JP2004004753A

JP2004004753A - Manufacturing method of liquid crystal panel

Info

Publication number: JP2004004753A
Application number: JP2003109221A
Authority: JP
Inventors: Hiroki Nakahara; 中原　弘樹; Hideki Uehara; 上原　秀樹; Takashi Miyazaki; 宮崎　貴史; Takeshi Hagiwara; 萩原　武
Original assignee: Seiko Epson Corp
Current assignee: Seiko Epson Corp
Priority date: 1998-08-31
Filing date: 2003-04-14
Publication date: 2004-01-08
Anticipated expiration: 2019-08-11
Also published as: JP3636193B2

Abstract

PROBLEM TO BE SOLVED: To provide liquid crystal panels which prevents a low twist domain from being generated at a gap region between an alignment layer and sealing materials, and a screen display region is expanded. SOLUTION: Large scale substrates 1A and 2A having a plurality of substrate forming regions are pasted together by sealing materials 3 for every substrate forming region and the large scale substrates are cut along cutting preparation lines L1 and L2 to manufacture a plurality of liquid crystal panels. The above manufacturing method includes a process in which electrodes 12 and 22 are formed on the large scale substrates, a process in which conductive terminals are formed on every substrate forming region to provide electrical connection between the large scale substrates when the substrates are pasted together and a process in which alignment layers 13 and 23 are formed to cover the electrodes on the large scale substrates. The layers are formed for a plurality of the substrate forming regions which stride over the cutting preparation lines. COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
技術分野本発明は、液晶表示装置に用いる液晶パネルおよびその製造方法に関するものである。さらに詳しくは、液晶パネルを構成する各基板の構造技術に関するものである。
【０００２】
【従来の技術】
第１１図（Ａ）、（Ｂ）に示すように、液晶パネル１０を構成する透明な第１の基板１と第２の基板２とはスペーサ３２を挟んで所定の間隙をもってシール材３によって貼り合わされ、この間隙３１には液晶４０が封入されている。また、第１および第２の基板１、２には偏光板４Ａ、４Ｂがそれぞれ貼られている。第１の基板１の内側表面には、シリコン酸化膜などからなる下地保護膜１１の表面に、透明導電膜であるＩＴＯ膜（ＩｎｄｉｕｍＴｉｎＯｘｉｄｅ）などによって各種キャラクタ表示用あるいはドット表示用の電極６Ａが形成され、第２の基板２の内側表面にも、シリコン酸化膜などからなる下地保護膜２１の表面に、ＩＴＯ膜によって各種キャラクタ表示用あるいはドット表示用の電極７Ａが形成されている。また、第１および第２の基板１、２では、電極６Ａ、７Ａを覆うように透明絶縁膜１２、２２が形成され、この透明絶縁膜１２、２２の表面にはポリイミド膜からなる配向膜１３、２３が形成されている。
【０００３】
ここで、シール材３は、従来、フェノール−ノボラックタイプの２液混合型のエポキシ樹脂、あるいは脂肪族タイプの２液混合型のエポキシ樹脂であり、ポリイミド膜からなる配向膜１３、２３と接すると、その界面で十分な密着性を確保できない傾向にある。このため、従来の液晶パネル１０では、シール材３と配向膜１３、２３との間に隙間Ｓを確保する必要があるので、以下の製造を採用している。すなわち、従来の液晶パネル１の製造工程では、第１２図に示すように、単品の第１および第２の基板１、２をそれぞれ複数取りするための第１および第２の大型基板１Ａ、２Ａの表面のうち、これらの大型基板１Ａ、２Ａの切断予定線Ｌ１、Ｌ２に沿って切断したときに単品の第１および第２の基板１、２として分割される各基板形成領域に前記の電極６Ａ、７Ａを形成した後、シール材４を形成する領域よりやや内側領域（第１２図において破線の斜線領域）に透明絶縁膜１２、２２を形成し、しかる後に透明絶縁膜１２、２２に重なるように配向膜１３、２３（ポリイミド膜）をフレキソ印刷している。そして、第１および第２の大型基板１Ａ、２Ａのうちの一方に対して、配向膜１３、２３の形成領域を外周側で囲むようにシール材３を形成し、このシール材３によって第１の大型基板１Ａと第２の大型基板２Ａとを貼り合わせる。次に、第１および第２の大型基板１Ａ、２Ａを貼り合わせたものを単品のパネル、あるいは短冊状のパネルに切断した後、シール材３の途切れ部分３０から液晶を減圧注入し、しかる後に、シール材３の途切れ部分３０を塞ぐ。
【０００４】
しかしながら、従来の液晶パネル１では、第１１図（Ｂ）に示すように、シール材３と配向膜１３、２３との間に隙間Ｓがあるので、この隙間Ｓに相当する部分では液晶４０に低ツイストドメインが発生するという問題点がある。このような低ツイストドメインの発生は表示品位を低下させるので、このような領域は画面表示領域として用いることができない。従って、有効な画面表示領域が狭くなってしまう。ここで、シール材３を形成する領域（第１２図に実線の斜線を付した領域）にできるだけに近づけるように配向膜１３、２３をフレキソ印刷すれば、低ツイストドメインが発生する領域を狭めることができるが、いくらフレキソ印刷機の精度を高めても、ローラの走行方向（第１２図に矢印Ｘで示す方向）においては低ツイストドメインが発生する隙間Ｓを狭めることができるほど配向膜１３、２３の印刷領域（第１２図に破線の斜線を付した領域）を制御することは不可能である。また、フレキソ印刷に用いるローラの幅方向（第１２図に矢印Ｙで示す方向）においては、前記の走行方向に比較すれば印刷領域を制御しやすいが、それでも、低ツイストドメインが発生する領域をある一定以上に狭めることは不可能である。
【０００５】
以上の問題点に鑑みて、本発明では、配向膜とシール材との隙間領域で発生する低ツイストドメインを解消することにより、画面表示領域を拡張することのできる液晶パネルおよびその製造方法を実現することにある。
【０００６】
【課題を解決するための手段】
上記課題を解決するために、本発明では、所定の間隙を介してシール材によって貼り合わされた矩形の一対の基板の間には前記シール材によって区画された領域内に液晶が封入されているとともに、該一対の基板には前記液晶の配向状態を制御するための電極がそれぞれ形成された液晶パネルにおいて、前記一対の基板には前記電極の表面側に配向膜がそれぞれ形成され、前記配向膜はいずれも、該配向膜が形成された基板の少なくとも３辺に相当する部分では前記シール材の形成領域と重なる領域まで形成されていることを特徴とする。
【０００７】
また、シール材を介して貼り合わされた一対の基板を有し、前記シール材によって囲まれる領域内に液晶が封入されてなる液晶パネルにおいて、前記一対の基板の前記液晶側に設けられた電極と、前記一対の基板の前記液晶側に設けられて該一対の基板間を導通させる導通用端子と、前記電極上に設けられた配向膜とを有し、前記配向膜は、前記導通用端子によって前記一対の基板の一方と他方とが導通される領域以外の領域で前記シール材の形成領域を越えて設けられていることを特徴とする。
【０００８】
また、前記配向膜は、前記導通用端子によって前記一対の基板の一方と他方とが導通される領域では前記シール材の形成領域と部分的に重なるように設けられていることを特徴とする。
【０００９】
また、前記導通用端子によって前記一対の基板の一方と他方とが導通される領域では、前記配向膜の形成範囲は前記シール材の形成領域の内側で止められていることを特徴とする。
【００１０】
また、前記配向膜は、前記基板の４辺のうち前記導通用端子が設けられている辺を除く各辺では前記シール材の形成領域を越えて設けられていることを特徴とする。
【００１１】
また、前記シール材の形成領域を越えて設けられた前記配向膜は、前記基板の端縁にまで設けられていることを特徴とする。
【００１２】
また、前記シール材は、一液性熱硬化型のエポキシ系シール材であることを特徴とする。
【００１３】
また、前記配向膜の形成領域と略重なる領域には、当該配向膜の下層側で前記電極を覆う透明絶縁膜が形成されていることを特徴とする。
【００１４】
本発明によれば、配向膜がシール材の形成領域と重なる領域まで形成されているので、シール材と配向膜との間には隙間がない。従って、シール材の内周縁付近で低ツイストドメインが発生するおそれがない。それ故、シール材の内周縁付近も画面表示領域として有効に利用できるので、画面表示領域を拡張することができる。
【００１５】
また、本発明による液晶パネルは、前記シール材は、配向膜として用いるポリイミド膜との密着性の高い一液性熱硬化型のエポキシ系シール材を用いることを特徴とする。
【００１６】
本発明によれば、一液性熱硬化型のエポキシ系シール材は配向膜として用いるポリイミド膜との密着性が高い傾向にあり、特に、エポキシ樹脂にアクリル系あるいはシリコン系ゴムをクラフト重合させたハイインパクト化エポキシを配合したものは、一液性熱硬化型のエポキシ系シール材の中でも、ポリイミド膜との間であっても優れた密着性を発揮するので、配向膜の表面に重なるようにシール材を形成してもそれらの界面において十分な液密性や気密性を確保できる。本発明の液晶パネルは、前記配向膜は、前記基板の４辺に相当する部分で前記シール材の形成領域と重なる領域まで形成されていることを特徴とする。
