JP2003273259A - Semiconductor device and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device and its manufacturing method wherein it has a flip-chip connection structure and a plate member is bonded to the back surface of its semiconductor chip. <P>SOLUTION: The semiconductor device has a semiconductor chip having externally connecting electrodes, a wiring board for subjecting the semiconductor chip to a flip-chip connection therewith via the externally connecting electrodes, a plate member provided on the opposite side of the semiconductor chip to the side of providing the wiring board which has inclined edge surfaces to both side surfaces of the semiconductor chip, and a bonding layer whereby the semiconductor chip and the plate member are bonded to each other. Since the plate member provided on the back surface of the semiconductor chip via the bonding layer has the inclined edge surfaces on both the side surfaces of the semiconductor chip, filets formed by the bonding layer which are extruded from the back surface of the semiconductor chip are easy to be formed between the inclined edge surfaces and both the side surfaces of the semiconductor chip. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having a flip chip connection structure and a plate member attached to the back surface of the semiconductor chip for the purpose of protecting the semiconductor device, and a method for manufacturing the same, and more particularly to reliability during use. TECHNICAL FIELD The present invention relates to a semiconductor device suitable for improving the property and a manufacturing method thereof.

[0002]

2. Description of the Related Art A semiconductor device having a flip chip connection structure in which a plate member is attached to the back surface of a semiconductor chip for the purpose of protecting the semiconductor chip is shown in FIG.
Will be described with reference to. This figure is a diagram for explaining the structure and manufacturing method of such a semiconductor device.

FIG. 6A is a schematic view showing in cross section an example of a structure in which a semiconductor chip 63 is flip-chip connected to a wiring board 61. That is, the pads 64 for external connection are formed on the functional surface of the semiconductor chip 63, and the bump electrodes 65 (bumps) are formed in advance on the pads 64. The protruding electrode 65 is aligned and brought into contact with a land 62 for connecting a semiconductor chip formed on the surface of the wiring board 61, and is electrically and mechanically joined by further heating and pressing.

The gap between the semiconductor chip 63 and the wiring board 61 is then filled with a filling resin 66 (underfill resin) in a liquid state, whereby the electrical / mechanical connection portion is shielded from the atmosphere and sealed. To be done. Filling resin 66 in liquid state
Is further cured, for example by heat. Here, the filling resin 6
6 is usually formed so as to protrude from between the semiconductor chip 63 and the wiring board 61 in order to obtain a sufficient filling state and mechanical strength. The protruding portion 66a is called a fillet (hereinafter referred to as a fillet 66a).

In the semiconductor device having such a flip-chip connection structure, in order to protect the semiconductor chip 63, dissipate heat, and prevent warpage of the entire connection structure, the back surface of the semiconductor chip 63 (the surface opposite to the functional surface). The one to which the plate member is attached is used. The attachment of such a plate member,
For example, it can be performed as follows.

First, as shown in FIG. 6A, a liquid is formed on the back surface of the semiconductor chip 63 after the flip chip connection.
An adhesive resin 67 in the form of paste or sheet is attached. Next, as shown in FIG. 6B, the plate member 68 mainly made of aluminum or copper is attached to the semiconductor chip 6 as shown in FIG.
Mount on the back of 3. Then, the adhesive resin 67 is plasticized and cured by, for example, heat to form the adhesive layer 67a. Here, the adhesive layer 67a includes the semiconductor chip 63 and the plate member 68.
Protrusions usually occur from the gap between and. The protruding portion 67b is called a fillet as in the case of the filling resin 66 (hereinafter referred to as fillet 67b).

[0007]

In the semiconductor device described above, there is room for improving reliability in the following points due to its structure. One is that the formation of the fillet 67b with the adhesive resin 67 is not necessarily performed evenly around the semiconductor chip 63. This is shown in Fig. 6 (c).
In the precise sense, the mounting position of the plate member 68 with respect to the vertical (x) or horizontal (y) direction as shown in FIG. When such a displacement occurs, the length of the fillet 67b extending from the side surface of the semiconductor chip 63 in the direction of the surface of the plate member 68 inevitably differs on each side.

