JP2003057022A - Optical inspection apparatus and optical inspection system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical inspection apparatus fitted to miniaturization and contributing to cost reduction, and an optical inspection system. SOLUTION: The optical inspection apparatus is equipped with a light irradiation means having a first optical component constituted of a Flesnel lens or a Flesnel reflecting mirror for converting the light from the spotlight source to parallel light to irradiate one surface of a wafer, a second optical component constituted of the Flesnel lens or Flesnel reflecting mirror and condensing the parallel light passed through the outside of the outer peripheral part of the wafer and a light receiving part for receiving the light from the second optical component.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical inspection apparatus, which performs centering of a wafer, detects a notch or an orientation flat (orientation flat) to adjust the orientation of a wafer crystal, or detects an ID or the like to detect a wafer. The present invention relates to an optical inspection device suitable for controlling

[0002]

2. Description of the Related Art Personal computers (personal computers) and mobile phones have been popularized as products that are now indispensable in daily life. It is no exaggeration to say that the evolution of these products is the evolution and development of various semiconductor devices such as CPUs and memories. Further evolution,
It is a well known fact that various semiconductor processes that support the semiconductor device manufacturing process are indispensable for the development.

As a process device, a dry etcher,
Apparatuses such as asher, plasma CVD, sputtering, and ion implantation are known. Among these apparatuses, the apparatus utilizing plasma emission detects the position of the wafer (including detection of the position of the notch and the orientation flat (orientation flat)) before transferring the wafer to the chamber, and then the position (direction). Including)) (Alignment)
Is absolutely necessary.

This is because it is necessary to secure the absolute position of the wafer in the chamber by stabilizing the process condition with respect to the orientation of the wafer crystal and maintaining the uniformity of the plasma by keeping the position of the wafer in the chamber constant. This is because This alignment is an in-apparatus process common to most so-called process apparatuses, and it is almost always equipped with an alignment unit.

[0005]

This alignment is
Normally, the robot once inserts the wafer that came out of the cassette on the loading side into the alignment unit, performs centering and orientation adjustment of the wafer, and when the end signal is sent, the robot again picks up the wafer and carries it to the chamber. Be implemented. However, in order to detect the position of the wafer and the like, it is necessary to incorporate various optical components into the alignment unit, and thus the alignment unit has conventionally been unavoidably large.

The present invention has been made in view of the above problems, and an object thereof is to provide an optical inspection apparatus and an optical inspection system which are suitable for downsizing and contribute to cost reduction.

[0007]

An optical inspection apparatus according to a first aspect of the present invention comprises a Fresnel lens or a Fresnel reflecting mirror for collimating light from a point light source and irradiating the light onto one surface of the wafer. A light irradiation means having an optical component of
A second optical component configured by a Fresnel lens or a Fresnel reflecting mirror for collecting parallel light passing outside the outer peripheral portion of the wafer; and a light receiving unit for receiving light from the second optical component. To do. In this case, each of the first optical component and the second optical component constitutes a telecentric system. The "wafer inspection" here is performed for the purpose of centering the wafer, adjusting the orientation of the wafer crystal, and the like. Further, the “point light source” does not need to be a complete point light source, and may be a point light source substantially, and may be a point light source according to desired accuracy. The “parallel light” may be substantially parallel light, and may be parallel light according to desired accuracy. Further, the “light receiving section” is not particularly limited, but a sensor such as CCD is used. According to this optical inspection apparatus, since the light made into parallel light by the first optical component is applied to one surface of the wafer, the distance between the first optical component and the wafer can be freely set. In addition, since the second optical component collects the parallel light passing outside the outer peripheral portion of the wafer,
The distance between the optical component and the wafer can be freely set. If necessary, a reflecting mirror may be incorporated to bend the optical path. As a result, according to this optical inspection apparatus, it is possible to realize an optical inspection apparatus which has a high degree of freedom in the arrangement of optical components and contributes to downsizing and cost reduction.

