JP2003214818A - Method for detecting reference mark position - Google Patents

Method for detecting reference mark position

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Publication number
JP2003214818A
JP2003214818A JP2002019241A JP2002019241A JP2003214818A JP 2003214818 A JP2003214818 A JP 2003214818A JP 2002019241 A JP2002019241 A JP 2002019241A JP 2002019241 A JP2002019241 A JP 2002019241A JP 2003214818 A JP2003214818 A JP 2003214818A
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JP
Japan
Prior art keywords
mark
image
area
wiring board
axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002019241A
Other languages
Japanese (ja)
Other versions
JP3736464B2 (en
Inventor
Junichi Hoashi
順一 帆足
Original Assignee
Matsushita Electric Works Ltd
松下電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd, 松下電工株式会社 filed Critical Matsushita Electric Works Ltd
Priority to JP2002019241A priority Critical patent/JP3736464B2/en
Publication of JP2003214818A publication Critical patent/JP2003214818A/en
Application granted granted Critical
Publication of JP3736464B2 publication Critical patent/JP3736464B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for detecting a reference mark position in which even when strained in an image obtained by imaging an object, a reference mark disposing position on the object can be accurately detected. <P>SOLUTION: The method for detecting the reference mark position comprises the steps of dividing the image 82 obtained by imaging the object into a plurality of areas 83, imparting an arithmetic value relating to a real dimension on the object at a pixel size in the image 82 to each area 83, deriving the pixel 85 corresponding to the reference mark 13 in the image 82 obtained by imaging the object, identifying where area 83 the pixel 85 is disposed, and deriving the disposing position of the mark 13 on the object from the position of the pixel 85 corresponding to the mark 13 in the image 82 by using the arithmetic value related to the area 83. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reference mark position detecting method for detecting the position of a reference mark formed on an object from an image obtained by picking up an image of the object, and more particularly to a method for detecting the position of a reference mark. Detected the position of the fiducial mark,
The present invention relates to a technique that can be used for positioning a wiring board or the like in a multilayer structure in which wiring boards are laminated.

[0002]

2. Description of the Related Art Conventionally, when wiring boards are stacked to form a multilayer structure, a reference mark is formed on each wiring board to be stacked and the position of each wiring board is determined based on the position of the reference mark. Is detected and the wiring boards are laminated in a state where the wiring boards are aligned with each other based on the arrangement position of the wiring boards, whereby the wiring boards are laminated without misalignment.

In order to detect the arrangement position of the reference mark formed on the object such as the wiring board as described above, generally, the object is imaged by an image pickup device such as a CCD camera and the obtained image is obtained. This is performed by performing image processing and deriving the position where the reference mark is arranged.

[0004]

However, when the reference mark formed on the object such as the wiring board is imaged by the image pickup device, the reference mark can be imaged even if the displacement of the position of the reference mark is large. In addition, imaging is performed via a condenser lens, and distortion may occur between the object and the obtained image due to aberration of the condenser lens and the like. In particular, when a wide-angle condenser lens is used to image a wide area, this distortion is significant, and therefore the placement position of the reference mark is accurately detected based on such a distorted image. It was difficult.

The present invention has been made in view of the above points, and it is possible to accurately detect the arrangement position of the reference mark on the object even when the image of the object is distorted. An object of the present invention is to provide a fiducial mark position detection method that can be performed.

[0006]

A reference mark position detecting method according to the present invention is a reference mark position for deriving an image of an object on which a reference mark 13 is formed and deriving an arrangement position of the reference mark 13 from an obtained image 82. In the detection method, an image 82 obtained by capturing an image of an object is divided into a plurality of areas 83, and for each area 83, a calculation value that associates the pixel size in the image 82 with the actual size on the object is given. Reference mark 1 in image 82 obtained by imaging an object
A pixel 85 corresponding to 3 is derived, and in which area 83 this pixel 85 is located is identified.
It is characterized in that the arrangement position of the reference mark 13 on the object is derived from the position of the pixel 85 corresponding to the reference mark 13 in the image 82 by using the calculated value given to.

The image 82 is preferably divided into a plurality of areas 83 at grid-like boundaries.

It is also preferable to divide the above-mentioned image into a plurality of areas 83 at concentric circular boundaries.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to examples in which the present invention is applied to a manufacturing process of a multilayer wiring board.

The wiring boards 1 and 3 which are objects are formed by providing a circuit on one side or both sides of an insulating plate such as a resin laminated board and further on an inner layer, and in the present invention, a lower laminated board. The side wiring board 1 and the upper wiring board 3 laminated on the upper side are used. The lower wiring board 1 and the upper wiring board 3 are formed to have substantially the same size, and a reference mark 13 is provided on the surface of each of the wiring boards 1 and 3 at the edge thereof. FIG. 8 shows an example of the position of the reference mark 13 provided on the wiring boards 1 and 3.
One wiring board 1 or 3 is provided with one or a plurality of wiring boards 3. However, in order to specify the arrangement position of the wiring boards 1 and 3, at least two reference marks 13 are provided on one wiring board 1 and 3. It is preferably formed. In this embodiment, the reference mark 1
3 are arranged on both side edges of the wiring boards 1 and 3, respectively.

The size of the lower wiring board 1 and the upper wiring board 3 determines how many lower wiring boards 1 and upper wiring boards 3 are arranged. In the present embodiment, FIG. As shown, the lower wiring board 1 and the upper wiring board 3 are arranged side by side in three rows.

The prepreg 2 is formed by impregnating a base material such as glass cloth with a thermosetting resin liquid such as an epoxy resin and heating and drying the semi-cured thermosetting resin into a B-stage state. It is something. As shown in FIG. 7A, this prepreg 2 has a lower wiring board 1 or an upper wiring board 1 when a required number of lower wiring boards 1 and upper wiring boards 3 are arranged (three in a row in this embodiment). The wiring board 3 is formed to have substantially the same size as the total size.