Such non-uniform formation of the fillet 67b on each side of the semiconductor chip 63 breaks the stress balance during repeated thermal expansion and contraction of the entire structure. Therefore, it affects the results of the temperature cycle test.

A fillet 67 made of an adhesive resin 67 is also provided.
In the sense that b is not formed uniformly around the semiconductor chip 63, as shown in FIG.
The same applies to the case where 8 is mounted while being displaced in the rotation (θ) direction with respect to the surface (xy surface) of the semiconductor chip 63.
Therefore, also in this case, thermal expansion /
The stress balance will be lost during repeated contraction, which will affect the results of the temperature cycle test.

The displacement of the mount position as shown in FIGS. 6 (c) and 6 (d) can be improved by improving the alignment accuracy of the mounter which is a manufacturing device, but the cost of the device is not expected and the alignment can be performed. It also affects productivity from the time required for.

Another point to be considered in order to improve the reliability deterioration peculiar to this structure is that the fillet 67b made of the adhesive resin 67 wraps around the side surface of the semiconductor chip 63 and is not stably formed. . This is shown in FIG.
Will be explained. FIG. 6 (e) is GG of FIG. 6 (c).
It is a figure which shows a cross section. As shown in FIG. 6E, the fillet 67b is formed almost exclusively on the plate member 68 side, and is hardly formed on the side surface of the semiconductor chip 63. It is considered that this is mainly due to the shape of the plate member 68 and the difference in material between the plate member 68 and the semiconductor chip 63.

Therefore, regardless of the adhesive layer 67a,
The side surface of the semiconductor chip 63 is likely to be exposed. This tendency is that the adhesive layer 67 supplied for fillet formation is formed at the corners of the semiconductor chip 63 (sides formed by the side surfaces).
This is particularly remarkable because the amount of a is relatively small. Further, since the formation of the fillet 67b also varies due to the variation in the amount of the adhesive resin 67 attached, the exposure is likely to occur.
The exposed state of the side surface (particularly the corner) of the semiconductor chip 63 causes stress concentration on the semiconductor chip 63. Therefore, the result of the temperature cycle test is affected.

In addition to these matters, the plate member 68
There is a case where the adhesive resin 67 abnormally squeezes out or creeps up, and in these cases, the outer shape of the structure is abnormal and the yield is deteriorated. Further, since the plate member 68 is a flat plate, it is likely to be warped or bent, which similarly leads to a decrease in yield.

As described above, in the conventional structure, due to the displacement of the mounting position of the plate member, the fillet formation is not uniform on each side of the semiconductor chip, and the stress balance may be lost. In addition, a fillet that covers the side surface (particularly, a corner) of the semiconductor chip is hardly formed, which may cause stress concentration. These are considered to be obstacles to further improvement of reliability.

The present invention has been made in consideration of the above circumstances, and has a flip chip connection structure and a semiconductor device in which a plate member is attached to the back surface of a semiconductor chip for the purpose of protecting the same and a manufacturing method thereof. An object of the present invention is to provide a semiconductor device capable of improving reliability and a manufacturing method thereof.

[0016]

In order to solve the above-mentioned problems, a semiconductor device according to the present invention has a semiconductor chip having an electrode for external connection, and a flip-chip connection to the semiconductor chip via the electrode for external connection. And a plate member having a surface inclined to the side surface of the semiconductor chip, the plate member being provided on the side opposite to the side of the semiconductor chip on which the wiring plate is arranged, and the semiconductor chip and the plate member. And an adhesive layer for adhering to each other.

A plate member provided on the back surface of the semiconductor chip via an adhesive layer is provided with a surface inclined toward the side surface of the semiconductor chip. With such an inclined surface, the fillet formed by the adhesive layer protruding from the back surface of the semiconductor chip is easily formed between the inclined surface and the side surface of the semiconductor chip.

