JP2003224349A - Method for manufacturing substrate - Google Patents
Method for manufacturing substrateInfo
- Publication number
- JP2003224349A JP2003224349A JP2002019694A JP2002019694A JP2003224349A JP 2003224349 A JP2003224349 A JP 2003224349A JP 2002019694 A JP2002019694 A JP 2002019694A JP 2002019694 A JP2002019694 A JP 2002019694A JP 2003224349 A JP2003224349 A JP 2003224349A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electrode
- manufacturing
- water repellent
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、基板製造方法に係
り、詳しくは、マイグレーションの抑制に適した基板製
造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate manufacturing method, and more particularly to a substrate manufacturing method suitable for suppressing migration.
【０００２】[0002]
【従来の技術】近年、半導体ＬＳＩ、チップ部品等の小
型化に伴って、実装基板における回路が高密度化してい
る。回路が高密度化するにつれて、回路間も狭くなって
きている。また、タッチパネル等に用いられるＩＴＯ
（Indium Tin Oxide）の透明導電膜が形成されたガラ
ス基板等においても、タッチパネルの高精細化等に伴っ
て、回路間が例えば２００〜３００μｍと狭くなってき
ている。2. Description of the Related Art In recent years, with the miniaturization of semiconductor LSIs, chip parts, etc., the density of circuits on a mounting board has increased. As the density of circuits increases, the distance between circuits becomes smaller. In addition, ITO used for touch panels, etc.
Even in a glass substrate or the like on which a transparent conductive film of (Indium Tin Oxide) is formed, the distance between circuits has become narrower, for example, 200 to 300 μm, as the definition of touch panels becomes higher.
【０００３】[0003]
【発明が解決しようとする課題】ところが、回路間が狭
くなると、電圧の掛かった回路電極でマイグレーション
の問題が生じる。マイグレーションとは材料の表面、ま
たは内部を金属イオンが移動する現象である。その中で
も、イオンマイグレーションでは、絶縁材料を介して２
つの導体が置かれ、その導体間に電圧が負荷されると、
絶縁材料の加水分解や導体イオンの生成に伴い、リーク
電流が流れる。そして、その流れによって導体イオン
（主に陽極イオン）が導体間を移動する現象が起こる。
この現象が基板の回路電極間で起きてしまうと、電極金
属がイオン化溶解して腐食を発生するばかりでなく、そ
の結果の断線や電極間に析出することによる電極パター
ンのショートを発生させ、基板の不良原因となってしま
う。However, when the distance between the circuits becomes narrow, a problem of migration occurs in the circuit electrodes to which a voltage is applied. Migration is a phenomenon in which metal ions move on the surface or inside the material. Among them, in ion migration, 2
When two conductors are placed and a voltage is applied between them,
A leak current flows due to hydrolysis of the insulating material and generation of conductor ions. Then, the flow causes a phenomenon in which conductor ions (mainly anode ions) move between the conductors.
If this phenomenon occurs between the circuit electrodes of the substrate, not only the electrode metal will be ionized and dissolved to cause corrosion, but also the resulting disconnection or short circuit of the electrode pattern due to deposition between electrodes, Will cause a defect.
【０００４】本発明は以上の背景に鑑みなされたもので
あり、その目的とするところは、基板の回路電極間で起
きるマイグレーションを抑制することのできる基板製造
方法を提供することである。The present invention has been made in view of the above background, and an object thereof is to provide a substrate manufacturing method capable of suppressing migration that occurs between circuit electrodes of a substrate.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
に、請求項１の発明は、絶縁性基板上に導体材料による
電極パターンを形成後、電位差の生じ得る互いに対向す
る電極の電極表面のうち互いに対向する電極端部の電極
表面と、該対向する電極間の絶縁性基板表面とに撥水処
理を施すことを特徴とするものである。本発明者が鋭意
検討したところ、基板の回路電極間で起きるマイグレー
ションは、吸湿等による水分の影響で、基板の絶縁材料
が加水分解したり回路を形成する金属材料がイオン化し
たりして発生するものであるから、絶縁材料や回路電極
表面への水分の付着を防ぐことによって、抑制すること
ができるとの結論に至った。この請求項１の基板製造方
法では、電極表面に撥水処理を施すことにより、大気中
の水分が電極表面に付着し難くなるため導体材料への水
分の吸湿が抑えられ、導体材料のイオン化を防ぐことが
できる。また、上記対向する電極間の絶縁性基板表面に
撥水処理を施すことにより、該絶縁性基板の加水分解を
防ぐことができる。これらのことにより、絶縁性基板の
電極間におけるマイグレーションを抑制することができ
る。この結果、電極パターンの断線や電極パターン間の
