JP2004063796A - Rear face cleaning device of plate-like angular substrate - Google Patents

Rear face cleaning device of plate-like angular substrate Download PDF

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JP2004063796A
JP2004063796A JP2002220240A JP2002220240A JP2004063796A JP 2004063796 A JP2004063796 A JP 2004063796A JP 2002220240 A JP2002220240 A JP 2002220240A JP 2002220240 A JP2002220240 A JP 2002220240A JP 2004063796 A JP2004063796 A JP 2004063796A
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substrate
cleaning
cleaning liquid
holding
held
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JP2002220240A
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Japanese (ja)
Inventor
Kosaku Saino
才野 耕作
Atsushi Kawada
川田 厚志
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Tatsumo Kk
タツモ株式会社
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a rear face cleaning device of a plate-like angular substrate, wherein a central part of a rear face of the substrate is held pure while an end edge of the rear face is cleaned, thereby intending to enhance a production yield of a substrate process and decrease a consumed quantity of a cleaning fluid. <P>SOLUTION: A central region of a recess 20 of a reduced approximate shape of a substrate W formed on an upper surface 2a of a substrate holding means 2 is shielded by a shielding plate 1, and a groove 2c as a substantially annular recess region comprising the outside of the shielding plate 1 and the inside of the recess as viewed from above is structured. If the substrate holding means 2 is rotated at an appropriate speed, and a fixed quantity of a cleaning fluid 5 satisfying the groove 2c is discharged, the cleaning fluid stays and is held by the groove 2c by a centrifugal force and a surface tension. The cleaning fluid is stationarily contact to a pollutant of a four peripheral end edge part on the rear face of the substrate, thereby cleaning and reducing the consumed quantity of the cleaning fluid. The cleaning fluid is prevented from permeating into a center of the rear face of the substrate by the centrifugal force. After the pollutant is dissolved, the cleaning fluid is scattered to outside of the substrate,and the central part of the rear face of the substrate is help pure. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は、遠心力により基板表面上に塗布処理又は化学処理を施す基板処理装置に適用された、基板裏面四周部の汚染物質を洗浄除去するための、裏面洗浄装置に関するものである。
【0002】
【従来の技術】
従来から、半導体や液晶ディスプレイの製造工程において、シリコンウェーハ、フォトマスク用ガラス角基板、液晶用ガラス角基板等の被処理基板表面上にフォトレジスト膜(感光性樹脂の一例)を形成する工程、及び前記フォトレジスト膜へ所定のパターンを露光後、現像液による化学処理を行い感光部分のフォトレジスト膜を除去する現像処理工程が行われている。この中で、回転塗布法等によるフォトレジスト膜の形成工程及び現像処理工程では、一般に膜厚及び基板面積に対して必要以上の液量の薬液が基板上に滴下される。これは、基板間で処理品質の安定化を図るためであるが、弊害として、基板を回転して基板面内に成膜材料等を均等に広げる際、余剰な薬液が被処理基板の側面から裏面端縁部に廻り込む問題がある。裏面に付着した薬液が乾燥固化して剥離し、次工程に向かう基板表面や次に処理される基板表面に付着すると、重大な欠陥を生じることがある。このため、例えば、基板側面及び表面端縁部の余分なフォトレジスト膜については、成膜処理後、同一処理装置内で、薬液の主溶媒を洗浄液として用いた溶解除去法等による端面剥離(EBR:Edge Bead Remover)処理が実施される。また、裏面側に廻り込み、付着したレジストについては、従来、前記端面剥離処理時に基板側面及び表面端縁部と同様に溶解除去する手法や、回転塗布装置における基板保持手段の中心部に備えられた、洗浄液吐出ノズルから洗浄液を吐出しながら基板を回転し、基板裏面を洗浄する手法等が知られている。
【0003】
例えば、一般的なEBRとして知られている手法では、図7(a)に示されるように、洗浄ノズル12の略コの字形状の凹部が被処理基板Wの端縁部上面、側面、及び裏面に近接するように配される。被処理基板Wと洗浄ノズル12の凹部間に形成される間隙に洗浄液5が満たされることにより、基板端縁部上面、側面、及び裏面の余分なレジスト膜7aが、レジストの主溶媒による静的溶解というレジスト材料の化学反応性により溶解除去される。
【0004】
