JP2003533054A - Electrical circuit with outer partial shielding energy path and passive electrostatic shielding structure for energy conditioning - Google Patents

Abstract

SUMMARY OF THE INVENTION The present invention is an electrode shield having a stacked conductive hierarchy progression including a circuit for energy simultaneously propagating along a pair of electrical differential paths utilizing a bypass mode and a feedthrough energy propagation mode. The present invention relates to a universal multifunctional common conductive shield structure (9905) that adds two electrically opposite differential energy paths (810b, 810f), using part of the architecture.

Description

Detailed Description of the Invention

TECHNICAL FIELD This application is a part-pending application of US patent application Ser. No. 08 / 841,940 filed Apr. 8, 1997, now US Pat. No. 5,097,581. No. 09/008769, filed Apr. 19, 1998, which is a part of pending application 09/008769 filed Jan. 19, 1998, issued as U.S. Pat. No. 6,018,448. No. 056379, copending application, co-pending application No. 09/4602, filed December 13, 1999.
Co-pending Application No. 09 filed on May 26, 2000, which is a part-pending application of No. 18
No. 579606, partly pending application, co-pending application No. 09/594447 filed on June 15, 2000, partly pending application Aug. 3, 2000, co-pending application 09/632048 It is a partly pending application of the issue.

The present application discloses a pair of electrical differential paths that utilize a bypass mode and a feed-thru energy transfer mode.
stacked conductive hierarchy including circuits for energies co-propagating along a pathway.
A universal multi-functional communicative shield structure with electrically opposite differential energy paths that uses in part a faradaic shield architecture with archy progression.
n conductive shield structure). Further, additional structural embodiments are provided by the use of electrically and physically opposite differential electrodes that sandwich the overall stacked conductive hierarchy progression in a predetermined manner. The present invention also uses, in part, a Faraday shield architecture with stacked conductive hierarchy progression that includes circuits that can include energy transfer modes to complement the energy decoupling behavior between energized conductive paths and electrodes. Separate version with an electrically opposite differential energy path that holds a centrally located and commonly shared common conductive energy path or electrodes for balancing and simultaneous shielding and smoothing And a non-individual version universal multi-function common conductive shield structure. In the present invention, it is almost always the case that, when energized, both the outer partial shield paired differential conduction energy path electrode and the housed and conversely opposite paired conduction energy path electrode respectively balance each other, but electrically. It can function in the opposite complementary manner.

BACKGROUND OF THE INVENTION The present invention provides a commonly shared and centrally located conductive path that is capable of complementary and simultaneously shielding and smoothing energy interactions between energized conductive path electrodes. Alternatively, it relates to a layered universal multi-function common conductive shield structure, which also holds electrodes, for circuit and energy conditioning, with electrically opposite complementary energy paths added. With the present invention, when energized, the encased conductive paths or electrodes can always operate in tune with each other, but with opposite phases or charging schemes. When placed in a circuit and energized, one invention embodiment also provides EMI filtering and surge protection while maintaining an apparent uniform or balanced voltage supply between the source and the energy-utilizing load. Further, in the present invention,
Almost always bypass in the integrated circuit gate simultaneous switching operation (SSO),
Simultaneous energy regulation functions including energy and signal decoupling, energy storage, continuous equilibrium can be effectively obtained. These adjustment functions are performed with minimal contribution of the destructive energy parasitics that are returned into the circuit system when one inventive embodiment operates passively in the circuit.

Today, with the increasing density of electronic devices in societies around the world, political and voluntary standards for the suppression of electromagnetic interference (EMI) and immunization of electronic circuits from that electromagnetic interference are becoming far more numerous. It's getting tougher. Only a few years ago, the main sources of interference were voltage imbalances, spurious transients from power surges.
source, condition such as a voltage transient, human, or other electromagnetic wave generator.

At higher operating frequencies, line conditioning of the propagating energy using prior art components resulted in increased levels of interference in the form of EMI, RFI, and capacitive and inductive parasitics. These increases are due, in part, to the inherent manufacturing imbalances and performance deficiencies of passive components that create or induce interference in the associated electrical circuits when functioning at higher operating frequencies. EMI can also arise from the electrical circuit paths themselves, which makes shielding from EMI desirable. Differential common mode noise energy can be generated, and almost always along cables, circuit board tracks or traces, high speed transmission lines and bus line paths.
Also cross around them. Often these important energy conductors are
It acts as an antenna that radiates an energy field that makes the problem even worse.

Another source of EMI interference arises from active silicon components as they operate or switch. These problems, such as SSO, are well known causes of circuit breakdown. It is known in the art that problems involving unshielded differential energy paths that freely couple parasitic energy onto electrical circuits cause significant interference at high frequencies.

Another breakdown to the circuit results from large transient voltages, as well as ground loop interference caused by changing ground potentials, which renders delicately balanced computer or electrical systems useless. Existing surge and EMI protection devices do not provide sufficient protection for a single integrated circuit package. Various individual networked ramp filters, decouplers
er), surge suppression devices, combinations, and circuitry have proven ineffective as evidenced by the shortcomings of the prior art.

Co-pending application 09/579606 filed on May 26, 2000, which is a part-pending application of co-pending application 09/460218 filed on December 13, 1999.
Filed June 15, 2000, copending application 09/5
No. 09/594 filed Aug. 3, 2000, which is a partly pending application of No. 94447.
447, as well as the following commonly owned U.S. Pat. No. 60975.
No. 81, U.S. Pat. No. 6,018,448, U.S. Pat. No. 5,909,350, and U.S. Pat. These multifunctional energy regulators are commonly shared and centrally located common conducting electrodes of a structure that can interact complementary and simultaneously with energized counter-electrically complementary differential conducting energy path electrodes. Hold. These opposite differential energy carrying conductive paths operate in opposite phase or charged complementary fashion and can be separated from each other by physical shielding.

The present application elaborates on this concept and, in addition, new embodiments of what we believe are part of circuit protection systems and adjustments that help solve or reduce industrial problems and obstacles. Is disclosed.

The present application also provides a manufacturing infrastructure and provides unprecedented adaptability or ease of production change as compared to the prior art.

SUMMARY OF THE INVENTION Based on what has been described above, in one embodiment or in a plurality of embodiments it is common as part of its structure to enable energy regulation, as well as numerous other functions simultaneously. It has been found necessary to provide a layered multifunctional common conductive shield structure containing a centrally located common conductive path or energy conductive paths sharing electrodes.

The layered multi-function common conductive shield structure also provides electrical conductivity by causing certain simultaneous energy interactions between the grouped and energized conductive paths and various conductive paths external to the embodiment elements. The physical shielding and the electrical shielding of a part of the propagation energy existing on the oppositely opposite differential electrode energy paths can be performed at the same time.

A good approach for high frequency decoupling is P in an attempt to achieve the same goal.
Rather than utilize multiple parallel low impedance decoupling capacitors on the CB, a tightly-spaced low impedance within and adjacent to the electrically opposite differential electrode energy paths or power / signal planes. To provide impedance parallel energy paths.

Therefore, a solution for low impedance power distribution over hundreds of MHz is according to the invention to internal parallel complementary aligned thin dielectric power plane technology.

Accordingly, one object of one inventive embodiment is to be able to operate effectively over a wide frequency range as compared to a single component or a single passive regulation network. Ideally, the present invention could be versatile in its potential applications by utilizing various embodiments of a given grouped element. The invention used almost always continues to perform effectively in systems operating above the frequency of 1 GHz.

One object of one inventive embodiment is to be able to provide energy decoupling for active system loads while simultaneously maintaining a constant apparent potential for that portion of the active component and its circuitry.

An object of one inventive embodiment is to minimize, suppress, or filter unwanted electromagnetic radiation resulting from the differential common mode current flowing in the electronic path under the influence of the one inventive embodiment.

One object of one inventive embodiment is to take a wide variety of multi-layered embodiments, and those particular ones that can provide simultaneous line conditioning functions and protection when mounted and energized in a circuit as described above. It is to provide a multifunctional common conductive shield and energy conditioning structure for a conductive energy path that can utilize a host of dielectric material, which is not limited by physical properties.

One object of an inventive embodiment is, but not limited to, simultaneous decoupling between source loads and / or between load sources, differential mode and / or common mode EMI filtering, most of the energy parasitics. Prior art that includes containment and exclusion, and surge protection of one integrated embodiment, and performs these previously described capabilities when utilizing a common conductive area or common energy path external to the originally manufactured embodiment. The goal is to provide the user with the ability to resolve problems or limitations not encountered on the device.

One object of one inventive embodiment is to provide one or more common conductive areas located outside the originally manufactured invention that may assist the inventive embodiment in protecting electronic system circuits. It is easily adapted for use with external conductive attachments. Further, protection from electromagnetic interference (EMI) is obtained over each voltage, from the in-use electronic components to the active electronic components, which in prior art devices would contribute as a parasitic in the host circuit. Weakens electromagnetic radiation due to the morphology itself.

One object of one invention embodiment is not to limit the invention embodiment to a particular form, shape or size for the many possible embodiments of the invention that can be produced at the time of manufacture, and the practice shown herein. SUMMARY OF THE INVENTION It is to provide a physically integrated shield-containing conductive electrode architecture for use with free-standing electrode materials and / or free-standing dielectric material compositions that are not limited to morphology.

One object of one inventive embodiment is to provide the user with the ability to provide a relatively inexpensive and miniaturized solution that may be utilized for integration and integration into multiple electronic products. Is to provide.

One object of one inventive embodiment is to reduce the need for additional supporting discrete passive components to achieve the desired filtering and / or line conditioning that prior art components can provide. To provide a form.

One object of one inventive embodiment is an easily manufacturable, adaptable, multifunctional electronic for a uniform solution to a wide range of electrical problems and constraints currently encountered when using prior art devices. It is to provide an embodiment that gives the user the ability to implement the embodiment.

Another object of an invention embodiment is to create a multifunctional electronic embodiment that operates effectively over a wide frequency range when attached to an external conductive path or a given conductive surface, and It is an object of the invention to provide an embodiment in the form of discrete or non-discrete devices, or a predetermined group of conductive paths, which simultaneously performs energy decoupling of active circuit components while maintaining a constant apparent potential for a portion.

Another object of one inventive embodiment is the implementation in combination with an external conductive surface or ground area to make a connection to an additional energy path from a counter conductive path conductor for damping EMI over each voltage. Forming a multifunctional electronic embodiment to provide one or more blocking circuits that utilize a unique common conductive path unique to the form;
It is to provide embodiments in the form of discrete or non-discrete devices or predetermined groups of conductive paths.

Another object of an invention embodiment is to utilize standard manufacturing processes while simultaneously maintaining a constant, uninterrupted conductive path for energy propagating from a source to an energy utilization load. It is an object of the invention to provide an embodiment composed of a dielectric and a conductive or conductively manufactured material commonly found to reach tight capacitive tolerances between electrical paths.

Finally, another object of one inventive embodiment is to provide a plurality of commonly joined conductive electrodes,
To separate, non-conducting conductive energy paths or electrode plates that very closely couple pairs of electrical conductors with respect to each other in an area or space that is partially covered by the plates or paths and are located as part of the same embodiment. It is to provide an embodiment that can provide the user with the option of selectively coupling outer conductors or paths.

Illustrating the versatility and widespread application of a universal versatile common conductive shield structure with the addition of two electrically opposite differential energy paths for energy and EMI path conditioning and protection within the scope of the present invention. Numerous other devices and configurations are also disclosed for carrying out and building the above objectives and advantages of one inventive embodiment.

Detailed Description of the Preferred Embodiments Currently US Pat. No. 609, which is a pendant application of application 08/841940 filed April 8, 1997, currently issued as US Pat. No. 5,909,350.
No. 09/00 filed on January 19, 1998, issued as No. 7581
No. 08769, partly pending, currently filed as US Pat. No. 6018448, filed on April 7, 1998, filed 09/056379, pending application, December 13, 1999 Co-pending application 09/579 filed on May 26, 2000, which is a part-pending application of copending application No. 09/460218.
No. 606, copending application No. 0, filed June 15, 2000
Application No. 0 of August 3, 2000, which is a partly pending application of 9/594447.
Co-pending to this application, including 9/594447, is hereby incorporated by reference in its entirety into the application of the same owner as this application.

This application is based on Provisional US Application No. 60/180101, filed February 3, 2000, 2.
Provisional US Application No. 60/200327 filed on April 28, 000, Provisional US Application No. 60 / xxxxxxx filed on August xx2000, Provisional US Application No. 60 / xxxxxxx filed on August xx2000 Provisional US Application No. 60 / xxxxxxx filed August xx 2000, Provisional US Application No. 60 / xx application December 15, 2000
A portion of the provisional United States application of the same owner as this application, including xxxxxx, is hereby incorporated by reference. This is because all of these relate to each other to the continuous improvement to this new family of shield structures for multifunctional energy regulators and energy propagation circuits.

As used herein, the term universal multifunctional common conductive shield structure plus two electrically opposite differential energy paths refers to the addition of conductive feedthrough and bypass energy paths. Refers to both discrete and non-discrete versions of a common conductive shield structure that uses electrically opposite differential energy paths of.

In addition, as used herein, the acronym “AOC” for the term “predetermined area or space of physical convergence or joining” is defined as the physical boundaries of the elements of the invention with which it is manufactured. R. Unbiased and biased are individual or non-individual versions of the "AOC" which are universal versatile common conductive shield structures plus electrically opposite differential energy paths.
The energy inside the "complementarily propagates energy to a region outside a predetermined region,
And / or is defined as the extent or extent to which energy is propagated from a region outside a given region.

In electrochemistry, various interactions and correlations between energy propagation are described by pairs of energy subelements having opposite energies and forces interacting from opposite poles or electrically complementary states. It is common to describe in terms of their complementary mechanics brought about by pairing. The results of these interactions are often unrecordable due to the limitations of current test equipment. Thus, interactions described as dynamic events in complementary equilibrium can be perceived by one of ordinary skill in the art due to simultaneous symmetry of pairing, such as identical, complementary, mirrored, or anti-mirrored positioning and timing. With the understanding that one is aware of the artificial tolerances and / or restrictions used to describe or record, but which is usually accepted by its precise wording, the substance that is accessible from the molecular or atomic size scale. It is not possible to record events on any scale.

In the quantum mechanical world, the principle of complementarity is mutually exclusive in the sense that it can only describe the whole when given together, but can never be measured simultaneously. , The claim that there are pairs of complementary quantities. They cannot be measured at the same time because the act of measuring one property creates an integral body that includes the measured part, the meter, and the observer. This larger mechanical whole defines the original mechanical "portion" or a new mechanical "portion" that is separate but combined with the measured event. These two mechanical "parts" are always mutually exclusive. No matter what you observe or how you design your experiment, the mechanical "action" is always outside your experiment and reveals a new "portion" that is connected to your experiment. In quantum mechanics, this principle immediately leads to the well-known uncertainty principle, which asserts that there is a fundamental limit to the accuracy that can be obtained with simultaneous measurements. This principle also limits the accuracy of simultaneous measurements of energy and the time required to make an energy measurement.

In order to compare science with the examples found in art, the integration of aesthetically pleasing elements (as a work of art) is usually achieved by giving each element only its natural importance or significance. And is often accomplished by allowing one element to be contrasted with another element or to be matched with another element. In art, not science, complementarity is often used in a somewhat vague sense, meaning that the corresponding parts are not necessarily the same, but simply a kind of equilibrium. This effect can be described as complementarity as well as contrast.

The symmetrical design produces a pleasing effect. This effect may be monotonic if there is a close match. A mathematical operation or transformation that yields the same figure (or mirror image) as the original figure is called a symmetric operation. Such operations include reflection, rotation, detour reflection, and translation. The set of all operations on a given diagram, where the diagram is invariant, constitutes the symmetry group for that diagram. Thus, the limitation on the accuracy of a pair of simultaneous, relevant pairings of measurements is, generally speaking, the equilibrium or correspondence between the various parts of interest. The term symmetry is used in science and should take into account the stability or efficiency that results from the equalization or precise regulation of opposing forces.

These definitions should be made using the normally imposed uncertainty principle. The uncertainty principle is limited by the accuracy imposed by current test equipment and is not always prominent in large scale routine measurements, smaller scale inspections, or combinations thereof. With the understanding that measurements or declarations showing offset or suppression are usually manufactured with the shape and size of the structure in mind, it is not possible for the device to measure it or it may be measured as a ruthless fact. Even if it is not possible or cannot be confirmed, it means an understanding that the aforementioned event has occurred.

These concepts described above are inconsistent with varying degrees of semantic restrictions on events, which is a difficult subject to explain in just a few words. This is not an excuse, but is here meant to be rigorous or limited, with the expectation and foresight that the reader or one of ordinary skill in the art will use these words, adjectives, adverbs, and nouns with some degree of ambiguity that is usually allowed. Uses well-known words that can be regarded as objective.

The usage of the terms “complementary simultaneous”, “simultaneous, same size, same size, same, equal, equal size, etc.” has real world accuracy with respect to the description of the word,
All are related to the general understanding that is considered common and standard, and in particular, within the state of the art, to the extent possible, or within conventional technology for the various OEMs that make up the invention and variations thereof described herein. It should be understood that it is as realistic as manufacturing tolerances with respect to manufacturing tolerances. Accordingly, all described variations are not only those described in terms of the invention and variations described within this disclosure, but also of the embodiments of the energized circuits provided for all of the prior art. Circuit,
Considered in the light of normal industrial processes having normal industrial assembly limits for industrial manufacturing, or any other conventional industrial limits.

The present invention begins as a combination of independent materials of conducting, semiconducting, and non-conducting dielectrics, as well as stacked or stacked materials in various embodiments such as discrete and non-discrete structures. These layers can be combined into a unique circuit when placed in a system and activated. Embodiments of the invention include conductive, semiconducting, and common conducting path electrodes, conductors, deposits, plates (all of which are referred to herein as "paths"), and conducting, semiconducting, and forming groups of dielectric planes. Includes a layer of non-conductive plane. These layers are generally oriented in parallel relation to each other and in parallel relation to a given pair or group of elements that also include various combinations of paths and their stacking into a given manufacturing structure. .

These inventive elements are not limited to only dielectric layers, multiple electrode conductive paths, sheets, laminates, deposits, multiple common conductive paths or shields, sheets, laminates, or deposits. In the present invention, the dielectric layer, a plurality of electrode conductive paths, a sheet, a laminated plate, a deposit, a plurality of common conductive paths, or a shield, a sheet, a laminated plate, or a deposit are combined and connected to each other in a predetermined manner. It also includes a method of energizing into a larger electrical system.