ショートによる基板の不良を防ぐことができる。In order to achieve the above-mentioned object, the invention of claim 1 forms an electrode pattern of a conductive material on an insulating substrate, and then forms an electrode surface of electrodes facing each other which may generate a potential difference. Of these, water repellent treatment is applied to the electrode surfaces of the electrode ends facing each other and the surface of the insulating substrate between the facing electrodes. As a result of intensive study by the present inventor, migration occurring between circuit electrodes of a substrate occurs due to hydrolysis of an insulating material of a substrate or ionization of a metal material forming a circuit due to the influence of moisture due to moisture absorption or the like. Therefore, it was concluded that it can be suppressed by preventing moisture from adhering to the insulating material and the surface of the circuit electrode. In the substrate manufacturing method of the present invention, by applying water repellent treatment to the electrode surface, it becomes difficult for moisture in the atmosphere to adhere to the electrode surface, so that moisture absorption of the conductor material is suppressed and ionization of the conductor material is suppressed. Can be prevented. Further, by applying water repellent treatment to the surface of the insulating substrate between the electrodes facing each other, hydrolysis of the insulating substrate can be prevented. By these, the migration between the electrodes of the insulating substrate can be suppressed. As a result, it is possible to prevent the substrate from being defective due to the disconnection of the electrode pattern and the short circuit between the electrode patterns.
【０００６】請求項２の発明は、請求項１の基板製造方
法において、複数のノズル開口を備えたジェット式吐出
ヘッドと絶縁性基板の少なくとも一方を平面内で移動さ
せながら、吐出信号に基づいて該複数のノズル開口から
撥水剤液滴を吐出させて撥水層を形成することを特徴と
するものである。この請求項２の基板製造方法では、ジ
ェット式吐出ヘッドと絶縁性基板の少なくとも一方を平
面内で移動させながら、例えばパソコン等から出力され
る吐出信号に基づいて撥水層を形成する。これにより、
例えばスクリーン印刷のように印刷マスクを作成する必
要がなく、コストダウンを図ることができる。また、吐
出信号を変更することで任意のパターンの撥水層を形成
でき、多品種少量生産に適した製造方法が得られる。な
お、上記ジェット式吐出ヘッドとしては、従来周知のも
のを用いることができる。例えば、ヘッドのノズル孔に
連通するように形成された液体（例えばインク）の貯留
部の流路に、サーマルヘッド等の発熱素子により気泡を
発生させ、この気泡の持つ圧力によって、該ノズル孔か
ら適量の液体を吐出させるバブルジェット（登録商標）
方式の吐出ヘッドがある。また、貯留部に充填された液
体に、圧電素子等の加圧手段により該液体にパルス的外
圧を加え、この外圧によって該ノズル孔から適量の液体
を吐出させる加圧方式の吐出ヘッドがある。According to a second aspect of the present invention, in the substrate manufacturing method according to the first aspect, at least one of the jet type discharge head having a plurality of nozzle openings and the insulating substrate is moved in a plane, and based on the discharge signal. The water-repellent agent droplets are discharged from the plurality of nozzle openings to form a water-repellent layer. In the substrate manufacturing method of the present invention, the water repellent layer is formed based on the ejection signal output from, for example, a personal computer while moving at least one of the jet type ejection head and the insulating substrate in a plane. This allows
For example, unlike the case of screen printing, there is no need to create a print mask, and the cost can be reduced. Further, by changing the ejection signal, a water repellent layer having an arbitrary pattern can be formed, and a manufacturing method suitable for high-mix low-volume production can be obtained. A conventionally known one can be used as the jet type ejection head. For example, a bubble is generated by a heating element such as a thermal head in a flow path of a liquid (for example, ink) reservoir formed so as to communicate with the nozzle hole of the head, and the pressure of the bubble causes the bubble to exit from the nozzle hole. Bubble Jet (registered trademark) that discharges an appropriate amount of liquid
There is a type of ejection head. Further, there is a pressurizing type ejection head that applies a pulsed external pressure to the liquid filled in the storage portion by a pressurizing means such as a piezoelectric element and ejects an appropriate amount of the liquid from the nozzle hole by the external pressure.