また、裏面側のレジスト処理としては、図8(a)〜(c)に示されるように、洗浄液吐出ノズル部40を基板保持手段2の中央に設けたものが知られている。この図に示される3つの例は、基板保持手段2の中心軸(回転軸)に空けられた貫通穴に洗浄液吐出ノズル3を挿通し、ノズル3の頂部に洗浄液吐出ノズル部40を設けたものである。それぞれ、中心軸下方から洗浄液5が導入され、被処理基板Wの裏面中央周辺又は裏面端部において、洗浄液吐出口4から被処理基板W裏面に向けて洗浄液5が吐出される。このとき、洗浄液5の吐出と共に被処理基板Wが基板保持手段2に保持されて回転することにより、被処理基板Wの裏面がほぼ全面に亘って、洗浄液5に動的に接液し、基板裏面のレジスト膜7a又は汚染物質が洗浄除去される(例えば、特開平04−066159号公報参照)。
【0005】
【発明が解決しようとする課題】
しかしながら、上記のEBRによる従来手法では、基板裏面端縁部のごく限られた領域(幅)の洗浄しかできない問題点がある。例えば、レジスト材料が基板裏面へ廻り込む幅は、材料の物性(表面張力、粘性係数等)やレジスト膜形成の条件により様々に変化するが、その都度、基板裏面の接液幅を変えることは、非常に困難である。このため、図7(b)に示されるように、被処理基板Wの側面のレジスト7cは除去されるが、洗浄ノズル12の凹部から外れた場所のレジスト7bが残留することがある。このような溶け残り(レジスト7b)が発生した場合、これを除去する後工程がないため、裏面洗浄不良により製品の歩留りが下がる問題もある。また、上記の基板裏面中央に設けた洗浄液吐出ノズル40を用いる方法は、基板裏面のほぼ全面に洗浄液を動的に接液させて洗浄するため、処理中終始、洗浄液を吐出する必要があり、洗浄液の消費量が膨大になる問題点がある。また、被処理基板Wの裏面中央部に向かって洗浄液5を吐出する場合、基板裏面中央部に吐出された洗浄液に作用する遠心力が小さいため、洗浄液の吐出停止後も洗浄液が液滴状に基板裏面に付着して残り、これが乾燥すると液滴跡が形成されるため、却って裏面を汚染する問題がある。
【0006】
本発明は、上記の課題を解消するものであって、フォトマスク用ガラス角基板、液晶用ガラス角基板等の平板状角形の被処理基板の裏面四周端縁部に廻り込んで付着する塗布剤や、処理液溶質成分等の基板汚染物質を、基板裏面中央部を清浄に保ち、基板裏面四周端縁部の汚染物質を溶解・洗浄除去し、基板処理工程における歩留りを向上させると共に、洗浄液消費量を大幅に低減させる平板状角基板の裏面洗浄装置を提供することを目的とする。
【0007】
【課題を解決するための手段及び発明の効果】
上記の課題を達成するために、請求項1の発明は、平板状角型基板を水平に保持して回転する基板保持手段が処理容器内に備えられ、この基板保持手段に保持した基板上に滴下した液状物質を遠心力により基板表面上に広げて塗布処理又は化学処理を施す基板処理装置に適用され、前記基板処理時に前記液状物質が前記基板の裏面四周部に廻り込んで形成した汚染物質を洗浄除去する裏面洗浄装置において、前記基板保持手段の上面に、前記基板の略縮小近似形の凹部が形成されると共に前記基板保持手段の中心に貫通孔が形成され、前記基板保持手段により保持された基板の下面と前記凹部の底面とに挟まれる空間に位置し、前記凹部の底面に対し間隙をおいて該底面に固定された略円形の遮蔽板と、前記貫通孔に挿通して前記遮蔽板の直下に配置した略円筒形状の洗浄液吐出ノズルとを備え、前記洗浄液吐出ノズルの洗浄液吐出口から吐出した洗浄液が前記基板保持手段により保持されて回転する基板の裏面四周部に接液して洗浄するものである。
【0008】
上記構成の平板状角型基板の裏面洗浄装置においては、基板保持手段上面に形成された凹部の中央部領域が遮蔽板により遮蔽され、上から見て遮蔽板の外部かつ凹部内部からなる略リング状の凹部領域である溝部が構成されるので、基板保持手段を適切な回転速度で回転し、遮蔽板の直下に配置された洗浄液吐出ノズルから上方に向かって、前記リング状の溝部を満たす一定量の洗浄液を吐出すれば、遠心力及び表面張力により、その洗浄液を溝部に停留保持することができる。このように、洗浄液を停留保持して、遮蔽板より露出した基板裏面の四周端縁部に洗浄液を静的に接液させることができるので、必要最少の洗浄液により効率的に、基板裏面における汚染物質を溶け残しなく洗浄除去することができ、洗浄液消費量の大幅な低減が可能である。また、停留保持された洗浄液に作用する遠心力により、洗浄液が基板裏面と遮蔽板上面との間隙を内側に向かって浸透しないように防止することができ、さらに、汚染物質溶解後に、基板保持手段と基板とを高速回転して停留洗浄液に動的な遠心力を付加して洗浄液を基板の外部方向に飛散除去できるので、もともと清浄な基板裏面中央部を汚染することがない。基板裏面中央部を清浄にたもつと共に、基板裏面四周端縁部の汚染物質のみを確実に溶解・洗浄して除去するので、基板処理工程での歩留りを向上させることができる。
【0009】
請求項2の発明は、平板状角型基板を水平に保持して回転する基板保持手段が処理容器内に備えられ、この基板保持手段に保持した基板上に滴下した液状物質を遠心力により基板表面上に広げて塗布処理又は化学処理を施す基板処理装置に適用され、前記基板処理時に前記液状物質が前記基板の裏面四周部に廻り込んで形成した汚染物質を洗浄除去する裏面洗浄装置において、前記基板保持手段の上面に、前記基板の略縮小近似形の凹部が形成されると共に前記基板保持手段の中心に貫通孔が形成され、洗浄液吐出口を側面に有した略円盤形状の洗浄液吐出ノズルが、前記基板保持手段により保持された基板の下面と前記凹部の底面とに挟まれる空間に、前記基板保持手段と中心軸を一致して配設され、前記洗浄液吐出ノズルの洗浄液吐出口から吐出した洗浄液が前記基板保持手段により保持されて回転する基板の裏面四周部に接液して洗浄するものである。
【0010】
上記構成の平板状角型基板の裏面洗浄装置においては、基板保持手段を適切な回転速度で回転し、略円盤形状の洗浄液吐出ノズル(以下、円盤形状ノズル)の側面の洗浄液吐出口から、基板保持手段上面に形成された凹部と前記円盤形状ノズルとから構成された略リング形状の溝部を満たす一定量の洗浄液を吐出すれば、遠心力及び表面張力により、その洗浄液を溝部に停留保持することができる。このように、洗浄液を停留保持して、上から見て円盤形状ノズルの外形より外にある基板裏面の四周端縁部に静的に接液させることができるので、必要最少の洗浄液により効率的に、基板裏面における汚染物質を溶け残しなく洗浄除去することができ、洗浄液消費量の大幅な低減が可能である。また、停留保持された洗浄液に作用する遠心力により、洗浄液が基板裏面と円盤形状ノズルとの間隙を内側に向かって浸透しないように防止することができ、さらに、汚染物質溶解後に、基板保持手段と基板とを高速回転して停留洗浄液に動的な遠心力を付加して洗浄液を基板の外部方向に飛散除去できるので、もともと清浄な基板裏面中央部を汚染することがない。基板裏面中央部を清浄にたもつと共に、基板裏面四周端縁部の汚染物質のみを確実に溶解・洗浄して除去するので、基板処理工程での歩留りを向上させることができる。
【0011】
【発明の実施の形態】
以下、本発明の一実施形態に係る平板状角型基板の裏面洗浄装置について、図1乃至図4を参照して説明する。図面中の共通する部材には同一符号を付して重複説明を省略する。裏面洗浄装置は、図1に示されるように、基板処理装置100の中央に、ベアリングBで回転自在に支持された基板保持手段2に適用して構成されている。基板処理装置100は、略軸対称の構造をしており、整流筒10、上部処理容器8、下部処理容器9、及び排気/廃液口11を備え、前記の基板保持手段2は、基板保持手段下部21を介して、図示しない回転駆動機構に接続され、例えば矢印Rの方向に回転される。また、図2(a)に示されるように、基板保持手段2の上面にある複数の位置決めピン6が、平板状角型基板(以下、基板)Wの4隅を支えて回転時にこれを保持する。この基板保持手段2に保持された基板W上にフォトレジスト又は現像液等の液状物質が滴下されると共に、遠心力により基板表面上に広げられることにより、レジスト塗布処理又は現像化学処理等が基板表面に施される。このような基板処理装置による基板処理時に、前記液状物質が基板の裏面四周部に廻り込んで形成した汚染物質が、基板保持手段2に適用した裏面洗浄装置により、洗浄除去される。
