JP2003068794A - Connecting structure and connecting method for electric member - Google Patents

Connecting structure and connecting method for electric member

Info

Publication number
JP2003068794A
JP2003068794A JP2002218313A JP2002218313A JP2003068794A JP 2003068794 A JP2003068794 A JP 2003068794A JP 2002218313 A JP2002218313 A JP 2002218313A JP 2002218313 A JP2002218313 A JP 2002218313A JP 2003068794 A JP2003068794 A JP 2003068794A
Authority
JP
Japan
Prior art keywords
conductive particles
conductor
electrically connected
conductive
electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002218313A
Other languages
Japanese (ja)
Inventor
Yasushi Goto
泰史 後藤
Kazuhiro Isaka
和博 井坂
Naoyuki Shiozawa
直行 塩沢
Tomohisa Ota
共久 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2002218313A priority Critical patent/JP2003068794A/en
Publication of JP2003068794A publication Critical patent/JP2003068794A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a connecting structure and its connecting method for an electric member which use an anisotropic conductive adhesive, have low resistance and are excellent in connection reliability. SOLUTION: The connecting method for the electric member constitutes that two electric members having conductive bodies to be provided projecting from the surface of an electrically insulating body is opposed in position of the conductive bodies which should be electrically connected to face each other, that at least a height of one of the conductive bodies is larger than the diameters of conductive particles, that the conductive particles which are deformed and put into the conductive bodies are interposed between the positions of the conductive bodies to be electrically connected and that parts of the positions of the conductive bodies to be electrically connected are mutually contacted and are fixed by an electrically conductive adhesive.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、電気絶縁体表面か
ら突き出して設けた導電体を有する二つの電気部材、例
えば、プリント配線板相互間又はプリント配線板と金バ
ンプを有するICチップの電気的接続構造及び接続方法
に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to two electrical members having a conductor provided so as to project from the surface of an electrical insulator, for example, electrical connection between printed wiring boards or an IC chip having a printed wiring board and gold bumps. The present invention relates to a connection structure and a connection method.

【0002】[0002]

【従来の技術】集積回路類と配線基板との接続、表示素
子類と配線基板との接続などのように接続端子が相対峙
して細かいピッチで形成されている場合の接続構造とし
て、異方導電性接着剤を用い、電気絶縁体表面から突き
出して設けた導電体(以下電極という)を有する二つの
電気部材を互いに接着するとともに、同一電気部材上に
あり隣接する導電体を短絡させることなく二つの電気部
材の互いに向き合う電極間を電気的に導通させる構造が
知られている。
2. Description of the Related Art An anisotropic connection structure for connecting terminals such as integrated circuits and a wiring board, connecting display elements and a wiring board, etc., when the connection terminals are formed at a fine pitch. A conductive adhesive is used to bond two electric members having a conductor (hereinafter referred to as an electrode) provided so as to project from the surface of the electric insulator to each other, without causing a short circuit between adjacent conductors on the same electric member. There is known a structure in which two electrodes of two electric members are electrically connected to each other.

【0003】異方導電性接着剤として、高分子重合体よ
りなる核材のほぼ全表面が導電性の金属薄層により実質
的に被覆された導電粒子と絶縁性接着剤よりなるものが
知られている(特公平3−40899号公報参照)。こ
の異方導電性接着剤を用いた接続構造体は、導電粒子が
接続しようとする電極接続時の加圧により適度に変形
し、充分な接触面積が得られること、および高分子核材
は剛性や熱膨張収縮特性が金属粒子に比べて接着剤の性
質に極めて近いため、接続信頼性が優れている。
As an anisotropic conductive adhesive, there is known an anisotropic conductive adhesive composed of conductive particles in which substantially the entire surface of a core material made of a polymer is substantially covered with a conductive thin metal layer and an insulating adhesive. (See Japanese Patent Publication No. 3-40899). The connection structure using this anisotropic conductive adhesive is that the conductive particles are appropriately deformed by the pressure when connecting the electrodes to connect, and a sufficient contact area can be obtained, and the polymer core material is rigid. The thermal expansion and contraction characteristics are very close to the properties of the adhesive as compared with the metal particles, so that the connection reliability is excellent.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、近年、
配線密度が高くなり、電極が微細化して、接続抵抗がよ
り低く、また、より高い接続信頼性のものが要求される
ようになっている。本発明は、異方導電性接着剤を用
い、接続抵抗がより低く、また、より高い接続信頼性の
接続構造を提供することを目的とする。
However, in recent years,
As the wiring density becomes higher and the electrodes become finer, lower connection resistance and higher connection reliability are required. An object of the present invention is to provide a connection structure which uses an anisotropic conductive adhesive and has a lower connection resistance and higher connection reliability.

