JP2003272798A - Method for assembling plug with electronic components built therein - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an assembling method of a plug with electronic components built therein for easily positioning each bus bar terminal, mitigating the stress in each bus bar terminal and the electronic components mounted on each bus bar terminal, improving the productivity, and ensuring the high reliability. <P>SOLUTION: In the assembling method of a plug with electronic components built therein, the periphery except an electronic component mounting part in each bus bar terminal 11 is integrated in a predetermined shape with a resin 13 before mounting the electronic components 12, the electronic components 12 are mounted on each bus bar terminal 11, and the periphery of the electronic components 12 in each bus par terminal 11 is integrated in a predetermined shape with a resin 14. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for assembling an electronic component built-in plug, in which electronic components are mounted on at least a pair of bus bar terminals and each bus bar terminal including the electronic components is covered with resin to be integrally molded. .

[0002]

2. Description of the Related Art Conventionally, Japanese Utility Model Laid-Open No. 62-96278 discloses a pair of parallel terminals 10 as shown in FIGS.
After the resistor 102 is adhered to one end of the resin mold layer 10, the rear periphery of each terminal 101 including the resistor 102 is attached to the resin mold layer 10.
A resistive connector 100 covered by 3 is described. The resistor 102 is provided with the printed resistor 105 on the surface of the ceramic substrate 104, and the printed resistor 10 is provided.
5 is provided with a pair of electrodes 106 that are in contact with both sides of the ceramic substrate 104. Each terminal 101 is soldered to the electrode 106 so as to overlap the resistor 102 so as to contact the corresponding electrode 106 of the resistor 102. With the above configuration, the resistance connector 100 is small and
The weight can be reduced, and excellent productivity and heat dissipation can be secured.

[0003]

However, in the conventional resistance connector 100 described above, the resistor 10 is connected to each terminal 101.
When bonding the two, it was necessary to position each terminal 101 by some method. Further, when the outer periphery of the rear portion of each terminal 101 is covered with the resin mold layer 103 including the resistor 102, each terminal 101 is displaced and the resistor 1
No. 02 and the resistor 102 may be stressed, resulting in a lack of reliability such as a lack of durability. Furthermore, the terminal 101, the resistor 1
02, since the coefficient of thermal expansion of the resin mold layer 103 is different from each other, each member receives a thermal stress due to a change in operating temperature environment, and the bonded portion between the terminal 101 and the resistor 102 and the resistor 102 are broken. However, there is a problem that the reliability as a product is lacking.

The present invention has been made in view of the above problems, and can position each bus bar terminal easily, and can reduce stress applied to each bus bar terminal and electronic components mounted on each bus bar terminal. An object of the present invention is to provide an assembling method of an electronic component built-in plug that can be relaxed and can improve productivity and ensure high reliability.

[0005]

According to a first aspect of the present invention, there is provided an electronic component built-in plug assembling method, wherein electronic components are mounted on at least a pair of bus bar terminals, and each bus bar terminal is attached. In a method of assembling an electronic component built-in plug, each of which includes an electronic component and is covered with a resin, after positioning each bus bar terminal by a positioning member that constitutes a part of the electronic component built-in plug, an electronic component is attached to each bus bar terminal. Is mounted, and the periphery of the electronic component in each of the bus bar terminals is integrally molded with resin into a required shape.

According to the method of assembling the plug with a built-in electronic component, the bus bar terminals are positioned by the positioning member before mounting the electronic component. Therefore,
After that, when the electronic component is mounted and integrally molded with resin, the stress applied to the electronic component and the bonding portion thereof is relieved, and high reliability can be secured.

Further, an assembling method of an electronic component built-in plug according to a second aspect of the present invention for achieving the above object is as follows:
The method for assembling a plug with a built-in electronic component according to claim 1, wherein the positioning member positions the busbar terminals by integrally molding the periphery of the busbar terminals excluding the electronic component mounting portion with a resin into a required shape. It is characterized by being performed by.

According to the method of assembling the plug with a built-in electronic component having the above structure, the bus bar terminals are positioned relative to each other by the first integral molding. Therefore, during the subsequent mounting of electronic components and the second integral molding,
The stress applied to the electronic component and its bonded portion is relieved, and high reliability can be ensured.

In order to achieve the above object, a method of assembling an electronic component built-in plug according to a third aspect of the present invention comprises:
The method of assembling a plug with a built-in electronic component according to claim 1, wherein the positioning of each of the bus bar terminals by the positioning member is performed by mounting a periphery of the bus bar terminal except an electronic component mounting portion on a resin holder. It is characterized by

According to the method of assembling the electronic component built-in plug having the above-mentioned configuration, the respective bus bar terminals are mutually positioned by the resin holder. Therefore, the stress applied to the electronic component and the bonding portion thereof is relieved during the subsequent mounting of the electronic component and the integral molding, and high reliability can be secured.