When or after manufacturing a structured layer structure, it is formed and embedded, covered or inserted into various electrical systems or other subsystems, line conditioning, decoupling, and / or energy Can help to modify the electrical transmission of. The present invention may be a separate stand-alone embodiment or may be manufactured as a group, integral part for larger electrical structures such as integrated circuits. The present invention may be combined as a subcircuit for larger circuits found in other embodiments such as, but not limited to, printed circuit boards (PCBs), interposers, substrates, connectors, integrated circuits, optical circuits, or atomic structures. It can also exist as a non-energized stand-alone device that is energized. Alternate embodiments of the present invention may also be primarily constructed as other devices such as PCBs, interposers, or substrates that primarily have purposes other than the purposes of the smaller discrete versions of the embodiments of the present invention. This type of alternative embodiment includes both active and passive components along with stacked circuits and provides most of the advantages described for regulating the propagating energy propagating back from the energy source to the load. provide,
It can function as a possible system or subsystem platform. Prior art PCBs have already utilized certain stack configurations with various power, signal, and VIAs that provide or tap a ground layer between the dielectric and the insulating material.

At least one pair of electrically opposite complementary aligned and stacked conductive energy path electrodes are combined into an electrode cage-like structure having at least one concentrated, shared common conductive path or region. Are almost entirely surrounded by symmetrically aligned and stacked shield electrodes. When energized, the inner / outer common energy path electrode and / or region provides a shared reference ground plane for circuit voltages that exist between two opposite phase or electrically opposite differential conductive energy path electrodes. The differential conductive energy path electrode is electrically and physically located on the opposite side of the common energy path electrode and the centralized and shared common conductive electrode path or external common conductive area. These types of configurations significantly help to suppress E and H fields, stray capacitances, stray inductances, parasitic currents, and allow for the mutual cancellation of variously located signals, power, and return path electric fields. Become. PC built
PCBs utilizing B, or a variation of the architecture of the present invention, can utilize various grounding schemes to improve the efficiency of existing structures currently used by large PCB manufacturers.

In order to propagate electromagnetic interference energy, two fields, an electric field and a magnetic field, are needed. The electric field couples energy into the circuit due to the voltage difference between two or more points. A magnetic field is created by changing the electric field in space. Any time-varying magnetic flux produces an electric field. As a result, purely electrical or purely magnetic time-varying fields cannot exist independently of one another. Passive architectures such as those utilized by embodiments of the present invention can be constructed to regulate or minimize both types of energy fields found in electrical systems. Embodiments of the present invention are not necessarily constructed to tune one type of field, but not the other, but use different types of materials to allow one such energy field to be used. Embodiments can be constructed that can make specific adjustments to the other energy field that is not.

With respect to almost all embodiments of the present invention, whether illustrated or not, Applicants have found that some or nearly all of the desired degree of electrical functionality of embodiments of the present invention. It is contemplated that the manufacturer has the option of combining a wide variety of possible materials that have been selected and combined within the configuration of the embodiments of the invention during manufacture while maintaining.

The materials for the compositions of the present embodiments can have one or more layers of material elements compatible with available processing techniques and are not limited to any possible dielectric material. These materials may be semiconductor materials such as silicon, germanium, gallium arsenide, or semi-insulating or insulating materials such as, but not limited to, any K, high K, and low K dielectrics. Similarly, embodiments of the present invention are not limited to any possible conductive material, such as magnetic, nickel-based materials, MOV-type materials, ferrite materials, films such as mylar, or create conductive paths for conductive materials. It is not limited to almost any type of material and process that can be performed, including but not limited to doped polysilicon, sintered polycrystalline, metal or silicate polysilicon, silicate polysilicon, conductive material deposits, etc. Is not limited to almost any material or process capable of producing a conductive region of.

Embodiments or devices of the present invention mounted between energized wire pairs reduce prior art devices where capacitive or circuit voltage imbalances are mitigated or enhanced at high frequency operation. Normally associated manufacturing imbalances are mitigated.

Prior art capacitors manufactured in the same manufacturing batch have>. 0
The capacity may easily fluctuate in the range of 5% to 25%. Therefore, when a prior art capacitor is placed in a circuit and energized, its manufacturing tolerances are introduced into the circuit, in this case, for example, a differential pair circuit, which exacerbates the voltage imbalance in the circuit. Costs for inspection, manual sorting of manufactured lots, as well as differential signaling, even when prior art devices are manufactured to obtain a minimum variation of less than 10% capacity between individual devices. Or, in order for manufacturers to regain the additional costs for the more specific dielectrics and fabrication techniques needed to fabricate the low individual variation prior art devices needed for filtering, the user must: You have to pay the cost or a considerable premium. The present invention allows the use of very cheap dielectric materials (compared to other available materials) to obtain the equilibrium between two lines.

By using an embodiment of the present invention, a differential circuit or an electrically opposite differential pair circuit is arranged to electrically couple each pair of circuits of the circuit utilizing the embodiment of the present invention. It is possible to provide complementary and approximately equal capacity tolerances due to the device of the present invention being shared equally and complementarily by some of the propagation energy generated between them. The voltage tolerances of the invention, and / or the capacitive and inductive balance, and / or the minimization between shared central conductive paths that are internally obtained within embodiments of the invention, allow for capacitive capacitance between individual devices. Even with a commonly specified X7R dielectric with a 20% variation, it will always remain relatively at a factory-created level during manufacture of embodiments of the invention.

Accordingly, the present invention, manufactured with tolerance values greater than 0% and less than 5%, will almost always correlate with tolerances greater than 0% and less than 5% when manufactured as described in the disclosure. Having the value, the capacitive tolerance between pairs in a biasing system, and the additional benefit of replacing two prior art devices for bypassing the pair using one of the embodiments of the present invention. Become. Thus, the need for expensive and specialized dielectric materials for bypassing and / or decoupling operations that attempt to maintain a capacitive balance between two system conductive paths is eliminated by the user of the present invention in the entire circuit. It is possible to utilize homogeneous capacitive elements in the material composition. This new invention is located between the conductive paths and also constitutes an embodiment of the invention. The common conductive path is common to all elements of the common conductive path and is connected to the third conductive path which is the outer conductive region. .

A versatile multi-function common conductive shield structure plus two electrically opposite differential energy paths has been fabricated, followed by an electrically opposite differential energy also utilizing embodiments of the present invention. When attached to an externally manufactured conductive path that is separate from the path (and not the differential energy path), embodiments of the present invention provide, at almost the same time, at least bipassing, energy, power line decoupling, energy storage,
And energy regulation functions including filtering. Thus, within embodiments of the present invention, substantially all of the electrically opposite differential energy paths or electrodes are almost completely covered within the shield structure and attempt to escape from the confinement region surrounding the covered differential conductive path electrode. Almost all internally generated capacitive or energetic parasitic currents will be relatively nearly eliminated. At the same time, this versatile multi-function common conductive shield structure allows almost any externally generated capacitive or energy parasitic currents, such as "floating capacitances", to actuate the common conductive shield structure on exactly the same covered differential conductive path. And acts to prevent coupling due to physical shielding different from the electrostatic shielding effect created by attachment to an externally located common conductive region by industrial attachment means well known in the art. .

Attachment to common outer conductive areas includes areas such as non-potential conductive areas (at a given moment) commonly referred to as “floating”, circuit system returns, chassis or PCB ground, and even ground. Due to the cancellation of opposite energy fields and other features such as interconnected parallel circuits, embodiments of the present invention provide a low impedance path on and in a Gauss-Faraday cage or common conductive shield structure unit. , Its enveloping conductive common shield path electrode can be generated, thereby facilitating or enabling a continuous d transfer of a portion of the energy onto an externally located common conductive region. ,
Therefore, the generation or promotion of the generation of low impedance energy paths is also completed to take advantage of unwanted EMI noise.

With this mounting scheme, for each differential conductor located, its respective (differential conductor) structure, and the common conductive surface used externally, a “0” voltage reference is almost always the common center and common conductive surface. It will be possible to occur on the other side of the path. By using embodiments of the present invention, it is possible to maintain a voltage, even in an SSO (simultaneous switching operation) state between gates located in an integrated circuit, in the circuit system, It allows the voltages to be complementary without contributing to the destructive energy parasitic currents that return into the circuit system when the embodiments are passively operated.

Therefore, the capacitive balance produced within the non-biased invention is prevented or minimized from being disturbed by parasitic currents, which is not the case in other prior art devices that do not use a conductive shield structure. This is in contrast to what happens. In the prior art, free parasitic currents were usually able to disturb the circuit, even when modernizing almost all prior art devices.

As pointed out above, propagating electromagnetic interference can generate both electric and magnetic fields, respectively. Until recently, there has been emphasis in the art to filter EMI from circuits or energy conductors that carry high frequency noise with DC energy or current. However, embodiments of the present invention provide DC, AC, and AC / AC of energy along a conductive path in an electrical system or test device.
The energy using DC hybrid type propagation can be adjusted.
This is to use embodiments of the present invention to regulate energy within a system that includes many different types of energy propagation formats within the same electrical system platform, systems that include many types of circuit propagation characteristics. including.

Although not shown, it should be noted that the various electrode stacks in FIGS. 2, 3, 8, and 9 are contemplated to have a split electrode configuration or a combination with other non-split electrode configurations. . For convenience of time, various combinations relating to particular drawings have been omitted.

The principle of the Faraday cage-like structure is that the common conductive paths are joined together, the grouping of said paths working together with a larger external conductive area or surface to suppress the emitted electromagnetic radiation and to suppress voltage and surge. It provides a larger conductive surface area to dissipate and initiates common conductive electrode cage-like electrostatic dynamic suppression of parasitic or other transient currents, while at the same time multiple common conductive paths are electrically coupled to system or chassis ground. Embodiments of the present invention are placed therein and are used when relying on a reference ground for the circuit being energized. The electrically opposite differential conductive energy electrodes or structures are electrically isolated and shielded from each other and typically do not contact within the embodiments of the invention.

The attached internal common conductive electrode paths, which make up the Faraday cage-like structure, placed the common external conductive area or common energy path in a given stacked PCB or similar electronic circuit during subsequent energization. In this case, it is possible for the common conducting elements to be expanded, arranged close together and arranged substantially parallel to their position.

A portion of a universal Faraday shield architecture having stacked conductive hierarchical progression with paired electrically opposite differential conductive paths is shown in detail in FIGS. 1, 2 and 3. Thus, multiple, but independent operating energies when placed in a conductive combination with the various internal and external common conductive paths (not fully shown) of FIGS. 1, 2 and 3. In order to disclose the importance of the portion of the pair of differential conductive paths configured to be adjustable and independent of the Faraday cage common conductive shield structure, such as the embodiment 9905 shown in FIG. Discuss with free movement between FIGS. 1, 2 and 3.

In FIG. 2, the common conductive shield electrode paths 850F / 850F-IM, 840F, 83
0F, 820F, 810F, 800 / 800-IM, 810B, 820B, 83
0B, 840B, and 850B / 850B-IM are within embodiment 9900,
Figure 3 has an embodiment of a universal Faraday shield architecture with the illustrated stacked conductive hierarchy progression without the pair of electrically opposite differential conductive paths. If desired, a species of common electrode path that can be used as the image shield shown in embodiment 9900 and can also be found to have part of a universal Faraday shield architecture with stacked conductive hierarchy progression with conductive differential paths. And optional sandwiching 850F / 850F-IM and 850B / 850 used as part of the variant shown at 9905 in FIG.
B-IM common conductive shield path.

It should be noted that most, if not all, of the general principles described herein are general to this new invention and alternative embodiments. The section based on the common conductive path 800 / 800-IM also applies to other common conductive paths from the point of being connected to the same potential external common path that is not the external differential path (both are shown in FIGS. 1 and 2). (Not shown).

First, FIG. 1 shows a portion of the complete shielded electrode container 800E of FIG. Figure 1
Returning to FIG.
0 / 800-IM and a common conductive shield electrode path 810B (810B is not shown in FIG. 1, but is shown in FIG. 2).

A dielectric material or medium 801 is disposed above and below the path 855BB. Deposition, manufacture, and / or positioning of the dielectric material or medium 801 is generally accomplished by standard enveloping of a given dielectric material or medium 801 during the manufacturing process by standard means well known in the art. And insert.

Dielectric material 801 separates 81 between working end 817 and common electrode path end 805.
4 areas or spaces are formed to form generally equal distance intervals between the differential conductive path electrode end 803 and the working end 817. Common conductive path 800 / 800-I
M and 810B, as well as electrode paths 855BB, are separated from each other for the most part by a generally parallel insertion and distance 814C with a given dielectric material or medium 801 disposed against them. Distance 814C corresponds to the planar electrode (2) major surface area, respectively, as well as various conductive connection various electrode connection materials 798-GN.
Most of the parts were made of material 8 except for the extension 812A and 79-GNDA to DA and 890A, respectively, for each conductive electrode stacking location.
Boundary or surface or surface edge being each of the aforementioned peripheral edges to be contacted with 01, 855B
803 of B and at least two sides of 800- / 800-IM-1 & 2.

The inset distance or region of element 806 is the boundary for the confined region of the energy flux portion during energization, this spacing is almost always the surrounding common shield electrode end 805 and the sandwiching common conductive shield electrode path. , Relative to substantially any electrically opposite differential electrode end 803 of the sandwiched differential conductive electrode paths (all not shown). This positioning and setback distance 806 of nearly any differential conductive electrode path electrode end 803 within the common electrode end 805 of the common shield electrode path 799G conductive material region of nearly any embodiment of the present invention is consistent with the practice of the present invention. It is regarded as a form of axiom. This axiom applies to almost any pair of differential conductive paths utilized, either in the container of a shield 800 “x” container as shown in FIG. 3, or externally, and has a shield electrode hierarchy. Although including at least one pair of outer electrically opposite differential electrodes found across the electrode hierarchy, both outer electrically opposite differential electrodes shown in FIG. 3 are almost always implemented to some extent. Shielded electrode hierarchies will be utilized in a shielded fashion in discrete or non-discrete versions of the form (not shown here).

First, a portion of an embodiment of the invention as shown in FIG. 2 and after starting from FIG.
Two single common conductive containers 800 "X" are each formed with two common conductive shields. However, in the process of manufacturing it, rather than when using four common shield electrodes, three shield electrodes can be used to create two common conductive shield electrode containers, eg, 800E and 800F. . Therefore,
Each single common conductive container 800E and 800F shares a centrally located shield electrode path common to both the conductive shield electrode structure and the container, in this case 90
Configure a common conductive Faraday center structure called 0A.

Here, not only the common conductive Faraday center structure 900A is formed, but also a part of the common conductive shield electrode structure called 900 “X”, which is similar to 900 B and 900 C of the much larger common conductive shield electrode structure 9900. Note that is created.

Each of the common conducting shield electrode structures 900A, 900B, and 900C shown in FIG. 2, when individually made, is as a single common conducting Faraday cage-like structure with the electrically opposite electrodes alone. If they include at least one pair of outer electrically opposite differential electrodes that are found to work well and are separated by the same common conductive Faraday cage-like structure and are found beyond the inside of the shielded electrode hierarchy. Any of the above will almost always still utilize the shielded electrode hierarchy to some extent, in either a discrete or non-discrete version of the embodiment (not shown here).

Embodiments of the present invention utilize a pair of electrically opposite differential energy path (not shown) arrangements, when energized, and 900A, 900B, and 900C.
If a structure such as any one of the It will always be done.

The relative inset to electrode 855BB inset in 800 / 800-IM- of FIG. 1 relative to the inset, or overlapping shield distance and area 806, causes electrostatic shielding effects, among other things, in this positioning relationship and in embodiments of the invention. It is possible to act on the relationships between the various elements of. Some of these space / distance relationships include, among other things, the vertical positioning of electrodes of almost all species (differential and common) with respect to each other and the separation of these electrodes with respect to each other and within the electrodes. Relative horizontal positioning for each internal electrode position is included, depending on the amount of dielectric material 801. This includes the relationship of various spacings and distances to the external embodiment frame or energy adjustment functions and this effect within this frame necessary for their positioning and proper energy adjustment interactions occurring within the frame. Be done. Common conductive path 800/800
-IM extends to a perimeter or edge that overlaps a distance beyond the perimeter or edge of electrode path 855BB and escapes normally beyond electrode edge 803 of electrode path 855BB in the absence of common electrode 800 / 800-IM-, 810F. Or to provide a shield against portions of various types of energy flux fields (not shown) that may try to couple to a "sacrificial" conductive path (not fully shown). Please note.

The energized, grouping-generated electrostatic shielding effect of these common electrode paths includes the grouping of the Faraday-like cage system, which will generally result in close proximity, 875BB ( Near-field coupling between virtually any internally located differential electrode paths (not shown) or the like is reduced or minimized. The horizontal electrode inset distance 806 is approximately a measure of the vertical distance or the electrode inset distance, or the difference to the common electrode shield inset 806 that creates a distance relationship between the electrode path 855BB and the common conductive path 800 / 800-IM. It can be stated that it lies between approximately> 0 and 20+ times the inset interval 814C. It is based on standard manufacturing methods and distances.

In other words, the extension portion (use it) despite almost any other element separating these two adjacent inventive elements, other than another differential electrode (such as an electrode having a split electrode pair). Or almost any adjacent differential electrode path has a smaller conductive plane size than the main surface electrode conductive area size, and is almost always larger than any of the adjacent common conductive shield electrode paths. The surface electrode conductive area size is smaller, the extension is smaller (if it is used), or the conductive plane size is smaller. This means that regardless of the dielectric material 801 or split differential electrode pairing, the next adjacent common conductive shield electrode path is at least almost always larger in coverage size and is considered to shield the same adjacent differential electrode. Means that

There is one size exception as a general rule, which is applicable only to at least the outer sandwiching differential electrode paths as shown at 865BB and 865BT in FIG. These special outer sandwiching differential electrode paths can have larger or smaller conductive area sizes, conductive material coverage, or conductive plane sizes than their adjacent common conductive shield electrode paths, and also FIG. 3C. These outer sandwiching differential electrode paths 865BB and 865BT of the need not be the same size as one another for the electrical functional variant configurations of the other inventions.

Accordingly, the common corresponding conductive master electrode surface area size of any pair set of differential electrode paths, then the adjacent common conductive shield electrode principle electrode surface or master electrode conductive material of either path. Unless the size of the coverage or the conductive plane size is the same, variations of this axiom are considered embodiments of the invention that have some of the energy conditioning function as disclosed.

