JP2002367894A - Positioning apparatus, apparatus and method for exposure, method for manufacturing device as well as device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress a deterioration of a positioning accuracy by suppressing a measurement of an optical position measuring means by mistake due to an air fluctuation in a positioning apparatus. SOLUTION: The positioning apparatus comprises stages RST, WST movable by holding samples R, W, and position measuring means 3, 7 for optically measuring positions of the stages RST, WST. The apparatus further comprises an extension member extended along a measuring optical path of a position measuring means (7), and temperature regulating means 12, 13, 15a and 15b constituted integrally with the member to directly temperature regulate the member itself.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positioning apparatus, an exposure apparatus, an exposure method, and a device manufacturing method, and more particularly, to a lithography process for manufacturing a device such as a semiconductor device, a liquid crystal display device, and a thin film magnetic head. The present invention relates to a mask or substrate positioning apparatus, an exposure apparatus, an exposure method and a device manufacturing method.

[0002]

2. Description of the Related Art Exposure apparatuses of the batch exposure type or the scanning exposure type used when manufacturing semiconductor elements or the like are required to have high exposure accuracy with the recent high integration of semiconductor elements.

In such an exposure apparatus, a wafer stage on which a wafer is placed and two-dimensionally moved and a reticle stage on which a reticle having a pattern is placed and two-dimensionally moved (hereinafter, the wafer stage and the reticle stage are collectively referred to as a stage). This stage requires higher positioning accuracy.

In order to realize highly accurate positioning, a laser interferometer has conventionally been used as a stage position measuring means. However, when so-called “air fluctuation” occurs in which the temperature of the air existing in the measurement optical path of the reference light and the measurement light of the laser interferometer changes over time, that is, when the so-called “air fluctuation” occurs, the measurement optical path of the laser interferometer is substantially reduced. The optical path length changes, and the laser interferometer incorrectly measures the position of the stage. As a result, it is known that the positioning accuracy of the stage deteriorates.

Therefore, the exposure apparatus is installed in a constant temperature chamber having an air-conditioning system capable of controlling the temperature, and the measurement optical path of the laser interferometer is covered with a cover of variable length such as a slide-type windshield tube or bellows, so that the laser interferometer can be used. The method of suppressing the temperature change of the measurement optical path, or the method of blowing temperature-controlled air to the measurement optical path of the laser interferometer to make the air temperature on the measurement optical path uniform is adopted.

[0006]

However, in the case of a method of covering the measurement optical path of the laser interferometer with a cover having a variable length, the stage must be supported by the stage since the stage is movable. Disturbance such as vibration is transmitted to the stage through the variable cover, and there is a disadvantage that the positioning accuracy of the stage is deteriorated.

Further, when exposing a semiconductor device or the like, a work of exchanging a sample such as a wafer or a reticle placed on the stage and having been exposed is required, so that a space for exchanging the sample is required above the stage. , For the maintenance of the laser interferometer and the convenience of sample exchange,
In some cases, the direction in which the laser interferometer is arranged and the direction in which the sample is exchanged must be the same.

[0008] In this case, if the temperature-regulated air outlet is arranged in the immediate vicinity of the measurement optical path in order to blow temperature-controlled air to the measurement optical path of the laser interferometer, it will be an obstacle to sample exchange. In addition, if the temperature control air outlet is arranged away from the measurement optical path, a slight temperature gradient will occur in the temperature-controlled air between the measurement optical path and the space near the temperature control air outlet, and there is a disadvantage that air fluctuations cannot be effectively removed. Was.

In view of the above, the present invention has as its first object to provide a positioning apparatus, an exposure apparatus, an exposure method, and a device manufacturing method which can maintain the temperature of a measurement optical path of a laser interferometer at a constant temperature and perform high-precision positioning. Aim. In addition, the present invention can maintain a constant temperature of a measurement optical path of a laser interferometer without obstructing the exchange of a sample such as a wafer and a reticle, and can perform a highly accurate positioning. It is a second object to provide a method and a device manufacturing method.

[0010]

In order to solve the above-mentioned problems, an embodiment will be described below with reference to the accompanying drawings. The positioning device according to claim 1, wherein a stage (RST, WST) that can move while holding the sample (R, W) and a position measurement unit (3, optically measuring the position of the stage (RST, WST)). 7), the extending member (11) extending along the measurement optical path of the position measuring means (7), and the extending member (11) integrally formed with the extending member (11). Temperature control means (12, 1
3, 14, 15a, 15b). According to this, the temperature control means (12, 13, 14, 15a, 1
5b), the temperature of the extending member (11) itself is directly controlled and the temperature of the extending member (11) is kept constant. As a result, the temperature of the measurement optical path can be kept constant.