Therefore, it becomes easy to form a fillet that covers the side surface of the semiconductor chip, and the concentration of stress on the semiconductor chip is reduced by the formed fillet. Further, since a more stable shape can be obtained as the fillet, the stress balance is less likely to be lost. Therefore, the reliability can be improved.

The plate member may be made of copper, aluminum, stainless steel (SUS) or the like as a main material. The wiring board may be made of resin (rigid or flexible) or ceramic. When the wiring board is made to function as a package of semiconductor chips, various well-known external connection terminals (for example, BGA: ball grid array) are provided on the surface of the wiring board opposite to the surface on which the semiconductor chips are flip-chip connected. Or LGA: land grid array, etc.) can be provided.

Further, the method of manufacturing a semiconductor device according to the present invention comprises a step of adhering a liquid or paste adhesive to the side of the semiconductor chip opposite to the side where the wiring board is arranged, and the attached adhesive. And a plate member having a surface inclined toward the side surface of the semiconductor chip through the step of attaching the plate member to the semiconductor chip.

This manufacturing method is for manufacturing the above semiconductor device. In this case, various well-known methods can be used for the step of flip-chip connection.

[0022]

As an embodiment of the present invention, the adhesive layer is formed so as to protrude so as to cover a part of sides formed by the side surfaces of the semiconductor chip. Since the fillet by the adhesive layer is easily formed on the side surface of the semiconductor chip, the fillet is further formed over the side formed by the side surfaces of the semiconductor chip (that is, the corner of the semiconductor chip). As a result, stress concentration on the semiconductor chip can be further reduced and reliability can be improved.

In an embodiment of the present invention, the adhesive layer is a cured resin which is in a liquid state before being cured. When it is liquid, when the plate member is mounted on the semiconductor chip, the mounting position shift is corrected by the surface tension of the liquid together with the shape of the plate member. Therefore, the formed fillets are made more uniform and the reliability is improved.

Further, as an embodiment of the present invention, it further comprises a filling resin filling a space between the semiconductor chip and the wiring board, and the semiconductor chip has a side surface and a side formed between the side surfaces (hereinafter, referred to as a side surface). , The sides formed by the side surfaces and the side surfaces are collectively referred to as a “side surface or the like”) are covered by the protruding portion of the filling resin and the protruding portion of the adhesive layer. A portion of the side surface of the semiconductor chip close to the wiring board is covered with a filling resin filling the space between the semiconductor chip and the wiring board, and a portion of the side surface of the semiconductor chip close to the plate member is an adhesive layer of the plate member. Covered by. As a result, it becomes possible to cover the side surfaces and the like of the semiconductor chip, and the stress concentration on the semiconductor chip can be further reduced. Therefore, further improvement in reliability is achieved.

Further, as an embodiment of the present invention, the surface of the plate member inclined toward the side surface of the semiconductor chip is substantially parallel to the surface of the protruding portion of the filling resin. By providing the inclined surface of the plate member so as to have such an arrangement relationship, the fillet by the adhesive layer can be stably and easily formed.

Further, according to an embodiment of the present invention, the plate member has a protrusion formed on a surface facing the semiconductor chip. By forming such protrusions on the plate member, it is possible to control the volume of the gap between the plate member and the semiconductor chip to a predetermined level, and the amount of the adhesive layer allocated to fillet formation becomes more constant. Therefore, the fillet formation is made uniform without variation, and the reliability is further improved.

Further, as an embodiment of the present invention, the adhesive layer contains particles. By including the particulate matter in the adhesive layer, it becomes possible to control the volume of the gap between the plate member and the semiconductor chip to a predetermined level as in the above, and the amount of the adhesive layer that is allocated to fillet formation. It will be more constant. Therefore, the fillet formation is made uniform without variation, and the reliability is further improved.

Further, as an embodiment of the present invention, in the plate member, the inclination angle of the surface inclined toward the side surface of the semiconductor chip is 20 ° or more and less than 80 °. With such an angle, when the plate member is mounted on the semiconductor chip, it is possible to further bring out the effect of correcting the mount position deviation without side effects.

