JP2003280744A - Vibration control device and method, exposure device having the same device and manufacturing method of semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To position a controlling object in high precision by suppressing an elastic vibration existing in the controlling object. <P>SOLUTION: The vibration control device is characterized by being equipped with: linear motors 46, 49 for driving a micromotion stage 100, laser measuring instruments 51a, 51b for measuring positions of the micromotion stage 100, an acceleration sensor S for measuring variation near the position where the linear motors 46, 49 make driving force act on the micromotion stage 100, an compensators 11a, 11b for controlling the linear motors 46, 49 in a way to drive the micromotion stage 100 with the vibration of the micromotion stage 100 reduced based on measurement results of the leaser measuring instruments 51a, 51b and the acceleration sensor S. The device suppresses the elastic vibration of the micromotion stage 100 so as to position the micromotion stage 100 in high precision. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vibration control apparatus and a control method therefor, and an exposure apparatus and a semiconductor device manufacturing method having the vibration control apparatus.

[0002]

2. Description of the Related Art In the field of semiconductor device manufacturing,
2. Description of the Related Art There is known an exposure apparatus provided with a wafer stage for mounting and positioning a substrate such as a wafer. With the miniaturization of the exposure line width in the exposure apparatus, the position control accuracy required for the wafer stage of the exposure apparatus has reached the order of several nm. From the viewpoint of improving productivity, the moving acceleration and moving speed of the stage tend to increase year by year. Further, in order to realize such high-speed and high-accuracy position control of the wafer stage, the position control system of the wafer stage needs to have a high servo band. By realizing a high servo band, it is possible to obtain a system that has high responsiveness to the target value and is robust against the influence of disturbance and the like. Therefore, it is desired to design a wafer stage having a servo band as high as possible and an apparatus having the same.

FIG. 7 is a schematic diagram showing the structure of a wafer stage of a conventional exposure apparatus. In the following, the three translational axes (X, Y, Z) with respect to the reference coordinate system and the three rotational axes (θx, θy, θz) around the three translational axes are collectively referred to as 6 degrees of freedom. The configuration and operation of a conventional wafer stage position control system will be described with reference to FIG.

This wafer stage is a Y linear motor that generates a driving force (thrust) in the Y direction along a surface plate 41 supported from a floor F via a damper and a fixed guide 42 fixed to the surface plate 41. 46, a Y stage 4 that can be moved in the Y direction on the reference surface of the surface plate 41 by a Y linear motor 46.
3, the X stage 45 and the like guided in the X direction by the X direction guide provided on the Y stage 43.

The Y stage 43 has a driving force (thrust) in the X direction.
An X linear motor stator (not shown) for generating is driven, and the X stage 45 is driven in the X direction together with the X linear motor mover (not shown) provided on the X stage 45. The surface plate 41, the X guide, and the X stage 45 are connected by air via an air pad 44c, which is a static pressure bearing, and are not in contact with each other. Surface plate 41 and fixed guide 4
The 2 and Y stage 43 are also air-coupled via air pads 44a and 44b, which are static pressure bearings, and are not in contact.

A tilt stage 48 is mounted on the X stage 45. The tilt stage 48 is moved in the Z direction by a driving force (thrust) by a linear motor (not shown) and is rotated in three axes (θ
Rotation in the (x, θy, θz) direction is performed. Tilt stage 4
A wafer 53, which is an object to be exposed, is held on the wafer 8. Further, on the stage substrate 49 on the tilt stage 48, a measurement mirror 50 used for position measurement in the X direction and the Y direction is provided.

In this exposure apparatus, the wafer stage performs six-degree-of-freedom positioning in the in-plane direction (X, Y, θz) and the vertical direction (Z, θx, θy) with respect to the reference surface of the surface plate 41. Each time, exposure for one chip is performed. The position in the in-plane direction (X, Y, θz) is measured using a laser interferometer 51 integrated with a lens barrel (not shown), and the position in the vertical direction (Z, θx, θy) is integrated with the lens barrel. The position of the Z direction and the angle of the rotation component are measured by the optimized alignment measuring system (not shown).

In FIG. 7, the laser interferometer 51 is connected to the surface plate 41 on the assumption that the lens barrel and the surface plate 41 are integrated. Although the measurement system in the Z direction is omitted, it is possible to measure the position in the vertical direction (Z, θx, θy) by measuring three points on the stage substrate 49 or the wafer 53 from the lens barrel.