【０００７】請求項３の発明は、請求項１又は２の基板
製造方法において、上記撥水処理の施された上記電極表
面及び上記絶縁性基板表面に絶縁性樹脂を重ねて塗布す
ることを特徴とするものである。従来マイグレーション
を防止するために、回路電極間に絶縁性樹脂をコーティ
ングすることが行なわれている。しかし、コーティング
した絶縁性樹脂にストレスがかかり、該絶縁性樹脂と基
板との界面にクラックが生じる場合がある。すると、上
記クラックから大気中の水分が浸入してマイグレーショ
ンが発生する場合がある。この請求項３の基板製造方法
では、絶縁性基板に塗布された絶縁性樹脂と該基板との
界面にクラックが発生して該クラックから内部に大気中
の水分が浸入したとしても、撥水層が電極表面や電極間
の基板表面に水分が付着するのを防ぎ、マイグレーショ
ンを抑制することができる。According to a third aspect of the present invention, in the substrate manufacturing method according to the first or second aspect, an insulating resin is applied to the surface of the electrode and the surface of the insulating substrate, which have been subjected to the water repellent treatment, in an overlapping manner. It is what Conventionally, in order to prevent migration, an insulating resin is coated between circuit electrodes. However, stress may be applied to the coated insulating resin, and cracks may occur at the interface between the insulating resin and the substrate. Then, moisture in the atmosphere may enter from the cracks to cause migration. According to the substrate manufacturing method of the present invention, even if a crack is generated at the interface between the insulating resin applied to the insulating substrate and the substrate, and moisture in the atmosphere enters the inside from the crack, the water-repellent layer. It is possible to prevent water from adhering to the surface of the electrode or the surface of the substrate between the electrodes, and suppress migration.
【０００８】請求項４の発明は、請求項３の基板製造方
法において、上記撥水処理の施された範囲よりも広い範
囲に絶縁性樹脂を塗布することを特徴とするものであ
る。撥水層の表面は接着性が悪いため、絶縁性基板表面
や電極表面に比べ撥水層表面から絶縁性樹脂が剥がれや
すい。この請求項４の基板製造方法では、撥水層よりも
広い範囲に絶縁性樹脂を塗布することにより、絶縁性樹
脂が絶縁性基板表面や電極表面と良好に接着し該絶縁性
樹脂の剥がれを防止することができる。According to a fourth aspect of the present invention, in the substrate manufacturing method according to the third aspect, the insulating resin is applied to a wider range than the range subjected to the water repellent treatment. Since the surface of the water-repellent layer has poor adhesion, the insulating resin is more likely to peel off from the surface of the water-repellent layer than the surface of the insulating substrate or the surface of the electrode. In the substrate manufacturing method according to the present invention, the insulating resin is applied to a wider area than the water repellent layer, so that the insulating resin is well adhered to the surface of the insulating substrate or the surface of the electrode and the insulating resin is not peeled off. Can be prevented.
【０００９】請求項５の発明は、請求項３又は４の基板
製造方法において、上記絶縁性基板としてフレキシブル
基板を用いることを特徴とするものである。フレキシブ
ル基板に絶縁性樹脂をコーティングした場合、該フレキ
シブル基板を湾曲させて使用すると、コーティングした
絶縁性樹脂にストレスがかかり、該絶縁性樹脂と該フレ
キシブル基板との界面にクラックが生じやすい。する
と、請求項３に関して述べたように、上記クラックから
大気中の水分が浸入してマイグレーションが発生する場
合がある。この請求項５の基板製造方法では、ソリッド
基板に比べ塗布した絶縁性樹脂との界面にクラックが生
じやすいフレキシブル基板を用いた場合に、撥水層が電
極表面や電極間のフレキシブル基板表面に水分が付着す
るのを防ぎ、マイグレーションを有効に抑制することが
できる。According to a fifth aspect of the present invention, in the substrate manufacturing method according to the third or fourth aspect, a flexible substrate is used as the insulating substrate. When a flexible substrate is coated with an insulating resin and the flexible substrate is bent and used, stress is applied to the coated insulating resin, and cracks are likely to occur at the interface between the insulating resin and the flexible substrate. Then, as described in claim 3, moisture in the atmosphere may infiltrate through the cracks to cause migration. According to the substrate manufacturing method of the present invention, when a flexible substrate is used which is more likely to have cracks at the interface with the insulating resin applied than the solid substrate, the water repellent layer causes moisture on the surface of the electrode or between the electrodes. Can be prevented, and migration can be effectively suppressed.
