JP2003224241A - 高効率増幅器 - Google Patents

高効率増幅器

Info

Publication number
JP2003224241A
JP2003224241A JP2002020631A JP2002020631A JP2003224241A JP 2003224241 A JP2003224241 A JP 2003224241A JP 2002020631 A JP2002020631 A JP 2002020631A JP 2002020631 A JP2002020631 A JP 2002020631A JP 2003224241 A JP2003224241 A JP 2003224241A
Authority
JP
Japan
Prior art keywords
substrate
efficiency amplifier
high efficiency
amplifier according
transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002020631A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003224241A5 (https=
Inventor
Akira Ota
彰 太田
Kiyotake Goto
清毅 後藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2002020631A priority Critical patent/JP2003224241A/ja
Publication of JP2003224241A publication Critical patent/JP2003224241A/ja
Publication of JP2003224241A5 publication Critical patent/JP2003224241A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Microwave Amplifiers (AREA)
JP2002020631A 2002-01-29 2002-01-29 高効率増幅器 Pending JP2003224241A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002020631A JP2003224241A (ja) 2002-01-29 2002-01-29 高効率増幅器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002020631A JP2003224241A (ja) 2002-01-29 2002-01-29 高効率増幅器

Publications (2)

Publication Number Publication Date
JP2003224241A true JP2003224241A (ja) 2003-08-08
JP2003224241A5 JP2003224241A5 (https=) 2005-08-11

Family

ID=27744080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002020631A Pending JP2003224241A (ja) 2002-01-29 2002-01-29 高効率増幅器

Country Status (1)

Country Link
JP (1) JP2003224241A (https=)

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