【0012】
裏面洗浄装置は、図2(b)(c)に示されるように、基板Wの裏面中央に洗浄液5が当たるのを防止する円盤形状の遮蔽板1を備えている。遮蔽板1は、基板Wの裏面(下面)と基板保持手段2の上面2aに形成された凹部20の底面2bとが成す空間に納まっている。また、遮蔽板1は、凹部20の底面2bに対して所定の隙間を付して、遮蔽板取付ねじ1aにより底面2bに固定されている。従って、この遮蔽板1は基板保持手段2と共に回転する。凹部20は、図2(a)、図3、及び図4に示されるように、基板Wを縮小した外形形状(略縮小近似形)をしており、また、例えば図2(b)に示されるように、この凹部20は、基板保持手段2の中心部ほど深くなり、基板保持手段2の中心軸上に形成された貫通孔につながっている。この貫通孔には、中心軸を一致して略円筒形状の洗浄液吐出ノズル3が挿通配置され、洗浄液吐出ノズル3の底部は、基板処理装置100の固定部に固定されると共に、図示しない洗浄液供給部に接続されている。従って、この洗浄液吐出ノズル3は回転しない。洗浄液吐出ノズル3の上部には、前記遮蔽板1の直下にあって、斜め上方に向かって洗浄液吐出口4が複数設けられている。裏面洗浄装置の稼働時には、洗浄液吐出口4から吐出される洗浄液は、遮蔽板1の下面と凹部20の底面2bとのなす間隙を通って、吐出圧及び遠心力により外方へと導かれる。なお、遮蔽板1の平面形状は、角型の被処理基板の縮小相似形状を呈してもよく、また、基板保持手段2の上面2aに設けられる凹部20の平面形状は、被処理基板の縮小近似形に固執する必要はなく、例えば図4に示されるように、主旨を逸脱しない範囲で、複数の曲線で構成される異形状を呈しても良い。
【0013】
次に、基板処理装置100を用いた基板処理(回転塗布)、及び裏面洗浄装置を用いて行われる裏面洗浄処理について、前述の図1を参照して、説明する。まず、整流筒10が図示されない昇降手段により上昇し、ロボットハンド等(図示なし)により、基板Wが上部処理容器8上面に形成された開口を通して搬入され、基板保持手段2に中心軸を一致させて載置される。ここで、基板Wは、基板保持手段2に同期して回転するように、位置決めピン6により保持される。次に、基板保持手段2が静止した状態で、図示されない薬液供給手段により、塗布液が基板W上面中心部に滴下される。薬液供給手段が基板W上方より退避後、整流筒10が下降して上部処理容器8上面に載置されると、基板保持手段2が所定の回転速度で、図示されない電動機及びその動力を出力軸に伝達する機構によって回転し、遠心力の作用により塗布処理が行なわれる。一般に、塗布薬液を基板W上に滴下する際、仕上がり塗布膜厚及び基板面積から計算される量以上の薬液が供給される。これは、基板間における処理品質の安定化を図る目的によるが、余剰薬液が基板Wの側面から、裏面に廻り込む原因となっている。
【0014】
続いて、上記の塗布処理終了後、低速で基板保持手段2、従って被処理基板Wを回転させつつ、洗浄液吐出ノズル3上部に形成された吐出口4より、前記塗布薬液の主溶媒から構成される洗浄液5を定量吐出する。吐出口4より吐出された洗浄液5は、吐出圧及び、遠心力の作用により、遮蔽板1の下面と基板保持手段2の凹部底面2bとによって形成される間隙を通して中心から遠ざかる方向に送液され、凹部20の一部かつ遮蔽板1の外部として定義される溝部2cに達し、略リング形状に停留保持される。この状態で、洗浄液5は、凹部20の底面2bから臨んで遮蔽板1により遮蔽されずに露出して見える基板Wの裏面四周端縁部に、静的に接液しており、基板裏面に廻り込んだ塗布剤が効率的に溶解除去される。また、洗浄液には、基板W及び基板保持手段2の回転による遠心力が半径方向外方に作用しているため、基板W裏面と遮蔽板1上面との間隙において、中心方向へ洗浄液が浸透し、清浄な基板裏面に接液することが防止される。洗浄液に遠心力が作用することは、溝部2cにおいて洗浄液の液面を盛り上げ、その液面を保持する効果を生む。その結果、基板Wの下面と遮蔽板1の上面の間隔を極端に狭くする必要がなくなるため、この間に毛細管現象による洗浄液の進入が防止でき、また、装置構成における機械公差にゆとりを持たすことができる。
【0015】
続いて、裏面の塗布剤が溶解除去された後、低速回転していた基板保持手段2の回転を高速回転に移行させて、前記停留保持されている洗浄液に作用する遠心力を大きくし、塗布剤溶質成分が含まれる処理済み洗浄液を基板保持手段2から振り切らせる。この際、処理済洗浄液がミスト状に飛散するので、下部処理容器9に配される排気/廃液口11を通して処理容器外に排出する。続いて、基板保持手段2の回転を止め、基板Wを基板処理装置100から搬出して、基板の回転塗布処理及び裏面洗浄処理が終了する。
【0016】
次に、本発明の他の実施形態に係る平板状角型基板の裏面洗浄装置について、図5及び図6を参照して説明する。これらの図に示される裏面洗浄装置は、上述の裏面洗浄装置における略円筒形状の洗浄液吐出ノズル3が、前記の遮蔽板1と一体となって略円盤形状の洗浄液吐出ノズル3を構成したものである。洗浄液吐出ノズル3の上部にある円盤形状部分の側面に、やや上方に向っている複数の洗浄液吐出口4を有している。裏面洗浄処理時に、洗浄液吐出口4から吐出された洗浄液が、吐出圧及び、遠心力の作用により、基板W裏面において、少なくとも洗浄液吐出ノズル3の円盤形状部分の直径以上の領域に接液し、基板裏面へ廻り込んだ塗布剤が溶解除去される。この場合、洗浄液吐出ノズル3及びその上部の円盤形状部分は、基板保持手段2が回転する時も回転せずに静止している。この実施形態の裏面洗浄装置を用いた裏面洗浄処理は、上記同様であり、説明は省略する。
【0017】
なお、本発明は、上記構成に限られることなく種々の変形が可能である。例えば、洗浄液吐出ノズルは、基板の回転時に回転するようにしてもよい。また、図5及び図6で示した洗浄液吐出ノズルの洗浄液吐出口は、円盤形状部分の側面に限らず側面周辺にあってもよい。本発明の裏面洗浄装置を適用する平板状角型基板は、四角形に限らず、多角形でもよい。
【図面の簡単な説明】
【図1】本発明の一実施形態による平板状角型基板の裏面洗浄装置を適用した回転塗布装置の側方断面図。
【図2】(a)は同上装置のA1−A1線矢視平面図、(b)は前図のB1−B1線断面図、(c)は同B2−O−B2線断面図。
【図3】同上装置を構成する基板保持手段の外観斜視図。
【図4】同基板保持手段の他の例を示す外観斜視構成図。
【図5】本発明の他の実施形態による平板状角型基板の裏面洗浄装置。
【図6】同上装置を構成する基板保持手段の外観斜視図。
【図7】(a)は従来の裏面洗浄装置の形態を示す側方断面図、(b)は同従来装置による洗浄結果を説明する基板断面図。
【図8】(a)は従来の裏面洗浄装置の側方断面図、(b)は従来の他の裏面洗浄装置の側方断面図、(c)は同装置に用いられる洗浄液吐出ノズル部の斜視図、(d)は従来のさらに他の裏面洗浄装置の側方断面図、(e)は同装置に用いられる洗浄液吐出ノズル部の斜視図。
【符号の説明】
W 被処理基板(基板)
1 遮蔽板
2 基板保持手段
3 洗浄液吐出ノズル
4 洗浄液吐出口
5 洗浄液
7a 塗布膜
[0001]
