JP2003165048A - Polishing tool shaping method and polishing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent unbalanced local loads from occurring in a wafer by suppressing polishing head rocking attributable to a wavy polishing tool by dressing or seasoning the tool without damaging the wafer surface to undergo polishing. <P>SOLUTION: The polishing device has a polishing head 2 for sucking and fixing a wafer 10, a polishing tool 5 for polishing the wafer 10, and a mechanism for causing relative movement between the wafer 10 and the tool 5 with the two remaining in contact with each other. A dressing plate or a seasoning plate is sucked and fixed to the part, designed for the wafer 10 on the polishing head 2 to be sucked to, and the surface of the tool 5 is dressed or seasoned in the fashion a wafer is polished. Waviness on the polishing surface of the tool 5 (caused by a polishing stool 1 and the polishing tool 5) is removed, and this suppresses the rocking of the head 2 due to waviness on the polishing surface and thereby prevents unbalanced local loads from occurring on the wafer 10. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plate-shaped member polishing apparatus, and more particularly to a method and a polishing apparatus for shaping a polishing tool used in a polishing step of a thin plate-shaped member such as a semiconductor wafer or a glass plate for LCD. Regarding

[0002]

2. Description of the Related Art Conventionally known general wafer manufacturing processes include the following processes. First,
A substantially cylindrical ingot formed by growing a seed crystal is sliced with a wire saw to form a disk-shaped wafer. Then, in order to adjust the shape of the wafer, the outer periphery and both the front and back surfaces are ground by a grinder to flatten the front and back surfaces of the wafer. Further, the front and back surfaces of the wafer are mirror-polished by a polishing device to finish the wafer with sufficient flatness and surface roughness.

As a polishing apparatus used in the polishing step of the above-mentioned wafer manufacturing, Japanese Patent No. 3109558 discloses a polishing apparatus.
A polishing apparatus using a vacuum chuck as shown in FIG. 6 is disclosed. FIG. 6 is a vertical sectional view schematically showing a part of the polishing apparatus.

A circular shape (diameter 200 to 250 mm) made of ceramics such as alumina or metal such as stainless steel.
The peripheral portion of the upper surface of the holding table 50 is removed, and Al ₂ O
_A ring-shaped retainer 51 made of a material such as ₃ (alumina), SiO ₂ (quartz), or SiC is fitted. The surface of the retainer 51 is lapped or ground, and a large number of fine diamond grains are embedded by metal bonds such as cast iron. The retainer 51 is attached to the missing portion of the holding table 50 by a method such as vacuum suction, screw fixing, and stopper fixing.

At the central portion inside the retainer 51 on the surface of the holding table 50, a suction portion 53 made of a resin such as polyfluoroethylene fiber having a plurality of concentric and radial grooves 52 is formed by an adhesive. It is installed. Further, a plurality of holes 54 are provided in the center of the suction portion 53 and the bottom portion of the groove 52 around the suction portion 53.
0 is connected to the vacuum line 55. The vacuum line 55 is connected to a pressure reducer (not shown).

The wafer 56 is placed on the holding table 50 constructed as described above, the vacuum line 55 is evacuated, the wafer 55 is vacuum-sucked to the suction part 53, and the rotating pad-shaped polishing tool is used. The wafer is being polished. At this time, since the polishing pad 57 contacts the wafer 56 and the retainer 51 in which the diamond grains are embedded, the polishing pad 57 polishes the wafer 56 and at the same time, the polishing pad 57 is seasoned by the diamond grains. As a result, the surface of the polishing pad 57 is constantly regenerated during the polishing process.
The progress of clogging can be delayed.

[0007]

However, according to the above-mentioned conventional technique, the retainer 51 in which the fine diamond grains are embedded always removes the polishing pad 57 during the polishing process of the wafer 56. Therefore, there is a problem that the abrasion amount of the polishing pad 57 is large and the life of the polishing pad 57 is short.

Also, during the polishing process, the abrasive grains embedded in the retainer 51 may fall off and scratch the surface to be polished of the wafer 56.

The invention according to the present application was made in order to solve the above problems, and its purpose is to prevent scratches on the surface to be polished of a wafer.
It is an object of the present invention to provide a method and apparatus for shaping or seasoning a polishing tool.