【００１０】[0010]
【発明の実施の形態】〔実施形態１〕以下本発明の実施
形態の一例について説明する。図１はＩＴＯの透明導電
膜が形成されたガラス基板の構造を示し、（ａ）はガラ
ス基板１の断面図、（ｂ）は平面図を示す。ガラス基板
１にＩＴＯ電極２を形成し、ＩＴＯ電極２の互いに対向
する電極端部の表面及びこれらの電極間のガラス基板表
面に撥水層３を形成している。BEST MODE FOR CARRYING OUT THE INVENTION [Embodiment 1] An example of an embodiment of the present invention will be described below. 1A and 1B show the structure of a glass substrate on which a transparent conductive film of ITO is formed. FIG. 1A is a sectional view of the glass substrate 1 and FIG. The ITO electrode 2 is formed on the glass substrate 1, and the water repellent layer 3 is formed on the surfaces of the electrode ends of the ITO electrode 2 facing each other and on the glass substrate surface between these electrodes.
【００１１】以下に製造方法の一例を説明する。まず、
透光性の絶縁性基板としてガラス基板１の一主表面に、
プラズマＣＶＤ法等でＩＴＯ薄膜を形成した後、ピーク
温度８５０℃・１０分保持でアニール処理を行なう。次
に、ＩＴＯ薄膜が形成されたガラス基板１に、ＹＡＧレ
ーザ光を照射して幅が約２００μｍの絶縁溝を加工し
て、ＩＴＯ電極２を形成する。又は、印刷法やフォトリ
ソ法でパターンニングしたレジスト被膜を介してエッチ
ング処理してＩＴＯ電極２を形成する。そして、ガラス
基板１を例えばタッチパネルとして実際に使用したとき
に電位差の生じるＩＴＯ電極２の互いに対向する電極端
部の表面及びこれらの電極間のガラス基板表面に、幅が
約５００μｍの撥水層３を形成する。この撥水層３を形
成するために、後述する撥水処理装置を用いる。また、
撥水処理に用いる撥水剤としては、例えば、トリアジン
チオールや旭硝子社のサイトップ（登録商標）等が挙げ
られる。An example of the manufacturing method will be described below. First,
On one main surface of the glass substrate 1 as a translucent insulating substrate,
After the ITO thin film is formed by the plasma CVD method or the like, an annealing treatment is performed at a peak temperature of 850 ° C. for 10 minutes. Next, the glass substrate 1 on which the ITO thin film is formed is irradiated with YAG laser light to form an insulating groove having a width of about 200 μm, and the ITO electrode 2 is formed. Alternatively, the ITO electrode 2 is formed by etching through a resist film patterned by a printing method or a photolithography method. Then, the water-repellent layer 3 having a width of about 500 μm is formed on the surfaces of the electrode ends of the ITO electrodes 2 facing each other and the glass substrate surface between these electrodes, in which a potential difference occurs when the glass substrate 1 is actually used as a touch panel, for example. To form. In order to form the water repellent layer 3, a water repellent treatment device described later is used. Also,
Examples of the water repellent used in the water repellent treatment include triazine thiol and CYTOP (registered trademark) of Asahi Glass Co., Ltd.
【００１２】図２は、上記撥水処理装置の具体的な構成
を示す斜視図である。キャリッジ４は、タイミングベル
ト５を介してキャリッジ駆動モータ６に接続されてい
て、ガイド部材７に案内されてプラテンローラ８上に配
置されたガラス基板１の幅方向に往復動するように構成
されている。キャリッジ４にはガラス基板１と対向する
面、すなわちこの実施例では下面側にジェット式塗布ヘ
ッド９が取り付けられている。また、キャッピング装置
１０が、非塗布領域に設けられていて、塗布の休止中に
塗布ヘッド９のノズルプレートを封止する一方、塗布動
作中に行なわれるフラッシング動作においては、塗布ヘ
ッド９からの撥水剤滴を受けるものである。またこのキ
ャッピング装置１０はクリーニング動作時においては、
塗布ヘッド９のノズルプレートを封止しつつ、吸引ポン
プ１１による負圧により塗布ヘッド９から撥水剤滴を排
出させる動作も行われる。このキャッピング装置１０に
より、塗布ヘッド９のノズル詰まりを防止し、良好な塗
布品質を維持することができる。FIG. 2 is a perspective view showing a specific structure of the water repellent treatment device. The carriage 4 is connected to a carriage drive motor 6 via a timing belt 5, and is configured to reciprocate in the width direction of the glass substrate 1 arranged on the platen roller 8 while being guided by the guide member 7. There is. A jet type coating head 9 is attached to the surface of the carriage 4 facing the glass substrate 1, that is, the lower surface side in this embodiment. Further, the capping device 10 is provided in the non-application area and seals the nozzle plate of the application head 9 while the application is paused, while the capping device 10 is repelled from the application head 9 in the flushing operation performed during the application operation. It receives liquid drops. Further, the capping device 10 is
While sealing the nozzle plate of the coating head 9, an operation of discharging the water-repellent agent droplets from the coating head 9 by negative pressure by the suction pump 11 is also performed. With this capping device 10, it is possible to prevent nozzle clogging of the coating head 9 and maintain good coating quality.