Positioning with these 6 degrees of freedom is realized by configuring servo systems on the 6 axes respectively. Based on the position information measured by the laser interferometer 51, a compensator (not shown) is an actuator for driving the stage substrate 49 in the X and Y directions.
Drive command values for the linear motor and the Y linear motor 46 in the Y direction are calculated and sent to each linear motor. This drives the X stage 45 and the Y stage 43. The compensator also adjusts the tilt stage 48 according to the position in the Z direction, the angle in the rotation direction (θx, θy), and the measured value in the θz direction.
Is calculated, and the tilt stage 48 is driven.

By configuring the position control system in this way, the wafer stage can move the controlled object to a given target position.

In the manufacture of semiconductor devices, as the exposure line width is reduced, the wafer stage included in the exposure apparatus is required to have high position control accuracy. Further, the exposure apparatus is required to have high throughput from the viewpoint of productivity.
In order to meet these requirements, it is necessary that the position control system (servo system) of the wafer stage has high responsiveness and that the stage substrate can be driven at high speed.

Therefore, in the conventional wafer stage, in order to improve the position control accuracy, the gain of the position control system is set as high as possible to realize a high servo band.

[0013]

However, even if the gain of the position control system (servo system) is set high,
The upper limit is restricted by the oscillation of the servo system. In particular, elastic vibration of the mechanical system existing in the control loop is a major factor.

Specifically, since elastic vibration exists on the stage substrate (top plate) or the like, the servo system may become unstable, or the control error may increase and the control specifications may not be satisfied. . Normally, the servo band is limited to about 1/3 to 1/4 of the lowest resonance frequency of this elastic vibration. As a result, in the position control system of the conventional positioning device, the servo band of the position control system is limited by the resonance frequency of the elastic vibration generated when driving the controlled object (for example, the stage substrate).

Therefore, in order to realize a higher servo band, it is necessary to increase the resonance frequency of the elastic vibration or attenuate the elastic vibration. Therefore, measures such as increasing the rigidity of the controlled object including the stage substrate, reducing the mass of the controlled object, and increasing the damping property of elastic vibration have been taken. However, there is a limit to mechanical means such as weight reduction, high rigidity, and high damping of the controlled object including the stage substrate.

Attempts have also been made to increase the servo band by modeling the controlled object including the elastic region, but the measured position of the controlled object and the position where the driving force for driving the controlled object is applied. In most cases, is fixed, and there is a problem that it is difficult to model a controlled object whose measurement position continuously changes, such as a wafer stage.

Therefore, the present invention has been made in view of the above problems, and it is an object of the present invention, for example, to position an object to be controlled with high accuracy by suppressing elastic vibration existing in the object to be controlled. .

[0018]

The first aspect of the present invention is as follows.
Related to a vibration control device, a driver that drives a controlled object, a position measuring device that measures the position of the controlled object, and a vibration that measures vibration in the vicinity of a position where the driver applies a driving force to the controlled object. A measuring instrument; and a compensator for controlling the driver so as to drive the controlled object while reducing the vibration of the controlled object based on the measurement results of the position measuring device and the vibration measuring device. Characterize.

According to a preferred embodiment of the present invention, the position measuring device measures the position of the controlled object in a predetermined direction, and the vibration measuring device measures the vibration of the controlled object in the predetermined direction. To do.

According to a preferred embodiment of the present invention, the compensator controls the driver so as to reduce the vibration of the controlled object based on the velocity component of the vibration.

According to a preferred embodiment of the present invention, the compensator includes a fourth order low pass filter.

According to a preferred embodiment of the present invention, the driver has a linear motor.

According to a preferred embodiment of the present invention, the driver is configured to generate a first force for driving the controlled object at a target position, and a vibration of the controlled object. A vibration control driver that produces a second force for reducing.

According to a preferred embodiment of the present invention, the compensator controls the position control driver so as to drive the controlled object to a target position based on the measurement result of the position measuring device. A position compensator and a vibration compensator that controls the vibration control driver to drive the control target so as to reduce the vibration of the control target based on the measurement result of the vibration measuring device.

According to a preferred embodiment of the present invention, the vibration compensator includes a fourth-order low pass filter.

