JP2003148930A - Board inspection equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate inspection device capable of performing the inspection of large substrates with a compact structure. SOLUTION: This device is provided with a substrate holding member 14 for holding a substrate 10 to be inspected; an imaging means 22 for imaging at least a part of the substrate 10; an image processing means 33 for image processing the output from the imaging means 22; a moving means for moving the substrate holding member 14 or the imaging means 22 in one direction parallel to the surface of the substrate 10, and further rotating the substrate 10 by the substrate holding member 14 to move an optional position on the substrate 10 into the imaging visual field of the imaging means 22; a detecting means for detecting the rotating angle by the rotation by the substrate holding member 14; and a correction means for rotating and correcting the image obtained by the imaging means 22 on the basis of the rotating angle detected by the detecting means so that the image of each part of the substrate 10 is outputted in the state where it is turned to a common direction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate inspection apparatus for inspecting a pattern formed on the surface of a semiconductor wafer, a glass substrate for liquid crystal production, or the like.

[0002]

2. Description of the Related Art A semiconductor device has a multi-layer structure in which a plurality of circuit pattern layers are formed in the thickness direction of a wafer in order to improve the degree of integration. The circuit pattern having such a multilayer structure is formed by stacking the upper layer circuit pattern on the lower layer circuit pattern formed by a plurality of photolithography steps so as to be multilayered. At this time, if the pattern of the upper layer is formed so as to be displaced from the circuit pattern of the lower layer, desired characteristics cannot be obtained, and therefore accurate positioning is required in each exposure process. For this reason, it is required to measure the shift of the overlay position of the upper layer circuit pattern with respect to the lower layer circuit pattern at each stage of forming each layer between the photolithography steps.

In order to accurately determine the deviation of the overlay position, overlay marks for measurement are provided around the circuit pattern functioning as a semiconductor device in each chip area (also referred to as a die area) on the semiconductor wafer surface. It is formed.
The overlay mark is formed of a first mark formed on the lower pattern layer and a second mark on the upper pattern layer that is overlaid in the same region as the first mark.
A square second mark having a side of about 10 μm is formed inside a square first mark having a side of about 20 μm (box-in-box type overlay mark).

The overlay measurement is performed by irradiating the overlay mark as described above with irradiation light, capturing an image of the overlay mark from the reflected light with a CCD camera, etc., and subjecting the captured image to image processing. The overlapping state of the mark and the second mark (the amount of positional deviation between the marks) is measured. The measuring optical system of such a device is fixedly disposed on the device main body, and is sequentially moved and positioned by a stage that moves the wafer in two directions (front and back and left and right) in a horizontal plane with respect to the measurement optical axis. Then, the overlay mark is moved into the visual field of the measurement optical system, the overlay state of each chip area is measured, and the quality is judged.

However, in recent years, the size of the substrate has tended to increase in order to increase the efficiency of the substrate processing process, and accordingly, the inspection apparatus has also increased in size. On the other hand, the line width of the pattern of the substrate tends to be small, and the demand for cleanliness in the substrate manufacturing factory is becoming stricter year by year. In order to maintain high cleanliness, it is advantageous that the devices that come into contact with the substrate are small, and there is a demand for processing a large substrate with a small inspection device.

[0006]

However, in order to inspect the substrate by moving the substrate in the two-dimensional direction in the horizontal plane with respect to the image pickup device as in the conventional inspection, a space for moving the substrate vertically and horizontally is secured. Therefore, the inspection apparatus requires vertical and horizontal dimensions of at least about twice the substrate diameter, which makes it difficult to miniaturize the apparatus.

The present invention has been made in view of the above problems, and an object thereof is to provide a substrate inspection apparatus capable of inspecting a large substrate with a compact structure.