Another object of the invention according to the present application is to provide a method and apparatus for suppressing the oscillation of the polishing head due to the waviness of the polishing tool and preventing a local unbalanced load from being generated on the wafer. To do.

[0011]

In order to achieve the above object, a first aspect of the present invention provides a support mechanism for suction-fixing a member to be polished, a polishing tool for polishing the member to be polished, In a polishing device comprising: a member to be polished and means for relatively moving the member in contact with each other,
The polishing apparatus includes a polishing tool processing tool which is suction-fixed to the support mechanism and shapes or sharpens the polishing tool.

According to a second aspect of the present invention, a support mechanism for sucking and fixing a member to be polished, a polishing tool for polishing the member to be polished, and the member to be polished and the polishing tool are in contact with each other. A polishing tool processing tool for shaping or sharpening the polishing tool in a polishing device comprising means for relatively moving the polishing tool in a state, the polishing tool having a shape capable of being suction-fixed to the support mechanism. It is a processing tool.

Further, in a third invention according to the present application, the polishing tool processing tool is one in which abrasive grains are fixed on the surface of a disk-shaped member made of metal or ceramics, or the abrasive grains are made of resin, glass or A polishing tool according to the second aspect of the present invention, which is a disk-shaped member bonded by a metal, or a disk-shaped member made of metal or a disk-shaped member made of ceramics. It is a processing tool.

In a fourth aspect of the present invention, a support mechanism for sucking and fixing a member to be polished, a polishing tool for polishing the member to be polished, and the member to be polished and the polishing tool are in contact with each other. A method of shaping or sharpening the polishing tool in a polishing apparatus including means for relatively moving the polishing tool, wherein a polishing tool processing tool for shaping or dressing the polishing tool is suction-fixed to the support mechanism. And a step of relatively moving the polishing tool processing tool and the polishing tool in a state of being in contact with each other.

Further, a fifth invention according to the present application is a support mechanism for sucking and fixing a member to be polished, a polishing tool for polishing the member to be polished, a polishing platen on which the polishing tool is installed, A method of shaping the polishing tool in a polishing apparatus comprising: a member to be polished and a means for relatively moving the polishing tool in contact with each other, wherein the polishing tool is installed on the polishing platen. A step of fixing a dressing plate for shaping the polishing tool to the support mechanism by suction, and a shaping step of relatively moving the dressing plate and the polishing tool in contact with each other. This is a characteristic method.

[0016] A sixth invention according to the present application is the provision of a seasoning plate for sharpening the polishing tool after the setting step, the fixing step, and the shaping step.
The method according to the fifth aspect of the present invention, comprising: a step of suction-fixing to the support mechanism; and a step of relatively moving the seasoning plate and the polishing tool in a state of being in contact with each other.

Further, a seventh invention according to the present application is a support mechanism for sucking and fixing a disk-shaped member containing at least silicon, a polishing tool for polishing the disk-shaped member, and the disk-shaped member. A method of manufacturing a silicon wafer by a polishing apparatus comprising: a means for relatively moving the polishing tool in contact with each other, wherein the polishing tool processing tool for shaping or sharpening the polishing tool is the support mechanism. Suction-fixing, relative movement of the polishing tool processing tool and the polishing tool in contact with each other, and relative movement of the disk-shaped member and the polishing tool in contact with each other And a step of manufacturing the silicon wafer.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the invention according to the present application will be described in detail below with reference to FIGS. FIG. 1 is a vertical sectional view schematically showing a part of a polishing apparatus according to the present invention. This polishing apparatus is roughly composed of a polishing surface plate 1, a polishing head 2 and a slurry nozzle 3.

The polishing platen 1 is made of stainless steel or ceramics and has an outer shape of a thick disk. A cylindrical or cylindrical surface plate rotating shaft 4 is fixed to the center of the lower surface of the polishing surface plate 1. The surface plate rotating shaft 4 is arranged vertically upright, and the polishing surface plate 1 fixed to the upper end of the shaft is arranged horizontally. The upper surface of the polishing platen 1 is a flat surface, and a polishing tool 5 made of non-woven fabric or the like is provided on the flat surface. As the material of the polishing tool 5, urethane resin, polyester resin or the like is generally used.

