JP2004017257A - Part gripping device - Google Patents

Part gripping device Download PDF

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Publication number
JP2004017257A
JP2004017257A JP2002179573A JP2002179573A JP2004017257A JP 2004017257 A JP2004017257 A JP 2004017257A JP 2002179573 A JP2002179573 A JP 2002179573A JP 2002179573 A JP2002179573 A JP 2002179573A JP 2004017257 A JP2004017257 A JP 2004017257A
Authority
JP
Japan
Prior art keywords
gripping
component
elastic
electronic component
rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002179573A
Other languages
Japanese (ja)
Inventor
Kazuo Kido
Hideki Uchida
内田 英樹
城戸 一夫
Original Assignee
Matsushita Electric Ind Co Ltd
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd, 松下電器産業株式会社 filed Critical Matsushita Electric Ind Co Ltd
Priority to JP2002179573A priority Critical patent/JP2004017257A/en
Publication of JP2004017257A publication Critical patent/JP2004017257A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a part gripping device which precisely grips electronic parts even when sizes, shapes, warpage, and distortion of electronic parts vary, or mass is large. <P>SOLUTION: This gripping device is equipped with a gripping pawl 2 gripping parts, and a drive part opening and closing the gripping pawl. The part of the gripping pawl is shaped like a bar, and an elastic material 4 having suitable elasticity and abrasion is fitted into the bar-like portion 3. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
[Field of the Invention]
The present invention relates to a component gripping device for electronic components used in a component mounting device.
[0002]
[Prior art]
There are various types of component gripping devices used in component mounting devices, including component gripping devices that grip components with gripping claws and devices that suck and mount electronic components using suction nozzles connected to vacuum pressure. Some parts have no surface that can be gripped by suction, and some parts are too heavy to be held by suction compared to the holding force obtained by the suction surface. Using a component gripping device.
[0003]
As a conventional technique of this component gripping device, for example, a component gripping device 51 as shown in FIG. 9 is known. The component gripping device 51 is mounted on a component mounting device 52 as shown in FIG. 8, for example, and grips and moves an electronic component supplied from the component supply unit 53 by the component gripping device 51. The component is mounted at the position indicated by.
[0004]
Hereinafter, the configuration of the component gripping device 51 will be described.
In FIG. 9, a block 55 determines a height relationship between the electronic component 56 and the component gripping device 51 when the gripping claw 57 grips the electronic component 56.
[0005]
The piston 59 drives the link 58 to transmit a driving force to the gripping claw 57. The tension spring 60 moves the piston 59 in the direction of the arrow X to open the gripping claw 57. In the direction opposite to the direction of the arrow X to drive the link 58. The piston pin 62 is attached to the piston 59 and transmits the movement of the piston 59 to the link 58, and the fulcrum pin 63 becomes the rotation center of the link 58. The gripping body 64 is fixed to the gripping claws 57 by coating or bonding or the like, and contacts the component when gripping the component.
[0006]
The operation of the component gripping device 51 configured as described above will be described below. FIG. 9 shows a state where the piston 59 is retracted in the direction of the arrow X by the tension spring 60 and the link 58 is driven outward around the fulcrum pin 63 via the piston pin 62, so that the gripping claw 57 is opened. It is.
[0007]
Next, when gripping the electronic component 56, the air is sucked by the vacuum device 61 so that the piston pin 62 moves together with the piston 59 in the direction of the arrow Y against the tensile force of the extension spring 60. As a result, the link 58 rotates in the direction of the arrow Z about the fulcrum pin 63, so that the gripping claw 57 is closed, and the gripping body 64 fixed to the gripping claw 57 contacts the electronic component 56 and grips it.
[0008]
As described above, since the gripping body 64 contacts the component 56, it is necessary to use an elastic body softer than the component in order to prevent the component from being damaged. As shown in the figure, when picking up the electronic component 56 of the component supply unit 53, the electronic component 56 is often picked up from an embossed tape 65 that stores and supplies the component. The gap is inevitably narrow due to the necessity of a large area. Therefore, the holding body 64 easily descends while interfering or strongly contacting the corner of the electronic component 56 or the edge of the embossed tape 64, and the holding body 64 is worn. It was easy to do.
[0009]
[Problems to be solved by the invention]
However, in the component gripping device as described above, the size and shape of a variety of electronic components, the roughness of the electronic component surface gripped by the gripping claws, the warpage and distortion of the electronic component during molding, etc. With the gripper fixed to the nail, warpage, distortion and unevenness of the electronic component cannot be avoided, so that a gap is generated between the gripper of the gripper and the electronic component, and the electronic component cannot be gripped accurately. On the other hand, if the electronic component has a very large mass, the friction force between the gripper and the electronic component may be insufficient, and may not be sufficient to grip the electronic component.
[0010]
The reason why it is necessary to accurately grip an electronic component without looseness is that the electronic component must be mounted on the electronic circuit board with high accuracy, for example, ± 50 μm, and the minute play generated between the gripping claw and the electronic component. Even in the case of long electronic components, the play with the gripping claw is a large gap at the tip, so it must be accurately held. Is because the contact area between the gripping claw and the electronic component is reduced, and even if a force for tightening the specified gripping claw is generated, the electronic component cannot be lifted even if the electronic component with the mass that should be able to be gripped can be gripped. is there.