The electrode inset distance 806 can be optimized for a particular application, but is common perimeter of common / differential electrode overlaps 806 and common from the differential electrodes included in each. Distance to shield electrode path pairing 814, 806A, and 8
14C and the overlap relationship are ideal and manufacturing tolerances are allowed but are about the same throughout the embodiments of the invention.

Additionally, internal differential conductive electrode paths such as 855BB sandwiched within the conductive regions of two common conductive paths such as 800 / 800-IM and 810B (not shown) in FIG. The relationship of the distance 806 between the electrode ends 803 of the conductive electrode 855BB is maintained. This relationship is relative to the perimeter electrode edge 805 of the common path electrode 800 / 800-IM, thereby allowing the distance or area inset to be a rule relating to the relative horizontal distance to 806. 7A of the disclosure showing various dielectric thicknesses, the electrode end 805 has a perimeter that is exposed or "peaked out" beyond the electrode end 803 by at least a vertical separation distance 814C.
The relative horizontal distance to 806 is the result of adding the three-dimensional distance 806 from the common conductive shield electrode end 805 when measured to the 800E differential electrode path electrode end 803. The outer electrode end 803 of the differential conductive path electrode 855BB is an inset,
800, which is an intermediate insert, between the sandwiched common conductive paths 800 / 800-IM and 810B (not shown) over the common electrode end perimeter 805, sandwiched and sandwiched between the differential conductive energy electrode paths 855BB or equivalent. / 800-
Located in both IM, 810B, covering a distance or region 806 along approximately the total perimeter distance of belonging 805 and 803. 806, 814, and 814C
Small or small differences in distance or area are due to the electrostatic shielding capabilities (not shown) of the universal Faraday Shield architecture with stacked conductive hierarchical progression, which have a pair of electrically opposite differential conductive paths. Unless impaired, it does not matter between the pathway as a whole or the pathways individually.

For the series shown in FIGS. 1 and 2 and shown in FIG. 3, for example, 850F / 850F-
IM, 840F, 830F, 820F, 810F, 800 / 800-IM, 81
The common conductive shield electrode paths, such as 0B, 820B, 830B, 840B, and 850B / 850B-IM, each generally occupy a region of common conductive shield electrode path material 799G for the end embodiment of the type desired by the user, which is all about the same size. It is desirable to have normal manufacturing margin of error to ensure a uniform region size relationship for almost any combination of various adjacent common conductive paths. This applies to the size relationship for each member of the common conductive path, which is grouped as a shield electrode in almost any general configuration of embodiments of the present invention. Thus, any differentially conductive paths that are sandwiched and located internally, either individually or in pairs of the same size, have at least two larger but identically sized common conductive shields to each other and each. The electrode paths will always be physically completely shielded, both of which will always consist of a larger total shielded conductive electrode area than the area of the differential electrode it shields. This common sized common conductive shield electrode axiom is based on 800A, 800B, 800C, 8 shown in FIG. 2 and partially in FIG.
Any sandwiched differential conductivity in almost any of the Faraday cage common conductive shield structure containers of the present invention, such as those referred to as 00D, 800E, 800F, 800G, and 800H (commonly referred to as 800 "X" respectively). The size relationship of at least the same size or larger material area of the common electrode energy path element to the path or electrode conductive area size applies.

Almost any of the sandwiching common conductive paths, by itself, is almost arbitrary.
Note that one will have a sum of the top and bottom conductive material areas that is almost always greater than the sum of the top and bottom conductive material areas of the two interleaved differential conductive paths. Any one of the sandwiched differential conductive paths may partially comprise a typical universal Faraday shield architecture having a stacked conductive hierarchical progression with a pair of electrically opposite differential conductive paths. In addition, it is almost always almost completely physically shielded by the common conductive shield electrode material region.

Common Conduction Shielding Path Electrodes 850F / 850F-IM, 840F, 830F, 82
0F, 810F, 800 / 800-IM, 810B, 820B, 830B, 84
0B, and 850B / 850B-IM, all of the conductive common conductive paths shown in FIGS. 1 and 2 are typically inserted a predetermined three-dimensional distance 814 from the outer end 817 of embodiment 9905 (not shown). However, this can be seen in detail at 800E in FIG.

Element 813 is the center of the three-dimensional energy conditioning function performed within an embodiment of the invention (not shown) relative to the final size, shape, and position of the embodiment in the energizing circuit. Note that it is the illustrated dynamic representation of the axial points.

Thus, paired and identically sized electrically opposite differential conductive paths, such as 800 / 800-IM and 810B in FIG. 2, with larger sandwiching common conductive paths are Each homogeneous seed grouping (common or differential path) within the same seed grouping will almost always be of generally the same size, so that specific manufacturing capabilities are possible. This same size conductive path electrode species axiom applies to almost any conductive path species group that has some of the major elements in the general configuration of nearly any new embodiment of the invention.

Returning to FIG. 1, the differential conductive electrode path 855BB is a conductive electrode material region of any differential conductive path that is deposited, doped, chemically generated, or placed, or simply screened on. 799 may be included. The conductive electrode material region 799 has a total conductive region size that is almost always smaller than any of the one common conductive shield electrode material region 799G size, and when calculating the ratio of the total conductive electrode material regions, it is 800 /
It will almost always be relative to the conductive electrode path material 799 region of any given sandwiching common conductive path such as 800-IM and 810B (79).
9 and 799G are typically the same conductive material type for purposes of disclosure, but in other embodiments they can be different material types, the same type herein, but as completely as possible. Note that they are separately numbered to describe the embodiments).

Shielding electrode containers 800A, 800B, 800C, 800D, 800E, 80
These 850F / 850F-IM, 840F, 830F, 820F, which make up 0F, 800G, 800G, and 800H, cover the differential pair, and constitute an integral grouping of the pair of conductive shielded containers 800X. , 810F,
800 / 800-IM, 810B, 820B, 830B, 840B, and 85
The 0B / 850B-IM sandwiching function also helps to a good extent in carrying out part of the energy transfer to an externally mounted common conducting region or common energy path, while at the same time within the embodiments of the invention. It is possible to generate the help of voltage image references for the circuits contained in.

An equal number of shielded electrode container structures 800 forming part of an embodiment of the present invention.
The "X" s are almost any additional or extra single common conductive shield that is balanced in this embodiment, added by mistake or foresight during the manufacturing process, according to a predetermined stacking sequence later. Note that the routing layer will not sufficiently hinder or reduce the energy conditioning operation. Due to the extra common conductive electrode stack added, almost any automated layer process may optionally add an additional outer layer as described, or actually include one of the two designated IM common conductive shield electrodes. With no manufacturing process, you can actually make potential cost savings. As discussed, these manufacturing errors, intentional or accidental, are not predominantly detrimental to the integrity integrity of embodiments of the present invention with properly sequenced stacking of the common conductive shield electrode containers shown at 800X. Disclosed and fully contemplated by applicant. However, this axiom is not true when additional outwardly separated pairs of identically sized electrically opposite differential conductive paths are in place. In this case, it is essential that an equal number of shielded electrode container structures 800 "X", which form part of an embodiment of the present invention, be in equilibrium within the embodiment structure according to a predetermined stacking sequence that follows. . There should be no additional or extra single common conductive shield path layer prior to the application of a separate pair of electrically opposite differential conductive paths of the same size. Therefore, due to mistakes or foresight, almost any additional or extra single added during the manufacturing process prior to the positioning of additional externally separated pairs of electrically opposite differential conductive paths of the same size. The common conductive shield path layer will also hinder or reduce the energy conditioning operation. The number of electrically opposite differential conductive paths of the same size in a pair, in almost any variant of the embodiment of the invention, must also be even.

With further reference to FIG. 2, common conductive shield electrode paths 850F / 850F-I
M, 840F, 830F, 820F, 810F, 800 / 800-IM, 810
It can be seen that B, 820B, 830B, 840B, and 850B / 850B-IM are further surrounded by a dielectric material 801 that provides the support and outer casing of embodiments of the present invention when configured as discrete components. 798-
A common conductive connection material or structure labeled GND “X” is illustrated for this configuration and illustrated in FIG. 2 and common electrode energy path 800/800 of FIG.
-As illustrated in detail with respect to IM, an electrode end 805 of common path electrode material 799G contained within at least two side structures 9900 is applied to the extended continuous portion of said common shield path electrode extension 79-GNDA. . Note the number of common shield path electrode extensions 79-GNDA at any common electrode end 805.

The various dielectric materials 801 also have a predetermined electrical tuning function within the embodiment AOC, or a variety of electrically opposite and paired differential conductive energy paths utilizing the embodiment AOC. It makes it possible to act on a part of the propagating energy transferred along the combination.

By further looking at FIG. 2, the element type 798-GND “X” common conductive attachment means, electrodes, or termination structure is common conductive path energy electrode 850F / 80.
0F-IM, 840F, 830F, 820F, 810F, 800 / 800-IM
, 810B, 820B, 830B, 840B, and 850B / 850-IM, respectively, can be electrically and physically connected to each other and to the same conductive external common conductive path or external common conductive energy path or region 6803 shown in FIG. It becomes clear that The generated new common energy path is the differential path (
798-GN, such as a conductive material, electrode, or termination structure, as well as a third common conductive energy path external to the embodiment of the present invention (not shown)
Used to develop or create a D "X" common conductive mount.

The universal multifunctional common conductive shield structure 9900 has the illustrated multi-stacked common conductive cage-like structures 900A, 900B, and 900C, which are generally parallel relationships of multiple stacked common conductive cage-like structures or containers. 800A, 800B
, 800C, and 800D (each commonly referred to as 800X). Each common electrode shielding cage structure 800X includes at least two common conductive path electrodes, 85
0F / 800F-IM, 840F, 830F, 820F, 810F, 800/8
00-IM, 810B, 820B, 830B, 840B, and 850B / 85.
With 0-IM. The number of stacked common conductive cage-like structures 800X is not limited to the numbers shown herein and can be almost any even number. Thus, the stacked common conductive cage-like structures 900X are not limited to the numbers shown herein and can be even or odd.

In another application, not shown, each pair of common conductive cage-like structures 800X is
As described above in connection with FIG. 1, sandwiches at least one conductive path electrode. To emphasize that the common conductive cage-like structures 800X are paired and that almost any type of counter-conductive path can be inserted into each common conductive cage-like structure 800X, the common conductive cage-like structures 800X are separated. It is shown. Therefore,
The common conductive cage-like structures 800X are paired to form 900B, 900A, and
And 900C have a versatile application in producing a larger common conductive cage-like structure 900X, in combination with, but not limited to, a pair of conductive paths, a configuration embedded in silicon, or of a PCB. Some may be used in individual or non-individual configurations such as individual component networks.

As described in FIG. 2, the dielectric material 801 is separated from a pair of electrically opposite differential conductive paths or conductive path electrodes (not shown) of the same size sandwiched therein. Common conductive path electrode 850F / 800F-IM, 840F, 830F, 820F
, 810F, 800 / 800-IM, 810B, 820B, 830B, 840B
, And 850B / 850-IM conductively isolating and also electrically isolating and shielding at least one pair of outer electrically conductive differential conductive paths of the same size.

In addition, as described in connection with FIGS. 1 and 2, the smallest two cages, eg 800E and 800D, which make up the larger cage 900A, are used in almost all of the stacked embodiments of the present invention. It is necessary to construct a multifunctional line adjustment structure for Therefore, as shown in FIG. 2, each 900A, 900B
, And 900C, there are a minimum of two required common conductive cage-like structures 800X. A very basic common conductive path fabrication result for any sequence (excluding dielectric material, etc.) is that it has a minimum of three stacked common conductive interconnect common shield electrode paths, and electrically opposite differential electrode energies. Connecting at least two pairs of paths, and a pair of pairs within a minimum of three common conductive interconnect common shield electrode paths, and including at least a portion of the operating electrical circuit when energized. It should be seen as a shield electrode embodiment structure further comprising a minimum of three common conductive interconnects that can be biased together and a pair of pairs outside the common shield electrode path.

In summary, in general, a single larger Faraday cage-like structure 900 “
When "X" is attached to a larger outer conductive area (not shown), this combination results in electrically opposite differential conductive electrode paths (() sandwiched within cage-like structure 900 "X".
(Not shown), as well as a variety of electrically opposite differential conductive paths, generally of the same size (with the exception for special outer electrodes), located at least one set of electrically isolated outer sides. As the energy propagates along the paired groupings, it helps to perform the bias line conditioning and filtering functions simultaneously.

Almost all variations of the universal Faraday Shield architecture with stacked conductive hierarchy progressions include various individually stacked layers that share common conductive connections with each other and with externally located energy paths that are not differential conductive paths. It is used as an interconnecting shield structure having a shield electrode.

Due to the conductive common connection of the shield electrodes arranged inside to each other and to the external energy path which is not the differential conductive path, the reference voltage for a part of the circuit included in the embodiment of the present invention. As a separate energy path that can supply
It is possible to use this third path at the same time. This third energy path utilized by the grouped electrode shield paths also allows for the development of a predetermined low impedance path utilized by each portion of the energy utilizing the differential path for propagation.

Due to the differential propagation of energy according to embodiments of the present invention, embodiments of the present invention AO
Some of the embodiments of the present invention are provided in a complementary and balanced manner to each other by supplying a portion of the energy in C and in terms of circuit system efficiency advantages over similar prior art circuits. It is possible to develop a device or an embodiment to be used. This separate, generally shared, third path acts only as a voltage divider for the energy present in a given energizing circuit due to its actual physical and electrical placement within the normal larger energizing circuit. Not do. This physical and electrical position is provided by at least one pair of internal, pairwise and oppositely acting differential conductive energy paths during a biasing operation,
A shield electrode insertion arrangement and electrically between at least one pair of electrically opposite differentially conductive paths of generally the same size (there are exceptions for these special outer electrodes). It is best described as a common arrangement.

This alternative third pathway is an embodiment of the invention and / or its 813AOC.
(Not shown) not only for circuits operating in
At least one pair of opposite and counter-acting differential conductive energy paths, and at least one pair of generally oppositely-sized electrically opposite electrodes (with exceptions for these special outer electrodes). Also for the differential conductive paths, they are simultaneously used and shared as a common voltage reference node.

The present invention also includes a pair of oppositely acting differential conductive energy paths each connected to the circuit from mutually inverted portions of the propagating circuit energy or voltage balance within the AOC of embodiments of the present invention. Minimize or suppress unwanted energy parasitic currents resulting therefrom. The invention also escapes harmful and undesired energy parasitic currents, such as in the form of common mode energy returning into the circuit system,
And the conduction path of subsequent releases to keep the circuit out of the adverse effects of AOC.

Referring now to FIG. 3, it is possible to decompose the overall structure 9905 into smaller, paired cage-like conductive structure portions and, for example, further common conductive shield electrode energy paths 810F, 800 / Figure 8 shows various small groups of stacks of conductive shield structures divided up to just 900A consisting of 800-IM-, 810B-, often with each shield species group being the external common conductive material 6;
805 or an industry standard connection means (not shown), conductively coupled to or attached to it to allow the use of an externally provided common conductive area or path 6803, this 900A being typical of the new invention. It is not of any of a variety of external electrically opposed differential conductive energy paths found to be attached or conductively coupled to one inventive embodiment for various applications.

As shown in FIG. 3, paired electrically opposed differential conductive bypass propagation mode energy paths, such as inner 855BB and inner 855BT, and pairs such as outer 865BB and outer 865BT of FIG. To adjust the electrically opposed differential conductive bypass propagation mode energy path, the paired 900 "X
The container 800 “XX” includes a common conductive universal shield electrode structure 9905 or equivalent in such a manner that various common conductive path shield electrodes are added to a given mold to form an “X” structure. 900 "XX" forms a larger overall shield electrode structure similar to that shown in FIG.

As shown in FIG. 3, the common conductive connection material connection portions 798-GNDA are respectively 7
As long as it is possible to maintain some kind of physical and electrical contact with a portion of the electrode end 805 of the common path in the area of the electrode extension shown uniformly with 9-GND "X",
One fully configured invention embodiment should work properly.

In FIG. 3, all pairs of electrically opposed differential conductive bypass propagation mode energy paths, such as inner 855BB and inner 855BT of FIG. 3, have different combinations of common conductive electrode shield electrodes. Route 810F, 800/8
00-IM-, 810B sandwiching each interconnected common conductive path,
This common conductive electrode shield electrode path differential conductive path sandwiches 855B and 855BT internally and is itself retracted to position 806 (FIG. 1), which is also approximately equal.
Also, all electrically opposed differential conductive bypass propagation mode energy paths, such as outer 865BB and outer 865BT, are electrically stacked in a spaced apart manner. Under such conditions, the conductive circuit, when energized, eliminates or minimizes noise or energy fields, as described above, and complements with respect to the common conductive shield electrode and material region or deposit layer positioned therein. Objectively or commonly utilize features of embodiments of the invention such as filtering or surge suppression. As shown in FIG. 3, each container 800D and 800E
Inside the larger structure 900A, some interior 855BBs that physically oppose each other
And can hold the same number of differential electrodes of the same size, such as 855 BT, but these containers are oriented and each act in a substantially physical and electrically parallel manner, which results in different energies. It is possible to maintain the adjustment function.

The larger this conductive Faraday cage-like common conductive shield structure 900A with cooperating 800D and 800E, which are shield-like structures, respectively,
Using an electrode extension 79-GNDA to the externally applied common conductive electrode material for electrical connection that is electrically applied and energized in the circuit and attached to the common conductive region 6803. And attached to the same external common conductive path region 6803. By resistive attachment, such as conductive solder material 6805 or other conventional connection means for conductive attachment or known industrial methods, or by methods known as various soldering methods (not shown), And the internal electrode extension 79-
This is accomplished by utilizing almost all possible means of generally acceptable industrial attachment methods (not shown) such as GNDA and reflux solders, conductive epoxy resins and adhesives (not shown). To be executed.

As a result, the manufacturing sequence is as follows (excluding the dielectric material). First, the differential conductive path 865BB, then the common conductive path 810B, and then the differential conductive path 855BB.
Of the common conductive path electrode 855BT, which is provided in the center of the internal differential conductive path 855BT.
10F, and then the external electrically opposed differential conductive paths 865BT were attached and created, and the completed structure of this example is activated in FIG. 3 resulting in a voltage reference path.