The surface plate rotating shaft 4 receives rotational power from a rotation driving mechanism (not shown) and rotates about its axis. As this rotary drive mechanism, there is one that transmits a driving force from a rotary drive motor arranged below the polishing platen 1 to the platen rotary shaft 4 by a gear or a timing belt. The surface plate rotary shaft 4 to which the rotary power is transmitted from the rotary drive motor rotates about the shaft center. Then, the polishing platen 1 fixed to the upper end of the shaft rotates in the horizontal plane. In polishing a wafer, the polishing platen 1 is often rotated only in a fixed direction, but the rotation direction of the rotation drive motor may be controlled so as to rotate in the opposite direction after a predetermined rotation.

FIG. 2 is an enlarged view showing a vertical cross section of the polishing head 2. As shown in FIG. 2, a rotatable head rotating shaft 6 is vertically arranged above the polishing head 2. Rotational power is applied to the head rotation shaft 6 by a head drive mechanism (not shown), and the head rotation shaft 6 is rotated about its axis. A top ring 7 made of a stainless steel disc is fixed to the lower end of the head rotation shaft 6.

The top ring 7 is formed on the lower surface of the disk-shaped member,
An annular projection 8 having a predetermined wall thickness is integrally formed vertically downward, and a head rotation shaft 6 is fixed to the center of the upper surface of the disk-shaped member. Rotational power is applied to the head rotation shaft 6 from the head drive mechanism, and this rotational power is transmitted to the top ring 7 to rotate the top ring 7.
A suction tube 19 for vacuum suction is provided in the center of the top ring 7.
Are arranged in the vertical direction. The suction pipe 19 penetrates the top ring 7, passes through the center of the head rotation shaft 6, and is connected to a vacuum suction pump (not shown).

Below the top ring 7, a chuck plate 9 is attached. The chuck plate 9 is made of stainless steel or ceramics and has a suction surface 11 which is a circular flat surface having a diameter equivalent to that of a disk-shaped wafer 10 which is an object to be polished. In the present embodiment, in order to describe the case of polishing a wafer having a diameter of 200 mm as the wafer 10, the suction surface 1 of the chuck plate 9 will be described.
1 also has a diameter of about 200 mm.

A circular recess 12 is provided on the upper surface of the chuck plate 9, and a plurality of female screws 13 are formed on the annular upper surface located on the outer periphery of the recess 12. The top ring 7 has a through hole 14 at a position corresponding to the female screw 13. By inserting a bolt 15 through the through hole 14 and screwing it into the female screw 13, the chuck plate 9 is fixed to the lower surface of the top ring 7. At this time, a rubber O-ring 16 is arranged between the outer peripheral surface of the annular projection 8 of the top ring 7 and the inner peripheral surface of the recess 12, and the recess 12 and the top ring 7 on the upper surface of the chuck plate 9 are arranged. The airtightness of the space 17 formed by the lower surface of the is maintained.

The lower surface of the chuck plate 9 serves as a reference surface for wafer polishing, and thus has a flat surface with high flatness. The chuck plate 9 has a plurality of linear suction holes 18 each having an opening on the lower surface and extending in the vertical direction. Each suction hole 18 communicates with the space 17, and the air pressure in the space 17 is lowered by vacuum suction from the suction pipe 19 provided in the top ring 7, so that the wafer 10 is sucked and fixed on the lower surface of the suction hole 13. Be seen.

A porous sheet 20 is arranged below the chuck plate 9. The porous sheet 20 is formed by sintering ceramic powder, is a thin sheet having a thickness of 10 mm or less, and has a structure through which air can pass. This porous sheet 20 is an adhesive sheet (not shown) that has holes in it.
It is attached to the lower surface of the chuck plate 9 by. The lower surface of the porous sheet 20 forms a suction surface 11 for sucking an object to be polished, and the wafer 10 is vacuum-sucked on the suction surface 11. In the present embodiment, the wafer 10 has a diameter of about 2
Although a silicon wafer having a thickness of 00 mm and a thickness of about 0.75 mm is used, the present invention is not limited to the polishing of a silicon wafer, and any other plate-shaped member such as a glass plate for LCD can be used for polishing other members. It goes without saying that it can also be applied to.