According to a preferred embodiment of the present invention, the vibration compensator controls the vibration control driver so as to reduce the vibration of the controlled object based on the velocity component of the vibration.

According to a preferred embodiment of the present invention, at least one of the position control driver and the vibration control driver.
One has a linear motor.

According to a preferred embodiment of the present invention, the controlled object is connected to another structure by an elastic body.

According to a preferred embodiment of the present invention, the controlled object has 6 degrees of freedom.

A second aspect of the present invention relates to an object control method, which includes a driving step of driving the object, a position measuring step of measuring the position of the object, and a driving force acting on the object in the driving step. A vibration measuring step of measuring vibration in the vicinity of a position, and a compensating step of controlling to drive the object while reducing the vibration of the object based on the measurement result of the position measuring step and the vibration measuring step. It is characterized by including.

A third aspect of the present invention relates to an exposure apparatus,
An optical system for projecting exposure light applied to a pattern-formed original onto a substrate, and a stage device for holding and positioning the substrate or the original, the stage device includes a stage and a controlled object. A driving device for driving, a position measuring device for measuring the position of the controlled object, a vibration measuring device for measuring vibration in the vicinity of a position where the driving device applies a driving force to the controlled object, the position measuring device, and And a compensator for controlling the driver so as to drive the controlled object while reducing the vibration of the controlled object based on the measurement result of the vibration measuring device.

A fourth aspect of the present invention relates to a method for manufacturing a semiconductor device, which is a method for manufacturing a semiconductor device,
A coating step of coating a substrate with a photosensitive material, an exposure step of transferring a pattern to the substrate coated with the photosensitive material in the coating step using the exposure apparatus according to claim 14, and the exposure step And a developing step of developing the photosensitive material on the substrate on which the pattern is transferred.

[0033]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment 1) FIG. 1 is a diagram showing the configuration of a vibration control device according to a preferred embodiment of the present invention. Hereinafter, the configuration of a high-speed and high-precision vibration control device and its control method will be described with reference to FIG.

This vibration control device measures the position of the control target in a predetermined direction by a driver (for example, a linear motor) that applies a driving force for driving the control target (for example, a fine movement stage) to the control target. Position measuring device (for example, laser interferometer, alignment measuring system), vibration measuring device (for example, acceleration sensor) that measures vibration in the vicinity of a position on the controlled object to which driving force is applied by the driving device, position measuring device, and vibration measuring device Compensators 11a and 11b that control the driver to drive the controlled object based on the measurement result of at least one of

The surface plate 41 is supported from the floor F via a damper (not shown). The Y stage 43 is a Y linear motor (actuator) 46 that generates a driving force (thrust) in the Y direction along a fixed guide 42 fixed to the surface plate 41.
Thus, it is possible to move in the Y direction on the reference surface of the surface plate 41. The surface plate 41, the fixed guide 42, and the Y stage 43 are connected by air via air pads 44a and 44b, which are static pressure bearings, and are not in contact with each other. Y stage 4
3 is provided with an X guide 47 in the X direction, and the Y stage 4
The X stage 45 mounted on the No. 3 is guided in the X direction. Further, the Y stage 43 is provided with a stator of an X linear motor (actuator) 49 that generates a driving force in the X direction, and drives the X stage 45 in the X direction together with the mover provided in the X stage 45. The surface plate 41, the X guide 47, and the X stage 45 are air pads 4 that are hydrostatic bearings.
It is connected by air through 4c and is non-contact.

A fine movement stage 100 is mounted on the X stage 45. The fine movement stage 100 is a driving force (thrust) by a plurality of linear motors acting in the XY directions.
The movement in the Y direction and the rotation in the θz direction are performed, and the movement in the Z direction and the rotation in the θx and θy directions are performed by the driving force (thrust) of a plurality of linear motors acting in the Z direction. Cx1,
Cx2, Cy1 and Cy2 are X and Y linear motor stators in the XY directions, Cz1, Cz2 and Cz3 are linear motor stators in the Z direction, Mx1, Mx2, My1, My2 and Mz.
1, Mz2 and Mz3 are linear motor movers corresponding to the respective units. In this embodiment, the coil through which the current flows is set to the fixed side and the permanent magnet is set to the movable side, but the effect is the same regardless of this combination. Fine movement stage 10
A wafer 53 to be exposed is held on 0, and
The fine movement stage 100 is provided with measurement mirrors 50a and 50b used for position measurement in the X and Y directions.