【００１３】また、塗布制御手段１３は、パソコン（不
図示）からの塗布信号を受けて、キャリッジ駆動回路１
４で制御されるキャリッジ駆動モータ６により、キャリ
ッジ４を一方向に移動させる。また、ヘッド駆動回路１
５によりジェット式塗布ヘッド９を作動させて撥水剤を
吐出させる。そして、一方向への塗布が終了した段階
で、送り機構駆動回路１６で制御される送りモータ１７
によりガラス基板１を所定距離だけ送る。また、キャリ
ッジ４を他方向へ移動させながら撥水剤を吐出させて塗
布を実行し、塗布が終了した段階で、ガラス基板１を所
定距離送り出す。The coating control means 13 receives a coating signal from a personal computer (not shown), and the carriage drive circuit 1
The carriage drive motor 6 controlled by 4 moves the carriage 4 in one direction. Also, the head drive circuit 1
5, the jet type coating head 9 is operated to discharge the water repellent. Then, when the application in one direction is completed, the feed motor 17 controlled by the feed mechanism drive circuit 16
The glass substrate 1 is fed by a predetermined distance. Further, the water repellent agent is ejected while moving the carriage 4 in the other direction to execute the application, and when the application is completed, the glass substrate 1 is sent out for a predetermined distance.
【００１４】上記ジェット式塗布ヘッド９は、キャリッ
ジ４の上部に搭載されている撥水剤収容カートリッジ１
２から撥水剤の補給を受け、塗布信号に基づいてキャリ
ッジ４の移動に合わせてガラス基板１に撥水剤滴を吐出
してドットを形成する。このようにして、ＩＴＯ電極２
の互いに対向する電極端部の表面及びこれらの電極間の
ガラス基板表面に撥水剤を塗布していき、幅が約５００
μｍの撥水層３を形成する。The jet type coating head 9 is a water repellent containing cartridge 1 mounted on the upper portion of the carriage 4.
Upon receiving the replenishment of the water repellent from 2, the water repellent droplets are ejected onto the glass substrate 1 in accordance with the movement of the carriage 4 based on the coating signal to form dots. In this way, the ITO electrode 2
The water repellent is applied to the surfaces of the electrode ends facing each other and the glass substrate surface between these electrodes, and the width is about 500.
A water-repellent layer 3 having a thickness of μm is formed.
【００１５】以上説明したように、ＩＴＯ電極２の互い
に対向する電極端部の表面及びこれらの電極間のガラス
基板表面に撥水層３を形成することにより、大気中の水
分が付着するのを防止する。よって、ＩＴＯ電極２やガ
ラス基板１に水分が吸湿されないため導電イオンの生成
や加水分解が起こらず、マイグレーションを抑制するこ
とができる。この結果、ＩＴＯ電極間のショートを防止
することができる。また、撥水処理装置への塗布信号の
変更により、塗布領域を任意に設定できるので、例えば
印刷マスクを用いてスクリーン印刷を行なう場合に比
べ、コストダウンや迅速な段取り切替えができる。As described above, by forming the water repellent layer 3 on the surfaces of the electrode ends of the ITO electrodes 2 facing each other and on the glass substrate surface between these electrodes, moisture in the atmosphere is prevented from adhering. To prevent. Therefore, since the ITO electrode 2 and the glass substrate 1 do not absorb moisture, generation of conductive ions and hydrolysis do not occur, and migration can be suppressed. As a result, a short circuit between the ITO electrodes can be prevented. Further, since the application area can be arbitrarily set by changing the application signal to the water repellent treatment device, the cost can be reduced and the setup can be quickly changed as compared with the case where screen printing is performed using a print mask.
【００１６】なお、上記実施形態では、プリンタ構造の
撥水処理装置を用いた例について説明したが、ジェット
式吐出ヘッドと絶縁性基板との少なくとも一方を平面内
で移動させる構成とすることもできる。図３（ａ）は、
ガラス基板１を固定しておき、ジェット式吐出ヘッド２
２をＸＹ方向に移動させながら、撥水剤を塗布する構成
の概略構成図である。また、図３（ｂ）は、ジェット式
吐出ヘッド２３を固定しておき、ガラス基板１を不図示
のＸＹテーブルに載置してＸＹ方向に移動させる構成の
概略構成図である。このように、ジェット式吐出ヘッド
と絶縁性基板との少なくとも一方を平面内で移動させる
ことにより、所定パターンの撥水層を容易に形成するこ
とができる。In the above embodiment, an example in which the water repellent treatment device having a printer structure is used has been described, but at least one of the jet type ejection head and the insulating substrate may be moved in a plane. . Figure 3 (a) shows
The glass substrate 1 is fixed, and the jet type ejection head 2
It is a schematic block diagram of the structure which applies a water repellent, moving 2 in XY directions. Further, FIG. 3B is a schematic configuration diagram of a configuration in which the jet-type ejection head 23 is fixed, the glass substrate 1 is placed on an XY table (not shown) and moved in the XY directions. In this way, by moving at least one of the jet-type ejection head and the insulating substrate in the plane, the water-repellent layer having a predetermined pattern can be easily formed.
