JP2003051385A - Manufacturing method of display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To establish electric connection without generating a great amount of heat in electrically connecting an organic electroluminescent element and a wiring board. SOLUTION: An electrode terminal part 106 and a conducting part 203 are electrically connected by positioning the electrode terminal part 106 for conducting the organic electroluminescence element 6 and the conducting part 203 of a through hole shape provided on the wiring board 5, arranging a solder material 301 in the through hole shaped conducting part 203, and irradiating a laser light 401 to the solder material 301 and melting. In this regard, in advance of the electrical connection, treatment for improving absorption of the laser light 401 is applied at least to the solder material 301.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a method for manufacturing a display device having an organic electroluminescent element.

[0002]

2. Description of the Related Art In recent years, organic electroluminescent elements (organic electroluminescent elements, hereinafter referred to as "organic EL elements")
A display device (hereinafter, referred to as “organic EL display”) using a light emitting element has been attracting attention. In an organic EL display, usually, a transparent electrode that serves as an anode is formed in a stripe shape on a panel substrate made of transparent glass or the like, and an organic layer including a hole transport layer and a light emitting layer is formed on the transparent electrode. Is formed in a direction orthogonal to the transparent electrode, and a cathode is formed on the organic layer. Thereby, an organic EL element is formed at each of the positions where the transparent electrode and the cathode intersect. A light emitting area is formed by arranging these organic EL elements vertically and horizontally. In addition, an electrode portion for connecting the light emitting area to an external circuit or an internal drive circuit is formed in the peripheral portion.

In the organic EL display having such a structure, when a positive voltage is applied to the transparent electrode as an anode and a negative voltage is applied to the cathode, holes injected from the transparent electrode are generated. It reaches the light emitting layer through the hole transport layer. On the other hand, the electrons injected from the cathode also reach the light emitting layer. Therefore, electron-hole recombination occurs in the light emitting layer, so that light having a predetermined wavelength is generated. Then, the light is emitted to the outside from the panel substrate made of transparent glass or the like. As a result, the organic EL display can display an image, for example.

[0004]

By the way, a display device typified by this type of organic EL display is provided with respect to an electrode portion on a panel substrate for driving a light emitting element.
It is necessary to electrically connect a flexible wiring board or a driver IC (integrated circuit) for driving, which constitutes a part of an external circuit or an internal drive circuit. This electrical connection is usually an anisotropic conductive film (A).
Abbreviated as “CF”).

However, when electrically connecting using the ACF, heating and pressurization are indispensable for softening and adhering the ACF, so that the following problems may occur. Organic EL elements are vulnerable to heat,
It can only withstand about 80 degrees. Therefore, when the influence of heating upon establishing the electrical connection extends over a wide range, the organic EL element is thermally damaged. In addition, since it is necessary to avoid the pressure directly above the organic EL element when applying electrical connection, it is not possible to perform high-density bonding, and as a result it is difficult to deal with large screens and space-saving configurations. turn into.

In order to avoid such damage to the organic EL element, it is conceivable to establish electrical connection by using, for example, laser bonding instead of making electrical connection by using ACF. . According to laser bonding, a solder ball or the like is placed at a place where an electrical connection should be established, and an electrical connection is made by irradiating with laser light to melt the solder ball. Connection can be established, and the organic EL element is not adversely affected by pressure.

However, even if the laser bonding is used, for example, when the solder balls or the like do not melt unless the laser light is irradiated for a long time, a lot of heat is generated by the laser irradiation. As an organic EL
There is a high possibility that the device will be adversely affected by heat. further,
In such a case, a large amount of laser power is required, so that the equipment for laser irradiation and its ancillary equipment are increased in size and cost.

Therefore, the present invention makes it possible to construct a display device while eliminating an adverse effect on the organic EL element by establishing an electrical connection without generating much heat. It aims at providing the manufacturing method of.

[0009]

The present invention is a method of manufacturing a display device devised to achieve the above object. That is, it is a manufacturing method of a display device used when electrically connecting an organic electroluminescent element and a wiring substrate that form a display device, in which the electrode terminal portion electrically connected to the organic electroluminescent element and the wiring substrate are provided. Positioning step for aligning a provided through-hole-shaped conductive portion, and solder filling step for arranging a solder material in the through-hole of the conductive portion in the wiring board after or prior to the positioning step. A connecting step of electrically connecting the electrode terminal portion and the conductive portion by irradiating the solder material in the conductive portion with a laser beam to melt the solder material, and at least the solder material prior to the connecting step. And a processing step for performing processing for improving absorption of laser light.