The polishing head 2 according to the present embodiment.
In the above, the porous sheet 20 is provided on the lower surface of the chuck plate 9, but the porous sheet 20 is not indispensable, and the porous sheet 20 may not be provided. In this case, the lower surface of the chuck plate 9 serves as a suction surface 11 for sucking an object to be polished.

A notch is formed in the peripheral portion of the lower surface of the chuck plate 9, and a retainer 21 is arranged in this notch. The retainer 21 is a ring-shaped member, and may be, for example, a ceramic material or resin, or a metal material coated with a ceramic material / resin. As the material of the retainer 21, it is preferable to use one having a hardness equal to or higher than the hardness of the wafer 10 as the object to be polished. The gap between the outer peripheral surface of the wafer 10 and the inner peripheral surface of the retainer 21 is preferably 2 mm or less. In the present embodiment, the inner diameter is 201 m.
A ring-shaped retainer 21 having a diameter of m and an outer diameter of 241 mm is used.

By disposing the retainer 21 on the outer periphery of the wafer 10 as described above, unnecessary lateral movement of the wafer can be prevented. Also, the retainer 21
By placing the polishing tool 5 on the wafer 10.
Can be made uniform over the entire surface to be polished, and in particular, surface sagging at the outer peripheral portion of the wafer 10 can be prevented.

3A and 3B show a dressing plate 22 for shaping the shape of the polishing tool 5. Figure 3
3A is a front view of the dressing plate 22, and FIG.
(B) shows a side view of the dressing plate 22. The dressing plate 22 is formed by fixing abrasive grains such as diamond grains to the surface of a disk-shaped substrate member made of metal such as stainless steel or ceramics by a method such as electrodeposition, or the abrasive grains made of resin, glass, cast iron or the like. It is formed into a disc shape by bonding with metal. here,
When a metal plate is used as the substrate member, the surface may be coated with a fluororesin such as polytetrafluoroethylene to prevent metal contamination. As the abrasive grains, it is preferable to use abrasive grains having a grain size of about 100 to 150 μm, which is equal to or harder than the polishing tool 5 as the object to be shaped. In particular, it is desirable to use diamond abrasive grains having a grain size of 100 to 150 μm.

The dressing plate 22 is used for the wafer 1
The polishing tool 5 is vacuum-sucked on the suction surface 11 for absorbing 0,
The surface of the polishing tool 5 is shaped by sliding with. Therefore, the dressing plate 22 follows the same trajectory as the wafer 10. As described above, the dressing plate 22 is attached to the polishing tool 5 with respect to the wafer 1
Since the polishing tool 5 is shaped through the same trajectory as the trajectory drawn by 0, the dressing plate 22 having a size and shape similar to that of the wafer 10 to be polished is preferably used. In the present embodiment, the diameter is about 200 mm, which has the same shape and dimension as the wafer 10.
And a disk-shaped dressing plate 2 with a thickness of about 2 mm
Although 2 is used, it goes without saying that any dressing plate having a diameter equal to or larger than the diameter of the wafer 10 can be used.

FIG. 4 is a vertical sectional view of the dressing plate 22 and the polishing head 2, showing how the dressing plate 22 is attached to the polishing head 2. First,
A dressing plate 22 is arranged below the polishing head 2. At this time, the dressing plate 22 is arranged with the grinding surface for grinding the polishing tool 5 facing downward. Then, with the back surface of the dressing plate 22 facing the suction surface 11, the suction tube 19 is evacuated by a vacuum suction pump (not shown) in the same manner as the suction fixing of the wafer 10 to suck the dressing plate 22. The surface 11 is fixed by adsorption.

The frictional force generated when the dressing plate 22 shapes the polishing tool 5 causes
Since it is considered that the frictional force generated when polishing the wafer is larger than the frictional force generated by polishing the wafer, it is preferable to set the suction force of the vacuum suction pump to a larger output than that when polishing the wafer.

When shaping the polishing tool 5, the retainer 21 is used.
Since the retainer 21 is not particularly required, the retainer 21 may be removed from the chuck plate 9 for use. By removing the retainer 21 in this way, the dressing plate 2
As the second wafer, a wafer having a diameter larger than that of the wafer 10 can be used. In particular, the polishing tool 5 is the wafer 1
It is particularly desirable to use the dressing plate 22 having a diameter equal to or larger than the diameter of the retainer 21, because the area where 0 contacts and the area where the retainer 21 can contact are required to be flat.