【００１７】〔実施形態２〕前記従来技術で述べたよう
に、回路電極間に絶縁性樹脂をコーティングしてマイグ
レーションを防止することが行なわれている。ところ
が、フレキシブル基板に絶縁性樹脂をコーティングした
場合には、使用により絶縁性樹脂とフレキシブル基板と
の界面にクラックが生じ、このクラックから大気中の水
分が浸入してマイグレーションが発生してしまう。そこ
で、フレキシブル基板の回路電極間に絶縁性樹脂をコー
ティングする前に、その下処理として撥水層を形成して
おくこともできる。[Second Embodiment] As described in the above-mentioned prior art, an insulating resin is coated between circuit electrodes to prevent migration. However, when the flexible substrate is coated with an insulating resin, a crack is generated at the interface between the insulating resin and the flexible substrate due to use, and moisture in the atmosphere penetrates from the crack to cause migration. Therefore, before coating the insulating resin between the circuit electrodes of the flexible substrate, a water repellent layer can be formed as a pretreatment.
【００１８】図４はＩＴＯの透明導電膜が形成されたフ
レキシブル基板の構造を示し、（ａ）はフレキシブル基
板の断面図、（ｂ）は（ａ）中のＡ部拡大図を示す。FIG. 4 shows the structure of a flexible substrate on which a transparent conductive film of ITO is formed. FIG. 4A is a sectional view of the flexible substrate, and FIG. 4B is an enlarged view of part A in FIG.
【００１９】以下に製造方法の一例を説明する。図４
（ｂ）に示すように、フレキシブル基板１８にＩＴＯの
ペースト状組成物をスクリーン印刷にて所定パターンを
形成した後、必要な場合にはアニール処理を行なう。次
に、上記撥水処理装置によりＩＴＯ電極１９の互いに対
向する電極端部の表面及びこれらの電極間のフレキシブ
ル基板表面に撥水層２０を形成する。そして、撥水層２
０上及び撥水層２０よりも広い範囲のＩＴＯ電極１９上
に絶縁性樹脂２１を上記撥水処理装置と略同一構成のジ
ェット式塗布装置にて塗布する。よって、上記フレキシ
ブル基板１８の基板表面と絶縁性樹脂２１との界面にク
ラックが生じた場合であっても、撥水層２０がＩＴＯ電
極１９の互いに対向する電極端部の表面及び電極間の基
板表面に大気中の水分が付着するのを防止する。これに
より、マイグレーションを抑え、電極間のショートを防
止することができる。An example of the manufacturing method will be described below. Figure 4
As shown in (b), a predetermined pattern is formed on the flexible substrate 18 by screen-printing the ITO paste composition, and then an annealing treatment is performed if necessary. Next, the water repellent layer 20 is formed on the surfaces of the electrode ends of the ITO electrodes 19 facing each other and on the surface of the flexible substrate between these electrodes by the above water repellent treatment device. And the water repellent layer 2
0 and the ITO electrode 19 in a wider area than the water repellent layer 20 is coated with an insulating resin 21 by a jet coating device having substantially the same configuration as the water repellent treatment device. Therefore, even if a crack occurs at the interface between the substrate surface of the flexible substrate 18 and the insulating resin 21, the water-repellent layer 20 has a surface between electrode ends of the ITO electrodes 19 facing each other and a substrate between the electrodes. Prevents atmospheric moisture from adhering to the surface. As a result, migration can be suppressed and a short circuit between electrodes can be prevented.
