JP2003060127A5 - Adhesive film for mounting semiconductor devices - Google Patents
Adhesive film for mounting semiconductor devices Download PDFInfo
- Publication number
- JP2003060127A5 JP2003060127A5 JP2002131897A JP2002131897A JP2003060127A5 JP 2003060127 A5 JP2003060127 A5 JP 2003060127A5 JP 2002131897 A JP2002131897 A JP 2002131897A JP 2002131897 A JP2002131897 A JP 2002131897A JP 2003060127 A5 JP2003060127 A5 JP 2003060127A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- adhesive film
- adhesive layer
- film according
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002313 adhesive film Substances 0.000 title claims 17
- 239000004065 semiconductor Substances 0.000 title claims 2
- 239000000853 adhesive Substances 0.000 claims 13
- 230000001070 adhesive Effects 0.000 claims 13
- WYURNTSHIVDZCO-UHFFFAOYSA-N tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims 6
- 229920001577 copolymer Polymers 0.000 claims 5
- -1 polytetrafluoroethylene Polymers 0.000 claims 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N Imidazole Chemical compound C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 4
- 125000003700 epoxy group Chemical group 0.000 claims 4
- 239000003822 epoxy resin Substances 0.000 claims 4
- 229920000647 polyepoxide Polymers 0.000 claims 4
- WTEOIRVLGSZEPR-UHFFFAOYSA-N Boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 238000000605 extraction Methods 0.000 claims 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims 2
- UAFNNYNGQVOTOM-UHFFFAOYSA-N 2-(2-phenyl-1H-imidazol-5-yl)propanenitrile Chemical compound N1C(C(C#N)C)=CN=C1C1=CC=CC=C1 UAFNNYNGQVOTOM-UHFFFAOYSA-N 0.000 claims 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 2-ethyl-5-methyl-1H-imidazole Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1H-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims 1
- 239000004677 Nylon Substances 0.000 claims 1
- 239000004952 Polyamide Substances 0.000 claims 1
- 239000004698 Polyethylene (PE) Substances 0.000 claims 1
- 229920001721 Polyimide Polymers 0.000 claims 1
- 239000004743 Polypropylene Substances 0.000 claims 1
- 229920001021 Polysulfide Polymers 0.000 claims 1
- 239000006087 Silane Coupling Agent Substances 0.000 claims 1
- 150000008065 acid anhydrides Chemical class 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- 150000001412 amines Chemical group 0.000 claims 1
- 150000001639 boron compounds Chemical class 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 230000001419 dependent Effects 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 238000001914 filtration Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims 1
- 230000020169 heat generation Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 229920001778 nylon Polymers 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 229920000573 polyethylene Polymers 0.000 claims 1
- 229920000306 polymethylpentene Polymers 0.000 claims 1
- 239000011116 polymethylpentene Substances 0.000 claims 1
- 229920001155 polypropylene Polymers 0.000 claims 1
- 239000005077 polysulfide Substances 0.000 claims 1
- 150000008117 polysulfides Polymers 0.000 claims 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims 1
- 239000004810 polytetrafluoroethylene Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Claims (14)
ベースフィルムと、該ベースフィルム上に形成された接着剤層とを備え、A base film, and an adhesive layer formed on the base film;
上記接着剤層は、エポキシ基含有アクリル共重合体とエポキシ樹脂とを含有する熱硬化性樹脂からなり、The adhesive layer is made of a thermosetting resin containing an epoxy group-containing acrylic copolymer and an epoxy resin,
上記接着剤層は、動的粘弾性測定装置を用いて測定した場合の接着剤硬化物の貯蔵弾性率が２５℃で１０〜２０００ＭＰａ、２６０℃で３〜５０ＭＰａであり、The adhesive layer has a storage elastic modulus of 10 to 2000 MPa at 25 ° C. and 3 to 50 MPa at 260 ° C. when measured using a dynamic viscoelasticity measuring device,
上記接着剤硬化物は、示差熱量計を用いて測定した場合の全硬化発熱量の９５〜１００％の発熱を終えた状態であり、The adhesive cured product is in a state where heat generation of 95 to 100% of the total curing calorific value as measured using a differential calorimeter has been completed,
上記貯蔵弾性率は、上記接着剤硬化物に引張り荷重をかけて、周波数１０Ｈｚ、昇温速度５〜１０℃／分で−５０℃から３００℃まで測定する温度依存性測定モード測定されたものであることを特徴とする接着フィルム。The storage elastic modulus is a temperature-dependent measurement mode in which a tensile load is applied to the cured adhesive and the frequency is 10 Hz, and the heating rate is 5 to 10 ° C./min and the temperature is measured from −50 ° C. to 300 ° C. Adhesive film characterized by being.
