JP2004039887A - 配線基板の製造方法および製造装置 - Google Patents

配線基板の製造方法および製造装置 Download PDF

Info

Publication number
JP2004039887A
JP2004039887A JP2002195485A JP2002195485A JP2004039887A JP 2004039887 A JP2004039887 A JP 2004039887A JP 2002195485 A JP2002195485 A JP 2002195485A JP 2002195485 A JP2002195485 A JP 2002195485A JP 2004039887 A JP2004039887 A JP 2004039887A
Authority
JP
Japan
Prior art keywords
cover film
base material
peeling
manufacturing
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002195485A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004039887A5 (https=
Inventor
Yasuhiro Nakaya
安広 仲谷
Masayoshi Koyama
雅義 小山
Fumio Echigo
文雄 越後
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2002195485A priority Critical patent/JP2004039887A/ja
Publication of JP2004039887A publication Critical patent/JP2004039887A/ja
Publication of JP2004039887A5 publication Critical patent/JP2004039887A5/ja
Withdrawn legal-status Critical Current

Links

Images

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2002195485A 2002-07-04 2002-07-04 配線基板の製造方法および製造装置 Withdrawn JP2004039887A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002195485A JP2004039887A (ja) 2002-07-04 2002-07-04 配線基板の製造方法および製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002195485A JP2004039887A (ja) 2002-07-04 2002-07-04 配線基板の製造方法および製造装置

Publications (2)

Publication Number Publication Date
JP2004039887A true JP2004039887A (ja) 2004-02-05
JP2004039887A5 JP2004039887A5 (https=) 2005-10-20

Family

ID=31703846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002195485A Withdrawn JP2004039887A (ja) 2002-07-04 2002-07-04 配線基板の製造方法および製造装置

Country Status (1)

Country Link
JP (1) JP2004039887A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160025449A (ko) 2014-08-27 2016-03-08 제이에스알 가부시끼가이샤 3차원 배선의 형성 방법, 3차원 배선을 갖는 회로 장치 및, 3차원 배선용의 금속막 형성용 조성물
JP2020009831A (ja) * 2018-07-04 2020-01-16 Ｎｉｓｓｈａ株式会社 導電シートの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160025449A (ko) 2014-08-27 2016-03-08 제이에스알 가부시끼가이샤 3차원 배선의 형성 방법, 3차원 배선을 갖는 회로 장치 및, 3차원 배선용의 금속막 형성용 조성물
US9543201B2 (en) 2014-08-27 2017-01-10 Jsr Corporation Method for forming three-dimensional interconnection, circuit arrangement comprising three-dimensional interconnection, and metal film-forming composition for three-dimensional interconnection
JP2020009831A (ja) * 2018-07-04 2020-01-16 Ｎｉｓｓｈａ株式会社 導電シートの製造方法

Similar Documents

Publication Publication Date Title
JP3241605B2 (ja) 配線基板の製造方法並びに配線基板
WO2001045478A1 (en) Multilayered printed wiring board and production method therefor
JPH11186698A (ja) 回路基板の製造方法および回路基板
JP2008300819A (ja) プリント基板およびその製造方法
JP3014365B2 (ja) 配線板、中間接続体、配線板の製造方法および中間接続体の製造方法
JP2008103548A (ja) 多層プリント配線板及びその製造方法
JPH07176871A (ja) 樹脂多層基板の製造方法
JP4287725B2 (ja) 部品内蔵モジュールの製造方法
JPH11233946A (ja) 高密度配線形成用基板とその製造方法及び高密度配線基板の製造方法
WO2006118141A1 (ja) 多層配線基板およびその製造方法
JP3705370B2 (ja) 多層プリント配線板の製造方法
JP2004039887A (ja) 配線基板の製造方法および製造装置
JP2002368414A (ja) 高導電性配線基板の製造方法および製造装置ならびに配線基板
KR100699237B1 (ko) 임베디드 인쇄회로기판 제조방법
JP2004103739A (ja) 多層配線基板、多層配線基板用基材およびその製造方法
JPH1174640A (ja) プリント配線基板の製造方法
JP3705573B2 (ja) 配線基板の製造方法
JP2000151102A (ja) 多層回路基板の製造方法
JP3173480B2 (ja) プリント配線基板の製造方法および製造装置
JP3238901B2 (ja) 多層プリント配線基板およびその製造方法
JP2003188534A (ja) 高導電性配線基板の製造方法
JP4058218B2 (ja) プリント配線基板の製造方法
JP4557477B2 (ja) 配線基板の製造方法
JP3996049B2 (ja) 配線板およびその製造方法、並びに、多層配線板
JP3973654B2 (ja) プリント配線基板の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050614

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050614

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20050713

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20061205