By grinding the surface of the polishing tool 5 with the dressing plate 22 to make it flat, the initial waviness generated on the surface of the new polishing tool 5 and the mechanical habits peculiar to each polishing device ( It is possible to remove the deviation of the parallel balance between the polishing tool 5 and the surface to be polished of the wafer 10 due to (error). As a result, the surface to be polished of the wafer 10 can be flattened uniformly with high accuracy, and a good wafer can be obtained. Further, when dressing with the dressing plate 22, the surface of the polishing tool 5 is scraped off, so that the chips clogging the surface of the polishing tool 5 are removed and the abrasive grains are spontaneously bladed, and the sharpening of the polishing tool 5 is performed at the same time. Done.

Next, FIGS. 3 (c) and 3 (d) show a seasoning plate 23 for sharpening the surface of the polishing tool 5. Figure (c) shows a front view of the seasoning plate 23,
FIG. 3D shows a side view of the seasoning plate 23. The seasoning plate 23 has a disc shape made of metal such as stainless steel or ceramics. Similarly to the dressing plate 22, the seasoning plate 23 also vacuum-sucks the suction surface 11 and slides the polishing tool 5 to smooth the surface of the polishing tool 5.

As described above, since the seasoning plate 23 also smoothes the surface of the polishing tool 5 along the same trajectory as the trajectory drawn by the wafer 10 with respect to the polishing tool 5, the size and shape of the seasoning plate 23 is to be polished. A wafer having the same size and shape as the wafer 10, which is an object, is most preferably used. In the present embodiment, the wafer 10
Although a disc-shaped seasoning plate 23 having a diameter of about 200 mm and a thickness of about 2 mm, which has the same shape and dimension as the above, is used, any seasoning plate having a diameter equal to or larger than the diameter of the wafer 10 can be used. Needless to say.

FIG. 5 is a vertical sectional view of the seasoning plate 23 and the polishing head 2, showing how the seasoning plate 23 is attached to the polishing head 2. First,
A seasoning plate 23 is arranged below the polishing head 2. At this time, the seasoning plate 23 is arranged with the grinding surface for leveling the polishing tool 5 facing downward. Then, with the back surface of the seasoning plate 23 facing the suction surface 11, the suction tube 19 is evacuated by a vacuum suction pump (not shown) in the same manner as the suction fixing of the wafer 10 to suck the seasoning plate 23. Surface 1
Adsorb and fix to 1.

By flattening the surface of the polishing tool 5 shaped by the dressing plate 22 with the seasoning plate 23, the flatness of the surface of the polishing tool 5 can be further improved. As a result, the surface to be polished of the wafer 10 can be planarized with higher accuracy, and a good wafer can be obtained. Further, during the seasoning by the seasoning plate 23, the chips clogging the surface of the polishing tool 5 are removed and the abrasive grains are spontaneously bladed to simultaneously sharpen the polishing tool 5. According to the seasoning plate 23 of the present invention, the polishing tool can be seasoned without scratching the surface to be polished of the wafer unlike the prior art.

As shown in FIG. 1, the slurry nozzle 3 has a supply port 24 directed toward a contact portion between the polishing tool 5 and the wafer 10, and a slurry 25, which is a polishing liquid, between the polishing tool 5 and the wafer 10. To supply.

Next, the operation of the polishing apparatus of the present invention will be described. As shown in FIG. 1, the polishing apparatus supplies a slurry 25 from a slurry nozzle 3 to a rotating polishing platen 1, and contacts and pressurizes a polishing tool 5 while rotating a polishing head 2 that vacuum-adsorbs a wafer 10. The lower surface of the wafer 10 is polished. An example of polishing conditions is a diameter of 200
When polishing the wafer 27 of mm, the rotation number of the polishing platen 1 is 60 rpm, and the rotation number of the polishing head 2 is 60 rp.
m, polishing load is 300 g / cm ² , polishing allowance is about 2.5μ
It is preferable to set to m and polish.

