JP2003007457A - Method for manufacturing organic el panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an organic EL panel by which a translucent substrate on which the organic EL element is arranged can be airtightly jointed with a sealing component. SOLUTION: An adhesive agent arranging process is constituted with a storing part 19 for containing the organic EL element 1, a sealing cap (sealing component) 7 prepared so that a junction part 20 joined to a glass substrate 2 through an adhesive agent 8 for sealing may surround the storing part 19, and the adhesive agent 8 arranged so that the gap part may be formed in at least one place of the junction part 20 which surround the storing part 19. After arranging the adhesive agent 8 in the junction part 2, an adhesion process joints the glass substrate 2 and the sealing cap 7, while making gas, which intervenes between the glass substrate 2 and the sealing cap 7, discharge outside from the gap part by piling up the glass substrate 2 and the sealing cap 7 in a state that predetermined pressure is applied.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an organic EL panel provided with an organic EL element (organic electroluminescence element) at least one of which is sandwiched by a pair of translucent electrodes and emits light of a predetermined amount. is there.

[0002]

2. Description of the Related Art The structure of an organic EL panel will be described with reference to FIGS. In the organic EL panel 1, a transparent electrode (anode) 3 is formed of ITO (indium tin oxide) or the like on a glass substrate 2 which is a transparent substrate, and a hole injection layer, a hole transport layer, An organic layer 4 is formed by sequentially stacking a light emitting layer and an electron transport layer, and a back electrode (cathode) 5 of aluminum (Al) or the like is formed on the organic layer 4 to obtain an organic EL element 6, and an organic EL element 6 is obtained. A configuration in which a sealing cap 7, which is a recessed sealing member made of a glass material, is airtightly provided on the glass substrate 2 so as to cover the EL element 6 with an ultraviolet curable adhesive 8 interposed therebetween. Then, in the organic EL panel 1, the light emitting layer emits a predetermined light by applying a DC voltage between the transparent electrode 3 and the back electrode 5.
Further, in the organic EL panel 1, in order to clearly display the contour of the light emitting region or to ensure the insulation between the transparent electrode 3 and the back electrode 5, the insulating layer 9 made of polyimide or the like has the peripheral portion of the transparent electrode 3. It is formed on the glass substrate 2 so as to slightly overlap with.

In the organic EL panel 1, a group of electrode portions 10 extended from the transparent electrode 3 and the back electrode 5 are centrally arranged on one side of the glass substrate 2 having a rectangular shape, and the glass substrate 2 has The formation region 11 of the electrode unit group 10 is configured to be exposed from the sealing cap 7.

[0004]

In the organic EL panel 1 having such a structure, if the glass substrate 2 and the sealing cap 7 are not hermetically sealed with the adhesive 8, the display unit will be exposed to the outside air. Since the dark spots are generated in the organic EL element 6 which deteriorates the durability of the organic EL panel 1, the organic EL panel 1 for hermetically bonding the glass substrate 2 and the sealing cap 7 together. A manufacturing method is desired.

In view of the above-mentioned problems, the present invention is directed to a method of manufacturing an organic EL panel in which it is possible to hermetically bond a translucent substrate on which an organic EL element is arranged and a sealing member. Is provided.

[0006]

In order to solve the above-mentioned problems, the present invention according to claim 1 provides an organic EL device in which an organic layer including at least a light-emitting layer is sandwiched between a pair of electrodes. A step of forming an organic EL element on a translucent substrate, and an accommodating portion for accommodating the organic EL element, and a joining portion for joining the translucent substrate through a sealing adhesive is A sealing member provided so as to surround the storage portion is prepared, and the sealing adhesive is disposed so as to form at least one gap in the joint portion surrounding the storage portion, or the joint portion. An adhesive disposing step of disposing the sealing adhesive so as to form at least one gap in the contact portion of the translucent substrate that is in contact with the sealing adhesive; After arranging it on the contact part, apply a predetermined pressure. By stacking the translucent substrate and the sealing member in this state, the translucent substrate is discharged while the gas interposed between the translucent substrate and the sealing member is discharged to the outside. A method of manufacturing an organic EL panel, comprising: a bonding step of bonding an optical substrate and the sealing member.

