JP2003511704A - Sensor for detecting high-frequency voltage oscillation and sensor arrangement - Google Patents
Sensor for detecting high-frequency voltage oscillation and sensor arrangementInfo
- Publication number
- JP2003511704A JP2003511704A JP2001530598A JP2001530598A JP2003511704A JP 2003511704 A JP2003511704 A JP 2003511704A JP 2001530598 A JP2001530598 A JP 2001530598A JP 2001530598 A JP2001530598 A JP 2001530598A JP 2003511704 A JP2003511704 A JP 2003511704A
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- shield
- conductor
- capacitor
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/04—Voltage dividers
- G01R15/06—Voltage dividers having reactive components, e.g. capacitive transformer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06777—High voltage probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/18—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using inductive devices, e.g. transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/1227—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
- G01R31/1263—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation
- G01R31/1272—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation of cable, line or wire insulation, e.g. using partial discharge measurements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
Abstract
(57)【要約】 導体（１１）中の高周波電圧振動を検出するセンサ（１０）及びセンサ配置構成において、センサはその第一端子が導体と接続可能なコンデンサ（１５）を備え、コンデンサの第二端子には変流器（１８）と、測定された信号を導出するためのジャック（１９）とが付属する。さらにセンサは導体とシールド（１２）との間の中間領域（１３）に配置される。このセンサは小形でコンパクトであり、個々の部品を順に組立てる必要がないことから据付も簡単かつ迅速に行える。 (57) Abstract: In a sensor (10) and a sensor arrangement for detecting a high-frequency voltage oscillation in a conductor (11), the sensor comprises a capacitor (15) having a first terminal connectable to the conductor, and The two terminals are accompanied by a current transformer (18) and a jack (19) for deriving the measured signal. Further, the sensor is located in an intermediate area (13) between the conductor and the shield (12). The sensor is small and compact, and can be installed easily and quickly because there is no need to assemble the individual components in order.
Description
【０００１】
この発明は、導体中の高周波電圧振動を検出すべく、第一端子がこの導体に接
続可能なコンデンサを備えたセンサに関する。The present invention relates to a sensor having a capacitor whose first terminal is connectable to a conductor for detecting high frequency voltage oscillations in the conductor.
【０００２】
この種センサは、火力発電所で高周波電圧振動を検出するために使用される。
種々の理由から、火力発電所では放電や絶縁破壊が発生することがある。これら
放電や絶縁破壊は高周波パルスを生じ、これが１つ又は複数の導体に伝わる。高
品質の電力供給の確保には、これらパルスを検出し、評価する必要がある。This type of sensor is used in thermal power plants to detect high frequency voltage oscillations.
For various reasons, electric power plants may experience discharges and breakdowns. These discharges and breakdowns generate high frequency pulses that propagate to one or more conductors. These pulses must be detected and evaluated to ensure a high quality power supply.
【０００３】
かかる振動を検出するため、コンデンサを持ち、その第一端子を導体に接続し
たセンサは公知である。該コンデンサの第二端子には、単数又は複数の抵抗が付
属している。これら抵抗での電圧降下を測定し、これを高周波振動の検出に用い
る。公知のセンサは、一連の別々の部品を必要とする欠点がある。これら部品を
取り付けるための所要空間も比較的大きく、その据付けもまた費用がかかる。In order to detect such vibration, a sensor having a capacitor and having its first terminal connected to a conductor is known. A resistor or resistors are attached to the second terminal of the capacitor. The voltage drop across these resistors is measured and used to detect high frequency vibrations. Known sensors have the drawback of requiring a series of separate parts. The space required to mount these components is also relatively large and their installation is also expensive.
【０００４】
従ってこの発明の課題は、部品点数が少なく、所要空間が小さくかつ据付けが
簡単なセンサを提供することにある。Therefore, an object of the present invention is to provide a sensor having a small number of parts, a small required space, and easy installation.
【０００５】
この発明によれば、この課題は、最初に挙げた型のセンサにおいて、コンデン
サの第二端子に変流器及び測定した信号を導出するためのジャックを付属させる
ことにより解決される。According to the invention, this problem is solved in a sensor of the first type mentioned by attaching a current transformer and a jack for deriving the measured signal to the second terminal of the capacitor.
