|
US20060241574A1
(en)
*
|
1995-08-31 |
2006-10-26 |
Rizoiu Ioana M |
Electromagnetic energy distributions for electromagnetically induced disruptive cutting
|
|
US20100125291A1
(en)
*
|
1995-08-31 |
2010-05-20 |
Rizoiu Ioana M |
Drill and flavored fluid particles combination
|
|
US20090143775A1
(en)
*
|
1995-08-31 |
2009-06-04 |
Rizoiu Ioana M |
Medical laser having controlled-temperature and sterilized fluid output
|
|
US20060240381A1
(en)
*
|
1995-08-31 |
2006-10-26 |
Biolase Technology, Inc. |
Fluid conditioning system
|
|
US20050281887A1
(en)
*
|
1995-08-31 |
2005-12-22 |
Rizoiu Ioana M |
Fluid conditioning system
|
|
US6288499B1
(en)
*
|
1997-06-12 |
2001-09-11 |
Biolase Technology, Inc. |
Electromagnetic energy distributions for electromagnetically induced mechanical cutting
|
|
US7320594B1
(en)
*
|
1995-08-31 |
2008-01-22 |
Biolase Technology, Inc. |
Fluid and laser system
|
|
US6393035B1
(en)
*
|
1999-02-01 |
2002-05-21 |
Gigatera Ag |
High-repetition rate passively mode-locked solid-state laser
|
|
US6647046B1
(en)
*
|
1999-11-23 |
2003-11-11 |
Corning Lasertron, Inc. |
Mode-selective facet layer for pump laser
|
|
US6885683B1
(en)
|
2000-05-23 |
2005-04-26 |
Imra America, Inc. |
Modular, high energy, widely-tunable ultrafast fiber source
|
|
JP3532838B2
(ja)
|
2000-08-30 |
2004-05-31 |
独立行政法人 科学技術振興機構 |
超短パルス光源
|
|
US20080157690A1
(en)
*
|
2001-05-02 |
2008-07-03 |
Biolase Technology, Inc. |
Electromagnetic energy distributions for electromagnetically induced mechanical cutting
|
|
US20020176473A1
(en)
*
|
2001-05-23 |
2002-11-28 |
Aram Mooradian |
Wavelength selectable, controlled chirp, semiconductor laser
|
|
JP2003090792A
(ja)
*
|
2001-09-20 |
2003-03-28 |
Fuji Photo Film Co Ltd |
光断層画像化装置
|
|
EP1517415A1
(de)
*
|
2003-09-18 |
2005-03-23 |
Leica Geosystems AG |
Geodätisches Gerät mit einer Laserquelle
|
|
US20100151406A1
(en)
*
|
2004-01-08 |
2010-06-17 |
Dmitri Boutoussov |
Fluid conditioning system
|
|
EP1812823A4
(en)
|
2004-03-25 |
2009-08-05 |
Imra America Inc |
OPTICAL PARAMETRIC REINFORCEMENT, OPTICAL PARAMETRIC GENERATION AND OPTICAL PUMPING IN FIBER OPTICAL SYSTEMS
|
|
EP1799404B1
(en)
*
|
2004-07-27 |
2020-01-08 |
Biolase, Inc. |
Contra-angle rotating handpiece having tactile-feedback tip ferrule
|
|
US7970030B2
(en)
*
|
2004-07-27 |
2011-06-28 |
Biolase Technology, Inc. |
Dual pulse-width medical laser with presets
|
|
JP2006053690A
(ja)
*
|
2004-08-10 |
2006-02-23 |
Ricoh Co Ltd |
画像処理装置、画像処理方法、画像処理プログラムおよび記録媒体
|
|
WO2006020946A2
(en)
*
|
2004-08-13 |
2006-02-23 |
Biolase Technology, Inc. |
Dual pulse-width medical laser with presets
|
|
WO2014079478A1
(en)
|
2012-11-20 |
2014-05-30 |
Light In Light Srl |
High speed laser processing of transparent materials
|
|
US8724666B1
(en)
*
|
2013-01-04 |
2014-05-13 |
Alcon Lensx, Inc. |
Self starting mode-locked laser oscillator
|
|
US9701564B2
(en)
|
2013-01-15 |
2017-07-11 |
Corning Incorporated |
Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
|
|
EP2754524B1
(de)
|
2013-01-15 |
2015-11-25 |
Corning Laser Technologies GmbH |
Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
|
|
EP2781296B1
(de)
|
2013-03-21 |
2020-10-21 |
Corning Laser Technologies GmbH |
Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
|
|
US10442719B2
(en)
|
2013-12-17 |
2019-10-15 |
Corning Incorporated |
Edge chamfering methods
|
|
US9850160B2
(en)
|
2013-12-17 |
2017-12-26 |
Corning Incorporated |
Laser cutting of display glass compositions
|
|
US11556039B2
(en)
|
2013-12-17 |
2023-01-17 |
Corning Incorporated |
Electrochromic coated glass articles and methods for laser processing the same
|
|
US9687936B2
(en)
|
2013-12-17 |
2017-06-27 |
Corning Incorporated |
Transparent material cutting with ultrafast laser and beam optics
|
|
US9815730B2
(en)
|
2013-12-17 |