TECHNICAL FIELD OF THE INVENTION
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a back surface cleaning apparatus for cleaning and removing contaminants on four peripheral portions of a back surface of a substrate, which is applied to a substrate processing apparatus that performs a coating process or a chemical process on a substrate surface by centrifugal force.
[0002]
[Prior art]
Conventionally, in a process of manufacturing a semiconductor or a liquid crystal display, a process of forming a photoresist film (an example of a photosensitive resin) on a surface of a substrate to be processed such as a silicon wafer, a glass square substrate for a photomask, and a glass square substrate for a liquid crystal; Further, a development processing step of exposing the photoresist film to a predetermined pattern and performing a chemical treatment with a developer to remove the photoresist film in the photosensitive portion is performed. In the process of forming a photoresist film by a spin coating method or the like and the developing process, in general, a chemical solution having a liquid amount larger than necessary for the film thickness and the substrate area is dropped on the substrate. This is to stabilize the processing quality between the substrates, but as an adverse effect, when the substrate is rotated to spread the film-forming material and the like evenly within the substrate surface, an excessive chemical solution is applied from the side of the substrate to be processed. There is a problem of wrapping around the back edge. If the chemical liquid attached to the back surface is dried and solidified and peels off, and adheres to the substrate surface going to the next step or the substrate surface to be processed next, serious defects may occur. For this reason, for example, with regard to an excess photoresist film on the side surface of the substrate and the edge of the surface, after film formation processing, in the same processing apparatus, end surface peeling (EBR) by a dissolution removal method or the like using a main solvent of a chemical solution as a cleaning liquid. : Edge Bead Remover) processing is performed. In addition, the resist that wraps around and adheres to the back side is conventionally provided by dissolving and removing the resist in the same manner as the side surface and the edge of the surface during the end surface peeling process, or provided at the center of the substrate holding means in the spin coating apparatus. In addition, a method of rotating a substrate while discharging a cleaning liquid from a cleaning liquid discharge nozzle to clean the back surface of the substrate is known.
[0003]
For example, in a method known as a general EBR, as shown in FIG. 7A, a substantially U-shaped concave portion of the cleaning nozzle 12 includes an upper surface, a side surface, and an edge portion of the substrate W to be processed. It is arranged to be close to the back surface. By filling the gap formed between the substrate W to be processed and the concave portion of the cleaning nozzle 12 with the cleaning liquid 5, the excess resist film 7 a on the upper surface, the side surface, and the rear surface of the edge of the substrate becomes static by the main solvent of the resist. It is dissolved and removed by the chemical reactivity of the resist material called dissolution.
