. Further, the temperature difference between the cooling water introduction temperature and the discharge temperature at that time was, for example, about 4.5 ° C.
[0022]
In the conventional cooling system 10 configured as described above, since the cooling water pipe 11 is formed of one copper pipe from the inlet to the outlet of the cooling water, the pipe resistance to the cooling water increases, The load on the pump increases. Further, the temperature distribution in the cooling system 10 has a large variation, and there is a possibility that the thermal effect on the Si wafer 18 which is the heating element (cooled object) may vary.
[0023]
Therefore, in the conventional cooling system 10, enormous energy is consumed as power for driving the water supply pump that conveys the cooling water, and the discharged cooling water is used as a load of the cooling equipment provided in the heat exchanger. Only worked. For this reason, the conventional cooling system 10 has a problem that the cooling equipment is enlarged and energy consumption is increased.
[0024]
In order to solve such a problem, the present applicant has previously proposed a cooling system called a double-pipe cooling system in which a cooling pipe is arranged concentrically with an inner cooling path and an outer cooling path (for example, And Patent Document 1).
[0025]
[Patent Document 1]
PCT International Publication Number WO / 01/03168 A1 (refer to FIG. 6)
[0026]
[Problems to be solved by the invention]
However, in the double-pipe cooling system as described above, the cooling water is supplied to the outer cooling path, and the cooling water that has passed through the outer cooling path is supplied to the inner cooling path, thereby increasing the cooling efficiency (heat recovery efficiency). Although it was configured to increase the cooling water, there was a possibility that sufficient cooling efficiency could not be obtained because the relationship between the cooling water supply speed and the thermal conductivity and the relationship between the water supply speed and the cooling efficiency were insufficient. .
[0027]
In Japan, greenhouse gases (CO 2) have been promoted in order to promote the control of global warming. ₂ ) Is required to reduce the amount of emissions, and how to reduce energy consumption in each industry is being sought.
[0028]
In the industrial field of semiconductor manufacturing equipment, increasing the efficiency of heat recovery in a clean room in which semiconductor manufacturing equipment is installed increases greenhouse gas (CO2) emissions. ₂ ) Is thought to contribute to the reduction of emissions.
[0029]
Therefore, when the energy (electric power) consumed in the clean room was simulated, the electric power consumed by the semiconductor manufacturing apparatus was larger than that of an air conditioner that controlled the temperature to keep the temperature in the clean room constant. It was found that the energy consumption required for cooling the cooling water for removing the heat after heating and for circulating the cooling water was large.
[0030]
That is, in the cooling system that circulates the cooling water, the consumption of electric energy is suppressed and the greenhouse gas (CO 2 ₂ It is important to increase the efficiency of heat recovery by cooling water in order to contribute to the reduction of emissions in (1).
[0031]
Therefore, an object of the present invention is to provide a cooling system that solves the above problems.
[0032]
[Means for Solving the Problems]
The present invention has the following features to solve the above problems.
The invention according to claim 1 has a storage chamber for storing a heating element heated by a heater, and a cooling path formed so as to surround the storage chamber, and supplies cooling water to the cooling path to generate the heating element. In the cooling system configured to cool the first path, the cooling path includes a first path in which a plurality of pipes are arranged in parallel so as to surround the storage chamber, and a plurality of pipes in the first path. A second path arranged in parallel so as to surround the outer periphery; and a plurality of communication paths communicating between the first path and the second path, wherein the cooling water is arranged in parallel. It is possible to increase the heat recovery efficiency of the cooling water by supplying the cooling water to the plurality of pipelines.
[0033]
According to a second aspect of the present invention, the cooling water is supplied to the first path and the second path at a turbulent flow velocity, and the temperature distribution in the pipes of the first path and the second path is made uniform. It is possible to increase the efficiency of heat recovery by the cooling water.
[0034]
According to a third aspect of the present invention, the cooling water is supplied to the first path and the second path at a flow rate at which the Reynolds number is 1000 or more, and the cooling water is supplied to the first path and the second path in a turbulent state. And the temperature distribution in the pipes of the first path and the second path is made uniform, so that the efficiency of heat recovery by the cooling water can be increased.
[0035]
According to a fourth aspect of the present invention, the cooling water supply unit communicates with one of the first path and the second path, and the cooling water discharge unit communicates with the other of the first path and the second path. Therefore, it is possible to make the temperature distribution in the pipes of the first path and the second path uniform and to enhance the heat recovery efficiency by the cooling water.
[0036]
According to a fifth aspect of the present invention, a heat absorber for absorbing heat is provided between the storage chamber and the first path, and the heat generated in the storage chamber is absorbed by the heat absorber. By cooling the surroundings, the heat recovery efficiency can be increased.
[0037]
The invention according to claim 6 is provided with a gas filling unit for filling the storage chamber with a gas having a high thermal conductivity, and recovering heat generated in the storage chamber through the gas having a high thermal conductivity, It is possible to increase the collection efficiency.
[0038]
According to a seventh aspect of the present invention, a heat insulating material is interposed between the first path and the second path to suppress heat conduction between the first path and the second path. , To prevent heat from the storage chamber from conducting to the surroundings.
[0039]
The invention according to claim 8 is characterized in that the first path is provided with an outflow-side common pipe that communicates the outflow-side ends of the plurality of pipes, and the cooling water that has passed through the plurality of pipes is simultaneously discharged. As a result, the heat recovery efficiency can be improved.
[0040]
According to a ninth aspect of the present invention, the second path is provided with an inflow-side common pipe that communicates the inflow-side ends of the plurality of pipes. It is possible to increase the collection efficiency.
[0041]
According to a tenth aspect of the present invention, the cooling water discharged from the outflow-side common pipe is supplied to the heat exchanger, and the cooling water, which has passed through the first path and the second path and has been heated, is heated. The heat recovery efficiency can be increased by cooling in the exchanger and supplying it to the first path and the second path.
[0042]
According to an eleventh aspect of the present invention, the cooling water is supplied to the inflow-side common pipe at a flow rate which becomes turbulent, and the temperature distribution in the pipes of the first path and the second path is made uniform so that the heat generated by the cooling water is supplied. It is possible to increase the collection efficiency.