Further, in the present invention according to claim 2, a plurality of organic EL elements each having an organic layer including at least a light emitting layer sandwiched by a pair of electrodes are formed in a row on a translucent support substrate. An organic EL element forming step, and a plurality of storage sections for storing the respective organic EL elements, and a sealing section provided so as to surround each storage section with a bonding section that is joined to the support substrate via a sealing adhesive. A stop substrate is prepared, and the sealing adhesive is disposed so as to form at least one gap for each of the joints corresponding to the peripheral edge of each of the accommodating portions, or is applied to each of the joints. An adhesive disposing step of disposing the sealing adhesive so that at least one gap is formed at each contact portion of the supporting substrate in contact with each other, and the sealing adhesive. After arranging at the joint part or the contact part, By overlapping the support substrate and the sealing substrate in a state where pressure is applied, the support is performed while discharging the gas interposed between the support substrate and the sealing substrate to the outside from each of the gaps. A method of manufacturing an organic EL panel, comprising: a bonding step of bonding a substrate and the sealing substrate.

Further, according to the present invention as defined in claim 3, the gaps formed in the joints or the abutments are formed in a uniform position with respect to the storage. The method for manufacturing an organic EL panel according to claim 2, wherein

According to a fourth aspect of the present invention, a wide area portion, which is the joint portion for connecting the storage portions, is provided.
Alternatively, in the contact portion corresponding to the wide area, the arrangement pattern of the sealing adhesive is formed into a substantially X shape, and the organic EL according to claim 2 or 3.
It is a manufacturing method of a panel.

The present invention according to claim 5 is characterized in that the sealing adhesive is disposed by dispensing or printing, and the organic material according to any one of claims 1 to 4. It is a manufacturing method of an EL panel.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the accompanying drawings. The same or corresponding portions as those of the conventional example will be designated by the same reference numerals and detailed description thereof will be omitted.

The structure of the organic EL panel will be described with reference to FIG. The organic EL panel 1 is composed of a glass substrate 2, a transparent electrode 3, an insulating layer 9, an organic layer 4, a back electrode 5 and a sealing cap 7.

The glass substrate 2 is a translucent flat plate member having a rectangular shape.

The transparent electrode 3 is made of a conductive material such as ITO on the glass substrate 2, and has a letter-shaped display segment portion 12, lead portions 13 formed by drawing out individual segments, and lead portions. And an electrode portion 14 provided at the end portion of 13. The electrode unit 14 group is
The glass substrate 2 is centrally arranged on one side.

The insulating layer 8 is made of an insulating material such as polyimide, and has a window portion 15 corresponding to the display segment portion 12,
Notch 16 corresponding to an electrode part of the back electrode 5 described later
In order to clearly display the contour of the light emitting region, the window portion 15 is formed so as to slightly overlap the peripheral portion of the display segment portion 12 of the transparent electrode 3, and the transparent electrode 3 and the back electrode 5 are It is arranged so as to cover the lead portion 13 in order to ensure insulation.

The organic layer 4 may have at least a light emitting layer, but in the embodiment of the present invention, a hole injection layer, a hole transport layer, a light emitting layer and an electron transport layer are sequentially laminated and formed. It will be. The organic layer 4 is arranged with a predetermined size so as to correspond to the location where the window 15 is formed in the insulating layer 8.

The back electrode 5 is made of a non-translucent conductive material such as aluminum and is disposed on the organic layer 4. The back electrode 5 is electrically connected to a lead portion 17 provided on one side of the glass substrate 2 on which each electrode portion 14 of the transparent electrode 3 is formed. An electrode portion 18 is provided at the terminal end of the lead portion 17, and the lead portion 17 and the electrode portion 18 are made of the same material as the transparent electrode 3.

The sealing cap 7 is an organic EL element 19 including a transparent electrode 3, an insulating layer 8, an organic layer 4 and a back electrode 5.
The glass substrate 2 has a recess-shaped storage portion 19 for storing the glass substrate 2 and is configured to be slightly smaller than the glass substrate 2 so that the electrode portion 14 of the transparent electrode 3 and the electrode portion 18 of the back electrode 5 are exposed. The joint portion 20 is formed so as to surround the entire circumference of the storage portion 19 so as to be joined with the adhesive 8 via the adhesive 8.
Is provided.

The organic EL panel 1 is constituted by the above parts.

Next, a method of manufacturing the organic EL panel 1 will be described with reference to FIGS.

First, the organic EL element 7 comprising the transparent electrode 3, the insulating layer 8, the organic layer 4 and the back electrode 5, the lead portions 13 and 17 and the electrode portions 14 and 18 corresponding to the transparent electrode 3 and the back electrode 5, respectively. "A step of forming an organic EL element, FIG. 2 (a)" in which a plurality of are formed in a row on the supporting substrate 21 to be the glass substrate 2 by means such as vapor deposition or sputtering.