【０００６】
この発明によるセンサは公知のセンサよりも小さく、コンパクトな単位として
構成でき、それ故容易に据付け可能である。特に、別々の部品を順に組立てる必
要がもはやなく、その据付けが著しく簡単になりかつ早められる。The sensor according to the invention is smaller than the known sensors and can be constructed as a compact unit and is therefore easy to install. In particular, it is no longer necessary to assemble the separate parts in sequence, which makes installation considerably easier and faster.
【０００７】 この発明による有利な構成と改良例を、２以下の請求項に示す。[0007] Advantageous configurations and refinements according to the invention are indicated in the claims below.
【０００８】
コンデンサの第二端子には、さらに、変流器に並列接続された放電間隙を付属
させるとよい。この場合、許容できない高電圧が加わっても、放電間隙に短絡が
生じ、変流器をこの過負荷から保護できる。The second terminal of the capacitor may be further provided with a discharge gap connected in parallel with the current transformer. In this case, even if an unacceptable high voltage is applied, a short circuit occurs in the discharge gap, and the current transformer can be protected from this overload.
【０００９】
有利な改良構成においては、コンデンサの第二端子を変流器及び放電間隙を介
して接地する。この場合、コンデンサが吸収した振動は接地により除かれ、測定
した信号のみが与えられる。In a preferred refinement, the second terminal of the capacitor is grounded via the current transformer and the discharge gap. In this case, the vibrations absorbed by the capacitor are eliminated by grounding and only the measured signal is given.
【００１０】
さらに有利な構成によれば、センサは、導体に押圧すべく、コンデンサの第一
端子に接続され、弾性的に支持された部材を備えている。センサにおいて製造或
いは組立誤差が発生しても、これはこの弾性支持により補償される。According to a further advantageous configuration, the sensor comprises a resiliently supported member connected to the first terminal of the capacitor for pressing against the conductor. Any elastic or manufacturing errors in the sensor will be compensated for by this elastic support.
【００１１】
さらにまた有利な構成によれば、この部材は球状に形成され、圧縮ばねで付勢
される。球状部材の使用により、この部材と導体との間に一定の接触面積が生ず
る。押圧のために使用する圧縮ばねは、その製作及び取り付けが容易なので、製
造及び据付け費用が低下する。According to a further advantageous development, the member is spherically shaped and is biased by a compression spring. The use of a spherical member creates a constant contact area between the member and the conductor. The compression spring used for pressing is easy to manufacture and install, thus reducing manufacturing and installation costs.
【００１２】
この部材の位置は、センサ、特にセンサの長手方向に対し変位可能にするとよ
い。これに伴い、部材と導体間の押圧間隔を、各適用例に合わせるよう調整でき
る。この場合、特に一連の異なる適用例に対し、唯一のセンサが使用できる。The position of this member is preferably displaceable with respect to the sensor, especially the longitudinal direction of the sensor. Accordingly, the pressing interval between the member and the conductor can be adjusted to suit each application. In this case, only one sensor can be used, especially for a series of different applications.
【００１３】
この発明は、更に導体をシールドで取り囲んだ場合の、高周波電圧振動を検出
すべく、この導体へのセンサ、特に上述のセンサの配置構成に関する。この発明
に従い、センサは導体とシールド間の中間領域に配置される。この構成は僅少な
所要空間で足り、据付けも容易で、既存の設備への追加装備も可能である。The present invention further relates to a sensor, particularly the above-mentioned arrangement of the sensor, for detecting high frequency voltage vibration when the conductor is surrounded by a shield. According to the invention, the sensor is arranged in the intermediate region between the conductor and the shield. This structure requires only a small space, is easy to install, and can be added to existing equipment.
【００１４】
センサはシールドに固定するとよい。付加的な要素は不要であり、構造と組立
は簡単かつ安価である。The sensor may be fixed to the shield. No additional elements are required and the structure and assembly are simple and inexpensive.