[0008]

In order to solve the above problems, a substrate inspection apparatus according to a first aspect of the present invention is a substrate holding member for holding a substrate to be inspected and at least a part of the substrate to be inspected. The image pickup means, the image processing means for image-processing the output from the image pickup means, the substrate holding member or the image pickup means is moved in one direction parallel to the surface of the substrate to be inspected, and the substrate holding member is used to move the object. Moving means for rotating an inspection substrate to move an arbitrary portion on the inspection substrate into an imaging visual field of the imaging means; detection means for detecting a rotation angle of rotation by the substrate holding member; and the inspection object. A correction for rotating the image obtained by the image pickup means is performed based on the rotation angle detected by the detection means so that the images of the respective parts of the substrate are output in a state in which they are oriented in a common direction. Constructed and a correction means.

According to a second aspect of the present invention, there is provided a substrate inspection apparatus which holds a substrate to be inspected, a substrate holding member, an image pickup means for picking up an image of at least a part of the substrate to be inspected, and an image output from the image pickup means. The image processing means and the substrate holding member or the image pickup means are moved in one direction parallel to the surface of the test substrate, and the test substrate is rotated by the substrate holding member, so that an arbitrary position on the test substrate is obtained. Moving means for moving the portion of the above into the image pickup field of the image pickup means,
The rotation angle detected by the detection means for detecting the rotation angle of the rotation by the substrate holding member and the rotation angle detected by the detection means so that the images of the respective portions of the substrate to be inspected are output in a state of facing a common direction. And a rotating means for rotating the image pickup means based on the above.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows the first of the present invention.
The external appearance of the board | substrate inspection apparatus 1 which concerns on embodiment of FIG. Also,
FIG. 2 is a block diagram showing the configuration of the board inspection apparatus 1. In this board inspection apparatus 1, two rails 12 a and 12 b extending parallel to one direction (X-axis direction) parallel to the horizontal plane are arranged on the upper surface of the base 11.
A flat plate-shaped stage 13 is slidably mounted on a and 12b. A rotation shaft (not shown) extending upward (Z-axis direction) is provided on the stage 13, and a disk-shaped substrate holding table 14 is attached to the upper end of the rotation shaft in a horizontal posture. The stage 13 can be moved in the X-axis direction on the rails 12a and 12b by the rotation operation of a slide movement motor 15 (not shown in FIG. 1) provided on the lower surface of the stage 13. The rotary shaft is driven by a rotary movement motor 16 (not shown in FIG. 1) provided on the table 11 to rotate in a horizontal plane. The rotation operation of both electric motors 15 and 16 is controlled by the control device 30 shown in FIG.

A substrate to be tested (here, a semiconductor wafer) 10 is detachably held on the upper surface side of the substrate holding table 14 via a vacuum chuck device (not shown). Here, the substrate 10 to be inspected is mounted on the substrate holding table 14 so that its center coincides with the center of the substrate holding table 14, and rotates in a horizontal plane as the substrate holding table 14 rotates.

An objective lens 21 and a CCD camera 22 are fixed to a frame connected to the base 11 at a position facing the substrate 10 to be tested held by the substrate holding table 14. The light from the illumination light source (not shown) is the substrate 10 to be inspected.
The light radiated to the surface of the substrate 10 and reflected by the surface of the substrate 10 to be tested is condensed by the objective lens 21 and guided to the image forming lens in the CCD camera 22, and the two-dimensional image pickup device in the CCD camera 22 (here, An image is formed on the image pickup surface of the CCD.

At this time, an enlarged image of the circuit pattern on the surface of the substrate 10 is formed on the image pickup surface of the CCD in the CCD camera 22. Hereinafter, a range in which the CCD camera 22 can perform an image pickup on the substrate 10 to be imaged once is referred to as an “image pickup field”.

In the CCD camera 22, the pattern image formed on the image pickup surface of the CCD is photoelectrically converted for each pixel, and an image pickup signal corresponding to the light intensity (brightness) of the pattern image is output to the outside.

The substrate holding table 14 is slidable in one direction (here, the X-axis direction) parallel to the surface of the substrate 10 to be tested, and is rotatable 360 degrees around the center of the substrate holding table 14. , By combining the slide movement in the X-axis direction and the rotation movement about the rotation axis, an arbitrary portion on the substrate 10 to be inspected can be captured by the CCD camera 22.
Can be moved to the imaging field of view. That is, it is possible to image the entire area of the surface of the test substrate 10.