Then, each concave portion 22 corresponding to each organic EL element 7 and serving as a storage portion 19 for storing each organic EL element 7.
Surrounding the periphery of each recess 22 and supporting substrate 2
The sealing substrate 24 which is to be the sealing cap 7 including the joining portion 23 for joining 1 is prepared (FIG. 2B). still,
The sealing substrate 24 is obtained by any of molding, etching, sandblasting, and cutting methods.

Next, an "adhesive disposing step (FIG. 2B)" in which the adhesive 8 is disposed on the joint portion 23 surrounding the peripheral edge of each recess 22 of the sealing substrate 24 by the method described later.

Here, the method of disposing the adhesive 8 will be described in detail with reference to FIG. FIG. 3 is a plan view showing the sealing substrate 24, and the recesses 22 are formed in rows in the vertical and horizontal directions.
The support substrate 2 to be the glass substrate 2 is provided on the periphery of each recess 22.
1 and each bonding portion 23 for bonding via the adhesive 8 are formed, and the bonding portion 23 between each recess 22 serves as a cutting position for forming each organic EL panel 1 by a cutting process described later. A wide area 26 is formed.

The adhesive 8 is arranged in a pattern 27 shown in FIG.
The joint portion 23 and the wide area portion 26 of the sealing substrate 24 are arranged along the above. The adhesive 8 is arranged over substantially the entire circumference of each joint 23 surrounding each recess 22, but the adhesive 8 is arranged at a predetermined position of each joint 23 for each recess 22. A gap portion 25 having no gap, for example, a gap of about 2 mm is formed. Further, the gaps 25 formed in the arrangement pattern 27 are formed in the recesses 22 having a rectangular shape.
Are formed on one predetermined side in a state in which the formation locations are unified (state in which the position and direction are unified).

Further, the arrangement pattern 27 of the adhesive 8 is formed in a substantially X shape in the wide area 26 between the recesses 22 formed in a flat shape. That is, the support substrate 21 and the sealing substrate 24
Although a predetermined pressure is applied in the bonding step with, the adhesive 8 spreads outward from the intersecting region of the adhesive 8 in the wide area 26, so that good joining of both members can be achieved. Since it is obtained, it is possible to prevent the outside air from entering the storage section 19.

In the disposition of the adhesive agent 8, a dispensing method or a printing method is used. In the case of a production line compatible with other models, the dispense method is desirable, and in the production line compatible with mass production, the printing method is desirable. When the adhesive 8 is arranged by using the dispensing method, the wide area 26 of the arrangement pattern 27 is formed into a substantially X shape so that the joints 23 surrounding the recesses 22 can be written in a single stroke. Since it is possible to dispose, the productivity is excellent.

Next, in a nitrogen atmosphere, while keeping the sealing substrate 24 on which the adhesive 8 is disposed and the supporting substrate 21 in parallel with each other, each concave portion 22 corresponds to each organic EL element 19. "(Figure 2 (c)")
For example, by applying a predetermined pressure from the sealing substrate 24 side, the disposed adhesive 8 spreads to the bonding regions of the bonding portion 23 and the wide area 26, and is irradiated with ultraviolet rays,
The sealing substrate 24 and the supporting substrate 21 are bonded and fixed to each other, and the organic E
“Adhesion process, FIG. 2 (d)” in which a multi-substrate 28 having a plurality of L panels 1 is obtained.

In the bonding step described above, the supporting substrate 21
The sealing substrate 24 and the sealing substrate 24 are bonded to each other in a state where a predetermined pressure is applied, but are interposed between the supporting substrate 21 and the sealing substrate 24 through the gaps 25 formed in the step of disposing the adhesive 8. Since it becomes possible to bond the support substrate 21 and the sealing substrate 24 while discharging the gas (nitrogen), that is, the gas in the storage unit 19, to the outside, the two substrates 21, 24 at the periphery of the storage unit 19 can be connected. In the joining region, it is possible to prevent the adhesion failure caused by the influence of the internal pressure in the storage section 19.
In addition, in the sealing substrate 24 as shown in FIG. 3, the gas of the storage unit 19 group located in the second stage is discharged to the outside from each gap 25 through the groove 29 provided in a straight line in the lateral direction. Will be done.

Further, since the support substrate 21 and the sealing substrate 24 are adhered to each other in the gaps 25 for discharging the internal pressure of the accommodating portion 19 to the outside in a state where a predetermined pressure is applied in the adhering process, the gaps 25 are formed. Since the adhesive 8 around the area where the organic EL element 6 is formed is crushed and the gaps 25 are closed, the airtightness in the storage portion 19 in which the organic EL element 6 is stored is not impaired.