The optical inspection device according to claim 2 is the optical inspection device according to claim 1.
In the optical inspection apparatus described above, at least one of the first optical component and the second optical component is rectangular. Here, it is preferable that the rectangular optical component is arranged such that its longitudinal direction corresponds to the diametrical direction of the wafer, and in that case, the light receiving portion has a one-dimensional sensor corresponding to the rectangular optical component. It is preferable. According to this optical inspection device, since at least one of the first optical component and the second optical component is rectangular, the optical inspection device can be further miniaturized and reduced in cost. This is because the optical component itself can be miniaturized and the cost can be reduced by making the optical component rectangular and removing a portion unnecessary for inspection.

An optical inspection apparatus according to a third aspect of the present invention is an optical inspection apparatus having a third optical component including a Fresnel lens or a Fresnel reflecting mirror for collimating light from a point light source and irradiating the parallel light onto one surface of the wafer. A fourth optical component including an irradiation unit and a Fresnel lens or a Fresnel reflecting mirror for condensing the light reflected by the one surface of the wafer; and a fourth optical component including a Fresnel lens or a Fresnel reflecting mirror. A fifth optical component for converting light into parallel light, and a light receiving unit for receiving the parallel light from the fifth optical component are provided. In this case, each of the third optical component and the fourth optical component constitutes a telecentric system. The fourth optical component and the fifth optical component form a double-sided telecentric system. "Wafer inspection" here
Is for wafer centering, wafer crystal orientation adjustment,
This is done for the purpose of reading the ID. Further, the “point light source” does not need to be a complete point light source, and may be a point light source substantially, and may be a point light source according to desired accuracy. The “parallel light” may be substantially parallel light, and may be parallel light according to desired accuracy. Further, the “light receiving section” is not particularly limited, but a sensor such as CCD is used. According to this optical inspection device, since the light made into the parallel light by the third optical component is applied to the one surface of the wafer, the distance between the third optical component and the wafer can be freely set. Further, since the both-side telecentric system is constituted by the fourth and fifth optical parts, the distance between the fourth optical part and the wafer and the distance between the fifth optical part and the light receiving portion can be freely set. It can be set. If necessary, a reflecting mirror may be incorporated to bend the optical path. As a result, according to this optical inspection apparatus, it is possible to realize an optical inspection apparatus which has a high degree of freedom in the arrangement of optical components and contributes to downsizing and cost reduction.

The optical inspection device according to claim 4 is the optical inspection device according to claim 3.
In the optical inspection device described above, at least one of the third optical component, the fourth optical component, and the fifth optical component is rectangular. Here, it is preferable that the rectangular optical components are arranged so that the longitudinal direction thereof corresponds to the diameter direction of the wafer. According to this optical inspection device, the third optical component, the fourth optical component, and the fifth optical component
Since at least one of these optical components is rectangular, the optical inspection device can be further miniaturized and reduced in cost. This is because the optical component itself can be miniaturized and the cost can be reduced by making the optical component rectangular and removing a portion unnecessary for inspection.

The optical inspection device according to claim 5 is the optical inspection device according to claim 3.
Alternatively, in the optical inspection device described in the paragraph 4, the third optical component is simultaneously the fourth optical component. According to this optical inspection device, since the third optical component also serves as the fourth optical component, the number of parts constituting the optical inspection device can be reduced, and the optical inspection device can be further downsized and inexpensive. It will be possible.

The optical inspection device of claim 6 is the optical inspection device of claims 3-5.
In any one of the optical inspection apparatuses, a diaphragm is provided at or near a focal position of the fourth optical component. Here, the “focal position of the fourth optical component” means the focal position on the image side. According to this optical inspection device, since the diaphragm is provided at or near the focal position of the fourth optical component, the contrast and resolution of the observed image can be improved.

An optical inspection system according to a seventh aspect of the present invention is an optical inspection system having a sixth optical component including a Fresnel lens or a Fresnel reflecting mirror for collimating light from a point light source and irradiating the parallel light onto one surface of the wafer. A seventh optical component configured by an irradiation unit and a Fresnel lens or a Fresnel reflecting mirror to collect parallel light passing through the outside of the outer peripheral portion of the wafer;
First light receiving portion for receiving light from the optical component, and an eighth optical component configured by a Fresnel lens or a Fresnel reflecting mirror for condensing light reflected on one surface of the wafer, and a Fresnel lens or a Fresnel reflecting mirror A ninth optical component configured to convert the light from the eighth optical component into parallel light, and a second light receiving unit that receives the parallel light from the ninth optical component. In this case, the sixth optical component and the seventh optical component each constitute a telecentric system. The eighth optical component constitutes a telecentric system, and the eighth optical component and the ninth optical component constitute a double-sided telecentric system. The “wafer inspection” is performed for the purpose of centering the wafer, adjusting the orientation of the wafer crystal, reading the ID, and the like.
Further, the “point light source” does not need to be a complete point light source, and may be a point light source substantially, and may be a point light source according to desired accuracy. The “parallel light” may be substantially parallel light, and may be parallel light according to desired accuracy. Further, the “light receiving section” is not particularly limited, but a sensor such as CCD is used. According to this optical inspection device, the actions and effects of claims 1 and 3 can be obtained at the same time, and only one light irradiation means is required.