According to the manufacturing method of the display device having the above procedure,
In the processing step prior to the connecting step, at least the solder material is subjected to processing for improving absorption of laser light, such as coloring processing and surface roughness processing. Therefore, compared with the case where the treatment is not performed, the solder material absorbs the laser light well, so that the irradiation time or the irradiation power of the laser light in the connection step can be short, and as a result, the heat generated by the irradiation of the laser light can be reduced. Can be suppressed.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing a display device according to the present invention will be described below with reference to the drawings.

First, prior to the description of the method for manufacturing a display device according to the present invention, the display device, more specifically, an organic EL display using an organic EL element as a display element will be described. 1 and 2 show organic EL
It is a perspective view which shows the external appearance structure of a display.

As shown in FIG. 1, the organic E described here is used.
The L display 1 is used for a television receiver, for example, and has a large display surface (for example, 75-inch size or more) 1a. In addition, as shown in FIG. 2, the organic EL display 1 is subdivided on the back side of the display surface 1a as the organic EL unit 2 corresponding to each drive circuit area divided into, for example, about A6 size. In addition to having a plurality of drive circuit boards, it has a structure in which adjacent drive circuit boards are connected by electrical wiring.

FIG. 3 is an exploded perspective view showing an enlarged structure of a part of the organic EL unit. The organic EL unit 2 includes a plurality of IC (integrated circuit) substrates 3 and one organic E unit.
L panel 4, and.

Each IC board 3 functions as a drive circuit board and is equipped with one or a plurality of driver ICs 31. These driver ICs 31 are electrically connected to the electrical connection portions on the back surface side (IC substrate 3 side) of the organic EL panel 4 via the flexible wiring board 5. Furthermore, each IC substrate 3 is connected via a flexible substrate 51 different from the flexible wiring board 5,
It is designed to be electrically connected to each other.

Thus, an organic EL having a large area
The reason why the panel 4 is divided into a plurality of partition surfaces 41 and the plurality of IC boards 3 are arranged corresponding to the partition surfaces 41 is as follows. That is, the organic EL panel 4 is attached to each partition surface 4
By driving every one, the length of the drive wiring from each IC substrate 3 to the partition surface 41 at the corresponding position becomes short, and even if the display surface 1a is enlarged, the voltage drop due to the wiring resistance is eliminated and stability is achieved. This is because the display drive of the organic EL panel 4 can be performed. Furthermore, if the IC boards 3 are arranged separately for each partition surface 41, even if the operation of the driver IC 31 of any one of the IC boards 3 becomes defective, the IC board 3 of the corresponding partition surface 41 can be used. This is because it is also possible to remove and replace only the one, and it is possible to obtain the merit that the cost at the time of maintenance can be reduced.

FIG. 4 is a schematic configuration diagram showing one structural example of the organic EL panel. In the example shown in the figure, only one partition surface 41, that is, only one drive circuit area which is handled by one IC substrate 3 and has an A6 size, for example, is shown. Organic EL panel 4
Has a display area 42 and an electrical connection area 43. The display area 42 is the entire surface of the organic EL panel 4, that is, an area formed by the dimensions D and D8 and the dimension D7 in the figure, and each color component of R (red), G (green), and B (blue). Pixels are evenly arranged. Further, the electrical connection region 43 is arranged in a region formed by dimensions D5 and D6 and dimensions D7 and D8 in the figure with connection points arranged between the R, G and B pixels. For example, a plurality of round-shaped connection points P are arranged. The connection point P is provided at least at one position for each of all cathode stripes and all anode stripes, which will be described later, and is arranged between the RGB pixels. By establishing an electrical connection with the IC substrate 3 via the connection point P, the organic EL panel 4 realizes a function as a display. In addition, organic E
An alignment mark 44 for positioning having a square shape, for example, is formed at the end of the L panel 4.

Here, the above-mentioned organic EL panel 4 will be described in more detail. 5 and 6 show an organic EL panel, particularly an organic EL panel provided in the organic EL panel.
It is a schematic block diagram which shows an L element part.