In this exposure apparatus, the wafer stage moves in the in-plane directions (X, Y, θ) with respect to the reference surface of the surface plate 41.
z) and 6 degrees of freedom in the vertical direction (Z, θx, θy) are positioned, and the wafer is exposed for one chip each time. The positions in the in-plane direction (X, Y, θz) are laser interferometers 51a, 5a that are integrated with the lens barrel (not shown).
In the vertical direction (Z, θx, θy), the alignment measurement system (not shown) integrated with the lens barrel measures the position in the Z direction and the angle of the rotation component. Further, linear motor movers Mx1, Mx2, Mx1, My2, My1, fixed to the fine movement stage 100,
Acceleration sensors Sx1, Sx2, Sy are provided near Mz2, Mz3 (hereinafter, these are represented as M).
1, Sy2, Sz1, Sz2, and Sz3 (hereinafter, these are represented as S) are arranged so that the acceleration of the fine movement stage 100 in the acting direction of the driving force (thrust) can be detected. As a result, the acceleration sensor S can measure vibration near the position on the fine movement stage 100 where the linear motor mover M exerts a driving force (thrust). In addition, Mx1, My2, Mz1, Sx1, Sy2,
Sz1 is not shown due to restrictions in drawing.

In FIG. 1, assuming that the lens barrel and the surface plate 41 are integrated, the laser interferometers 51a and 51b are connected to the surface plate 41. However, the lens barrel and the surface plate 41 are connected to each other. 41 is different from the laser interferometers 51a and 51b.
Even if it is connected to the lens barrel, the effect of this embodiment does not change. Although the measurement system in the Z direction is omitted, the vertical direction (Z, θ) can be obtained by measuring three points on the fine movement stage 100 substrate or the wafer 53 from the lens barrel.
x, θy) can be measured. Positioning with 6 degrees of freedom is performed by configuring a servo system for each of the 6 axes. The compensator 1 is based on the measurement result of the position information of the laser interferometers 51a and 51b and the measurement result of the position information in the vertical direction of the alignment measurement system (not shown).
1a and 11b control each linear motor so as to drive the fine movement stage 100. That is, the compensators 11a, 1
1b calculates a command value to each linear motor, and each linear motor drives the fine movement stage 100 in arbitrary directions of six axes according to the command value. The compensator that operates based on the measurement result of the acceleration sensor S will be described later. Also, X
The stage and the Y stage are separately driven in the X and Y directions according to the position information measured by the position measuring means (not shown).

Next, a method for controlling the vibration control device according to the preferred embodiment of the present invention will be described.

FIG. 2 is a block diagram of a control system of the vibration control device according to the preferred embodiment of the present invention. This control system uses the position control loop 1 based on the measurement result of the position information measured by the laser interferometers 51a and 51b and the tilt measurement result, and the measurement result by the acceleration sensor S arranged near the linear motor mover M. And a vibration control loop 2 based on it. The position compensator 11 includes a coordinate conversion unit and a general PID controller, and the vibration compensator 21 includes a converter that first-order integrates acceleration to convert it into velocity. The acceleration sensor S detects a response (for example, acceleration) in the acting direction of the driving force (thrust) near the linear motor mover M fixed to the fine movement stage (stage substrate) 100, and the linear motor drives the driving force (thrust). Fine movement stage 1
The vibration near the position on 00 is measured. Acceleration sensor S
Typically detects absolute variation rather than relative variation from some reference. The advantage of the acceleration speed sensor S detecting the absolute fluctuation will be described later. If a certain reference does not include a vibration component, the value of a relative fluctuation detector such as a linear encoder or an electrostatic sensor may be used as the reference. Further, the converter of the vibration compensator 21 is not necessarily required to have the function of integrating the DC component because the speed information of the target elastic vibration may be obtained, and the information source (for example, the acceleration sensor S) is the displacement sensor. In some cases, the function of differentiation is required to calculate the speed. The driver 15 is based on the command value calculated by the position compensator 11 and the vibration compensator 21,
In order to apply a driving force for driving the fine movement stage 100 in a predetermined direction to the fine movement stage 100, a drive current is supplied to a coil of a linear motor stator (not shown) to move the linear motor fixed to the fine movement stage 100. The child M is driven in a predetermined direction.