[0011]
Furthermore, since the gap between the elastic body provided on the contact surface of the gripping claw and the electronic component must be narrow, typically about 1 mm, as described above, variations in the electronic component feed accuracy and the electronic component suction position. Therefore, interference between the elastic body and the electronic component may occur, and the elastic body may be worn.
[0012]
At that time, in order to realize high production, in order to mount a wide variety of electronic components, remove the gripping nail fixing bolts to the size, shape and size corresponding to the electronic component, replace each time, and replace the gripping nail again. Precise adjustments such as parallelism between them were required, and a great deal of time was spent switching production varieties.
[0013]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the component gripping device of the present invention has a bar-shaped portion for gripping the component of the gripping claw, inserts an annular elastic body into the rod-shaped portion, and abuts the elastic body on the component. It is characterized by having a surface. Thereby, the elastic body can be easily and interchangeably attached to an arbitrary position of the gripping claw, so that various electronic components can be gripped without a gap between the gripping claw and the electronic component.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
The component gripping device according to claim 1 of the present invention is a gripping device including a gripper for gripping a component, and a driving unit that opens and closes the gripper, and a portion of the gripper that grips the component. Is formed in a rod-like shape, and an annular elastic body is fitted into the rod-like portion, and the elastic body is used as a surface that comes into contact with the component.
[0015]
Thus, the elastic body can be easily and interchangeably attached to an arbitrary position of the gripping claw, so that various electronic components can be gripped and mounted with high precision without a gap between the gripping claw and the electronic component. In addition, since an elastic body is employed for a surface that comes into contact with the electronic component, a heavy electronic component or an electronic component having fine irregularities on the gripping surface can be reliably gripped without generating a gap in the contact surface with the electronic component. . Furthermore, since the elastic stopper can be attached to an arbitrary position, the contact portion of the gripping claw with the electronic component can be easily changed for various electronic components, and the loss time for switching the production type can be reduced. Further, even if the elastic body is damaged, it can be replaced immediately and the loss of production operation time can be reduced.
[0016]
According to a second aspect of the present invention, there is provided the component gripping device, wherein the rod-shaped portion into which the annular elastic body is inserted is provided with a groove into which the annular elastic is inserted. Thus, the annular elastic body fits into the concave portion and does not shift its position, so that the holding position of the electronic component can be reliably held by the elastic body.
[0017]
According to a third aspect of the present invention, the surface of the rod-shaped portion for gripping the component has a shape compatible with the shape of the surface to be gripped of the component to be gripped. Thus, the elastic body can securely grip the electronic component along the grip surface of the electronic component.
[0018]
5. The component gripping device according to claim 4, wherein the annular elastic body is a large elastic ring whose inner circumference is larger than the outer circumference of the rod-shaped part, and a gap is provided on a side where the rod-shaped part is gripped by the fixing means. It is characterized by being fixed. Thereby, the large elastic body ring can exert an appropriate elastic force, and effectively functions to absorb and hold large uneven portions and distortion of the electronic component.
[0019]
Hereinafter, an embodiment of a component holding device according to the present invention will be described with reference to FIGS. 1 and 2 show a component gripping device 1 according to an embodiment of the present invention. The difference from the conventional technique is that a gripping claw for gripping a component and an elastic body portion that constitutes a surface that comes into contact with the component. Therefore, the same components as those in the prior art are denoted by the same reference numerals.
[0020]
In the figure, a piston 59 is driven back and forth by a vacuum device 61 and a tension spring 60, and a link 58 fastened to a piston pin 62 on the piston rotates in the arrow C or Z direction. By the operation of the driving unit configured as described above, the gripping claws 2 gripping the components open and close. The portion 3 of the gripping claw 2 where the component 56 is gripped has a rod-like shape. An annular elastic body 4 is fitted into the rod-shaped portion 3, and the elastic body 4 is used as a surface that comes into contact with the component.
[0021]
Hereinafter, the operation of the present embodiment will be described.
The piston 59 is moved in the direction of arrow X by the spring 60, the link 58 is rotated in the direction of arrow C, and the gripping claw 2 is open. Next, when gripping the component as shown in FIG. 2, the vacuum device 61 generates a vacuum pressure to move the piston 59 in the Y direction, and the link 58 fastened to the piston pin 62 rotates in the Z direction. . Thereby, the elastic body 4 attached to the gripping claws 2 can grip the electronic component 9. It is appropriate that the elastic body has a large friction coefficient, for example, about 0.2.