【００１５】
有利な構成において、センサは測定した信号を導出すべく、シールドの外側に
配置したジャックを備える。測定信号を取り出すためのケーブルは、迅速かつ容
易にこのジャックに接続され、シールドの外部に敷設される。In an advantageous configuration, the sensor comprises a jack arranged outside the shield in order to derive the measured signal. The cable for extracting the measurement signal is quickly and easily connected to this jack and laid outside the shield.
【００１６】
有利な構成では、センサをシールドに固定した接続板に配置する。センサをこ
の接続板に予め据え付け、しかる後この接続板をシールドに固定する。これによ
り据付け速度が早まる。In an advantageous configuration, the sensor is arranged on a connecting plate fixed to the shield. The sensor is pre-installed on this connecting plate and then this connecting plate is fixed to the shield. This speeds up the installation speed.
【００１７】
シールドは、センサを固定するための装入部片を備えるとよい。この部片は既
存のシールドに後から取り付け可能なので、この発明によるセンサ及びセンサ配
置は、既存の設備に追加して組み込むことができる。The shield may comprise a charging piece for fixing the sensor. Since this piece can be retrofitted to an existing shield, the sensor and sensor arrangement according to the invention can be retrofitted into an existing installation.
【００１８】
有利な構成では、シールドは接地されている。その場合、シールドの接触を阻
止する特別な保護手段は不要である。更に、この発明に従ったコンデンサの接地
はシールドを介して行う。別設の接地ケーブルは不要である。In an advantageous configuration, the shield is grounded. In that case, no special protection means for blocking the contact of the shield is required. Furthermore, the capacitor according to the invention is grounded via a shield. No separate ground cable is required.
【００１９】 以下、この発明を図示の実施例により詳しく説明する。[0019] Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments.
【００２０】
図１は、通電導体１１と接地されたシールド１２間の中間領域１３に収納され
た、本発明によるセンサ１０を示す。センサ１０は、接点チップ１４、両側をア
ルミニウム板１６、１７で挟まれたコンデンサ１５、変流器１８及びジャック１
９を備えている。ジャック１９は、シールド１２の外側に配置されている。FIG. 1 shows a sensor 10 according to the invention housed in an intermediate region 13 between a conducting conductor 11 and a grounded shield 12. The sensor 10 includes a contact chip 14, a capacitor 15 sandwiched between aluminum plates 16 and 17 on both sides, a current transformer 18, and a jack 1.
9 is equipped. The jack 19 is arranged outside the shield 12.
【００２１】
下側アルミニウム板１７は、絶縁介挿板２３を介して接続板２０に結合してい
る。介挿板２３は、コンデンサ１５を絶縁する。固定用ボルトを概略的に示す。The lower aluminum plate 17 is joined to the connection plate 20 via an insulating interposition plate 23. The insertion plate 23 insulates the capacitor 15. The fixing bolt is shown schematically.
【００２２】
センサ１０は、接続板２０を介し装入部片２１に固定する。この装入部片２１
は、図示しないが、シールド１２に、例えば溶接で接続する。この固定は、概略
的に示したボルトによっても行える。接続板２０と装入部片２１との間に、単数
又は複数のパッキン２をシールドと振動減衰のために配置している。The sensor 10 is fixed to the charging piece 21 via the connecting plate 20. This charging piece 21
Although not shown, is connected to the shield 12 by welding, for example. This fixing can also be done by means of the bolts shown schematically. A single or a plurality of packings 2 are arranged between the connecting plate 20 and the charging piece 21 for shielding and vibration damping.
【００２３】
接点チップ１４は、矢２７に沿ってセンサ１０の長手方向２６に変位可能であ
る。この結果、接点チップ１４と導体１１との間の押圧間隔が調整できる。The contact tip 14 is displaceable in the longitudinal direction 26 of the sensor 10 along an arrow 27. As a result, the pressing interval between the contact tip 14 and the conductor 11 can be adjusted.