[0004]
Further, as the resist processing on the back side, as shown in FIGS. 8A to 8C, a processing in which a cleaning liquid discharge nozzle unit 40 is provided at the center of the substrate holding means 2 is known. In the three examples shown in this figure, the cleaning liquid discharge nozzle 3 is inserted into a through hole formed in the center axis (rotation axis) of the substrate holding means 2, and a cleaning liquid discharge nozzle section 40 is provided at the top of the nozzle 3. It is. The cleaning liquid 5 is introduced from below the central axis, and the cleaning liquid 5 is discharged from the cleaning liquid discharge port 4 toward the rear surface of the substrate W around the center of the rear surface of the substrate W or at the edge of the rear surface. At this time, the substrate W to be processed is held by the substrate holding means 2 and rotated together with the discharge of the cleaning liquid 5, so that the back surface of the substrate W to be processed comes into contact with the cleaning liquid 5 almost over the entire surface, and The resist film 7a on the back surface or the contaminants are removed by washing (for example, see Japanese Patent Application Laid-Open No. 04-066159).
[0005]
[Problems to be solved by the invention]
However, the conventional method using the above-described EBR has a problem that only a very limited area (width) of the edge of the rear surface of the substrate can be cleaned. For example, the width of the resist material flowing around the back surface of the substrate varies depending on the physical properties (surface tension, viscosity coefficient, etc.) of the material and the conditions for forming the resist film. , Very difficult. For this reason, as shown in FIG. 7B, the resist 7c on the side surface of the substrate to be processed W is removed, but the resist 7b may be left at a position outside the recess of the cleaning nozzle 12. When such undissolved residue (resist 7b) is generated, there is no post-process to remove it, and there is also a problem that the yield of the product is reduced due to defective back surface cleaning. Further, in the method using the cleaning liquid discharge nozzle 40 provided at the center of the back surface of the substrate, it is necessary to discharge the cleaning liquid throughout the processing, because the cleaning liquid is dynamically brought into contact with almost the entire back surface of the substrate for cleaning. There is a problem that the consumption of the cleaning liquid is enormous. Further, when the cleaning liquid 5 is discharged toward the center of the back surface of the substrate W to be processed, the cleaning liquid is in a droplet form even after the discharge of the cleaning liquid is stopped because the centrifugal force acting on the cleaning liquid discharged to the center of the back surface of the substrate W is small. There is a problem that the ink remains on the back surface of the substrate, and when it dries, droplet traces are formed.
[0006]
An object of the present invention is to solve the above-mentioned problems, and to provide a coating agent that wraps around and adheres to the four peripheral edges of the rear surface of a flat rectangular substrate to be processed such as a glass square substrate for a photomask or a glass square substrate for a liquid crystal. In addition, substrate contaminants such as solute components in the processing liquid are kept clean at the center of the back surface of the substrate, and contaminants on the four peripheral edges of the back surface of the substrate are dissolved and washed away, thereby improving the yield in the substrate processing process and consuming the washing liquid. It is an object of the present invention to provide an apparatus for cleaning the back surface of a flat rectangular substrate whose amount is greatly reduced.
[0007]
Means for Solving the Problems and Effects of the Invention
In order to achieve the above object, according to the invention of claim 1, a substrate holding means for horizontally holding and rotating a flat rectangular substrate is provided in a processing container, and the substrate holding means is provided on the substrate held by the substrate holding means. Contaminants formed by spreading the dropped liquid substance on the surface of the substrate by centrifugal force and performing coating or chemical processing, and the liquid substance is formed around the periphery of the back surface of the substrate when the substrate is processed. In the back surface cleaning apparatus for cleaning and removing the substrate, a substantially reduced approximate concave portion of the substrate is formed on the upper surface of the substrate holding means, and a through-hole is formed at the center of the substrate holding means, and the substrate is held by the substrate holding means. A substantially circular shielding plate fixed to the bottom surface of the recessed portion, which is located in a space interposed between the lower surface of the substrate and the bottom surface of the concave portion, with a gap with respect to the bottom surface of the concave portion, Straight of the shielding plate A cleaning liquid discharge nozzle having a substantially cylindrical shape disposed on the substrate, wherein the cleaning liquid discharged from the cleaning liquid discharge port of the cleaning liquid discharge nozzle is held by the substrate holding means and comes into contact with the four peripheral portions of the back surface of the rotating substrate for cleaning. It is.
[0008]
In the apparatus for cleaning the back surface of a flat rectangular substrate having the above structure, the central region of the concave portion formed on the upper surface of the substrate holding means is shielded by the shielding plate, and a substantially ring formed outside the shielding plate and inside the concave portion when viewed from above. Since the groove, which is a concave portion, is formed, the substrate holding means is rotated at an appropriate rotation speed, and the ring-shaped groove is filled upward from the cleaning liquid discharge nozzle disposed immediately below the shielding plate. By discharging the amount of the cleaning liquid, the cleaning liquid can be retained in the groove by the centrifugal force and the surface tension. As described above, the cleaning liquid is retained and retained, and the cleaning liquid can be statically brought into contact with the four peripheral edges of the back surface of the substrate exposed from the shielding plate. The substance can be washed and removed without remaining undissolved, and the consumption of the cleaning liquid can be greatly reduced. Further, the centrifugal force acting on the held and retained cleaning liquid can prevent the cleaning liquid from penetrating inward through the gap between the back surface of the substrate and the upper surface of the shielding plate. The substrate and the substrate are rotated at a high speed, and a dynamic centrifugal force is applied to the stationary cleaning liquid, whereby the cleaning liquid can be scattered and removed to the outside of the substrate, so that the center of the originally clean substrate back surface is not contaminated. Since the central portion of the rear surface of the substrate is kept clean and only the contaminants on the four peripheral edges of the rear surface of the substrate are surely dissolved, washed and removed, the yield in the substrate processing step can be improved.
[0009]
According to a second aspect of the present invention, a substrate holding means for holding and rotating a flat rectangular substrate horizontally is provided in a processing container, and a liquid substance dropped on the substrate held by the substrate holding means is subjected to centrifugal force to apply the liquid substance to the substrate. Applied to a substrate processing apparatus that performs a coating process or a chemical process by spreading on a surface, a back surface cleaning device that cleans and removes contaminants formed by the liquid material wrapping around the back surface of the substrate during the substrate processing. A substantially disk-shaped cleaning liquid discharge nozzle having a substantially reduced approximation of the substrate formed on an upper surface of the substrate holding means, a through hole formed in the center of the substrate holding means, and a cleaning liquid discharge port on a side surface. Is disposed in a space sandwiched between the lower surface of the substrate held by the substrate holding means and the bottom surface of the concave portion so that the center axis of the substrate holding means is coincident with the center axis of the substrate holding means. In which al the discharged cleaning liquid is washed wetted on the back four peripheries of the rotating substrate held by the substrate holding means.