FIG. 6 shows the layout of the apparatus of the present invention. From the left, the rough positioning portion 4, the positioning portion 5, the welding portion 6, and the take-out portion 21 are arranged in a line. Rails 22 are provided on both sides from the rough positioning portion 4 to the positioning portion 5 and the welding portion 6.

The rough positioning section 4 is formed by a work table 23 such as a suction table. First, a plurality of lower wiring boards 1 are placed side by side on the work table 23, and then the lower wiring board 1 is placed. 1. The prepregs 2 are placed so as to overlap each upper surface of 1, and a plurality of upper wiring boards 3 are placed side by side on the prepregs 2, so that the lower wiring board 1, the prepreg 2, and the upper wiring board are placed. The stack 7 composed of 3 is set on the rough positioning portion 4. Here, the plurality of upper wiring boards 3 are arranged side by side on the prepreg 2 at positions corresponding to the upper and lower sides of the lower wiring boards 1 as shown in FIG. 7B.
The upper wiring board 3 is placed on the prepreg 2 while roughly positioning the upper wiring board 3 with respect to the lower wiring board 1. The work of placing the lower wiring board 1, the prepreg 2, and the upper wiring board 3 on the rough positioning portion 4 may be performed manually by a worker or may be performed by a robot. The rough positioning of the upper wiring board 3 with respect to the lower wiring board 1
It may be performed within a range of about ± 2 mm, and can be performed by visual confirmation by the operator or confirmation by image processing of image pickup by the image pickup device.

The stack 7 in which the lower wiring board 1, the prepreg 2 and the upper wiring board 3 are stacked as described above is transferred from the rough positioning portion 4 to the positioning portion 5. At this time, the clamp transfer device 8 is used to clamp both ends of the stack 7 so that the rough positioning of the upper wiring board 3 with respect to the lower wiring board 1 is not displaced, and the lower wiring board 1 and the upper wiring board are connected. The plate 3 is transferred while being sandwiched and fixed via the prepreg 2. FIG. 9 shows the clamp tool 2 of the clamp transfer device 8.
5, showing a holder 26 having a U-shaped side surface.
And the plunger 28 provided on the upper piece 27 of the holder 26.
And a pressing piece 29 that is moved up and down by the operation of the plunger 28.
And a lower piece 30 and a holding piece 29 of the holder 26.
It can be clamped between and. The clamp tool 25 is driven and moved along the rail 22, and the clamp transfer device 8 is formed so that the clamp tool 25 can be driven and moved along the rail 22. Then, with the clamp tool 25 clamping both side ends of the stack 7 made up of the lower wiring board 1, the prepreg 2, and the upper wiring board 3, the stack 7 is fed along the rails 22 and the rough positioning portion 4 It is transferred to the positioning unit 5.

FIG. 10 shows the positioning portion 5,
The positioning unit 5 includes a suction table 9, a suction alignment unit 12, and lower and upper imagers 10 and 11. The suction table 9 has a large number of suction holes (not shown) on the upper surface.
10A and FIG.
As shown in FIG. 1, the lengthwise direction is formed so that three lower wiring boards 1 can be arranged. The suction table 9 is formed to be slightly shorter than the width of the lower wiring board 1 in the width direction, and sagging prevention plates 32 are provided at both ends of the suction table 9 so as to project laterally at predetermined intervals. Clamp tool 25 of the clamp transfer device 8
The stack 7 transferred to the positioning unit 5 in a state where the side edge is clamped by is transferred onto the suction table 9, and a plurality of lower pieces 30 provided on the clamp tool 25 are arranged as shown in FIG.
By escaping between the dripping prevention plates 32, the stack 7
Can be placed on the suction table 9. The side end of the stack 7 is supported by the sag prevention plate 32,
The suction table 9 is prevented from hanging down. When the stack 7 is placed on the suction table 9 in this manner, the upper surface of the suction table 9 is brought into a vacuum suction state, and each lower wiring board 1 is suction-fixed to the upper surface of the suction table 9, and then the clamp tool 25 is used. The clamp is released.

The suction alignment unit 12 is shown in FIG.
As shown in (b), a number of suction holes (not shown) are formed on the lower surface.
And the suction plate 33 provided with the above, and the suction plate 33 is moved up and down, and the suction plate 33 is moved in the longitudinal direction of the suction table 9 and the direction orthogonal thereto, and further in the direction in which the suction plate 33 is horizontally rotated about the vertical axis, that is, the XYθ directions. And a drive mechanism section 34 for driving. The suction board 33 is the upper wiring board 3
It is formed in a slightly smaller area, and as shown in FIG. 12, a plurality of auxiliary suction pads 35 are provided on each of the four sides of the suction plate 33 so as to project outward. The auxiliary suction pad 35 is vertically moved by a plunger 36.

In the example shown in FIG. 7, the drive mechanism section 34 has a suction support section 34a having a suction plate 33 on the lower surface, a first slide drive section 34b, a second slide drive section 34c, a rotation drive section 34d, and a lift drive section. 34e, the suction support portion 34a is provided below the first slide drive portion 34b, and the first slide drive portion 34b supports the suction support portion 34a so as to be horizontally movable in one direction by a servomotor drive or the like. is doing. Further, the first slide drive unit 34b is provided below the second slide drive unit 34c, and the second slide drive unit 34c drives the first slide drive unit 34b to move the first slide drive unit 34b to the above-mentioned first slide drive unit. Drive unit 3
It is supported so as to be horizontally movable in a direction orthogonal to the horizontal movement direction of the suction support portion 34a by 4b. Further, the second slide drive unit 34c is provided below the rotation drive unit 34d, and the rotation drive unit 34d is driven by a servo motor or the like.
The second slide drive unit 34c is supported so as to be rotatable around a vertical rotation shaft. The rotation drive unit 34d is provided below the elevation drive unit 34e.
Reference numeral e denotes a cylinder drive or the like, which supports the rotation drive unit 34d so as to be vertically movable in the vertical direction.

The drive mechanism section 34 thus constructed is
The position adjustment operation of the suction disk 33 is controlled by numerical control based on NC data transmitted from the sequencer 81 described later.