According to a second aspect of the present invention, the extending member (11) has at least two band-shaped members (11a to 11d) facing each other. According to a third aspect of the present invention, in the positioning device, the extending member (11) is provided with a belt-shaped member (11).
a to 11d) are arranged so as to include at least a part of the measurement optical path of the optical position measurement means (7) between two planes respectively including the first surface and the second surface facing each other. I have. Thereby, the temperature of the measurement optical path can be kept constant.

According to a fourth aspect of the present invention, in the positioning device, the extending member has a U-shaped cross section.
1f) It is arranged so that at least a part of the measurement optical path of the optical position measuring means (7) is included in the space surrounded by the U-shape, and the temperature of the measurement optical path can be kept constant.

According to a fifth aspect of the present invention, there is provided a positioning device according to the first aspect.
5. Temperature control means (12,
13, 14, 15 a, and 15 b) are provided with a flow path means (14) having a flow path formed in the extending member (11) and a supply means (12, 13) for supplying a fluid whose temperature is controlled in the flow path. , 15
a, 15b).

According to a sixth aspect of the present invention, the temperature control means (12, 13, 14, 15a, 15b) measures at least one of the temperature of the extending member (11) and the temperature of the measurement optical path. It has a temperature measuring means (16) and a control means (11) for controlling the temperature of the fluid based on the temperature measured by the temperature measuring means (16). Thus, the temperature of the extension member (11) can be controlled to a desired temperature.

A positioning device according to claim 7, wherein the driving means (6) for driving the stage (RST) and at least one second stage which moves in accordance with the movement of the stage and supports the driving means (6a). (17). Since the second stage (17) supports a part (6a) of the driving means, it is not affected by the reaction force generated by driving the stage (RST).

The positioning device according to the eighth aspect is the seventh aspect.
In the positioning device described above, the extending member (11f) has a U-shaped cross section, and the measurement optical path, the stage driving means (6), and the second stage ( 17) is arranged such that at least one of the extending members (11) is included.

According to a ninth aspect of the present invention, there is provided a positioning device, comprising: a stage (RST) capable of holding and moving a sample;
In a positioning device provided with a position measuring means (7) for optically measuring the position of ST), a defining means (11) for defining a space of the positioning apparatus, and a measuring optical path of the position measuring means (7). A driving means (20, 22, 24) for positioning the defining means (11) at a first position defined by (11) and a second position different from the first position. By the driving means (20, 22, 24), the defining means (11) can be retracted when exchanging the sample (R, W).

According to a tenth aspect of the present invention, there is provided a positioning device according to the ninth aspect, wherein the defining means (11) in the positioning device according to the ninth aspect is installed in the defining means (11) and temperature regulating means (T) for regulating the temperature of the defining means (11). 12, 13, 14, 15a, 15
b). The positioning device according to claim 11,
Temperature control means (12, 13, 14, 15a, 15b) for measuring at least one of the temperature of the defining means (11) and the temperature of the measurement optical path; and a temperature measurement means (16). And (13) for controlling the temperature of the fluid based on the temperature measured in (1). According to this, the temperature of the defining means (11) can be maintained at a desired temperature.

According to a twelfth aspect of the present invention, in the exposure apparatus, a mask stage (RST) that can move while holding the mask (R) is provided.
And a substrate stage (WST) on which a photosensitive substrate (W) to which a mask pattern is to be transferred is placed and movable while holding the photosensitive substrate (W), the mask stage (RST) and the substrate stage ( WST) has at least one of the positioning devices described above. As a result, highly accurate positioning of the stage can be achieved.

A semiconductor device according to a thirteenth aspect is manufactured using the exposure apparatus according to the twelfth aspect.
The exposure method according to claim 14, wherein the defining means (11) for defining the space in the positioning device is positioned at a first position for defining the measurement optical path of the position measuring means (7);
Exposure including a step of exposing the substrate (W) when the defining means (11) is at the first position, and a step of positioning the defining means (11) to a second position different from the first position. Is the way. According to this method, the stage (RS) can be exchanged without hindering the exchange of the sample (R, W).
T, WST) can be positioned with high accuracy.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings showing examples. FIG. 1 shows an example of the overall configuration of an exposure apparatus according to an embodiment of the present invention.
In this embodiment, the positioning device according to the present invention is applied to a reticle stage of a scanning exposure apparatus. here,
The scanning type exposure apparatus refers to an exposure apparatus that transfers a pattern image of the reticle R onto the wafer W by synchronizing and scanning the reticle R having a pattern and the wafer W. Although not shown in the present embodiment, the scanning exposure apparatus of the present embodiment is installed in a constant temperature chamber having an air conditioning system capable of controlling the temperature from the viewpoint of temperature stability. Hereinafter, each configuration will be described.