The position of the substrate holding table 14 in the X-axis direction and the rotation angle of the substrate holding table 14 are measured by a position sensor 18 and a rotation angle sensor 19, respectively. The detection data of both these sensors 18 and 19 are both control device 3
It is input to 0, and the control device 30 itself can grasp which part on the substrate 10 to be inspected is located within the imaging visual field of the CCD camera 22.

As the rotation angle sensor 19, a rotary encoder or the like is used. The position sensor 18 can be composed of an X scale that outputs a pulse signal according to the amount of movement of the substrate holding table 14 in the X axis direction, and a counter that counts the pulse signal and calculates the amount of movement. .

With the above structure, the substrate 1 to be inspected 1 is moved by sliding and rotating the substrate holding table 14.
Any area on the surface of 0 can be moved to the imaging field of view of the CCD camera 22. FIG. 3 shows the movement (sliding movement and rotational movement) of the substrate holding table 14 when moving each area of the surface of the inspection substrate 10 to the imaging visual field by the movement trajectory T of the imaging visual field on the inspection substrate 10. It is a thing. In FIG. 3, the locus in the radial direction of the test substrate 10 is
The movement locus of the imaging visual field when the substrate holding table 14 is slidingly moved is shown. The locus in the circumferential direction of the substrate 10 to be inspected indicates the locus of movement of the imaging visual field when the substrate holding table 14 is rotating. Further, in FIG. 3, a plurality of rectangular areas C on the substrate 10 to be inspected are respectively chip areas, each of which is an area where one chip is formed. Circuit patterns are formed in these chip regions.

The operation of moving the substrate holding table 14 as described above is performed by the memory 30a provided in the controller 30.
It is preferable that the program is stored in (see FIG. 2) and is automatically performed by operating the start switch 31.

Further, an index such as a notch 10d or an orientation flat (not shown) is provided around the substrate 10 to be inspected. The index such as the notch 10d is used as an outer shape reference indicating the orientation (direction of the xy coordinate system) of the test substrate 10 when the test substrate 10 is placed on the substrate holding table 14.

When the substrate 10 to be inspected is placed on the substrate holding table 14, the substrate 10 to be inspected is placed.
Is adjusted by a pre-alignment system (not shown) so that the center of the surface of the substrate is positioned on the rotation center axis of the substrate holding table 14.

The image on the substrate 10 to be inspected, which is picked up by the CCD camera 22, is converted into a digital signal corresponding to the light intensity thereof and is taken into the image output correction device 32. The image output correction device 32 performs correction for aligning the directions of the captured images. This correction is performed by rotating the captured image based on the rotation angle of the substrate holding table 14 detected by the rotation angle sensor 19. The image corrected in the image output correction device 32 is output to the image processing device 33, and the image processing device 33 performs image processing on the corrected image and outputs the image on the display 34. Then, the corrected image is displayed on the display 34.

FIG. 4 is a diagram for explaining the correction of the imaged image as described above. In FIG. 4, the X axis and the Y axis are absolute coordinate axes in the substrate holding table 14, and the substrate holding table 14 is movable in the X axis direction. F indicates the reference direction on the substrate 10, and the direction from the notch 10d of the substrate 10 to the center point of the substrate 10 is F. The overlay marks M1, M2, M3 formed on the substrate 10 are formed with the F direction as a reference direction.