Further, as an embodiment of the present invention, in the plate member, the size of a flat portion excluding the surface inclined toward the side surface of the semiconductor chip is set in both vertical and horizontal directions with reference to the size of the back surface of the semiconductor chip. -0.2 mm or more +0.5 m
m or less. With such a size, when the plate member is mounted on the semiconductor chip, the effect of correcting the mount position deviation can be further obtained without any side effect.

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic process diagram showing a manufacturing process of a semiconductor device according to an embodiment of the present invention. In the figure, the process progresses from (a) to (e).

First, as shown in FIG. 1A, a wiring board 11 having a land 12 for flip-chip connecting a semiconductor chip 13 and a pad 14 having a pad 14 are provided with a protruding electrode 15 (bump). Shaped semiconductor chip 13
Position and face each other. Protruding electrode 15
A well-known method using gold or solder may be used for forming.

Then, as shown in FIG. 1 (b), the semiconductor chip 13 and the wiring board 11 are pressed and heated so that the protruding electrodes 15 and the lands 12 are in contact with each other, and these are electrically and electrically connected.
Mechanically join. Depending on the material of the protruding electrode 15 or the like, ultrasonic waves may be used together with the pressure.

Next, as shown in FIG. 1C, a space between the semiconductor chip 13 and the wiring board 11 is filled with a filling resin 16 (underfill resin) to seal the electrical / mechanical joining portion. To do. The filling of the filling resin 16 can be performed, for example, by injecting the liquid filling resin 16 with a syringe and spreading the filling resin 16 in the gap by the surface tension of the liquid. After the filling, the filling resin 16 is cured by, for example, heat. As shown in the drawing, a fillet 16a made of the filling resin 16 is formed between the semiconductor chip 13 and the wiring board 11 and outside.

The above steps from FIGS. 1A to 1C are steps of flip-chip connecting the semiconductor chip 13 to the wiring board 11, and various methods other than those described above may be used. . For example, instead of the filling resin 16, an anisotropic conductive film or an anisotropic conductive paste may be used to form the sealed state and the electrically connected state.

Next, as shown in FIG. 1D, an adhesive resin 17 is attached to the back surface of the semiconductor chip 13. The adhesive resin 17 may be in the form of liquid, paste, sheet or the like.

Next, as shown in FIG. 1E, a plate member 18 having a surface inclined toward the side surface of the semiconductor chip 13 and made mainly of aluminum, copper, stainless steel or the like is used as the semiconductor chip. Mount it on the back of 13. Then, the adhesive resin 17 is cured by, for example, heat (in the case of a sheet, plasticization is also performed at the same time) to form the adhesive layer 17a. In the adhesive layer 17a, a protrusion is generated from the gap between the semiconductor chip 13 and the plate member 18, and the fillet 17
b is formed.

Here, the plate member 18 is the semiconductor chip 13
Fillet 1 because it has a surface inclined toward the side of
7b is easily formed between the inclined surface and the side surface of the semiconductor chip 13. Therefore, the fillet 17b is formed so as to cover the side surface of the semiconductor chip 13, and the formed fillet 17b reduces stress concentration on the semiconductor chip 13. Further, since a more stable shape can be obtained as the fillet 17b, the stress balance is less likely to be lost. Therefore, the reliability can be improved. This is more remarkable when the amount of the adhesive resin 17 used is adjusted to form the fillet 17b so as to cover not only the side surface of the semiconductor chip 13 but also the side formed by the side surfaces.

The plate member 18 having the inclined surface as described above can be easily obtained by pressing a flat plate, for example. Further, the plate member 18 has the surface inclined toward the side surface of the semiconductor chip 13, which is the reason why the above-described effect is obtained.
The upper surface of 8 (the surface opposite to the surface facing the semiconductor chip 13) may have no inclined surface. That is, it is also possible to form a shape having a surface inclined toward the side surface of the semiconductor chip 13 by scooping one side of a plate having a certain thickness. Further, in any case, the predetermined shape may be obtained by casting.

FIG. 2 is a diagram for explaining a method for reducing the positional deviation of the plate member 18 in the embodiment described with reference to FIG. In FIG. 1, the components already described are given the same numbers.