[0022]
FIG. 3 is a diagram when the electronic component 56 is actually taken out from the electronic component supply unit 53. The electronic component 56 is housed in an embossed tape 64, and the elastic body 4 attached to the gripping claws 2 generally has a narrow gap of, for example, less than about 1 mm as shown in FIG. Since the elastic member 4 that can rotate the elastic member 4 is attached, even if the elastic member 4 interferes with the edge of the embossed tape 64 or the corner of the electronic component 56, the elastic member 4 rotates and the elastic member 4 does not break. Naturally, the frictional force between the elastic body 4 and the gripping claws 2 and the frictional force between the elastic body 4 and the electronic component 56 are set sufficiently larger than the mass of the electronic component 56.
[0023]
For this reason, even if the elastic body 4 rotates on the rod-shaped portion 3 when the electronic component 9 is taken out, the electronic component 56 does not slide and drop after gripping the electronic component 9.
[0024]
FIG. 4 is a perspective view of the gripping claw portion of FIG. FIG. 4A shows a state before the elastic body 4 is inserted into the rod-shaped portion 3 of the gripping claw 2, and FIG. 4B shows a state where the elastic body 4 is inserted. As a material selected as the elastic body 4, a material having a large friction and a high elastic force is preferable. For example, silicon rubber and nitrile rubber are suitable.
[0025]
Further, the outer peripheral dimension of the rod-shaped portion 3 of the gripping claw 2 is set to be about 10 to 20% larger than the inner peripheral dimension of the inner diameter of the elastic body 4 inserted into the outer peripheral dimension, and the elastic body is attached to the gripping claw with elastic force. Is preferred. The degree of the increase is appropriately selected depending on the material of the elastic body 4.
[0026]
Further, as shown in FIG. 4 (b), a plurality of elastic members 4 can be easily attached to any position of the rod-shaped portion 3 of the gripping claw 2, so that the elastic members can be efficiently repaired, and the parts can be replaced. Since the position to be gripped can be set by the mounting position of the elastic body, it can correspond to various electronic component shapes. An example is shown in FIG. FIG. 7 is a diagram when the electronic component 56 is grasped as viewed from the direction A in FIG. 2, and shows a state in which the elastic body 4 has adapted according to the unevenness of the electronic component 56.
[0027]
In addition, as shown in FIG. 5, when the groove 3 a into which the annular elastic body 4 is fitted is provided in the rod-shaped portion 3 into which the annular elastic body 4 is inserted, the position where the elastic body 4 is set becomes clear. In addition, the groove 3a is securely fixed at the position. FIG. 5A shows the groove 3a, and FIG. 5B shows a state where the elastic body 4 is fitted into the groove 3a.
[0028]
If the surface 3b of the rod-shaped portion 3 for gripping the component has a shape compatible with the shape of the surface to be gripped of the component to be gripped, the elastic body 4 also has a surface 4a following the surface 3b. The contact area increases, so that the user can more reliably hold the device.
[0029]
In addition, when the electronic component 56 has large irregularities and strains, a large number of elastic regions of the elastic body are required to absorb the irregularities and the distorted portions and securely hold the electronic component 56. In such a case, it is effective means to grip the large elastic ring 5 having a larger elastic region with the rod portion 3.
[0030]
As an embodiment, a gap 7 is provided on the side of the rod-shaped portion 3 on which the component is gripped by the plate 6 and two elastic rings 8 as fixing means for the ring-shaped large elastic ring 5 whose inner circumference is larger than the outer circumference of the rod-shaped portion 3. 6A is shown in a perspective view of FIG. 6A, and FIG. 6B is a cross-sectional view taken along the line BB of FIG. 6A.
The gap 7 is a region in which the large elastic body ring 5 exerts an appropriate elastic force, and effectively functions to absorb and hold large uneven portions and distortion of the electronic component 56. The large elastic ring 5 can be easily replaced for repair or the like by attaching and detaching the elastic ring 8. Further, since the large elastic ring 5 is fixed to the rod-shaped portion 3 so as not to rotate in the above structure, the large elastic ring 5 does not rotate even when the electronic component 56 is gripped and lifted. However, the electronic components do not fall.
[0031]
【The invention's effect】
As described above, according to the present invention, the elastic body can be easily replaced by inserting and attaching the annular elastic body to the bar-shaped portion of the gripping claw of the component gripping device, thereby contributing to high-efficiency production. . Further, it is possible to easily grip and mount components having various shapes.
[Brief description of the drawings]
FIG. 1 is a partially sectional front view showing a component gripping device according to an embodiment of the present invention; FIG. 2 is a front view in which a gripping nail shown in FIG. 1 is closed; FIG. FIG. 4 is a perspective view of a gripping claw portion of FIG. 1; FIG. 5 is a perspective view of FIG. 4 having grooves; FIG. 6 is a perspective view of a gripping claw portion showing another embodiment of the present invention; FIG. 7 is a bottom view of FIG. 2; FIG. 8 is a perspective view of an electronic component mounting apparatus; FIG. 9 is a partially sectional front view showing a conventional component gripping apparatus and a relation diagram of embossed tape.
REFERENCE SIGNS LIST 1 component gripping device 2 gripping claw 3 rod-shaped portion 4 elastic body 5 large elastic body 6 plate 7 elastic ring 56 electronic component 59 piston pin 60 tension spring 61 vacuum device 64 embossed tape