The organic EL panel 4, as shown in FIG.
On a panel substrate (hereinafter, simply referred to as “transparent substrate”) 101 made of transparent glass or the like, transparent electrodes 102 to be anodes are formed in stripes, and the transparent electrodes 10 are formed.
2 is an organic EL film 10 including a hole transport layer and a light emitting layer.
3 is formed so as to be orthogonal to the transparent electrode 102, and a cathode (cathode) 104 is further formed on the organic EL film 103, so that the organic EL element 6 is provided at the position where the transparent electrode 102 and the cathode 104 intersect. It is equipped with it. With this configuration, the organic EL is formed on the transparent substrate 101.
The display area 42, which is a light emitting area in which the elements 6 are arranged vertically and horizontally, is formed, and an electrical connection area 43 for connecting the light emitting area to the IC substrate 3 is formed.

In the organic EL panel 4, an insulating layer is usually provided between the transparent electrodes 102, which causes a short circuit between the transparent electrodes 102 and a short circuit between the transparent electrode 102 and the cathode 104. Is prevented.

By the way, in such an organic EL panel 4, in the display area 42, as shown in FIG. 6A, the transparent electrode 102 and the organic EL film 103 (cathode 104) are formed.
And intersect, and the organic EL element 6 is formed at the intersecting position. As the organic EL element 6, for example, as shown in FIG.
It is a single hetero type as shown in (b). That is, the organic EL element 6 has ITO on the transparent substrate 101.
An anode made of a transparent electrode 102 such as an (Indium tin oxide) film is provided, and an organic EL film 103 made of a hole transport layer 103a and a light emitting layer 103b and a cathode 104 are provided thereon. .

The organic EL element 6 thus formed
Then, a positive voltage is applied to the transparent electrode 102 which is an anode,
When a negative voltage is applied to the cathode 104, the holes injected from the transparent electrode 102 pass through the hole transport layer 103a and the light emitting layer 1
03b and the electrons injected from the cathode 104 reach the light emitting layer 103b.
Recombination of holes occurs. As a result, light having a predetermined wavelength is generated in the light emitting layer 103b, and the light is generated as shown in FIG.
Since the light is emitted from the transparent substrate 101 side as indicated by the arrow, the organic EL panel 4 can display each pixel (image display) in RGB, for example.

Next, the sectional structure and the like of the organic EL element 6 as described above will be described in more detail. FIG. 7 is a schematic configuration diagram showing a cross-sectional structure of the organic EL element portion.

In the illustrated example, it is conceivable to use, for example, a transparent glass substrate or a transparent plus rack substrate as the transparent substrate 101. Examples of the transparent glass substrate include soda glass, non-alkali glass, and quartz glass. Examples of the transparent plastic substrate include polycarbonate (PC), fluoropolyimide (PI),
Acrylic resin (PMMA), polyethylene terephthalate (PET), polyarylate (PAR), polyether sulfone (PES), polyether nitrile (PE
N), cyclo-olefin resin and the like.

Gas barrier films 111 are formed on the front and back surfaces of the transparent substrate 101. This gas barrier film 111
Is for preventing invasion of gas such as water and oxygen into the element to prevent deterioration of the organic EL element. In addition,
At least the gas barrier film 1 on the surface side (side facing the outside)
In order to suppress the reflection of light on the transparent substrate 101 and realize an excellent organic EL element having a high transmittance, it is desirable that 11 has an antireflection characteristic.

An auxiliary electrode 112 is formed on one gas barrier film 111. This auxiliary electrode 112 is
This is for reducing the resistance value, and is realized by forming chromium (Cr) in a comb shape.

The transparent electrode 102 is formed on the auxiliary electrode 112.
Are formed. The transparent electrode 102 functions as an anode to which a positive voltage is applied, and is made of, for example, an ITO film formed in a stripe shape.

A first insulating layer 11 is formed on the transparent electrode 102.
3 is formed. Further, the organic EL film 103 is formed on the first insulating layer 113. First insulating layer 1
13 is made of, for example, silicon nitride (SiN), and has not only an electrical insulating property, but also a gas barrier function against moisture and oxygen. By providing this gas barrier function, it is possible to prevent water and oxygen from entering the inside of the device, and
The L film 103 is prevented from being deteriorated. In addition, the organic EL film 103 has a multilayer structure in which a hole transport layer and a light emitting layer are laminated.