In FIG. 4, the substrate 10 to be inspected is viewed from above, and FIG. 4A shows a state in which the overlay mark M1 is imaged. In FIG. 4A, the test substrate 10
The reference direction F of and the Y-axis coincide with each other. In this state,
The overlay mark M1 is on the X-axis and the CCD camera 2
It is possible to image with 2. The imaging field of view of the CCD camera 22 is a quadrangle, and the CCD camera 22 is installed so that its vertical side is parallel to the Y axis and its horizontal side is parallel to the X axis. The image captured in the state of FIG. 4A is shown in FIG.
1), and the vertical side of the quadrangular imaging field of view and the vertical side of the overlay mark M1 (side parallel to the F direction).
An image is obtained in which and are substantially parallel to each other (or an image is obtained in which the lateral side of the quadrangular imaging field of view and the side perpendicular to the F direction of the overlay mark M1 are substantially parallel).

FIG. 4B shows a state in which the overlay mark M2 is imaged. In order to move the overlay mark M2 on the X axis, the substrate holding table 14 is moved to the position shown in FIG.
By rotating θ1 (= 30 degrees) clockwise from the state of (A) and moving the substrate holding table 14 in the X-axis direction, the overlay mark M2 is moved to the imaging visual field position of the CCD camera 22. Is possible. Figure 4
The image picked up in the state of (B) is as shown in FIG. 4 (b1), and the vertical side of the rectangular imaging field of view and the side parallel to the F direction of the overlay mark M2 are θ1 in the clockwise direction. (= 3
(0 degree) The image is tilted.

FIG. 4C shows a state in which the overlay mark M3 is imaged. In order to move the overlay mark M3 on the X axis, the substrate holding table 14 is moved to the position shown in FIG.
By rotating θ2 (= 90 degrees) clockwise from the state of (A) and moving the substrate holding table 14 in the X-axis direction, the overlay mark M3 is moved to the imaging visual field position of the CCD camera 22. Is possible. Figure 4
The image picked up in the state of (C) is as shown in FIG. 4 (c1), and the vertical side of the rectangular imaging field of view and the side parallel to the F direction of the overlay mark M3 are θ2 in the clockwise direction. (= 9
(0 degree) The image is tilted.

As shown in FIG. 4, a state where the direction F, which is the reference direction of the substrate 10, and the Y-axis coincide with each other is referred to as a state where the rotation angle of the substrate holding table 14 is zero. That is, the output from the rotation angle sensor 19 in this state is set to 0. At this time, the image output correction device 32 outputs the captured image (FIG. 4 (a1)) without rotating the image. The image displayed on the display 34 via the image processing device 33 (shown in FIG. 4 (a2)) is the CCD camera 2
The image is the same as that captured in 2.

In the state of FIG. 4B or FIG. 4C, the rotation angles of the substrate holding table 14 are θ1 and θ2, respectively, when the state of FIG. 4A is 0. At this time, the outputs from the rotation angle sensor 19 have values indicating the angles θ1 and θ2, respectively. In the image output correction device 32,
Based on the output from the rotation angle sensor 19, the CCD camera 2
The images taken in 2 are angle (-θ1), (-θ2)
Correct the tilt only (clockwise direction is +). As a result, the corrected images shown in FIGS. 4 (b2) and 4 (c2) are output and displayed on the display 34.

As described above, by correcting the picked-up image in the image output correction device 32, as shown in FIG.
As shown in (b2) and (c2), it is possible to obtain an image in which the directions of the overlay marks are aligned (the same orientation as that of FIG. 4A1).

As described above, in the substrate inspection apparatus 1 of the first embodiment, the substrate holding table 14 holding the substrate 10 to be inspected is moved in one direction parallel to the surface of the substrate 10 to be inspected (for example, the X-axis direction). The substrate 10 is rotated by sliding and moving the substrate holding table 14, and an arbitrary portion (for example, a portion having an overlay mark) on the substrate 10 is moved within the imaging field of view of the CCD camera 22. Can be made.

Further, the picked-up image is converted into a rotation angle sensor 19
By correcting the rotation based on the rotation angle of the substrate holding table 14 obtained by detecting by the above, the plurality of captured images can be observed as images oriented in the same direction.