Claims (4)

  1. What is claimed is: 1. A gripping device comprising: a gripper for gripping a component; and a drive unit for opening and closing the gripper, wherein a portion of the gripper that grips the component has a rod-like shape, and an annular elastic body is formed on the rod-like portion. And a component gripping device in which the elastic body is brought into contact with the component.
  2. The component gripping device according to claim 1, wherein the rod-shaped portion into which the annular elastic body is inserted has a groove into which the annular elastic body is fitted.
  3. The component gripping device according to claim 1, wherein a surface of the rod-shaped portion that grips the component has a shape that matches a shape of a gripped surface of the component to be gripped.
  4. 2. The component grip according to claim 1, wherein the ring-shaped elastic body is a large elastic ring whose inner circumference is larger than the outer circumference of the rod-shaped part, and is fixed with a gap on the rod-shaped part holding side by the fixing means. apparatus.
JP2002179573A 2002-06-20 2002-06-20 Part gripping device Pending JP2004017257A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002179573A JP2004017257A (en) 2002-06-20 2002-06-20 Part gripping device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002179573A JP2004017257A (en) 2002-06-20 2002-06-20 Part gripping device

Publications (1)

Publication Number Publication Date
JP2004017257A true JP2004017257A (en) 2004-01-22

Family

ID=31176940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002179573A Pending JP2004017257A (en) 2002-06-20 2002-06-20 Part gripping device

Country Status (1)

Country Link
JP (1) JP2004017257A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009196813A (en) * 2008-02-25 2009-09-03 Sharp Corp Gripping device
JP2009542557A (en) * 2006-07-10 2009-12-03 ゴス インターナショナル アメリカス インコーポレイテッドGoss International Americas, Inc. Compensating gripper with independent gripper adjustment
JP2009542558A (en) * 2006-07-10 2009-12-03 ゴス インターナショナル アメリカス インコーポレイテッドGoss International Americas, Inc. Opposing link gripper
JP2012161876A (en) * 2011-02-07 2012-08-30 Canon Inc Holding device
JP2018148046A (en) * 2017-03-06 2018-09-20 パナソニックIpマネジメント株式会社 Component mounting device and component mounting method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009542557A (en) * 2006-07-10 2009-12-03 ゴス インターナショナル アメリカス インコーポレイテッドGoss International Americas, Inc. Compensating gripper with independent gripper adjustment
JP2009542558A (en) * 2006-07-10 2009-12-03 ゴス インターナショナル アメリカス インコーポレイテッドGoss International Americas, Inc. Opposing link gripper
JP2009196813A (en) * 2008-02-25 2009-09-03 Sharp Corp Gripping device
WO2009107590A1 (en) * 2008-02-25 2009-09-03 シャープ株式会社 Grasping device
JP2012161876A (en) * 2011-02-07 2012-08-30 Canon Inc Holding device
JP2018148046A (en) * 2017-03-06 2018-09-20 パナソニックIpマネジメント株式会社 Component mounting device and component mounting method
US10568250B2 (en) 2017-03-06 2020-02-18 Panasonic Intellectual Property Management Co., Ltd. Component mounting device and method of mounting component

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