Next, the multi-substrate 2 obtained after the bonding step
In FIG. 8, the individual organic EL element 1 is cut by cutting the formation position of the groove portion 29 formed in the substantially central portion of the wide area portion 26 and the portion connecting the sealing substrate 24 in the vertical direction by means of a scribing method or dicing. "Cutting process, Fig. 2
(E) ”.

The method of manufacturing the organic EL element 1 is provided with a plurality of recesses 22 corresponding to the organic EL elements 6 and serving as the storage portions 19 for storing the organic EL elements 6, surrounding the recesses 22 and supporting them. A sealing substrate 24 having a joint portion 23 for joining to the substrate 21 via an adhesive 8 is prepared, and at least one gap portion is formed for each joint portion 23 corresponding to the peripheral edge of each recess 22. An adhesive disposing step for disposing the adhesive 8 is provided, and after disposing the adhesive 8 at the bonding portion 23, the support substrate 21 is applied with a predetermined pressure applied.
And the sealing substrate 24 are overlapped with each other to form the support substrate 21.
A multi-substrate 28 having a plurality of organic EL panels 1 is obtained by bonding the supporting substrate 21 and the sealing substrate 24 while discharging the gas interposed between the sealing substrate 24 and the sealing substrate 24 to the outside from each gap 25. From the supporting substrate 21 and the sealing substrate 24
Since it is possible to prevent defective adhesion around the area where each recess 22 is formed due to a change in the internal pressure in the recess 22 (accommodation portion 19) that occurs when the and are overlapped with each other while applying a predetermined pressure. The sealing cap 7 and the sealing cap 7 can be hermetically joined. This is because the gas in each recess 22 is positively released from each gap 25,
Since the gas generated when the support substrate 21 and the sealing substrate 24 are superposed on each other can be prevented from being discharged from the joint portions 23 on the periphery of the recesses 22 in which the adhesive 8 is disposed,
It is possible to eliminate the occurrence of seal breakage (adhesion failure) of the adhesive 8 at each joint 23.

Further, since each gap portion 25 is formed in the sealing substrate 24 in a state where the formation positions are unified with respect to each recessed portion 22, the arrangement device provided with the dispenser of the adhesive 8 is provided. In the case of using the arrangement pattern, an operation program for moving the dispenser along the arrangement pattern 27 is created for a predetermined area of the arrangement pattern 27, and this operation program is repeated in all the arrangement pattern 27 areas. Since it can be used, it becomes possible to easily design the operation program of the arrangement device.

In the wide area 26 which is the joint 23 between the recesses 22, the arrangement pattern 27 of the adhesive 8 is approximately X.
When the adhesive 8 is arranged by a dispenser by forming it into a character shape, it becomes possible to dispose the adhesive 8 on each joint 23 surrounding each recess 22 in a one-stroke writing manner, so that productivity is improved. It becomes possible to improve. Further, the wide area 26 has a substantially X-shaped arrangement pattern 27, and the support substrate 21 and the sealing substrate 24 are overlapped with each other while a predetermined pressure is applied, so that the adhesive 8 is spread over the entire wide area 26. The adhesiveness of both members is made good. Therefore, since it is possible to prevent the outside air from entering the storage portion 19,
Since it is possible to suppress the generation of dark spots in the organic EL element 6, it is possible to obtain the organic EL panel 1 having excellent durability.

Further, since the adhesive 8 is provided on the wide area 26 and the joint 23 by dispensing or printing, it is possible to obtain an adhesive providing process which is excellent in mass productivity.

In the embodiment of the present invention, the adhesive 8 is arranged on the joint portion 23 of the sealing substrate 24. However, in the present invention, the joint portions 23 surrounding the respective concave portions 22 are arranged. You may make it form a gap | interval part in at least 1 place of the contact part of the support substrate 21 which contacts.

Further, in the embodiment of the present invention, the method of manufacturing an organic EL panel in which the individual organic EL panels 1 are obtained from the multi-substrate 1 has been described. However, in the present invention, the organic EL panels are individually manufactured. It is also effective for the manufacturing method to obtain. In the manufacturing method in this case, the organic EL element forming step of forming the organic EL element 6 on the glass substrate (translucent substrate) 2 and the joining portion 20 for joining the glass substrate 2 with the adhesive 8 are provided. The sealing cap 7 provided is prepared, and at least one gap portion 2 is provided in the joint portion 20 surrounding the organic EL element 6.
5 is formed so that the adhesive 8 is formed so that the adhesive 8 is formed so as to form at least one gap in the contact portion of the glass substrate 2 that contacts the bonding portion 20. The glass substrate 2 and the sealing cap 7 are overlapped with each other by placing the adhesive 8 on the joining portion 20 or the abutting portion and then stacking the glass substrate 2 and the sealing cap 7 under a predetermined pressure. The gas interposed between the stopper cap 7 and the gap 25 formed in the joint portion 20 of the sealing cap 7 or the gap portion formed in contact with the joint portion 20 of the glass substrate 2 is formed. The organic EL panel is obtained by a bonding step of bonding the glass substrate 2 and the sealing cap 7 while discharging the glass substrate 2 to the outside, and in the bonding of the glass substrate 2 and the sealing cap 7 as in the above-described embodiment. Poor adhesion No reason, it is possible to join the two members airtightness good.