【００１７】
また、本発明の液晶パネルは、前記配向膜は、前記基板の４辺のうち、入出力端子および基板間導通用端子が形成されている辺を除く各辺では前記シール材の形成領域を越えて基板端縁にまで形成されていることを特徴とする。
【００１８】
さらに本発明の液晶パネルは、前記配向膜の形成領域と略重なる領域には、当該配向膜の下層側で前記電極を覆う透明絶縁膜が形成されていることを特徴とする。本発明による液晶パネルの製造方法は、前記一対の基板を複数取りするための大型基板の表面のうち、該大型基板を切断予定線に沿って切断したときに前記一対の基板として分割される各基板形成領域に前記電極をそれぞれ形成した後、当該基板形成領域の少なくとも３辺に相当する部分では前記シール材の形成領域と重なる領域まで前記配向膜を形成すべき薄膜を形成することを特徴とする。
【００１９】
また、本発明による液晶パネルの製造方法は、基板形成領域を複数有する大型基板を前記基板形成領域毎に形成したシール材を介して貼り合わせ、前記大型基板を切断予定線に沿って切断することにより液晶パネルを製造する方法において、前記大型基板上に電極を形成する工程と、前記大型基板が張り合わされた際に該大型基板間を導通させる導通用端子を前記基板形成領域毎に形成する工程と、前記大型基板上の前記電極を覆うように配向膜を形成する工程とを具備し、前記配向膜は、前記導通用端子によって前記大型基板間の導通がなされる領域以外の領域では前記シール材の形成領域を越えて形成されることを特徴とする。
【００２０】
また、前記配向膜は、前記導通用端子によって前記一対の基板の一方と他方とが導通される領域では前記シール材の形成領域と部分的に重なるように形成されることを特徴とする。
【００２１】
また、前記配向膜の形成範囲は、前記導通用端子によって前記一対の基板の一方と他方とが導通される領域において前記シール材の形成領域の内側で止められることを特徴とする。
【００２２】
また、前記配向膜は、前記基板の４辺のうち前記導通用端子が設けられている辺を除く各辺では前記シール材の形成領域を越えて形成されることを特徴とする。
【００２３】
また、前記シール材の形成領域を越えて形成される前記配向膜は、前記基板の端縁にまで形成されることを特徴とする。前記一対の基板を複数取りするための大型基板の表面のうち、該大型基板を切断予定線に沿って切断したときに前記一対の基板として分割される各基板形成領域に前記電極をそれぞれ形成した後、前記切断予定線を跨ぐ複数の基板形成領域に対して前記配向膜を形成すべき薄膜をそれぞれ形成することを特徴とする。
【００２４】
さらに、本発明による液晶パネルの製造方法は、前記一対の基板をそれぞれ複数取りするための一対の大型基板の各表面のうち、該大型基板を切断予定線に沿って切断したときに前記一対の基板として分割される各基板形成領域に前記電極をそれぞれ形成した後、前記一対の大型基板のそれぞれにおいて前記切断予定線を跨ぐ複数の基板形成領域に対して前記配向膜を形成すべき薄膜をそれぞれ形成した以降、該一対の大型基板の少なくとも一方に前記シール材を形成して該大型基板同士を貼り合わせ、しかる後に、貼り合わせた前記大型基板を前記切断予定線に沿って切断することを特徴とする。
【００２５】
またさらに、本発明による液晶パネルの製造方法は、前記大型基板では、入出力端子および基板間導通用端子が形成されている辺が互いに反対側に向くように前記基板形成領域が切断予定線を挟んで配置され、前記配向膜を形成すべき薄膜を形成する際には、当該切断予定線に沿って帯状に前記薄膜を形成することを特徴とする。配向膜を形成すべき薄膜を帯状に形成するのではあれば、フレキソ印刷において、入出力端子および基板間導通用端子が形成されている辺にローラの端部を向けることになる。このようなローラの幅方向であれば、ローラの走行方向と違って、ある程度高い精度で印刷領域を制御できるので、この幅方向では基板の端縁にまで配向膜を形成できない場合でも、シール材の形成領域にかなり近接させて、あるいはシール材の形成領域に部分的に重なるように配向膜を形成することができる。
【００２６】
【発明の実施の形態】
添付図面を参照して、本発明の実施の形態を説明する。
【００２７】
［実施の形態１］
（全体構成）
第１図は、液晶表示装置の外観を示す斜視図であり、第２図は、その分解斜視図である。なお、第１図および第２図において、配線パターンおよび端子などについてはその一部のみを示し、それらの詳細は第３図および第４図に示す。
【００２８】
第１図および第２図において、携帯電話などの電子機器に搭載されている液晶表示装置の液晶パネル１０は、透明ガラスなどによって形成された第１の基板１と、同じく透明ガラスなどによって形成された第２の基板２とを有している。これらの基板の一方にはギャップ材および導電粒子を含有するシール材３が印刷等によって形成され、このシール材３を挟んで第１の基板１と第２の基板２とが接着固定されている。この状態において、第１の基板１と第２の基板２は、シール材３が含有するギャップ材によって所定の間隙が確保され、この間隙のうち、シール材３で区画形成された液晶封入領域４１内に液晶４０が封入されている。第１の基板１の外側表面には偏光板４Ａが粘着剤などによって貼られ、第２の基板２の外側表面にも偏光板４Ｂが粘着剤などで貼られている。液晶パネル１０を反射型として構成する際には、第２の基板２に貼られている偏光板４Ｂの外側に、あるいは偏光板４Ｂの代わりに反射板（図示せず。）が貼られる。
【００２９】
本形態において、第２の基板２は第１の基板１よりも大きいので、第２の基板２に第１の基板１を重ねた状態で、第２の基板２はその一部が第１の基板１の下端縁から張り出す。この張り出し部分１１０には液晶封入領域４１に隣接するようにＩＣ実装領域９が形成され、ここに駆動用ＩＣ３３がＣＯＧ（ＣｈｉｐＯｎＧｌａｓｓ）実装されている。
【００３０】
第２の基板２において、ＩＣ実装領域９よりさらに下端縁の側では、ＩＣ実装領域９に隣接するように複数の入出力端子７Ｄが基板端縁に沿って形成され、これらの入出力端子７Ｄには、第１図に二点鎖線で示すように、フレキシブル基板２９が接続される。
【００３１】
第３図および第４図はそれぞれ、第１の基板１および第２の基板２に形成した透明電極の配置パターンを示す平面図である。
【００３２】
第３図において、第１の基板１の内側表面には、シール剤３で区画形成された液晶封入領域４１の内側に、キャラクタ表示用あるいはドット表示用の電極６Ａと、液晶封入領域４１の外側で第２の基板２との導通を図るために辺１０１に沿って並ぶ基板間導通用の端子６Ｃとを備える電極パターン６が形成されている。
【００３３】
この電極パターン６は、ＩＴＯ膜などで形成されている。
【００３４】
第４図において、第２の基板２の内側表面には、シール材３で区画形成された液晶封入領域４１の内側に、キャラクタ表示用あるいはドット表示用の電極７Ａと、液晶封入領域４１の外側で電極７ＡをＩＣ実装領域９に向けて配線するための配線部７Ｂと、液晶封入領域４１の外側で第１の基板１との導通を図るために辺２０１の側で並ぶ基板間導通用の端子７Ｃと、辺２０１に沿って並ぶ入出力端子７Ｄとを備える電極パターン７が形成されている。この電極パターン７もＩＴＯ膜などで形成されている。
【００３５】
このように構成した第１の基板１と第２の基板２とを第１図および第５図（Ａ）、（Ｂ）に示すように貼り合わせた状態で、第１の基板１の端子６Ｃと第２の基板２の端子７Ｃとが対向するので、端子６Ｃ、７Ｃの間に介在するシール材３に含まれる導電粒子は、端子６Ｃと端子７Ｃとを導通させ、第１の基板１と第２の基板２との間での導通を図ることができる。すなわち、シール材３に含まれる導電粒子は、弾性変形可能なプラスチックビーズの表面にニッケルもしくは金メッキを施したもので、その粒径は約５〜９μｍである。これに対して、シール材３に含まれるギャップ材の粒径は約４〜８μｍである。それ故、第１の基板１と第２の基板２とを重ねた状態でその間隙を狭めるような力を加えながらシール材３を溶融、硬化させると、導電粒子は、第１の基板１と第２の基板２との間で押し潰された状態で第１の基板１の端子６Ｃと第２の基板２の端子７Ｃとを導通させる。
【００３６】
また、第１の基板１と第２の基板２とを貼り合わせた状態で、第１の基板１の電極６Ａと第２の基板２の電極７Ａとの間に対向部分が構成されるので、これらの電極６Ａ、７Ａによって液晶４０に電場をかけることにより液晶４０の配向状態を制御し、液晶パネル１０に希望の像を表示することができる。
【００３７】
（透明絶縁膜および配向膜の構成）
第５図（Ａ）、（Ｂ）はそれぞれ、第１図に示す液晶パネルの断面図、およびその端部を拡大して示す断面図である。第６図は、第１図に示す液晶パネルの配向膜形成領域とシール材形成領域との関係を模式的に示す液晶パネルの平面図である。
【００３８】
このように構成した液晶パネル１０において、第５図（Ａ）、（Ｂ）に示すように、第１および第２の基板１、２では、電極６Ａ、７Ａを覆うように透明絶縁膜１２、２２が形成され、この透明絶縁膜１２、２２の表面にはポリイミド膜からなる配向膜１３、２３が形成されている。これらの配向膜１３、２３は、ラビング処理が施されたポリイミド膜であり、液晶４０をＳＴＮ（ＳｕｐｅｒＴｗ
ｉｓｔｅｄＮｅｍａｔｉｃ）方式で用いるようになっている。
【００３９】
ここで、第５図（Ａ）、（Ｂ）および第６図（配向膜１３、２３および透明絶縁膜１２、２２の形成領域を破線の斜線領域で示し、シール材３の形成領域を実線の斜線領域で示す。）に示すように、第１および第２の基板１、２のいずれにおいても、透明絶縁膜１２、２２および配向膜１３、２３は、第１および第２の基板１、２の４辺１０１〜１０４、２０１〜２０４に相当する部分でシール材３の形成領域と重なる領域まで形成されている。
【００４０】
ここに用いるシール材３として、本形態では、配向膜１３、２３を構成するポリイミド膜との間であっても密着性の高い一液性熱硬化型のエポキシ系シール材を用いている。たとえば、三井東圧化学社製のストラクトボンドＥＳシリーズ（商品名）を用いている。この一液性熱硬化型のエポキシ系シール材は、エポキシ樹脂にジシアンジアミド、ジヒドラジド類イミダゾール類その他の潜在性硬化剤を分散させ、さらに無機フィラー、溶剤、粘度調整剤などを配合したものである。さらに、この系に対しては、エポキシのハイインパクト化技術、すなわち、エポキシ樹脂にアクリル系あるいはシリコン系ゴムをクラフト重合させたハイインパクト化エポキシを配合してある。従って、一液性熱硬化型のエポキシ系シール材の中でも、三井東圧化学社製のストラクトボンドＥＳシリーズはポリイミド膜との間であっても優れた密着性を発揮するので、配向膜１３、２３の表面に重なるようにシール材３を形成しても、それらの界面で優れた液密性や気密性を発揮する。