Still referring to FIG. 3, the portion including 810F, 800 / 800-IM, 810B is shown including a portion of the embodiment 9905 of FIG. One common shield electrode is configured as a shield electrode including two electrode extensions 798-GNDA (shown in detail in FIG. 1) and then combined with other elements of embodiment 9905, which In most cases, paired energy paths are inner 855 and outer 865 BT and inner 855 BB and outer 865, respectively.
Provided in combination to form two pairs of electrically opposed differential conductive bypass energy paths in pairs that include two subsets of BB, and the portions are in common conductive shield electrode energy paths. Alternatively, it may be considered a pair of bypass conductive path elements sharing structure 900A.

FIG. 3 is a partial cutaway view of various attached elements of embodiment 9905 of the invention and is shown as a cross-sectional view. Universal Faraday Shield Architecture with Stacked Conductive Hierarchical Progression, Including Separate Circuits for Paired and Simultaneously Propagating Energy Along Electrically Differential Paths Utilizing Independently Acting Bypass Energy Propagation Modes The concept of 900A shows a structure 9905 that includes a stacked common conductive cage-like structure 900A, which in turn is a multiple stacked common in the context of generally parallel but interconnected conductive shield electrodes. It consists of a conductive cage-like structure or container 800D and 800E (each uniformly referred to as 800X). Each common conductive container 800D and 8
00E is at least two common conductive path electrodes 810F, 800 / 800-IM.
, 810B is included. The interconnected stacked common conductive shield electrode cage structures 800x are even, and typically even. Therefore, the stacked common conductive cage-like structures 900X are also not limited to the numbers shown herein, but are typically even or odd.

Also shown in FIG. 3 are two pairs of common conductive cage-like structures 800X, each operating independently of two electrically opposed pairs of conductive differential bypass mode path electrodes of the same size. It shows a state of sandwiching at least one conductive differential bypass mode path electrode including a pair. This interconnected stacked common conductive shield electrode cage-like structure 800X is substantially all discrete, in discrete or non-discrete configurations such as, but not limited to, the discrete stand-alone components shown in FIGS. 3 and 7A. But can be used in combination with a pair of external differential conductive energy paths, such as silicon ICs, interposers, modules, substrates, or PCs.
Structures such as, but not limited to, a combination of discrete and non-discrete components embedded in part of B, energy regulation network, etc. are not shown.

The common conductive path electrodes 810F, 800 / 800-IM and 810B are all
Conductively interconnected to 79-GNDA as shown, via solder material 6805 or most other attachment means known in the art, to an external common conductive energy path or region 6803. I will provide a. Each common conductive path electrode 810F, 800 / 800-IM and 810B includes a dielectric material 801.
Only the lateral side formed above and including dielectric material 801 instead of conductive electrode material 799G is shown.

As shown in FIG. 3, the electrically opposed differential energy paths of the illustrated paired sets are set or paired, and are of substantially the same size and substantially complete each other's major electrode surface areas. Surrounding but separated by a larger common shield electrode and dielectric material 801. Such paths are in complementary pairs to provide conductive coupling in electrically opposed motion (when energized). These similarly sized, complementary paired electrically differential (in operation) conductive electrodes or energy paths are typically physically separated from one another, as well as the common conductive shield electrode energy paths. The charge of one of the two main conductive parts is electrically located on the opposite side with respect to each other. All of the electrodes shown here are generally flat in shape and appearance, and are arranged in groups of each of these homogeneous groups, which results in many levels in the areas where they are effectively utilized by the various portions of the energy propagating therein. Keeps the balance.

A plurality of common shield electrode paths 810F, each with a coupled common conductive and surrounding common centrally located common conductive path 800 / 800-IM.
, 800 / 800-IM and 810B are almost always similar to the external common conductive elements or external common conductive energy paths or extensions of region 6803, as shown in FIG. A plurality of common shield electrode paths 810F,
The 800 / 800-IM and 810B are often inserted by a number of them in a parallel stack, with 865BB and 865BT also provided externally to sandwich the inner 855BT and inner 855BB of the differential electrode conductor. It is sandwiched, and at the same time, the common shield electrode paths 810F, 800 / 800-I
Further maintaining the condition that M and 810B have a minimum separation 814C or "loop region" with respect to the differentially paired and electrically opposed differential electrodes 855BB, 865BB and 855BT, 865BT in the dielectric material 801. .

External conductive elements, such as the 798-GNDA shown in FIG. 3, are especially capable of electrostatic shielding functions (not shown) performed by common shield electrode paths 810F, 800 / 800-IM and 810B. To help. These conductive path portions within 9905 are
This is due to being connected externally by conductive connection extensions 812A and 812B structures attached to conductive connection means 890B and 891B for a circuit group including paired differential electrodes 855BB, 855BT, 865BB and 865BT. The structure also facilitates an external common conductive energy path or region 6803 to assist the interconnected common shield electrodes in embodiment 9905, and assembly 990.
5s "differential electrode conductors 855BB, 865BB and 855BT and 865B
Facilitates a combination of biased connections as described above that allows for effective and simultaneous regulation on or along said portion of the energy path of T. Combined and interconnected common shield electrodes 810F, 800 / 800-IM and 81
The 0B inner and outer parallel placement groups also represent the AOCs respectively used by the energy portion as the energy propagates along these disclosed conductive paths to the active assembly load (not shown). Through or through the portion of the circuit group that includes the paired differential electrode interior 855BB and the inner 855BT and the portion of the circuit group that includes the paired differential electrode outer 865BT and the outer 865BT. Helps to nullify or suppress unwanted parasitic and electromagnetic emissions that can go away.

This universal shield electrode structure also increases the availability of a portion of the propagating circuit energy (not shown), and the same type of physical shield electrode structure 9905 of FIG. To allow the development of a common low impedance energy path (not shown) and a reference diagram (not shown) that is not that of a differential path.

In some cases and when working simultaneously at the same time, often a fraction of the propagating circuit energy will, at a given moment, be the energy contained in the AOC portion with respect to the exact same third energy path and reference diagram. Has a high-impedance energy blocking function for some other opposing and shielded isolated parts of the propagation of, while at the same time at the same instant, this high-low impedance The switching phenomenon also occurs in exactly opposite directions, complementary to the energy propagating in relation to the portions of energy located opposite each other, but with the same shared larger universal shield electrode. It occurs in electrical harmony along the opposite side of the structure.

For example, this would include a plurality of generally flat layers shown as portions of embodiment 9905 as shown in FIGS. These generally flat layers shown in FIG. 3 include, for example, a ceramic dielectric material 801, and a conductive electrode material 79 during fabrication.
9G is applied or deposited. The main electrode surface of the common shield electrode layer (which cannot be counted due to the large number) is the main dielectric material 8 of the stack 9905 of the embodiment.
01 surface (both not shown in FIG. 3).

As shown in FIG. 3, in order to allow the best cancellation of magnetic field coupling between various opposing differential energy paths in a universal Faraday Shield architecture using stacked conductive hierarchical progression, pairing is generally performed. And only a minimum distance from one another generally requires separation of the operationally opposed differential conductors. There are some exceptions to these. However, by operating generally opposite or out of phase, the energy path 855BB along 855BT and 865BT
And 865BB, the mutual coupling of opposed pairs of electrodes promotes mutual cancellation of their respective opposing magnetic fields, while at the same time varying the same pair of oppositely disposed energy paths within one inventive embodiment AOC. Cooperate at the same time in using the electrostatic or Faraday shielding effect that also occurs for the portion of energy propagating along the circuit portion.

By just positioning the two differential conductive paths with the deposited or applied dielectric media material approximately equidistant, as just shown, the resulting structure of the present invention embodiment just showed. It should also be noted that it provides advantageous energy regulation to the portion of the circuit energy located along the differential conductive paths in such an AOC. The paired and opposite differential conductive paths as just shown are also 855
At some point electrically complementary, regardless of the generalized direction of the portions of energy present along each of the paired differential energy paths 855BB and 865BB propagating along BT and 865BT, respectively. At the same time maintain a biased relationship that is electrically opposite of each other.

Such an arrangement shown in FIG. 3 including, for example, 855BB and 865BB results in one of two differential energy paths each with 855BT and 865BT, respectively, where 855BT and 865BT serve as an energy source. 8
The remaining differential energy paths 855BB and 865BB, respectively, are also electrically provided between the central conductive shield element of the 00-IM and the energy-utilizing load separated by the others, respectively. The energy that recombines to that energy source originator that initiated some form of energy or some other form of energy propagating with a given circuit, considered to come from the source of energy propagation that began at the energized first time. It is believed to be electrically provided as an energy path positioned between utilization loads. That is, for example, 2
One of the two adjacent but shielded and separated differential energy paths or differential electrodes 855B and 865BB are present with one another energized in an active relationship with each other. However, the actual physical separation that is maintained both physically and electrically between the shielded architectures, so long as each handles the propagation of circuit energy fractions with respect to the other, is greater than approximately 50 mms to 0 mms. It is in the range of numbers.

The conductive connections of a plurality of common shield electrode paths each having a coupled common conductive and surrounding common common-positioned common conductive path 800 “X” -IM are, for example, In most cases, as shown in FIG. 3, the external common conducting element 68 is
03, often sandwiched by itself, but separated from the extension of the external common conductive energy path or region 6803 shown in FIG. With respect to the phased differential electrodes, the common conductive elements will have a separation distance or "loop area" of .mu.m because they are inserted in parallel stacks.

Accordingly, the external common conductive energy path or region 680 shown in FIG.
3 electrical or conductive extensions, in particular energy shielded electrode assembly 90
When propagating on or along said portion of the 0A 'outer differential conductors 865BB and 865BT, an energized combination such as described above is often effective and simultaneous adjustment. It is possible to help enhance and create an electrostatic shield function. The groups of parallel arrangements inside and outside of the combined common conductor 900A also often produce energy as they propagate along conductive paths (not shown) to active loads not shown in FIG. Eliminates or suppresses unwanted parasitic and electromagnetic emissions that may leak or enter the portions of the differential conductors 855BT and 855BB used by the portion of the.

Therefore, the only significant difference between embodiments of the invention that are similarly constructed or manufactured by standard means, are used with the conditions of a standard single paired line circuit, and are identically constructed. Almost all embodiments having a dielectric difference as a variant and variants of the embodiment of the invention have not heretofore been required in most cases in view of the reaction of the respectively known prior art dielectric materials. And provides a measure of insertion loss performance in a manner that is not obvious. This comparison of similar type invention units (
(Other than the dielectric material) clearly and clearly show the main cause or factor that produces this result, and within this embodiment, the circuit performance is a balance of elements, and the common conductive shielding structure and electrostatic suppression The greater the conductive attachment of the external common conductive elements that work together to be used, the more various embodiments of the invention will be incorporated into the physical shield to affect the regulation of energy propagating within the circuit system. Users of various embodiments of the present invention have made all common conductive energy paths conductively to the same conductive energy path provided externally to each other and / or usually from a pair of differential paths. Almost any industry standard means of attachment and / or conductive material or construction may be used to make the connections.

An important characteristic of a perfectly balanced mounting of all common conducting electrodes present on or accessible to the mounting of the external conductive energy path is the decoupling of power and signals, filtering. , Such as voltage balancing using a method of electrically positioning with respect to the opposite side of a reference "0" voltage generated on the opposite side of one centrally provided common and shared conducting electrode path, and It has been shown in previous disclosures to achieve the co-operating function of performing an explicit energy conditioning function as shown in the previous disclosures, and the principles as disclosed in those patent documents are embodiments of the present invention. Make progress.

Mounting of the present invention on the same common conductive region or path outside of all commonly and conductively mounted common electrode elements will often result in the energy propagating to the AOC being electrically coupled to the power source and load. In addition to acting in parallel with each other, they are not only positioned relative to each other when connected to a separate return path, unique ground, chassis ground or a low impedance path that is not a differential conductive path, but almost all of the main It also allows the circuit to operate electrically in parallel with other common conducting structures.
When the USS is placed or attached to the energized circuit as described, the common conductive energy path parallel to the internal and external differential energy paths as disclosed will most likely thereby again be the second in the AOC. It raises and lowers the impedance of the three conductive / synergistic conductive paths, allowing the propagated energy-return path to become a utilized part of the energy originating from the source.

It should be noted that once the present invention is placed in the common conductive region, both the external and internal differential electrode energy paths are typically balanced. The addition of an externally located common conductive path disturbs the balance of the conductive energy path and shifts the self-resonance point to a similar type of inventive test. As shown in FIGS. 2 and 3, additionally provided with a unique central shared image “0” voltage reference plane attached (
The common conduction energy path denoted by # -IM) often increases the shielding effectiveness of one inventive embodiment in many respects. These are additional externally provided common conduction energy paths, and their close proximity to adjacent internal paths is greater than adding capacitance to the USS embodiment. For the purpose. These additionally provided common conductive energy paths are provided prior to the final application of at least one set of external differential electrode pairs.

Therefore, the present invention is approximately 180 °, ie, due to the complementary stresses applied to the material that simultaneously oppose or dephase with the other side of the inserted common electrode energy path. In this embodiment, the hysteresis effect is significantly reduced to almost zero. As disclosed, these stress handling techniques are, in any case, very difficult to reproduce with respect to prior art components. This is especially true of prior art components configured for feedthrough propagation modes and applications. The 79S "X" used to designate the conductive electrode extension is an internally mounted differential coming from an external conductive connection structure (not fully shown) mounted by standard industrial means and methods. Allow a portion of the propagating energy to flow along the conductive electrode.

Embodiments of the novel invention, such as 9210 as shown in FIGS. 7A and 7B, can consist of straight feedthrough versions of split electrodes 7300C and 7300D, which are conductive electrodes. With respect to each other, each set of split differential electrode surfaces of material 799 appears to be a single one contained in a completed 9210, which is typically the same volume or a little smaller than the prior art structure. Provided or closely spaced.

However, in this novel inventive arrangement, such as 9210 in FIG. 7A, a homogeneous electrode group, a single (differential electrode only or simply common electrode only) or both groups (differential electrode and common electrode). This small but important split differential electrode configuration for any of the above allows for more energy carrying or energy propagation capability with each set of split differential electrode surfaces of conductive electrode material 799, and more By allowing a large number of circuit conductive connections, it is possible to reduce the number of stacks that may be required for a single common or differential electrode by reducing the area used, while providing a clearer number. Energy found in prior art devices of the same size, including the same size split differential feedthrough conductive differential electrode or common shield electrode. Simultaneously handles the additional energy regulation requirements of multiple common electrode energy pathways, where energy handling capacity is more effective and greater than rugged handling capacity.

Prior art devices utilizing these closely positioned split electrode pairs 7300C and 7300D as shown in FIG. 5 for energy conditioning are:
Not as effective or energetically effective as the new invention.

For example, when constructing split differential electrodes, they were similarly layered and aligned simply because they did not combine different groups of electrodes or incorporated them into a split or predetermined positioning architecture. Devices or embodiments are available that utilize a lower number of split layers over the prior art stacked electrodes.

For example, in a design that mounts three differential path circuits, the prior art device doubles the number of electrodes that carry current to increase its energy handling capability. The invention is capable of handling more energy than the prior art because both the split and non-split common differential conducting electrode energy carrying paths are in a predetermined alignment.

Accordingly, the split differential electrodes 7300C and 7300D are both provided at a position in between so as to be shared by at least one larger third common conductive shield electrode or both 7300C and 7300D for energy adjustment. 7300C and 7300D, defined as at least two single equal-sized energy paths separated by a separate internal energy path, have the same basic function of the circuit in embodiment 9210 as the non-split path uses. Use voltage reference. Split differential electrodes 7300C and 7300D are further
Electrically opposed and paired as each set of electrode material 799 and planar areas provided for parts of many variations of energy conditioning embodiments that utilize a common voltage reference as the reference function of the circuit. , Same size conductive electrode main area 797
It contains a set of "x" s. This is universal in the present invention having a split electrode configuration. These two same sized conductive material or electrode energy path regions 7300C and 7300D are all together each substantially parallel and each thin conductive electrode element 797SF1 separated between itself by a thin layer of dielectric casing material 801. -A, 797SF1-B and 797SF
2-A, 797SF2-B, a common shield electrode 810F-1 and 2, 800/800, which includes a group of four separate but closely spaced pairs of two units.
-IM-1 and 2, even smaller than 810-1 and 2.

Referring to FIG. 7A, such a common shield electrode structural element for these shield electrodes need not have twice the overall electrode area to use this configuration in all cases, Each common shield electrode energy path also does not have to consist of corresponding closely spaced pairs of thin common shield electrode energy path elements, but includes a larger universal common conducting shield electrode structure architecture with stacked hierarchical progression. Note that the shield electrode structural element does not handle the energy function of the main input or output energy propagation paths as in the prior art. Instead, the common shield electrode structural element is often utilized within one invention embodiment 9210 as a third additional energy propagation path that is not that of an external differential energy path (not shown).

Referring now to FIG. 7B, the stacked structure of 9210 shown in FIG. 7A is now shown as a completed energy conditioning component. 798- "X", six outer conductive connection electrodes and each outer conductive connection structure or electrode, each specifically shown, surrounds the 9210 body. This energy conditioning component 9210 is for common conductive connection of all internally located GNDG shield electrodes to an external common conductive energy path (not shown) that is not of an external differential energy path or circuit (not shown). , And two external common conductive connection electrodes 798-GNDA and 798-GNDB. Four crossed feedthrough external conductive connection electrodes 798FA, 79 for conductive connection external differential conductive circuit paths (not shown).
8FD, 798FC and 798FB, including two external common conductive connection electrodes 798-GNDA and 798-GNDB for conductive connection to a third external differential conductive circuit path (not shown).

To further improve and simplify the elements referred to in this disclosure, the invention shown in FIG. 7A enables the low voltage energy regulation function utilized in a given energized circuit to work. However, it discloses the high and low voltage handling capability of a single circuit provided within the same energy regulation function embodiment to enable working simultaneously for circuits using the high voltage energy path, The adjustment functions within the exact same multi-layer invention are disclosed herein, if desired.

Thus, some of the entire other embodiments (not shown) of FIG. 7A are often paired (relative to a common shield path electrode), eg, as shown in FIG. A balanced shielded electrode architecture that incorporates electrodes, but conductive and electrically opposed electrodes of the same size, paired linear differential feedthrough and paired differential feedthrough configurations It is suitable for simultaneous electrical circuit systems, including both low voltage and high voltage circuit applications, which provide excellent reliability by utilizing.

For example, the inserted differential and common energy path electrodes 797F1B and 810.
B-1 and 810B-2, and 792F2A and 810B-1 and 8
The dielectric distance 814C seen with 10B-2 is substantially greater than or equal to the separation distance of 814-B, but between the pair of split conductive electrode elements 797F4A, 797F4B and 797F3A, 797F3B, 797F1A, 797F1B and 797
The spacing 814B between F2A and 797F2B is typically less than 1.0 mil but greater than or equal to 0 mils, depending on manufacturing tolerances currently existing, and the energy handling properties of electrode materials are often Allows the desired effect.