In the following description, the scanning direction of the wafer reticle is assumed to be the Y direction, the direction orthogonal to the Y direction and perpendicular to the plane of FIG. 1 is assumed to be the X direction, and XY is orthogonal to the X direction and the Y direction.
The description will be made with the direction perpendicular to the plane as the Z direction. The illumination optical system 1 homogenizes and shapes exposure light emitted from a light source (not shown, for example, a bright line in an ultraviolet region such as g-line or i-line, or an excimer laser such as KrF or ArF) to form illumination light. The reticle R is irradiated around the axis AX.

The projection optical system PL includes a reticle stage RS
Exposure light irradiated on the reticle R held at T (described later in detail) is reduced and projected onto the wafer W, and the pattern of the reticle R is transferred onto the wafer W. Usually, the projection magnification of projection optical system PL is 1/4 or 1/5, so that reticle stage R
ST and wafer stage WST scan synchronously with each other at a speed ratio of 4: 1 or 5: 1.

Wafer stage WST is located below projection optical system PL, and holds wafer W and moves in a two-dimensional plane. The movement of wafer stage WST is performed by a sliding device (not shown), for example, an air bearing and wafer stage driving unit 2. The position of wafer stage WST is accurately measured by wafer interferometer 3, and scanning can be performed in synchronization with reticle stage RST by stage control system 4 performing position control according to the measured value. Details of the stage control system 4 will be described later.

The reticle stage RST includes the illumination optical system 1
The reticle stage driving unit 6 is disposed between the reticle stage driving unit 6 and the projection optical system PL, and is movable on a reference plane formed on the body 5. The reticle stage driving unit 6 includes a stator 6a
And a linear motor including a stator 6b. The reticle stage RST can scan at a predetermined speed in the scanning direction (Y direction), and can finely move in the non-scanning direction (X direction).

Although not shown in FIG. 1, reticle stage RST may be configured to have a coarse movement stage and a fine movement stage. Here, the coarse movement stage moves with a fine stroke together with the fine movement stage, and the fine movement stage holds the reticle R and moves with a smaller stroke than the coarse movement stage.
The reticle stage RST composed of the coarse movement stage and the fine movement stage has a configuration in which a fine movement stage and a fine movement stage drive unit are mounted on the coarse movement stage, or the coarse movement stage and the fine movement stage are mounted on the aforementioned reference plane. Alternatively, a configuration in which the coarse movement stage moves together with the fine movement stage drive unit may be employed.

The reticle interferometer 7 has a reticle stage R
In order to detect the position of the ST in the Y direction, the measurement light 8 is emitted toward a reflecting mirror 9 provided at the end of the reticle stage RST in the Y direction, and a reference light (not shown) is provided on a reference reflecting surface (not shown). For example, the measuring light 8 emitted to the reference reflecting surface formed in the projection optical system PL and reflected by the reflecting mirror 9 and the reference light reflected by the reference reflecting surface are detected. By providing two axes of reticle interferometer 7 in the Y direction, the attitude of reticle stage RST in the rotation direction can also be measured. The interferometer unit 10 processes the detection results of the measurement light 8 and the reference light detected by the reticle interferometer 7, calculates the current position of the reticle stage RST in the Y direction, and outputs it to the stage control system 4. The stage control system 4 calculates a difference between the current position of the reticle stage RST calculated by the interferometer unit 10 and a predetermined target position, and issues a command to the reticle stage driving unit 6 to drive the difference to zero, thereby causing the reticle stage to move. Control the position of RST. At this time, the reticle stage R
The target position of ST is calculated with reference to the measurement result of wafer interferometer 3 that measures the position of wafer stage WST.

The reflecting mirror 9 is a reticle stage RST.
Alternatively, the reflecting mirror 9 formed as a separate component may be fixed on the reticle stage RST and used. In addition, a plane mirror can be used as the reflecting mirror 9, or a corner mirror having a function of reflecting at an angle always equal to the incident angle of the measuring light 8 can be adopted.

The position of reticle stage RST in the X direction is
The measurement is performed by a reticle interferometer (not shown) and an interferometer unit 10 which are different from the reflecting mirror (not shown) and the reticle interferometer 7 provided at the end in the X direction. The constant temperature member 11 is arranged along a measurement optical path through which the measurement light 8 of the reticle interferometer 7 passes. The constant temperature member 11 may be supported by the illumination optical system 1 or may be supported by the body 5. FIG. 2 shows an example of the structure of the thermostat 11, in which a flow path 14 is formed inside the thermostat 11. The constant temperature member 11 is the flow path 1
4 is not limited to that formed inside, and a tube made of a material having good thermal conductivity is fixed to the surface of the
The flow path 14 integrated with the channel 1 may be formed.

Returning to FIG. 1, the description will be continued. The pump 12 supplies the temperature control medium controlled to a predetermined temperature by the temperature control device 13 to the flow path 14, and circulates the temperature control medium through the circulation hoses 15a and 15b. As a result, the temperature of the constant-temperature member 11 itself is directly controlled by the temperature-controlling medium, and by extending the constant-temperature member 11 to the measurement optical path of the measurement light 8, it is possible to suppress a temperature change in the measurement optical path and reduce air fluctuation. As the temperature control medium, an inert substance is preferable, and for example, a fluorine-based inert liquid or nitrogen gas is used.