【００４１】
このようにして配向膜１３、２３の形成領域を設定するにあたって、第１の基板１の辺１０１に相当する部分には、第２の基板２との導通用の端子６Ｃが形成され、第２の基板２の辺２０１に相当する部分には、第１の基板１との導通用の端子７Ｃおよび入出力端子７Ｄが形成されているので、これらの端子６Ｃ、７Ｃ、７Ｄを配向膜１３、２３で覆うと電気的な導通を図れなくなる。そこで、本形態では、第１および第２の基板１、２の４辺１０１〜１０４、２０１〜２０４のうち、導通用の端子６Ｃ、７Ｃおよび入出力端子７Ｄが形成されている辺１０１、２０１に相当する部分では、配向膜１３、２３をシール材３の形成領域と部分的に重なるように形成するに止め、その他の３辺１０２〜１０４、２０２〜２０４に相当する部分では配向膜１３、２３を第１および第２の基板１、２の端縁まで形成してある。
【００４２】
また、電極６Ｃ、７Ｃを覆うように形成された透明絶縁膜１２、２２については、配向膜１３、２３に対して略重なるように形成されている。すなわち、透明絶縁膜１２、２２についても、第１および第２の基板１、２の導通用の端子６Ｃ、７Ｃおよび入出力端子７Ｄを覆うと電気的な導通を図れなくなるので、第１および第２の基板１、２の４辺１０１〜１０４、２０１〜２０４のうち、導通用の端子６Ｃ、７Ｃおよび入出力端子７Ｄが形成されている辺１０１、２０１に相当する部分では、透明絶縁膜１２、２２をシール材３の形成領域と部分的に重なるように形成するに止め、その他の３辺１０２〜１０４、２０２〜２０４に相当する部分では透明絶縁膜１２、２２を第１および第２の基板１、２の端縁まで形成してある。
従って、本形態の液晶パネル１０では、第５図（Ｂ）に示すように、シール材３と配向膜１３、２３との間に隙間がないので、シール材３の内周縁付近で液晶４０に低ツイストドメインが発生するおそれがない。従って、シール材３の内周縁付近も有効な画面表示領域として用いることができるので、画面表示領域を拡張することができる。
【００４３】
（液晶パネルの製造方法）
このような構成の液晶パネル１０の製造方法を第５図（Ａ）、（Ｂ）および第７図を参照して説明する。第７図は、第１図に示す液晶パネルの製造工程において、第１の基板１および第２の基板２をそれぞれ複数取りするための第１および第２の大型基板１Ａ、２Ａ、これらの第１および第２の大型基板１Ａ、２Ａに形成した透明絶縁膜１２、２２並びに配向膜１３、２３の形成領域、およびシール材３の形成領域を示す説明図である。なお、第７図には、第１の基板１および第２の基板２をそれぞれ複数取りするための第１および第２大型基板１Ａ、２Ａ、これらの第１および第２の大型基板１Ａ、２Ａに対する透明絶縁膜１２、２２並びに配向膜１３、２３の形成領域（破線の斜線領域）、およびシール材３の形成領域（実線の斜線領域）を示し、その他の構成部分を省略してあるので、第１および第２の大型基板１Ａ、２Ａに形成していく各構成要素の説明は第５図（Ａ）、（Ｂ）を参照することにする。
【００４４】
まず、第５図（Ａ）、（Ｂ）および第７図に示すように、第１の基板１および第２の基板２をそれぞれ複数取りするための第１および第２の大型基板１Ａ、２Ａの表面全体に下地保護膜１１、２１を形成した後、これらの大型基板１Ａ、２Ａを切断予定線Ｌ１、Ｌ２に沿って切断したときに第１および第２の基板１、２として分割される各基板形成領域に、フォトリソグラフィ技術を用いて電極６Ａ、７Ａや端子６Ｃ、７Ｃなどの電極パターン６、７を形成する。
次に、第１および第２の大型基板１Ａ、２Ａに対して電極６Ａ、７Ａを覆うようにシリコン酸化膜からなる透明絶縁膜１２、２２を形成する。これらの透明絶縁膜１２、２２は、切断予定線Ｌ１、Ｌ２を跨いで複数の基板形成領域に対して帯状に形成する。すなわち、第１および第２の大型基板１Ａ、２Ａでは、入出力端子１２および基板間導通用の端子６Ｃ、７Ｃが形成されている辺１０１、２０１が互いに反対側に向くように基板形成領域が切断予定線Ｌ２を挟んで配置されているので、透明絶縁膜１２、２２を切断予定線Ｌ２に沿って帯状に形成する。
【００４５】
その結果、第１および第２の大型基板１Ａ、２Ａを切断予定線Ｌ１、Ｌ２に沿って切断して単品の第１および第２の基板１、２に分割したときの第１および第２の基板１、２の４辺１０１〜１０４、２０１〜２０４に相当する部分において、透明絶縁膜１２、２２はシール材３の形成領域に重なるように形成される。また、透明絶縁膜１２、２２は、第１および第２の基板１、２の４辺１０１〜１０４、２０１〜２０４のうち、基板間導通用の端子６Ａ、７Ａおよび入出力端子７Ｄが形成されている辺１０１、２０１を除く３辺１０２〜１０４、２０２〜２０４に相当する部分ではシール材３の形成領域を越えて第１および第２の基板１、２の端縁にまで形成され、基板間導通用の端子６Ａ、７Ａおよび入出力端子７Ｄが形成されている辺１０１、２０１に相当する部分ではシール材３の形成領域に部分的に重なるように形成される。
【００４６】
次に、第１および第２の大型基板１Ａ、２Ａに対して透明絶縁膜１２、２２を覆うようにポリイミド膜（配向膜１３、２３）をフレキソ印刷により形成する。
【００４７】
これらのポリイミド膜（配向膜１３、２３）も、切断予定線Ｌ１、Ｌ２を跨がって複数の基板形成領域に対して帯状に形成する。すなわち、第１および第２の大型基板１Ａ、２Ａでは、入出力端子７Ｄおよび基板間導通用の端子６Ｃ、７Ｃが形成されている辺１０１、２０１が互いに反対側に向くように基板形成領域が切断予定線Ｌ２を挟んで配置されているので、フレキソ印刷機のローラの端部を辺１０１、２０１の方に向けてローラを切断予定線Ｌ２に沿って走行させ、ポリイミド膜（配向膜１３、２３）を切断予定線Ｌ２に沿って帯状に形成する。その結果、第１および第２の大型基板１Ａ、２Ａを切断予定線Ｌ１、Ｌ２に沿って切断して単品の第１および第２の基板１、２に分割したときの第１および第２の基板１、２の４辺１０１〜１０４、２０１〜２０４に相当する部分において、ポリイミド膜（配向膜１３、２３）はシール材３の形成領域に重なるように形成される。また、ポリイミド膜（配向膜１３、２３）は、第１および第２の基板１、２の４辺１０１〜１０４、２０１〜２０４のうち、基板間導通用の端子６Ａ、７Ａおよび入出力端子７Ｄが形成されている辺１０１、２０１を除く３辺１０２〜１０４、２０２〜２０４に相当する部分ではシール材３の形成領域を越えて第１および第２の基板１、２の端縁にまで形成され、基板間導通用の端子６Ａ、７Ａおよび入出力端子７Ｄが形成されている辺１０１、２０１に相当する部分ではシール材３の形成領域に部分的に重なるように形成される。
【００４８】
次に、第１および第２の大型基板にラビング処理を行ってポリイミド膜を配向膜１３、２３とする。
【００４９】
次に、第２の大型基板２Ａに対して、配向膜１３、２３の表面にシール材３を印刷した後、プリベークを行い、しかる後に、シール材３を介して第１の大型基板１Ａと第２の大型基板２Ａとを貼り合わせる。この際には、第５図（Ａ）に示すように、第１の大型基板１に対してスペーサ３２を散布してから第１の大型基板１Ａと第２の大型基板２Ａとを貼り合わせる。
【００５０】
再び第５図（Ａ）、（Ｂ）および第７図において、第１の大型基板１Ａと第２の大型基板２Ａとを貼り合わせた後は、第１の大型基板１Ａと第２の大型基板２Ａとを貼り合わせたものを切断予定線Ｌ１、Ｌ２に沿って切断して単品の液晶パネル１０に分割するか、あるいは第１の大型基板１Ａと第２の大型基板２Ａとを貼り合わせたものを切断予定線Ｌ１に沿って切断して短冊状のパネルに分割する。これらのいずれの状態に切断しても、その切断面（辺１０４、２０４に相当する部分）にシール材３の途切れ部分３０が開口する。
【００５１】
従って、第１および第２の基板１、２の間隙のうち、シール材３で区画された領域を真空状態にしてこの途切れ部分３０を液晶中に浸けた状態で大気開放すれば、シール材３で区画された領域内に液晶４０が注入される。それ故、液晶４０の注入後、シール材３の途切れ部分３０を塞げば、第１および第２の基板１、２の間隙３１に液晶４０が封入された状態となる。
【００５２】
この状態で、すでに単品の液晶パネル１０に分割されておれば、第１図および第５図（Ａ）、（Ｂ）に示すように、そのまま偏光板４Ａ、４Ｂなどの貼り付けを行う。これに対して、短冊状のパネルに分割されておれば、単品の液晶パネル１０に分割した後、偏光板４Ａ、４Ｂなどの貼り付けを行う。
【００５３】
しかる後には、第１図に示すように、第２の基板２の入出力端子７Ｄにフレキシブル配線基板２９を異方性導電膜などを用いて圧着し、検査工程に回送する。
【００５４】
このように、本形態の製造方法によれば、フレキソ印刷機のローラ面の走行方向（第７図に矢印Ｘで示す方向）においてはべた塗りを行えばよいので、この方向では配向膜１３、２３の印刷領域を制御できなくても、シール材３と配向膜１３、２３との間に隙間が発生しない。また、フレキソ印刷に用いるローラ面の幅方向（第７図に矢印Ｙで示す方向）においては、配向膜１３、２３が基板間導通用の端子６Ａ、７Ａおよび入出力端子７Ｄを覆うことがないようにその印刷領域を制御する必要があるが、このような方向については、フレキソ印刷機において印刷領域の制御が比較的容易であるので、この方向においてもシール材３と配向膜１３、２３との間に隙間が発生しない。
【００５５】
［実施形態２］
第８図は、本発明の実施の形態２に係る液晶パネルの製造工程において、第１の基板および第２の基板をそれぞれ複数取りするための第１および第２の大型基板、これらの第１および第２の大型基板に形成した透明絶縁膜並びに配向膜の形成領域（右下がりの点線の斜線領域）、およびシール材の形成領域（右上がりの実線の斜線領域）を示す説明図である。なお、本形態の液晶パネルの基本的な構成は、実施の形態１に係る液晶パネルと共通するので、対応する部分には同一の符号を付して第８図に示すとともに、それらの詳細な説明を省略する。
【００５６】
第８図に示すように、本形態では、第１および第２の大型基板１Ａ、２Ａに対して電極６Ａ、７Ａ（第３図、第４図および第５図を参照。）を覆うようにシリコン酸化膜からなる透明絶縁膜１２、２２を形成する。これらの透明絶縁膜１２、２２は、切断予定線Ｌ１、Ｌ２のうち、切断予定線Ｌ１を跨ぐが、切断予定線Ｌ２については跨ぐことなく、複数の基板形成領域に対して各列毎に帯状に形成する。
その結果、第１および第２の大型基板１Ａ、２Ａを切断予定線Ｌ１、Ｌ２に沿って切断して単品の第１および第２の基板１、２に分割したときの第１および第２の基板１、２の４辺１０１〜１０４、２０１〜２０４に相当する部分において、透明絶縁膜１２、２２はシール材３の形成領域に重なるように形成される。
【００５７】
また、透明絶縁膜１２、２２は、第１および第２の基板１、２の４辺１０１〜１０４、２０１〜２０４のうち、基板間導通用の端子６Ａ、７Ａおよび入出力端子７Ｄが形成されている辺１０１、２０１、および切断予定線Ｌ２の側に位置する辺１０３、２０３を除く２辺１０２、１０４、２０２、２０４に相当する部分では、シール材３の形成領域を越えて第１および第２の基板１、２の端縁にまで形成される。