In the substrate inspection apparatus 1 of this embodiment, if the substrate holding table 14 can be rotated 360 degrees as described above, the substrate holding table 14 can be moved by the radius of the substrate 10 to be inspected. Of course, if the substrate holding table 14 can be rotated only 180 degrees, it is sufficient that the substrate holding table 14 can be moved by the diameter of the test substrate 10.
Therefore, the apparatus can be downsized as compared with the conventional configuration that requires at least twice the vertical and horizontal dimensions of the substrate 10 to be inspected, and a large substrate can be inspected with a compact configuration. .

In the board inspection apparatus 1 described above, the CCD
The camera 22 is fixed to the frame and the substrate holding table 1
4 was slid in one direction parallel to the surface of the substrate 10 to be inspected, the substrate holding table 14 was fixed on the frame (however, rotation was possible), and the CCD camera 22 was attached to the substrate to be inspected. It may be slid in one direction parallel to the surface of 10. Even with such a configuration, it is possible to obtain the same effect as that of the above-described board inspection apparatus 1.

Next, a substrate inspection apparatus according to the second embodiment of the present invention will be described. FIG. 5 shows the appearance of the board inspection apparatus 2 according to the second embodiment. Further, FIG. 6 is a block diagram showing the configuration of the board inspection apparatus 2. In this board inspection device 2, the same parts as those of the board inspection device 1 according to the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

In the board inspection apparatus 2 according to the second embodiment, the CCD camera 22 is attached to the frame via a holder (not shown). A CCD camera rotation motor 17 is provided in the holder. As shown in FIG. 6, the CCD camera rotation motor 17 is controlled by the controller 30 to rotate the CCD camera 22 around an axis parallel to the rotation axis of the substrate holding table 14. The control device 30 drives the CCD camera rotation motor 17 based on the rotation angle of the substrate 10 to be detected detected by the rotation angle sensor 19, and CC
The D camera 22 is rotated. As a result, the CCD camera 2
The imaging field of view 2 also rotates. As a result, the test substrate 10
The upper registration mark can be imaged in the same direction. Further, the image output correction device 32 included in the above-described board inspection device 1 is not used, and the image captured by the CCD camera 22 is sent to the image processing device 33 as it is, and the image is displayed on the display 34. To be done.

FIG. 7 is a diagram for explaining the orientation of the image picked up as described above. Similar to FIG. 4, FIG.
In, the X axis and the Y axis are absolute coordinate axes in the substrate holding table 14, and the substrate holding table 14 is movable in the X axis direction. F indicates the reference direction on the substrate 10, and the direction from the notch 10d of the substrate 10 to the center point of the substrate 10 is F. The overlay marks M1, M2, M3 formed on the substrate 10 are formed with the F direction as a reference direction.

In FIG. 7, the substrate 10 to be inspected is viewed from above, and FIG. 7A shows a state in which the overlay mark M1 is imaged. In FIG. 7A, the substrate 10 to be tested is
The reference direction F of and the Y-axis coincide with each other. In this state,
The overlay mark M1 is on the X-axis and the CCD camera 2
It is possible to image with 2. The imaging field of view of the CCD camera 22 is a quadrangle, and in the initial state, the CCD camera 22 is installed so that its vertical side is parallel to the Y axis and its horizontal side is parallel to the X axis. The direction parallel to the vertical side of the imaging visual field at this time is referred to as “V direction”. An image captured in the state of FIG. 7A is as shown in FIG. An image is obtained in which the side of the quadrangular imaging field of view parallel to the V direction and the side of the overlay mark M1 parallel to the F direction are substantially parallel (or the side of the quadrangular imaging field of view that is perpendicular to the V direction is superimposed. An image is obtained in which the side of the mark M1 perpendicular to the F direction is substantially parallel).