The thermometer 16 is provided on the constant temperature member 11, and measures the temperature of one representative point in the measurement optical path of the measurement light 8. The thermometer 16 can be arranged so as to be in close contact with the thermostat 11 and measure the temperature of the thermostat 11 itself. Alternatively, a plurality of thermometers 16 may be provided and arranged so as to measure one or more points on the measurement optical path and one or more points of the constant temperature member 11 itself.
As the thermometer 16, a thermocouple, a thermistor, a platinum resistor, or the like can be used.

The temperature controller 13 uses the temperature measured by the thermometer 16 as a target value of the temperature of the temperature control medium when controlling the temperature of the temperature control medium as described above. Thermometer 1
When a plurality of 6 are arranged, the target value can be set using a part selected arbitrarily from the plurality of measured values, or the target value can be calculated using all the measured values. it can. A thermometer 16 is used as a target value for temperature control of the temperature control medium.
By using the temperature measured in step (1), it is possible to set an optimal target value for reducing air fluctuation in the measurement optical path.

Regarding the shape and arrangement of the constant temperature member 11,
This will be described below with reference to FIGS. FIGS. 3 and 4 are cross-sectional views taken along the line AA shown in FIG. FIG. 3A shows a first embodiment relating to the shape and arrangement of the constant temperature member 11. In the first embodiment,
The constant temperature member 11 is a belt-shaped constant temperature member 11a, 11b, 11c.
It is composed of The constant temperature members 11a and 11b are arranged on both sides of the reticle stage RST, and are positioned so as to sandwich the measurement light 8. Arranging the constant temperature members 11a and 11b on both sides of the reticle stage RST does not hinder the scanning of the reticle stage RST, and also keeps the temperature of the measurement optical path constant by being located on both side surfaces of the measurement light 8. It is possible to block air having different temperatures flowing into the measurement optical path from outside the measurement optical path. Further, in the case where the air conditioning system of the constant temperature chamber in which the exposure apparatus is installed is a down flow type in which the temperature control air is blown from the upper part to the lower part of the apparatus, the first embodiment controls the temperature of the measurement optical path to be constant. Along with the action, it also has a rectifying action for the temperature-controlled air blown out of the constant temperature chamber. Furthermore, in order to more effectively keep the temperature of the measurement optical path constant by arranging the constant temperature member 11 at a position slightly closer to the measurement optical path, in the first embodiment, 2.
A constant temperature member 11c is also provided in the middle of the measurement light 8 on the axis.

FIG. 3B shows a second embodiment. In the second embodiment, the constant temperature member 11 is a belt-like constant temperature member 11a to 11d.
The constant temperature members 11a to 11d are all arranged above the reticle R. Here, the four thermostat members 11a to 11d are thermostat members 11a and 11b,
And a pair of constant temperature members 11c and 11d, which are arranged so as to include the measuring light 8 between the constant temperature members 11a and 11b and between the constant temperature members 11c and 11d when viewed from above the apparatus. By arranging the constant temperature members 11a to 11d in this way, even if the constant temperature members 11 cannot be arranged on both side surfaces of the reticle stage RST, they do not hinder the scanning of the reticle stage RST. Also,
Even if the measurement light 8 cannot be completely sandwiched between the constant temperature members 11a and 11b as shown in FIG. 3A, the temperature of the measurement optical path is stabilized by arranging many constant temperature members 8 near the measurement light 8. . Further, similarly to the first embodiment, when the constant temperature chamber of the exposure apparatus is of a down-flow type, it is possible to provide both the temperature control of the measurement optical path and the rectification of the temperature-controlled air.

FIG. 4A shows a third embodiment. The third embodiment is an example in which the constant temperature member 11 is constituted by a constant temperature member 11e having a U-shaped cross section. The constant temperature member 11e is arranged so that a part of the measurement light 8 and a part of the reticle stage RST are included in the U-shaped space. Reticle stage R is formed by forming constant temperature member 11e so as to cover both side surfaces and upper portion of reticle stage RST.
Since it does not hinder the scanning of the ST and also covers the upper part of the measurement optical path of the measurement light 8, the temperature of the measurement optical path can be kept constant, and the inflow of air having different temperatures into the measurement optical path can be effectively blocked.

FIG. 4B shows a fourth embodiment. The fourth embodiment is directed to a positioning device equipped with a reaction force processing mechanism for the reticle stage RST.
3 shows the shape and arrangement of f. First, a reaction force processing mechanism of reticle stage RST will be described with reference to FIG.