【００２０】なお、撥水層２０の表面は接着性が悪いた
め、撥水層２０の表面から絶縁性樹脂２１は剥がれやす
いといえる。しかし、本実施形態では、撥水層２０より
も広い範囲に絶縁性樹脂２１を塗布することにより、絶
縁性樹脂２１がＩＴＯ電極１９表面と良好に接着し、絶
縁性樹脂２１の剥がれを防止している。Since the surface of the water-repellent layer 20 has poor adhesion, it can be said that the insulating resin 21 is easily peeled off from the surface of the water-repellent layer 20. However, in the present embodiment, the insulating resin 21 is applied to a wider area than the water-repellent layer 20, so that the insulating resin 21 is well adhered to the surface of the ITO electrode 19 and the insulating resin 21 is prevented from peeling off. ing.
【００２１】[0021]
【発明の効果】請求項１乃至５の発明によれば、絶縁性
基板の回路電極間のマイグレーションを抑制でき、電極
パターンの断線や電極パターン間のショートによる基板
の不良を防ぐことができるという優れた効果がある。According to the first to fifth aspects of the present invention, migration between circuit electrodes of an insulating substrate can be suppressed, and it is possible to prevent defects of the substrate due to disconnection of electrode patterns and short circuit between electrode patterns. There is an effect.
【００２２】特に、請求項２の発明によれば、例えばス
クリーン印刷のような従来の方法で撥水層を形成する場
合く比べ、コストダウンや多品種少量生産を図ることが
できるという優れた効果がある。In particular, according to the second aspect of the invention, as compared with the case where the water-repellent layer is formed by a conventional method such as screen printing, it is possible to achieve cost reduction and high-mix low-volume production. There is.
【００２３】特に、請求項３、４及び５の発明によれ
ば、絶縁性樹脂と絶縁性基板との界面にクラックが発生
して該クラックから内部に大気中の水分が浸入したとし
ても、撥水層が電極表面や電極間の基板表面に水分が付
着するのを防止する。これにより、マイグレーションを
抑制することができるという優れた効果がある。In particular, according to the third, fourth and fifth aspects of the present invention, even if a crack is generated at the interface between the insulating resin and the insulating substrate and moisture in the atmosphere penetrates into the inside from the crack, The water layer prevents moisture from adhering to the electrode surface or the substrate surface between the electrodes. Thereby, there is an excellent effect that migration can be suppressed.
【００２４】特に、請求項４の発明によれば、絶縁性樹
脂が絶縁性基板表面や電極表面と良好に接着し該絶縁性
樹脂の剥がれを防止することができるという優れた効果
がある。In particular, according to the invention of claim 4, there is an excellent effect that the insulating resin can be favorably adhered to the surface of the insulating substrate or the surface of the electrode and the peeling of the insulating resin can be prevented.
【００２５】特に、請求項５の発明によれば、塗布され
た絶縁性樹脂との界面にクラックが発生しやすいフレキ
シブル基板のマイグレーションを有効に抑制することが
できるという優れた効果がある。In particular, according to the invention of claim 5, there is an excellent effect that the migration of the flexible substrate, which is likely to cause cracks at the interface with the applied insulating resin, can be effectively suppressed.
【図１】（ａ）は、本発明の実施形態１の基板製造方法
におけるガラス基板の全体構造を示す断面図。（ｂ）
は、同ガラス基板の平面図。FIG. 1A is a sectional view showing the overall structure of a glass substrate in a substrate manufacturing method according to a first embodiment of the present invention. (B)
Is a plan view of the glass substrate.
【図２】撥水処理装置の斜視図。FIG. 2 is a perspective view of a water repellent treatment device.
【図３】（ａ）は、ガラス基板を固定しておき、ジェッ
ト式吐出ヘッドをＸＹ方向に移動させながら、撥水剤を
塗布する構成の概略構成図。（ｂ）は、ジェット式吐出
ヘッドを固定しておき、ガラス基板をＸＹテーブルに載
置してＸＹ方向に移動させる構成の概略構成図。FIG. 3A is a schematic configuration diagram of a configuration in which a glass substrate is fixed, and a water-repellent agent is applied while moving a jet type ejection head in XY directions. FIG. 7B is a schematic configuration diagram of a configuration in which the jet-type ejection head is fixed, the glass substrate is placed on an XY table and moved in the XY directions.
【図４】（ａ）は、本発明の実施形態２に係るフレキシ
ブル基板の全体構造を示す断面図。（ｂ）は、図（ａ）
中のＡ部拡大図。FIG. 4A is a sectional view showing the overall structure of a flexible substrate according to a second embodiment of the present invention. (B) is a figure (a)
FIG.