The suction alignment unit 12 is shown in FIG.
As shown in (b), it is attached to the lower side of the ceiling frame 38 of the moving body 37. The moving body 37 is formed in a gate shape by installing a ceiling bridge 38 between upper ends of columns 39 on both sides, and a traveling tool 40 is provided at a lower end of each column 39. Guide rails 41 are provided on both sides of the suction table 9 along the longitudinal direction thereof, and the traveling tool 40 is mounted on the guide rails 4.
The movable body 37 can be moved in the longitudinal direction of the suction table 9 while straddling the suction table 9 by being mounted on the suction table 9 so as to be able to drive.

The upper image pickup device 11 is attached to the columns 39 on both sides of the moving body 37 by the arms 42a, and the lower image pickup device 10 is attached to the traveling tools 40 on both sides by the arms 42b. Each imager 10, 11
Is composed of a condenser lens, an image pickup device such as a charge-coupled device (CCD), an A / D conversion circuit, an amplification circuit, etc., and A / D conversion or amplification of an electric signal obtained by photoelectrically converting the image pickup device. After performing the processing of (1), the image is transmitted to the image processing unit 80 described later. The A / D conversion circuit, the amplification circuit, etc. are the image pickup device 1
0 and 11 may be provided separately, and for example, an A / D conversion circuit, an amplification circuit, etc. may be provided in the image processing unit 80.

The upper image pickup device 11 is arranged laterally of the suction disk 33 at a position between the auxiliary suction pads 35 with the condenser lens facing downward. Further, the lower image pickup device 10 is arranged at the lower position of both side ends of the suction table 9 with the condenser lens facing upward.

These image pickup devices 10 and 11 are provided with respective reference marks 13 formed on a pair of upper and lower wiring boards 1 and 3, respectively.
Are respectively provided, and in the present embodiment, two upper side image pickup devices 11 and two lower side image pickup devices 10 are provided.

In the initial state, the moving body 37 is arranged at the end position of the suction table 9 on the side of the rough positioning portion 4, and as described above, the stack 7 placed on the suction table 9 is placed. After fixing the lower wiring board 1 by suction and releasing the clamp by the clamp tool 25, the suction board 33 of the suction alignment unit 12 is moved downward to suck the upper wiring board 3 at the end on the lower surface of the suction board 33. At the same time, the auxiliary wiring pads 35 suck the edge portions of the upper wiring board 3 protruding from the four circumferences of the suction board 33, and then the suction board 33 is moved upward to lift the upper wiring board 3.

At this time, the end edge portion of the lower wiring board 1 which is suction-fixed on the suction table 9 is removed from the gap between the sagging prevention plates 32 after the clamp 25 is retracted by the lower image pickup device 10. It is being imaged. Further, the edge portion of the upper wiring board 3 is picked up by the upper image pickup device 11 from between the auxiliary suction pads 35 while being sucked by the suction board 33. Based on the images obtained by the upper image pickup device 11 and the lower image pickup device 10, the upper wiring board 3 is accurately aligned with the lower wiring board 1 by a process described later, and in this state, the suction board By lowering 33 and placing the upper wiring board 3 on the prepreg 2, the upper wiring board 3 can be stacked in a state of being accurately aligned with the lower wiring board 1. After that, the lower wiring board 1 and the upper wiring board 3 are imaged again by the lower imaging device 10 and the upper imaging device 11, and it is confirmed that the upper wiring board 3 is aligned with the lower wiring board 1. After that, the suction of the upper wiring board 3 by the suction board 33 is released.

Next, after raising the suction disk 33, the moving body 37 is moved to move the moving body 37, as shown by an imaginary line in FIG.
The upper wiring board 3 arranged in the center is aligned with the lower wiring board 1 in the same manner as described above, and the welding portion 6
The upper wiring board 3 arranged at the end on the side closer to the lower wiring board 1 is aligned with the lower wiring board 1 in the same manner as described above. Can be aligned with the corresponding lower wiring board 1 in order. FIG. 7C shows a state in which the upper wiring board 3 is accurately aligned with the lower wiring board 1 in the positioning portion 5, and the positioning can be performed with high accuracy.

When the upper wiring boards 3 are positioned on the lower wiring boards 1 by the positioning portion 5 as described above, the stack 7 in which the lower wiring board 1, the prepreg 2, and the upper wiring board 3 are stacked.
Are transferred from the positioning unit 5 to the welding unit 6. Also at this time, the both ends of the stack 7 are clamped by the clamps 25 and transferred to the welding portion 6 by the clamp transfer device 8 so that the positioning state of the upper wiring board 3 with respect to the lower wiring board 1 does not shift. Is done.

FIG. 13 shows the welded portion 6. The conveyor belt 14, the lower heater 16 disposed below the conveyor belt 14, and the upper heater 1 disposed above the conveyor belt 14.
7, and the welding portion 6 is formed from the deodorizing suction ducts 43 arranged below the lower heater 16 and above the upper heater 17, respectively.

The conveyor belt 14 is formed of, for example, a heat-resistant long belt-shaped belt, and the drive rolls 44, 4
5 is formed so as to be driven. Figure 1
As shown in FIG. 4, collars 50 are provided at both ends of the drive rolls 44 and 46 so that the conveyor belt 14 can be fed without meandering. Then, the conveyor belt 14 is stretched from one drive roll 44 to a position between a pair of lower feed rolls 48, and is fed to the other drive roll.

A plurality of upper heaters 17 are arranged with the heating portion at the tip facing downward, as shown in FIG. 13 (b), and are moved up and down. A plurality of lower heaters 16 are arranged along the both sides of the conveyor belt 14 between the lower feed rolls 48 with the heating portion at the tip end facing upward, and are vertically moved.