Next, the position control loop and the vibration control loop of this control system will be described.

First, the control characteristics of the position control loop will be described. Assuming that a position at which a linear motor (for example, a linear motor stator Cx1 and a linear motor mover Mx1) applies a driving force to the fine movement stage 100 is a, a measurement position u of a certain laser interferometer 51a, 51b is reached. The force-displacement transfer characteristic of is expressed by equation (1) in terms of vibration engineering, and the gain phase diagram of the transfer characteristic is shown in FIG. 3a.

[0043]

[Formula 1] Since the position a where the linear motor applies the driving force and the measurement position u of the laser interferometers 51a and 51b are not the same (collocation is not established), the phase is usually 18
Delay by 0 degrees or more. Further, laser interferometers 51a and 51b
Since the measurement position u of (1) changes within the movable range of the fine movement stage 100, the transfer characteristic also largely changes.

Therefore, the response frequency of only the position control loop remains at F0.

Next, the control characteristics of the vibration control loop will be described. The force-displacement transfer characteristic from the linear motor (acting position is a) to the measurement point of the acceleration sensor S (measurement position is a) is expressed by the equation (2), and the gain phase diagram of the transfer characteristic is shown in the figure. 3b.

[0046]

[Formula 2] Since the position a where the linear motor applies the driving force and the measurement position a of the acceleration sensor S are exactly the same (collocation is established), the phase is not delayed by 180 degrees or more. Further, since the positional relationship between the two is fixed, the transfer characteristic does not change. Therefore, the vibration control loop is stable, and the gain of the speed feedback control system can be increased. As a result, by using this vibration control loop, the control characteristic of the position control can obtain the characteristic as shown in FIG. 3C, and the response frequency dramatically increases to F1.

(Second Embodiment) As shown in FIG. 4, an embodiment using different linear motors for the position control loop and the vibration control loop will be described.

In the first embodiment, the position control loop and the vibration control loop use a common linear motor. But,
If a driving force (thrust) is applied to almost the same place, it is not always necessary to use a common linear motor.
For example, as shown in FIG. 4, a coil c having a large number of turns and a coil c ′ having a small number of turns are arranged in parallel, and a large driving force for driving a controlled object (for example, a fine movement stage) to a target position in a predetermined direction. The position control loop (using the coil c) that requires (generated force) and the driving force (generated force) for canceling the vibration of the controlled object (for example, the fine movement stage) may be weak, but a high servo band is required. A linear motor that is independent of the vibration control loop (using the coil c ') may be configured. in this case,
In particular, it is desirable that the current characteristics of the vibration control loop have a high servo band because interference occurs between the coils.

(Third Embodiment) As shown in FIG. 5, an embodiment using a low-pass filter in a control loop will be described.

According to the first and second embodiments, it is expected that the vibration control loop has a high servo band, but (1) the action point of the driving force and the measurement point of the acceleration may not match (2) the detection characteristic Also, by further considering the two points in which a phase delay occurs due to the response limit, a more accurate control system can be realized.

Therefore, as shown in FIG. 5, a low pass filter 22 having a high cutoff characteristic is further provided in the control loop. In particular, it is the 4th-order filter that has a notable effect in accordance with the notch portion of the control characteristic. The method and effect of the fourth-order low-pass filter will be shown below.

FIG. 6 is a diagram showing an example of calculation of control characteristics when the vibration control loop is special. It is assumed that the velocity feedback alone causes an unexpected mode oscillation at a high frequency, so that the gain cannot be increased as expected. Therefore, a fourth-order filter having an appropriately high Q matched to the frequency Fn of the notch that is always present in the control characteristic is inserted. In addition, it is theoretically proved that a notch always exists between the peaks of the low frequency mode in a system in which collocation is almost established. By using a fourth-order filter having an appropriately high Q, it is possible to maintain the stability of each peak even in the band (1) where the phase around the band is lower than Fn is small and (2) the band is higher than Fn.

(3) Since advantages such as excellent high-frequency cutoff characteristics are obtained, each mode can be cut off in the high frequency range in a stable state, and the speed feedback gain can be increased.