[0043]
According to a twelfth aspect of the present invention, the plurality of conduits are arranged in parallel so as to face the storage chamber at predetermined intervals, and the entire circumference of the storage chamber is uniformly cooled to enhance heat recovery efficiency. Becomes possible.
[0044]
According to a thirteenth aspect of the present invention, the plurality of communication paths are arranged in parallel so as to branch off from respective ends of the plurality of conduits, and the cooling from the first path via the plurality of communication paths. By supplying water to the plurality of conduits in the second path, it is possible to uniformly cool the entire circumference of the storage chamber and increase the heat recovery efficiency.
[0045]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 5 is a longitudinal sectional view showing one embodiment of the cooling system according to the present invention.
[0046]
As shown in FIG. 5, in the double-tube cooling system 30 of the present invention, an inner cooling path (first path) 32 in which a plurality of pipes are arranged in parallel so as to surround the periphery of the reaction chamber 12, and An outer cooling path (second path) 34 in which a plurality of pipelines are arranged in parallel so as to surround the outer periphery of the inner cooling path 32, and a plurality of communicating paths between the inner cooling path 32 and the outer cooling path 34. And a communication passage 36 (indicated by a broken line in FIG. 5).
[0047]
In the double-tube cooling system 30, an aluminum cylindrical member 19a is provided at a position close to the Si wafer 18 which is a heating element, an inner cooling path 32 is provided on the outer side in the circumferential direction of the cylindrical member 19a, and a heat insulating material is provided. An outer cooling path 34 is provided through 40.
[0048]
As described later, the double cooling water pipe 38 is configured to supply cooling water to a plurality of pipes arranged in parallel to cool the quartz bell jar 20 and the Si wafer 18 from the entire circumference. Heat recovery efficiency can be increased.
[0049]
The inner cooling passage 32 and the outer cooling passage 34 are held by an upper holding portion 13a having an upper portion formed in a ring shape, and a lower portion is held by a lower holding portion 13b having a ring shape.
[0050]
Further, a heat insulating material 40 is interposed between the inner cooling path 32 and the outer cooling path 34. The cooling water supplied to the outer cooling path 34 is supplied after being cooled to the same temperature as the room temperature of the clean room so that the temperature of the clean room does not change. The heat insulating material 40 blocks heat. Therefore, the heat of the inner cooling path 32 is blocked by the heat insulating material 40 and is not conducted to the outer cooling path 34.
[0051]
Here, an example of cooling equipment to which the double-tube cooling system 30 of the present invention is applied will be described with reference to FIG.
[0052]
In the cooling system 42 shown in FIG. 6, the cooling water supply temperature supplied to the double-tube cooling system 30 is controlled to 23 ° C. which is the same as the room temperature of the clean room, and this cooling water is supplied by the water supply pump P4 and the water supply line. It is supplied to the double cooling water pipe 38 of the double pipe cooling system 30 via L4, and recovers heat from the heat generating portion of the semiconductor manufacturing apparatus 14.
[0053]
At this time, in the double pipe cooling system 30 using the double cooling water pipe 38, the cooling water amount is controlled so that the discharge temperature of the cooling water becomes 50 ° C. or more and the temperature difference becomes 30 ° C. or more. It has been found that the flow rate of the cooling water supplied to the double cooling water pipe 38 is reduced to 8100 (L / hr), for example, from 54000 (L / hr) in the case of the conventional cooling system 10. As a result, the shaft power required for the water pump P4 can be reduced to about 1/6 of the conventional one.
[0054]
Further, the water discharged from the double cooling water pipe 38 is cooled from 50 ° C. or more to 23 ° C. by the heat exchanger HEX. At that time, in the heat exchanger HEX, a reheating portion or a preheating portion (not shown) of an outside air treatment device (for example, a cooling building CT or the like) requiring a heating source is used instead of the conventional cooling with cold water. The cooling water is returned to 23 ° C. by releasing heat at a heating portion (not shown) of another production apparatus.
[0055]
By adopting this method, the large-sized refrigerator R, the water pumps P2 and P3 and the water lines L2 and L3 of the 5 ° C. system, which are conventionally required, become unnecessary, and the number of equipment and the number of equipment and the water line are simplified. Therefore, the initial cost and operating cost of the cooling equipment can be significantly reduced, and the energy productivity can be improved.
[0056]
Further, the energy consumed by the cooling facility 42 is only 5.5 KW, and the energy consumed by the conventional cooling facility 28 can be reduced to about 1/6 of 30 KW.
[0057]
As a result, in the double-tube cooling system 30, the heat recovery efficiency in the clean room where the semiconductor manufacturing apparatus 14 is installed can be increased, and the greenhouse gas (CO 2) ₂ ) Can also be reduced.
[0058]
Here, the configuration of the double cooling water pipe 38 will be described.
FIG. 7 is a developed view showing a double cooling water path 38 used in the double-pipe cooling system 30.
As shown in FIG. 7, the double cooling water pipe 38 of the double pipe cooling system 30 is divided into an inner cooling path 32 and an outer cooling path 34, and the inner cooling path 32 and the outer cooling path 34 Are communicated by a plurality of communication pipes 36.
[0059]
The outer cooling path 34 includes a plurality of straight pipes 34a arranged to extend in the vertical direction, and an inflow-side common pipe formed to extend in the circumferential direction so that the upper ends of the plurality of straight pipes 34a communicate with each other. And a road 34b. One end of the inflow-side common pipe 34b is a cooling water supply port, and the other end is connected in parallel with the plurality of straight pipes 34a.
[0060]
The plurality of straight pipes 34a are respectively arranged in parallel at regular intervals B. The cooling water supplied to the plurality of straight pipes 34a via the inflow-side common pipe 34b flows from above to below at a flow rate higher than a predetermined flow rate so as to flow in a turbulent manner as described later.
[0061]
The lower ends of the plurality of straight pipes 34a are connected to two communicating pipes 36 branched in a forked shape. Since the communication pipe 36 is curved in a U-shape when viewed from the side, resistance in the pipe increases, but by branching into two communication pipes 36, pressure loss of the cooling water is reduced.