In the initial state, the stack 7 whose side edge is clamped by the clamp 25 of the clamp transfer device 8 is transferred to the welding portion 6, and the stack 7 is shown in FIG. 15 (a).
As described above, it is placed on the conveyor belt 14. here,
The width of the conveyor belt 14 is formed to be narrower than the width of the stack 7, and even after the stack 7 is placed on the conveyor belt 14, as shown in FIG. The side end portion of the stack 7 that protrudes can be clamped by the clamp tool 25, and the lower wiring board 1 and the upper wiring board 3 can be clamped.
It is possible to prevent misalignment of the alignment of the.

Next, as shown in FIG. 15B, the lower heater 1
6 moves up, the upper heater 17 moves down, the lower heater 16 contacts the lower wiring board 1 via the conveyor belt 14, and the upper heater 17 approaches the upper wiring board 3. The lower wiring board 1 and the upper wiring board 3 are locally heated to locally melt the prepregs 2 in contact with each other, and the lower wiring boards 1 are locally welded to the lower surface of the prepregs 2 and temporarily bonded. At the same time, each upper wiring board 3 can be locally welded to the upper surface of the prepreg 2 and temporarily bonded. Further, the odor generated when the resin of the prepreg 2 is melted is sucked by the deodorizing suction duct 43 to be deodorized.

After each lower wiring board 1 and each upper wiring board 3 are thus temporarily adhered to the prepreg 2 to be integrated, as shown in FIG.
As shown in (c), the upper heater 17 is moved upward and then the lower heater 16 is moved downward. After this, dry air for cooling is blown to the welding point to cool it. Up to this point, the side edges of the stack 7 have been continuously clamped by the clamp 25, but at this stage, the clamp by the clamp 25 is released. Clamp tool 25 is rail 22
It is configured to return to the position of the rough positioning portion 4 along the line.

After that, the drive rolls 44 and 46 are moved to the positions shown in FIG.
It is rotationally driven as shown in (d), and the conveyor belt 14 is sent toward the take-out section 21. When the transport belt 14 is fed, the resin attached to the transport belt 14 is scraped off by the doctor blade 51. Then, the stack 7 in which the lower wiring board 1 and the upper wiring board 3 are temporarily adhered to the prepreg 2 is taken out from the welding portion 6 by the conveyor belt 14 being fed and moved toward the take-out portion 21. It can be sent to the section 21. FIG. 7C shows a state in which the upper wiring board 3 and the lower wiring board 1 are welded to the prepreg 2 at the welding portion 6 and temporarily adhered.

FIG. 16 shows the detailed structure of the upper heater 17. A heater portion 55 is provided at the tip of a cylinder rod 54 protruding from the cylinder 53, and a heat transfer plate 56 is arranged below this. I am doing it. The heat transfer plate 56 is formed by providing a heat insulating part 58 around a heat transfer part 57 having high heat conductivity such as brass, and a fitting recess 59 into which the heater part 55 fits is formed on the upper surface of the heat transfer plate 56. It is recessed. Reference numeral 60 is a cooling nozzle for blowing dry air for cooling after welding. In this structure, the heat transfer plate 56 is placed on the upper wiring board 3 of the stack 7, and the cylinder 53 is operated to move the cylinder rod 54 downward and the heater portion 55 to descend. And heat transfer section 5
When fitted into the fitting recess 59 of No. 7, the heat transfer section 57 is heated by the heater section 55, and the upper wiring board 3 can be heated and welded by the heat transferred to the lower surface of the heat transfer section 57. A portion of the heat transfer plate 56 other than the heat transfer portion 57 is a heat insulating portion 58, and the heat of the heater portion 55 is not transferred to the heat insulating portion 58. Therefore, only the heat transfer portion 57 is locally connected to the upper wiring board. 3 can be heated and welded. Lower heater 1
6 is also formed in the same manner as in FIG. 16 except that the top and bottom are reversed.

The take-out portion 21 is formed by a roller conveyor or the like, and the positioning pins 67 are provided at both end portions so as to project from the upper surface thereof.
The stack 7 is fed onto the take-out portion 21 with its both ends positioned. See also FIG.
As shown in FIG. 7, a first prepreg carry-in table 62 and a second prepreg carry-in table 63 are arranged on one side of the take-out section 21, and a loading table 64 is arranged on the other side. A prepreg 65 is loaded on the first prepreg loading table 62, and a prepreg 66 is loaded on the second prepreg loading table 63. The prepregs 65 and 66 are formed by impregnating a base material with thermosetting resin compositions having different compositions, and are formed to have the same dimensions as the prepreg 2.

First, as shown by the arrow in FIG. 17, the prepreg 65 loaded on the first prepreg loading table 62 is taken out and placed on the loading table 64, and then, as indicated by the arrow, the second prepreg loading table. The prepreg 66 loaded on the 63 is taken out and the loading table 64 is loaded.
The prepreg 66 is placed on the upper prepreg 65, and then the prepreg 66 loaded on the second prepreg carry-in table 63 is taken out and placed on the stack 7 on the take-out section 21, and then the arrow The prepreg 65 loaded on the first prepreg carry-in table 62 is taken out and placed on the prepreg 66 on the take-out section 21, and then placed on the stack 7 on the take-out section 21 as indicated by the arrow. , 66 are taken out and placed on the prepreg 66 on the stacking table 64. In this way, the stacking table 64 is placed on top of FIG.
The prepreg 6 is formed on the upper and lower outer layers of the stack 7 as in (e).
An outer layer prepreg stack 68 in which 5, 66 are stacked can be obtained. A plurality of sets of the outer layer prepreg stack 68 are stacked on the stacking table 64 and stacked, and the stacking positions are alternately shifted to facilitate the taking out. The outer layer prepreg stack 68 taken out from the loading table 64 is loaded with a metal foil such as a copper foil or the like on the outer side of the outer layer prepreg as required, and then carried into a press machine to be heated and pressed to form a multilayer wiring board. Used for manufacturing.

FIG. 18 shows a hoist 69 for stacking the prepregs 65 and 66 and the stack 7, which is provided with a suction pad 70 and a clamp claw 71. The prepregs 65 and 66 are sucked by a suction pad 70, taken out from the first prepreg carry-in table 62 and the second prepreg carry-in table 63, and stacked. In addition, the prepregs 65, 6 are placed on the stack 7 on the take-out portion 21.
The stack of 6 is clamped by the clamp claw 71 and taken out to be stacked.