Further, according to a fourth aspect of the present invention to achieve the above object, an assembling method of an electronic component built-in plug is to mount an electronic component on at least a pair of busbar terminals and to attach each electronic component to each busbar terminal. In a method of assembling an electronic component built-in plug which is covered with a resin, the bus bar terminals are positioned by the positioning means, and after mounting the electronic component on each bus bar terminal, the electronic component of each of the bus bar terminals is extremely The present invention is characterized in that the vicinity of the electronic parts in each of the bus bar terminals is integrally molded into a required shape by molding a nearby periphery with a resin having a rigidity lower than that of the exterior resin.

According to the method of assembling the plug with a built-in electronic component having the above structure, the bus bar terminals are positioned by the positioning means, so that the stress applied to the electronic component and its bonded portion is relaxed when the electronic component is mounted and integrally molded. It Further, even when the operating temperature environment changes, the thermal stress of each bus bar terminal, the electronic component, and the outer shell resin can be relieved by the resin having lower rigidity than the outer shell resin.
Therefore, high reliability of the product can be ensured.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION A first embodiment of a method for assembling an electronic component built-in plug according to the present invention will be described below with reference to FIG. FIG. 1 is a perspective view showing a method of assembling an electronic component built-in plug according to a first embodiment of the present invention,
(A) shows a state of the busbar terminal alone, (b) shows a state where the periphery of the busbar terminal is integrally molded with resin, (c) shows a state where electronic components are mounted on the busbar terminals, and (d) shows electronic components. The respective states of the mounted bus bar terminals are integrally molded with resin.

In FIG. 1, an electronic component built-in plug 10 is provided.
Mounts the electronic component 12 on the pair of busbar terminals 11 and attaches each busbar terminal 11 to the electronic component 12 respectively.
And resin 13 and 14 are included. The method of assembling the plug 10 with built-in electronic component is as follows. First, the periphery of each bus bar terminal 11 excluding the electronic component mounting portion is integrally molded into a required shape with resin 13 before mounting the electronic component (first time).
(See FIGS. 1A and 1B). Next, resin 13
The electronic component 12 is mounted and adhered to each of the bus bar terminals 11 integrally formed with (see FIG. 1C). After that, the electronic component built-in plug 10 is integrally molded in a required shape with the resin 14 around the electronic component 12 in each bus bar terminal 11 (2
The second time) (see FIG. 1 (d)).

The operation of the first embodiment will be described. By the first integral molding, the bus bar terminals 11 are positioned and fixed to each other (see FIGS. 1A and 1B), and when the electronic component 12 is subsequently mounted and bonded (see FIG. 1).
(See (c)), and resin mold (second integral molding).
At this time (see FIG. 1D), it is difficult for mechanical stress to act on the electronic component 12 and its bonded portion. In the resin molding (second integral molding), it is also possible to first mold the periphery of each bus bar terminal 11 very close to the electronic component 12 with a resin having a rigidity lower than that of the outer resin 14. In this case, even when the operating temperature environment changes, the thermal stress of each bus bar terminal 11, the electronic component 12, and the outer shell resin 14 can be relieved by the resin having lower rigidity than the outer shell resin 14.

As described above, according to the first embodiment,
1 for each bus bar terminal 11 before mounting the electronic component 12
The first integral molding positions and fixes each other, and then the second integral molding molds each bus bar terminal 11 on which the electronic component 12 is mounted with resin. Therefore, it is possible to reduce the size and weight of the busbar terminal 11 and to ensure excellent productivity, but it is necessary to attach the busbar terminals 11 and the electronic components 12 mounted on the busbar terminals 11 during the assembling process. Mechanical stress can be relieved. As a result, durability can be improved and high reliability as a product can be ensured.

Next, a second embodiment of the method for assembling the electronic component built-in plug according to the present invention will be described with reference to FIG. 2A and 2B are perspective views showing a method of assembling the plug with a built-in electronic component according to the second embodiment of the present invention. FIG. 2A shows the holder and the busbar terminal alone, and FIG. 2B shows the busbar terminal attached to the holder. The state in which the electronic parts are mounted on the bus bar terminal is shown in FIG. 7C, and the state in which the bus bar terminal on which the electronic parts are mounted is integrally molded with resin is shown in FIG.