FIG. 2 (a) is a plan view of FIG. 1 (e) seen from above. Ideally, as shown in the drawing, the plate member 18 is placed in the xy direction (top, bottom, Place it evenly in the left-right direction. Here, when a paste-like or sheet-like material having a high viscosity is used as the adhesive resin 17, if the plate member 18 has a mount position displacement, xy position displacement as shown in FIG. Figure 2
There is a possibility that it may be manufactured by being fixed at a position shift of θ (about an axis perpendicular to the xy plane) as shown in (c). Even in this case, the formation of the fillet 17b is improved as compared with the conventional product.

In addition to such an improving effect, the adhesive resin 17
If a liquid material or a paste material having a low viscosity is used as the above, there is an advantage when the mounting position of the plate member 18 is displaced as shown in FIGS. 2B and 2C. That is, the surface tension of the adhesive resin 17 such as liquid can automatically converge toward an ideal position as shown in FIG. Therefore, the fillet 17b can be further uniformly formed, and the adhesive resin 17 can be cured in this state. Therefore,
The reliability of the structure including the semiconductor chip 13 can be further improved.

FIGS. 3A and 3B are respectively shown in FIG.
It is a figure which shows the A-Aa cross section and B-Ba cross section in (a), and is a figure explaining the preferable formation relationship of the fillet 17b by the adhesive resin 17, and the fillet 16a by the filling resin 16. In FIG. 3, the components already described are given the same numbers.

As shown in FIGS. 3A and 3B, the side surfaces of the semiconductor chip 13 and the sides formed by the side surfaces are all covered with the fillet 17b of the adhesive resin 17 and the fillet 16a of the filling resin 16. Are more preferable as already mentioned. To do so, the inclination angle φ of the surface of the plate member 18 that is inclined toward the side surface of the semiconductor chip 13 may be substantially parallel to the surface of the fillet 16a of the filling resin 16 as illustrated. This is because the fillet 17b is formed between the two surfaces that are substantially parallel to each other, so that the side surface of the semiconductor chip 13 is likely to be covered. The same applies to the corners of the semiconductor chip 13, as shown in FIG.

The complete coating of the semiconductor chip 13 as shown in FIG. 3 is performed with the adhesive layer 17a (and the fillet 17).
Since the contact area of the plate member 18 and the fillet 16a in b) is increased, the reliability of making the plate member 18 less likely to peel off is also improved.

Here, an example of an experimental result for the above-described positional deviation correction (positional correction effect) will be described. According to the experiment, the size of the semiconductor chip 13 is 11 mm × 19 m
m, the outer shape of the plate member 18 is 13 mm × 21 mm, the size of the flat portion is 11.2 mm × 19.2 mm, and the angle φ of the surface inclined toward the side surface of the semiconductor chip 13 is 70 ° with respect to the horizontal plane, The adhesive resin 17 has a viscosity of 15 to 20
A position correction effect of 50 μm to 100 μm could be obtained by using the one having Pa · s. The following shows the position correction effect (calculation and experiment) when the angle of the inclined surface or the size of the flat portion is changed.

[Table 1]

[Table 2]

Table 1 shows the relationship between the inclination angle φ of the plate member 18 and the position correction effect. In this case, the size of the flat portion is ± 0.0 to − with respect to the size of the back surface of the semiconductor chip 13.
It is 0.2 mm. As you can see, the angle φ
If the angle is set to 20 ° or more, the position correction effect begins to appear,
In (2), the effect is increased and becomes practical until the plate member 18 interferes with the fillet 16a of the filling resin. In that sense, the angle φ is more preferably set to about 70 °.

Table 2 shows the relationship between the size of the flat portion of the plate member 18 and the position correction effect. The inclination angle φ of the plate member 18 in this case is about 40 °. As can be seen from this, when the back surface size of the semiconductor chip 13 of the plate member 18 is -0.5 mm, the plate member 13 and the semiconductor chip 13 directly contact and interfere with each other, and the position correction effect cannot be obtained. It can be seen that it is necessary to set it to about −0.2 mm. Also, with respect to the size of the back surface of the semiconductor chip 13, +
Since the position correction effect begins to appear at 0.5 mm, this can be the upper limit.