In the fourth embodiment, a reticle stage RST
And a second stage 17 that can move independently in the Y direction. This second stage 17 is a reticle stage RS
The stator 6a for driving T is supported. The second stage 17 is movable in a non-contact manner on a reference plane of the body 5 by an air bearing (not shown). Further, the second stage 17 may mount a mass body 18 having a predetermined mass as needed. Driving of reticle stage RST is performed by Lorentz force generated between stator 6a and movable element 6b fixed to reticle stage RST, and thus driving of reticle stage RST generates a reaction force on stator 3a. Due to this reaction force, the second stage 17 moves on the reference plane of the body 5 in a direction opposite to the moving direction of the reticle stage RST. Second stage 17 at this time
The moving amount of the second stage 17, the stator 6a, the driven portion including the reticle stage RST and the mover 6b, etc.
And the mass ratio with the driving portion including the mass body 18 and the like. Therefore, by increasing the mass of the mass body 18, the moving amount of the driving portion can be reduced. The reaction force generated by the scanning of the reticle stage RST is converted into the movement amount of the mass body 18 and the like according to the law of conservation of momentum by the reaction force processing mechanism including the second stage 17 and the mass body 18 so as not to be transmitted to the body 5. be able to. As a result, there is no error due to vibration of the body 5 on the measured value of the current position of the reticle stage RST measured by the reticle interferometer 7 and the interferometer unit 10, and the position measurement accuracy of the reticle stage RST can be maintained. Thus, a decrease in positioning accuracy of reticle stage RST can be suppressed.

The constant temperature member 11 of the fourth embodiment having the above-mentioned reaction force treatment mechanism is a constant temperature member 1 having a U-shaped cross section.
1f. The constant-temperature member 11f includes the measurement light 8, the reticle stage driving unit 6, or the second stage 17.
It is arranged so as to include. Thus, even when it is difficult to cover only the reticle stage RST with the constant temperature member 11 due to the use of the above-described reaction force processing mechanism, the measurement optical path temperature is kept constant as in the third embodiment, and air having different temperatures is transmitted to the measurement optical path. Inflow can be blocked.

The shape of the constant temperature member 11 is not limited to the above, and may take various forms such as using a rod-shaped member or a pipe-shaped member having a cross-sectional shape in which a part of the circumference is cut off. Can be. The main controller MP controls the entire exposure apparatus, and particularly controls the stage control system 4, the pump 12, and the temperature controller 13.

Next, a device exposure method using the exposure apparatus having the above-described configuration will be described. Main controller MP places a predetermined reticle R on reticle stage RST in accordance with an operator's specification, and precisely measures the position of reticle R (hereinafter, referred to as reticle alignment) and records it. Thereafter, the reticle R is accurately positioned with respect to the projection optical system PL based on the reticle alignment result.

After reticle alignment, main controller MP causes wafer W to be held on wafer stage WST by vacuum suction and moved to an exposure standby position. Note that main controller MP appropriately measures the position of wafer W (hereinafter referred to as wafer alignment) as necessary.

Thereafter, the main controller MP controls the illumination optical system 1 to illuminate the reticle R with the exposure light while limiting the predetermined range of the reticle R, and transfers and exposes the pattern of the reticle R onto the wafer W with a predetermined exposure energy. I do. At this time, depending on a process to be exposed, the main controller MP follows the information on the position of the pattern of the wafer W already measured by the wafer alignment so that the pattern of the reticle R is accurately superimposed on the pattern of the wafer W. The wafer stage WST and the reticle stage RST are positioned and exposed.

After the exposure, the main controller MP collects the exposed wafer W, replaces it with an unexposed wafer W, and repeats the procedure after the wafer alignment for the unexposed wafer W. In the above-described device exposure method, the temperature of the constant temperature member 11 needs to be constantly adjusted in order to stabilize the temperature of the measurement optical path with high accuracy. However, when the temperature cannot be constantly controlled, the temperature of the constant temperature member 11 is controlled during the execution of a sequence requiring particularly high stage positioning accuracy, for example, at least during the execution of each sequence of reticle alignment, wafer alignment, and exposure. It is desirable to keep.

FIGS. 5 to 7 are views showing some embodiments of the retracting structure of the constant temperature member 11. Hereinafter, the retracting structure of the constant temperature member 11 will be described with reference to FIGS. The same components as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

FIGS. 5A and 5B show a fifth embodiment. The fifth embodiment relates to a retreat structure for the constant temperature member 11. FIG. 5A shows a constant temperature member 1 during exposure.
FIG. 5B shows a reticle stage RST.
Shows a state in which the constant-temperature member 11 is retracted from the measurement optical path when is located at the reticle exchange position away from the illumination optical axis AX.