上記ＴＨＦ抽出率は、テトラヒドロフラン中に重量Ｗ１の上記接着剤層を浸し、２５℃で２０時間放置した後、非溶解分を２００メッシュのナイロン布で濾過して乾燥した後の重量Ｗ２を測定し、下記数式（２）により算出される値であることを特徴とする請求項１記載の接着フィルム。The THF extraction rate is determined by immersing the adhesive layer of weight W1 in tetrahydrofuran and leaving it to stand at 25 ° C. for 20 hours, and then measuring the weight W2 after filtering the non-dissolved matter with a 200 mesh nylon cloth and drying. The adhesive film according to claim 1, wherein the adhesive film is a value calculated by the following formula (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002131897A JP3617504B2 (en) | 1996-10-08 | 2002-05-07 | Adhesive film for mounting semiconductor elements |
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26646096 | 1996-10-08 | ||
| JP31770996 | 1996-11-28 | ||
| JP9-111430 | 1997-04-28 | ||
| JP8-317709 | 1997-04-28 | ||
| JP11143097 | 1997-04-28 | ||
| JP8-266460 | 1997-04-28 | ||
| JP2002131897A JP3617504B2 (en) | 1996-10-08 | 2002-05-07 | Adhesive film for mounting semiconductor elements |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51739298A Division JP3453390B2 (en) | 1996-10-08 | 1997-10-08 | Semiconductor device, substrate for mounting semiconductor chip, and method of manufacturing the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003060127A JP2003060127A (en) | 2003-02-28 |
| JP3617504B2 JP3617504B2 (en) | 2005-02-09 |
| JP2003060127A5 true JP2003060127A5 (en) | 2005-06-09 |
Family
ID=27469907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002131897A Expired - Lifetime JP3617504B2 (en) | 1996-10-08 | 2002-05-07 | Adhesive film for mounting semiconductor elements |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3617504B2 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005109307A (en) * | 2003-10-01 | 2005-04-21 | Matsushita Electric Ind Co Ltd | Board with built-in circuit part, and manufacturing method of the same |
| US7453157B2 (en) * | 2004-06-25 | 2008-11-18 | Tessera, Inc. | Microelectronic packages and methods therefor |
| US7560821B2 (en) * | 2005-03-24 | 2009-07-14 | Sumitomo Bakelite Company, Ltd | Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same |
| JP4523611B2 (en) * | 2007-02-20 | 2010-08-11 | 日東電工株式会社 | Manufacturing method of semiconductor device |
| WO2009001492A1 (en) | 2007-06-22 | 2008-12-31 | Sumitomo Bakelite Co., Ltd. | Adhesive film and semiconductor device obtained with the same |
| JP5083070B2 (en) * | 2007-11-19 | 2012-11-28 | 日立化成工業株式会社 | Sealing film |
| JP5493327B2 (en) * | 2007-12-18 | 2014-05-14 | 日立化成株式会社 | Resin composition for sealing filling, semiconductor device and method for manufacturing the same |
| JP2008263234A (en) * | 2008-07-17 | 2008-10-30 | Hitachi Chem Co Ltd | Semiconductor chip mounting substrate, semiconductor package, and their manufacturing method |
| KR101866901B1 (en) * | 2016-10-12 | 2018-06-14 | 한국기계연구원 | Multi-layered carrier film and the transfer method using the device and electronics manufacturing method using the same method |
| TWI791721B (en) * | 2017-12-27 | 2023-02-11 | 日商三菱瓦斯化學股份有限公司 | Resin composition, prepreg, laminate, meta foil-clad laminate, printed wiring board, and multilayer printed wiring board |
| CN113423753B (en) * | 2019-02-21 | 2024-06-11 | 松下知识产权经营株式会社 | Semiconductor packaging material and semiconductor device |
-
2002
- 2002-05-07 JP JP2002131897A patent/JP3617504B2/en not_active Expired - Lifetime
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