【0005】[0005]

【課題を解決するための手段】本発明は、電気絶縁体1
5の表面から突き出して設けた電極13を有する二つの
電気部材を前記電極13が向き合うように対向させ、そ
の間に変形されかつ前記電極13に食い込んでいる導電
粒子11を介在させるとともに、前記電極13、13の
電気的に接続すべき部位の一部を相互に接触させて電気
絶縁性の接着剤12で固着してなることを特徴とするも
のである。この際に、前記導電体の少なくとも一方の高
さが導電粒子の径より大きくする。
The present invention provides an electrical insulator 1
5, two electric members having electrodes 13 protruding from the surface of the electrode 5 are opposed to each other so that the electrodes 13 face each other, and the conductive particles 11 that are deformed and bite into the electrodes 13 are interposed between the two electric members. , 13 are made to come into contact with each other, and are fixed by an electrically insulating adhesive 12. At this time, the height of at least one of the conductors is made larger than the diameter of the conductive particles.

【0006】[0006]

【発明の実施の形態】本発明の接続構造は、絶縁物表面
から突き出して設けた電極13を有する二つの電気部材
を前記電極13が向き合うように対向させ、電気部材の
絶縁物表面から突き出して設けた電極13より硬質であ
りかつ加圧により変形可能な導電粒子11を分散させた
異方導電性接着剤を前記電気部材間に置き、加圧するこ
とによって得られる。この際に、前記導電体の少なくと
も一方の高さが導電粒子の径より大きくする。
BEST MODE FOR CARRYING OUT THE INVENTION In the connection structure of the present invention, two electric members having electrodes 13 projecting from the surface of an insulator are made to face each other so that the electrodes 13 face each other, and project from the surface of the insulator of the electric member. It is obtained by placing an anisotropic conductive adhesive in which the conductive particles 11 that are harder than the provided electrode 13 and deformable by pressure are dispersed between the electric members and press the same. At this time, the height of at least one of the conductors is made larger than the diameter of the conductive particles.

【0007】接続の対象となる電気部材としては、例え
ばガラス基板、セラミック基板、フィルム(ポリイミド
等)基板、ガラスエポキシ基板等の絶縁板の表面に、I
TO、アルミニウム、ニッケル、金等の薄膜電極を設け
たもの、銅はく、銀、ニッケル等を含む導電性ペースト
類の電極を設けたもの、ICチップのような半導体素子
が挙げられる。電極本体がニッケルのように硬質の場合
には、その表面に、錫、金、はんだ等の軟質の表面層を
形成したものを使用する。
As an electric member to be connected, for example, a glass substrate, a ceramic substrate, a film (polyimide or the like) substrate, a glass epoxy substrate, or the like, on the surface of an insulating plate, I
Examples thereof include those provided with thin film electrodes of TO, aluminum, nickel, gold, etc., those provided with electrodes of conductive pastes containing copper foil, silver, nickel, etc., and semiconductor elements such as IC chips. When the electrode body is hard like nickel, a soft surface layer of tin, gold, solder or the like is formed on the surface of the electrode body.