The alignment control of the wiring boards 1 and 3 based on the detection of the arrangement position of the reference mark 13 in the above-mentioned multilayer wiring board manufacturing apparatus will be described in detail.

The position alignment control of the wiring boards 1 and 3 is performed by the image processing section 80 and the sequencer 81.

The image processing section 80 processes the electric signals transmitted from the image pickup devices 10 and 11 in accordance with a computer program stored therein, and picks up the image pickup device 10 on the object (here, wiring boards 1 and 3). , 11 form an image 82 of the region (imaging region 84) to be imaged, and the arrangement position of the reference mark 13 is identified based on this image 82. In deriving the arrangement position of the reference mark 13 in the image processing unit 80, for example, the arrangement position of the reference mark 13 is derived based on a general image processing method, and the image 82 corresponding to the center position of the reference mark 13 is derived. The position (address) of the inside pixel 85 is specified. Then, from the address of the specified pixel 85, the reference mark 13
The position of the reference mark 1
The arrangement position of 3 is detected.

The reference mark 13 in the image processing unit 80.
A method of deriving the arrangement position of the reference mark 13 from the address of the pixel 85 corresponding to will be described in detail.

The image processing section 80 divides the constructed image 82 into a plurality of predetermined areas 83. Although this area 83 can be set arbitrarily, for example, as shown in FIG. 1, a plurality of rectangular areas 83 divided by a grid-like boundary line are arranged in a matrix in a rectangular image 82. Can be set as:

Further, the image processing section 80 has a reference mark 1
A coordinate axis for displaying the position of an arbitrary point on the plane parallel to the wiring boards 1 and 3 in the state of capturing an image of 3 is set. As this coordinate axis, for example, an orthogonal coordinate axis composed of a coordinate axis in the reference direction (x axis) parallel to the horizontal direction on the imaging region 84 and a coordinate axis in the reference direction (y axis) parallel to the vertical direction can be set. Further, a specific point in each imaging region 84 imaged by each imaging device 10, 11 is a reference point 8
6 is set, and the coordinates of the reference point 86 on the above coordinate axes are set.

In addition, a plurality of areas 83 in the image 82
Is a calculated value that associates the pixel size in the coordinate axis direction in each area 83 with the actual size in the coordinate axis direction on the image pickup area 84 corresponding to this area 83, and the image pickup area corresponding to an arbitrary pixel based on this calculated value. An arithmetic expression for deriving the coordinates on 84 is derived in advance, and the arithmetic value and the arithmetic expression are stored in the image processing unit 80.

The calculated value can be, for example, the actual size of the image pickup area 84 in the coordinate axis direction, which corresponds to the size of one pixel in the coordinate axis direction. At this time, the calculated value can be derived based on actual measurement, and when the above-mentioned orthogonal coordinate axis is set as the coordinate axis, the calculated value is derived for each of the x-axis direction and the y-axis direction.

An example of the method of deriving the calculated value is as follows.

In the imaging area 84, a plurality of points arranged in the x-axis direction and the y-axis direction are set in the area corresponding to each area 83 in the image 82, and the actual size in the coordinate axis direction between the two points is set.
A value divided by the number of pixels in the coordinate axis direction between these two points in the image 82 is derived. This value is derived for each of the x-axis direction and the y-axis direction using a combination of two or more sets of two points, and the average value of the obtained values is calculated in the x-axis direction and the y-axis direction. Is calculated.

For example, as shown in FIG. 3A, a total of twelve points, four rows in the x-axis direction and three rows in the y-axis direction, are provided in an area within the imaging area 84 corresponding to one area 83. For the combination of eight adjacent points in the x-axis direction, the actual sizes X1 to X8 in the x-axis direction between the two points are respectively defined as pixels in the coordinate axis direction between the two points in the area 83 of the image 82. Derive the value divided by a number. Then, the average value of the obtained eight values is set as the calculated value in the x-axis direction. Further, as shown in FIG. 3B, a total of 12 points are set in an area of the imaging area 84 corresponding to one area 83, three rows in the x-axis direction and four rows in the y-axis direction. Then, for a combination of eight adjacent points in the y-axis direction, a value obtained by dividing the actual dimensions Y1 to Y8 in the y-axis direction between the two points by the number of pixels in the coordinate axis direction between each two points in the image 82. Derive. Then, the average value of the obtained eight values is set as the calculated value in the y-axis direction.

An example of the method of deriving the arithmetic expression is as follows.

Here, the reference point 86 on the coordinate axis of the image pickup area 84 is defined by one corner of the rectangular image pickup area 84 (see FIG. 1).
(Upper left corner of the imaging area 84 shown in (b)),
Let that address be (Ax 0 , Ay 0 ). Further, the origin 87 of the pixel address is set at the corner of the image 82 corresponding to the reference point 86 of the coordinate axis in the image pickup area 84. The pixel address is x-th in the x-axis direction from the origin position and y.
The one arranged y-th in the axial direction is represented as (x, y).

Further, the coordinates of the point on the image pickup area 84 corresponding to the address of this pixel are displayed as (Ax, Ay).

Further, the address of the area 83 arranged at the X-th area in the x-axis direction and the Y-th area in the y-axis direction counting from the area 83 including the origin 87 of the pixel address is (X, Y).
The calculated value in the x-axis direction of the area 83 at this address (X, Y) is δ X, Y , and the calculated value in the y-axis direction is ε X, Y.

In this case, with respect to the area 83 arranged in the x-th direction in the x-axis direction and the Y-th area in the y-axis direction counting from the area 83 including the origin 87 of the pixel address, the following arithmetic expression is used. A general formula is derived.

Ax = Ax 0 + δ X, Y × x Ay = Ay 0 + ε X, Y × y Then, the image processing unit 80 causes the reference in the imaging area 84 based on the above-described arithmetic expression and arithmetic value. A function of deriving the coordinates (Ax, Ay) of a point corresponding to the arrangement position of the mark 13 is provided.

