JP2002533914A - 集積回路と伝送コイルを備えるデータキャリアモジュール - Google Patents

集積回路と伝送コイルを備えるデータキャリアモジュール

Info

Publication number
JP2002533914A
JP2002533914A JP2000590100A JP2000590100A JP2002533914A JP 2002533914 A JP2002533914 A JP 2002533914A JP 2000590100 A JP2000590100 A JP 2000590100A JP 2000590100 A JP2000590100 A JP 2000590100A JP 2002533914 A JP2002533914 A JP 2002533914A
Authority
JP
Japan
Prior art keywords
coil
holding means
data carrier
transmission coil
connection contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000590100A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002533914A5 (https=
Inventor
ギュンター、アフレンツァー
ペーター、シュマレッガー
ヨアヒム、ショーバー
マーカス、トス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics NV filed Critical Philips Electronics NV
Publication of JP2002533914A publication Critical patent/JP2002533914A/ja
Publication of JP2002533914A5 publication Critical patent/JP2002533914A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Near-Field Transmission Systems (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2000590100A 1998-12-18 1999-12-03 集積回路と伝送コイルを備えるデータキャリアモジュール Withdrawn JP2002533914A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP98890373.8 1998-12-18
EP98890373 1998-12-18
PCT/EP1999/009448 WO2000038109A1 (en) 1998-12-18 1999-12-03 Data carrier module with integrated circuit and transmission coil

Publications (2)

Publication Number Publication Date
JP2002533914A true JP2002533914A (ja) 2002-10-08
JP2002533914A5 JP2002533914A5 (https=) 2007-02-01

Family

ID=8237221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000590100A Withdrawn JP2002533914A (ja) 1998-12-18 1999-12-03 集積回路と伝送コイルを備えるデータキャリアモジュール

Country Status (4)

Country Link
US (1) US6285561B1 (https=)
EP (1) EP1055192A1 (https=)
JP (1) JP2002533914A (https=)
WO (1) WO2000038109A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1052595B1 (de) * 1999-05-14 2001-09-19 Sokymat Sa Transponder und Spritzgussteil sowie Verfahren zu ihrer Herstellung
CN1321282A (zh) * 1999-08-31 2001-11-07 皇家菲利浦电子有限公司 具有集成电路和传输线圈的数据载体
AT410728B (de) * 2001-02-09 2003-07-25 Pollmann Austria Ohg Verfahren zum einbetten zumindest einer flexiblen leiterbahnfolie in kunststoff, leiterbahneneinheitsowie einbettungseinheit hiefür
JP2003101204A (ja) * 2001-09-25 2003-04-04 Nec Kansai Ltd 配線基板及び配線基板の製造方法並びに電子部品
US20050276341A1 (en) * 2004-06-14 2005-12-15 Infineon Technologies Ag Method and apparatus for transmitting and/or receiving data

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU570439B2 (en) * 1983-03-28 1988-03-17 Compression Labs, Inc. A combined intraframe and interframe transform coding system
US5386342A (en) * 1992-01-30 1995-01-31 Lsi Logic Corporation Rigid backplane formed from a moisture resistant insulative material used to protect a semiconductor device
US5801440A (en) * 1995-10-10 1998-09-01 Acc Microelectronics Corporation Chip package board having utility rings
KR100201380B1 (ko) * 1995-11-15 1999-06-15 김규현 Bga 반도체 패키지의 열방출 구조
US5818102A (en) * 1995-12-29 1998-10-06 Lsi Logic Corporation System having integrated circuit package with lead frame having internal power and ground busses
FR2743649B1 (fr) * 1996-01-17 1998-04-03 Gemplus Card Int Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication
DE19609134A1 (de) * 1996-03-08 1997-09-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Datenträgers mit einem elektronischen Modul
DE19632115C1 (de) * 1996-08-08 1997-12-11 Siemens Ag Kombinations-Chipmodul und Verfahren zur Herstellung eines Kombinations-Chipmoduls
WO1998035452A1 (en) 1997-02-10 1998-08-13 Koninklijke Philips Electronics N.V. Electronic watch comprising a watch/transponder chip
DE19710144C2 (de) * 1997-03-13 1999-10-14 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte
US5841191A (en) * 1997-04-21 1998-11-24 Lsi Logic Corporation Ball grid array package employing raised metal contact rings

Also Published As

Publication number Publication date
EP1055192A1 (en) 2000-11-29
WO2000038109A1 (en) 2000-06-29
US6285561B1 (en) 2001-09-04

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