【0008】半導体素子としては、シリコン、ガリウム
ヒ素等を材料とするものがあり、これらICチップは、
アルミニウム等の上に、銅、ニッケル、金、はんだ等を
被覆した電極を設けたものである。これら電極の表面
に、さらに、錫、金、はんだ等の表面層を形成すること
もできる。電極以外の面は、酸化シリコン、ホウケイ酸
ガラス、チッ化ケイ素、チッ化アルミニウム、チッ化ホ
ウ素、ポリイミド、フッ素樹脂のような絶縁層が形成さ
れていることが導電粒子とICチップの素子との接触を
完全に防止できるので好ましい。
Some semiconductor elements are made of silicon, gallium arsenide, etc., and these IC chips are
An electrode coated with copper, nickel, gold, solder or the like is provided on aluminum or the like. It is also possible to further form a surface layer of tin, gold, solder or the like on the surface of these electrodes. An insulating layer such as silicon oxide, borosilicate glass, silicon nitride, aluminum nitride, boron nitride, polyimide, or fluororesin is formed on the surface other than the electrodes between the conductive particles and the IC chip element. It is preferable because contact can be completely prevented.

【0009】また、互いに向き合う電極13のうち、少
なくとも一方の電極13の高さは、導電粒子11の径よ
りも大きくする。電極表面に存する凹凸も考慮して電極
の高さより1μm以上大きいのが好ましい。電極の高さ
ばらつきは導電粒子の粒径よりも小さい方が好ましい。
電極の硬さは導電粒子と同じか柔らかいことが導電粒子
が食い込むために必要である。電解銅はくより、伸びの
大きい圧延銅はくを用いた方が導電粒子の食い込みが大
きく、好ましい。
The height of at least one of the electrodes 13 facing each other is made larger than the diameter of the conductive particles 11. It is preferable that the height of the electrode is 1 μm or more in consideration of the unevenness on the electrode surface. The height variation of the electrodes is preferably smaller than the particle size of the conductive particles.
It is necessary that the hardness of the electrode is the same as or softer than the conductive particles so that the conductive particles can bite. It is preferable to use a rolled copper foil having a larger elongation than the electrolytic copper foil because the conductive particles are more bite into the rolled copper foil.

【0010】導電粒子としては、金、銀、銅、はんだ等
が用いられる。ポリスチレン等の高分子の球状の核材に
ニッケル、銅、金、はんだ等の導電層を設けたものがよ
り好ましい。さらに、導電粒子の表面に錫、金、はんだ
等の表面層を形成することもできる。微小電極上に導電
粒子を分散させ、電極に食い込ませためには、粒径が小
さいほうが好ましく、3μm〜5μmが好ましい。同じ
材質の導電粒子を用いた場合、粒径が大きい例えば10
μmの粒子では粒子の変形が大きく電極への食い込みは
小さくなる。これにたいし、粒径の小さい例えば3μm
の粒子では変形は小さく電極への食い込みは大きく容易
に電極間の直接接触が得られる。
As the conductive particles, gold, silver, copper, solder or the like is used. It is more preferable that a spherical core material of a polymer such as polystyrene is provided with a conductive layer of nickel, copper, gold, solder or the like. Further, a surface layer of tin, gold, solder or the like can be formed on the surface of the conductive particles. In order to disperse the conductive particles on the microelectrode and make them penetrate into the electrode, a smaller particle size is preferable, and 3 μm to 5 μm is preferable. If conductive particles of the same material are used, the particle size is large, for example 10
With particles of μm, the deformation of the particles is large and the bite into the electrode is small. In contrast to this, the particle size is small, for example, 3 μm.
In the particles of No. 3, deformation is small, the penetration into the electrode is large, and direct contact between the electrodes is easily obtained.