An optical inspection system according to an eighth aspect is the optical inspection system according to the seventh aspect, wherein the sixth optical component is simultaneously the eighth optical component. According to this optical inspection system, the sixth optical component also serves as the eighth optical component, so that the optical inspection system can be further downsized and reduced in cost.

An optical inspection system according to a ninth aspect comprises the optical inspection apparatus according to the first or second aspect and the optical inspection apparatus according to any of the third to sixth aspects. According to this optical inspection system, the operations and effects according to the combination of the optical inspection devices according to any one of claims 1 to 6 are exhibited.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION 1. Overall Configuration FIG. 1 shows an optical inspection system according to an embodiment, and FIG. 2 is a schematic enlarged view of a wafer suction plate and its vicinity of the optical inspection system of FIG. This optical inspection system includes a wafer suction plate 10 for sucking a wafer W by vacuum suction by a vacuum pump 11, an XY table 20 for moving the wafer suction plate 10 in an XY plane, and a wafer suction plate 1.
0 and XY table 20 is rotated about a predetermined axis as a rotation table 30, a position detection optical system 40 for optically detecting the position of the wafer W, and an ID of the wafer W
ID reading optical system 50 for optically detecting the position, a display unit 60 for displaying an optical image of the wafer W obtained by the position detection optical system 40 and the ID reading optical system 50, and the rotation amount of the rotary table 30. An encoder 70 for detecting the above is provided and a control circuit 80 for comprehensively managing the overall operation of the optical inspection system.

According to this optical inspection system, the wafer W is vacuum-sucked on the wafer suction plate 10 by the vacuum suction of the vacuum pump 11, and the position W of the wafer W (including the positions of notches and orientation flats) is detected by the position detection optical system 40. Is optically detected, and the positional deviation can be corrected (including crystal orientation adjustment) by operating the XY table 20 and / or the rotary table 30. Further, the ID formed on the main surface of the wafer W can be optically detected and read.

The configuration of the essential parts of the present invention will be described below.

2. Configuration of essential parts of the present invention This optical inspection system includes a position detection optical system 40 and an ID reading optical system 50. Hereinafter, the position detecting optical system 40 and the ID reading optical system 50 will be mainly described.

A. Position Detection Optical System 40 (1) Configuration FIG. 3 shows the position detection optical system 40. Light source 40
Although a is not particularly limited as a, an LED is used. The LEDs are used for downsizing and cost reduction of the position detecting optical system 40. The light from the light source 40a is designed to be a substantial point light source. For example, an aperture (not shown) is installed in front of the light source 40a, and the light emitted from the light source 40a passes through the aperture to become a substantial point light source. A halogen lamp, a xenon lamp, or other light source may be used as a light source, and an optical fiber or the like may be used to form a substantial point light source.

The light from the point light source is directed to the outer peripheral portion (one surface) of the wafer W. A Fresnel lens 40b is installed in the middle of the Fresnel lens 40b.
The light from the point light source is collimated by b. That is,
The Fresnel lens 40b constitutes a telecentric system. The Fresnel lens 40b is not particularly limited, but has a rectangular shape and is installed such that its longitudinal direction corresponds to the diameter direction of the wafer W. Fresnel lens 40
The reason why b is rectangular is that the Fresnel lens itself can be made small, and the position detection optical system 40 can be made compact and inexpensive. When the Fresnel lens 40b is rectangular, it is preferable to avoid the central portion of the ring-shaped lens as shown in FIG. In place of the Fresnel lens 40b, a rectangular Fresnel reflecting mirror is used, although not particularly limited,
The outer peripheral portion of the wafer W may be irradiated with parallel light. Also in this case, it is preferable to avoid the central portion of the ring-shaped reflecting mirror.