The above position correction effect cannot be obtained at all when the plate member 18 is a flat plate. Further, in this case, even when the adhesion amount of the adhesive resin 17 was varied by about 60 ± 5 mg, the formation of the fillet 17b could be set to a variation level without any problem. The following table shows the relationship (experimental result) between the adhesion amount of the adhesive resin 17 and the displacement of the plate member 18.

[Table 3]

From this result, it can be said that the adhesive resin 17
This means that the positional deviation of the plate member 18 can be maintained at a small level if the amount of is suppressed to a central value of about 60 ± 5 mg and its variation. On the contrary, it is preferable to select the central value (and the variation) of this amount of the adhesive resin 17 in order to obtain a sufficient effect.

FIG. 4 is a structural diagram schematically showing a semiconductor device according to another embodiment of the present invention. In the figure, the same numbers are assigned to the components already described. Figure 4
FIG. 4A is a vertical sectional view corresponding to the state shown in FIG. 1E, and FIG. 4B is a plan view thereof.

In this embodiment, the plate member 18a is provided with a protrusion 19 toward the semiconductor chip 13. Due to the presence of such protrusions 19, the volume of the gap between the plate member 18a and the semiconductor chip 13 can be set to be more constant and the state can be fixed.

Therefore, the amount of the adhesive resin 17 allocated to the formation of the fillet 17b is made constant as compared with the case where there is no protrusion 19 (the case of the embodiment of FIG. 1).
This is because in the embodiment of FIG. 1, the volume of the gap between the plate member 18 and the semiconductor chip 13 changes due to the pressing force of the plate member 18 at the time of manufacturing, and the fillet 17 is changed in accordance with the change.
This is because the amount allocated to b formation is determined.

Therefore, as compared with the embodiment shown in FIG. 1, the formation of the fillet 17b can be further stabilized, and the factor of reliability deterioration can be reduced. Also,
When the adhesive resin 17 used is liquid or paste having a low viscosity, the amount of the adhesive resin 17 that exerts a sufficient positional deviation correction effect on the plate member 18a is set to the plate member 1
There is also an effect of ensuring a space between the semiconductor chip 13 and 8a.

Although the number of the protrusions 19 is four in the embodiment shown in FIG. 4, the number thereof may be appropriately determined so that the volume of the gap between the plate member 18a and the semiconductor chip 13 becomes more constant. In addition, the plate member 18a having the protrusion 19 is
For example, it can be easily obtained by pressing a flat plate. Of course, the manufacturing method is not limited to press working, and may be manufactured by casting or the like. The protrusion 19 may have a height of 0.1 mm and a diameter of 0.7 mm, for example, on the protruding side.

FIG. 5 is a structural diagram schematically showing a semiconductor device according to still another embodiment of the present invention. In the figure, the same numbers are assigned to the components already described. FIG. 5A shows the state shown in FIG.
FIG. 5B is a vertical sectional view corresponding to the state shown in FIG. 1E, and FIG. 5B is a plan view of FIG. 5B.

In this embodiment, as shown in FIG. 5 (a), the adhesive resin 51 contains the particulate matter 52 (filler). Then, as shown in FIG. 5B, the adhesive resin 51
In the adhesive layer 51a formed by the above, the granular material 52 functions as a spacer that maintains a gap between the semiconductor chip 13 and the plate member 18. Thereby, the plate member 18 and the semiconductor chip 13
The volume of the gap between and can be set more constant and fixed in that state. Therefore, the fillet 51b is similarly formed with good controllability.

As described above, in this embodiment, the same effect as that of the embodiment shown in FIG. 4 can be obtained. The granular material 52 can be, for example, resin particles or glass particles, and the size thereof can be, for example, a diameter of 0.1 mm.