１ ガラス基板 ２，１９ ＩＴＯ電極 ３，２０ 撥水層 ４ キャリッジ ９ ジェット式塗布ヘッド １３ 塗布制御手段 １８ フレキシブル基板 ２１ 絶縁性樹脂 1 glass substrate 2,19 ITO electrode 3,20 Water repellent layer 4 carriage 9 Jet type coating head 13 Application control means 18 Flexible board 21 Insulating resin
Claims (5)
ンを形成後、電位差の生じ得る互いに対向する電極の電
極表面のうち互いに対向する電極端部の電極表面と、該
対向する電極間の絶縁性基板表面とに撥水処理を施すこ
とを特徴とする基板製造方法。1. After forming an electrode pattern of a conductive material on an insulative substrate, among electrode surfaces of electrodes facing each other where a potential difference may occur, electrode surfaces of electrode ends facing each other and insulation between the electrodes facing each other. A method for manufacturing a substrate, which comprises subjecting the surface of the flexible substrate to a water repellent treatment.
ノズル開口を備えたジェット式吐出ヘッドと絶縁性基板
の少なくとも一方を平面内で移動させながら、吐出信号
に基づいて該複数のノズル開口から撥水剤液滴を吐出さ
せて撥水層を形成することを特徴とする基板製造方法。2. The method of manufacturing a substrate according to claim 1, wherein at least one of a jet type ejection head having a plurality of nozzle openings and an insulating substrate is moved in a plane, and the plurality of nozzle openings are ejected based on an ejection signal. A method for manufacturing a substrate, characterized in that a water repellent layer is formed by discharging water repellent droplets from the substrate.
上記撥水処理の施された上記電極表面及び上記絶縁性基
板表面に絶縁性樹脂を重ねて塗布することを特徴とする
基板製造方法。3. The substrate manufacturing method according to claim 1,
A method for manufacturing a substrate, characterized in that an insulating resin is applied over the surface of the electrode and the surface of the insulating substrate that have been subjected to the water repellent treatment.
水処理の施された範囲よりも広い範囲に絶縁性樹脂を塗
布することを特徴とする基板製造方法。4. The substrate manufacturing method according to claim 3, wherein the insulating resin is applied to a wider area than the water-repellent area.
上記絶縁性基板としてフレキシブル基板を用いることを
特徴とする基板製造方法。5. The substrate manufacturing method according to claim 3 or 4,
A method of manufacturing a substrate, wherein a flexible substrate is used as the insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002019694A JP2003224349A (en) | 2002-01-29 | 2002-01-29 | Method for manufacturing substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002019694A JP2003224349A (en) | 2002-01-29 | 2002-01-29 | Method for manufacturing substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003224349A true JP2003224349A (en) | 2003-08-08 |
Family
ID=27743442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002019694A Withdrawn JP2003224349A (en) | 2002-01-29 | 2002-01-29 | Method for manufacturing substrate |
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| Country | Link |
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| JP (1) | JP2003224349A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007095512A (en) * | 2005-09-29 | 2007-04-12 | Casio Comput Co Ltd | Display device and method of manufacturing same |
| JP2010087107A (en) * | 2008-09-30 | 2010-04-15 | Fujifilm Corp | Method of forming wiring |
| US7892059B2 (en) | 2006-05-10 | 2011-02-22 | Casio Computer Co., Ltd. | Manufacturing method for organic electroluminescent display device including etching partition wall after imparting lyophilicity to partion wall and pixel electrode |
| US8087962B2 (en) | 2007-09-18 | 2012-01-03 | Casio Computer Co., Ltd. | Manufacturing method of display apparatus |
| CN114271034A (en) * | 2020-05-21 | 2022-04-01 | 株式会社村田制作所 | Stretchable wiring board |
-
2002
- 2002-01-29 JP JP2002019694A patent/JP2003224349A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007095512A (en) * | 2005-09-29 | 2007-04-12 | Casio Comput Co Ltd | Display device and method of manufacturing same |
| US7981484B2 (en) | 2005-09-29 | 2011-07-19 | Casio Computer Co., Ltd. | Display device and method of manufacturing the same |
| US7892059B2 (en) | 2006-05-10 | 2011-02-22 | Casio Computer Co., Ltd. | Manufacturing method for organic electroluminescent display device including etching partition wall after imparting lyophilicity to partion wall and pixel electrode |
| US8087962B2 (en) | 2007-09-18 | 2012-01-03 | Casio Computer Co., Ltd. | Manufacturing method of display apparatus |
| JP2010087107A (en) * | 2008-09-30 | 2010-04-15 | Fujifilm Corp | Method of forming wiring |
| US8378227B2 (en) | 2008-09-30 | 2013-02-19 | Fujifilm Corporation | Method of forming wiring board and wiring board obtained |
| CN114271034A (en) * | 2020-05-21 | 2022-04-01 | 株式会社村田制作所 | Stretchable wiring board |
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