[0010]
In the apparatus for cleaning the back surface of a flat rectangular substrate having the above configuration, the substrate holding means is rotated at an appropriate rotation speed, and the cleaning liquid discharge nozzle on the side of a substantially disk-shaped cleaning liquid discharge nozzle (hereinafter, a disk-shaped nozzle) is used. By discharging a certain amount of cleaning liquid that fills the substantially ring-shaped groove formed by the concave portion formed on the upper surface of the holding means and the disk-shaped nozzle, the cleaning liquid is retained and held in the groove by centrifugal force and surface tension. Can be. In this manner, the cleaning liquid is retained and retained, and can be statically brought into contact with the four peripheral edges on the back surface of the substrate, which is outside the outer shape of the disk-shaped nozzle when viewed from above. In addition, the contaminants on the back surface of the substrate can be washed and removed without remaining undissolved, and the consumption of the cleaning liquid can be significantly reduced. Further, the centrifugal force acting on the held and retained cleaning liquid can prevent the cleaning liquid from penetrating inward through the gap between the back surface of the substrate and the disc-shaped nozzle. The substrate and the substrate are rotated at a high speed, and a dynamic centrifugal force is applied to the stationary cleaning liquid, whereby the cleaning liquid can be scattered and removed to the outside of the substrate, so that the center of the originally clean substrate back surface is not contaminated. Since the central portion of the rear surface of the substrate is kept clean and only the contaminants on the four peripheral edges of the rear surface of the substrate are surely dissolved, washed and removed, the yield in the substrate processing step can be improved.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an apparatus for cleaning the back surface of a flat rectangular substrate according to an embodiment of the present invention will be described with reference to FIGS. The same reference numerals are given to common members in the drawings, and redundant description will be omitted. As shown in FIG. 1, the back surface cleaning apparatus is configured to be applied to a substrate holding unit 2 rotatably supported by a bearing B at the center of the substrate processing apparatus 100. The substrate processing apparatus 100 has a substantially axially symmetric structure, and includes a rectifying cylinder 10, an upper processing container 8, a lower processing container 9, and an exhaust / waste liquid port 11, and the substrate holding means 2 includes a substrate holding means. Via a lower part 21, it is connected to a rotation drive mechanism (not shown), and is rotated, for example, in the direction of arrow R. Further, as shown in FIG. 2A, a plurality of positioning pins 6 on the upper surface of the substrate holding means 2 support four corners of a flat rectangular substrate (hereinafter, substrate) W and hold them during rotation. I do. A liquid substance such as a photoresist or a developer is dropped on the substrate W held by the substrate holding means 2 and spread on the surface of the substrate by centrifugal force. Applied to the surface. At the time of substrate processing by such a substrate processing apparatus, a contaminant formed by the liquid substance circling around the four back peripheral portions of the substrate is cleaned and removed by the back surface cleaning device applied to the substrate holding means 2.
[0012]
As shown in FIGS. 2B and 2C, the back surface cleaning device includes a disk-shaped shielding plate 1 for preventing the cleaning liquid 5 from hitting the center of the back surface of the substrate W. The shielding plate 1 is accommodated in a space defined by the back surface (lower surface) of the substrate W and the bottom surface 2b of the concave portion 20 formed on the upper surface 2a of the substrate holding means 2. Further, the shielding plate 1 is fixed to the bottom surface 2b with a shielding plate mounting screw 1a with a predetermined gap provided with respect to the bottom surface 2b of the concave portion 20. Therefore, the shielding plate 1 rotates together with the substrate holding means 2. The recess 20 has an outer shape (substantially reduced approximate shape) obtained by reducing the size of the substrate W, as shown in FIGS. 2A, 3, and 4. As described above, the concave portion 20 becomes deeper toward the center of the substrate holding means 2, and is connected to a through hole formed on the central axis of the substrate holding means 2. A cleaning liquid discharge nozzle 3 having a substantially cylindrical shape is inserted through the through-hole so as to coincide with the center axis. The bottom of the cleaning liquid discharge nozzle 3 is fixed to a fixed portion of the substrate processing apparatus 100 and a cleaning liquid supply not shown. Connected to the unit. Therefore, the cleaning liquid discharge nozzle 3 does not rotate. Above the cleaning liquid discharge nozzle 3, a plurality of cleaning liquid discharge ports 4 are provided directly below the shielding plate 1 and obliquely upward. During operation of the back surface cleaning device, the cleaning liquid discharged from the cleaning liquid discharge port 4 is guided outward by a discharge pressure and a centrifugal force through a gap formed between the lower surface of the shielding plate 1 and the bottom surface 2b of the concave portion 20. The planar shape of the shielding plate 1 may be similar to a reduced size of a square substrate to be processed, and the planar shape of the concave portion 20 provided on the upper surface 2a of the substrate holding means 2 may be reduced. It is not necessary to stick to the approximate shape. For example, as shown in FIG. 4, an irregular shape constituted by a plurality of curves may be exhibited without departing from the gist.
[0013]
Next, substrate processing (rotational coating) using the substrate processing apparatus 100 and back surface cleaning processing performed using the back surface cleaning apparatus will be described with reference to FIG. First, the rectifying cylinder 10 is moved up by an elevating means (not shown), and the substrate W is carried in through an opening formed on the upper surface of the upper processing vessel 8 by a robot hand or the like (not shown). Is placed. Here, the substrate W is held by the positioning pins 6 so as to rotate in synchronization with the substrate holding means 2. Next, in a state where the substrate holding unit 2 is stationary, the coating liquid is dropped onto the center of the upper surface of the substrate W by a chemical liquid supply unit (not shown). After the chemical solution supply means is retracted from above the substrate W, the rectifying cylinder 10 is lowered and mounted on the upper surface of the upper processing container 8, and the substrate holding means 2 rotates the motor (not shown) and the power of the motor (not shown) at a predetermined rotational speed. The coating process is performed by the action of the centrifugal force. In general, when the coating solution is dropped onto the substrate W, the solution is supplied in an amount equal to or greater than the amount calculated from the finished coating film thickness and the substrate area. This is for the purpose of stabilizing the processing quality between the substrates, but causes excess chemical liquid to flow from the side surface of the substrate W to the back surface.