[0062]
The inner cooling path 32 includes a plurality of straight pipes 32a arranged so as to extend in the vertical direction, and an outflow side common pipe formed so as to extend in the circumferential direction so that upper ends of the plurality of straight pipes 32a communicate with each other. Road 32b. One end of the outflow-side common conduit 32b is a cooling water discharge port, and the other end is connected in parallel with the plurality of straight pipes 32a.
[0063]
The lower ends of the plurality of straight pipes 32 a of the inner cooling path 32 are respectively connected to two communication pipes 36. In the present embodiment, for example, an aluminum pipe having an outer diameter of 10 mm and an inner diameter of 8 mm is used for the inner cooling path 32 and the outer cooling path 34.
[0064]
FIG. 8 is a perspective view showing an attached state of the double cooling water pipe 38.
As shown in FIG. 8, the cooling water pipe 36 is formed such that the inner cooling path 32 forms the inner layer and the outer cooling path 34 forms the outer layer from the state where the inner cooling path 32 and the outer cooling path 34 are developed as described above. , And the communication pipe 36 is curved. Further, the inner cooling path 32 and the outer cooling path 34 are formed in an annular shape so as to surround the outer periphery of the quartz bell jar 20.
[0065]
Therefore, in the double-pipe cooling system 30 of the present invention, first, in order to eliminate the convection phenomenon in the air layer and reduce the heat leakage outside the system, the double cooling water pipe 38 is also provided at the upper end of the system. Heat recovery becomes possible.
[0066]
Further, in the double-pipe cooling system 30, a heat insulating material 40 is provided between the inner cooling path 32 and the outer cooling path 34 of the double-cooling water pipe 38 to raise the temperature of the inner surface of the double-pipe cooling system 30. As a result, heat recovery efficiency can be improved, and heat release from the outer surface of the double-tube cooling system 30 can be reduced.
[0067]
Here, the heat recovery efficiency of the double-tube cooling system 30 configured as described above will be described.
[0068]
Regarding the flow of the cooling water in the double-tube cooling system 30, cooling water equivalent to room temperature always flows to the double cooling water pipe 38 regardless of the introduced water and the discharged water. This is to reduce heat release from the double-tube cooling system 30 to the clean room atmosphere.
[0069]
In the conventional cooling system 10 described above, a large amount of cooling water for processing an enormous amount of heat is supplied to the cooling water pipe 11. Further, the temperature difference between the cooling water introduction temperature and the discharge temperature at that time was as extremely small as 4.5 ° C., for example.
[0070]
Therefore, enormous amount of electric energy is consumed as power consumed by the water pump for transporting the cooling water, and the discharged cooling water works only as a load of cooling equipment such as the refrigerator R.
[0071]
As a result, the cooling equipment has become larger, resulting in an increase in energy consumption.
For this reason, in this research, in addition to the improvement of the system, the operation method is also examined. As shown by the following equation, when the heat load amounts are equal, an inversely proportional relationship holds between the cooling water and the temperature difference between the introduction temperature and the discharge temperature.
[0072]
q = Vρw · cw · (To-Ti)
= Vρw · cw · △ T (1)
Here, q: cooling calorie (Kcal / min), V: cooling water flow rate (L / min), ρ _o : Cooling water density (kg / L), cw: specific heat of cooling water (Kcal / kg ° C), To: cooling water discharge temperature (° C), Ti: cooling water introduction temperature (° C).
[0073]
From the above equation (1), it can be seen that the temperature difference can be increased by reducing the amount of cooling water.
[0074]
In the present embodiment, the temperature of the waste water discharged from the double cooling water pipe 38 is raised to a high temperature, so that water having a high potential in temperature is returned to the equipment side. The discharged hot water is reused as heating energy at another place in the factory. As a result, it is possible to reduce the power for supplying the cooling water, reduce the load on the refrigerator equipment, and reduce the size of the cooling equipment. Here, the temperature distribution in the circumferential direction of the double cooling water pipe 38 will be described with reference to FIGS. 9 and 10.
[0075]
FIG. 9 is a cross-sectional view of the double-tube cooling system 30 as viewed from above. FIG. 10 is a graph showing the temperature distribution in the circumferential direction of the double cooling water pipe 38. The experimental results shown in FIG. 10 were obtained under the conditions where the furnace temperature was 800 ° C. and the flow rate of the cooling water was 5 L / min.
[0076]
The inner cooling path 32 and the outer cooling path 34 of the double cooling water pipe 38 are arranged in parallel in the circumferential direction as shown in FIG. 9 because a plurality of straight pipes 32a and 34a are provided in parallel at equal pitch intervals. , To supply the cooling water evenly over the entire circumference.
[0077]
Therefore, as shown in FIG. 10, in the circumferential temperature distribution where the cooling water introduction portion of the double cooling water pipe 38 is 0 °, there is no large temperature change over the entire circumference, and about 360 ° at any angle. It can be seen that the distribution stays within the range of ° C to 370 ° C.
[0078]
Here, the circumferential temperature distribution of the conventional cooling system will be described with reference to FIGS.
[0079]
FIG. 11 is a cross-sectional view of the conventional cooling system 10 as viewed from above. FIG. 12 is a graph showing a circumferential temperature distribution of the conventional cooling water pipe 11. The experimental results shown in FIG. 12 were obtained under the conditions that the furnace temperature was 800 ° C. and the flow rate of the cooling water was 5 L / min, as in the case of the present embodiment.
[0080]
As shown in FIGS. 11 and 12, in the conventional cooling system 10, when the cooling water introduction part is set to 0 (base point), the temperature decreases clockwise around an angle of 180 ° (about 225 ° C to 175 ° C). ). Further, it can be seen that the temperature rises clockwise from around 180 ° to around 360 ° (from about 175 ° C to 250 ° C).
[0081]
From this experimental result, the temperature difference between the maximum temperature part and the minimum temperature part in the circumferential direction of the conventional cooling system 10 is about 75 ° C. The temperature distribution of this experimental result is affected by the structure of the cooling system 10 and the method of introducing the cooling water. That is, it is considered that the temperature rise until the cooling water is introduced into and discharged from the cooling system 10 has caused such variation in the temperature distribution in the circumferential direction.