【００５８】
次に、第１および第２の大型基板１Ａ、２Ａに対して透明絶縁膜１２、２２を覆うようにポリイミド膜（配向膜１３、２３）をフレキソ印刷により形成する。
【００５９】
これらのポリイミド膜（配向膜１３、２３）も、切断予定線Ｌ１、Ｌ２のうち、切断予定線Ｌ１を跨ぐが、切断予定線Ｌ２については跨ぐことなく、複数の基板形成領域に対して各列毎に帯状に形成する。
【００６０】
その結果、第１および第２の大型基板１Ａ、２Ａを切断予定線Ｌ１、Ｌ２に沿って切断して単品の第１および第２の基板１、２に分割したときの第１および第２の基板１、２の４辺１０１〜１０４、２０１〜２０４に相当する部分において、ポリイミド膜（配向膜１３、２３）はシール材３の形成領域に重なるように形成される。また、ポリイミド膜（配向膜１３、２３は、第１および第２の基板１、２の４辺１０１〜１０４、２０１〜２０４のうち、基板間導通用の端子６Ａ、７Ａおよび入出力端子７Ｄが形成されている辺１０１、２０１、および切断予定線Ｌ２の側に位置する辺１０３、２０３を除く２辺１０２、１０４、２０２、２０４に相当する部分ではシール材３の形成領域を越えて第１および第２の基板１、２の端縁にまで形成される。
【００６１】
［実施形態３］
第９図は、本発明の実施の形態３に係る液晶パネルの製造工程において、第１の基板および第２の基板をそれぞれ複数取りするための第１および第２の大型基板、これらの第１および第２の大型基板に形成した透明絶縁膜並びに配向膜の形成領域（右下がりの点線の斜線領域）、およびシール材の形成領域（右上がりの実線の斜線領域）を示す説明図である。なお、本形態の液晶パネルの基本的な構成は、実施の形態１に係る液晶パネルと共通するので、対応する部分には同一の符号を付して第９図に示すとともに、それらの詳細な説明を省略する。
【００６２】
第９図に示すように、本形態では、第１および第２の大型基板１Ａ、２Ａに対して電極６Ａ、７Ａ（第３図、第４図および第５図を参照。）を覆うようにシリコン酸化膜からなる透明絶縁膜１２、２２を形成する。これらの透明絶縁膜１２、２２は、切断予定線Ｌ１、Ｌ２のうち、切断予定線Ｌ２を跨ぐが、切断予定線Ｌ１については跨ぐことなく、複数の基板形成領域に対して帯状に形成する。その結果、第１および第２の大型基板１Ａ、２Ａを切断予定線Ｌ１、Ｌ２に沿って切断して単品の第１および第２の基板１、２に分割したときの第１および第２の基板１、２の４辺１０１〜１０４、２０１〜２０４に相当する部分において、透明絶縁膜１２、２２はシール材３の形成領域に重なるように形成される。また、透明絶縁膜１２、２２は、第１および第２の基板１、２の４辺１０１〜１０４、２０１〜２０４のうち、切断予定線Ｌ２の側に位置する辺１０３、２０３に相当する部分では、シール材３の形成領域を越えて第１および第２の基板１、２の端縁にまで形成される。
【００６３】
また、第１および第２の大型基板１Ａ、２Ａに対して透明絶縁膜１２、２２を覆うようにポリイミド膜（配向膜１３、２３）をフレキソ印刷により形成する。
【００６４】
これらのポリイミド膜（配向膜１３、２３）も、切断予定線Ｌ１、Ｌ２のうち、切断予定線Ｌ２を跨ぐが、切断予定線Ｌ１については跨ぐことなく、複数の基板形成領域に対して帯状に形成する。その結果、第１および第２の大型基板１Ａ、２Ａを切断予定線Ｌ１、Ｌ２に沿って切断して単品の第１および第２の基板１、２に分割したときの第１および第２の基板１、２の４辺１０１〜１０４、２０１〜２０４に相当する部分において、ポリイミド膜（配向膜１３、２３）はシール材３の形成領域に重なるように形成される。
【００６５】
また、ポリイミド膜（配向膜１３、２３）は、第１および第２の基板１、２の４辺１０１〜１０４、２０１〜２０４のうち、切断予定線Ｌ２の側に位置する辺１０３、２０３に相当する部分ではシール材３の形成領域を越えて第１および第２の基板１、２の端縁にまで形成される。
【００６６】
［実施形態４］
第１０図は、本発明の実施の形態４に係る液晶パネルの製造工程において、第１の基板および第２の基板をそれぞれ複数取りするための第１および第２の大型基板、これらの第１および第２の大型基板に形成した透明絶縁膜並びに配向膜の形成領域（右下がりの点線の斜線領域）、およびシール材の形成領域（右上がりの実線の斜線領域）を示す説明図である。なお、本形態の液晶パネルの基本的な構成は、実施の形態１に係る液晶パネルと共通するので、対応する部分には同一の符号を付して第１０図に示すとともに、それらの詳細な説明を省略する。
【００６７】
第１０図に示すように、本形態では、第１および第２の大型基板１Ａ、２Ａに対して電極６Ａ、７Ａ（第３図、第４図および第５図を参照。）を覆うようにシリコン酸化膜からなる透明絶縁膜１２、２２を形成する。これらの透明絶縁膜１２、２２は、切断予定線Ｌ１、Ｌ２を跨ぐことなく、複数の基板形成領域毎に独立して形成される。それでも、第１および第２の大型基板１Ａ、２Ａを切断予定線Ｌ１、Ｌ２に沿って切断して単品の第１および第２の基板１、２に分割したときの第１および第２の基板１、２の４辺１０１〜１０４、２０１〜２０４に相当する部分において、透明絶縁膜１２、２２はシール材３の形成領域に重なるように形成される。
【００６８】
また、第１および第２の大型基板１Ａ、２Ａに対して透明絶縁膜１２、２２を覆うようにポリイミド膜（配向膜１３、２３）をフレキソ印刷により形成する。
【００６９】
これらのポリイミド膜（配向膜１３、２３）も、切断予定線Ｌ１、Ｌ２を跨ぐことなく、複数の基板形成領域毎に形成する。それでも、第１および第２の大型基板１Ａ、２Ａを切断予定線Ｌ１、Ｌ２に沿って切断して単品の第１および第２の基板１、２に分割したときの第１および第２の基板１、２の４辺１０１〜１０４、２０１〜２０４に相当する部分において、ポリイミド膜（配向膜１３、２３）はシール材３の形成領域に重なるように形成される。
【００７０】
［その他の実施形態］
なお、上記のいずれに形態においても、透明絶縁膜１２、２２およびポリイミド膜（配向膜１３、２３）は、基板の４辺においてシール材３の形成領域に重なるように形成されていたが、少なくとも３辺においてシール材３の形成領域に重なっておればよい。たとえば、第１および第２の基板１、２の４辺１０１〜１０４、２０１〜２０４のうち、基板間導通用の端子６Ａ、７Ａおよび入出力端子７Ｄが形成されている辺１０１、２０１ではシール材３の形成領域の内側で、透明絶縁膜１２、２２およびポリイミド膜（配向膜１３、２３）の形成範囲を止めてもよい。
【００７１】
また、パッシブマトリクスタイプの液晶パネルの例であったが、アクティブマトリクスタイプの液晶パネルに本発明を適用してもよい。
【００７２】
さらに、上記形態では大型基板の段階で配向膜などを形成し、大型基板同士を貼り合わせてから単品の液晶パネルに切断していく例であったが、単品の基板の状態で電極や配向膜を形成する場合であっても本発明を適用できる。
【００７３】
【発明の効果】
以上説明したように、本発明に係る液晶パネルおよびその製造方法では、配向膜がシール材の形成領域と重なる領域まで形成されているので、シール材と配向膜との間に隙間がなく、シール材の内周縁付近で低ツイストドメインが発生するおそれがないうえ、シール材の内周縁付近も画面表示領域として有効に利用できる。従って、より広い画面表示領域を必要とする液晶表示装置およびその製造方法として有用であり、特に限られた画面表示領域を有効利用して、より多くの表示を必要とする液晶表示装置およびその製造方法として用いるのに適している。
【図面の簡単な説明】
【図１】液晶表示装置の外観を示す斜視図である。
【図２】第１図に示す液晶表示装置に用いた液晶パネルの分解斜視図である。
【図３】第１図に示す液晶パネルの第１の基板に形成した透明電極の配置パターンを示す平面図である。
【図４】第１図に示す液晶パネルの第２の基板に形成した透明電極の配置パターンを示す平面図である。
【図５】（Ａ）、（Ｂ）はそれぞれ、第１図に示す液晶パネルの断面図、およびその端部を拡大して示す断面図である。
【図６】第１図に示す液晶パネルの配向膜形成領域とシール材形成領域との関係を模式的に示す液晶パネルの平面図である。
【図７】第１図に示す液晶パネルの製造工程において、第１の基板および第２の基板をそれぞれ複数取りするための第１および第２の大型基板、これらの第１および第２の大型基板に形成した透明絶縁膜並びに配向膜の形成領域（右下がりの点線の斜線領域）、およびシール材の形成領域（右上がりの実線の斜線領域）を示す説明図である。
【図８】本発明の実施の形態２に係る液晶パネルの製造工程において、第１の基板および第２の基板をそれぞれ複数取りするための第１および第２の大型基板、これらの第１および第２の大型基板に形成した透明絶縁膜並びに配向膜の形成領域（右下がりの点線の斜線領域）、およびシール材の形成領域（右上がりの実線の斜線領域）を示す説明図である。
【図９】本発明の実施の形態３に係る液晶パネルの製造工程において、第１の基板および第２の基板をそれぞれ複数取りするための第１および第２の大型基板、これらの第１および第２の大型基板に形成した透明絶縁膜並びに配向膜の形成領域（右下がりの点線の斜線領域）、およびシール材の形成領域（右上がりの実線の斜線領域）を示す説明図である。
【図１０】本発明の実施の形態４に係る液晶パネルの製造工程において、第１の基板および第２の基板をそれぞれ複数取りするための第１および第２の大型基板、これらの第１および第２の大型基板に形成した透明絶縁膜並びに配向膜の形成領域（右下がりの点線の斜線領域）、およびシール材の形成領域（右上がりの実線の斜線領域）を示す説明図である。
【図１１】（Ａ）、（Ｂ）はそれぞれ、従来の液晶パネルの断面図、およびその端部を拡大して示す断面図である。
【図１２】第１１図に示す従来の液晶パネルの製造工程において、第１の基板および第２の基板をそれぞれ複数取りするための第１および第２の大型基板、これらの第１および第２の大型基板に形成した透明絶縁膜並びに配向膜の形成領域（右下がりの斜線領域）、およびシール材の形成領域（右上がりの斜線領域）を示す説明図である。[0001]
BACKGROUND OF THE INVENTION
TECHNICAL FIELD The present invention relates to a liquid crystal panel used for a liquid crystal display device and a manufacturing method thereof. More specifically, the present invention relates to a structure technology of each substrate constituting the liquid crystal panel.