FIG. 7B shows a state in which the overlay mark M2 is imaged. In order to move the overlay mark M2 on the X axis, the substrate holding table 14 is moved to the position shown in FIG.
By rotating θ1 (= 30 degrees) clockwise from the state of (A) and moving the substrate holding table 14 in the X-axis direction, the overlay mark M2 is moved to the imaging visual field position of the CCD camera 22. Is possible. At this time, the control device 30 recognizes from the output from the rotation angle sensor 19 that the substrate holding table 14 has rotated by the angle θ1 from the state of FIG. 7 (A). The CCD camera 2 is controlled by controlling the CCD camera rotation motor 7.
Rotate 2 by angle θ1. As a result, the imaging visual field of the CCD camera 22 rotates by the angle θ1. The image picked up in the state of FIG. 7B is as shown in FIG. 7B, and although the V direction of the visual field is inclined by the angle θ1 with respect to the Y axis, a side parallel to the V direction of the rectangular imaging visual field. And overlay mark M2 F
An image is obtained in which the side parallel to the direction is substantially parallel (or the side perpendicular to the V direction of the rectangular imaging field and the side perpendicular to the F direction of the overlay mark M2 are substantially parallel to each other. can get).

FIG. 7C shows a state in which the overlay mark M3 is imaged. In order to move the overlay mark M2 on the X axis, the substrate holding table 14 is moved to the position shown in FIG.
By rotating θ2 (= 90 degrees) clockwise from the state of (A) and moving the substrate holding table 14 in the X-axis direction, the overlay mark M3 is moved to the imaging visual field position of the CCD camera 22. Is possible. Figure 7
As in the case of (B), the CCD camera 22 sets the angle θ.
By rotating by 2, the imaging field of view also rotates by the angle θ2. The image picked up in the state of FIG. 7C is as shown in FIG. 7C, and although the V direction of the visual field is inclined by the angle θ2 with respect to the Y axis, the side parallel to the V direction of the rectangular imaging visual field. And an edge of the overlay mark M3 that is parallel to the F direction can be obtained (or an edge that is perpendicular to the V direction of the rectangular imaging field and an edge of the overlay mark M3 that is perpendicular to the F direction). You can get a nearly parallel image).

As described above, in any of the cases of FIGS. 7A, 7B and 7C, the image of the imaged overlay mark is
They are facing the same direction with respect to the imaging visual field. That is, the F direction on the wafer (the overlay mark is formed by the side parallel to the F direction and the side perpendicular to the F direction) and the V direction of the imaging visual field match in any case. Therefore, even if these captured images are directly output to the image processing device 33,
The image displayed on the display 34 is displayed with the overlay marks facing the same direction.

As described above, in the substrate inspection apparatus 1 of the second embodiment, the substrate holding table 14 holding the substrate 10 to be inspected is moved in one direction parallel to the surface of the substrate 10 to be inspected (for example, the X-axis direction). The substrate 10 is rotated by sliding and moving the substrate holding table 14, and an arbitrary portion (for example, a portion having an overlay mark) on the substrate 10 is moved within the imaging field of view of the CCD camera 22. Can be made.

Further, based on the rotation angle of the substrate holding table 14 detected by the rotation angle sensor 19, the CCD
By rotating the camera 22, the plurality of captured images can be observed as images oriented in the same direction.

In the substrate inspection apparatus 2 of the present embodiment, if the substrate holding table 14 can be rotated 360 degrees as described above, the substrate holding table 14 can be moved by the radius of the substrate 10 to be inspected. Of course, if the substrate holding table 14 can be rotated only 180 degrees, it is sufficient that the substrate holding table 14 can be moved by the diameter of the test substrate 10.
Therefore, the apparatus can be downsized as compared with the conventional configuration that requires at least twice the vertical and horizontal dimensions of the substrate 10 to be inspected, and a large substrate can be inspected with a compact configuration. .

In the board inspection apparatus 2 described above, the CCD
The camera 22 is fixed to the frame and the substrate holding table 1
4 was slid in one direction parallel to the surface of the substrate 10 to be inspected, the substrate holding table 14 was fixed on the frame (however, rotation was possible), and the CCD camera 22 was attached to the substrate to be inspected. It may be slid in one direction parallel to the surface of 10. Even with such a configuration, it is possible to obtain exactly the same effects as the above-described board inspection apparatus 2.