2017-11-14 |
Corning Incorporated |
Processing 3D shaped transparent brittle substrate
|
|
US9701563B2
(en)
|
2013-12-17 |
2017-07-11 |
Corning Incorporated |
Laser cut composite glass article and method of cutting
|
|
US20150165560A1
(en)
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Laser processing of slots and holes
|
|
US9676167B2
(en)
|
2013-12-17 |
2017-06-13 |
Corning Incorporated |
Laser processing of sapphire substrate and related applications
|
|
US9517963B2
(en)
|
2013-12-17 |
2016-12-13 |
Corning Incorporated |
Method for rapid laser drilling of holes in glass and products made therefrom
|
|
EP3166895B1
(en)
|
2014-07-08 |
2021-11-24 |
Corning Incorporated |
Methods and apparatuses for laser processing materials
|
|
US9617180B2
(en)
|
2014-07-14 |
2017-04-11 |
Corning Incorporated |
Methods and apparatuses for fabricating glass articles
|
|
EP3169479B1
(en)
|
2014-07-14 |
2019-10-02 |
Corning Incorporated |
Method of and system for arresting incident crack propagation in a transparent material
|
|
CN208586209U
(zh)
|
2014-07-14 |
2019-03-08 |
康宁股份有限公司 |
一种用于在工件中形成限定轮廓的多个缺陷的系统
|
|
WO2016010991A1
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
|
|
JP2017530867A
(ja)
*
|
2014-07-14 |
2017-10-19 |
コーニング インコーポレイテッド |
長さおよび直径の調節可能なレーザビーム焦線を用いて透明材料を加工するためのシステムおよび方法
|
|
US10047001B2
(en)
|
2014-12-04 |
2018-08-14 |
Corning Incorporated |
Glass cutting systems and methods using non-diffracting laser beams
|
|
KR20170105562A
(ko)
|
2015-01-12 |
2017-09-19 |
코닝 인코포레이티드 |
다중 광자 흡수 방법을 사용한 열적 템퍼링된 기판의 레이저 절단
|
|
JP7292006B2
(ja)
|
2015-03-24 |
2023-06-16 |
コーニング インコーポレイテッド |
ディスプレイガラス組成物のレーザ切断及び加工
|
|
EP3274313A1
(en)
|
2015-03-27 |
2018-01-31 |
Corning Incorporated |
Gas permeable window and method of fabricating the same
|
|
CN107835794A
(zh)
|
2015-07-10 |
2018-03-23 |
康宁股份有限公司 |
在挠性基材板中连续制造孔的方法和与此相关的产品
|
|
EP3452418B1
(en)
|
2016-05-06 |
2022-03-02 |
Corning Incorporated |
Laser cutting and removal of contoured shapes from transparent substrates
|
|
US10410883B2
(en)
|
2016-06-01 |
2019-09-10 |
Corning Incorporated |
Articles and methods of forming vias in substrates
|
|
US10794679B2
(en)
|
2016-06-29 |
2020-10-06 |
Corning Incorporated |
Method and system for measuring geometric parameters of through holes
|
|
KR20190035805A
(ko)
|
2016-07-29 |
2019-04-03 |
코닝 인코포레이티드 |
레이저 처리를 위한 장치 및 방법
|
|
JP2019532908A
(ja)
|
2016-08-30 |
2019-11-14 |
コーニング インコーポレイテッド |
強度マッピング光学システムによる材料のレーザー切断
|
|
JP6923284B2
(ja)
|
2016-09-30 |
2021-08-18 |
コーニング インコーポレイテッド |
非軸対称ビームスポットを用いて透明被加工物をレーザ加工するための装置及び方法
|
|
LT3529214T
(lt)
|
2016-10-24 |
2021-02-25 |
Corning Incorporated |
Substrato apdorojimo stotis lakšto formos stiklo substratų lazeriniam mašininiam apdorojimui
|
|
US10752534B2
(en)
|
2016-11-01 |
2020-08-25 |
Corning Incorporated |
Apparatuses and methods for laser processing laminate workpiece stacks
|
|
US10688599B2
(en)
|
2017-02-09 |
2020-06-23 |
Corning Incorporated |
Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
|
|
WO2018205087A1
(zh)
*
|
2017-05-08 |
2018-11-15 |
深圳大学 |
一种异质结可饱和吸收镜及其制备方法、脉冲光纤激光器
|
|
US11078112B2
(en)
|
2017-05-25 |
2021-08-03 |
Corning Incorporated |
Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
|
|
US10580725B2
(en)
|
2017-05-25 |
2020-03-03 |
Corning Incorporated |
Articles having vias with geometry attributes and methods for fabricating the same
|
|
US10626040B2
(en)
|
2017-06-15 |
2020-04-21 |
Corning Incorporated |
Articles capable of individual singulation
|
|
US12180108B2
(en)
|
2017-12-19 |
2024-12-31 |
Corning Incorporated |
Methods for etching vias in glass-based articles employing positive charge organic molecules
|
|
US11554984B2
(en)
|
2018-02-22 |
2023-01-17 |
Corning Incorporated |
Alkali-free borosilicate glasses with low post-HF etch roughness
|