[0002]
[Prior art]
As shown in FIGS. 11 (A) and 11 (B), the transparent first substrate 1 and the second substrate 2 constituting the liquid crystal panel 10 are bonded with a sealant 3 with a predetermined gap with a spacer 32 interposed therebetween. The liquid crystal 40 is sealed in the gap 31. Further, polarizing plates 4A and 4B are attached to the first and second substrates 1 and 2, respectively. On the inner surface of the first substrate 1, an electrode 6A for displaying various characters or dots is formed on the surface of a base protective film 11 made of a silicon oxide film or the like by using an ITO film (Indium Tin Oxide) which is a transparent conductive film. On the inner surface of the second substrate 2, various character display or dot display electrodes 7 A are formed of ITO film on the surface of the base protective film 21 made of a silicon oxide film or the like. Further, on the first and second substrates 1 and 2, transparent insulating films 12 and 22 are formed so as to cover the electrodes 6A and 7A, and an alignment film 13 made of a polyimide film is formed on the surfaces of the transparent insulating films 12 and 22. , 23 are formed.
[0003]
Here, the sealing material 3 is conventionally a phenol-novolak type two-component mixed epoxy resin or an aliphatic type two-component mixed epoxy resin, and comes into contact with the alignment films 13 and 23 made of a polyimide film. There is a tendency that sufficient adhesion cannot be secured at the interface. For this reason, in the conventional liquid crystal panel 10, since it is necessary to ensure the clearance S between the sealing material 3 and the alignment films 13 and 23, the following manufacture is employ | adopted. That is, in the manufacturing process of the conventional liquid crystal panel 1, as shown in FIG. 12, the first and second large substrates 1A, 2A for taking a plurality of single first and second substrates 1, 2 respectively. Of the large-sized substrates 1A and 2A, the electrodes are formed on the respective substrate forming regions which are divided as the single first and second substrates 1 and 2 when cut along the predetermined cutting lines L1 and L2. After forming 6A and 7A, the transparent insulating films 12 and 22 are formed in a region slightly inside the region where the sealing material 4 is formed (the hatched region in FIG. 12), and then overlaps the transparent insulating films 12 and 22 Thus, the alignment films 13 and 23 (polyimide film) are flexographically printed. Then, a sealing material 3 is formed on one of the first and second large substrates 1A and 2A so as to surround the formation region of the alignment films 13 and 23 on the outer peripheral side. The large substrate 1A and the second large substrate 2A are bonded together. Next, the first and second large substrates 1A and 2A bonded together are cut into a single panel or a strip-shaped panel, and then liquid crystal is injected under reduced pressure from the discontinuous portion 30 of the sealing material 3, and thereafter Then, the interrupted portion 30 of the sealing material 3 is closed.
[0004]
However, in the conventional liquid crystal panel 1, there is a gap S between the seal material 3 and the alignment films 13 and 23 as shown in FIG. There is a problem that a low twist domain occurs. Since the occurrence of such a low twist domain lowers the display quality, such an area cannot be used as a screen display area. Therefore, the effective screen display area is narrowed. Here, if the alignment films 13 and 23 are flexographically printed so as to be as close as possible to the region where the sealing material 3 is formed (the region hatched with a solid line in FIG. 12), the region where the low twist domain occurs is narrowed. However, no matter how much the accuracy of the flexographic printing machine is improved, the alignment film 13 can narrow the gap S in which the low twist domain is generated in the running direction of the roller (the direction indicated by the arrow X in FIG. 12). It is impossible to control the 23 print areas (areas with broken lines in FIG. 12). Further, in the width direction of the roller used for flexographic printing (the direction indicated by the arrow Y in FIG. 12), the printing area can be easily controlled as compared with the traveling direction, but the area where the low twist domain still occurs. It is impossible to narrow it beyond a certain level.
[0005]
In view of the above problems, the present invention realizes a liquid crystal panel capable of expanding a screen display area and a manufacturing method thereof by eliminating the low twist domain generated in the gap area between the alignment film and the sealing material. There is to do.
[0006]
[Means for Solving the Problems]
In order to solve the above problems, in the present invention, liquid crystal is sealed in a region defined by the sealing material between a pair of rectangular substrates bonded by a sealing material through a predetermined gap. In the liquid crystal panel in which electrodes for controlling the alignment state of the liquid crystal are formed on the pair of substrates, respectively, an alignment film is formed on the surface side of the electrodes on the pair of substrates, In any case, a portion corresponding to at least three sides of the substrate on which the alignment film is formed is formed up to a region overlapping with the region where the sealing material is formed.
[0007]
In addition, in a liquid crystal panel having a pair of substrates bonded via a sealing material, and liquid crystal is sealed in a region surrounded by the sealing material, electrodes provided on the liquid crystal side of the pair of substrates; A conductive terminal provided on the liquid crystal side of the pair of substrates to conduct between the pair of substrates, and an alignment film provided on the electrode, wherein the alignment film is formed by the conductive terminal. It is characterized by being provided beyond the region where the sealing material is formed in a region other than a region where one and the other of the pair of substrates are electrically connected.
[0008]
Further, the alignment film is provided so as to partially overlap with a region where the sealing material is formed in a region where one of the pair of substrates is electrically connected by the conductive terminal.
[0009]
In the region where one of the pair of substrates is electrically connected to the other by the conduction terminal, the formation range of the alignment film is stopped inside the formation region of the sealing material.
[0010]
Further, the alignment film is provided so as to extend beyond a region where the sealing material is formed on each side of the four sides of the substrate except the side where the conduction terminal is provided.
[0011]
Further, the alignment film provided beyond the region where the sealing material is formed is provided up to an edge of the substrate.
[0012]
Further, the sealing material is a one-component thermosetting epoxy sealing material.
[0013]
Further, a transparent insulating film that covers the electrode on a lower layer side of the alignment film is formed in a region that substantially overlaps with the formation region of the alignment film.
[0014]
According to the present invention, since the alignment film is formed up to the region overlapping with the sealing material forming region, there is no gap between the sealing material and the alignment film. Therefore, there is no possibility that a low twist domain is generated near the inner periphery of the seal material. Therefore, the vicinity of the inner periphery of the sealing material can be effectively used as the screen display area, so that the screen display area can be expanded.
[0015]
The liquid crystal panel according to the present invention is characterized in that the sealing material is a one-component thermosetting epoxy sealing material having high adhesion to a polyimide film used as an alignment film.
[0016]
According to the present invention, the one-component thermosetting epoxy-based sealing material tends to have high adhesion to the polyimide film used as the alignment film, and in particular, an acrylic resin or a silicon-based rubber is kraft polymerized to the epoxy resin. The high-impact epoxy blended material exhibits excellent adhesion even with a polyimide film, even in a one-part thermosetting epoxy sealant, so that it overlaps the surface of the alignment film. Even if a sealing material is formed, sufficient liquid tightness and air tightness can be secured at the interface between them. The liquid crystal panel of the present invention is characterized in that the alignment film is formed up to a region that overlaps a region where the sealing material is formed at a portion corresponding to four sides of the substrate.
[0017]
In the liquid crystal panel of the present invention, the alignment film may exceed the region where the sealing material is formed on each side of the four sides of the substrate except the side where the input / output terminals and the inter-substrate conduction terminals are formed. In other words, it is formed up to the edge of the substrate.
[0018]
Furthermore, the liquid crystal panel of the present invention is characterized in that a transparent insulating film that covers the electrode on the lower layer side of the alignment film is formed in a region that substantially overlaps the formation region of the alignment film. The method of manufacturing a liquid crystal panel according to the present invention includes: dividing each of the large substrates for taking a plurality of the pair of substrates as the pair of substrates when the large substrate is cut along a predetermined cutting line. After each of the electrodes is formed in the substrate forming region, a thin film on which the alignment film is to be formed is formed in a portion corresponding to at least three sides of the substrate forming region up to a region overlapping with the sealing material forming region. To do.
[0019]
The method for manufacturing a liquid crystal panel according to the present invention includes bonding a large substrate having a plurality of substrate formation regions through a sealing material formed for each substrate formation region, and cutting the large substrate along a planned cutting line. In the method of manufacturing a liquid crystal panel, a step of forming an electrode on the large substrate, and a step of forming a conduction terminal for connecting the large substrates to each substrate formation region when the large substrates are bonded to each other And forming an alignment film so as to cover the electrodes on the large substrate, and the alignment film has the seal in a region other than a region where conduction between the large substrates is made by the conductive terminal. It is characterized by being formed beyond the material formation region.
[0020]
The alignment film may be formed so as to partially overlap with a region where the sealing material is formed in a region where one of the pair of substrates is electrically connected to the other by the conductive terminal.
[0021]
In addition, the formation range of the alignment film may be stopped inside the sealing material formation region in a region where one of the pair of substrates is electrically connected to the other by the conduction terminal.
[0022]
Further, the alignment film is formed so as to extend beyond the region where the sealing material is formed on each side of the four sides of the substrate except the side where the conduction terminal is provided.
[0023]
The alignment film formed beyond the region where the sealing material is formed is formed up to an edge of the substrate. Of the surface of the large substrate for taking a plurality of the pair of substrates, the electrodes are respectively formed in the respective substrate formation regions that are divided as the pair of substrates when the large substrate is cut along a cutting line. Thereafter, a thin film on which the alignment film is to be formed is formed on each of a plurality of substrate formation regions straddling the planned cutting line.