At this time, the image processing section 80 stores the general formula and the calculated value of such a calculation formula, and
Based on the address (x, y) of the pixel 85 corresponding to the arrangement position of the reference mark 13 derived by the image processing, the address (X, Y) of the area 83 including the pixel 85, and the value of the calculated value A function for deriving a specific arithmetic expression from the equation and deriving the coordinates (Ax, Ay) of the arrangement position of the reference mark 13 in the imaging region 84 from the arithmetic expression is provided. In addition, the image processing unit 80 stores a specific arithmetic expression for each area 83, which is derived from the above general expression and the arithmetic value, in association with each area 83 in the image 82, and performs image processing. On the basis of the address (X, Y) of the area 83 including the pixel 85 corresponding to the arrangement position of the reference mark 13 derived in step 3, a specific arithmetic expression associated with this area 83 is selected, and this arithmetic expression is selected. Based on the address of the pixel 85, the reference mark 1 in the imaging area 84
A function of deriving the coordinates (Ax, Ay) of the arrangement position of 3 may be provided.

For example, the number of pixels in the x-axis direction in each area 83 is 1,600, the number of pixels in the y-axis direction is 1,600, and the coordinates of the reference point 86 are (0,250) in μm units.
000) and the address of the pixel 85 corresponding to the reference mark 13 derived by the image processing in the image processing unit 80 is (1000, 4000), the area 83 in which the pixel 85 is arranged. The address of
It becomes (1, 3). In this case, the coordinates (Ax, Ay) of the point corresponding to the arrangement position of the reference mark 13 are as follows. Ax = 0 + δ 1,3 × 1000 Ay = 250,000 + ε 1,3 × 4000 At this time, δ 1,3 = 1.518219 (μm / one pixel) and ε 1,3 = 1.523229 (μm / one pixel). Then, Ax = 1518.219 (μm), Ay =
It is 256092.916 μm.

Another example of the method of deriving the arithmetic expression is as follows.

Here, the reference point 86 on the coordinate axis of the image pickup area 84 is set at one corner of the rectangular image pickup area 84 (see FIG. 1).
(Upper left corner of the imaging area 84 shown in (b)),
Let that address be (Ax 0 , Ay 0 ). Further, the origin 87 of the pixel address is set at the corner of the image 82 corresponding to the reference point 86 of the coordinate axis in the image pickup area 84. The pixel address is x-th in the x-axis direction from the origin position and y.
The one arranged y-th in the axial direction is represented as (x, y).

The coordinates of the point on the image pickup area 84 corresponding to the address of this pixel are displayed as (Ax, Ay).

In each area 83, the number of pixels in the x-axis direction is M and the number of pixels in the y-axis direction is N.

Further, counting from the area 83 including the reference point 86 of the pixel address, the Xth pixel is arranged in the x-axis direction and the Yth pixel is formed in the y-axis direction.
The address of the area 83 arranged in the second area is (X,
Y), the calculated value in the x-axis direction of the area 83 at this address (X, Y) is δ X, Y , and the calculated value in the y-axis direction is ε X, Y.

In this case, the following arithmetic expression is derived for the area 83 arranged in the x-th direction in the x-axis direction and the Y-th area in the y-axis direction counting from the area 83 including the origin 87 of the coordinate axis. It

[0064]

[Equation 1]

[0065]

[Equation 2]

In the above equation, δ 0, Y = δ
It is defined that X, 0 = 0 and ε 0, Y = ε X, 0 = 0.

Then, the image processing unit 80 has a function of deriving the coordinates (Ax, Ay) of a point corresponding to the arrangement position of the reference mark 13 on the image pickup area 84 based on the above-mentioned arithmetic expression and arithmetic value. Is provided.

At this time, the image processing unit 80 stores the general formula and the calculated value of such a calculation formula, and
Based on the address (x, y) of the pixel 85 corresponding to the arrangement position of the reference mark 13 derived by the image processing, the address (X, Y) of the area 83 including the pixel 85, and the value of the calculated value A function for deriving a specific arithmetic expression from the equation and deriving the coordinates (Ax, Ay) of the arrangement position of the reference mark 13 in the imaging region 84 from the arithmetic expression is provided. In addition, the image processing unit 80 stores a specific arithmetic expression for each area 83, which is derived from the above general expression and the arithmetic value, in association with each area 83 in the image 82, and performs image processing. On the basis of the address (X, Y) of the area 83 including the pixel 85 corresponding to the arrangement position of the reference mark 13 derived in step 3, a specific arithmetic expression associated with this area 83 is selected, and this arithmetic expression is selected. Based on the address of the pixel 85, the reference mark 1 in the imaging area 84
A function of deriving the coordinates (Ax, Ay) of the arrangement position of 3 may be provided.

For example, the number of pixels in the x-axis direction in each area 83 is 1600, and the number of pixels in the y-axis direction is 1600, and it corresponds to the reference mark 13 derived by the image processing in the image processing unit 80. If the address of the pixel 85 to be selected is (1000, 4000), this pixel 85
The address of the area 83 where is located is (1, 3)
Becomes In this case, the coordinates (Ax, Ay) of the point corresponding to the arrangement position of the reference mark 13 are as follows. Ax = Ax 0 + δ 0,3 × 1600 + δ 1,3 × {1000- (1-1) × 1600} Ay = Ay 0 + δ 1,0 × 1600 + ε 1,1 × 1600 + ε 1,2 × 1600 + ε 1,3 × { 4000- (3-1) × 1600} At this time, as described above, the coordinates of the reference point 86 are (0.25000) in μm units, δ 0,3 = δ 1,0 = 0, and δ 1,3 = 1.518219 (μm / one pixel), ε 1,1 = 1.52207 (μm / one pixel), ε 1,2
= 1.527884 (μm / one pixel), ε 1,3 = 1.5
Assuming 23229 (μm / one pixel), Ax = 1
518.219 (μm), Ay = 2560609.509
6 (μm).