A cathode (cathode electrode) 104 is formed on the first insulating layer 113 and the organic EL film 103.
Are formed. The cathode 104 serves as the cathode of the organic EL film 103, and is formed larger than the organic EL film 103. The cathode 104 is made of, for example, lithium fluoride (LiF).

A second insulating layer 114 is formed on the first insulating layer 113 and the cathode 104. The second insulating layer 114 is formed over the entire element, and is made of, for example, silicon nitride (SiN) or aluminum nitride (AlN).
And so on. The second insulating layer 114 is also the first insulating layer 113.
Similarly to the above, it has a gas barrier function, which can prevent the deterioration of the organic EL film 103.

By the way, the opening 10 is formed in the first insulating layer 113 and the second insulating layer 114 at the position which becomes the connection point P.
5 is formed. Then, the electrode terminal portion 106 is provided in each of the openings 105 with a conductive metal film such as nickel (Ni), Au (gold) or Sb (antimony). The electrode terminal portion 106 is the transparent electrode 10 that constitutes the organic EL element 6.
2 and to energize the cathode 104.

These transparent substrate 101 and gas barrier film 11
1, auxiliary electrode 112, transparent electrode 102, first insulating layer 11
3, organic EL film 103, cathode 104, second insulating layer 11
The organic EL panel 4 is constituted by 4 and the electrode terminal portion 106. In the present embodiment, the electrode terminal portion 106 of the organic EL panel 4 is used.
Corresponds to the electrode terminal portion in the present invention.

On the organic EL panel 4 having such a structure, the flexible wiring board 5 is attached via the adhesive 201. The adhesive 201 may be, for example, a double-sided adhesive tape attached to the flexible wiring board 5. However, the adhesive 201 does not exist in the portion of the electrode terminal portion 106 of the organic EL panel 4.

The flexible wiring board 5 may be formed of, for example, polyimide (PI) or polyethylene terephthalate (PET). However, in the flexible wiring board 5, a through-hole-shaped through hole 20 is provided at a position corresponding to the electrode terminal portion 106 in the organic EL panel 4.
Two are provided. Furthermore, the through hole 202
The inner wall portion of and the vicinity thereof have a conductive portion 2 having conductivity.
It is covered with 03. The conductive portion 203 is connected to the electrical wiring pattern 204 of the flexible wiring board 5, and is made of, for example, copper (Cu), or nickel (Ni) or nickel / gold (Ni / Au) laminated on the copper. It is conceivable that it is formed by what was done.

As described above, the flexible wiring board 5 has the through holes 202 and the conducting portions 203. In the present embodiment, the flexible wiring board 5 corresponds to the wiring board of the present invention, and the conducting portion 203 of the flexible wiring board 5 corresponds to the through-hole-like conducting portion of the present invention. However, the wiring board in the present invention is not necessarily limited to the flexible wiring board 5. That is, as long as it has a conductive portion for electrically connecting to the electrode terminal portion 106 of the organic EL panel 4, it constitutes a part or the whole of a drive circuit for driving the organic EL panel 4. ,
More specifically, it may be the IC substrate 3 itself, the driver IC 31 itself mounted on the IC substrate 3, or the like.

Next, regarding the procedure for electrically connecting the flexible wiring board 5 to the organic EL panel 4 configured as described above, that is, the method for manufacturing the organic EL unit 2 (organic EL display 1), This will be described in detail with reference to FIGS.

FIG. 8 is a schematic configuration diagram (No. 1) showing a cross-sectional structure of the organic EL element portion when establishing the electrical connection. When electrically connecting the flexible wiring board 5 to the organic EL panel 4, first, the electrode terminal portion 106 of the organic EL panel 4 and the through hole 202 of the flexible wiring board 5 are aligned with each other. Are laid on top of each other and adhered and fixed with an adhesive 201. The alignment at this time may be performed, for example, based on the alignment mark 44 provided on the organic EL panel 4.