[0082]
This corresponds to the fact that uniform cooling is not performed on the Si wafer 18 as the heating element. As a result, there is also a concern about temperature effects due to variations in the temperature distribution on the Si wafer 18 after the formation of the thin film.
[0083]
On the other hand, in the double-tube cooling system 30 of the present invention, the variation in the temperature distribution in the circumferential direction is small, and the Si wafer 18 can be cooled uniformly over the entire circumference, as compared with the conventional one. It is. The reason why the temperature distribution by the double-tube cooling system 30 is good is that the cooling water is supplied in parallel from the plurality of parallel pipes to the circumference of the Si wafer 18 and that the inner cooling path 32 This is considered to be due to the influence of the heat insulating material 40 interposed between the outer cooling path 34 and the outer cooling path 34.
[0084]
That is, in the double-tube cooling system 30, the Si wafer 18 is uniformly cooled over the entire circumference, and thus the temperature effect on the Si wafer 18 after the thin film is formed is also uniform. Therefore, according to the double-pipe cooling system 30, the load on the air conditioning equipment for controlling the temperature to keep the temperature in the clean room constant is reduced, and the greenhouse gas (CO 2) ₂ ) Can also be reduced.
[0085]
Here, the temperature distribution in the radial direction of the double cooling water pipe 38 will be described with reference to FIGS. 13 and 14.
[0086]
FIG. 13 is a graph showing the relationship between the distance from the heat insulating material provided on the outer periphery of the heater and the temperature. FIG. 14 is a diagram showing a simplified configuration of the double-tube cooling system 30 in the radial direction. The experimental results shown in FIG. 13 show that the temperature inside the furnace was set to 800 ° C. and the flow rate of the cooling water was set to 0.5 to 7 L / min. Is shown. In FIG. 14, the horizontal axis represents the distance in the radial direction with the inner surface of the heat insulating material 24 at the outer periphery of the heater being 0 (base point).
[0087]
As shown in FIGS. 13 and 14, regardless of the difference in the flow rate of the cooling water, the inner surface temperature of the heat insulating material 24 near the heater 22 reaches approximately 920 ° C., and the outer surface temperature of the heat insulating material 24 is , About 400 ° C. Further, the inner surface temperature of the double-pipe cooling system 30 becomes about 360 ° C., and the outer surface temperature of the double-pipe cooling system 30 drops to about 60 ° C.
[0088]
Here, the temperature distribution (temperature gradient) in the radial direction of the conventional cooling system 10 will be described with reference to FIGS.
[0089]
FIG. 15 is a graph showing the relationship between the distance from a heat insulating material provided on the outer periphery of the heater and the temperature in the conventional system. FIG. 16 is a diagram showing a simplified configuration of the conventional cooling system 10 in the radial direction. In FIG. 15, the furnace temperature was set to 800 ° C. and the flow rate of the cooling water was set to O. 4 shows the change in the radial temperature of the conventional cooling system when the flow rate is 5 to 7 L / min. In FIG. 15, the horizontal axis indicates the distance in the radial direction with the inner surface of the heat insulating material 24 facing the outer periphery of the heater being 0 (base point).
[0090]
As shown in FIGS. 15 and 16, regardless of the difference in the flow rate of the cooling water, the inner surface temperature of the heat insulating material 24 reaches about 900 ° C., and the outer surface temperature of the heat insulating material 24 becomes 420 ° C. descend. Further, the inner surface temperature of the cooling system 10 becomes approximately 240 ° C., and the outer surface temperature of the cooling system 10 decreases to approximately 80 ° C.
[0091]
Comparing the experimental results of the present invention shown in FIG. 13 with the experimental results of the conventional system shown in FIG. 15, first, the cooling system outer surface temperature is 60 ° C. compared to the conventional 80 ° C. It was confirmed that the temperature could be lowered by 20 ° C., and the heat release from the outer surface of the cooling system to the clean room could be reduced.
[0092]
Furthermore, the internal temperature of the system is raised from the conventional 240 ° C. to 360 ° C. as in the present invention, so that most of the heat release from the furnace is received on the inner surface of the double-tube cooling system 30, Heat can be recovered by circulating the cooling water, and the heat recovery efficiency described later can be improved.
[0093]
Here, the reason why the heat recovery efficiency of the conventional cooling system 10 is extremely low as 20% to 30% is that the outer surface temperature of the heat insulating material 24 (about 420 ° C) is changed from the inner surface temperature of the cooling system 10 (about 240 ° C). It is conceivable that heat is not efficiently transferred to the cooling system side due to the rapid temperature drop to ()).
[0094]
Further, since the outer surface temperature of the conventional cooling system 10 is about 80 ° C., the heat received on the inner surface of the cooling system 10 is not efficiently transmitted to the cooling water, and the air is transferred from the outer surface of the cooling system 10 to the air. Since the heat is released to the clean room via the layer 50, the heat recovery efficiency is considered to be 20% to 30%.
[0095]
FIG. 17 is a graph showing an experimental result of a temperature distribution in a radial direction of the air layer 50 interposed between the heat insulating material 24 and the cooling system. In FIG. 17, the horizontal axis represents the distance in the radial direction with the outer surface of the heat insulating material 24 being 0 (base point).
[0096]
As shown in FIG. 17, it was found that the air layer 50 was composed of two layers, a high-temperature layer and a low-temperature layer, with a boundary of 5 mm from the outer surface of the heat insulating material 24. From the result of the temperature distribution, it is inferred that a thermal convection phenomenon occurs in the air layer 50.
[0097]
In addition, on the surface of the heat insulating material 24, the heat released to the air layer 50 temporarily moves upward according to the heat convection without being directly transmitted to the cooling system 10, and is cooled at a low temperature portion above the cooling system. The heat at this time is released to the outside of the cooling system 10, and it is considered that a phenomenon occurs in which the cooled air descends along the surface of the cooling system 10.