【００２４】
センサ１０は、中間領域１３に完全に収容されている。ジャック１９はシール
ド１２の外側から接近可能なので、他のケーブルの敷設には僅かな費用しか必要
ない。更にセンサ１０全体はコンパクトに構成され、完全に接続板２０と一緒に
予め組立てられる。装入部片２１は、既存のシールド１２に追加して装着できる
ので、この発明によるセンサ１０は僅かな費用で追加して取り付けられる。The sensor 10 is completely housed in the intermediate region 13. Since the jack 19 is accessible from the outside of the shield 12, laying other cables requires little expense. Furthermore, the entire sensor 10 is of compact construction and is completely preassembled with the connecting plate 20. Since the charging piece 21 can be additionally mounted on the existing shield 12, the sensor 10 according to the invention can be additionally mounted at a small expense.
【００２５】
図２は、使用する回路を模式的に示す。センサ１０のコンデンサ１５は、第一
端子２４を介して導体１１に接続されている。この接続は接点チップ１４を介し
て行われる。コンデンサ１５の第二端子２５には変流器１８並びにジャック１９
及び放電間隙３０が接続されている。この放電間隙３０は端子２８、２９間で変
流器１８に並列に接続されている。端子２９は接地されている。FIG. 2 schematically shows the circuit used. The capacitor 15 of the sensor 10 is connected to the conductor 11 via the first terminal 24. This connection is made via the contact tip 14. The current transformer 18 and the jack 19 are connected to the second terminal 25 of the capacitor 15.
And the discharge gap 30 is connected. The discharge gap 30 is connected in parallel to the current transformer 18 between the terminals 28 and 29. The terminal 29 is grounded.
【００２６】
導体１１で検出された電圧振動は信号を発生し、この信号はコンデンサ１５及
び変流器１８を介してジャック１９に与えられる。そこでこの信号は取り出され
て図示しない評価装置に導かれる。許容できない高負荷時には、放電間隙３０に
短絡が発生する。これにより変流器１８の損傷を確実に回避できる。The voltage oscillations detected on the conductor 11 generate a signal, which is applied to the jack 19 via the capacitor 15 and the current transformer 18. Then, this signal is taken out and guided to an evaluation device (not shown). At an unacceptable high load, a short circuit occurs in the discharge gap 30. As a result, damage to the current transformer 18 can be reliably avoided.
【００２７】
図３は、センサ１０のこの発明による配置の全体構成を模式的に示す。センサ
１０は完全に中間領域１３に収納されている。ただ装入部片２１、接続板２０及
びジャック１９はシールド１２の外側に出ている。従って、センサ１０を取り付
けるための付加的な所要空間は最小となる。FIG. 3 schematically shows the overall configuration of the arrangement according to the invention of the sensor 10. The sensor 10 is completely housed in the intermediate area 13. However, the charging piece 21, the connecting plate 20, and the jack 19 are outside the shield 12. Therefore, the additional space required to mount the sensor 10 is minimized.
【００２８】
図４は、センサ１０の接点チップ１４を拡大して示す。チップ１４は外側ケー
ス３２を備え、この中に内側ケース３２を収容している。外・内側ケース３１、
３２は、図示しないねじで結合している。内側ケース３２を外側ケース３１に対
し回すと、矢印２７の方向に、センサ１０の長手軸２６に沿う変位が行える。FIG. 4 shows the contact tip 14 of the sensor 10 on an enlarged scale. The chip 14 includes an outer case 32, and the inner case 32 is accommodated in the outer case 32. Outer / inner case 31,
32 is connected by a screw (not shown). When the inner case 32 is rotated with respect to the outer case 31, displacement along the longitudinal axis 26 of the sensor 10 can be performed in the direction of the arrow 27.
【００２９】
内側ケース３２に、圧縮ばね３４で付勢される球体３３を配置してある。球体
３３は、組み込んだ状態で導体１１に接触し、端子３５を介してコンデンサ１５
の第一端子２４に接触する。仮に導体１１に電圧振動が発生しても球体３３で吸
収され、端子３５、２４を介してコンデンサ１５に、そしてそこから変流器１８
を介しジャック１９に更に伝わる。接点チップ１４が長手軸２６の方向に矢２７
に沿って変位可能なので、押圧間隔を調整できる。球体３３を使用することで、
導体１１の部分的損傷並びに導体１１と球体３３の接触面積の拡大は回避可能で
ある。この結果、接触面積を長期にわたり実質的に一定に保時できる。A spherical body 33 biased by a compression spring 34 is arranged in the inner case 32. The spherical body 33 comes into contact with the conductor 11 in the assembled state, and the capacitor 15 is connected through the terminal 35.