As a result, the electrode terminal portion 106, the through hole 202 and the conducting portion 203 in the peripheral portion thereof are
It will be located at a location corresponding to the connection point P on the organic EL panel 4. However, these connection points P
Are located so as not to overlap the organic EL film 103. This is the electrode terminal portion 106 and the conducting portion 203.
This is to prevent conduction of heat to the organic EL film 103 as much as possible when electrically connecting and.

Organic EL panel 4 and flexible wiring board 5
After closely fixing and, the solder balls 301 are put into the through holes 202 of the flexible wiring board 5.
FIG. 9 is an explanatory diagram showing an outline of throwing in a solder ball when establishing electrical connection. As shown in the drawing, when the solder balls 301 are loaded into the through holes 202, the suction device 302 is operated to vacuum-adsorb the solder balls 301 into the holes 304 of the solder ball loading holder 303. Then, after moving the holder 303 onto the flexible wiring board 5, the vacuum suction by the suction device 302 is released, so that the solder balls 301 are put into the respective through holes 202 of the flexible wiring board 5.

It is conceivable that, for example, lead-free solder is used as the solder balls 301 to be introduced at this time, and the flux F is transferred to the outer peripheral surface thereof. The flux F makes it difficult for the solder balls 301 to roll when they are put into the through holes 202 and even after the putting.

Further, it is assumed that the solder ball 301 has been subjected to a treatment for improving absorption of laser light prior to being put into the through hole 202. Specifically, the surface of the solder ball 301 is coated with, for example, a cobalt (Co) alloy, and the surface thereof is blackened. It is desirable that the blackening by the coating of the cobalt alloy is applied not only to the solder ball 301 but also to the inner wall portion of the through hole 202, that is, the conductive portion 203. It should be noted that the coloring treatment applied to the solder balls 301 and the like is not limited to the one using the cobalt alloy coating, and any other treatment can be used as long as the surface thereof is colored and impurities are not mixed into the solder balls 301. You may make it color-process by a method.

After the colored solder balls 301 are put into the through holes 202, as shown in FIG.
The solder ball 301 is irradiated with laser light 401. As the laser beam 401, for example, a semiconductor laser, an excimer laser, a YAG laser, or the like may be used, but any type of laser may be used as long as it can melt the solder ball 301. Of course.

The laser beam 401 is applied to the solder ball 301.
Masking material 402 if necessary
Should be used. The masking material 402 is the laser light 40.
1 has a hole 403 for hitting the solder ball 301.

FIG. 10 is a schematic configuration diagram (No. 2) showing the cross-sectional structure of the organic EL element portion when establishing the electrical connection. Laser light 401 for solder balls 301
Is irradiated, the solder balls 301 are melted as shown in the figure. Then, the melted solder material 305 electrically and mechanically connects the electrode terminal portion 106 of the organic EL panel 4 and the conducting portion 203 of the flexible wiring board 5.

However, at this time, the solder ball 301 and the conducting portion 203 are subjected to a coloring treatment (blackening) for improving the absorption of the laser light, as already described. Therefore, when the laser beam 401 is irradiated to these, the laser beam is well absorbed, so that the solder ball 301 melts in a shorter irradiation time or a smaller irradiation power as compared with the case where the coloring process is not performed, and the electric power is reduced. To establish a dynamic connection.

By the manufacturing method as described above, the solder material 305 after melting is provided between the electrode terminal portion 106 and the conducting portion 203.
It will be electrically connected via. At this time,
The laser light 401 is irradiated, for example, locally only to the places where the solder balls 301 are arranged. Therefore, the organic EL film 103 (organic EL element 6) is not adversely affected by heating and pressing unlike the case where electrical connection is made using the ACF.

Moreover, since the solder ball 301 absorbs the laser light 401 well by the coloring treatment, it melts in a shorter irradiation time or a smaller irradiation power. That is, the solder ball 301 will not be melted unless it is irradiated with the laser light 401 for a long time. In addition, compared to the case without coloring treatment,
The irradiation power of the laser light 401 can be reduced, and heat generation due to the irradiation of the laser light 401 can be suppressed. From these facts, it is possible to prevent the organic EL film 103 (organic EL element 6) from being thermally damaged as much as possible.

In addition, since the irradiation power of the laser light 401 can be reduced, equipment for laser irradiation and its incidental equipment, specifically, various oscillators of the laser light 401, a power supply, a cooling unit, etc. The equipment can be downsized, and along with this, cost reduction of various equipment can be expected.