The paired and split conducting electrode paths are essentially similar in size to the conducting regions, but are preferably the same size with respect to their split couplings, and thus 797F4A, respectively. 797F4B and 797F1
The pair of plates designated A, 797F1B are 797F3A, 797, respectively.
Note that F3B and 797F2A, 797F2B are merely mirror images of the opposite conductive electrode material. However, it is a pair of electrically opposed differential electrodes 79.
Each of 7F3A, 797F3B and 797F2A, 797F2B is generally considered to be a mirror image, with respect to its position in embodiment 9210, respectively, in most cases 797F4A, 797F4B and 797F1A, 797F1B.

The fabrication sequence of the actual embodiment 9210 for making these particular energy conducting path structures is now outlined and described in a separate variation of FIG. 7A. First, a dielectric material 801 is deposited or placed, then a differential conductive path 797F2.
The electrode material 799G is positioned and laminated to enable the formation of B,
The dielectric material 801 is subsequently made after the very thin layers 814B are spaced apart, and then the electrode material 799 is laminated to form the differential conductive paths 797F2A, followed by the dielectric material 801. Is applied to 814C, and then electrode material 799G is provided in a stack to form common conductive shield electrode paths 810B-1 and 810B-2, followed by dielectric material 801 stacked on 814C to provide differential conductivity. Route 7
Electrode material 799 is laminated to form 97F1B, and then a very thin layer 814B separated by a distance of dielectric material 801 is used, followed by a differential conductive path 79.
Electrode material 799 is further laminated to form 7F1A and then dielectric material 80
1 layer 814C, followed by also shared common conductive shield electrode path 800 /
Electrode material 799G is overlaid to form 800-IM-1 and 2, providing the equilibrium point of the central shield electrode structure and the central common path point of the universal conductive cage-like structure for embodiment 9210, followed by the dielectric. A layer 814C of material 801 is overlaid, then a layer of electrode material 799 is overlaid so that differential cross feedthrough electrode paths 797F3B can be formed, followed by deposition of dielectric material 801 814B, then differential cross feedthrough. Layers of electrode material 799 are overlaid so that electrode path 797F3A can be formed, followed by deposition of dielectric material 801 at 814C, then common conductive shield electrode path 810F-
Electrode material 799G is overlaid to form 1 and 2 followed by dielectric material 801.
814C overlaid with a layer of electrode material 799 to form differential cross feedthrough electrode path 797F4B, followed by deposition of dielectric material 801 with 814B, and then differential cross feedthrough electrode path 797F4A. A layer of electrode material 799 to form a layer of dielectric material 801 and finally a layer 814 of dielectric material 801 to include some of the major underlying stacking structures to support 9210 physical stacking composition elements. To do.

The configuration of split electrodes 7300C and 7300D can approximately double the current carrying capacity compared to a pair of energy path groups, but this differential electrode characteristic is also often cross-type. 9 with the differential conductive electrodes of FIG.
Nearly all the partial pressure features of embodiments of the present invention, such as 210, are relatively small for various electrode material elements 799, including various electrode material elements 799 of the embodiments of the invention, while further reducing size. The circuit's voltage divider architecture of the embodiments of the invention can be further utilized to increase the overall current handling capability of the embodiments of the present invention while still maintaining a regulated environment of stress energy.

Therefore, the new invention also often utilizes a balanced shield electrode architecture that incorporates paired and smaller differential path electrodes (relative to the common shield path electrode). It is suitable for simultaneous electrical systems, including both low voltage and high voltage circuit applications that provide excellent reliability. Furthermore, embodiments of the invention can also be combined with and are suitable for electrical systems including various low current and high current circuit applications. Various and / or both of the same size and paired differential bypasses combined and paired differential feedthrough energy paths configured for electrically opposed paired operation. It is also noted that homogeneous combinations can be stacked vertically or horizontally, or in combination with actuated circuit paths compatible with both vertical and horizontal combined using various energy transfer modes as described above. I want to.

Therefore, as the only significant variation between similarly configured or manufactured by standard means, and used with standard paired line circuit conditions, and similarly configured embodiments of the invention. Almost all embodiments having a dielectric difference and variations of the embodiments of the invention have in most cases been heretofore unnecessary and obvious in view of the reaction of each known prior art dielectric material. It provides a performance measurement of insertion loss in a way that never existed.

This comparison of similar types of inventive units (other than dielectric materials) clearly and clearly shows the major causes or factors that give rise to this result: the performance of the circuit depends on parasitic suppression, physical shielding. Thus, there is a novel common conductive shield structure and outer conductive mounting elements that work together with electrostatic suppression to affect the regulation of energy propagated within the circuit system in which the present invention is incorporated. Thus, individual, non-individual embodiments using common conductive shielding structures and external conductive mounting elements as disclosed and using dielectrics primarily classified for certain electrical conditioning functions or results are often The use of the elements of embodiments of the invention with equivalents to the elements that achieve the unexpected and advantageous properties often added to the knowledge of the previously limited use of dielectric materials used. You will notice. This uses non-discrete capacitive or inductive structures, such as manufactured individual silicon molds, or non-discrete capacitive or inductive structures that can incorporate variations of one inventive embodiment in supercapacitor applications or even atomic level energy conditioning structures. Includes all stacking applications.

Returning to FIG. 7A, the spacing of the dielectric material 801 or 806 A, 806, 814,
A separation distance equal to (not fully shown) that shown at 814A, 814B, 814C and 814D (not fully shown) is often device related. Looking at the cross-sectional view shown in FIG. 7A, another significant vertical and horizontal distance spacing relationship (not fully shown) is shown in which a predetermined electrode and conductive path stacking arrangement (not fully shown). It will be understood that

It has been noted that, for example, almost all separations of elements within device 9210 are related to the various electrode path structures included in the device and are absolutely necessary for many circuit energy conditioning applications. However, to maintain control of balance within the circuitry of a particular system, the distance relationship of these materials must be uniform in the spacing considerations and distributions of the embodiments. Large differences or inconsistencies with the size and distance of these paired materials have been experimented and are detrimental to circuit balance for most common electrical applications of the invention.

For example, in FIG. 7A, various separation distances 814 “X” are as measured between a predetermined three-dimensional distance associated with the application, or common shield electrode energy path, and containers 800D and 800E, respectively. It requires areas of spacing or separation filled with material 801, and otherwise various differential electrodes, splits, and the like.

Spacing 814 A (not shown) is generally very small of the proximity of spacing found between multiple adjacent common electrode material paths, such as a three-dimensional separation or common electrode paths, in parallel proximity. 800/80, which is the area to be covered and which shields the image of the common electrode path
The 0-IM- contains, for example, a thin dielectric material 801 or the equivalent of a spacing (not fully shown) or other type of spacer (not shown).

The separation distance 814C is the vertical separation found between multiple common electrode paths, such as common electrode paths, and differential electrode paths, such as multiple differential electrode paths. Distance 814
B is a split differential conductive path 797F1-A and 797F1-B and 797F.
2-A and vertical separation between multiple split differential conductive paths such as 797F2-B.

Such a unique combination of dynamic and static forces (not shown) uses this structure as a path from the differential path to the third energy path within the containment of the shield electrode structure. Because of this happens at the same time. Therefore, by utilizing and combining various rules for the distance of physical elements and the spacing of energy fields between conductive energy paths, in the energized circuit paths found in dielectric materials, non-conductive materials and other energy conditioning capabilities. The dynamic energy relationships that occur in are provided.

Internally, unstable circuits in prior art energy regulators that do not operate in opposite differential environments often have different coefficients, such as thermal expansion, respectively.
Inhomogeneous expansion due to a variety of materials, which typically have a wide range of hysteresis effects, material memory effects, angular stresses, thermal stresses, and, in contrast, mutually complementary complementary occurrences that occur within embodiments of the invention. From the point of occurrence in the energy propagation, it is all reduced in terms of the effective voltage dividing capability of the circuit.

FIGS. 4 to 5 now show various different configurations of the dielectric / electrode layer pairs or only the electrode layers. 4 and 5, each of these pairs of electrodes or electrode layers is shown with at least two portions of differential electrode path material and dielectric material 801 (not shown).

Some of these structural differences are best illustrated in FIG. 4, which shows different feedthrough differential electrode paths 799F1A, 799F2A and 799F1B, 7.
FIG. 7B shows a top view of two parallel 7200A and 7200B tops of 99F2B. This configuration, shown generally at 7200A and 7200B, is generally cross-feedthrough differential electrode path 799F1A in that the energy propagating in each path must “cross” the energy propagating in the other path. ,
799F2A and 799F1B, 799F2B, all of which are within the 813AOC (not shown) of the present invention, but these electrically opposed cross feedthrough differential electrode paths 799F1A, 799F2A and 799F1B, 799F2B.
A common shield electrode path of a third energy path (not shown) that is not of interest is inserted during this operation so that the entire invention (not shown) can adjust the energy by this positioning and energy flowing effect. Provide and make available.

Relative Spacing Dimension 814— “X
(FIG. 7A) and the sharp twist of energy propagation (not shown) is 813 AO
The individual twisting effects that occur in opposing or co-propagating propagation have a clear effect on the reduction and minimization of the impedance of the circuit portion in C (FIG. 7A), and the paired interaction causes a linear feedthrough pair. Crossed feedthrough differential electrode paths (not shown) 799F to enhance as to the cancellation effect as compared to the propagation method.
A uniform impedance is obtained due to the concentrated effect of the mutual effects of the energy propagating along the 1A, 799F2A and 799F1B, 799F2B pairs. The combination of twisted or crossed electrically opposing differential electrode paths is
Crossed feedthrough differential electrode paths 799F1A, 799F2A and 799F1
B, 799F2B, utilizing a very short distance of conductive electrode separation effect (as defined by industrial possibilities) (not shown) for electrically opposed electrode conductors, this novel invention Almost all of the variations of the embodiment of the present invention allow this advantageous electrical regulation effect to be fully utilized for each circuit (not shown) utilizing this technique.

The two side-by-side stacked configurations, shown uniformly at 7300A and 7300B, are referred to as generally electrically opposed linear feedthrough differential electrode paths, and are referred to herein as 799SF1A, 799SF2A (FIG. Not shown, but under 799SF1A) and 799SF2B, 799SF1B (not shown, 799S
(Underneath F2B), and the electrically opposed linear feedthrough differential electrode paths herein are respectively 79
SF1A, 79SF2A and 79SF2B, 79SF1B Introduced alongside the conductive electrode extension pair and for the portion of the energy applied by them /
Each has its own exit point. Each differential electrode path 799SF1A, 799SF2A
And 799SF1B, 799SF2B, the energy propagating in the opposite direction through the differential electrode paths 799SF1A, 799SF2A and 799SF1B, 799SF2B has a variety of simultaneous energy adjustment effects on the portion of energy propagating in the AOC. 7 of the larger areas to offer
Enter 99SF1A, 799SF2A and 799SF1B, 799SF2B.

Heretofore, passive components, including stacked architectures, have been manufactured by forming a dielectric material in a relatively thin sheet. In the state where it is relatively flexible or "green" before firing, the dielectric sheet is an electrode, or a thin conductive area selected by stencil printing with cemented carbide or conductive metal or metal deposition. It is defined by the electrode. Multiple sheets of these dielectric bases with conducting electrodes thereon are laminated on a layer, which is then baked to give a given dielectric spacing and a given desired differential and common conducting electrodes for the completed conductive electrodes. The differential and common conductive electrodes are embedded in a stacked order to form a rigid, compact, substantially monolithic casing structure. In feedthrough operation, where the current passes through a common plate electrode, the inherent electrical resistance provided by the thin electrode plate results in
At least some power loss is produced as heat, which is believed to be minimal in a bypass configuration such as with the present invention having a common conductive plate that shorts to an outer conductive area or other type of attachment. The power dissipation of this electrode plate, and thus the size of heating of the plate in operations like feedthrough, is a function of electrical energy. If the plate energy is effectively high for a relatively short period of time, sufficient plate heating will occur and will be partially concentrated, especially by the collapse of the thin electrode plate and / or its connection to the conductive termination component. Electrode / plate failure will occur. Prior art filter capacitors used in pacemaker and defibrillator applications typically encounter relatively high pulsed inrush currents, making them prone to overheating and associated failure, a good example of this problem. It is easy to become. One way to solve this problem is to increase the thickness of the electrode plate layers within the stacked structure of the multi-layer electronic circuit conditioning assembly. However, increasing the layer thickness is not desirable or it is practical to use existing electrode plating and silk screen printing techniques. Significantly thicker electrode layers or plates will cause delamination and associated reliability issues. In this regard, it is important that the grain growth of the selected dielectric be penetrated into the uneven monolithic structure and the complete structure be incorporated into the monolithic structure so that the electrode plate has a thin, discontinuous structure. Another method is to increase the total surface area of the conductive electrode plate, but this idea requires significantly larger volumes of the physical size of the structure, which is not suitable for many circuit applications.

One method of making a bypass or feedthrough device for embodiments similar to laminated industrial size units is the same as the conventional method of making laminated ceramic capacitors. This method is well known to those skilled in the art and will only be described briefly. The dielectric component is formed by casting a thin film of a slurry of finely divided dielectric-forming material such as a substrate barium titanate suspended in a liquid containing a binder. This "green" ceramic is screen printed with the desired forming pattern using electrode forming ink. Typically the ink comprises a metal such as palladium. The patterned green ceramics are superposed to provide the desired number of layers, and the patterns of adjacent layers are combined to achieve the desired stacking. The individual units are cut from the superposed layers in such a way as to expose the base at the opposite end of the first baked part. The cut units are then burnt out of the binder at a first temperature and then sintered at a higher temperature to define a monolithic structure. A termination is applied to the base at one end and the base at the other end. The terminations can be formed using any number of known vapor deposition or other methods to provide electrical and mechanical coupling to the exposed electrode base at the opposite end of the monolithic structure, which can then be soldered to the motherboard. One or more metal layers may be applied to the sputter layer. This termination may extend beyond the edge where surface mounting is desired.

An alternative termination method involves applying carbon and then applying an outer silver layer with or without a metal layer between the carbon and silver. The layers of material elements are also compatible with available and future processing techniques. The present invention is
The prior art has been improved by providing improved circuit conditioning features in the embedded electrode layer / plate pattern that can handle very high RF propagation portions without the need to significantly increase volume in certain applications. Solving the problems and disadvantages that are seen.

Ideally, the energy will lead or influence the said common elements in parallel, so that the common conductive electrode layers are provided with a plurality of mutual connections of the same external conductive area or external common conductive path. They share points or conductive paths. The biased invention made up of stacked elements generally has multiple complementary kinetic energy paths of varying intensity or degree, and these complementary kinetic energy paths are directed toward the simultaneous energy transfer directions. It is considered to be three-dimensional and multi-directional.

In general, energy transfer via the present invention is different with respect to the energy transfer path or energy transfer path for a single stacked element of the present invention, but both types of transfer or effect are: Complementary, dynamic and simultaneous generation via parallel and non-parallel energy transfer paths. Since these parallel and non-parallel transfer motions of these energies occur simultaneously in the present invention, these motions affect circuit function and effectiveness. These movements are always dynamic and at the same time affect some or all of the stacking elements.

For example used as a capacitive energy regulator and provided for differential applications and mounted in a circuit with a common electrode path attached to three separate energy paths or independent common conducting paths. The current load carried by the electrode layers or stacks of each energy regulator is a function of the number of layers used in the capacitive energy regulator.

That is, doubling the number of electrodes halves the current carried by each layer in a given circuit application. Thus, by doubling the number of layers of electrodes, the power that needs to be dissipated in the form of heat by each layer is reduced by a factor of four.

Therefore, based on power dissipation alone, a capacitive energy regulator with double the number of electrode layers has the ability to handle very large currents without thermal damage. Until now, however, doubling the number of layers in a capacitive energy regulator essentially required a corresponding increase in the size of the capacitive energy regulator, with an inevitable increase in size. Not suitable for the main operating environment.

The present invention can double the number of electrode layers in a capacitive energy regulator to effectively provide significantly improved current handling capability, but at high voltages where the required dielectric spacing is relatively thick. In application, the physical size of the capacitive energy conditioner using split layer technology only on the common conducting electrodes is reduced. This is also the case if only the physical size of the capacitive energy regulator using split layer technology is used for the differential conducting electrodes. This is also the case if the physical size of the capacitive energy regulator using split layer technology is used together for both the differential and common conducting electrodes.

Returning to FIG. 6, the electrodes 800 / 800-IM of FIG. 1 have a common closely-paired symmetrical electrode assembly or elements of the same size 800 / 800-IM-1 and 800 / 800-. Shown as a half size split pair of IM-2 electrodes and separated by a very thin film 814B of dielectric material 801, where 800 / 800-IM is a two layer element 800/800 as described above. It is incorporated into 800-IM-1 and 800 / 800-IM-2. This is, for example, 800/80
The 0-IM electrode layer or differential electrode (not shown) is subdivided into closely sized symmetrical electrodes and elements of the same size separated by a very thin spacing layer 814B of dielectric material 801. This element not only protects the capabilities of the electrode element itself, but also the inflow and outflow of energy from and into electricity from energized or energized operation, including abnormalities such as voltage pulses or surges. It is believed to be different from material 801 which relies on the properties of thin layer 814B, where it is desired to protect the entire energy conditioner in its ability and reliability to withstand. The distance between the slit and the electrode is usually greater than zero and is either designed for two non-split electrodes or is usually found between these two electrodes or is separated from each other by a material such as 801. It is in the range of 25% of the separation distance seen as the electrode spacing between two split pairs of an electrode and a group of common electrodes.

Using this configuration, each active layer element 800 / 800-IM-typically
1 and 800 / 800-IM-2 are placed in a desired and normal dielectric spacing relationship with corresponding differential electrodes (not shown).

To only increase the overall energy regulator size for a given number of common electrode layers, such as 800 / 800-IM-1 and 2 or 800 “X” -1 and 2, to increase only the size of 801, etc. Specific dielectric material or pair of dual layer elements 800/8
A minimum thickness spacing 814B of yet another dielectric material used for the bond between 00-IM-1 and 2 is required.

