JP2004088791A - 半導体集積回路 - Google Patents

半導体集積回路 Download PDF

Info

Publication number
JP2004088791A
JP2004088791A JP2003323904A JP2003323904A JP2004088791A JP 2004088791 A JP2004088791 A JP 2004088791A JP 2003323904 A JP2003323904 A JP 2003323904A JP 2003323904 A JP2003323904 A JP 2003323904A JP 2004088791 A JP2004088791 A JP 2004088791A
Authority
JP
Japan
Prior art keywords
frequency band
pin
input
amplifier
noise amplifier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003323904A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004088791A5 (https=
Inventor
Kumiko Takigawa
滝川　久美子
Satoshi Tanaka
田中　聡
Takashi Hashimoto
橋本　孝
Yoshiyuki Okabe
岡部　義行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2003323904A priority Critical patent/JP2004088791A/ja
Publication of JP2004088791A publication Critical patent/JP2004088791A/ja
Publication of JP2004088791A5 publication Critical patent/JP2004088791A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Amplifiers (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2003323904A 2003-09-17 2003-09-17 半導体集積回路 Pending JP2004088791A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003323904A JP2004088791A (ja) 2003-09-17 2003-09-17 半導体集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003323904A JP2004088791A (ja) 2003-09-17 2003-09-17 半導体集積回路

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP11107545A Division JP2000299438A (ja) 1999-04-15 1999-04-15 半導体集積回路

Publications (2)

Publication Number Publication Date
JP2004088791A true JP2004088791A (ja) 2004-03-18
JP2004088791A5 JP2004088791A5 (https=) 2006-06-08

Family

ID=32064542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003323904A Pending JP2004088791A (ja) 2003-09-17 2003-09-17 半導体集積回路

Country Status (1)

Country Link
JP (1) JP2004088791A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007208373A (ja) * 2006-01-31 2007-08-16 Sharp Corp 半導体集積回路装置及びこれを用いたチューナ装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007208373A (ja) * 2006-01-31 2007-08-16 Sharp Corp 半導体集積回路装置及びこれを用いたチューナ装置

Similar Documents

Publication Publication Date Title
US7369817B2 (en) Semiconductor integrated circuit
JP4012840B2 (ja) 半導体装置
US7274923B2 (en) Wireless communication system
KR102302911B1 (ko) 전력 증폭 모듈
US9979360B1 (en) Multi baseband termination components for RF power amplifier with enhanced video bandwidth
KR100750449B1 (ko) 반도체 장치
US6169461B1 (en) High-frequency oscillating circuit
US20070202832A1 (en) Wireless communication system
JP2007259464A (ja) 半導体集積回路
JP2004088791A (ja) 半導体集積回路
JP2004134506A (ja) 高周波半導体装置および無線通信端末機器
JPH0964646A (ja) 高周波フロントエンド回路及び半導体装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040225

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040225

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060414

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060414

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20060414

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090319

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20090806