The Fresnel lens 40 with the wafer W in between.
A reflecting mirror (total reflecting mirror) 40c is installed at a position facing b. The reflecting mirror 40c is installed at an angle of 45 degrees with respect to the main surface of the wafer W. The reflecting mirror 40c has a function of reflecting the light from the Fresnel lens 40b in the radiation direction of the wafer W in parallel with the main surface of the wafer W. By inserting this reflecting mirror 40c, the optical path can be bent. The reflecting mirror 40c is not essential. A Fresnel reflector or Fresnel lens may be installed at the position of the reflector 40c. By doing so, the reflecting mirror having only the function of reflecting light can be omitted, and the number of parts of the position detection optical system 40 can be reduced.

A Fresnel reflecting mirror 40d is provided so as to face the reflecting mirror 40c in the radiation direction of the wafer W. The Fresnel reflecting mirror 40d has a function of reflecting the light from the reflecting mirror 40c downward and condensing the light. The Fresnel reflecting mirror 40d is not particularly limited, but is rectangular and is installed so that its longitudinal direction corresponds to the diameter direction of the wafer W. The reason why the Fresnel reflecting mirror 40d is rectangular is that the Fresnel reflecting mirror itself can be made small, and the position detection optical system 40 can be made compact and inexpensive.
A Fresnel lens may be used instead of the Fresnel reflecting mirror 40d.

A sensor 40e is provided at or near the focal position of the Fresnel reflecting mirror 40d. This sensor 4
0e receives the light from the Fresnel reflecting mirror 40d and outputs an electric signal corresponding to the received light. The sensor 40e in this case is not particularly limited, but it is preferable to use a line sensor (one-dimensional sensor). When the line sensor is used, it is preferable that each sensor (CCD or the like) forming the line sensor is arranged corresponding to the radiation direction of the wafer W as shown in FIG. In this case, the position of the wafer W is detected depending on which position of the sensor receives the light.

The above position detecting optical system 40 is used for centering the wafer W and detecting notches and orientation flats of the wafer W to adjust the orientation. Hereinafter, an example of the specific method will be described. (2) Method 1) As shown in FIG. 3, after the wafer W is vacuum-sucked on the wafer suction plate 10, the Fresnel lens 40b is moved from the light source 40a.
The wafer W is rotated while irradiating light toward the outer peripheral portion of the wafer W through. 2) In this case, the light passing outside the outer peripheral portion of the wafer W is received by the sensor 40e via the reflecting mirror 40c and the Fresnel reflecting mirror 40d, but if there is a positional deviation, the line sensor output as a whole is shown in FIG. As shown, it becomes a sine wave or a cosine wave. In the figure, A indicates the sensor output of the notch or the orientation flat portion. The positional deviation in the XY directions is obtained from the amplitude of the sensor output, the positional deviation of the crystal orientation is obtained from the sensor output position of the notch or the orientation flat portion, and the control circuit 80 determines the positional deviation in the XY table 20 and the rotary table. The position shift is corrected by moving 30 accordingly.

B. ID Reading Optical System 50 (1) Configuration FIG. 6 shows the ID reading optical system 50. Light source 50
Although a is not particularly limited as a, an LED is used. The LED is used in order to reduce the size and cost of the ID reading optical system 50. The light from the light source 50a is designed to be a substantial point light source. For example, an aperture (not shown) is installed in front of the light source 50a,
The light emitted from the light source 50a passes through this aperture to become a substantial point light source.
A halogen lamp, a xenon lamp, or other light source may be used as a light source, and an optical fiber or the like may be used to form a substantial point light source. Also, this light source 5
Another aperture 50b having a relatively large diameter near 0a
Is installed, and stray light is removed by the aperture 50b.

