JP2003243358A5 - - Google Patents

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Publication number
JP2003243358A5
JP2003243358A5 JP2002035387A JP2002035387A JP2003243358A5 JP 2003243358 A5 JP2003243358 A5 JP 2003243358A5 JP 2002035387 A JP2002035387 A JP 2002035387A JP 2002035387 A JP2002035387 A JP 2002035387A JP 2003243358 A5 JP2003243358 A5 JP 2003243358A5
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JP
Japan
Prior art keywords
cleaning
plasma reaction
micropore
plasma
reaction product
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JP2002035387A
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English (en)
Japanese (ja)
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JP3876167B2 (ja
JP2003243358A (ja
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Priority to JP2002035387A priority Critical patent/JP3876167B2/ja
Priority claimed from JP2002035387A external-priority patent/JP3876167B2/ja
Priority to US10/361,570 priority patent/US6897161B2/en
Publication of JP2003243358A publication Critical patent/JP2003243358A/ja
Publication of JP2003243358A5 publication Critical patent/JP2003243358A5/ja
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Publication of JP3876167B2 publication Critical patent/JP3876167B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002035387A 2002-02-13 2002-02-13 洗浄方法および半導体装置の製造方法 Expired - Fee Related JP3876167B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002035387A JP3876167B2 (ja) 2002-02-13 2002-02-13 洗浄方法および半導体装置の製造方法
US10/361,570 US6897161B2 (en) 2002-02-13 2003-02-11 Method of cleaning component in plasma processing chamber and method of producing semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002035387A JP3876167B2 (ja) 2002-02-13 2002-02-13 洗浄方法および半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2003243358A JP2003243358A (ja) 2003-08-29
JP2003243358A5 true JP2003243358A5 (https=) 2005-08-18
JP3876167B2 JP3876167B2 (ja) 2007-01-31

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JP2002035387A Expired - Fee Related JP3876167B2 (ja) 2002-02-13 2002-02-13 洗浄方法および半導体装置の製造方法

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Country Link
US (1) US6897161B2 (https=)
JP (1) JP3876167B2 (https=)

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US9939501B2 (en) 2014-11-12 2018-04-10 The Board Of Trustees Of The Leland Stanford Junior University Iterative minimization procedure with uncompressed local SAR estimate
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JP2023180400A (ja) * 2022-06-09 2023-12-21 株式会社ディスコ バリ除去装置及び切削装置

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