[0024]
Furthermore, in the method for manufacturing a liquid crystal panel according to the present invention, the pair of large substrates out of each surface of the pair of large substrates for taking a plurality of the pair of substrates are cut when the large substrates are cut along a predetermined cutting line. After each of the electrodes is formed in each substrate formation region divided as a substrate, a thin film on which the alignment film is to be formed on each of the plurality of substrate formation regions across the planned cutting line in each of the pair of large substrates After the formation, the sealing material is formed on at least one of the pair of large substrates, the large substrates are bonded together, and then the bonded large substrate is cut along the planned cutting line. And
[0025]
Furthermore, in the method for manufacturing a liquid crystal panel according to the present invention, in the large substrate, the substrate forming region has a predetermined cutting line so that the sides on which the input / output terminals and the inter-substrate conduction terminals are formed are directed to opposite sides. When forming a thin film that is sandwiched and to form the alignment film, the thin film is formed in a band shape along the planned cutting line. If the thin film on which the alignment film is to be formed is formed in a strip shape, the end of the roller is directed to the side where the input / output terminals and the inter-substrate conduction terminals are formed in flexographic printing. In such a width direction of the roller, unlike the running direction of the roller, the printing area can be controlled with a certain degree of accuracy. Therefore, even in the case where the alignment film cannot be formed up to the edge of the substrate in this width direction, the sealing material The alignment film can be formed so as to be very close to the formation region of the film or partially overlap the formation region of the sealing material.
[0026]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described with reference to the accompanying drawings.
[0027]
[Embodiment 1]
(overall structure)
FIG. 1 is a perspective view showing an appearance of a liquid crystal display device, and FIG. 2 is an exploded perspective view thereof. In FIGS. 1 and 2, only a part of the wiring patterns and terminals are shown, and details thereof are shown in FIGS.
[0028]
1 and 2, a liquid crystal panel 10 of a liquid crystal display device mounted on an electronic device such as a mobile phone is formed of a first substrate 1 made of transparent glass or the like, and also made of transparent glass or the like. And a second substrate 2. A sealing material 3 containing a gap material and conductive particles is formed on one of these substrates by printing or the like, and the first substrate 1 and the second substrate 2 are bonded and fixed with the sealing material 3 interposed therebetween. . In this state, a predetermined gap is secured between the first substrate 1 and the second substrate 2 by the gap material contained in the sealing material 3, and the liquid crystal sealing region 41 partitioned and formed by the sealing material 3 in the gap. A liquid crystal 40 is sealed inside. A polarizing plate 4A is attached to the outer surface of the first substrate 1 with an adhesive or the like, and a polarizing plate 4B is attached to the outer surface of the second substrate 2 with an adhesive or the like. When the liquid crystal panel 10 is configured as a reflection type, a reflection plate (not shown) is attached to the outside of the polarizing plate 4B attached to the second substrate 2 or instead of the polarizing plate 4B.
[0029]
In this embodiment, since the second substrate 2 is larger than the first substrate 1, a part of the second substrate 2 is the first substrate 1 in a state where the first substrate 1 is superposed on the second substrate 2. Project from the lower edge of the substrate 1. An IC mounting area 9 is formed in the projecting portion 110 so as to be adjacent to the liquid crystal sealing area 41, and a driving IC 33 is mounted thereon by COG (Chip On Glass).
[0030]
In the second substrate 2, a plurality of input / output terminals 7 D are formed along the substrate edge so as to be adjacent to the IC mounting region 9 on the lower end edge side from the IC mounting region 9. As shown in FIG. 1 by a two-dot chain line, a flexible substrate 29 is connected.
[0031]
FIGS. 3 and 4 are plan views showing the arrangement patterns of the transparent electrodes formed on the first substrate 1 and the second substrate 2, respectively.
[0032]
In FIG. 3, on the inner surface of the first substrate 1, the character display or dot display electrode 6 A and the outer side of the liquid crystal sealing area 41 are provided inside the liquid crystal sealing area 41 partitioned by the sealant 3. Thus, an electrode pattern 6 including inter-substrate conduction terminals 6 C arranged along the side 101 is formed in order to achieve conduction with the second substrate 2.
[0033]
The electrode pattern 6 is formed of an ITO film or the like.
[0034]
In FIG. 4, on the inner surface of the second substrate 2, the character display or dot display electrode 7 A and the outer side of the liquid crystal sealing area 41 are provided inside the liquid crystal sealing area 41 partitioned by the sealing material 3. In order to connect the electrode 7A toward the IC mounting area 9 with the wiring portion 7B and the first substrate 1 outside the liquid crystal sealing area 41, the inter-substrate conduction lined up on the side 201 side is arranged. An electrode pattern 7 including a terminal 7 C and an input / output terminal 7 D arranged along the side 201 is formed. This electrode pattern 7 is also formed of an ITO film or the like.
[0035]
In the state where the first substrate 1 and the second substrate 2 thus configured are bonded as shown in FIGS. 1 and 5A and 5B, the terminal 6C of the first substrate 1 is used. And the terminal 7C of the second substrate 2 face each other, the conductive particles contained in the sealing material 3 interposed between the terminals 6C and 7C cause the terminal 6C and the terminal 7C to conduct, and the first substrate 1 Conductivity with the second substrate 2 can be achieved. That is, the conductive particles contained in the sealing material 3 are obtained by applying nickel or gold plating to the surface of elastically deformable plastic beads, and the particle size thereof is about 5 to 9 μm. On the other hand, the particle size of the gap material included in the sealing material 3 is about 4 to 8 μm. Therefore, when the sealing material 3 is melted and cured while applying a force that narrows the gap in the state where the first substrate 1 and the second substrate 2 are overlapped, the conductive particles are separated from the first substrate 1. The terminal 6 C of the first substrate 1 and the terminal 7 C of the second substrate 2 are made conductive while being crushed with the second substrate 2.
[0036]
In addition, since the opposing portion is configured between the electrode 6A of the first substrate 1 and the electrode 7A of the second substrate 2 in a state where the first substrate 1 and the second substrate 2 are bonded together, By applying an electric field to the liquid crystal 40 with these electrodes 6A and 7A, the alignment state of the liquid crystal 40 can be controlled, and a desired image can be displayed on the liquid crystal panel 10.
[0037]
(Configuration of transparent insulating film and alignment film)
FIGS. 5A and 5B are a cross-sectional view of the liquid crystal panel shown in FIG. 1 and an enlarged cross-sectional view of an end portion thereof. FIG. 6 is a plan view of the liquid crystal panel schematically showing the relationship between the alignment film forming region and the sealing material forming region of the liquid crystal panel shown in FIG.
[0038]
In the liquid crystal panel 10 configured as described above, as shown in FIGS. 5A and 5B, the first and second substrates 1 and 2 cover the transparent insulating film 12 so as to cover the electrodes 6A and 7A. 22 is formed, and alignment films 13 and 23 made of a polyimide film are formed on the surfaces of the transparent insulating films 12 and 22. These alignment films 13 and 23 are polyimide films subjected to a rubbing process, and the liquid crystal 40 is changed to STN (SuperTw).
It is designed to be used in a system (steady Nematic).
[0039]
Here, FIGS. 5A, 5B and 6 (formation regions of the alignment films 13 and 23 and the transparent insulating films 12 and 22 are indicated by hatched regions with broken lines, and the formation region of the sealing material 3 is indicated by a solid line. As shown in the hatched region), the transparent insulating films 12 and 22 and the alignment films 13 and 23 are the first and second substrates 1 and 2 in both the first and second substrates 1 and 2. The region corresponding to the four sides 101 to 104 and 201 to 204 is formed up to a region overlapping the region where the sealing material 3 is formed.
[0040]
As the sealing material 3 used here, in this embodiment, a one-component thermosetting epoxy sealing material having high adhesion is used even between the polyimide films constituting the alignment films 13 and 23. For example, the tract bond ES series (trade name) manufactured by Mitsui Toatsu Chemicals is used. This one-component thermosetting epoxy sealant is obtained by dispersing dicyandiamide, dihydrazide imidazoles and other latent curing agents in an epoxy resin, and further blending an inorganic filler, a solvent, a viscosity modifier and the like. Further, for this system, an epoxy high-impact technology, that is, a high-impact epoxy obtained by kraft polymerization of acrylic or silicon rubber in an epoxy resin is blended. Therefore, among the one-component thermosetting epoxy sealants, the Structbond ES series manufactured by Mitsui Toatsu Chemical Co., Ltd. exhibits excellent adhesion even with the polyimide film. Even if the sealing material 3 is formed so as to overlap the surface of 23, excellent liquid tightness and air tightness are exhibited at the interface between them.
[0041]
In setting the formation regions of the alignment films 13 and 23 in this way, a terminal 6C for conduction with the second substrate 2 is formed in a portion corresponding to the side 101 of the first substrate 1, and the second Since a terminal 7C and an input / output terminal 7D for conduction with the first substrate 1 are formed in a portion corresponding to the side 201 of the substrate 2, the terminals 6C, 7C, 7D are connected to the alignment film 13, When covered with 23, electrical conduction cannot be achieved. Therefore, in this embodiment, of the four sides 101 to 104 and 201 to 204 of the first and second substrates 1 and 2, the sides 101 and 201 on which the conduction terminals 6C and 7C and the input / output terminal 7D are formed. In the portion corresponding to, the alignment films 13 and 23 are stopped from being formed so as to partially overlap the formation region of the sealing material 3, and in the other portions corresponding to the three sides 102 to 104 and 202 to 204, the alignment film 13, 23 is formed up to the edges of the first and second substrates 1 and 2.
[0042]
Further, the transparent insulating films 12 and 22 formed so as to cover the electrodes 6C and 7C are formed so as to substantially overlap the alignment films 13 and 23. That is, since the transparent insulating films 12 and 22 also cannot be electrically connected when covering the conductive terminals 6C and 7C and the input / output terminals 7D of the first and second substrates 1 and 2, the first and second Among the four sides 101 to 104 and 201 to 204 of the second and second substrates 1 and 2, the transparent insulating film 12 is provided at portions corresponding to the sides 101 and 201 where the terminals 6 C and 7 C for conduction and the input / output terminals 7 D are formed. , 22 is formed so as to partially overlap the formation region of the sealing material 3, and the transparent insulating films 12, 22 are formed in the first and second portions in the portions corresponding to the other three sides 102 to 104, 202 to 204. The edges of the substrates 1 and 2 are formed.
Therefore, in the liquid crystal panel 10 of this embodiment, as shown in FIG. 5B, there is no gap between the sealing material 3 and the alignment films 13 and 23, so that the liquid crystal 40 is formed near the inner periphery of the sealing material 3. There is no risk of a low twist domain. Accordingly, the vicinity of the inner periphery of the sealing material 3 can also be used as an effective screen display area, so that the screen display area can be expanded.