As a result, as shown in FIG. 6, a high effect which cannot be obtained by the conventional technique is obtained.

(Embodiment 4) Another embodiment of the elastic vibration control device according to the preferred embodiment of the present invention will be described.

As described in the first embodiment, the elastic vibration control device according to the preferred embodiment of the present invention drives the fine movement stage 100 having six-axis degrees of freedom by driving the linear motor 46,
I'm at 49. This elastic vibration control device may be configured by a fine movement stage 100 that is connected to another structure by an elastic body (for example, a weak spring). In the first embodiment, the fine movement stage 100 is moved to another structure (for example, the x stage 4) by using the weak spring in the present embodiment.
5) can be connected. The weak spring may be, for example, an air spring or a magnetic spring.

(Other Embodiments) FIG. 8 is a conceptual diagram of an exposure apparatus used when the vibration control apparatus of the present invention is applied to a semiconductor device manufacturing process. In FIG. 8, the light emitted from the illumination optical system 81 is projected onto the reticle 82 that is the original plate. The reticle 82 is held on the reticle stage 83, and the pattern of the reticle 82 is
The reduction projection lens 84, which is reduced and projected at the magnification of the reduction projection lens 84 to form a reticle pattern image on its image plane.
The image plane of is perpendicular to the Z direction. A resist is applied to the surface of the substrate 85 which is a sample to be exposed,
Shots formed in the exposure process are arranged. The substrate 85 is placed on the substrate stage 86. The substrate stage 86 includes a chuck that fixes the substrate 85, an XY stage that is horizontally movable in the X-axis direction and the Y-axis method, and the like. The position information of the substrate stage 86 is constantly measured by the substrate stage interferometer 88 with respect to the mirror 87 fixed to the substrate stage 86. The vibration control device 80 according to the preferred embodiment of the present invention generates a control signal based on a position signal output from the substrate stage interferometer 88 and controls the position of the substrate stage 86.

FIG. 9 is a flow chart of the overall manufacturing process of a semiconductor device using the above exposure apparatus. In step 1 (circuit design), the circuit of the semiconductor device is designed. In step 2 (mask making), a mask is made based on the designed circuit pattern. On the other hand, in step 3 (wafer manufacturing), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the mask and wafer described above. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip by using the wafer manufactured in step 4, and an assembly process (dicing, bonding),
It includes an assembly process such as a packaging process (chip encapsulation). In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. Through these steps, the semiconductor device is completed,
This is shipped (step 7).

FIG. 10 shows a detailed flow of the wafer process. In step 11 (oxidation), the surface of the wafer is oxidized. In step 12 (CVD), an insulating film is formed on the wafer surface. In step 13 (electrode formation), electrodes are formed on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted in the wafer. In step 15 (resist processing), a photosensitive agent is applied to the wafer.
In step 16 (exposure), the wafer is precisely moved using the above-mentioned exposure apparatus to transfer the circuit pattern onto the wafer. In step 17 (development), the exposed wafer is developed. In step 18 (etching), parts other than the developed resist image are removed. In step 19 (resist stripping), the resist that is no longer needed after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer.

[0060]

According to the present invention, for example, by suppressing the elastic vibration existing in the controlled object, the controlled object can be positioned with high accuracy.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of a vibration control device according to a preferred embodiment of the present invention.

FIG. 2 is a block diagram of a control system of the vibration control device according to the preferred embodiment of the present invention.

FIG. 3 is a gain phase diagram of transfer characteristics in the control system of FIG.

FIG. 4 is a diagram showing an embodiment in which different linear motors are used for the position control loop and the vibration control loop in the vibration control device according to the preferred embodiment of the present invention.

FIG. 5 is a diagram showing an embodiment in which a low-pass filter is used in a control loop in the vibration control device according to the preferred embodiment of the present invention.

FIG. 6 is a diagram showing an example of control characteristic calculation in a special case of a vibration control loop.

FIG. 7 is a schematic diagram showing a configuration of a wafer stage of a conventional exposure apparatus.

FIG. 8 is a diagram showing an exposure apparatus using a vibration control device according to a preferred embodiment of the present invention.

FIG. 9 is a diagram showing a flow of an overall manufacturing process of a semiconductor device.

FIG. 10 is a diagram showing a detailed flow of a wafer process.