With reference now to the various elements shown in FIG. 5, US Pat. No. 5,978,204 discloses a layer containing a plurality of active and grounding electrode plates inserted or embedded within a dielectric casing such as ceramic. , And each active grounding plate is defined by a pair of closely spaced electrode plate elements that significantly increase the overall area of each electrode plate, whereby The current handling capacity of the prior art is correspondingly increased.

Prior to describing in detail a method for further improving and simplifying certain elements such as those mentioned in US Pat. No. 5,978,204, a novel invention embodiment such as that shown in FIG. 5 is now described. Although a portion discloses high-low voltage handling capability, this embodiment is provided as an unusual but basic shield electrode energy conditioning embodiment or structure, not shown, but as shown at 9210 in FIG. 7A. Each embodiment may include a separate energized circuit, which allows the low voltage energy conditioning function to be available on a given energized circuit, but if necessary, exactly the same stack at the same time. In the invention of the invention, circuits that utilize high voltage energy paths and regulation functions can also be made to work.

FIG. 5 shows electrically opposed differential electrode pairs 7300C and 7300D. Fully differential electrodes 7300C and 7300D, respectively, are split electrodes 79
7SF1-A and 797SF1-B and 797SF2-A and 797S
F2-B, each of which is grouped and paired, is an electrically linear feedthrough differential electrode energy path, and is electrically opposed including the portion of embodiment 9210 of FIG. 7A. 7300C which is similar in configuration to the differential electrode pair
And 7300D. Each split differential electrode of the parent 797SF2 and 797SF1 is a split differential electrode pair 797SF1-A and 797SF1-.
B and 797SF2-A and 797SF2-B, respectively, when electrically defined respectively, a single capacitor plate 7300C and 7300D, respectively.
Are provided in close proximity in an embodiment of the invention. 7 in FIG.
9-SF1 and 79-SF2 are arranged along a differential conductive electrode internally provided with a portion of the propagating energy from an external conductive connection structure (not shown) mounted by standard industrial means and methods. The electrode shape constructed and used to indicate the conducting electrode extension that causes it to flow is simply an extension.

These two pairs of plate elements 797SF1-A and 797SF1-B and 797SF2-A and 797SF2-B respectively cooperate to significantly increase the overall volume of the overall energy conditioning structure (not shown). Two electrically opposed paired differential conductive path electrodes with significantly increased overall electrode surface area, in many cases responding to a corresponding increase in the current handling capacity of the energized circuit without increase. Of the parent 7300C and 7300D electrode elements.

To further describe and define the improvements in the state of the art, embodiments of the invention (not shown) include these split differential electrode pairs 797SF1-A and 797SF.
1-B and 797SF2-A and 797SF2-B are used, the electrodes being spaced by 814 B with respect to each other,
Often, the propagating energy travels along these differential conducting paths, often as if each group of split electrodes as described were a single differential conducting electrode, but with additional Split pair 797SF1 provided in close proximity to appear in a circuit (not shown), which is feasible without the need to configure a common conductive shield electrode
-A and 797SF1-B and 797SF2-A and 797SF2-B are available. The advantages of using paired split electrodes are:
The additional area obtained by using additional electrodes is often the differential, electrically opposed energy paths 7300E and 7300 without this property.
Regarding the current carrying capacity of one non-split paired group of E (not shown), these two electrically opposed differential conductive paths 797SF1-A and 797.
Increases the current handling capability of the SF1-B and 797SF2-A and 797SF2-B electrode elements.

The split electrode 7300C and 7300D configuration can approximately double the current carrying capacity compared to one single pair of energy path groups, but this differential electrode characteristic is often the case. 7A, the cross-type differential conductivity shown in FIG. 7A while still maintaining a relatively low stress energy conditioning environment for various electrode material elements 799, including various electrode material elements 799 of embodiments of the invention. The voltage dividing function of almost all embodiments of the present invention, such as the 9210 with electrodes, increases the overall current handling capability of the embodiments of the present invention itself while increasing the same size reduction. Enables further utilization of the circuit voltage divider architecture of the embodiments.

Returning to FIG. 7A, dielectric material 801 spacing and 806A, 806, 814, 8
Separation distances corresponding to this spacing (not fully shown) shown at 14A, 814B, 814C and 814D (not fully shown) are often device related. Looking at the cross-sectional view shown in FIG. 7A, another significant vertical distance and vertical distance spacing relationship (not fully shown) is shown in a stacked configuration of certain electrodes and conductive pathways (not fully shown). Note that (not shown).

It has been noted that, for example, almost all separations of elements within device 9210 are related to the various electrode path structures included in the device and are absolutely necessary for many energy conditioning applications. However, in order to maintain control of balance within the circuitry of a particular system, the distance relationships of these materials must be uniform in the spacing considerations and distributions of the embodiments. Large differences or inconsistencies with the size and distance of these paired materials have been experimented and are detrimental to circuit balance for most common electrical applications of the invention. The utility and versatility of a shield structure with split electrodes can be imagined, for example, with reference to FIG. In FIG. 2, the separation distance 814 used in FIG. 3 has a predetermined need related to the application, and the spacing or distance as measured with the common shield electrode energy path containers 800C, 800D, 800E, 800F, respectively. It can be used in three-dimensional distances or regions of separation. FIG. 2 also includes common shields 810B-1 and 2 and 820B-1 and 2 and is a differential conductive path 797S as shown in FIG. 7A.
Including a single or group of split differential electrodes such as 800F including F2,
A conductive electrode material surface or, in one embodiment, a region defined in such a biased state, or a differential bypass electrode path as in FIG. 3 with common shields 810B-1 and 2 and 820B-1 and 2 800F-1 and 2 including 865BT
Such as 810F-1 and 2 and 820F-1 and 2 that would also affect the movement of parts of the energy transfer found in defined regions, but which would abut along the "surface" of these structures? Or including adjacent regions, and in another example (not shown), will affect the movement of portions of the energy transfer seen in the conductive electrode material surface or in the region defined in such a biased state. Of these structures
Includes areas that abut or adjoin along the "surface".

The separation distance 814 A (not shown) is a three-dimensional separation distance or common electrode path 82.
0B-, etc. is a region of parallel adjacencies that is generally very small in the proximity of the spacing seen between adjacent common electrode material paths, such as common electrode path image shielding 85.
The OB / 850B-IM- includes, for example, a thin dielectric material 801 or the equivalent of a spacing (not fully shown) or other type of spacer (not shown).

Separation distance 814C is the vertical separation found between common electrode paths such as common electrode path 820B- and differential electrode paths such as differential electrode path 865BT. The separation distance 814B is equal to the split differential conductive paths 797SF1A-A and 797SF1-B.
Such as the vertical separation between split differential conductive paths.

Such a unique combination of dynamic and static forces (not shown) uses this structure as a path from the differential path to the third energy path within the containment of the shield electrode structure. Because of this happens at the same time. Therefore, by utilizing and combining various rules for the distance of physical elements and the spacing of energy fields between conductive energy paths, in the energized circuit paths found in dielectric materials, non-conductive materials and other energy conditioning capabilities. The dynamic energy relationships that occur in are provided.

Internally, unstable circuits in prior art energy regulators that do not operate in opposite differential environments often have different expansion temperature coefficients, etc.
Expansions due to a variety of materials, which usually have a wide range of hysteresis effects, material memory effects, angular stresses, thermal stresses, and, in contrast, occur during opposing energy propagation that occurs within embodiments of the invention. From the point, all are reduced in terms of the effective voltage division capability of the circuit.

Therefore, due to the complementary stresses applied to the material so that it is approximately 180 °, that is, at the same time as the other side of the inserted common electrode energy path, the hysteresis effect is approximately in the embodiment of the invention. It is significantly reduced to 0. These stress handling techniques as disclosed are in any case very difficult to reproduce with respect to the prior art components. This is especially true of prior art components configured for feedthrough propagation modes and applications. The 79S "X" used to designate the conductive electrode extension is an internally mounted differential coming from an external conductive connection structure (not fully shown) mounted by standard industrial means and methods. Allow a portion of the propagating energy to flow along the conductive electrode.

Embodiments of the novel invention, such as 9210 shown in FIGS. 7A and 7B, may include straight feedthrough versions of split electrodes 7300C and 7300D, which split electrode comprises conductive electrode material 799. Each of the split differential electrode surfaces are typically provided in relation to each other so that they appear as a single one contained in a completed 9210 of the same or slightly smaller volume than prior art structures. Or closely spaced, but more effective and large than the capabilities found in prior art devices of the same size that include a more defined number of split differential feedthrough conductive differential electrodes of the same size. Has energy processing capability.

This difference is that the new invention utilizes less stacking, smaller area, and energy regulation of multiple energy paths of this smaller but important configuration in a configuration of this new invention, such as 9210 in FIG. 7A. It enables more circuit conductive connections while simultaneously handling demands, allowing more energy carrying and energy carrying capabilities.

Due to the electrode positioning architecture, these closely spaced split electrodes 73 for energy conditioning in prior art stacks as well as layers.
Prior art devices utilizing the 00C and 7300D pairs would not be as effective as the inventive device utilizing less than about one-third of the total electrode split stack. However, while the prior art device would effectively double the number of current carrying electrodes increasing its energy regulation capability, both split and non-split common conducting electrode energy propagation paths and differential conducting electrode energies. Due to the predetermined alignment of the propagation paths, this new invention with less than about 25-30% of the same number of split electrode paths can handle more energy than the prior art.

Thus, 7300C and 7300D are defined together as at least two single, equal-sized energy paths separated by at least a larger third common conductive shield electrode energy path, which path of embodiment 9210. 7300C and 730 for energy regulation and voltage reference of circuit reference function
It is provided at a position where it is inserted so as to be shared by both 0D.

Split differential electrodes 7300C and 7300D are electrically opposed and paired similarly sized for many parts of energy conditioning embodiments that utilize a common reference voltage for circuit reference function. Of conductive material regions are included.
These two same-sized conductive material or electrode energy path regions 7300C and 7300D are all both substantially parallel, respectively, and are thin conductive electrode elements 79 separated between themselves by a thin layer of dielectric casing material 801.
9SF1-A, 797SF1-B and 797SF2-A, 797SF2-B4
Common shield electrode 810F including two distinct but closely spaced groups of pairs
-1 and 2, 800 / 800-IM-1 and 2, 810B-1 and 2, even smaller. (Refer to FIG. 7A, symbols 797SF1-A, 797SF1-B
And 797SF2-A, 797SF2-B for 797F1-A, 797F1-B
And 797F2-A and 797F2-B respectively)

Referring to FIG. 7A, such common shield electrode structural elements for these shield electrodes do not need to have an overall double electrode area to use this configuration, so each common shield electrode The energy path also need not include corresponding closely spaced pairs of thin common shield electrode energy path elements, but a common shield electrode structure element that includes a larger universal common conductive shield electrode structure architecture with stacked hierarchical progression. Note that some mounting configurations do not handle the energy of the primary input or output energy propagation path function. Moreover, the common shield electrode structural element is often utilized within one invention embodiment 9210 as a third additional energy propagation path that is not that of an external differential energy path (not shown).

Referring to FIG. 8, a balanced and relatively symmetrical pair of electrodes used in conjunction with a variation of the concept of balanced and paired equal sized electrically opposed differential conductive paths. Embodiment 9915 is shown, which is a new concept of an element.

Pair-balanced, relatively symmetric elements are utilized for larger interposing common and differential conduction paths, and are different from the previously described complementary complementary same size principles. It will be related to the continuous improvement to the new family of multifunctional energy regulators and to another variant concept of this new family of individual multifunctional energy regulators.

Basically, the present invention comprises the formation of various internal electrode patterns 799 and 799G, so that the main electrode area (eg electrode extension 79-GNDA or 8) is formed.
(Excluding 12A) are positioned relative to each other with respect to the plurality of internal electrodes, which are group or individual, and the pairs provided further include a central portion of the dielectric along the stacking direction of the ceramic sheets. To the surface of the dielectric 1 gradually (or stepwise). Alternatively, the internal electrode pattern (eg, electrode extension 79-GND
A (excluding A or 812A) is a conductive main surface area (not shown) of a plurality of internal electrodes.
The region used by is gradually and symmetrically reduced (or stepwise) in both directions between the portions remote from the central common shield electrode which functions as a symmetrical equilibrium point. The pairs in this case are separate 800-1 and 2 / 800-I
It exists between the central common shield electrodes of M-1 and 2. This pair is dielectric material 8
No. 01 sheet (not shown) along the surface of the dielectric material 801.

Larger stacks of one invention embodiment (combinations of stacks of five common and differential energy paths), such as 9915 in FIG. 8, refer to the cross section of one invention embodiment and each is in place. Yes Functioning paired electrically opposed differential conductive paths 855BB, 855BT, 865BB, 865BT, 875BB, 8
75BT, 885BB and 885BT (all may be split electrodes)
To the first pair of differentially conductive paths 855BB and 855BT of the same size and electrically opposed from the central common shared electrode path 800 / 800-IM, and to the first and second common conductive shields. Differences in the arrangement of energy paths 810F-1 and 2 and 810B-1 and 2 (for clarity of concept, 9
Other material elements of 915 are omitted in this part of the disclosure).

Electrically Opposed Differential Conduction Paths 865BB with Reduced Third and Fourth Sizes
And a next set of 865BT or a third and a fourth increased size electrically opposed differential conductive paths 865BB and 865BT, which are subsequently provided with a central common shared electrode path 800 / 800-. IM, a first pair of electrically opposite differential conductive paths 855BB and 855BT of the same size, and first and second common conductive shield energy paths 810F-1 and 2 and 810B.
It will be appreciated that it would be provided to sandwich the overall prior arrangement of -1 and 2.

Therefore, the third and fourth differential conductive paths 865BB and 8 of the same size are provided.
This device or embodiment in which the 65 BT is proportionally reduced or expanded is proportionally and symmetrically balanced and the fourth and fifth common conductive shield energy paths 820B-1 and 2 and 820F-1 and 2 are provided. It is found that these are still at least equal but preferably reduced to 40, 41, 42, 43 the next time sandwiching, etc., universal multi-function common partly using Faraday shield architecture with stacked conductive hierarchy progression. Two electrically opposed differential energy paths to the conductive shield structure (9915 885BT and 885BB
An additional inventive variant 9915 is provided, which still follows the principle of).

This concept also uses paired electrical differential paths 855BB, 855BT, 865 that use bypass or feedthrough (not shown) energy propagation modes.
It can also be used in a universal multifunctional common conductive shield structure (not shown) that includes circuitry for energy (not shown) that is simultaneously propagated along the BB, 865BT, 875BB, 875BT, 885BB and 885BT.

Therefore, symmetrical pairs of matching and the same size are provided on opposite sides of the central common conductive shield energy path 800 / 800-IM-1 and 2 with respect to each other and physically parallel to each other. Differential conductive paths 855BB, 855
BT, 865BB, 865BT, 875BB, 875BT, 885BB and 8
The predetermined pattern of 85BT is 855BB, 855BT, 865BB, 865B.
T, 875BB, 875BT, 885BB and 885BT are each 8
It may be installed or positioned using, for example, the setback scheme 40, 41, 42, 43 so that it does not necessarily fit adjacent differential electrodes provided before the 85BT and 875BT. The concept of this relative pair principle disclosed is that the differential conduction paths 855BB, 855BT, 865BB, 865BT, 875BB.
, 875 BT, 885 BB and 885 BT, these matched and physically parallel, same size pairs are relative to each other and their respective sizes (as seen in other embodiments, such as 9905 in FIG. 855BB vs. 855BT, 865B
B to 865 BT, 875 BB to 875 BT, 885 BB to 885 BT) are primarily compatible, but are not necessarily of a size (eg, 855 BB to 865) for adjacent paths.
BB vs. 875BB vs. 885BB) are not compatible and are adjacent to the previously deposited differential conductive paths (at least one common conductive shield energy path 830F-1 and 2, 820F-1 and 2, 810F-1 and 2, 800 / 800-IM-
1 and 2, 810B-1 and 2, 820B-1 and 2, separated by 830B-1 and 2) respectively.

Therefore, variations of the embodiments of each invention are significant and self-evident during manufacturing, with the common central shared electrode path 800 / 800-IM (800 / 800-IM is always a functional start for the next stack or deposit). Setback areas (814A, 814B, 814C, 814D, etc.) associated with material 801, 814- "X" deposited on either side of the point, but not necessarily the starting point of manufacture. ),
Or include some parts of various other materials and method placement concept elements, such as connecting elements such as 798-GND "X" for personalization (e.g., not necessarily used non-individually). As far as possible, relative pairing concepts and setback schemes are also further described by the setback schemes 44, 45, 46 and 4
7, common path electrodes 830F-1 and 2,820F- of the shield electrode structural element.
1 and 2, 810F-1 and 2, 800 / 800-IM-1 and 2, 81
0B-1 and 2, 820B-1 and 2, and 830B-1 and 2. As long as the various related pairs are complemented and symmetrically paired for complementary opposite alignments and maintain other distance relationships and setbacks in related pairs or related balancing symmetrical relationships. ,
Variations of the embodiments of the invention will operate with certain electrical adjustment methods for various energy adjustment functions required by the user. This related balancing, related “two-pairing”, or related match-off of “mirror-like” elements, or related balancing pairs is like 9905. A versatile Faraday shield with stacked conductive hierarchy progression that is a novel improvement over previous embodiments and that has many unexpected results and includes paired electrically opposed differential conductive paths. As far as the electrostatic shielding function (not shown) of the architecture is concerned, no other structural improvement is possible. This related pairing concept is an embodiment of the invention that does not use external paired electrically opposed differential conductive paths as described in other shared and co-pending disclosures. Is also included. Setback scheme 40, 41, 42, 43, 44, 45, 46, 47
It should be noted that 9915 can be reversed in the tapering of the variants possible and fully contemplated by Applicant.

One of a number of embodiments of a given split electrode stacking configuration heretofore fully described in this application or not described herein and external trace paths, conductive paths and conductors, etc. When combined, one complete invention configuration can be created when energized. Without limiting the invention, one embodiment of the assembly of the invention is shown in FIG. 9 below.