【0011】接着成分は液状もしくは加熱して液状とな
ることが必要である。熱又は光等で反応硬化する、エポ
キシ、アクリル樹脂のような反応性樹脂が好ましい。接
着成分中には、粒径が揃った導電粒子を分散させる。分
散量は、導電粒子の粒径によって異なる。電気部材間に
配して、加圧したとき、単粒子層を形成できかつ隣接粒
子が互いに接触しない程度とする必要がある。
It is necessary that the adhesive component be in a liquid state or a liquid state when heated. A reactive resin such as an epoxy resin or an acrylic resin which is reactively cured by heat or light is preferable. Conductive particles having a uniform particle size are dispersed in the adhesive component. The amount of dispersion depends on the particle size of the conductive particles. It is necessary to dispose between the electric members so that a single particle layer can be formed and a neighboring particle does not contact with each other when being pressed.

【0012】電気絶縁体表面から突き出して設けた電極
13,13間に存在する導電粒子11は、加圧により、
少なくとも一方の電極13に食い込み変形し、電極13
中の少なくとも1つ以上、好ましくはほとんどが、他方
の電極13と接触する。このように、導電粒子11が変
形しかつ電極13に食い込むことにより充分な接触面積
が得られる。
The conductive particles 11 existing between the electrodes 13, 13 protruding from the surface of the electric insulator are pressed by
At least one electrode 13 is bitten and deformed, and the electrode 13
At least one, and preferably most of them are in contact with the other electrode 13. In this way, the conductive particles 11 are deformed and dig into the electrodes 13, so that a sufficient contact area can be obtained.

【0013】また、電極13が一部分相互に直接接触す
ることにより、低抵抗での接続が可能となる。電極間以
外では導電粒子11は接着剤中に分散し圧力がかからな
いため変形することがない。従って、導電粒子の粒径や
添加量を選択することで隣接電極との絶縁性が充分に保
たれる。
Further, since the electrodes 13 are partially in direct contact with each other, connection with low resistance is possible. Except between the electrodes, the conductive particles 11 are dispersed in the adhesive and no pressure is applied, so that the conductive particles 11 are not deformed. Therefore, the insulating property from the adjacent electrode can be sufficiently maintained by selecting the particle size and the addition amount of the conductive particles.

【0014】[0014]