Using the arithmetic expression thus derived,
In addition to the calculated value in the area 83 including the pixel 85 corresponding to the reference mark 13, the area 8 including the pixel 85 corresponding to the origin position and the reference mark 13 in the imaging region 84
Since the coordinates corresponding to the reference mark 13 are derived by using the calculated values in the other areas 83 between 3 and 3, the coordinates corresponding to the reference mark 13 can be derived more accurately.

In the above example, the position of the reference point 86 is set at the corner of the image pickup area 84, but the reference point 86 can be set at an arbitrary position, for example, the center position of the image pickup area 84. it can. In this case, an arithmetic expression is appropriately set based on the calculated value according to the position of the reference point 86.

That is, an arbitrary point in each image pickup area 84 is set in advance as a reference point 86, and the coordinates of this reference point 86 on the coordinate axes on the plane parallel to the wiring boards 1 and 3 and this reference point 86 are set. The address of the pixel in the corresponding image 82 is stored in the image processing unit 80, and when detecting the arrangement position of the reference mark 13, in the image processing unit 80, the pixel corresponding to the reference point 86 and the reference mark 13 are detected. An arithmetic expression derived by deriving the number of pixels in the x-axis direction and the y-axis direction between the pixel 85 and the pixel 85 corresponding to the arrangement position, and deriving based on the arithmetic value given to each area 83 as described above, The number of pixels in the x-axis direction and the number of pixels in the y-axis direction are respectively defined as x in the imaging region 84.
The coordinate of the reference mark 13 is derived by converting the actual size in the axial direction and the actual size in the y-axis direction and using the value as the difference between the coordinate values corresponding to the reference point 86 and the reference mark 13, respectively.

When deriving the difference between the coordinate values corresponding to the reference point 86 and the reference mark 13 by this arithmetic expression, only the arithmetic value given to the area 83 including the pixel 85 corresponding to the reference mark 13 is derived. From the number of pixels in the x-axis direction between the pixels using only the calculated value in the x-axis direction of the area 83, and the coordinate in the y-axis direction is calculated. Can be derived from the number of pixels in the y-axis direction between the pixels using only the calculated value in the y-axis direction of the area 83.

Further, a straight line in the x-axis direction and the y-axis direction connecting the pixels corresponding to the reference point 86 and the reference mark 13 in the image 82, or the x-axis direction portion and the y-axis direction portion of this straight line Of at least one of them is a pixel corresponding to the reference point 86 when one end thereof is located at a pixel corresponding to the reference point 86, and conversely, a pixel corresponding to the reference point 86 is located at a pixel corresponding to the reference mark 13. Set the straight line that has been translated so that
It is also possible to derive the difference between the coordinate values corresponding to the reference point 86 and the reference mark 13 by using the calculated values of all the areas 83 through which this straight line passes. In this case, the number of pixels of a portion of each of the straight lines in the x-axis direction that passes through each area 83 is converted into the actual size in the imaging region 84 by the calculated value in the x-axis direction given to the area 83, and the integrated amount thereof is calculated. Is the difference between the values in the x-axis direction of the coordinates corresponding to the reference point 86 and the reference mark 13, respectively, and the number of pixels of the portion of the straight line in the y-axis direction that passes through each area 83 is given to that area 83. The calculated value in the y-axis direction is converted into the actual size in the imaging region 84, and the integrated amount is calculated as the reference point 86 and the reference mark 13.
Can be taken as the difference in the values in the y-axis direction of the coordinates respectively corresponding to. In this case, the coordinates of the reference mark 13 can be derived more accurately.

After deriving the coordinates of the reference mark 13 in each image pickup area 84 in this way, the image processing unit 80
Transmits the information of the coordinates of the reference mark 13 to the sequencer 81 as an electric signal.

The sequencer 81, based on the coordinate information of each reference mark 13 transmitted from the image processing unit 80,
The moving distances in the x-axis direction and the y-axis direction of the upper wiring board 3 and the wiring board 3 required for the reference marks 13 of the upper and lower wiring boards 1 and 3 to have a predetermined arrangement relationship by the vector calculation. Of the rotation angle about the θ axis is generated, NC data is generated based on this calculation result, and there is no positional deviation between the wiring board 1 arranged below and the wiring board 3 arranged above. It is provided with a function of numerically controlling the drive mechanism section 34 so as to have a predetermined positional relationship. For example, when the reference mark 13 of the upper wiring board 3 and the lower wiring board 1 have a predetermined positional relationship, the arrangement positions of the reference marks 13 of the respective wiring boards 1 and 3 are the same in plan view. , The sequencer 81 performs a vector operation so that the reference mark 13 of the upper wiring board 3 is located at the same position as the lower reference mark 13 is arranged. 3 in x-axis direction and y-axis direction and θ of wiring board 3
The rotation angle about the axis is derived, NC data based on the calculation result is generated, and the wiring board 1 arranged below
It is provided with a function of numerically controlling the drive mechanism section 34 so that the wiring board 3 arranged above has a predetermined positional relationship without displacement.

By deriving the arrangement position of the reference mark 13 as described above, even if the image 82 picked up by the image pickup devices 10 and 11 is distorted with respect to the actual image pickup area 84, the plurality of areas 83 can be obtained. By performing the correction based on the set calculation value, the accurate arrangement position of the reference mark 13 can be derived, and when it is used for the alignment of the wiring boards 1 and 3 as described above, the wiring The plates 1 and 3 can be accurately aligned with each other.

In particular, when the wiring boards 1 and 3 are aligned with each other as described above, the image pickup devices 10 and 11 need to use a wide-angle condenser lens so that the reference mark 13 can be reliably picked up. However, the aberration of the condenser lens increases, but according to the present invention, the image 8 due to such aberration is generated.
By correcting the distortion of No. 2, it is possible to accurately derive the arrangement position of the reference mark 13.