[0098]
Therefore, it is presumed that the inner surface temperature of the cooling system 10 via the air layer 50 was 240 ° C. (see FIG. 15), and the heat recovery efficiency was limited to 20 to 30%.
[0099]
Here, the heat recovery efficiency of the double-tube cooling system 30 of the present invention will be described with reference to FIGS. FIG. 21 shows the relationship between the heat recovery rate of the conventional cooling system 10 and the flow rate of the cooling water.
[0100]
FIG. 18 is a graph showing the cooling water amount of the double-tube cooling system 30 and the cooling efficiency with respect to the set temperature in the furnace. In FIG. 18, the ratio of the amount of recovered heat to the electric energy supplied to the heater 22 is represented as the cooling efficiency.
[0101]
As shown in FIG. 21, the heat recovery efficiency of the conventional cooling system 10 is about 20%. On the other hand, as shown in FIG. 18, it was confirmed that the double-tube cooling system 30 has a high heat recovery efficiency of 70 to 75% in a region where the flow rate of the cooling water is about 2 to 7 L / min. Was.
[0102]
That is, by changing to the double-tube cooling system 30, the heat recovery efficiency can be improved to about three times the conventional value.
[0103]
As shown in FIG. 19, at this time, regardless of the flow rate of the cooling water supplied to the double-tube cooling system 30, the electric energy consumed in the furnace body did not increase. This means that the heat that could not be recovered by the conventional cooling system 10 and was released to the outside through the air layer 50 or that was recovered by the other cooling system in an auxiliary manner was converted into a single double pipe type. It has become possible to collect the liquid in the cooling system 30.
[0104]
In addition, according to the double-tube cooling system 30, even if the flow rate of the cooling water is reduced to 2 L / min, the heat recovery efficiency can be maintained at about 70%. It is possible to reduce the flow rate of water. This is considered to be because the heat convection in the air layer 50 inside the double-pipe cooling system 30 was suppressed.
[0105]
However, as shown in FIG. 18, it was also confirmed that in a region where the flow rate of the cooling water was 2 L / min or less, a sharp decrease in the cooling efficiency occurred. Signs that this phenomenon occurs even in the region where the flow rate of the cooling water is 1 L / min or less in the conventional cooling system 10 can be confirmed from the graph of FIG.
[0106]
The decrease in the heat recovery efficiency in the low flow rate region can be explained by the Reynolds number Re. The Reynolds number is expressed by the fluid density ρ (kgm ³ ), The fluid flow velocity v (m / sec), the pipe diameter d (m) of the flow path, the fluid viscosity μ (Pa · sec), or the fluid flow velocity v (m / sec) as in equation (3). sec), the pipe diameter d (m) of the flow path, and the kinematic viscosity v (m ² / Sec).
[0107]
Re = ρvd / μ (2)
= Vd / v (3)
The magnitude of the Reynolds number makes it possible to determine whether the fluid (cooling water in the present embodiment) is turbulent or laminar. The Reynolds number at which the fluid transitions from a turbulent flow to a laminar flow is called a critical Reynolds number. When the Reynolds number is below a critical value, the fluid becomes laminar, and when it exceeds, it becomes turbulent. It is known that the value when the fluid flows horizontally is about 2000.
[0108]
At this time, when the fluid is exposed to heat, its thermal conductivity greatly differs depending on whether the fluid is turbulent or laminar. That is, the thermal conductivity of the double-tube cooling system 30 is governed by the Reynolds number. For example, in the case of a flow in the horizontal direction, the thermal conductivity increases when Re = 2000 or more, that is, turbulent flow, and decreases when Re = 2000 or less, that is, laminar flow.
[0109]
The transition from the turbulent flow to the laminar flow differs depending on whether the flow of the fluid is an upward flow or a downward flow. In the case of an upward flow, the critical Reynolds number tends to decrease due to the flow of the cooling water itself and the upward flow due to thermal convection. In the case of a downward flow, the opposite phenomenon occurs.
[0110]
In the conventional cooling system 10, the flow of the cooling water alternates between the upward flow and the downward flow, so that the change in the Reynolds number due to the cooling water flowing through the cooling water pipeline 11 (see FIG. 3) is mutually canceled. As in the case of the horizontal flow, the critical Reynolds number exists near 2000.
[0111]
On the other hand, in the case of the double cooling water pipe 38 of the present invention, since the portion where heat is mainly recovered is the upward flow area where the cooling water flows through the plurality of straight pipes 32a of the inner cooling path 32, the critical Reynolds number becomes smaller. It shows a tendency, and Re = around 1000. The flow rate of the cooling water corresponding to the critical Reynolds number is 1 L / min in the conventional method, and 2 L / min in the double-tube cooling system 30 of the present invention.
[0112]
For the above reasons, the double-tube cooling system 30 of the present invention can secure three times the heat recovery efficiency of the conventional system while reducing the flow rate of the cooling water to 2 L / min.
[0113]
Further, at the time of low flow rate operation in the double-pipe cooling system 30, the flow path control by the cooling water pipe line 11 and the water supply pump P4 such that the Reynolds number of the cooling water becomes Re = 1000 or more in the case of the upward flow. Need to be done.
[0114]
Here, optimization of the inner diameter of the cooling water pipe 11 used in the double-pipe cooling system 30 and the fluid flow velocity will be described.
[0115]
First, as a precondition, in the double-pipe cooling system 30, the temperature of the discharged water is 80 ° C. or more, and the heat recovery efficiency is 70%, which is the same as at 4 to 7 L / min. Determine the flow rate. When the temperature inside the furnace was maintained at 800 ° C., the power consumed by the heater 22 was 6 kW (see FIG. 19). .2 kW.
[0116]
When the cooling water at 25 ° C. is supplied to the double-tube cooling system 30 and the cooling water at 80 ° C. or more is discharged from the double-tube cooling system 30, the temperature difference Δt of the cooling water is 55 ° C or higher. The flow rate of the cooling water at that time is calculated to be about 1 L / min as described above.
[0117]
This is the minimum flow rate for maintaining the heat recovery efficiency of 70% or more in this embodiment. Therefore, when supplying 1.0 L / min of cooling water, the pipe diameter of the double-pipe cooling system 30 can be obtained as follows.