[Explanation of Codes] 1: Position control loop, 2: Vibration control loop, 11: Position compensator, 21: Vibration compensator, 22: Filter, M: Linear motor mover, C: Linear motor stator, S: Acceleration Sensor, 100: Fine movement stage, 50: Measuring mirror, 5
1a, b: laser interferometer

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI Theme Coat (reference) H02P 7/00 101 H01L 21/30 503F 5H540 503A (72) Inventor Hirohito Ito 3-30 Shimomaruko, Ota-ku, Tokyo No. 2 Canon Inc. F-term (reference) 2F069 AA01 BB15 CC06 DD09 DD12 EE03 GG04 GG07 GG59 HH09 JJ15 MM23 MM34 NN04 2F078 CA02 CA08 CB05 CB13 CC07 CC15 3J048 AA07 AB07 AB11 AD01 CB23 BA03 CC02 BA03 CC02 BA01 DA23 CB21 BA01 DA06 DA07 DB05 DC05 DC12 5H303 AA06 BB03 BB09 BB14 CC01 DD04 DD21 FF03 GG13 HH01 HH07 JJ04 KK02 KK03 KK04 5H540 AA10 BA03 BB01 BB06 BB09 EE05 EE06 FA14 FC10

Claims (15)

[Claims] 1. A driver for driving a controlled object, a position measuring device for measuring the position of the controlled object, and a vibration measurement for measuring vibration in the vicinity of a position where the driver applies a driving force to the controlled object. And a compensator that controls the driver so as to drive the controlled object while reducing the vibration of the controlled object based on the measurement results of the position measuring device and the vibration measuring device. A characteristic vibration control device. 2. The position measuring device measures the position of the controlled object in a predetermined direction, and the vibration measuring device measures the vibration of the controlled object in the predetermined direction. The vibration control device described. 3. The compensator controls the driver so as to reduce the vibration of the controlled object based on the velocity component of the vibration.
The vibration control device described in. 4. The vibration control device according to claim 1, wherein the compensator includes a fourth-order low-pass filter. 5. The vibration control device according to claim 1, wherein the driver has a linear motor. 6. The position control driver for generating a first force for driving the controlled object at a target position, and the second driver for generating a second force for reducing vibration of the controlled object. The vibration control device according to claim 1, further comprising: 7. The position compensator for controlling the position control driver so as to drive the controlled object to a target position based on the measurement result of the position measuring device, and the compensator of the vibration measuring device. 7. A vibration compensator that controls the vibration control driver so as to drive the controlled object so as to reduce the vibration of the controlled object based on the measurement result. Vibration control device. 8. The vibration control device according to claim 7, wherein the vibration compensator includes a fourth-order low-pass filter. 9. The vibration compensator controls the vibration control driver so as to reduce the vibration of the controlled object, based on the velocity component of the vibration. The vibration control device described. 10. The vibration control device according to claim 6, wherein at least one of the position control driver and the vibration control driver has a linear motor. 11. The vibration control device according to claim 1, wherein the controlled object is connected to another structure by an elastic body. 12. The vibration control device according to claim 1, wherein the controlled object has 6 degrees of freedom. 13. A method of controlling an object, comprising a driving step of driving the object, a position measuring step of measuring a position of the object, and a vibration in the vicinity of a position where a driving force acts on the object in the driving step. And a compensation step of controlling so as to drive the object while reducing the vibration of the object based on the measurement result of the position measuring step and the vibration measuring step. Control method of the object. 14. An optical system for projecting exposure light applied to a patterned original onto a substrate, and a stage device for holding and positioning the substrate or the original, the stage device comprising: A stage, a driver for driving the controlled object, a position measuring device for measuring the position of the controlled object, and a vibration measuring device for measuring vibration in the vicinity of a position where the driver applies a driving force to the controlled object. And a compensator for controlling the driver so as to drive the controlled object while reducing the vibration of the controlled object based on the measurement results of the position measuring device and the vibration measuring device, Exposure equipment. 15. A method of manufacturing a semiconductor device, comprising: applying a photosensitive material onto a substrate; and applying the exposure apparatus according to claim 14 to the substrate coated with the photosensitive material in the applying step. And a developing step of developing the photosensitive material on the substrate on which the pattern is transferred in the exposing step, and a developing step.