The constant temperature member 11 is held by an arm 19a, and the arm 19a can be moved up and down by a linear drive device 20. In the fifth embodiment, the linear drive device 20 is supported by the illumination optical system 1. However, the linear drive device 20 may be supported by another structure, for example, a pedestal provided exclusively on the body 5. The linear drive device 20 can take various modes by an air cylinder, a linear motor, a rotary motor, or the like and a mechanical mechanism. At the time of exposure and reticle alignment, the constant temperature member 11 is positioned at a position extending in the measurement optical path of the measurement light 8 to stabilize the temperature of the measurement optical path. On the other hand, when the reticle R is replaced, the constant temperature member 11 is moved in the Z direction by the linear drive device 17 and the reticle stage R positioned at the reticle replacement position.
A space required for exchanging the reticle R is secured above ST. According to the fifth embodiment, it is possible to dispose the constant temperature member 11 in the vicinity of the measurement optical path of the reticle interferometer 7 without disturbing the operation of replacing the reticle R. Therefore, air fluctuations during exposure and reticle alignment And reticle stage RST can be positioned with high accuracy.

FIG. 6 shows a sixth embodiment. In the sixth embodiment, the constant temperature member 11 is held by the arm 16b. The arm 16b is rotatable about a shaft 21 parallel to the X direction, and is rotationally driven by a rotation driving device 22.
When the reticle R is replaced, the constant-temperature member 11
By moving from the position extending in the measurement optical path by the step 2, a space required for reticle R exchange is secured above the reticle stage RST positioned at the reticle exchange position. According to the sixth embodiment, similarly to the fifth embodiment, the constant temperature member 11 can be arranged immediately near the measurement optical path without hindering the reticle R exchange operation, and the reticle R can be exchanged above the reticle R exchange position. Furthermore, it is possible to secure a larger space than in the fifth embodiment, and the reticle R can be easily replaced.

FIGS. 7A and 7B show a seventh embodiment. FIG. 7A shows the arrangement of the constant temperature member 11 at the time of exposure, and FIG. 7B shows a state where the constant temperature member 11 is retracted from the measurement optical path when the reticle stage RST is located at the reticle exchange position. In the seventh embodiment, the constant temperature member 11 is movable in the Y direction along the linear guide 23. The movement of the constant temperature member 11 is performed by the horizontal driving device 24. The linear motion guide 23 can use a sliding bearing by a ball bearing or an air stage, and the horizontal driving device can take various modes such as driving by a rack and pinion, driving by a linear motor, driving by a belt, and the like. In the seventh embodiment, the constant temperature member 11 is moved between the illumination system 1 and the reticle stage RST by moving in the Y direction by the direct drive device 20 when the reticle R is replaced. According to the seventh embodiment, since the space above the reticle stage RST positioned at the reticle replacement position is a free space, the constant temperature member 11 can be retracted without hindering the reticle R replacement operation.

The retracting method of the constant temperature member 11 is not limited to the above embodiment. For example, the constant temperature member 11 may have a structure that can be divided into two or more. You may retreat to a different position.
The first to fourth embodiments and the fifth to seventh embodiments can be combined with each other.

The constant temperature member 1 described in the fifth to seventh embodiments
The device exposure method in the exposure apparatus having the retracting structure further includes the following procedure in addition to the device exposure method described above. The main controller MP includes a linear drive device 20, a rotary drive device 21, and a horizontal drive device 2 via a stage control system 4.
4 is controlled, and the constant temperature member 11 is arranged at a position along the measurement optical path of the reticle interferometer 7 during reticle alignment and exposure. The constant temperature member 11 is retracted before the reticle exchange, and is disposed again at a position along the measurement optical path of the reticle interferometer 7 after the reticle exchange operation is completed. Thereby, the constant temperature member 11 does not become an obstacle at the time of reticle replacement, and the reticle stage RST can be positioned with high precision during the execution of a sequence such as reticle alignment, wafer alignment, and exposure, which require particularly high stage positioning accuracy. ,
The yield rate of manufactured semiconductor devices is improved.

Although the first to seventh embodiments have described the case where the constant temperature member 11 is applied to the reticle stage RST, the constant temperature member 11 can also be applied to the wafer stage WST. Further, when a semiconductor device is manufactured using the exposure apparatus of the present embodiment, the semiconductor device is designed to have a function / performance design, a reticle is manufactured based on the previous steps, and a wafer is manufactured from a silicon material. Step, applying a photosensitive agent (resist) to the wafer, performing reticle alignment to expose and develop the wafer, assembling a device (including a dicing process, a bonding process, and a packaging process), and inspecting the device. It is manufactured through steps and the like. According to the present manufacturing method, semiconductor devices can be manufactured with high yield.

The application of the exposure apparatus of the present embodiment is as follows.
The present invention is not limited to manufacturing semiconductor devices, but can be used for manufacturing, for example, liquid crystal display devices, imaging devices, thin-film magnetic heads, and the like. The exposure apparatus of the present embodiment includes a plurality of optical components for each unit, such as an illumination optical system 1, a projection optical system PL, an alignment system (not shown), and a stage system.
After assembling and adjusting the mechanical parts and the electric parts, the unit can be manufactured by docking each unit, performing wiring and piping, and performing overall adjustment and operation confirmation.