To contact the first terminal 24 of. Even if a voltage oscillation occurs in the conductor 11, it is absorbed by the sphere 33, passes through the terminals 35 and 24 to the capacitor 15, and then the current transformer 18
It is further transmitted to Jack 19 via. The contact tip 14 has an arrow 27 in the direction of the longitudinal axis 26.
Since it is possible to displace along, the pressing interval can be adjusted. By using the sphere 33,
Partial damage to the conductor 11 and enlargement of the contact area between the conductor 11 and the sphere 33 can be avoided. As a result, the contact area can be kept substantially constant over a long period of time.
【００３０】
コンデンサ１５の容量と、変流器１８及び放電間隙３０の構成とは、個々の事
例に関係する。しかしコンデンサ１５の容量は、通常の場合、既存のセンサの場
合より小さく選べる。導体１１に例えば３０ｋＶの電圧がかかっているとき、従
来の１００ｎＦに対し、この発明の場合には１０ｎＦの静電容量で足りる。放電
間隙３０は、この場合４００Ｖに合わせて設計される。The capacity of the capacitor 15 and the configurations of the current transformer 18 and the discharge gap 30 relate to the individual case. However, the capacity of the capacitor 15 can usually be selected smaller than that of the existing sensor. When a voltage of, for example, 30 kV is applied to the conductor 11, a capacitance of 10 nF is sufficient in the case of the present invention as compared with the conventional 100 nF. The discharge gap 30 is designed for 400V in this case.
【００３１】
この発明によるセンサ１０はコンパクトに構成されており、迅速にかつ容易に
据付けられる。個々の構造部品の装着はもはや不要である。この発明による配置
構成により、センサ１０の取り付けに必要な空間は著しく減少する。更に既存の
設備に追加装備することも、最小の費用で可能である。The sensor 10 according to the invention is of compact construction and is quick and easy to install. The mounting of individual structural parts is no longer necessary. With the arrangement according to the invention, the space required for mounting the sensor 10 is significantly reduced. Furthermore, it is possible to add additional equipment to existing equipment at a minimum cost.
【図１】 この発明によるセンサ配置の概略構成図を示す。[Figure 1] Figure 2 shows a schematic block diagram of a sensor arrangement according to the invention.
【図２】 この発明によるセンサを含む回路を示す。[Fig. 2] 1 shows a circuit including a sensor according to the invention.
【図３】 この発明によるセンサ配置の概略全体構成図を示す。[Figure 3] 1 shows a schematic overall configuration diagram of a sensor arrangement according to the present invention.
【図４】 この発明によるセンサの接点チップの拡大図を示す。[Figure 4] Figure 3 shows an enlarged view of the contact tip of the sensor according to the invention.
１０ センサ １１ 導体 １２ シールド １３ 中間領域 １４ 接点チップ １５ コンデンサ １６、１７ アルミニウム板 １８ 変流器 １９ ジャック ２０ 接続板 ２１ 装入部片 ２２ パッキン ２３ 介挿板 ２４、２５ コンデンサの端子 ２８、２９ 変流器の端子 ３０ 放電間隙 ３１、３２ 外側ケース ３３ 弾性支持部材（球体） ３４ 圧縮ばね ３５ 接点チップの端子 10 sensors 11 conductors 12 shield 13 Intermediate area 14 contact chips 15 capacitors 16, 17 Aluminum plate 18 Current transformer 19 Jack 20 connection plate 21 charging part 22 Packing 23 Interposer 24, 25 Capacitor terminals 28, 29 Current transformer terminals 30 discharge gap 31, 32 Outer case 33 Elastic support member (sphere) 34 Compression spring 35 contact tip terminals
Claims (12)
その第一端子（２４）が導体（１１）と接続可能なコンデンサ（１５）を備え、
該コンデンサ（１５）の第二端子（２５）に、変流器（１８）と、測定した信号
を導出するジャック（１９）とが付属することを特徴とするセンサ。1. A sensor for detecting high frequency voltage vibration in a conductor (11), comprising:
The first terminal (24) comprises a capacitor (15) connectable to the conductor (11),
A sensor characterized in that a current transformer (18) and a jack (19) for deriving a measured signal are attached to a second terminal (25) of the capacitor (15).