In FIG. 9, the circuits and electrodes are formed by predetermined conductive material attachments (not shown) external to the various split electrodes of predetermined configuration that form part of the illustrated embodiment of the invention. The circuit of the two paths shown is only schematically shown. In that such a conductive circuit attachment is an individual or non-individual embodiment of a given conductor that is not itself the actual layer to the path of the external structure utilizing the connecting split electrode portion of the present invention, It can be made regardless of the casing of this embodiment. The following is a list of the various parts required for this circuit. 300: Split electrode path, common electrically coupled source, differential electrode layer, energization and source, path 301, load 317 and return path 322 coupled to the overall circuit created by the mounting arrangement. FIG. 5 is a diagram showing a split electrode shield layer that is connected in common and is a common load source. 301: Schematic of the "powered on" conductive energy path or Vcc. 302: A schematic diagram highlighting the area of dynamic function. 303: A single external power supply path (both "A" and "B" differential split electrodes) such that attachment points and / or portions of energy enter from opposite directions of the stacked electrode configuration from both 303 and 309. FIG. 3 is a schematic diagram of the structure of one non-common differential conductive split electrode to the outer conductor with about half of the energy supplied from the split of the incoming energy). 304: Schematic of the energy conditioner formed between the differential split electrode and the common return split electrode / path. 305: Shielding split electrode or return split electrode 329, 330, 33
"0" for both the differential split electrode associated with 1 and the resulting shielding effect
It is the schematic which shows a voltage circuit reference. 306: Schematic of the split points of the energy path to split electrode elements 313, 314. 307: Schematic diagram of the inductance inherent in the common differential conductive split electrode. 308: Schematic of the electrical resistance inherent in the common differential conductive split electrode. 309: A single external power supply path (of the "A" and "B" common differential conductive split electrodes) such that attachment points and / or portions of energy enter from both 303 and 309 in opposite directions of the stacked electrode configuration. FIG. 6 is a schematic diagram of the structure of one common differential conducting split electrode to the outer conductor with about half of the energy supplied from the split of both entering energy). 310: Same attachment point and / or one common differential conductive split electrode 30
Figure 9 is a schematic diagram of the structure highlighting the areas of 9 dynamic functions. 311 shows stacked differential split electrodes and common split electrode shielding elements in groups. 312: A stack of the present invention having a split electrode configuration, expanded to better show stacking from the circuit portion. 313: Differential split electrode “A” 314: Differential split electrode “B” 315: Diagram showing the connection between the circuit and the recombination point of the split part of energy transfer. 316: It is a figure which shows the recombination point of the split part of energy transfer (arbitrary). 317: It is a figure which shows the load which receives the part of the energy used. 318: Electric resistance peculiar to the conductive split electrode. 319: It is a figure which shows the inductance peculiar to the conductive split electrode which performs cancellation. FIG. 6 is a diagram of a region in which the dynamic function of the 320: 305 region is emphasized. 321: Line-to-line cap formed during energization
(acitance) (line-to-line capacity) (
It is a figure which shows a line-to-line capacity) element. 322: It is a figure which shows conduction energy return VSS. 323: is a diagram showing a dynamic function area of the area 312 of the present invention. 324: Feedthrough common conductive split electrode and exit point of the return portion of the load back to the source. 325: It is a figure which shows the electric resistance peculiar to a common conductive split electrode. 326: Shows the entry point of the feedthrough return portion of energy returning from the load to the common conductive split electrode (returning to the source). 327: shows a line between a common split electrode and the energy regulator formed during energization. 328: shows the structure of the same attachment point and / or (1) conductive split electrode 303. 329: shows a common conductive split electrode. 330: A diagram showing a common conductive split electrode. FIG. 331: Common conductive split electrode.

The circuit and functions shown in FIG. 9 as a 2-line circuit do not show the third path connection. The circuit and device of the present invention shown in FIG. 9 includes split electrodes 329, 33.
It operates like a shielded switching regulator with capacitive and inductive cancellation, with a predetermined alignment stack of smaller and larger groups of two separately functioning groups of 0, 331 and 313 and 314. These two groups of split electrodes are common, but in this case only differential in terms of direction. In this way, one larger and ideal energy conditioning circuit is formed between Vdd and Vss, the main circuit sub-elements used both as part of the energy return and the voltage image with the shield central common electrode 330. Energy is returned through the circuit common split electrode of the present invention which performs the operational responsibility as.

In order to optimize decoupling performance, the inventive circuit and device should be located as close as possible to the load 317, which is associated with the internal electrode portions 314, 313 of the circuit traces 301, 322. (Not shown) Minimizes stray inductance and resistance, thereby making full use of the circuits, devices and capabilities of the present invention to be utilized partially as an energy path in the energy propagation subject to conditioning. In this embodiment, a portion of the energy in the circuit operates in bypass propagation mode with respect to the overall processing by the physical differential bypass split electrodes 313 and 314, respectively, where the energy used exclusively as energy return 322 is also used. Returns to the source (not shown) via the central common split electrode 330 and the sandwiching common split electrodes 329, 331, operating in a feedthrough relationship within the device. The shielded split electrode mounting arrangement also establishes an alternative third path and one of lower impedance and electrical resistance and allows the undesired portion of energy to flow from the common split electrode while terminating structure 325. And 326 or energy propagating through connection stores 325 and 326 between a source (not shown) and load 317 may be bypassed on an energy path (not shown), and a portion of this energy may It is used as part of the energy return 322 without returning to the source (not shown).

The current path of the energy part operates under bypass in the bypass mode with respect to the overall treatment by the physical differential bypass split electrodes 313 and 314, but here independently as energy return and in some mounting configurations. Filter 3 when the energy used as the shield split electrode in the possibility of return to the source
Also note that it operates in a feedthrough relationship via 00.

The number of stacks found in 312 is not limited, but it is desirable that the common electrode shield electrode be an odd number in the unit used. This is the balance of the shield electrodes 329 and 331, which is related in that in this case each circuit is completely different, but the same stacking element can be used in both circuits.
Allows to be equally distributed on each side of 30.

When the elements of the present invention are combined and energized into a larger electrical system using industry standard insertion or attachment methods, the differences in the circuit layers will result in a given attachment to external differential split electrodes or paths. And in common attachment to a common conductive structure, region or path.

The functions obtained are differential mode and common mode filtering working simultaneously, surge protection and decoupling, mutual flux of certain types of electromagnetic energy field propagation, containment and suppression of e and h electromagnetic energy field propagation, Including but not limited to various parasitic emissions, the portion of energy reduction is minimized, which is typically the case when using prior art embodiments that do not include such elements. can not see.

Individual and Non-Individual Embodiments Using Various Dielectrics Mainly Classed for Certain Other Electrical Conditioning Functions or Results Using Common Conductive Shielding Structures with Common External Conductive Elements as Disclosed In many cases, the new use of the constructed inventive element will achieve the unexpected and advantageous properties added to the knowledge of the previously limited use of the particular dielectric used. Please note. This uses, for example, non-discrete capacitive or inductive structures that can incorporate variations of one inventive embodiment in, for example, manufactured silicon molds or in supercapacitor applications or even atomic level energy conditioning structures, Including stacking applications.

Therefore, as the only significant variation between similarly configured or manufactured embodiments of the present invention, which is similarly constructed or manufactured by standard means, and used with standard paired line circuit conditions. Almost all embodiments having a dielectric difference and variations of the embodiments of the invention have heretofore been unpredictable and unobvious in view of the reaction of each known prior art dielectric. Such a method provides a performance measurement of insertion loss. This comparison (other than dielectric) of similar types of invention units clearly and clearly shows the main cause or factor that produces this result, and within this embodiment the circuit performance is a balance of elements, The larger the conductive attachment of the external common conductive elements that work together using the conductive shield structure and electrostatic suppression, the more physical attachment that various inventive embodiments have to the regulation of the energy propagating in the circuit system. Built into the shield.

The attachment of the present invention to the same common conductive outer region or path of all common and conductively attached common electrode elements often results in the energy carried by the AOC (region of convergence) being electrically related to the source and load. Enable them to operate in parallel in parallel, and nearly all but not only with respect to each other when connected to separate return paths that are not of differential conductive paths, unique installations, chassis ground or low impedance paths. It is possible to operate in parallel with other common conductive structures that are also provided with respect to the main circuit of. When the USS (universal shield structure) is placed or attached to the energized circuit as described, the common conductive energy path parallel to the internal and external differential energy, as disclosed, is often re-established thereby. A
Increasing and lowering the impedance of the third conductive / sympathetic conductive path in the OC,
Allows the propagated energy-return path to be a utilized part of the energy originating from the source.

When the invention is placed on a common conductive area, such as may be produced by paddle solder material placed during the test, the test is shown as unimportant between common conductive plates. It should be noted that both the external and internal differential electrode energy paths are usually complementary during a slight but insignificant imbalance. The addition of an externally located common conductive path disturbs the balance of the conductive energy path and shifts the self-resonance point to a similar type of test. As shown in FIGS. 2 and 3, there are many common conduction energy paths, shown additionally (# -M), with a unique central shared image “0” voltage reference plane attached. In that case, the shielding effectiveness of one invention embodiment is increased. These are additional externally provided common conduction energy paths, and the close sandwiching of their adjacent adjacent paths has a greater purpose than adding capacitance to the USS embodiment. This is because. These additionally provided common conductive energy paths are provided prior to the final application of at least one set of external differential electrode pairs.

The sandwich function of these external paired differential conductive paths between the basic groups of paired conductive shield-like containers 800X is often the externally mounted common conductive area and / or common. Helps influence the energy propagation associated with the third energy path, which is a conductive region.

Also, the sandwich and insertion features of these external paired differential conductive paths between the basic groups of paired conductive shield-like containers 800 “X” were often externally mounted. Helps influence the energy propagation associated with the common conductive region and / or the third path which is the common conductive region. Shield 80 constituting the invention
It should be noted that the 0 "X" container is balanced according to the stacking order described.

In almost all of one inventive embodiment, at least three, distinctly different, simultaneously functioning energy conditioning features are often provided for active energy pathways within the improvisation of the region of the intervening common conductive shielding energy pathways. Circuit shielding occurs only if it is maintained and contained within the AOC. These functions are divided into at least three parts of the circuit shield that are occurring simultaneously in one inventive embodiment.

In addition to shielding the electrically charged containment of the internally generated energy parasitics from the active differential conductive energy path, the externally generated energy parasitics coupled to the same active differential conductive energy path are physically The function of the physical Faraday cage-like effect or electrostatic shielding effect to protect in addition to minimizing energy parasitics is to create an active energy path within the footprint of the enclosing common conductive shield energy path. This is due to the almost entirely biased physical shielded enclosure that utilizes insertion.

By inserting a dielectric shielding function that allows very small separation distances of physically charged materials and oppositely charged active differential conductive energy paths contained in a common energy path, electrical and electromagnetic Interact with each other in a controlled manner.

Propagating along complementary and electrically opposing complementary electrodes or conductive energy paths, with parasitic complementary imposed suppression of concomitant stray energy and containment of physical and electrical shields. The cancellation of the mutual energy flux fields of the various portions of the energy consumed is an important reason for the functionality of one inventive embodiment.

Since the magnetic field lines move counterclockwise in the transmission line or line conductor or layer,
When the RF return path is parallel and close to its corresponding source trace, the field lines seen in the return path (counterclockwise field) associated with the source path (clockwise field) are often in opposite directions. Combining the clockwise and counterclockwise bounds has a cancellation or minimization effect. The closer this path is, the better the cancellation effect.

Using the "0" voltage reference produced by the centrally located and shared common shield energy path electrode, the two distinct common conductive shield structure portions are complementarily charged. The translational shielding effect (as opposed to the continuous transfer effect due to the bulk of the energy using AOC) is electrically complementary charged and / or charged to one side of the central common and shared conductive energy paths. Each energy portion propagating in magnetic motion often has parallel, non-enhancing, but complementary charged, substantially simultaneously opposing cancellation types or corresponding ones that operate in a complementary manner.

The present invention also utilizes a sandwiched electrostatic shielding function in simultaneous complementary charged suppression within a given electrode area defined by a common electrode end associated with a differential electrode end. It will interact between and within the common conductive shield structure as described above.

All or nearly all internally conductively stacked electrodes or energy paths have a centrally located common conductive energy path electrode and a “0” voltage reference plane (as defined by the addition of non-split # -IM). The common energy shield (which is the common electrode shield) and is simultaneously utilized by the portion of the transmitted energy.

The electrically parallel method refers to the conductive energy path utilized by the portion of the energy that propagates from the working source to the AOC and then further to the energy source, and then the energy. Part of the energy utilization load propagates from the energy utilization load to the AOC, and then the part or part that returns to the source path via the AOC is A
Moved through the low impedance enhanced by the third conductive set of paths leading to common conductive external paths provided within the OC and externally common to each other. As described, the invention, properly mounted either individually or non-individually, often results in multiple sources of energy, often due to multiple distinct and well-defined circuits,
Multiple pairs of conductive energy paths, decoupling associated with the energy utilizing the load and conductive energy paths back to the source to complete the circuit, filtering, voltage balancing using the principle of electrically positioning in parallel, etc. And help achieve the ability to work simultaneously to perform well-defined energy regulation functions.

This also uses a centrally located common and shared conductive electrode path in such a way that it is balanced on the opposite side of the simultaneously occurring “0” voltage reference. Including opposing but electrically canceling and complementary positioning of the portion of the propagated energy that acts on. This generally parallel energy distribution scheme allows all material configurations of the manufactured elements of the invention to work together more effectively and efficiently with load and source paths in the circuit. To do.
By operating complementarily, the stress of the material is significantly reduced compared to the prior art. Therefore, phenomena such as memory effect or hysteresis effect of elastic material are minimized.

Piezoelectric effects are also substantially minimized due to the materials that make up part of one inventive embodiment, so that our inefficiently utilized energy is not diverted inside the AOC and the AOC and It is automatically available for use by loads of large dynamic increases in the ability of standard and common dielectric materials to perform functions in circuits for more broadly unrestricted applications, which reduces costs and Performance level higher than that of the prior art. In the energized state, minimizing the hysteresis effect with controlling the piezoelectric effect on the stresses of the dielectric and conductive materials in the AOC of one invention embodiment translates into increased performance levels for applications such as the SSO state. Or equal to that level. Also, the faster use of passive components by active components is achieved directly because of the complementary way in which these stress reductions and transmitted energy can be utilized in the present invention. .

[0218] Then, additional common conduction energy surrounding a combination of shared centrally provided conduction energy paths or surrounding a grouped arrangement of central conduction energy paths and a plurality of differential conduction electrodes. The paths can be used to increase the intrinsic ground and optimize Faraday cage-like function and surge emission, as well as common conductive paths not considered part of the differential conductive path as shown in all embodiments. It is also possible to increase or enhance the low impedance effect of the connection structure.

Also, although not shown, one inventive embodiment can be easily manufactured using silicon and can be directly incorporated into a microprocessor circuit or chip of an integrated circuit. The integrated circuit is prefabricated with the etched capacitors in a silicon mold, a semiconductor mold or a silicon base that can be easily incorporated using the techniques of the present invention as currently available.

When closed, the prior art energy conditioner provides a high input impedance (e.g.
Z) A normally paired external electrical counter to improve the energy regulation function from that of other necessary prior art energy regulation devices used elsewhere in the circuit to handle the condition. It will be noted that the differential energy paths are coupled in a line-to-line placement scheme. In practice, line-to-line arrangements with improved energy conditioning capabilities are often provided with at least two additional line installations provided at line installation between each of the same external electrically opposed differential energy paths and to ground connection. Prior art energy conditioning devices are required. This additional arrangement is required to adjust the portion of the propagated energy that still requires energy adjustment to maintain the nominal operation of the circuit as described. This need is in part due to the inherently occurring internal conductive circuitry that develops within each of the various prior art energy conditioners when the energy conditioner is operated in an energized circuit, This prior art device often exists with its use.

These three elements are inductive circuit elements (“L”) in this part of the circuit where the circuit energy propagating in the AOC circuit part of the stacked arrangement of the invention does not develop and is energized.
)) Is provided at a minimum to simultaneously provide a canceling and suppressing energy conditioning function (ie, a very effective filtering effect) on the portion of the circuit energy propagating in the AOC. Therefore, almost all variations of this new energy conditioning invention embodiment often have a significantly wider bandwidth than prior art capacitors or prior art energy conditioning devices of the same size and capacity. Provides the filter function of.

Finally, considering a number of embodiments herein, the shape, thickness or size may be varied in individual or non-individual modes of operation within at least one or more energized circuits and then Then at least one conductive container forming at least one larger single conductive and homogeneous Faraday cage-like shield structure, or a pair of differential conductive electrodes or parts of a pair of energy paths Obviously, it may vary depending on the electrical application derived from the configuration of the common conductive shield electrode path and mounting structure to form part of the invention that may be.

Although the principles, preferred embodiments and preferred operations of the present invention have been described in detail herein, this should not be construed as being limited to the specifically illustrated forms. Therefore, it will be apparent to those skilled in the art that various modifications of the preferred embodiments described herein are possible without departing from the spirit or scope of one defined invention embodiment.

[Brief description of drawings]

1 details a portion of a common conductive shield electrode path and differential electrode path stacking and placement within a portion of a universal Faraday Shield architecture embodiment 9900 with stacked conductive hierarchical progression shown in FIG. 2 in accordance with the present invention. It is a top view.

FIG. 2 illustrates a portion of an enlarged perspective view of an embodiment of a universal Faraday shield architecture 9900 with electrode stacking conductive hierarchy progression in accordance with the present invention.

FIG. 3 is a cross section of an anti-differential bypass circuit conditioning embodiment 9905 utilizing one portion of one embodiment of a universal Faraday shield architecture with electrode stacked conductive hierarchy progression for energy conditioning of multiple discrete bypass circuits in accordance with the present invention. It is a figure which shows a part of figure.

FIG. 4 shows part of a plan view of a stratified arrangement for two differential twisted pair crossover feedthrough electrode energy paths according to the present invention.

FIG. 5 shows a portion of a plan view of a pair of “straight feedthrough” feedthrough electrode stratifications with electrode energy paths configured with a split differential electrode configuration according to the present invention.

FIG. 6A is a detailed plan view of a portion of a common conductive shield electrode path portion showing an exemplary split electrode configuration according to the present invention.

FIG. 6B is a detailed plan view cross-section illustrating an exemplary split electrode configuration according to the present invention.

FIG. 7A is a further alternative embodiment 92 comprising two pairs of electrically opposite differential twisted pair crossover feedthrough electrode energy paths constructed in accordance with the present invention.
10 is a cross-sectional view of a portion of 10.

FIG. 7B   FIG. 9 shows a portion of a front view of 9910 according to the present invention.

FIG. 8 is a cross-sectional view of a portion of an alternative embodiment 9915 with several pairs of electrically opposite differential electrode energy paths constructed in accordance with the present invention.

FIG. 9 illustrates a split electrode circuit combination utilized by all of the electrodes present in one embodiment. An alternative to this can have one of two of the groups of electrodes optionally configured non-split according to the present invention.