After polishing the plurality of wafers 10 as described above, the dressing plate 22 instead of the wafer 10 is suction-fixed to the suction surface 11 of the chuck plate 9 this time. Then, in the same manner as when polishing the wafer 10, the dressing plate 22 is rotated and brought into contact with and presses the surface of the rotating polishing tool 5, thereby shaping and dressing the polishing tool 5. The dressing conditions at this time are as follows: the rotation speed of the polishing platen 1 is 60 rpm, and the rotation speed of the polishing head 2 is 60 rp.
m, the polishing load is 50 g / cm ² , and the polishing allowance is preferably set to about 50 μm for dressing.

When dressing of the surface of the polishing tool 5 is completed as described above, the dressing plate 22 is removed from the chuck plate 9, and the seasoning plate 23 is vacuum-sucked to the suction surface 11 this time. Then, the seasoning plate 23 is seasoned by contacting and pressing the surface of the rotating polishing tool 5 while rotating the seasoning plate 23 in the same manner as when polishing the wafer 10. The conditions of the seasoning at this time are as follows: the rotation speed of the polishing platen 1 is 60 rpm, the rotation speed of the polishing head 2 is 60 rpm, the polishing load is 300 g / cm ² , and the polishing allowance is set to about 5 μm or less. Is preferred.

In the above description, the case where the polishing tool 5 is shaped by the dressing plate 22 and the seasoning is continuously performed by the seasoning plate 23 has been described. However, the seasoning does not necessarily have to be performed together with the dressing, and the seasoning alone may be performed. It goes without saying that it is possible.

Normally, a new polishing tool 5 is manufactured and sold as having a uniform quality, but the product may vary depending on the lot of the manufacturer. Also,
The flatness of the surface of the commercially available polishing tool 5 is
It is considered that the flatness required for 0 polishing is not satisfied. Further, depending on the polishing apparatus used on the user side, when the polishing tool 5 is installed on the polishing platen 1, the polishing surface of the polishing tool 5 has waviness, or the wafer is polished with a mechanical habit (error). It is conceivable that the parallelism of the tool 5 may not be kept uniform.

Therefore, as the most preferable method, when the used polishing tool 5 is replaced with a new polishing tool 5,
Dressing is performed by the dressing plate 22.
When the new polishing tool 5 is installed on the polishing platen 1, the surface of the polishing tool 5 is dressed by using the dressing plate 22, so that the mechanical error or the like of each polishing device as described above is eliminated. It can be corrected by surface shaping.

In this way, by removing the waviness of the polishing surface of the polishing tool 5 (waviness caused by the polishing platen 1 and the polishing tool 5), the swinging of the polishing head 2 due to the waviness of the polishing surface is suppressed. Therefore, it is possible to prevent the occurrence of a local unbalanced load on the wafer 10. At this time, since the dressing plate 22 draws the same trajectory as the trajectory of the wafer 10 sliding on the polishing tool 5, the dressing plate 22 appropriately flattens the moving range of the wafer 10.

On the other hand, seasoning is performed after polishing a predetermined number of wafers 10 or when a predetermined processing time has elapsed. In a normal working state, seasoning may be performed several times a day when the polishing apparatus is started up.

[0049]

According to the present invention, the dressing plate or the seasoning plate is vacuum-sucked to the chuck plate to remove the waviness of the polishing surface of the polishing tool (waviness caused by the polishing platen and the polishing tool). It is possible to prevent the polishing head from swinging due to the waviness, and to prevent the occurrence of an unbalanced load locally on the wafer.

Further, according to the present invention, the dressing plate or seasoning plate draws the same trajectory as the trajectory of the wafer sliding on the polishing tool, so that the range in which the wafer moves can be appropriately flattened.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing an outline of a polishing apparatus of the present invention.

FIG. 2 is a vertical sectional view showing the structure of a polishing head in a polishing apparatus of the present invention.

FIG. 3 (a) is a front view of a dressing plate,
3B is a side view of the dressing plate, FIG.
FIG. 3C is a front view of the seasoning plate, and FIG. 3D is a side view of the seasoning plate.

FIG. 4 is a vertical cross-sectional view showing how the dressing plate of the present invention is mounted on the polishing head.

FIG. 5 is a vertical cross-sectional view showing how the seasoning plate of the present invention is attached to the polishing head.

FIG. 6 is a vertical sectional view showing a conventional polishing apparatus.