A coloring treatment for improving the absorption of the laser beam 401 is applied to the solder balls 301 and the conductive portions 20 are added.
When it is also applied to No. 3, it is suitable for melting the solder ball 301 in a shorter irradiation time or a smaller irradiation power for the reason described below. Laser light 4
The spot diameter of 01 is usually slightly larger than the diameter of the solder ball 301. Therefore, when the solder ball 301 is irradiated, the laser light 401 may leak into the through hole 202 and irradiate not only the solder ball 301 but also the conductive portion 203. In this case, if the conductive portion 203 is also colored, the heating by the laser light 401 is efficiently performed, so that the solder ball 301 in contact with the conductive portion 203 is melted more efficiently. Will be able to.

By the way, in the above-described embodiment, the case where the electrical connection between the electrode terminal portion 106 and the conducting portion 203 is performed by using the solder ball 301 and inserting it into the through hole 202 is an example. However, other than this, the electrical connection may be performed as follows, for example. FIG. 11 is a schematic configuration diagram showing another example of the cross-sectional structure of the organic EL element portion when establishing the electrical connection. In the case of the example shown, organic EL
Prior to aligning the electrode terminal portion 106 of the panel 4 with the through hole 202 of the flexible wiring board 5, the solder material 306 is filled in the through hole 202 of the flexible wiring board 5 in advance. However, it is assumed that the surface of the solder material 306 is subjected to blackening treatment by coating with a cobalt alloy, for example.

Then, the solder material 3 is placed in the through hole 202.
The organic EL panel 4 and the flexible wiring board 5 are aligned with each other while being filled with 06, and then the filled solder material 306 is irradiated with a laser beam 401. At this time, since the solder material 306 has been blackened,
The solder material 306 melts in a shorter irradiation time or a smaller irradiation power as compared with the case where the blackening treatment is not performed, and the electrical connection is established. That is, even when the through hole 202 is filled with the solder material 306, just as in the case of the solder ball 301 described above,
By coloring the solder material 306, thermal damage to the organic EL film 103 (organic EL element 6) can be avoided as much as possible, and miniaturization of various equipment and cost reduction can be expected. .

In the above-described embodiment, the case where the solder ball 301 (or the solder material 306) is colored is described as an example, but the process for improving the absorption of the laser light 401 is performed. Other than this, the following may be considered. That is, the solder ball 301 (or the solder material 306) is subjected to surface roughness processing. More specifically, processing is performed so that the surface roughness becomes a predetermined value (for example, ten-point average roughness 5 μm) or more.

FIG. 12 is an explanatory diagram showing a specific example of the relationship between the roughness (Rz) of the laser irradiation surface and the absorptance of infrared light (λ = 9.3 μ). As shown in the figure, it can be seen that the higher the surface roughness of the laser irradiation surface, the higher the absorption rate of the laser light. This is because when the laser irradiation surface is rough, the irradiated laser light is diffusely reflected, which increases the laser absorption rate (for example, direct laser drilling using an ultra-thin copper foil with carrier). ,
Nakano, Yamamoto et al., MES2000 (10th Microelectronics Symposium), November 2000).

Therefore, if the solder ball 301 (or the solder material 306) is subjected to surface roughness processing, the absorption rate of the laser light 401 becomes high, and the solder ball 301 (with a shorter irradiation time or a smaller irradiation power). Alternatively, since the solder material 306) is melted, it is possible to avoid thermal damage to the organic EL film 103 (organic EL element 6) as much as possible in the same manner as in the case where the coloring treatment is performed, and to reduce the size of various equipment. And cost reduction can be expected.

In each of the above-mentioned embodiments, various technically preferable limitations are described as suitable specific examples of the present invention in any case, but the scope of the present invention is particularly limited to the present invention. Needless to say, the contents are not limited to those described in the present embodiment unless otherwise stated.

[0056]

As described above, according to the manufacturing method of the display device of the present invention, the electrical connection between the organic EL element and the wiring board can be established without generating much heat. Therefore, it is possible to configure a high-quality display device while eliminating adverse effects on the organic EL element. Moreover, it is possible to prevent the laser irradiation equipment and its associated equipment, which are necessary for establishing electrical connection, from increasing in size and cost.