In this embodiment, the scanning type exposure apparatus has been described. However, the present invention can be applied to a step-and-repeat type exposure apparatus (collective exposure type exposure apparatus). As described above, the present invention is not limited to the above-described embodiments, and can take various configurations without departing from the gist of the present invention.

[0054]

As described above in detail, according to the positioning device of the first aspect, since the temperature control means integrally formed with the extending member directly controls the temperature of the extending member itself, the position measurement is performed. Temporal temperature changes in the measurement optical path of the means can be suppressed, and as a result, highly accurate positioning of the stage can be realized.

According to the positioning device of the second and third aspects, since the extending member is arranged on the side surface of the stage or above the stage, there is no trouble in moving the stage, and the extending member itself is controlled by the temperature control means. , The temperature of the measurement optical path of the position measurement means can be suppressed from changing over time, and the stage can be positioned with high accuracy.

According to the positioning device of the fourth aspect, since the extending members are arranged on both sides of the stage and above, there is no hindrance when moving the stage, and the temperature of the ambient light is measured in the measuring optical path of the position measuring means. Can be prevented from flowing, and the temperature of the extending member itself can be kept constant by the temperature control means, so that the stage can be positioned with high accuracy.

According to the positioning device of the fifth aspect, since the temperature of the extending member itself can be kept constant by the temperature adjusting means, the temperature change of the measuring optical path of the position measuring means with time can be effectively suppressed. The stage can be positioned with high accuracy. According to the positioning device of the sixth aspect, the temperature of the extending member can be controlled optimally by having the temperature measuring means in the extending member, and the temperature change of the measuring optical path of the position measuring means with time can be controlled. The stage can be effectively suppressed and the stage can be positioned with high accuracy.

According to the positioning device of the seventh aspect, it is possible to prevent the stage positioning accuracy from deteriorating due to the reaction force accompanying the stage movement in the positioning device of the first aspect. According to the positioning device of the eighth aspect, it is possible to prevent the stage positioning accuracy from deteriorating due to the reaction force accompanying the stage movement and to suppress the temporal temperature change of the measurement optical path of the position measuring means, and to highly accurately adjust the position of the stage. Positioning can be done.

According to the ninth aspect of the present invention, since the defining means for defining the space is retracted from the position for defining the measurement optical path of the position measuring device, the measurement by the position measuring means does not hinder the sample exchange. An optical path can be defined. According to the positioning device of the tenth and eleventh aspects, it is possible to optimally control the temperature of the defining means, and change the temperature of the measuring optical path of the position measuring means over time without hindering the sample exchange. And the stage can be positioned with high accuracy.

According to the twelfth aspect of the present invention, since the positioning accuracy of the sample at the time of exposure is improved, the semiconductor device can be mass-produced with a high yield even in the case of a highly integrated semiconductor device requiring high positioning accuracy. Can be. Further, the semiconductor device according to the thirteenth aspect manufactured by using the present exposure apparatus can have a high degree of integration and a high function.

According to the exposure method of the present invention, it is possible to suppress a temperature change at the time of exposure requiring high precision positioning accuracy and to accurately position the sample.
Highly integrated semiconductor devices can be mass-produced.

[Brief description of the drawings]

FIG. 1 is a diagram showing an overall configuration of an exposure apparatus according to an embodiment of the present invention.

FIG. 2 is a view showing a structure of an extension member 11;

FIG. 3 is a sectional view taken along the line AA in FIG. 1,
It is a figure which shows arrangement | positioning of the belt-shaped extending member 11, FIG.
FIG. 3 is a sectional view showing a first embodiment, and FIG. 3B is a sectional view showing a second embodiment.

FIG. 4 is a sectional view taken along the line AA in FIG. 1,
FIG. 9 is a view showing the arrangement of the extending members 11 having a U-shaped cross section;
FIG. 4A is a sectional view showing a first embodiment, and FIG. 4B is a sectional view showing a second embodiment.

5A and 5B are diagrams showing an embodiment relating to a retracting structure of the extension member 11, and FIG. 5A is a diagram showing a fifth embodiment in which the extension member 11 extends in the measurement optical path; FIG. 5B is a view showing a state in which the extending member 11 is retracted for exchanging the sample R in the fifth embodiment.

FIG. 6 is a view showing an embodiment relating to a retracting structure of the extending member 11, wherein a solid line is a sixth embodiment, in which the extending member 11 extends in the measurement optical path, and a dotted line is a sixth embodiment. FIG. 7 is a view showing a state in which the extending member 11 is retracted for exchanging the sample R in the embodiment.