[0118]
As a method of calculating the pipe diameter of the double-pipe cooling system 30, the pipe diameter d is obtained by using the above-described equation (3) and on condition that the Reynolds number is Re = 1000 or more (turbulent flow). . When the cooling water flows in a turbulent flow, heat conduction from the inner surface of the double cooling water pipe 38 to the cooling water is performed more efficiently than in the laminar flow state.
[0119]
As a result, the pipe diameter (inner diameter) becomes 7.1 mm or less. By setting the flow rate of the cooling water at that time to be 0.05 m / sec or more, it is possible to further reduce the flow rate of the cooling water and recover high heat.
[0120]
Here, a calculation example for obtaining the minimum flow rate and the pipe diameter (inner diameter) as described above will be exemplified.
[0121]
When supplying 1.0 L / min of cooling water to the cooling system 30 of the present embodiment and calculating a flow path pipe diameter for obtaining a heat recovery efficiency of 70% or more, it is obtained using the following formula. .
[0122]
Re = vd / v ≧ 1000 (4)
v = Q / S / 60
= Q / ｛(d / 2) ² π × 8｝ / 60 (5)
Re = [Q / ｛(d / 2) ² πx8｝ / 60] d / v
≧ 1000 (6)
Q = 1.0 (L / min) (7)
ν = 3.65xlO ^-7 (M ² / Sec)… (8)
In the above equation, Re is the Reynolds number, v is the flow rate of the cooling water (m / sec), Q is the flow rate (L / min), and S is the cross-sectional area of the flow path (m ² ), Ν is the kinematic viscosity of the cooling water (m ² / Sec).
[0123]
From the calculation result of the above equation, in order to secure the heat recovery efficiency of 70% or more by setting the flow rate of the cooling water to Q = 1.0 (L / min), the pipe diameter (inner diameter) is d ≧ 7.1 (mm). , The minimum flow rate is v ≧ O. 05 (m / sec).
[0124]
FIG. 22 is a graph showing changes in cooling heat amount, electric power, and cooling water temperature difference with respect to the cooling water flow rate of the double-tube cooling system 30. FIG. 23 is a graph showing changes in cooling heat amount, electric power, and cooling water temperature difference with respect to the cooling water flow rate of the conventional cooling system 10.
[0125]
As shown in FIG. 22, in the double-pipe cooling system 30, the power is constant at approximately 6 KW regardless of the cooling water flow rate. Further, it can be seen that when the cooling water flow rate is reduced to 1.0 (L / min), the cooling water temperature difference ΔT increases to the maximum value of about 40 ° C., and the heat recovery efficiency increases.
[0126]
On the other hand, in the conventional cooling system 10, as shown in FIG. 23, the electric power is substantially constant at 6 KW regardless of the flow rate of the cooling water as in the present embodiment. Further, in the conventional cooling system 10, even if the flow rate of the cooling water is controlled to 1.0 (L / min), the cooling water temperature difference ΔT is only about 15 ° C., and the heat recovery is smaller than that of the present embodiment. It can be seen that the efficiency is low.
[0127]
Here, a modified example will be described.
FIG. 24 is a diagram illustrating a schematic configuration of Modification Example 1 of the cooling system.
As shown in FIG. 24, in the first modification, a black board (heat absorber) 52 having a high heat absorption rate is provided inside the double-tube cooling system 30. The black board 52 is formed in a cylindrical shape, and is provided so as to surround the outer periphery of the plurality of Si wafers 18 heated by the heater 22.
[0128]
The surface of the black board 52 is blackened in order to increase the heat absorption efficiency. Then, the stage 16 on which the plurality of Si wafers 18 are placed falls below the heater 22 and the elevating base 26 descends, so that the double-tube cooling system 30 and the black board 52 move the plurality of Si wafers 18 Descends to a position facing the outer periphery of.
[0129]
In this lowered state, the heat of the plurality of Si wafers 18 radiates to the inner surface of the black board 52 via the air layer 54, and the surface temperature of the black board 52 rises. The heat of the black board 52 is conducted and recovered by the cooling water flowing through the inner cooling path 32 of the double-pipe cooling system 30.
[0130]
As described above, by disposing the black board 52 having high heat absorption efficiency around the Si wafer 18 as the heating element, the heat recovery efficiency in the double-tube cooling system 30 can be further increased.
[0131]
FIG. 25 is a diagram showing a schematic configuration of Modification 2 of the cooling system.
As shown in FIG. 25, in the second modification, a black board 52 having a high heat absorption rate is provided inside the double-tube cooling system 30, and helium (He) supplied from the helium supply device 56 is supplied to the black board 52. To form a helium layer 58. Therefore, the plurality of Si wafers 18 are cooled by the double-tube cooling system 30 in a state where the inner space of the black board 52 is stored in an atmosphere filled with helium.
[0132]
Helium has a higher thermal conductivity than gas such as air, so that heat radiated from the Si wafer 18 can be efficiently transmitted to the inner surface of the black board 52. Therefore, in the second modification, since the helium layer 58 and the black board 52 are formed inside the double-tube cooling system 30, the thermal conductivity is higher than that in the first modification, and The heat recovery efficiency in the type cooling system 30 can be further increased.
[0133]
FIG. 26 is a graph showing the temperature change of the Si wafer 18 due to the cooling of the conventional method and the first and second modifications. In FIG. 26, a graph I is a graph when the Si wafer 18 is naturally cooled in a mirror-surface stainless steel and steel case. Graph II is a graph when the Si wafer 18 is cooled by the conventional forced convection cooling system. Graph III is a graph when the Si wafer 18 is cooled by the cooling system of the first modification. Graph IV is a graph when the Si wafer 18 is cooled by the cooling system of the second modification.
[0134]
Comparing the above graphs I to IV, the temperature of the Si wafer 18 heated to 800 ° C. drops only to about 180 ° C. even after 50 minutes in the conventional graph I, and the temperature of the Si wafer 18 in the conventional graph II It can be seen that the temperature drops only to about 70 ° C. even after 50 minutes.