[0043]
(Liquid crystal panel manufacturing method)
A method of manufacturing the liquid crystal panel 10 having such a configuration will be described with reference to FIGS. 5 (A), 5 (B) and FIG. FIG. 7 shows the first and second large substrates 1A and 2A for removing a plurality of first substrates 1 and second substrates 2 in the manufacturing process of the liquid crystal panel shown in FIG. It is explanatory drawing which shows the formation area of the transparent insulating films 12 and 22 and the alignment films 13 and 23 which were formed in 1 and 2nd large sized board | substrates 1A and 2A, and the formation area of the sealing material 3. FIG. FIG. 7 shows the first and second large substrates 1A and 2A for taking a plurality of first substrates 1 and second substrates 2, respectively, and the first and second large substrates 1A and 2A. The transparent insulating films 12 and 22 and the alignment film 13 and 23 forming region (broken-line hatched region) and the sealing material 3 forming region (solid hatched region) are shown, and other components are omitted. Refer to FIGS. 5 (A) and 5 (B) for the description of each component to be formed on the first and second large substrates 1A and 2A.
[0044]
First, as shown in FIGS. 5A, 5B and 7, first and second large substrates 1A, 2A for taking a plurality of first substrates 1 and second substrates 2 respectively. After the base protective films 11 and 21 are formed on the entire surface of the substrate, the large substrates 1A and 2A are divided as the first and second substrates 1 and 2 when cut along the planned cutting lines L1 and L2. Electrode patterns 6 and 7 such as electrodes 6A and 7A and terminals 6C and 7C are formed on each substrate formation region using a photolithography technique.
Next, transparent insulating films 12 and 22 made of a silicon oxide film are formed on the first and second large substrates 1A and 2A so as to cover the electrodes 6A and 7A. These transparent insulating films 12 and 22 are formed in a strip shape with respect to a plurality of substrate forming regions across the cutting lines L1 and L2. That is, in the first and second large substrates 1A and 2A, the substrate formation region is such that the sides 101 and 201 on which the input / output terminals 12 and the inter-substrate conduction terminals 6C and 7C are formed are opposite to each other. Since it is arranged across the planned cutting line L2, the transparent insulating films 12 and 22 are formed in a strip shape along the planned cutting line L2.
[0045]
As a result, the first and second large substrates 1A and 2A are cut along the planned cutting lines L1 and L2 to be divided into the first and second substrates 1 and 2 as single products. In portions corresponding to the four sides 101 to 104 and 201 to 204 of the substrates 1 and 2, the transparent insulating films 12 and 22 are formed so as to overlap the formation region of the sealing material 3. The transparent insulating films 12 and 22 are formed with terminals 6A and 7A for inter-substrate conduction and input / output terminals 7D among the four sides 101 to 104 and 201 to 204 of the first and second substrates 1 and 2, respectively. The portions corresponding to the three sides 102 to 104 and 202 to 204 excluding the sides 101 and 201 are formed beyond the forming region of the sealing material 3 to the edges of the first and second substrates 1 and 2. The portions corresponding to the sides 101 and 201 where the inter-conduction terminals 6A and 7A and the input / output terminals 7D are formed are formed so as to partially overlap the formation region of the sealing material 3.
[0046]
Next, a polyimide film (alignment films 13 and 23) is formed by flexographic printing so as to cover the transparent insulating films 12 and 22 on the first and second large substrates 1A and 2A.
[0047]
These polyimide films (alignment films 13 and 23) are also formed in a strip shape over a plurality of substrate formation regions across the planned cutting lines L1 and L2. That is, in the first and second large substrates 1A and 2A, the substrate formation region is set such that the sides 101 and 201 on which the input / output terminal 7D and the inter-substrate conduction terminals 6C and 7C are formed face each other. Since it is arranged across the planned cutting line L2, the end of the roller of the flexographic printing machine is directed toward the sides 101 and 201, and the roller is run along the planned cutting line L2, and a polyimide film (alignment film 13, 23) is formed in a strip shape along the planned cutting line L2. As a result, the first and second large substrates 1A and 2A are cut along the planned cutting lines L1 and L2 to be divided into the first and second substrates 1 and 2 as single products. In portions corresponding to the four sides 101 to 104 and 201 to 204 of the substrates 1 and 2, the polyimide films (alignment films 13 and 23) are formed so as to overlap the formation region of the sealing material 3. Also, the polyimide films (alignment films 13 and 23) are the terminals 6A and 7A for inter-substrate conduction among the four sides 101 to 104 and 201 to 204 of the first and second substrates 1 and 2, and the input / output terminal 7D. The portions corresponding to the three sides 102 to 104 and 202 to 204 excluding the sides 101 and 201 formed are formed beyond the formation region of the sealing material 3 to the edges of the first and second substrates 1 and 2. The portions corresponding to the sides 101 and 201 where the inter-substrate conduction terminals 6A and 7A and the input / output terminals 7D are formed are formed so as to partially overlap the formation region of the sealing material 3.
[0048]
Next, the first and second large substrates are rubbed to form polyimide films as alignment films 13 and 23.
[0049]
Next, after the sealing material 3 is printed on the surfaces of the alignment films 13 and 23 on the second large substrate 2A, pre-baking is performed, and then the first large substrate 1A and the first large substrate 1A are connected via the sealing material 3. 2 large substrates 2A are bonded together. At this time, as shown in FIG. 5A, the first large substrate 1A and the second large substrate 2A are bonded together after the spacers 32 are dispersed on the first large substrate 1.
[0050]
5A, 5B and 7 again, after the first large substrate 1A and the second large substrate 2A are bonded together, the first large substrate 1A and the second large substrate are combined. 2A is bonded along the planned cutting lines L1 and L2, and is divided into a single liquid crystal panel 10, or the first large substrate 1A and the second large substrate 2A are bonded. Is cut along the planned cutting line L1 and divided into strip-like panels. Even if it cut | disconnects in any of these states, the discontinuous part 30 of the sealing material 3 opens in the cut surface (part corresponded to the edge | sides 104 and 204).
[0051]
Accordingly, if the region defined by the sealant 3 in the gap between the first and second substrates 1 and 2 is evacuated and the discontinuous portion 30 is immersed in the liquid crystal, the sealant 3 is released. The liquid crystal 40 is injected into the area partitioned by Therefore, after the liquid crystal 40 is injected, the liquid crystal 40 is sealed in the gap 31 between the first and second substrates 1 and 2 by closing the interrupted portion 30 of the sealing material 3.
[0052]
In this state, if the liquid crystal panel 10 has already been divided, the polarizing plates 4A, 4B, etc. are attached as they are as shown in FIG. 1 and FIGS. 5 (A) and 5 (B). On the other hand, if it is divided into strip-like panels, the polarizing plates 4A, 4B, etc. are pasted after being divided into single liquid crystal panels 10.
[0053]
After that, as shown in FIG. 1, the flexible wiring board 29 is pressure-bonded to the input / output terminal 7D of the second substrate 2 using an anisotropic conductive film or the like and sent to the inspection process.
[0054]
As described above, according to the manufacturing method of the present embodiment, it is only necessary to perform solid coating in the running direction of the roller surface of the flexographic printing machine (the direction indicated by the arrow X in FIG. 7). Even if the printing area 23 cannot be controlled, no gap is generated between the sealing material 3 and the alignment films 13 and 23. In the width direction of the roller surface used for flexographic printing (the direction indicated by the arrow Y in FIG. 7), the alignment films 13 and 23 do not cover the inter-substrate conduction terminals 6A and 7A and the input / output terminals 7D. In such a direction, since it is relatively easy to control the printing area in a flexographic printing machine, the sealing material 3 and the alignment films 13 and 23 are also in this direction. There is no gap between them.
[0055]
[Embodiment 2]
FIG. 8 shows first and second large substrates for taking a plurality of first substrates and second substrates, respectively, in the manufacturing process of the liquid crystal panel according to Embodiment 2 of the present invention. FIG. 6 is an explanatory view showing a transparent insulating film and an alignment film forming region (lower right dotted hatched region) formed on the second large substrate, and a sealing material forming region (upward solid hatched region). The basic configuration of the liquid crystal panel of the present embodiment is the same as that of the liquid crystal panel according to the first embodiment. Therefore, corresponding parts are denoted by the same reference numerals and shown in FIG. Description is omitted.
[0056]
As shown in FIG. 8, in this embodiment, the electrodes 6A and 7A (see FIGS. 3, 4 and 5) are covered with respect to the first and second large substrates 1A and 2A. Transparent insulating films 12 and 22 made of a silicon oxide film are formed. These transparent insulating films 12 and 22 straddle the planned cutting line L1 among the planned cutting lines L1 and L2, but do not straddle the planned cutting line L2, and are strip-shaped for each column with respect to a plurality of substrate formation regions. To form.
As a result, the first and second large substrates 1A and 2A are cut along the planned cutting lines L1 and L2 to be divided into the first and second substrates 1 and 2 as single products. In portions corresponding to the four sides 101 to 104 and 201 to 204 of the substrates 1 and 2, the transparent insulating films 12 and 22 are formed so as to overlap the formation region of the sealing material 3.
[0057]
The transparent insulating films 12 and 22 are formed with terminals 6A and 7A for inter-substrate conduction and input / output terminals 7D among the four sides 101 to 104 and 201 to 204 of the first and second substrates 1 and 2, respectively. In the portion corresponding to the two sides 102, 104, 202, 204 excluding the sides 101, 201 and the sides 103, 203 located on the side of the planned cutting line L2, the first and It is formed up to the edges of the second substrates 1 and 2.
[0058]
Next, a polyimide film (alignment films 13 and 23) is formed by flexographic printing so as to cover the transparent insulating films 12 and 22 on the first and second large substrates 1A and 2A.
[0059]
These polyimide films (alignment films 13 and 23) also cross the planned cutting line L1 among the planned cutting lines L1 and L2, but do not straddle the planned cutting line L2 with respect to the plurality of substrate forming regions. Each is formed in a strip shape.
[0060]
As a result, the first and second large substrates 1A and 2A are cut along the planned cutting lines L1 and L2 to be divided into the first and second substrates 1 and 2 as single products. In portions corresponding to the four sides 101 to 104 and 201 to 204 of the substrates 1 and 2, the polyimide films (alignment films 13 and 23) are formed so as to overlap the formation region of the sealing material 3. In addition, the polyimide films (the alignment films 13 and 23 include the terminals 6A and 7A and the input / output terminals 7D for inter-substrate conduction among the four sides 101 to 104 and 201 to 204 of the first and second substrates 1 and 2). The portions corresponding to the two sides 102, 104, 202, and 204 excluding the sides 101 and 201 that are formed and the sides 103 and 203 that are located on the side of the planned cutting line L2 are first beyond the region where the sealing material 3 is formed. And it is formed up to the edge of the second substrates 1 and 2.