[Brief description of drawings]

FIG. 1 is a diagram schematically illustrating an example of the external configuration of a display device, and is a perspective view of the display device when viewed from the display surface side.

FIG. 2 is a diagram schematically showing a configuration example of a display device,
It is a perspective view when the display device is seen from the opposite side of the display surface.

3 is an exploded perspective view showing an enlarged configuration of a part of an organic EL unit included in the display device of FIG.

FIG. 4 is a schematic configuration diagram showing one structural example of an organic EL panel, and is a diagram showing in detail an example of an electrical connection region and a display region.

FIG. 5 is a schematic configuration diagram showing a configuration example of an organic EL element portion included in an organic EL panel.

6A and 6B are schematic configuration diagrams showing a detailed configuration example of an organic EL element portion, in which FIG. 6A is a plan view thereof, and FIG.

FIG. 7 is a schematic configuration diagram showing a cross-sectional structure of an organic EL element portion in a state before electrical connection is established by the manufacturing method according to the present invention.

FIG. 8 is a schematic configuration diagram (No. 1) showing an example of a cross-sectional structure of an organic EL element portion when electrical connection is established by the manufacturing method according to the present invention.

FIG. 9 is an explanatory diagram showing an outline of throwing in a solder ball when establishing electrical connection by the manufacturing method according to the present invention.

FIG. 10 is a schematic configuration diagram (No. 2) showing an example of the cross-sectional structure of the organic EL element portion when establishing the electrical connection by the manufacturing method according to the present invention.

FIG. 11 is a schematic configuration diagram showing another example of the cross-sectional structure of the organic EL element portion when establishing the electrical connection by the manufacturing method according to the present invention.

FIG. 12 shows the roughness (Rz) of the laser irradiation surface and infrared light (λ =
FIG. 9 is an explanatory diagram showing a specific example of the relationship with the absorption rate of 9.3 μ).

[Explanation of symbols]

1 ... Organic EL display, 2 ... Organic EL unit, 3
... IC substrate, 4 ... Organic EL panel, 5 ... Flexible wiring board, 6 ... Organic EL element, 101 ... Transparent substrate, 102 ...
Transparent electrode, 103 ... Organic EL film, 103a ... Hole transport layer, 103b ... Light emitting layer, 104 ... Cathode, 105 ... Opening portion, 106 ... Electrode terminal portion, 201 ... Adhesive agent, 202 ... Through hole, 203 ... Conducting portion , 301 ... Solder balls, 3
06 ... Solder material, 401 ... Laser light

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G09F 9/40 301 G09F 9/40 301 H05B 33/06 H05B 33/06 33/10 33/10 33/14 33/14 A F-term (reference) 3K007 AB11 AB18 BA06 BB07 DA01 DB03 EA01 EB00 FA02 5C094 AA13 AA14 AA15 AA21 AA31 AA43 AA48 AA53 AA55 BA27 CA19 DA09 DA12 DB01 DB03 DB05 EA10 EB02 FA01 FA02 FB01 FB12 FB15 FB20 GB10 5G435 AA14 AA16 AA17 AA18 BB05 CC09 EE32 EE35 EE36 EE43 HH12 HH14 KK05

Claims (4)

[Claims] 1. A method of manufacturing a display device used when electrically connecting an organic electroluminescent element constituting a display device and a wiring board, comprising: an electrode terminal portion electrically connected to the organic electroluminescent element; A positioning step of positioning a through-hole-shaped conductive portion provided on the wiring board, and a solder material is arranged in the through-hole of the conductive portion of the wiring board after or prior to the positioning step. A solder filling step, a connection step of electrically connecting the electrode terminal section and the conductive section by irradiating the solder material in the conductive section with laser light to melt the solder material, and at least prior to the connecting step, A method of manufacturing a display device, comprising: a treatment step of subjecting the solder material to treatment for improving absorption of laser light. 2. The method of manufacturing a display device according to claim 1, wherein a treatment for improving absorption of laser light is performed on the conductive portion in addition to the solder material. 3. The method for manufacturing a display device according to claim 1, wherein the solder material is subjected to a coloring treatment as the treatment of the solder material in the treatment step. 4. The method for manufacturing a display device according to claim 1, wherein the solder material is subjected to surface roughness processing as the processing for the solder material in the processing step.