In FIG. 2, a plug 20 with a built-in electronic component is provided.
Mounts the electronic component 12 on the pair of busbar terminals 11 and attaches each busbar terminal 11 to the electronic component 12 respectively.
Including the resin 21 and 14. In the method of assembling the plug with built-in electronic component 20, first, the periphery of the electronic component mounting portion of each bus bar terminal 11 is mounted at a predetermined position of the resin holder 21 before mounting the electronic component (FIG. 2A). And (b)). Next, the electronic component 12 is mounted and adhered to each bus bar terminal 11 mounted on the holder 21 (see FIG. 2C). After that, the electronic component built-in plug 20 is connected to the electronic component 1 in each bus bar terminal 11.
2 is integrally molded with resin 14 into a required shape (see FIG. 2).
(See (d)).

The operation of the second embodiment will be described. The bus bar terminals 11 are positioned and fixed to each other by the holder 21 (see FIGS. 2A and 2B), and when the electronic component 12 is subsequently mounted and adhered (see FIG. 2C), and During resin molding (see FIG. 1D), mechanical stress is unlikely to act on the electronic component 12 and its adhesive portion. It should be noted that at the time of resin molding, it is also possible to first mold the periphery of each bus bar terminal 11, which is extremely close to the electronic component 12, with a resin having a rigidity lower than that of the outer shell resin 14. In this case, even when the operating temperature environment changes, the thermal stress of each bus bar terminal 11, the electronic component 12, and the outer shell resin 14 can be relieved by the resin having lower rigidity than the outer shell resin 14.

As described above, according to the second embodiment,
The busbar terminals 11 before mounting the electronic components 12 are mutually positioned and fixed by the holder 21, and then the busbar terminals 11 mounting the electronic components 12 are resin-molded. Therefore, each busbar terminal 11 and each busbar terminal 1 can be miniaturized and lightened and excellent productivity can be secured.
It is possible to relieve the mechanical stress applied to the electronic component 12 mounted on the device 1 during assembly. As a result, durability can be improved and high reliability as a product can be ensured.

Next, a third embodiment of the method for assembling the electronic component built-in plug according to the present invention will be described with reference to FIG. 3A and 3B are perspective views showing a method of assembling an electronic component built-in plug according to a third embodiment of the present invention. FIG. 3A is a state of a single busbar terminal, and FIG. (C) shows a state in which electronic components are mounted on the busbar terminals, (d) shows a state in which the positioning jig is removed from the busbar terminals on which the electronic components are mounted,
(E) shows a state in which the periphery of the busbar terminal on which the electronic component is mounted, which is extremely close to the electronic component, is integrally molded with a resin having a rigidity lower than that of the outer resin, and (f) shows a periphery of a portion integrally molded with the resin having a low rigidity. The respective states are shown in which they are integrally molded with an outer resin having higher rigidity.

In FIG. 3, a plug 30 with a built-in electronic component is provided.
Mounts the electronic component 12 on the pair of busbar terminals 11 and attaches each busbar terminal 11 to the electronic component 12 respectively.
And resin 32 and 33 are included. In the method of assembling the plug 30 with a built-in electronic component, first, the periphery of the electronic component mounting portion of each bus bar terminal 11 is mounted at a predetermined position by a positioning jig 31 which is a positioning means before mounting the electronic component (FIG. 3). (See (a) and (b)).
Next, each bus bar terminal 1 mounted on the positioning jig 31
The electronic component 12 is mounted and adhered to 1 (see FIG. 3C). Then, the positioning jig 31 is removed from each bus bar terminal 11 on which the electronic component 12 is mounted (see FIG. 3).
(See (d)). Next, in each bus bar terminal 11 on which the electronic component 12 is mounted, the resin 32 having a lower rigidity than the outer peripheral resin 33 (see FIG. 3 (f)) in the vicinity very close to the electronic component 12 is provided.
Are integrally molded (first time) (see FIG. 3E). Further, the outer resin 33 having a higher rigidity around the resin 32
Are integrally molded into the required shape (second time) (see FIG. 2D).

The operation of the third embodiment will be described. The bus bar terminals 11 are positioned relative to each other by the positioning jig 31 (see FIGS. 3A and 3B), and when the electronic component 12 is subsequently mounted and bonded (see FIG. 3C). It is difficult for mechanical stress to act on the electronic component 12 and its bonded portion. Further, the resin 32 having lower rigidity than the outer resin 33
Each of the bus bar terminals 11, the electronic component 12, and the outer shell resin 3 are formed by the first resin molding (see FIG. 3 (e)).
Even when the operating temperature environment of 3 changes, the thermal stress of each bus bar terminal 11, the electronic component 12, and the outer shell resin 33 can be relaxed.