[Explanation of symbols]

1 ... Polishing surface plate 2 ... Polishing head 3 ... slurry nozzle 4 ... Surface plate rotation axis 5 ... Polishing cloth 6 ... Head rotation axis 7 ... Top ring 8 ... annular protrusion 9 ... Chuck plate 10 ... Wafer 11 ... Suction surface 12 ... Recess 13 ... Female thread 14 ... Through hole 15 ... bolt 16 ... O-ring 17 ... Space 18 ... Suction hole 19 ... Suction tube 20 ... Porous sheet 21 ... Retainer 22 ... Dressing plate 23 ... Seasoning plate 24 ... Supply port 25 ... slurry 50 ... Holding table 51 ... Retainer 52 ... Groove 53 ... Adsorption part 54 ... hole 55 ... Vacuum line 56 ... Wafer 57 ... Polishing pad.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hiroaki Yamamoto             3-25-1, Shinomiya, Hiratsuka, Kanagawa Prefecture             Matsu Electronics Co., Ltd. (72) Inventor Akihiro Ishii             3-25-1, Shinomiya, Hiratsuka, Kanagawa Prefecture             Matsu Electronics Co., Ltd. F term (reference) 3C047 BB01 BB16 EE02 EE11                 3C058 AA07 AA14 AA19 AB04 CB02                       DA17

Claims (7)

[Claims] 1. A support mechanism for suction-fixing a member to be polished, a polishing tool for polishing the member to be polished, and means for relatively moving the member to be polished and the polishing tool in a contact state. A polishing apparatus including: a polishing tool processing tool that is suction-fixed to the support mechanism to shape or sharpen the polishing tool. 2. A support mechanism for sucking and fixing a member to be polished, a polishing tool for polishing the member to be polished, and means for relatively moving the member to be polished and the polishing tool in contact with each other. A polishing tool processing tool for shaping or sharpening the polishing tool in a polishing apparatus comprising: a polishing tool processing tool having a shape capable of being suction-fixed to the support mechanism. 3. The polishing tool processing tool has a disk-shaped member made of metal or ceramics and abrasive particles fixed on the surface, or is formed into a disk shape by bonding the abrasive particles with resin, glass or metal. 3. The polishing tool processing tool according to claim 2, wherein the polishing tool processing tool is a disk-shaped member made of metal, or a disk-shaped member made of ceramics. 4. A support mechanism for sucking and fixing a member to be polished, a polishing tool for polishing the member to be polished, and means for relatively moving the member to be polished and the polishing tool in contact with each other. A method of shaping or sharpening the polishing tool in a polishing device comprising: a step of suction-fixing a polishing tool processing tool that shapes or sharpens the polishing tool to the support mechanism; Relatively moving the polishing tool in contact with the polishing tool. 5. A support mechanism for sucking and fixing a member to be polished, a polishing tool for polishing the member to be polished, a polishing platen on which the polishing tool is installed, and the member to be polished and the polishing tool are brought into contact with each other. A method of shaping the polishing tool in a polishing apparatus comprising: a means for relatively moving the polishing tool in a state of being placed, an installation step of installing the polishing tool on the polishing platen; and a dressing for shaping the polishing tool. A method comprising: a fixing step of fixing a plate to the support mechanism by suction; and a shaping step of relatively moving the dressing plate and the polishing tool in a state of being in contact with each other. 6. A step of sucking and fixing a seasoning plate for sharpening the polishing tool to the support mechanism after the setting step, the fixing step, and the shaping step, and bringing the seasoning plate and the polishing tool into contact with each other. 6. The method of claim 5, comprising: moving relatively in a state. 7. A support mechanism for sucking and fixing a disk-shaped member containing at least silicon, a polishing tool for polishing the disk-shaped member, and a relative structure in a state where the disk-shaped member and the polishing tool are in contact with each other. A method of manufacturing a silicon wafer by a polishing apparatus provided with: a step of causing a polishing tool processing tool that shapes or sharpens the polishing tool to be suction-fixed to the support mechanism; And a step of relatively moving the processing tool and the polishing tool in a state of being in contact with each other, and a step of relatively moving the disk-shaped member and the polishing tool in a state of being in contact with each other. Silicon wafer manufacturing method.