[0014]
Subsequently, after the above-described coating process is completed, the main body of the coating solution is formed from the discharge port 4 formed above the cleaning liquid discharge nozzle 3 while rotating the substrate holding means 2 and thus the substrate W to be processed at a low speed. The cleaning liquid 5 is discharged in a constant amount. The cleaning liquid 5 discharged from the discharge port 4 is sent in a direction away from the center through a gap formed by the lower surface of the shielding plate 1 and the concave bottom surface 2b of the substrate holding means 2 by the action of the discharge pressure and the centrifugal force. Reaches the groove 2c defined as a part of the recess 20 and outside the shielding plate 1, and is held and retained in a substantially ring shape. In this state, the cleaning liquid 5 is statically in contact with the four peripheral edges of the rear surface of the substrate W, which are exposed from the bottom surface 2b of the concave portion 20 without being shielded by the shielding plate 1, and are exposed. The applied coating agent is efficiently dissolved and removed. Further, since the centrifugal force due to the rotation of the substrate W and the substrate holding means 2 acts outward in the radial direction, the cleaning liquid permeates in the center direction in the gap between the back surface of the substrate W and the upper surface of the shielding plate 1. In addition, it is possible to prevent the liquid from coming into contact with the clean substrate back surface. The action of the centrifugal force on the cleaning liquid raises the level of the cleaning liquid in the groove 2c and produces an effect of maintaining the level. As a result, the distance between the lower surface of the substrate W and the upper surface of the shielding plate 1 does not need to be extremely narrow, so that it is possible to prevent the cleaning liquid from entering due to the capillary phenomenon, and to allow the mechanical tolerance in the device configuration to have a margin. it can.
[0015]
Subsequently, after the coating agent on the back surface is dissolved and removed, the rotation of the substrate holding means 2 that has been rotating at a low speed is shifted to a high speed rotation to increase the centrifugal force acting on the held and held cleaning liquid, and the coating is performed. The treated cleaning solution containing the agent solute component is shaken off from the substrate holding means 2. At this time, the treated cleaning liquid scatters in a mist form, and is discharged out of the processing vessel through the exhaust / waste liquid port 11 provided in the lower processing vessel 9. Subsequently, the rotation of the substrate holding means 2 is stopped, the substrate W is unloaded from the substrate processing apparatus 100, and the spin coating process and the back surface cleaning process of the substrate are completed.
[0016]
Next, an apparatus for cleaning the back surface of a flat rectangular substrate according to another embodiment of the present invention will be described with reference to FIGS. The back surface cleaning apparatus shown in these figures is configured such that the substantially cylindrical cleaning liquid discharge nozzle 3 in the above-described back surface cleaning apparatus is integrated with the shielding plate 1 to form a substantially disk-shaped cleaning liquid discharge nozzle 3. is there. A plurality of cleaning liquid discharge ports 4 slightly upward are provided on the side surface of the disk-shaped portion above the cleaning liquid discharge nozzle 3. At the time of the back surface cleaning process, the cleaning liquid discharged from the cleaning liquid discharge port 4 comes into contact with at least the area of the disc-shaped portion of the cleaning liquid discharge nozzle 3 on the back surface of the substrate W by the action of the discharge pressure and the centrifugal force, The coating material that has flowed into the back surface of the substrate is dissolved and removed. In this case, the cleaning liquid discharge nozzle 3 and the upper disk-shaped portion are stationary without rotating even when the substrate holding means 2 rotates. The back surface cleaning processing using the back surface cleaning apparatus of this embodiment is the same as above, and the description is omitted.
[0017]
The present invention can be variously modified without being limited to the above configuration. For example, the cleaning liquid discharge nozzle may be rotated when the substrate is rotated. The cleaning liquid discharge port of the cleaning liquid discharge nozzle shown in FIGS. 5 and 6 is not limited to the side surface of the disk-shaped portion, but may be provided around the side surface. The flat rectangular substrate to which the back surface cleaning apparatus of the present invention is applied is not limited to a square, but may be a polygon.
[Brief description of the drawings]
FIG. 1 is a side cross-sectional view of a spin coating apparatus to which a back surface cleaning apparatus for a flat rectangular substrate according to an embodiment of the present invention is applied.
2 (a) is a plan view of the same device as viewed in the direction of arrows A1-A1, FIG. 2 (b) is a cross-sectional view taken along line B1-B1 of the previous figure, and FIG. 2 (c) is a cross-sectional view taken along line B2-O-B2.
FIG. 3 is an external perspective view of a substrate holding unit included in the apparatus.
FIG. 4 is an external perspective configuration diagram showing another example of the substrate holding means.
FIG. 5 is an apparatus for cleaning the back surface of a flat rectangular substrate according to another embodiment of the present invention.
FIG. 6 is an external perspective view of a substrate holding unit included in the apparatus.
FIG. 7A is a side cross-sectional view showing a configuration of a conventional back surface cleaning apparatus, and FIG. 7B is a cross-sectional view of a substrate explaining a cleaning result by the conventional apparatus.
8A is a side sectional view of a conventional back surface cleaning apparatus, FIG. 8B is a side sectional view of another conventional back surface cleaning apparatus, and FIG. 8C is a side view of a cleaning liquid discharge nozzle used in the apparatus. FIG. 9D is a perspective view, FIG. 10D is a side sectional view of still another conventional back surface cleaning apparatus, and FIG. 10E is a perspective view of a cleaning liquid discharge nozzle used in the apparatus.