[0061]
[Embodiment 3]
FIG. 9 shows first and second large substrates for taking a plurality of first substrates and second substrates, respectively, in the manufacturing process of the liquid crystal panel according to Embodiment 3 of the present invention. FIG. 6 is an explanatory view showing a transparent insulating film and an alignment film forming region (lower right dotted hatched region) formed on the second large substrate, and a sealing material forming region (upward solid hatched region). The basic configuration of the liquid crystal panel of this embodiment is the same as that of the liquid crystal panel according to the first embodiment. Therefore, corresponding parts are denoted by the same reference numerals and shown in FIG. Description is omitted.
[0062]
As shown in FIG. 9, in this embodiment, the electrodes 6A and 7A (see FIGS. 3, 4 and 5) are covered with respect to the first and second large substrates 1A and 2A. Transparent insulating films 12 and 22 made of a silicon oxide film are formed. These transparent insulating films 12 and 22 straddle the planned cutting line L2 among the planned cutting lines L1 and L2, but do not straddle the planned cutting line L1, and are formed in a strip shape over a plurality of substrate formation regions. As a result, the first and second large substrates 1A and 2A are cut along the planned cutting lines L1 and L2 to be divided into the first and second substrates 1 and 2 as single products. In portions corresponding to the four sides 101 to 104 and 201 to 204 of the substrates 1 and 2, the transparent insulating films 12 and 22 are formed so as to overlap the formation region of the sealing material 3. The transparent insulating films 12 and 22 are portions corresponding to the sides 103 and 203 located on the side of the planned cutting line L2 among the four sides 101 to 104 and 201 to 204 of the first and second substrates 1 and 2. Then, it is formed to the edge of the first and second substrates 1 and 2 beyond the region where the sealing material 3 is formed.
[0063]
Further, a polyimide film (alignment films 13 and 23) is formed by flexographic printing so as to cover the transparent insulating films 12 and 22 on the first and second large substrates 1A and 2A.
[0064]
These polyimide films (alignment films 13 and 23) also straddle the planned cutting line L2 among the planned cutting lines L1 and L2, but do not straddle the planned cutting line L1 in a strip shape with respect to a plurality of substrate formation regions. Form. As a result, the first and second large substrates 1A and 2A are cut along the planned cutting lines L1 and L2 to be divided into the first and second substrates 1 and 2 as single products. In portions corresponding to the four sides 101 to 104 and 201 to 204 of the substrates 1 and 2, the polyimide films (alignment films 13 and 23) are formed so as to overlap the formation region of the sealing material 3.
[0065]
The polyimide films (alignment films 13 and 23) are formed on the sides 103 and 203 located on the side of the planned cutting line L2 among the four sides 101 to 104 and 201 to 204 of the first and second substrates 1 and 2. In a corresponding portion, the first and second substrates 1 and 2 are formed beyond the region where the sealing material 3 is formed.
[0066]
[Embodiment 4]
FIG. 10 shows first and second large substrates for taking a plurality of first substrates and second substrates, respectively, in the manufacturing process of the liquid crystal panel according to Embodiment 4 of the present invention. FIG. 6 is an explanatory view showing a transparent insulating film and an alignment film forming region (lower right dotted hatched region) formed on the second large substrate, and a sealing material forming region (upward solid hatched region). The basic configuration of the liquid crystal panel of the present embodiment is the same as that of the liquid crystal panel according to the first embodiment. Therefore, corresponding parts are denoted by the same reference numerals and shown in FIG. Description is omitted.
[0067]
As shown in FIG. 10, in this embodiment, the electrodes 6A and 7A (see FIGS. 3, 4 and 5) are covered with respect to the first and second large substrates 1A and 2A. Transparent insulating films 12 and 22 made of a silicon oxide film are formed. These transparent insulating films 12 and 22 are formed independently for each of the plurality of substrate formation regions without straddling the planned cutting lines L1 and L2. Still, the first and second substrates when the first and second large substrates 1A, 2A are cut along the planned cutting lines L1, L2 and divided into the single first and second substrates 1, 2. In portions corresponding to the four sides 101 to 104 and 201 to 204 of 1 and 2, the transparent insulating films 12 and 22 are formed so as to overlap the formation region of the sealing material 3.
[0068]
Further, a polyimide film (alignment films 13 and 23) is formed by flexographic printing so as to cover the transparent insulating films 12 and 22 on the first and second large substrates 1A and 2A.
[0069]
These polyimide films (alignment films 13 and 23) are also formed for each of the plurality of substrate forming regions without straddling the planned cutting lines L1 and L2. Still, the first and second substrates when the first and second large substrates 1A, 2A are cut along the planned cutting lines L1, L2 and divided into the single first and second substrates 1, 2. In the portions corresponding to the four sides 101 to 104 and 201 to 204 of 1 and 2, the polyimide films (alignment films 13 and 23) are formed so as to overlap the formation region of the sealing material 3.
[0070]
[Other Embodiments]
In any of the above forms, the transparent insulating films 12 and 22 and the polyimide film (alignment films 13 and 23) were formed so as to overlap the formation region of the sealing material 3 on the four sides of the substrate. What is necessary is just to have overlapped with the formation area of the sealing material 3 in three sides. For example, among the four sides 101 to 104 and 201 to 204 of the first and second substrates 1 and 2, the sides 101 and 201 where the inter-substrate conduction terminals 6A and 7A and the input / output terminals 7D are formed are sealed. The formation range of the transparent insulating films 12 and 22 and the polyimide films (alignment films 13 and 23) may be stopped inside the region where the material 3 is formed.
[0071]
Further, although the example is a passive matrix type liquid crystal panel, the present invention may be applied to an active matrix type liquid crystal panel.
[0072]
Furthermore, in the above embodiment, an alignment film or the like is formed at the stage of a large substrate, and the large substrates are bonded to each other and then cut into a single liquid crystal panel. The present invention can be applied even when forming.
[0073]
【The invention's effect】
As described above, in the liquid crystal panel and the manufacturing method thereof according to the present invention, since the alignment film is formed up to a region overlapping with the formation region of the seal material, there is no gap between the seal material and the alignment film, and the seal There is no possibility that a low twist domain is generated near the inner peripheral edge of the material, and the vicinity of the inner peripheral edge of the sealing material can be effectively used as a screen display region. Therefore, the present invention is useful as a liquid crystal display device that requires a wider screen display area and a method for manufacturing the same, and in particular, a liquid crystal display device that requires more displays by effectively using a limited screen display area and the manufacture thereof. Suitable for use as a method.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an external appearance of a liquid crystal display device.
FIG. 2 is an exploded perspective view of a liquid crystal panel used in the liquid crystal display device shown in FIG.
3 is a plan view showing an arrangement pattern of transparent electrodes formed on a first substrate of the liquid crystal panel shown in FIG. 1. FIG.
4 is a plan view showing an arrangement pattern of transparent electrodes formed on a second substrate of the liquid crystal panel shown in FIG. 1. FIG.
5A and 5B are a cross-sectional view of the liquid crystal panel shown in FIG. 1 and an enlarged cross-sectional view of an end portion thereof, respectively.
6 is a plan view of the liquid crystal panel schematically showing the relationship between the alignment film forming region and the sealing material forming region of the liquid crystal panel shown in FIG. 1. FIG.
FIG. 7 shows first and second large substrates for taking a plurality of first substrates and second substrates in the manufacturing process of the liquid crystal panel shown in FIG. 1, and the first and second large substrates. It is explanatory drawing which shows the formation area (the diagonal line of the downward slanting dotted line) of the transparent insulating film and alignment film which were formed in the board | substrate, and the formation area of the sealing material (the oblique line of the solid line of the right upward).
FIG. 8 shows first and second large substrates for taking a plurality of first substrates and second substrates, respectively, in the manufacturing process of the liquid crystal panel according to the second embodiment of the present invention; It is explanatory drawing which shows the formation area (the diagonal line of the downward slanting dotted line) of the transparent insulating film and alignment film which were formed in the 2nd large sized substrate, and the formation area of the sealing material (the oblique line area of the solid line of the right upward).
FIG. 9 shows first and second large substrates for taking a plurality of first substrates and second substrates, respectively, in the manufacturing process of the liquid crystal panel according to the third embodiment of the present invention. It is explanatory drawing which shows the formation area (the diagonal line of the downward slanting dotted line) of the transparent insulating film and alignment film which were formed in the 2nd large sized substrate, and the formation area of the sealing material (the oblique line area of the solid line of the right upward).
FIG. 10 shows first and second large substrates for taking a plurality of first substrates and second substrates, respectively, in the manufacturing process of the liquid crystal panel according to Embodiment 4 of the present invention. It is explanatory drawing which shows the formation area (the diagonal line of the downward slanting dotted line) of the transparent insulating film and alignment film which were formed in the 2nd large sized substrate, and the formation area of the sealing material (the oblique line area of the solid line of the right upward).
11A and 11B are a cross-sectional view of a conventional liquid crystal panel and an enlarged cross-sectional view of an end portion thereof, respectively.
FIG. 12 shows first and second large substrates for taking a plurality of first substrates and second substrates, respectively, in the manufacturing process of the conventional liquid crystal panel shown in FIG. It is explanatory drawing which shows the formation area (lower right slanting area | region) of the transparent insulating film and alignment film which were formed in the large-sized board | substrate, and the formation area (right sloping line area) of a sealing material.

Claims

In a method of manufacturing a liquid crystal panel by laminating a large substrate having a plurality of substrate formation regions through a sealing material formed for each substrate formation region, and cutting the large substrate along a planned cutting line.
Forming an electrode on the large substrate;
Forming a conduction terminal for each of the substrate formation regions for conducting between the large substrates when the large substrates are bonded together;
Forming an alignment film so as to cover the electrode on the large substrate,
The method of manufacturing a liquid crystal panel, wherein the alignment film is formed on the plurality of substrate forming regions straddling the planned cutting line.

2. The method of manufacturing a liquid crystal panel according to claim 1, wherein the substrate forming region is arranged with the planned cutting line in between, and the alignment film is formed in a strip shape along the planned cutting line. .

The liquid crystal according to claim 1 or 2, wherein, in the large substrate, sides on which the conductive terminals are formed adjacent to each other are directed to opposite sides with respect to the planned cutting line. Panel manufacturing method.

The alignment film according to claim 1 or 2, wherein the alignment film is formed so as to partially overlap the formation region of the sealing material in a portion corresponding to a side where the conduction terminal is formed. A method for manufacturing a liquid crystal panel.