As described above, according to the third embodiment,
The bus bar terminals 11 before mounting the electronic component 12 are positioned with respect to each other by a positioning jig 31.
Equipped with. After that, each bus bar terminal 11 from which the positioning jig 31 has been removed is first integrally molded with the resin 32 having low rigidity, and then the periphery is integrally molded with the outer resin 33 having higher rigidity. Therefore, it is possible to reduce the size and weight of the busbar terminal 11 and to ensure excellent productivity, but it is necessary to attach the busbar terminals 11 and the electronic components 12 mounted on the busbar terminals 11 during the assembling process. Mechanical stress can be relieved. further,
Thermal stress of each member caused by temperature change during use,
It can be alleviated by the resin 32 having low rigidity. As a result, durability can be improved and high reliability as a product can be ensured.

[0025]

As described above, the first to third aspects of the present invention are described.
According to the method of assembling the plug with a built-in electronic component described in 3, the bus bar terminals before mounting the electronic component are positioned relative to each other by the positioning member, so that the bus bar terminals can be positioned easily. Productivity can be improved. Further, mechanical stress on the busbar terminals and electronic components mounted on the busbar terminals at the time of assembly can be relieved, and high reliability can be secured.

According to the method of assembling the plug with a built-in electronic component according to the fourth aspect of the present invention, the bus bar terminals before mounting the electronic component are mutually positioned by the positioning member. Positioning can be performed easily, and productivity can be improved. Further, it is possible to relieve the mechanical stress applied to each bus bar terminal and the electronic components mounted on each bus bar terminal during assembly. Furthermore, since the periphery of each bus bar terminal, which is extremely close to the electronic components, is molded with a resin that has lower rigidity than the outer resin, the thermal stress of each member caused by changes in the operating temperature environment should be mitigated by the resin with low rigidity. You can With the above configuration, durability can be improved and high reliability as a product can be ensured.

[Brief description of drawings]

FIG. 1 is a perspective view showing an assembling method of an electronic component built-in plug according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a method for assembling an electronic component built-in plug according to a second embodiment of the present invention.

FIG. 3 is a perspective view showing an assembling method of an electronic component built-in plug according to a third embodiment of the present invention.

FIG. 4 is an overall perspective view showing a conventional resistance connector.

5 is an exploded perspective view showing resistors and terminals of the resistance connector of FIG.

[Explanation of symbols]

10 Electronic Component Built-in Plug (First Embodiment) 11 busbar terminals 12 Electronic components 13 Resin for the first integral molding 14 Resin at the time of second integral molding (outer shell resin) 20 Electronic Component Built-in Plug (Second Embodiment) 21 Holder 30 Electronic Component Built-in Plug (Third Embodiment) 31 Positioning jig (positioning means) 32 Resin with low rigidity 33 outer shell resin

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masashi Nagao             206-1 Nunobikihara, Haibara-cho, Haibara-gun, Shizuoka Prefecture Yazaki             Parts Co., Ltd. F-term (reference) 5E021 FA05 FA11 FA14 FC11 FC32                       MA01                 5E063 JB01 JB05 JB09 XA01                 5F061 AA02 BA07 FA06

Claims (4)

[Claims] 1. An assembling method of an electronic component built-in plug, comprising: mounting an electronic component on at least a pair of busbar terminals; and coating each busbar terminal with a resin including the electronic component. After positioning by a positioning member that constitutes a part of the component built-in plug, an electronic component is mounted on each bus bar terminal, and the periphery of the electronic component of each bus bar terminal is integrally molded with resin into a required shape. How to assemble a plug with a built-in electronic component. 2. The positioning of each of the busbar terminals by the positioning member is performed by integrally molding the periphery of each of the busbar terminals excluding an electronic component mounting portion with a resin into a desired shape. How to assemble the described electronic component built-in plug. 3. The electronic device according to claim 1, wherein the positioning of each of the bus bar terminals by the positioning member is performed by mounting the periphery of each of the bus bar terminals excluding an electronic component mounting portion on a resin holder. How to assemble a plug with a built-in component. 4. An electronic component built-in plug mounting method, wherein electronic components are mounted on at least a pair of busbar terminals, and each busbar terminal including the electronic components is covered with resin. After mounting the electronic component on each bus bar terminal by positioning by, the periphery of the bus bar terminal in the vicinity of the electronic component is molded with a resin having a rigidity lower than the outer resin, and then the electronic component on each bus bar terminal is further formed. A method for assembling a plug with a built-in electronic component, characterized in that the periphery of the component is integrally molded into the required shape with the outer resin.