FIG. 7 is a view showing an embodiment relating to a retracting structure of the extension member 11, and FIG. 7 (a) is a view showing a seventh embodiment in which the extension member 11 extends in the measurement optical path; FIG. 7B is a view showing a state in which the extending member 11 is retracted for exchanging the sample R according to the seventh embodiment.

[Explanation of symbols]

RST: reticle stage, R: reticle, AX: illumination optical axis, PL: projection optical system, WST: wafer stage, W
... wafer, MP ... main controller, 1 ... illumination optical system, 2 ... wafer stage drive unit, 3 ... wafer interferometer, 4 ... stage control system, 5 ... body, 6 ... reticle stage drive unit, 6
a: linear motor stator, 6b: linear motor mover,
7: reticle interferometer, 8: measuring light, 9: reflecting mirror, 10 ...
Interferometer unit, 11: constant temperature member, 12: pump, 13
.. Temperature control device, 14 flow path, 15a, 15b circulation hose, 16 thermometer, 17 second stage, 18 mass body, 19 arm, 20 linear drive device, 21 rotary shaft, 22 ... Rotary drive unit, 23 ... Linear guide, 24 ... Horizontal drive unit

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) // G01B 11/00 H01L 21/30 516B 516E F term (reference) 2F065 AA02 AA03 AA06 AA20 AA39 CC18 CC19 DD14 DD15 EE01 FF52 FF55 FF67 GG05 LL12 LL17 MM01 NN20 PP12 QQ25 2F069 EE02 GG07 MM24 PP02 2F078 CA02 CA08 CB05 CB13 5F031 CA02 CA05 CA07 HA37 HA38 HA53 JA02 JA27 JA46 MA27 5F046 BA04 BA05 CC01 CC02 CC16 DA26

Claims (14)

[Claims] A stage capable of holding and moving a sample;
A positioning device comprising: a position measuring unit that optically measures the position of the stage; an extending member extending along a measurement optical path of the position measuring unit; and an extending member integrally formed with the extending member. A temperature control means for directly controlling the temperature of the member itself. 2. The positioning device according to claim 1, wherein the extending member has at least two belt-shaped members facing each other. 3. The extension member is disposed such that at least a part of the measurement optical path is included between two planes of the strip-shaped member that include a first surface and a second surface that oppose each other. 3. The positioning device according to claim 2, wherein: 4. The extending member has a U-shaped cross section, and is arranged so that at least a part of the measurement optical path is included in a space surrounded by the U-shape. The positioning device according to claim 1, wherein: 5. The temperature control means includes a flow path means in which a flow path is formed in the extending member, and a supply means for supplying a temperature-controlled fluid in the flow path. Claim 1
The positioning device according to any one of claims 1 to 4. 6. The temperature control unit includes: a temperature measurement unit configured to measure at least one of a temperature of the extending member and a temperature of the measurement optical path; and a temperature of the fluid measured by the temperature measurement unit. The positioning device according to any one of claims 1 to 4, further comprising control means for controlling a temperature. 7. The positioning device according to claim 1, wherein the positioning device includes a driving unit that drives the stage, and at least one second stage that moves in accordance with the movement of the stage and supports the driving unit. The positioning device according to claim 1. 8. The positioning device according to claim 7, wherein the extending member has a U-shaped cross section, and the measurement optical path and the stage are placed in a space surrounded by the U-shape. A positioning device, wherein the extension member is arranged so as to include at least one of a driving unit and the second stage. 9. A stage capable of holding and moving a sample,
A positioning device comprising: a position measuring unit that optically measures the position of the stage; a defining unit that defines a space of the positioning device; and a first position that defines a measurement optical path of the position measuring unit by the defining unit. And a driving means for positioning the defining means at a second position different from the first position. 10. The apparatus according to claim 9, further comprising a temperature adjusting means installed on said defining means for adjusting the temperature of said defining means.
The positioning device according to the above. 11. The temperature control unit includes: a temperature measurement unit configured to measure at least one of a temperature of the defining unit and a temperature of the measurement optical path; and a temperature of the fluid based on the temperature measured by the temperature measurement unit. The positioning device according to claim 10, further comprising: a control unit configured to control the positioning. 12. An exposure apparatus comprising: a mask stage capable of holding and moving a mask; and a substrate stage on which a photosensitive substrate onto which the mask pattern is transferred is mounted and movable while holding the photosensitive substrate. An exposure apparatus comprising the positioning device according to any one of claims 1 to 11 on at least one of a mask stage and the substrate stage. 13. A semiconductor device manufactured by using the exposure apparatus according to claim 12. 14. An exposure method for positioning a stage holding a mask having a pattern by performing position measurement by an optical position measurement means, and exposing the pattern to a substrate, wherein a step defines a space in a positioning device. Positioning the means at a first position that defines a measurement optical path of the position measuring means; exposing the substrate to light when the defining means is at the first position; A step of positioning at a second position different from the position of (i).