【実施例】実施例1 ポリイミドフィルムをフィルムベース15とする厚み3
5μmの圧延銅はく張りフィルムをエッチングし、残っ
た銅の上に錫を被覆し、幅50μm、密度10本/mm
の電極13を有する試験片を用意した。この試験片の電
極13を向き合わせ、その間に、異方導電性接着剤を介
在させ、圧力を変えて、180℃で、20秒間加熱加圧
した。なお、異方導電性接着剤は、エポキシ樹脂を接着
成分12とし、導電粒子11を単粒子層を形成するよう
に拡げたときに1000個/mm 2となるように導電粒
子11を分散したものである。導電粒子11はポリスチ
レン核の表面に金を被覆したもので、粒径3μm、5μ
m及び10μmの3種類とした。その結果、導電粒子1
1の粒径が3μmのときは、圧力が1.0MPa以上
で、また、導電粒子の粒径が5μmのときは、圧力が
2.0MPa以上で、導電粒子の粒径が10μmのとき
は、圧力が3.0MPa以上で、電極13,13間にあ
る導電粒子11が変形して電極13に食い込み、また、
電極13も互いに接触していた(図1参照)。さらに、
導電粒子11の粒径が3μmのときは、圧力が1.0M
Paで、導電粒子の粒径が5μmのときは、圧力が2.
0MPaで、導電粒子の粒径が10μmのときは、圧力
が3.0MPaで、それぞれ、接続抵抗(配線抵抗を含
む)が1Ωであった。これにたいし、導電粒子11の粒
径が3μmのとき、圧力が0.5MPaでは、接続抵抗
1.5Ω、導電粒子の粒径が5μmのとき、圧力が1.
0MPaで接続抵抗1.5Ω、導電粒子の粒径が10μ
mのとき、圧力が1.0MPaで接続抵抗2.0Ωであ
った。なお、電極間に存在する導電粒子の変形、導電粒
子の電極への食い込みは接続部分の断面を顕微鏡または
電子顕微鏡を用いて観察した。次に、粒径が10μmの
導電粒子について、接続後、85℃、85%RHに保持
して接続抵抗の変化を調べた。その結果、圧力が3.0
MPaのとき、初期値1Ω(前記参照)から、1000
時間後に1.1Ω、2000時間後に1.3Ωと僅かし
か増加しなかったが、圧力が1.0MPaのときは、初
期値2Ω(前記参照)から、1000時間後に2.5
Ω、2000時間後に3Ωと変化した。
[Example] Example 1 Thickness 3 with polyimide film as film base 15
5μm rolled copper foil film is etched and left
Coated copper with tin, width 50μm, density 10 / mm
A test piece having the electrode 13 of 1 was prepared. This test piece
The poles 13 face each other, and an anisotropic conductive adhesive is interposed between them.
And pressurize at 180 ℃ for 20 seconds
did. For anisotropic conductive adhesive, glue epoxy resin
As the component 12, the conductive particles 11 are used to form a single particle layer.
1000 pieces / mm when expanded to 2Conductive particles so that
The child 11 is dispersed. The conductive particles 11 are made of polystyrene.
The surface of ren core is coated with gold, and the particle size is 3μm, 5μ
m and 10 μm. As a result, the conductive particles 1
When the particle size of 1 is 3 μm, the pressure is 1.0 MPa or more.
When the particle size of the conductive particles is 5 μm, the pressure is
When the particle size of the conductive particles is 10 μm at 2.0 MPa or more
Is at a pressure of 3.0 MPa or higher, and there is a gap between the electrodes 13 and 13.
The conductive particles 11 that are deformed penetrate into the electrode 13, and
The electrodes 13 were also in contact with each other (see FIG. 1). further,
When the particle size of the conductive particles 11 is 3 μm, the pressure is 1.0M.
When the particle size of the conductive particles is 5 μm at Pa, the pressure is 2.
At 0 MPa, when the conductive particle size is 10 μm, the pressure is
Is 3.0 MPa, and the connection resistance (including wiring resistance) is
Was 1Ω. In contrast to this, particles of conductive particles 11
Connection resistance at a pressure of 0.5 MPa when the diameter is 3 μm
When the resistance is 1.5Ω and the diameter of the conductive particles is 5 μm, the pressure is 1.
Connection resistance is 1.5Ω at 0 MPa, and particle diameter of conductive particles is 10 μ
When m, the pressure is 1.0 MPa and the connection resistance is 2.0Ω.
It was. In addition, deformation of conductive particles existing between electrodes, conductive particles
To cut into the electrode of the child, the cross section of the connection part
It was observed using an electron microscope. Next, if the particle size is 10 μm
After connecting, keep conductive particles at 85 ℃ and 85% RH
Then, the change in connection resistance was investigated. As a result, the pressure is 3.0
At MPa, from the initial value of 1Ω (see above), 1000
1.1 Ω after hours and 1.3 Ω after 2000 hours
Did not increase, but when the pressure was 1.0 MPa,
From the period value of 2Ω (see above), 2.5 hours after 1000 hours
Ω, changed to 3Ω after 2000 hours.

【0015】実施例2 ガラス板15a上にITOの透明電極13a(厚み20
0nm、幅50μm、密度10本/mm)を形成したガ
ラス基板試験片を一方の電気部材とし、実施例1で用い
た試験片を他方の電気部材とし、その他は実施例1と同
様にして試験した。その結果、実施例1と同様な結果が
得られた。ただし、ガラス基板上の透明電極13aに
は、導電粒子の食い込みはみられなかった。
Example 2 A transparent electrode 13a of ITO (thickness: 20) is formed on a glass plate 15a.
A glass substrate test piece having a thickness of 0 nm, a width of 50 μm, and a density of 10 pieces / mm) was used as one electric member, the test piece used in Example 1 was used as the other electric member, and other tests were performed in the same manner as in Example 1. did. As a result, the same results as in Example 1 were obtained. However, no penetration of the conductive particles was observed in the transparent electrode 13a on the glass substrate.