[0059]

As described in detail above, according to the present invention,
Since the plate member disposed on the back surface of the semiconductor chip via the adhesive layer is provided with the surface inclined toward the side surface of the semiconductor chip, the fillet formed by the adhesive layer protruding from the back surface of the semiconductor chip is inclined. It is likely to be formed between the surface and the side surface of the semiconductor chip. Therefore, it becomes easy to form a fillet that covers the side surface of the semiconductor chip, and the formed fillet reduces stress concentration on the semiconductor chip. Further, since a more stable shape can be obtained as the fillet, the stress balance is less likely to be lost. Therefore, reliability as a semiconductor device can be improved.

[Brief description of drawings]

FIG. 1 is a schematic process diagram showing a manufacturing process of a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating a method for reducing the positional deviation of the plate member 18 in the embodiment shown in FIG.

3A and 3B are views showing a cross section A-Aa and a cross section B-Ba in FIG.

FIG. 4 is a structural diagram schematically showing a semiconductor device according to another embodiment of the present invention.

FIG. 5 is a structural diagram schematically showing a semiconductor device according to still another embodiment of the present invention.

6A and 6B are views for explaining a conventional structure and a manufacturing method of a semiconductor device having a flip chip connection structure in which a plate member is attached to the back surface of a semiconductor chip.

[Explanation of symbols]

11 ... Wiring board, 12 ... Land, 13 ... Semiconductor chip, 1
4 ... Pad, 15 ... Projection electrode, 16 ... Filling resin, 16a
... fillet, 17 ... adhesive resin, 17a ... adhesive layer, 17
b ... fillet, 18, 18a ... plate member, 19 ... projection,
51 ... Adhesive resin, 51a ... Adhesive layer, 51b ... Fillet, 52 ... Granular material

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hideo Aoki             1st Komukai Toshiba-cho, Sachi-ku, Kawasaki-shi, Kanagawa             Ceremony Company Toshiba Microelectronics Sen             Inside F-term (reference) 4M109 AA01 BA03 CA04 EE01

Claims (10)

[Claims] 1. A semiconductor chip having an electrode for external connection, a wiring board flip-chip connected to the semiconductor chip via the electrode for external connection, and a side of the semiconductor chip on which the wiring board is arranged. A semiconductor device comprising: a plate member provided on the opposite side and having a surface inclined toward the side surface of the semiconductor chip; and an adhesive layer for bonding the semiconductor chip and the plate member. 2. The semiconductor device according to claim 1, wherein the adhesive layer is formed so as to protrude so as to cover a part of sides formed by the side surfaces of the semiconductor chip. 3. The semiconductor device according to claim 1, wherein the adhesive layer is a liquid cured resin in a state before being cured. 4. A filling resin filling the space between the semiconductor chip and the wiring board is further provided, and the semiconductor chip has a side surface and a side formed by the side surfaces and a protruding portion of the filling resin and the adhesive. The semiconductor device according to claim 1, wherein the semiconductor device is covered with a protruding portion of the layer. 5. The surface of the plate member inclined toward the side surface of the semiconductor chip is substantially parallel to the surface of the protruding portion of the filling resin.
The semiconductor device described. 6. The semiconductor device according to claim 1, wherein the plate member has a protrusion formed on a surface facing the semiconductor chip. 7. The semiconductor device according to claim 1, wherein the adhesive layer contains a granular material. 8. The plate member has an inclination angle of 20 ° or more of the surface inclined toward the side surface of the semiconductor chip 80.
The semiconductor device according to claim 1, wherein the semiconductor device is less than °. 9. The size of a flat portion of the plate member excluding the surface inclined toward the side surface of the semiconductor chip is based on the size of the back surface of the semiconductor chip in both vertical and horizontal directions.
The semiconductor device according to claim 1, wherein the distance is 0.2 mm or more and +0.5 mm or less. 10. A step of adhering a liquid or paste adhesive to the side of the semiconductor chip opposite to the side on which the wiring board is arranged, and to face the side surface of the semiconductor chip through the attached adhesive. And a step of sticking a plate member having an inclined surface to the semiconductor chip.