Light from the point light source is emitted parallel to the main surface of the wafer W and toward the center of the wafer W. The light emitted from this point light source is a semi-transparent mirror (beam splitter) 5
0c and hits the Fresnel reflecting mirror 50d installed above the wafer W to bend the optical path downward,
It is considered as parallel light. In other words, the Fresnel reflecting mirror 50d constitutes a telecentric system. Then, the parallel light from the Fresnel reflecting mirror 50d is applied to the main surface of the wafer W from the normal direction of the wafer W. This Fresnel reflector 50
Although not particularly limited, d has a rectangular shape and is installed such that its longitudinal direction corresponds to the arrangement direction of the characters and symbols forming the ID. The Fresnel reflecting mirror 50d is rectangular because the Fresnel reflecting mirror itself can be made small and the ID reading optical system 50 can be made compact. When the Fresnel reflecting mirror 50d is rectangular, it is preferable that the light from the Fresnel reflecting mirror 50d can cover the entire ID. Also, the Fresnel reflector 50d
When is rectangular, it is preferable to avoid the central portion of the annular reflecting mirror. Further, the Fresnel reflecting mirror 50d may be replaced by a rectangular Fresnel lens, which is not particularly limited, and the main surface of the wafer W may be irradiated with parallel light. Also in this case, it is preferable to avoid the central portion of the ring-shaped lens.

The Fresnel reflecting mirror 50 is provided on the main surface of the wafer W.
In addition to the parallel light from d, diffused light from the auxiliary light source 50e provided above the wafer W is irradiated.
By providing this auxiliary light source 50e, the contrast and resolution can be improved depending on the state of the ID number. The auxiliary light source 50e is not particularly limited, but an LED, a white light source, or the like is used. in this case,
It is preferable to use LEDs. This is because the ID reading optical system 50 can be made compact and inexpensive.

The light radiated to the main surface of the wafer W and reflected by the main surface of the wafer W returns to the Fresnel reflecting mirror 50d and the light path thereof is bent to be converged light, hits the semi-transparent mirror 50c, and the light path is bent downward. A diaphragm (spatial filter) 50f is provided at the focal position of the Fresnel reflecting mirror 50d. It is preferable that the diaphragm 50f is a variable diaphragm and the control circuit 80 can change the opening of the diaphragm 50f. In this way, the contrast and resolution can be freely selected.

The light that has passed through the diaphragm 50f is emitted from the diaphragm 50f.
The light enters the Fresnel lens 50g provided below f. The Fresnel lens 50g has a function of converting incident light into parallel light. That is, the Fresnel lens 50g constitutes a telecentric system. Further, the Fresnel lens 50g and the Fresnel reflecting mirror 50d constitute a both-side telecentric system. The Fresnel lens 50g is not particularly limited, but has a rectangular shape whose longitudinal direction is ID.
It is installed so as to correspond to the arrangement direction of the characters and symbols that make up. The reason why the Fresnel lens 50g is rectangular is
This is because the Fresnel lens itself can be made small, and the ID reading optical system 50 can be made inexpensive and compact. When the Fresnel lens 50g has a rectangular shape, it is preferable to cover the entire ID. Also,
When the Fresnel lens 50g is rectangular, it is preferable to avoid the central portion of the annular lens. Further, the Fresnel lens 50g may be replaced by a rectangular Fresnel reflecting mirror, although not particularly limited thereto. Also in this case, it is preferable to avoid the central portion of the ring-shaped reflecting mirror. Needless to say, when using the Fresnel reflecting mirror, it is necessary to change the arrangement of the sensor 50h described later.

A sensor 5 is provided below the Fresnel lens 50g.
0h is provided. The sensor 50h receives light from the Fresnel lens 50g and outputs an electric signal corresponding to the received light. The sensor 50g in this case is not particularly limited, but it is preferable to use a two-dimensional sensor. This is because when the line sensor is used, it is necessary to scan the line sensor for reading the ID.

The ID reading optical system 5 configured as described above
0 is used to detect the ID of the wafer W.

(2) Method 1) As shown in FIG. 7, on the wafer W, an ID is usually attached near the notch or orientation flat. This ID reading is performed after position adjustment (alignment). 2) This ID reading is performed automatically, and the read I
D is output to the outside.

3. Effects of the Embodiments According to the above-described optical inspection system, since the Fresnel lens or the Fresnel reflecting mirror is used, the optical inspection system can be configured compactly. As a result, it becomes easy to incorporate the position detection optical system 40 and the ID reading optical system 50 in the alignment unit at the same time. Also,
Since the Fresnel lens, the Fresnel reflecting mirror, and the like form a telecentric system, the degree of freedom in arranging various optical components increases.