[0135]
On the other hand, in the graph III of the first modification, the temperature of the Si wafer 18 decreases to about 40 ° C. after 40 minutes, and in the graph II of the second modification, it decreases to about 50 ° C. after 20 minutes. .
[0136]
Therefore, from the experimental results, in the case of Modifications 1 and 2, it becomes possible to cool the temperature of the Si wafer 18 from 800 ° C. to 50 ° C. in a shorter time than in the conventional method.
[0137]
FIG. 27 is a system diagram of the third modification.
As shown in FIG. 27, in the cooling equipment 60 of the third modification, the cooling water supply temperature supplied to the double-tube cooling system 30 is controlled to 23 ° C. which is the same as the room temperature of the clean room. Water is supplied to the double cooling water pipe 38 of the double pipe cooling system 30 via the water pump P4 and the water feeding line L4, and heat is recovered from the heat generating portion of the semiconductor manufacturing apparatus 14.
[0138]
At this time, in the cooling equipment 60, the discharge temperature of the cooling water supplied to the double cooling water pipe 38 of the double pipe cooling system 30 is set to 60 ° C, and the temperature difference from the supply temperature is set to 37 ° C. Control the flow rate of cooling water. In the case of this cooling facility 60, the flow rate of the cooling water supplied to the double cooling water pipe 38 is reduced to 4260 (L / hr), for example, from 54000 (L / hr) in the case of the conventional cooling system 10. I found out. As a result, the shaft power required for the water pump P4 can be further reduced as compared with the above embodiment.
[0139]
Further, the water discharged from the double cooling water pipe 38 is cooled from 60 ° C. to 23 ° C. by the heat exchanger HEX. At that time, in the heat exchanger HEX, a reheating portion or a preheating portion (not shown) of an outside air treatment device (for example, a cooling building CT or the like) requiring a heating source is used instead of the conventional cooling with cold water. The cooling water is returned to 23 ° C. by releasing heat at a heating portion (not shown) of another production apparatus.
[0140]
By adopting this method, the large-sized refrigerator R, the cold water tank CWT, the 5 ° C water pumps P2, P3, and the water lines L2, L3 required in the conventional cooling equipment 28 become unnecessary. Therefore, in the cooling equipment 60, the number of equipments and the water supply line can be reduced more than the cooling equipment 42 of the above embodiment, and the initial cost and operating cost of the cooling equipment can be greatly reduced. Is achieved.
[0141]
Further, the energy consumed by the cooling facility 60 is only 5.5 KW, and the energy consumed by the conventional cooling facility 28 can be reduced to about 1/6 of 30 KW.
[0142]
In the above embodiment, the configuration in which the cooling system of the present invention is applied to the cooling system for cooling the heat generated by the semiconductor manufacturing apparatus 14 is described as an example. However, the present invention is not limited to this. Of course, it can also be applied to
[0143]
【The invention's effect】
As described above, according to the first aspect of the present invention, there is provided a storage chamber for storing a heating element heated by a heater, and a cooling path formed so as to surround the storage chamber. In the cooling system configured to supply and cool the heating element, the cooling path includes a first path in which a plurality of pipes are arranged in parallel so as to surround the storage chamber, and a plurality of pipes. Since it is composed of a second path arranged in parallel so as to surround the outer periphery of the first path, and a plurality of communication paths communicating between the first path and the second path, the cooling water is By supplying the cooling water to a plurality of pipes arranged in parallel, the efficiency of heat recovery by the cooling water can be increased. Furthermore, by increasing the heat recovery efficiency, greenhouse gases (CO ₂ ) Can also be reduced.
[0144]
According to the second aspect of the present invention, the cooling water is supplied to the first path and the second path at a turbulent flow velocity, so that the temperature distribution in the pipes of the first path and the second path is made uniform. Heat recovery efficiency by cooling water can be increased.
[0145]
According to the third aspect of the present invention, since the cooling water is supplied to the first path and the second path at a flow rate at which the Reynolds number is 1000 or more, the cooling water is supplied to the first path and the second path in a turbulent state. And the temperature distribution in the pipes of the first path and the second path is made uniform, so that the efficiency of heat recovery by the cooling water can be increased.
[0146]
According to the invention described in claim 4, the cooling water supply unit communicates with one of the first path and the second path, and the cooling water discharge unit communicates with the other of the first path and the second path. , The temperature distribution in the pipes of the first path and the second path can be made uniform, and the efficiency of heat recovery by the cooling water can be increased.
[0147]
According to the fifth aspect of the present invention, since the heat absorber that absorbs heat is provided between the storage chamber and the first path, the heat generated in the storage chamber is absorbed by the heat absorber, and By cooling the surroundings, the heat recovery efficiency can be increased.
[0148]
According to the invention of claim 6, since the storage chamber is provided with the gas filling unit that fills the gas with high thermal conductivity, the heat generated in the storage chamber is recovered via the gas with high thermal conductivity, and the heat recovery is performed. Efficiency can be increased.
[0149]
According to the invention described in claim 7, since the heat insulating material is interposed between the first path and the second path, heat conduction between the first path and the second path is suppressed, and It is possible to prevent heat from the storage room from being conducted to the surroundings.
[0150]
According to the eighth aspect of the present invention, since the first path includes the outflow-side common pipe that communicates the outflow-side ends of the plurality of pipes, the cooling water that has passed through the plurality of pipes is simultaneously discharged. Heat recovery efficiency can be increased.
[0151]
According to the ninth aspect of the present invention, since the second path includes the inflow-side common pipe connecting the inflow-side ends of the plurality of pipes, the cooling water is simultaneously supplied to the plurality of pipes to recover heat. Efficiency can be increased.
[0152]
According to the tenth aspect of the present invention, in order to supply the cooling water that has flowed out of the outflow-side common pipe to the heat exchanger, the cooling water that has passed through the first path and the second path and that has risen in temperature is heated. Heat recovery efficiency can be increased by cooling the heat exchanger and supplying it to the first path and the second path.
[0153]
According to the eleventh aspect of the present invention, since the cooling water is supplied to the inflow-side common pipe at a turbulent flow velocity, the temperature distribution in the pipes of the first path and the second path is made uniform so that the heat generated by the cooling water becomes uniform. Recovery efficiency can be increased.