【0016】実施例3 複数の金電極(高さ=15μm、一つの面積=40μm
□)を設けたICチップと、ガラス基板上に、表面に金
を被覆したニッケルの薄膜電極(高さ=0.3μm、一
つの面積=40μm□)と、エポキシ樹脂を接着成分1
2とし、導電粒子11を単粒子層を形成するように拡げ
たときに、導電粒子の数が1電極あたり10個となるよ
うに分散した異方導電性接着剤とを用い以下実施例1と
同様にして試験した。その結果、実施例1と同様な結果
が得られた。
Example 3 Multiple gold electrodes (height = 15 μm, one area = 40 μm)
□) is provided, a nickel thin film electrode (height = 0.3 μm, one area = 40 μm □) whose surface is coated with gold, and an epoxy resin are used as adhesive components 1 on a glass substrate.
2 and using an anisotropic conductive adhesive dispersed such that the number of conductive particles is 10 per electrode when the conductive particles 11 are spread so as to form a single particle layer. It tested similarly. As a result, the same results as in Example 1 were obtained.

【0017】[0017]

【発明の効果】本発明は、電気絶縁体表面から突き出し
て設けた導電体を有する二つの電気部材を前記導電体の
うち電気的に接続すべき部位が向き合うように対向さ
せ、前記導電体の電気的に接続すべき部位間に変形され
かつ前記導電体に食い込んでいる導電粒子を介在させる
とともに、前記導電体の電気的に接続すべき部位の一部
を相互に接触させて電気絶縁性の接着剤で固着すること
により、低抵抗でかつ信頼性の高い接続を得ることがで
きる。
According to the present invention, two electric members having a conductor provided so as to project from the surface of an electric insulator are made to face each other so that portions of the conductor to be electrically connected face each other, and The electrically conductive particles that are deformed between the portions to be electrically connected and that are biting into the conductor are interposed, and a part of the portions of the conductor to be electrically connected is brought into contact with each other to provide an electrically insulating property. By fixing with an adhesive, a connection with low resistance and high reliability can be obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】 フィルム基板同士の接続状態を示す断面図で
ある。
FIG. 1 is a cross-sectional view showing a connection state between film substrates.

【図2】 フィルム状基板とガラス基板の接続状態を示
す断面図である。
FIG. 2 is a cross-sectional view showing a connected state of a film substrate and a glass substrate.

【符号の説明】[Explanation of symbols]

11 導電粒子 12 接着成分 13、13a 電極 15 フィルムベース 15a ガラス板 11 Conductive particles 12 Adhesive component 13, 13a electrode 15 film base 15a glass plate

───────────────────────────────────────────────────── フロントページの続き (72)発明者 太田 共久 茨城県下館市大字小川1500番地 日立化成 工業株式会社総合研究所内 Fターム(参考) 5F044 KK01 KK18 LL09 QQ03    ─────────────────────────────────────────────────── ─── Continued front page    (72) Kyohisa Ota, inventor             Hitachi Chemical, 1500 Ogawa, Shimodate City, Ibaraki Prefecture             Industrial Research Institute F-term (reference) 5F044 KK01 KK18 LL09 QQ03