Although the embodiments of the present invention have been described above, it is needless to say that the present invention is not limited to such embodiments and various modifications can be made without departing from the scope of the invention. Absent.

[0036]

According to the present invention, the cost and size of the optical inspection device or the optical inspection system can be reduced.

[Brief description of drawings]

FIG. 1 is a block diagram of an optical inspection system according to an embodiment.

2 is a wafer in the optical inspection system of FIG. 1, XY
It is a schematic block diagram of a table and a rotary table.

3 is a diagram showing a position detection optical system in the optical inspection system of FIG.

FIG. 4 is a diagram for explaining a positional relationship between a sensor and a wafer in the optical inspection system of FIG.

5 is a diagram showing a sensor output when the wafer is displaced in the optical inspection system of FIG.

6 is a diagram showing an ID reading optical system in the optical inspection system of FIG.

FIG. 7 is a diagram for explaining the position of the ID number on the wafer.

FIG. 8 is a diagram showing a use position of a Fresnel lens.

[Explanation of symbols]

W wafer 40 Position detection optical system 40a light source 40b Fresnel lens (optical component) 40d Fresnel reflector (optical parts) 40e sensor (light receiving part) 50 ID reading optical system 50a light source 50d Fresnel reflector (optical parts) 50g Fresnel lens

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 2F065 AA03 AA39 AA56 BB03 CC19                       DD02 FF44 FF65 GG02 GG03                       GG07 GG12 HH02 HH03 HH13                       JJ02 JJ03 JJ07 JJ25 JJ26                       LL01 LL10 LL12 LL18 LL30                       LL46 LL59 MM04 NN03 NN20                       PP12 TT08                 2G051 AA51 AB20 BB09 CA03 CC07                       CC11

Claims (9)

[Claims] 1. A light irradiating means having a first optical component composed of a Fresnel lens or a Fresnel reflecting mirror for collimating light from a point light source and irradiating the light to one surface of the wafer, and a Fresnel lens or Fresnel. An optical inspection apparatus comprising: a second optical component configured of a reflecting mirror for collecting parallel light passing through the outside of the outer peripheral portion of the wafer; and a light receiving unit for receiving light from the second optical component. . 2. The optical inspection apparatus according to claim 1, wherein at least one of the first optical component and the second optical component has a rectangular shape. 3. A light irradiating means having a third optical component composed of a Fresnel lens or a Fresnel reflecting mirror for collimating light from a point light source and irradiating it toward one surface of the wafer, and a Fresnel lens or Fresnel. A fourth optical component which is composed of a reflecting mirror and collects the light reflected by the one surface of the wafer, and a fifth optical component which is composed of a Fresnel lens or a Fresnel reflecting mirror and which collimates the light from the fourth optical component. 2. An optical inspection device, comprising: the optical component; and a light receiving portion that receives parallel light from the fifth optical component. 4. The optical inspection apparatus according to claim 3, wherein at least one of the third optical component, the fourth optical component and the fifth optical component is rectangular. 5. The third optical component is the fourth optical component at the same time, and the third optical component is the fourth optical component at the same time.
The optical inspection device described. 6. The optical inspection apparatus according to claim 3, wherein a diaphragm is provided at or near a focal position of the fourth optical component. 7. A light irradiating means having a sixth optical component composed of a Fresnel lens or a Fresnel reflecting mirror for collimating light from a point light source and irradiating the parallel light to one surface of the wafer, and a Fresnel lens or Fresnel. A seventh optical component configured of a reflecting mirror for collecting parallel light passing outside the outer peripheral portion of the wafer, a first light receiving portion for receiving light from the seventh optical component, a Fresnel lens or a Fresnel reflecting mirror And an eighth optical component configured to condense the light reflected by the one surface of the wafer and a Fresnel lens or a Fresnel reflecting mirror to convert the light from the eighth optical component into parallel light.
2. An optical inspection system comprising: the optical component and the second light receiving unit that receives parallel light from the ninth optical component. 8. The optical inspection system according to claim 7, wherein the sixth optical component simultaneously serves as the eighth optical component. 9. An optical inspection system comprising the optical inspection device according to claim 1 or 2 and the optical inspection device according to any one of claims 3 to 6 at the same time.