並列接続された放電間隙（３０）が更に付属することを特徴とする請求項１記載
のセンサ。2. Sensor according to claim 1, characterized in that the second terminal (25) of the capacitor (15) is additionally provided with a discharge gap (30) connected in parallel with the current transformer (18).
放電間隙（３０）を介して接地されたことを特徴とする請求項２記載のセンサ。3. Sensor according to claim 2, characterized in that the second terminal (25) of the capacitor (15) is grounded via a current transformer (18) via a discharge gap (30).
５）の第一端子（２４）に接続され、弾性支持された部材（３３）を備えること
を特徴とする請求項１から３の１つに記載のセンサ。4. A capacitor (1) for a sensor (10) to press against a conductor (11).
Sensor according to one of claims 1 to 3, characterized in that it comprises an elastically supported member (33) connected to the first terminal (24) of 5).
付勢されたことを特徴とする請求項４記載のセンサ。5. A sensor according to claim 4, characterized in that the member (33) is spherical and is biased by a compression spring (34).
０）の長手軸（２６）方向に変位可能であることを特徴とする請求項４又は５記
載のセンサ。6. The position of the member (33) relative to the sensor (10), in particular the sensor (1).
Sensor according to claim 4 or 5, characterized in that it is displaceable in the direction of the longitudinal axis (26) of (0).
電圧振動を検出すべく、該導体（１１）に接続されたセンサ（１０）が導体（１
１）とシールド（１２）との間の中間領域（１３）に配置されたことを特徴とす
るセンサ（１０）、特に請求項１から６の１つに記載のセンサの配置構成。7. A sensor (10) connected to a conductor (11) for detecting high frequency voltage oscillations in the conductor (11) surrounded by a shield (12).
Arrangement of the sensor (10), characterized in that it is arranged in an intermediate region (13) between the (1) and the shield (12), in particular a sensor arrangement according to one of claims 1 to 6.
する請求項７記載の配置構成。8. Arrangement according to claim 7, characterized in that the sensor (10) is fixed to the shield (12).
外側に配置されたジャック（１９）を備えることを特徴とする請求項７又は８記
載の配置構成。9. Arrangement according to claim 7 or 8, characterized in that the sensor (10) comprises a jack (19) arranged outside the shield (12) for deriving the measurement signal.
２０）に配置されたことを特徴とする請求項７から９の１つに記載の配置構成。10. A connecting plate () comprising a sensor (10) fixed to a shield (12).
20) Arrangement according to one of claims 7 to 9, characterized in that it is arranged.
（２１）を備えることを特徴とする請求項７から１０の１つに記載の配置構成。11. Arrangement according to one of claims 7 to 10, characterized in that the shield (12) comprises a charging piece (21) for fixing the sensor (10).