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 電気絶縁体表面から突き出して設けた導
電体を有する二つの電気部材を前記導電体のうち電気的
に接続すべき部位が向き合うように対向させ、前記導電
体の少なくとも一方の高さが導電粒子の径より大きく、
前記導電体の電気的に接続すべき部位間に変形されかつ
前記導電体に食い込んでいる導電粒子を介在させるとと
もに、前記導電体の電気的に接続すべき部位の一部を相
互に接触させて電気絶縁性の接着剤で固着してなる電気
部材の接続構造。
1. Two electric members having a conductor protruding from a surface of an electric insulator are made to face each other so that portions of the conductor to be electrically connected face each other, and at least one of the conductors has a height. Is larger than the diameter of the conductive particles,
By interposing the conductive particles that are deformed between the portions of the conductor to be electrically connected and that are biting into the conductor, contact a part of the portions of the conductor to be electrically connected to each other. A connection structure for electrical members that is fixed with an electrically insulating adhesive.
【請求項2】 導電粒子の径が3〜10μmである請求
項1に記載の電気部材の接続構造。
2. The electrical member connection structure according to claim 1, wherein the conductive particles have a diameter of 3 to 10 μm.
【請求項3】 電気部材間に導電粒子を配して、加圧し
たとき、導電粒子が単粒子層を形成でき、かつ、隣接粒
子が互いに接触しないようにした請求項1または請求項
2に記載の電気部材の接続構造。
3. The method according to claim 1, wherein conductive particles are formed between the electric members so that the conductive particles can form a single particle layer when pressed, and the adjacent particles do not contact each other. A connection structure for the electric member described.
【請求項4】 絶縁物表面から突き出して設けた導電体
を有する二つの電気部材を前記導電体のうち電気的に接
続すべき部位が向き合うように対向させ、前記導電体の
少なくとも一方の高さが導電粒子の径より大きく、電気
部材の絶縁物表面から突き出して設けた導電体より硬質
でありかつ加圧により変形可能な導電粒子を分散させた
異方導電性の接着剤を前記電気部材間に置き、加圧する
ことにより前記導電体の電気的に接続すべき部位間に変
形されかつ前記導電体に食い込んでいる導電粒子を介在
させるとともに、前記導電体の電気的に接続すべき部位
の一部を相互に接触させて電気絶縁性の接着剤で固着さ
せる電気部材の接続方法。
4. Two electric members each having a conductor provided so as to project from an insulator surface are opposed to each other so that portions of the conductor to be electrically connected face each other, and the height of at least one of the conductors. Is larger than the diameter of the conductive particles, harder than the conductor provided by protruding from the insulator surface of the electric member, and an anisotropic conductive adhesive in which the conductive particles deformable by pressure are dispersed The conductive particles that are deformed and bite into the conductor between the parts of the conductor to be electrically connected by applying pressure, and one of the parts of the conductor to be electrically connected. A method of connecting electrical members, wherein parts are brought into contact with each other and fixed with an electrically insulating adhesive.
【請求項5】 接着剤が液状もしくは加熱して液状とな
る接着成分を含む請求項4に記載の電気部材の接続方
法。
5. The method for connecting electrical members according to claim 4, wherein the adhesive contains an adhesive component which is liquid or which becomes liquid when heated.
JP2002218313A 2002-07-26 2002-07-26 Connecting structure and connecting method for electric member Pending JP2003068794A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002218313A JP2003068794A (en) 2002-07-26 2002-07-26 Connecting structure and connecting method for electric member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002218313A JP2003068794A (en) 2002-07-26 2002-07-26 Connecting structure and connecting method for electric member

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP25776594A Division JP3367076B2 (en) 1994-10-24 1994-10-24 Connection structure and connection method for electrical members

Publications (1)

Publication Number Publication Date
JP2003068794A true JP2003068794A (en) 2003-03-07

Family

ID=19196019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002218313A Pending JP2003068794A (en) 2002-07-26 2002-07-26 Connecting structure and connecting method for electric member

Country Status (1)

Country Link
JP (1) JP2003068794A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012174722A (en) * 2011-02-17 2012-09-10 Hitachi Chem Co Ltd Semiconductor device manufacturing method
JP2013239479A (en) * 2012-05-11 2013-11-28 Denso Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012174722A (en) * 2011-02-17 2012-09-10 Hitachi Chem Co Ltd Semiconductor device manufacturing method
JP2013239479A (en) * 2012-05-11 2013-11-28 Denso Corp Semiconductor device

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