Further, since the degree of distortion of the image 82 due to the aberration of the lens usually depends on the distance from the center of the image 82, when setting the calculation value, the image 8
The same calculation value can be given to the areas 83 whose distances from the center of 2 are equal to or close to each other. For example, as shown in FIG. 1, when setting an area 83 divided by a grid-like boundary line, an area 83 in an image 82 and a set 88 of four areas 83 set at the center and The set 88 of the areas 83 is classified into a set 88 of square-shaped areas 83 that sequentially surround each other, and the same calculation value is given to each area 83 in each set 88.
In this case, the same calculated value can be given to the area 83 having a similar distance from the center of the image 82.

Further, the method of setting the area 83 in the image 82 is not limited to the method of using the grid-like boundary lines as described above. For example, as shown in FIG.
The boundary can be divided by a plurality of circles arranged concentrically with respect to the center of the image and a straight line radially arranged with respect to the center of the image 82. In this case, image 8
The area 83 in 2 is classified into a set 88 of areas 83 divided by concentric circles, and the area 8 in each set 88 is divided.
It is possible to give the same calculation value to each of the three. In this case, the same calculated value can be given to the areas 83 having the same distance from the center of the image 82, and the arrangement position of the reference mark 13 can be detected more accurately.

[0081]

As described above, the fiducial mark position detecting method according to the present invention captures an image of an object on which fiducial marks are formed,
In the reference mark position detection method that derives the position of the reference mark from the obtained image, the image obtained by imaging the object is divided into multiple areas, and for each area, the pixel size in the image and the object In the image obtained by imaging the object, the pixel corresponding to the reference mark is derived, the area in which this pixel is located is identified, and the pixel is associated with this area. Using the calculated value, the position of the reference mark on the object is derived from the position of the pixel corresponding to the reference mark in the image, so even if the image obtained by imaging the object is distorted, The arrangement position of the reference mark can be accurately detected.

Further, when the image is divided into a plurality of areas by the grid-like boundary line, the calculated value is given to each of the divided areas, and the arrangement position of the reference mark can be accurately detected. is there.

Further, when the image is divided into a plurality of areas along the concentric circle boundary line, a calculated value is given to each of the divided areas, and the arrangement position of the reference mark can be accurately detected. In addition, it is possible to give a calculated value to each area according to the distance from the center of the image, and according to the degree of image distortion due to the aberration of the condenser lens of the image pickup device that changes according to the distance from the center of the image. The calculation value can be given to each area, and the arrangement position of the reference mark can be detected more accurately.

[Brief description of drawings]

FIG. 1 shows an example of an embodiment of the present invention,
(A) is the schematic which shows the image which imaged the target object, (b) is the schematic which shows the imaging area of the wiring board which is the target object.

FIG. 2 shows another example of the embodiment of the present invention,
It is the schematic which shows the image which imaged the target object.

3A and 3B are conceptual diagrams illustrating an example of a method of deriving a calculation value.

FIG. 4 is a schematic perspective view showing a step of aligning wiring boards with each other.

FIG. 5 is a schematic front view of the above.

FIG. 6 is a schematic plan view showing an example of a multilayer process of a wiring board.

7 (a) to 7 (e) are schematic views showing a state of each step of the same.

FIG. 8 is a plan view showing an example of a wiring board used in the above.

FIG. 9 is a side view of the above clamp device.

FIG. 10 is a view showing a positioning portion of the above, (a)
Is a front view and (b) is a side view.

FIG. 11 is a plan view of the suction table of the above.

12A and 12B show the suction alignment unit of the above, wherein FIG. 12A is a front view and FIG. 12B is a plan view.

13A and 13B are views showing a welded portion of the same, in which FIG. 13A is a front view and FIG. 13B is a plan view.

FIG. 14 is a plan view showing a drive roll of the above.

FIG. 15 is a view showing a welding procedure at a welding portion of the above, and (a) to (d) are front views, respectively.

FIG. 16 is a front view with a part in section showing the upper heater of the same.

FIG. 17 is a plan view of a portion of the take-out portion of the above.

FIG. 18 is a front view of the above hoist.

[Explanation of symbols]

13 Standard mark 82 images 83 areas 85 pixels

Claims (3)

[Claims]
1. An image of an object on which a reference mark is formed is imaged,
In the reference mark position detection method that derives the position of the reference mark from the obtained image, the image obtained by imaging the object is divided into multiple areas, and for each area, the pixel size in the image and the object In the image obtained by imaging the object, the pixel corresponding to the reference mark is derived, the area in which the pixel is located is identified, and the calculated value is given to this area. A reference mark position detecting method, which uses an arithmetic value to derive an arrangement position of the reference mark on the object from a position of a pixel corresponding to the reference mark in the image.
2. The fiducial mark position detecting method according to claim 1, wherein the image is divided into a plurality of areas along a grid-like boundary line.
3. The fiducial mark position detecting method according to claim 1, wherein the image is divided into a plurality of areas along concentric boundary lines.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014055833A (en) * 2012-09-12 2014-03-27 Jfe Steel Corp Method and apparatus for measuring hot long material
WO2015152331A1 (en) * 2014-04-02 2015-10-08 株式会社Ihi Pre-preg sheet lamination device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014055833A (en) * 2012-09-12 2014-03-27 Jfe Steel Corp Method and apparatus for measuring hot long material
WO2015152331A1 (en) * 2014-04-02 2015-10-08 株式会社Ihi Pre-preg sheet lamination device
CN106029318A (en) * 2014-04-02 2016-10-12 株式会社Ihi Pre-preg sheet lamination device
JPWO2015152331A1 (en) * 2014-04-02 2017-04-13 株式会社Ihi Prepreg sheet laminating equipment
CN106029318B (en) * 2014-04-02 2017-12-26 株式会社Ihi Presoak sheet material stacked laminator
KR20180102699A (en) * 2014-04-02 2018-09-17 가부시키가이샤 아이에이치아이 Pre-preg sheet lamination device
KR101998539B1 (en) * 2014-04-02 2019-07-09 가부시키가이샤 아이에이치아이 Pre-preg sheet lamination device

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