[Procedure Amendment] Patent Cooperation Treaty Article 19 Amendment Translation Form

[Submission date] July 20, 2001 (2001.7.20)

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be amended] Claims

[Correction method] Change

[Contents of correction]

[Claims]

15. The circuit assembly of claim 14, wherein the plurality of common electrodes is a plurality of split common electrodes.

[Procedure amendment]

[Submission date] August 6, 2002 (2002.8.6)

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 5

[Correction method] Change

[Contents of correction]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 14

[Correction method] Change

[Contents of correction]

[Procedure 3]

[Document name to be amended] Statement

[Name of item to be corrected] 0194

[Correction method] Change

[Contents of correction]

In FIG. 9, the circuits and electrodes are formed by predetermined conductive material attachments (not shown) external to the various split electrodes of predetermined configuration that form part of the illustrated embodiment of the invention. The circuit of the two paths shown is only schematically shown. In that such a conductive circuit attachment is an individual or non-individual embodiment of a given conductor that is not itself the actual layer to the path of the external structure utilizing the connecting split electrode portion of the present invention, It can be made regardless of the casing of this embodiment. The following is a list of the various parts required for this circuit. 300: Split electrode path, common electrically coupled source, differential electrode layer, energization and source, path 301, load 317 and return path 322 coupled to the overall circuit created by the mounting arrangement. FIG. 5 is a diagram showing a split electrode shield layer that is connected in common and is a common load source. 301: Schematic of the "powered on" conductive energy path or Vcc. 302: A schematic diagram highlighting the area of dynamic function. 303: A single external power supply path (both "A" and "B" differential split electrodes) such that attachment points and / or portions of energy enter from opposite directions of the stacked electrode configuration from both 303 and 309. FIG. 3 is a schematic diagram of the structure of one non-common differential conductive split electrode to the outer conductor with about half of the energy supplied from the split of the incoming energy). 304: Schematic of the energy conditioner formed between the differential split electrode and the common return split electrode / path. 305: Shielding split electrode or return split electrode 329, 330, 33
"0" for both the differential split electrode associated with 1 and the resulting shielding effect
It is the schematic which shows a voltage circuit reference. 306: Schematic of the split points of the energy path to split electrode elements 313, 314. 307: Schematic diagram of the inductance inherent in the common differential conductive split electrode. 308: Schematic of the electrical resistance inherent in the common differential conductive split electrode. 309: A single external power supply path (of the "A" and "B" common differential conductive split electrodes) such that attachment points and / or portions of energy enter from both 303 and 309 in opposite directions of the stacked electrode configuration. FIG. 6 is a schematic diagram of the structure of one common differential conducting split electrode to the outer conductor with about half of the energy supplied from the split of both entering energy). 310: Same attachment point and / or one common differential conductive split electrode 30
Figure 9 is a schematic diagram of the structure highlighting the areas of 9 dynamic functions. 311 shows stacked differential split electrodes and common split electrode shielding elements in groups. 312: A stack of the present invention having a split electrode configuration, expanded to better show stacking from the circuit portion. 313: Differential split electrode “A” 314: Differential split electrode “B” 315: Diagram showing the connection between the circuit and the recombination point of the split part of energy transfer. 316: It is a figure which shows the recombination point of the split part of energy transfer (arbitrary). 317: It is a figure which shows the load which receives the part of the energy used. 318: Electric resistance peculiar to the conductive split electrode. 319: It is a figure which shows the inductance peculiar to the conductive split electrode which performs cancellation. FIG. 6 is a diagram of a region in which the dynamic function of the 320: 305 region is emphasized. 321: Line-to-line cap formed during energization
FIG. 322: It is a figure which shows conduction energy return VSS. 323: is a diagram showing a dynamic function area of the area 312 of the present invention. 324: Feedthrough common conductive split electrode and exit point of the return portion of the load back to the source. 325: It is a figure which shows the electric resistance peculiar to a common conductive split electrode. 326: Shows the entry point of the feedthrough return portion of energy returning from the load to the common conductive split electrode (returning to the source). 327: shows a line between a common split electrode and the energy regulator formed during energization. 328: shows the structure of the same attachment point and / or (1) conductive split electrode 303. 329: shows a common conductive split electrode. 330: A diagram showing a common conductive split electrode. FIG. 331: Common conductive split electrode.

─────────────────────────────────────────────────── ─── Continued front page    (31) Priority claim number 60 / 191,196 (32) Priority date March 22, 2000 (March 22, 2000) (33) Priority claiming countries United States (US) (31) Priority claim number 60 / 200,327 (32) Priority date April 28, 2000 (April 28, 2000) (33) Priority claiming countries United States (US) (31) Priority claim number 60 / 203,863 (32) Priority date May 12, 2000 (May 12, 2000) (33) Priority claiming countries United States (US) (31) Priority claim number 09 / 579,606 (32) Priority date May 26, 2000 (May 26, 2000) (33) Priority claiming countries United States (US) (31) Priority claim number 09 / 594,447 (32) Priority date June 15, 2000 (June 15, 2000) (33) Priority claiming countries United States (US) (31) Priority claim number 60/215, 314 (32) Priority date June 30, 2000 (June 30, 2000) (33) Priority claiming countries United States (US) (31) Priority claim number 09 / 632,048 (32) Priority date August 3, 2000 (August 2000) (33) Priority claiming countries United States (US) (31) Priority claim number 60 / 225,497 (32) Priority date August 15, 2000 (August 15, 2000) (33) Priority claiming countries United States (US) (31) Priority claim number 60 / 241,128 (32) Priority date October 17, 2000 (October 17, 2000) (33) Priority claiming countries United States (US) (31) Priority claim number 60 / 248,914 (32) Priority date November 15, 2000 (November 15, 2000) (33) Priority claiming countries United States (US) (31) Priority claim number 60 / 252,766 (32) Priority date November 22, 2000 (November 22, 2000) (33) Priority claiming countries United States (US) (31) Priority claim number 60 / 253,793 (32) Priority date November 29, 2000 (November 29, 2000) (33) Priority claiming countries United States (US) (31) Priority claim number 60 / 255,818 (32) Priority date December 15, 2000 (December 15, 2000) (33) Priority claiming countries United States (US) (81) Designated countries EP (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, I T, LU, MC, NL, PT, SE, TR), OA (BF , BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG), AP (GH, G M, KE, LS, MW, MZ, SD, SL, SZ, TZ , UG, ZW), EA (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM), AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, B Z, CA, CH, CN, CR, CU, CZ, DE, DK , DM, DZ, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, J P, KE, KG, KP, KR, KZ, LC, LK, LR , LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, PL, PT, R O, RU, SD, SE, SG, SI, SK, SL, TJ , TM, TR, TT, TZ, UA, UG, US, UZ, VN, YU, ZA, ZW (72) Inventor Anthoni, Anthoni, A             United States Pennsylvania             16505, Erie, Wolf Run Dry             Ve 5064 F-term (reference) 5E321 AA32 GG09

Claims (23)

[Claims] 1. A passive multi-layer energy regulator for passively conditioning a portion of energy conductively connected between an energy source, an energy load and a third separate conductive path, the shield comprising a plurality of shields. A plurality of shield common electrodes, wherein the plurality of shield common electrodes include at least a first shield common electrode, a second shield common electrode, and a third shield common electrode, and the plurality of shield common electrodes are conductively connected to each other. And a pair of split differential electrodes having a plurality of shield common electrodes, each of which is generally the same size and the same shape, and a first split differential electrode and a second split differential electrode, At least one pair of split differential electrodes are generally the same size and shape and each split differential electrode of said at least one pair of split differential electrodes At least one pair of split differential electrodes arranged complementarily to each other, the first split differential electrode stacked on the first shield common electrode, and the second split differential electrode. Are stacked under the first shield common electrode, the second shield common electrode is stacked over the first split differential electrode, and the third shield common electrode is stacked over the second split differential electrode. The at least one pair of split differential electrodes are stacked below the moving electrodes so that the at least one pair of split differential electrodes are disposed at the insets of the plurality of shield common electrodes. Is a small material having predetermined electrical characteristics, said material partially encapsulating said plurality of shield common electrodes and said at least one pair of split differential electrodes and uniformly supporting them. Holding and operably maintained in a separable manner to prevent direct electrical connection between the plurality of shield common electrodes and the at least one pair of split differential electrodes, the plurality of shield common electrodes The passive multilayer for passively conditioning a portion of the energy in which an electrode and the at least one pair of split differential electrodes are conductively connected between an energy source, an energy load and a third separate conductive path. A passive multilayer energy regulator that forms a plurality of passive capacitive energy regulator elements within the energy regulator. 2. A passive multi-layer energy regulator for passively regulating a portion of energy conductively connected between an energy source, an energy load and a third separate conductive path, the passive multilayer energy regulator comprising at least one pair. A pair of common shield electrode structures, wherein each common shield electrode structure of the at least one pair of common shield electrode structures is aligned, complementary, and stacked in parallel with each other; Each common shield electrode structure of at least one pair of common shield electrode structures is at least 2
One split differential electrode, at least two shield common electrodes, and a predetermined characteristic operable to support the at least two shield common electrodes and the split differential electrode as a group or individually. A material having a material that prevents direct electrical connection between any one of the at least two shield common electrodes and the split differential electrode, the split differential electrode having the at least two shields. Sandwiched between common electrodes, said split differential electrode being of smaller size and inset from said at least two shield common electrodes, said split differential electrode being the edge of said at least two shield common conductive electrodes. At least one electrode portion extending a predetermined distance beyond the at least two shield common electrodes. , And electrically connected to all other shield common electrodes of the energy regulator and of generally the same size and shape, between the at least one pair of common shield electrode structures, the at least one pair of common shield electrodes. At least one shield common electrode portion of said at least one pair of shield common electrodes from each of the structures as at least one central shield common electrode portion common to each common shield electrode structure of said at least one pair of common shield electrode structures; Operable for a complementary energy conditioning function for passively conditioning each differential portion of energy propagating between the energy source, the energy load and the third separate conductive path. A passive multi-layer energy conditioner forming at least one pair of differential electrodes. 3. A passive multi-layer energy circuit conditioning electronic assembly for passively conditioning a portion of energy electrically connected between an energy source, an energy load and a third discrete conductive path, wherein: A material having at least first and second conductive paths connected between the energy source and the energy utilization load, a plurality of shield common electrodes, at least one pair of differential electrodes, and predetermined electrical characteristics, The material is maintained between the plurality of shield common electrodes and the at least one pair of differential electrodes to provide a direct electrical connection between the plurality of shield common electrodes and the at least one pair of differential electrodes. And a material for preventing the plurality of shield common electrodes, the plurality of shield common electrodes including at least a first shield common electrode, a second shield common electrode, and a third shield common electrode, and the plurality of shield common electrodes. The electrodes are electrically conductively connected to each other and are of generally the same size and shape, the at least one pair of differential electrodes including a first differential electrode and a second differential electrode, and the at least one pair of differential electrodes. Each of the electrodes is generally of the same size, the first differential electrode is stacked on the first shield common electrode, and the second differential electrode is stacked on the second shield common electrode.
Differential electrodes are stacked under the first shield common electrode, the second shield common electrode is stacked over the first differential electrode, and the third shield common electrode is the second shield common electrode. Of the plurality of shield common electrodes such that the at least one pair of differential electrodes are stacked below the plurality of shield common electrodes so that the at least one pair of differential electrodes are arranged at an inset of the plurality of shield common electrodes And at least one of the combination of the at least one pair of differential electrodes and the plurality of shield common electrodes is a split differential electrode, the plurality of shield common electrodes are connected to the first conductive path, and At least 1
A pair of differential electrodes is connected to the second conductive path and is passive for passively adjusting a portion of the energy electrically connected between the energy source, the energy load and the third separate conductive path. A passive multilayer energy circuit conditioning electronic assembly forming a plurality of energy conditioning elements for a multilayer energy circuit conditioning electronic assembly. 4. The material having predetermined electrical properties has dielectric properties.
A passive multilayer energy regulator according to claim 1, for passively regulating a portion of the energy conductively connected between the energy source, the energy load and the third separate conductive path. 5. The at least one pair of split differential electrodes for passively conditioning a portion of the energy conductively connected between an energy source, an energy load and a third separate conductive path. Line-to-ground capacitance of a passive multilayer energy regulator (lin)
e-to-ground capacitance (line-to-line capacitance)
ine capacity) (line-to-line capac)
2. Passive a portion of the energy conductively connected between the energy source, the energy load and the third separate conductive path according to claim 1, having equal and equilibrium electrical properties that yield an impedance value. Passive multi-layer energy regulator for dynamic regulation. 6. The shield common electrode and the at least one pair of split differential electrodes share a portion of the energy conductively connected between an energy source, an energy load and a third separate conductive path. Of the plurality of passive capacitive energy regulating elements for inducing a complementary cancellation interaction of the mutual inductive coupling between the at least one pair of split differential electrodes of the passive multilayer energy regulator for passive regulation. In said passive multi-layer energy regulator for passively regulating a portion of energy conductively connected between an energy source, an energy load and a third separate conductive path, including one passive capacitive energy regulating element An energy source, an energy load and a third separate conductive member according to claim 1, forming a plurality of passive capacitive energy conditioning elements in the. A passive multilayer energy conditioner for passively adjusting a portion of the energy conductively connected between the paths. 7. The energy source, energy load, and third energy source of claim 1, further comprising a plurality of outer conductive split differential electrodes having conductive major surfaces for complementary electrical interaction with each other. A passive multilayer energy regulator for passively conditioning a portion of the energy conductively connected between separate conductive paths. 8. A first conductive electrode termination band, a second conductive electrode termination band, and a common electrode termination band, the first conductive electrode termination electrode coupled to the first conductive electrode termination band, A second conductive electrode termination electrode is coupled to the second conductive electrode termination band, the plurality of common electrodes are coupled to the common electrode termination band, and at least one between the first and second conductive electrode termination bands. One energy adjustment element, at least two energy adjustment elements, one between the first conductive electrode termination band and the common electrode termination band, and the other between the second conductive electrode termination band and the second conductive electrode termination band. A portion of the energy conductively connected between the energy source, the energy load, and the third separate conductive path of claim 1, generated between the common electrode termination bands. Passive multi-layer energy regulator for passively adjusting minutes. 9. A portion of energy conductively connected between an energy source, an energy load and a third separate conductive path according to claim 1, operable as a feedthrough capacitor array. Passive multi-layer energy regulator for dynamic regulation. 10. An energy source conductively connected between an energy source, an energy load and a third discrete conductive path according to claim 1, operable as a crossover feedthrough capacitor array. A passive multilayer energy regulator for passively adjusting a portion. 11. A portion of the energy conductively connected between the energy source, the energy load and the third separate conductive path of claim 1, operable as a bypass capacitor array. Passive multi-layer energy regulator for adjusting to. 12. The passively regulated portion of the energy conductively connected between the energy source, the energy load and the third separate conductive path of claim 1, operable as a bypass capacitor. Passive multi-layer energy regulator for. 13. The electrically conductive connection between the energy source, the energy load and the third discrete conductive path according to claim 2, wherein the material having predetermined electrical properties comprises dielectric properties. A passive multilayer energy conditioner for passively adjusting a portion of energy. 14. The at least one pair of split differential electrodes for passively conditioning a portion of the energy conductively connected between an energy source, an energy load and a third separate conductive path. Line-to-ground capacitance (li) of a passive multilayer energy regulator
ne-to-ground capacitance (line-to-line capacitance) (line-to-line capacitance)
line capacitance) (line-to-line capa
C.) having equivalent and equilibrium electrical properties that produce a value
A passive multilayer energy conditioner for passively conditioning a portion of the energy conductively connected between an energy source, an energy load and a third separate conductive path according to. 15. The shield common electrode and the at least one pair of split differential electrodes share a portion of the energy conductively connected between an energy source, an energy load, and a third separate conductive path. Of the plurality of passive capacitive energy regulating elements for inducing a complementary cancellation interaction of the mutual inductive coupling between the at least one pair of split differential electrodes of the passive multilayer energy regulator for passive regulation. In said passive multi-layer energy regulator for passively regulating a portion of energy conductively connected between an energy source, an energy load and a third separate conductive path, including one passive capacitive energy regulating element An energy source, an energy load and a third separate conductor according to claim 2, forming a plurality of passive capacitive energy regulating elements in the. A passive multilayer energy conditioner for passively adjusting a portion of the energy conductively connected between electrical paths. 16. The energy source, energy load and third energy source of claim 2, further comprising a plurality of outer conductive split differential electrodes having conductive major surfaces for complementary electrical interaction with each other. A passive multilayer energy regulator for passively conditioning a portion of the energy conductively connected between separate conductive paths. 17. A first conductive electrode termination band, a second conductive electrode termination band, and a common electrode termination band, wherein the first conductive electrode termination electrode is the first conductive electrode termination band.
Coupled to the second conductive electrode termination band, the second conductive electrode termination electrode coupled to the second conductive electrode termination band, the plurality of common electrodes coupled to the common electrode termination band, the first and second Producing at least one energy adjusting element between the conducting electrode termination bands, one between the first conducting electrode termination band and the common electrode termination band, the other at the other. 3. An energy source, energy load and energy of conductively connected between a third separate conductive path according to claim 2, generated between a second conductive electrode termination band and the common electrode termination band. A passive multilayer energy regulator for passively adjusting a portion. 18. A device capable of operating as a feedthrough capacitor array,
A passive multilayer energy conditioner for passively conditioning a portion of energy conductively connected between an energy source, an energy load and a third separate conductive path according to claim 2. 19. The energy source conductively connected between an energy source, an energy load and a third separate conductive path according to claim 2, operable as a crossover feedthrough capacitor array. A passive multilayer energy regulator for passively adjusting a portion. 20. A portion of the energy conductively connected between the energy source, the energy load and the third separate conductive path of claim 2, operable as a bypass capacitor array. Passive multi-layer energy regulator for adjusting to. 21. Passive conditioning of a portion of the energy conductively connected between the energy source, the energy load and the third separate conductive path of claim 2, operable as a bypass capacitor. Passive multi-layer energy regulator for. 22. The operation according to claim 3, which is operable as a differential bypass circuit.
A passive multilayer energy circuit conditioning electronic assembly for passively conditioning a portion of energy conductively connected between an energy source, an energy load and a third discrete conductive path. 23. The energy source, the energy load, and a portion of the energy conductively connected between a third separate conductive path of claim 3, operable as a differential feedthrough circuit. Passive multi-layer energy circuit conditioning electronic assembly for tuning.