[Explanation of symbols]
W Substrate to be processed (substrate)
DESCRIPTION OF SYMBOLS 1 Shield plate 2 Substrate holding means 3 Cleaning liquid discharge nozzle 4 Cleaning liquid discharge port 5 Cleaning liquid 7a Coating film

Claims (2)

  1. 平板状角型基板を水平に保持して回転する基板保持手段が処理容器内に備えられ、この基板保持手段に保持した基板上に滴下した液状物質を遠心力により基板表面上に広げて塗布処理又は化学処理を施す基板処理装置に適用され、前記基板処理時に前記液状物質が前記基板の裏面四周部に廻り込んで形成した汚染物質を洗浄除去する裏面洗浄装置において、
    前記基板保持手段の上面に、前記基板の略縮小近似形の凹部が形成されると共に前記基板保持手段の中心に貫通孔が形成され、
    前記基板保持手段により保持された基板の下面と前記凹部の底面とに挟まれる空間に位置し、前記凹部の底面に対し間隙をおいて該底面に固定された略円形の遮蔽板と、
    前記貫通孔に挿通して前記遮蔽板の直下に配置した略円筒形状の洗浄液吐出ノズルとを備え、
    前記洗浄液吐出ノズルの洗浄液吐出口から吐出した洗浄液が前記基板保持手段により保持されて回転する基板の裏面四周部に接液して洗浄することを特徴とする平板状角型基板の裏面洗浄装置。
    A substrate holding means for holding and rotating the flat rectangular substrate horizontally is provided in the processing container, and the liquid substance dropped on the substrate held by the substrate holding means is spread on the substrate surface by centrifugal force to perform a coating process. Or applied to a substrate processing apparatus that performs a chemical treatment, in the back surface cleaning apparatus for cleaning and removing contaminants formed by the liquid material wrapped around the back four sides of the substrate during the substrate processing,
    On the upper surface of the substrate holding means, a substantially reduced approximate shape concave portion of the substrate is formed, and a through hole is formed at the center of the substrate holding means,
    A substantially circular shielding plate which is located in a space sandwiched between the lower surface of the substrate held by the substrate holding means and the bottom surface of the concave portion, and is fixed to the bottom surface of the concave portion with a gap therebetween;
    A cleaning liquid discharge nozzle having a substantially cylindrical shape inserted through the through hole and disposed immediately below the shielding plate,
    A back surface cleaning apparatus for a flat rectangular substrate, wherein a cleaning liquid discharged from a cleaning liquid discharge port of the cleaning liquid discharge nozzle is held by the substrate holding means and is brought into contact with four peripheral portions of a rear surface of a rotating substrate for cleaning.
  2. 平板状角型基板を水平に保持して回転する基板保持手段が処理容器内に備えられ、この基板保持手段に保持した基板上に滴下した液状物質を遠心力により基板表面上に広げて塗布処理又は化学処理を施す基板処理装置に適用され、前記基板処理時に前記液状物質が前記基板の裏面四周部に廻り込んで形成した汚染物質を洗浄除去する裏面洗浄装置において、
    前記基板保持手段の上面に、前記基板の略縮小近似形の凹部が形成されると共に前記基板保持手段の中心に貫通孔が形成され、
    洗浄液吐出口を側面に有した略円盤形状の洗浄液吐出ノズルが、前記基板保持手段により保持された基板の下面と前記凹部の底面とに挟まれる空間に、前記基板保持手段と中心軸を一致して配設され、
    前記洗浄液吐出ノズルの洗浄液吐出口から吐出した洗浄液が前記基板保持手段により保持されて回転する基板の裏面四周部に接液して洗浄することを特徴とする平板状角型基板の裏面洗浄装置。
    A substrate holding means for holding and rotating the flat rectangular substrate horizontally is provided in the processing container, and the liquid substance dropped on the substrate held by the substrate holding means is spread on the substrate surface by centrifugal force to perform a coating process. Or applied to a substrate processing apparatus that performs a chemical treatment, in the back surface cleaning apparatus for cleaning and removing contaminants formed by the liquid material wrapped around the back four sides of the substrate during the substrate processing,
    On the upper surface of the substrate holding means, a substantially reduced approximate shape concave portion of the substrate is formed, and a through hole is formed at the center of the substrate holding means,
    A substantially disk-shaped cleaning liquid discharge nozzle having a cleaning liquid discharge port on a side surface is provided so that the center axis of the cleaning liquid discharge nozzle coincides with the center axis of the space held between the lower surface of the substrate held by the substrate holding device and the bottom surface of the concave portion. Arranged
    A back surface cleaning apparatus for a flat rectangular substrate, wherein a cleaning liquid discharged from a cleaning liquid discharge port of the cleaning liquid discharge nozzle is held by the substrate holding means and is brought into contact with four peripheral portions of a rear surface of a rotating substrate for cleaning.
JP2002220240A 2002-07-29 2002-07-29 Rear face cleaning device of plate-like angular substrate Withdrawn JP2004063796A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010519585A (en) * 2007-03-28 2010-06-03 エスエヌユー プレシジョン カンパニー リミテッド Substrate support device and LCD cell seal pattern inspection device using the same
JP2013038442A (en) * 2004-09-30 2013-02-21 Lam Research Corporation Edge wheel structure
CN104588353A (en) * 2015-01-15 2015-05-06 山东大学 Magnetic-jet washing device for washing surface of large-sized KDP (potassium dihydrogen phosphate) crystal and washing process
CN107116007A (en) * 2017-06-20 2017-09-01 柴德维 Rubber coating fixture for rubber component

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013038442A (en) * 2004-09-30 2013-02-21 Lam Research Corporation Edge wheel structure
JP2010519585A (en) * 2007-03-28 2010-06-03 エスエヌユー プレシジョン カンパニー リミテッド Substrate support device and LCD cell seal pattern inspection device using the same
CN104588353A (en) * 2015-01-15 2015-05-06 山东大学 Magnetic-jet washing device for washing surface of large-sized KDP (potassium dihydrogen phosphate) crystal and washing process
CN107116007A (en) * 2017-06-20 2017-09-01 柴德维 Rubber coating fixture for rubber component

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