Although the preferred embodiments of the present invention have been described above, the scope of the present invention is not limited to the above-described embodiments. For example, in the above-described embodiment, the substrate holding table 14 or the CCD camera 22 is slidable in one direction parallel to the horizontal plane, but this is because the substrate 10 to be inspected is held in a horizontal posture. When the inspection substrate 10 is not in the horizontal posture, the substrate holding table 14 or the CCD camera 22 may be movable in one direction parallel to the surface of the inspection substrate 10. Further, in the above embodiment, the substrate 10 to be inspected is a semiconductor wafer, but the substrate 10 is not limited to a semiconductor wafer, and may be a glass substrate for liquid crystal production or the like.

[0046]

As described above, according to the present invention,
By moving the substrate holding member holding the substrate to be inspected or the image pickup means in one direction parallel to the surface of the substrate to be inspected, and rotating the substrate to be inspected, an arbitrary portion on the substrate to be inspected is picked up by the image pickup means. Move in. With such a configuration, it is possible to image the entire area of the test substrate. Further, the apparatus can be downsized as compared with the conventional configuration in which vertical and horizontal dimensions are required to be at least about twice as large as the substrate to be inspected, and a large substrate can be inspected with a compact configuration.

[Brief description of drawings]

FIG. 1 is a perspective view showing an external appearance of a substrate inspection device according to a first embodiment of the present invention.

FIG. 2 is a block diagram showing a configuration of a substrate inspection apparatus according to the first embodiment of the present invention.

FIG. 3 is a diagram showing the order of movement (sliding movement and rotational movement) of the substrate holding table when moving each region of the substrate to be inspected within the imaging field of view by means of a movement locus of the imaging field of view on the substrate to be inspected.

FIG. 4 is a diagram showing an example of performing correction for rotating a captured image based on a rotation angle of a substrate holding table.

FIG. 5 is a perspective view showing an appearance of a substrate inspection device according to a second embodiment of the present invention.

FIG. 6 is a block diagram showing a configuration of a substrate inspection device according to a second embodiment of the present invention.

FIG. 7 is a diagram showing an example of capturing an image while rotating a CCD camera based on a rotation angle of a substrate holding table.

[Explanation of symbols]

1, 2 board inspection device 10 Test board 11 bases 12a, 12b rail 13 stages 14 Substrate holding table 15 Slide movement motor 16 rotation movement motor 18 Position sensor 19 Rotation angle sensor 21 Objective lens 22 CCD camera 30 control device 32 image output correction device 33 image processing device 34 display

Claims (2)

[Claims] 1. A substrate holding member for holding a substrate to be inspected, an image pickup means for picking up an image of at least a part of the substrate to be inspected, an image processing means for image-processing an output from the image pickup means, the substrate holding member, or The imaging means is moved in one direction parallel to the surface of the substrate to be inspected, and the substrate to be inspected is rotated by the substrate holding member, so that an arbitrary portion on the substrate to be inspected is within the imaging field of view of the imaging means. Moving means for moving the substrate holding member, detecting means for detecting a rotation angle of rotation by the substrate holding member, and the detection so that the images of the respective portions of the substrate to be inspected are output in a state in which they are oriented in a common direction. A board inspecting apparatus, comprising: a correction unit that performs a rotation process on an image obtained by the imaging unit based on a rotation angle detected by the unit to correct the image. 2. A substrate holding member for holding a substrate to be inspected, an image pickup means for picking up an image of at least a part of the substrate to be inspected, an image processing means for image-processing an output from the image pickup means, the substrate holding member or The imaging means is moved in one direction parallel to the surface of the substrate to be inspected, and the substrate to be inspected is rotated by the substrate holding member, so that an arbitrary portion on the substrate to be inspected is within the imaging field of view of the imaging means. Moving means for moving the substrate holding member, detecting means for detecting a rotation angle of rotation by the substrate holding member, and the detection so that the images of the respective portions of the substrate to be inspected are output in a state in which they are oriented in a common direction. And a rotation unit configured to rotate the image pickup unit based on a rotation angle detected by the unit.