ら１１の１つに記載の配置構成。12. Arrangement according to one of claims 7 to 11, characterized in that the shield (12) is grounded.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19949172.0 | 1999-10-12 | ||
| DE19949172 | 1999-10-12 | ||
| PCT/DE2000/003318 WO2001027639A1 (en) | 1999-10-12 | 2000-09-22 | Sensor for detecting high-frequency oscillations of a voltage and an arrangement of a sensor |
| US10/120,805 US6734698B2 (en) | 1999-10-12 | 2002-04-11 | Radio frequency oscillation detector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003511704A true JP2003511704A (en) | 2003-03-25 |
Family
ID=30116758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001530598A Pending JP2003511704A (en) | 1999-10-12 | 2000-09-22 | Sensor for detecting high-frequency voltage oscillation and sensor arrangement |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6734698B2 (en) |
| EP (1) | EP1221056B1 (en) |
| JP (1) | JP2003511704A (en) |
| CN (1) | CN1165772C (en) |
| WO (1) | WO2001027639A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2974418B1 (en) | 2011-04-20 | 2013-05-31 | Commissariat Energie Atomique | OSCILLATION DETECTOR |
| CN102773699B (en) * | 2012-07-25 | 2016-08-10 | 浙江旷达纺织机械有限公司 | A kind of harness cord thread compressing structure for apparatus for assembling harness cord |
| CN103344797A (en) * | 2013-07-04 | 2013-10-09 | 国家电网公司 | GIS ultrasonic sensor universal clamping device |
| ES2819188T3 (en) * | 2014-09-10 | 2021-04-15 | Siemens Energy Global Gmbh & Co Kg | RC voltage dividers used in a common GIS gas compartment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0312050A2 (en) * | 1987-10-14 | 1989-04-19 | Hydro-Quebec | High voltage measuring circuit coupled to the capacitive grounding tap bushing of an HV device |
| JPH02278161A (en) * | 1989-04-19 | 1990-11-14 | Fujitsu Ltd | Measuring contact probe |
| JPH0627139A (en) * | 1992-04-13 | 1994-02-04 | Towa Kogyo Kk | Contact probe and electric connector using same |
| JPH0921842A (en) * | 1995-07-10 | 1997-01-21 | Kansai Electric Power Co Inc:The | Device and method for detecting internal partial-discharge of capacitive instrument transformer |
| JPH09113541A (en) * | 1995-10-16 | 1997-05-02 | Nissin Electric Co Ltd | Voltage detecting device |
| US5641315A (en) * | 1995-11-16 | 1997-06-24 | Everett Charles Technologies, Inc. | Telescoping spring probe |
| JPH118003A (en) * | 1997-06-13 | 1999-01-12 | Sony Corp | Contact type connection device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE257904C (en) * | ||||
| DD257904A1 (en) * | 1987-03-02 | 1988-06-29 | Zeiss Jena Veb Carl | TASTSONDE FOR CHECKING PCB |
| US6285538B1 (en) * | 1996-02-20 | 2001-09-04 | General Electric Company | Partial discharge coupler |
| US6362709B1 (en) * | 1999-12-21 | 2002-03-26 | Andrew Corporation | Broadband tap for extracting energy from transmission lines using impedance transformers |
-
2000
- 2000-09-22 JP JP2001530598A patent/JP2003511704A/en active Pending
- 2000-09-22 CN CNB008141568A patent/CN1165772C/en not_active Expired - Fee Related
- 2000-09-22 EP EP00979375A patent/EP1221056B1/en not_active Expired - Lifetime
- 2000-09-22 WO PCT/DE2000/003318 patent/WO2001027639A1/en active IP Right Grant
-
2002
- 2002-04-11 US US10/120,805 patent/US6734698B2/en not_active Expired - Lifetime
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0312050A2 (en) * | 1987-10-14 | 1989-04-19 | Hydro-Quebec | High voltage measuring circuit coupled to the capacitive grounding tap bushing of an HV device |
| JPH02278161A (en) * | 1989-04-19 | 1990-11-14 | Fujitsu Ltd | Measuring contact probe |
| JPH0627139A (en) * | 1992-04-13 | 1994-02-04 | Towa Kogyo Kk | Contact probe and electric connector using same |
| JPH0921842A (en) * | 1995-07-10 | 1997-01-21 | Kansai Electric Power Co Inc:The | Device and method for detecting internal partial-discharge of capacitive instrument transformer |
| JPH09113541A (en) * | 1995-10-16 | 1997-05-02 | Nissin Electric Co Ltd | Voltage detecting device |
| US5641315A (en) * | 1995-11-16 | 1997-06-24 | Everett Charles Technologies, Inc. | Telescoping spring probe |
| JPH118003A (en) * | 1997-06-13 | 1999-01-12 | Sony Corp | Contact type connection device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1165772C (en) | 2004-09-08 |
| WO2001027639A1 (en) | 2001-04-19 |
| US20030193325A1 (en) | 2003-10-16 |
| US6734698B2 (en) | 2004-05-11 |
| EP1221056B1 (en) | 2005-08-17 |
| EP1221056A1 (en) | 2002-07-10 |
| CN1378649A (en) | 2002-11-06 |
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