[0154]
According to the twelfth aspect of the present invention, since the plurality of conduits are arranged in parallel at predetermined intervals so as to face the storage chamber, the entire circumference of the storage chamber can be uniformly cooled to enhance the heat recovery efficiency. it can.
[0155]
According to the thirteenth aspect, since the plurality of communication paths are arranged in parallel so as to branch from respective ends of the plurality of pipes, the cooling water from the first path via the plurality of communication paths. Is supplied to the plurality of conduits in the second path, so that the entire circumference of the storage chamber can be uniformly cooled to increase the heat recovery efficiency.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view showing a schematic configuration of a semiconductor manufacturing apparatus to which a conventional cooling system is attached.
FIG. 2 is a system diagram showing an example of a cooling facility to which a conventional cooling system 10 is applied.
FIG. 3 is a development view showing a cooling water path 11 used in the conventional cooling system 10.
FIG. 4 is a perspective view showing an attached state of a cooling water pipe 11;
FIG. 5 is a longitudinal sectional view showing one embodiment of a cooling system according to the present invention.
FIG. 6 is a system diagram showing an example of a cooling facility to which the double-pipe cooling system 30 of the present invention is applied.
FIG. 7 is a development view showing a double cooling water path 38 used in the double pipe cooling system 30.
FIG. 8 is a perspective view showing an attached state of a double cooling water pipe 38.
FIG. 9 is a cross-sectional view of the double-tube cooling system 30 as viewed from above.
FIG. 10 is a graph showing a temperature distribution in a circumferential direction of a double cooling water pipe 38;
FIG. 11 is a cross-sectional view of the conventional cooling system 10 as viewed from above.
FIG. 12 is a graph showing a circumferential temperature distribution of a conventional cooling water pipe 11;
FIG. 13 is a graph showing the relationship between the distance from a heat insulating material provided on the outer periphery of the heater and the temperature.
FIG. 14 is a diagram schematically illustrating a configuration of a double-tube cooling system 30 in a radial direction.
FIG. 15 is a graph showing the relationship between the distance from a heat insulating material provided on the outer periphery of the heater and the temperature in the conventional system.
FIG. 16 is a diagram schematically illustrating a configuration of a conventional cooling system 10 in a radial direction.
FIG. 17 is a graph showing an experimental result of a temperature distribution in a radial direction of an air layer 50 interposed between the heat insulating material 24 and the cooling system.
FIG. 18 is a graph showing the cooling water amount of the double-tube cooling system 30 and the cooling efficiency with respect to the furnace set temperature.
FIG. 19 is a graph showing a relationship between heater temperature and electric power when the double-tube cooling system 30 is used.
FIG. 20 is a graph showing the relationship between the flow rate of cooling water and the Reynolds number.
FIG. 21 is a graph showing the relationship between the heat recovery rate of the conventional cooling system 10 and the flow rate of cooling water.
FIG. 22 is a graph showing changes in cooling heat amount, electric power, and cooling water temperature difference with respect to the cooling water flow rate of the double-tube cooling system 30.
FIG. 23 is a graph showing changes in cooling heat amount, electric power, and cooling water temperature difference with respect to the cooling water flow rate of the conventional cooling system 10.
FIG. 24 is a diagram illustrating a schematic configuration of a modification 1 of the cooling system.
FIG. 25 is a diagram showing a schematic configuration of Modification 2 of the cooling system.
FIG. 26 is a graph showing a temperature change of the Si wafer 18 due to cooling in the conventional method and the first and second modifications.
FIG. 27 is a system diagram of a third modification.
[Explanation of symbols]
12 Reaction chamber
14 Semiconductor manufacturing equipment
16 stages
18 Si wafer
20 Quartz bell jar
22 Bar heater
24 Insulation
26 Elevating base
30 Double tube cooling system
32 Inside cooling path
34 Outside cooling path
36 connecting passage
38 Double cooling water line
40 Insulation
42,60 cooling equipment
50,54 Air layer
52 Black Board
56 Helium supply device
58 helium layer

Claims (13)

A cooling system comprising a storage chamber for storing a heating element, and a cooling path formed to surround the storage chamber, and configured to supply cooling water to the cooling path to cool the heating element. ,
The cooling path is
A first path in which a plurality of conduits are arranged in parallel so as to surround the storage chamber;
A second path in which a plurality of conduits are arranged in parallel so as to surround an outer periphery of the first path;
A plurality of communication paths communicating between the first path and the second path;
A cooling system characterized by comprising: 2. The cooling system according to claim 1, wherein the cooling water supply unit supplies the cooling water to the first path and the second path at a turbulent flow velocity. 3. The cooling system according to claim 1, wherein the cooling water supply unit supplies the cooling water to the first path and the second path at a flow rate at which the Reynolds number is 1000 or more. The cooling water supply unit communicates with one of the first path and the second path,
The cooling system according to claim 1, wherein the cooling water discharge unit communicates with one of the first path and the second path. The cooling system according to claim 1, wherein a heat absorber that absorbs heat is provided between the storage chamber and the first path. The cooling system according to claim 1, further comprising a gas filling unit that fills the storage chamber with a gas having high thermal conductivity. The cooling system according to claim 1, wherein a heat insulating material is interposed between the first path and the second path. The first path is:
The cooling system according to claim 1, further comprising an outflow-side common pipe communicating the outflow-side ends of the plurality of pipes. The second path is
The cooling system according to claim 1, further comprising an inflow-side common pipe communicating the inflow-side ends of the plurality of pipes. 9. The cooling system according to claim 8, wherein the cooling water discharge section supplies the cooling water discharged from the outflow common pipe to a heat exchanger. The cooling system according to claim 9, wherein the cooling water supply unit supplies the cooling water to the inflow-side common pipe at a turbulent flow velocity. The cooling system according to claim 1, wherein the plurality of conduits are arranged in parallel so as to face the storage chamber at predetermined intervals. 2. The cooling system according to claim 1, wherein the plurality of communication paths are arranged in parallel so as to branch from respective ends of the plurality of conduits. 3.

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