[0038]

INDUSTRIAL APPLICABILITY The present invention provides an organic EL device having an organic EL element (organic electroluminescence element) at least one of which is sandwiched by a pair of translucent electrodes and emits light of a predetermined amount.
Regarding a method for manufacturing an L panel, there is provided a method for manufacturing an organic EL panel capable of air-tightly bonding a translucent substrate on which the organic EL element is arranged and the sealing member surrounding the organic EL element. can get.

[Brief description of drawings]

FIG. 1 is a perspective view showing an organic EL panel according to an embodiment of the present invention.

FIG. 2 is a diagram showing a method for manufacturing the organic EL panel according to the embodiment.

FIG. 3 is a diagram illustrating a method of disposing an adhesive in the organic EL panel according to the above embodiment.

FIG. 4 is a partial cross-sectional view of an essential part showing a conventional organic EL panel.

FIG. 5 is a plan view showing a conventional organic EL panel.

[Explanation of symbols]

1 Organic EL panel 2 Glass substrate (translucent substrate) 3 transparent electrodes 4 organic layers 5 Back electrode 6 Organic EL element 7 Sealing cap (sealing member) 8 adhesive 19 Storage 20,23 joint 21 Support substrate 24 Sealing substrate 25 Gap 26 Wide area 27 arrangement pattern 28 multi boards

Claims (5)

[Claims] 1. An organic EL element forming step of forming, on a translucent substrate, an organic EL element in which an organic layer including at least a light emitting layer is sandwiched by a pair of electrodes; and a step of housing the organic EL element. A sealing member is provided that is provided with a storage portion, and a joining portion that is joined to the translucent substrate via a sealing adhesive is provided so as to surround the storage portion, and to the joining portion that surrounds the storage portion. The sealing adhesive is arranged so as to form at least one gap, or the sealing is formed so as to form at least one gap at the contact portion of the translucent substrate that contacts the joint. An adhesive disposing step of disposing an adhesive for use, and disposing the encapsulating adhesive at the joint portion or the contact portion, and then applying the predetermined pressure to the translucent substrate and the transparent substrate. By overlapping the sealing member, And a bonding step of joining the translucent substrate and the sealing member while discharging the gas interposed between the substrate and the sealing member to the outside from the gap portion. Panel manufacturing method. 2. An organic EL element forming step of forming a plurality of organic EL elements, which are formed by sandwiching an organic layer including at least a light emitting layer by a pair of electrodes, in a row on a translucent supporting substrate; A sealing substrate is provided, which is provided with a plurality of storage portions for storing EL elements, and in which a sealing substrate is provided so as to surround each storage portion with a bonding portion that is joined to the support substrate via a sealing adhesive. The sealing adhesive is provided so as to form at least one gap for each of the joints corresponding to the peripheral edge of, or in each of the abutting portions of the support substrate that abut the respective joints. An adhesive disposing step of disposing the sealing adhesive so as to form at least one gap for each contact portion, and the sealing adhesive at the joint portion or the contact portion. After installation, the above-mentioned support is applied with a predetermined pressure applied. By stacking the substrate and the sealing substrate, the supporting substrate and the sealing substrate are joined while discharging the gas interposed between the supporting substrate and the sealing substrate to the outside from the gaps. And a step of adhering the same, the method of manufacturing an organic EL panel. 3. The gap portion formed in each of the joint portions or each of the contact portions is formed in a state in which the formation positions with respect to the storage portion are unified. A method for manufacturing the organic EL panel described. 4. The arrangement pattern of the sealing adhesive is approximately X in a wide area, which is the joint for connecting the storage sections, or in the abutting section corresponding to the wide area. The method for manufacturing an organic EL panel according to claim 2, wherein the organic EL panel has a letter shape. 5. The sealing adhesive is disposed by dispensing or printing.
5. The method for manufacturing an organic EL panel according to claim 4.