JP2002339028A - Copper alloy for electric or electronic part, and electric or electronic part using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an Fe-containing copper alloy for electric or electronic parts which has better workability than the conventional Fe-containing copper alloy electronic parts, and to provide electric or electronic parts which have excellent quality. SOLUTION: [1] The Fe-containing copper alloy for electric or electronic parts in which a ratio between an X-ray diffraction intensity in the (200) plane and that in the (220) plane is 0.5 to 10, is provided. [2] The Fe-containing copper alloy for electric or electronic parts in which an orientation density in the Cube orientation is 1 to 50, is provided. [3] The Fe-containing copper alloy for electric or electronic parts in which a ratio between an orientation density (1 to 50) in the Cube orientation and that in the S orientation is 0.1 to 5, is provided. [4] The electric or electronic parts are consisting of those copper alloys.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention belongs to the technical field of copper alloys for electric and electronic parts and electric and electronic parts, and more particularly to copper alloys for electric and electronic parts such as semiconductor lead frames, terminals, connectors and bus bars. In addition, it belongs to the technical field of copper alloys for electric and electronic parts having excellent workability.

[0002]

2. Description of the Related Art With the increase in capacity, miniaturization, and functionality of semiconductor devices used in electronic equipment, lead frames used in semiconductor devices have become smaller in cross-sectional area, and have higher strength, conductivity, and the like. Thermal conductivity is required.

Various Fe-containing copper alloys (Fe-containing copper alloys) have been used as materials for electrical and electronic components such as lead frames for semiconductors. That is, when Fe or an intermetallic compound such as Fe-P, Fe-Si, or Fe-Ti is precipitated in the copper matrix, a copper alloy having excellent conductivity and strength can be obtained relatively easily, and therefore C19400 (Cu -2.35
Fe-0.03P-0.12Zn), C19500 (C
u-1.5Fe-0.8Co-0.1P-0.6S
n), C19700 (Cu-0.6Fe-0.2P-
0.05Mg), Cu-Fe-Si, Cu-Fe-Ti
Various Fe-containing copper alloys such as lead frames for semiconductors,
It is used in large quantities as a material for electrical and electronic components such as terminals and connectors.

However, these electric and electronic component materials (Fe
When processing and forming copper alloys, corrugation and meandering of the plate during cold rolling, uneven residual stress, meandering of slitted strips, occurrence of bending and burrs in stamping, roughening of the lead bending part, etc. Problems such as cracking and reduction in strength of the product may occur, which has reduced the product yield and the productivity during processing.

Conventionally, Fe-containing copper alloys as described above have been used as electric and electronic component materials.
The control of the properties of the contained copper alloy was mainly by adjusting the amounts of the main components such as Fe, P, and Zn, and by controlling the addition of trace elements such as Sn and Mg. However, in recent years, there has been a demand for higher quality and improved properties of copper alloys for lead frames, and such a requirement cannot be satisfied by mere component control alone. Have been proposed and disclosed. For example, Japanese Patent Application Laid-Open No. 10-265873 discloses that the average crystal grain size in the width direction of the rolled surface is 3 to 60 μm and the value is 8 μm.
A copper alloy for electric and electronic parts in which the number of crystal grains having a size of 0 to 120% is 70% or more of all crystal grains, that is, the workability is controlled by controlling the crystal grain size and the mixed grain structure in this way. The disclosed copper alloy for electric and electronic parts is disclosed.

[0006]

As can be seen from the above,
The control of the properties of the conventional copper alloy for electric and electronic parts is based on the precipitation of Fe and / or Fe-based intermetallic compounds in the copper matrix and / or the control of recrystallized grains.

[0007] Such control has been achieved by strict control of the precipitation behavior and recrystallization behavior, but it is difficult to stably control the behavior, and in particular, the workability in the coil tends to vary. Occurs.

[0008] Further, with the recent trend toward lighter, thinner and smaller sizes, it is not possible to satisfy sufficient workability by conventional control of the structure and precipitates.

Therefore, in order to more stably improve the workability, it is necessary to essentially clarify the structural factors governing these from the viewpoint of workability and formability, and to improve from another viewpoint. Has become.

Accordingly, the present inventors have conducted intensive studies on the systematic factors that govern the workability of the Fe-containing copper alloy. As a result, it was found that the cause of poor moldability was that the texture was not sufficiently controlled. That is, it was found that the plastic anisotropy of the sheet material was changed by the difference in the crystal orientation, and that the press formability was affected, and the texture (structure in which a specific crystal orientation was assembled) was not controlled so far. In addition, it was found that stable workability was not obtained. Depending on the degree of development of the texture, the difference in deformability between the parts of the sheet material becomes large, and the sheet is wavy and meandered in cold rolling as described above, uneven in residual stress, meandering of slitted strips, bending and burr in stamping processing. It was found that problems such as occurrence of cracks, roughening and cracking of the lead bending portion, and reduction in strength of the product occurred.

The present invention has been made based on such knowledge, and an object of the present invention is to solve the problems of the conventional copper alloy for electric and electronic parts (Fe-containing copper alloy) and to improve the workability. It is an object of the present invention to provide a copper alloy for electric and electronic parts excellent in quality and an electric and electronic part excellent in quality.

[0012]

In order to achieve the above object, a copper alloy for an electric / electronic part and an electric / electronic part according to the present invention are provided as described above.
The electric and electronic component according to claim 4 has the following configuration.

That is, the copper alloy for electric / electronic parts according to claim 1 is a copper alloy for electric / electronic parts containing Fe,
X-ray diffraction intensity of (200) plane: I (200) and (22)
0) X-ray diffraction intensity of plane: ratio to I (220): I (20)
0) / I (220) is 0.5 or more and 10 or less (1st invention).

The copper alloy for electric and electronic parts according to claim 2 is
A copper alloy for electric and electronic parts containing Fe, wherein Cub
A copper alloy for electric and electronic parts, wherein the orientation density of the e orientation: D (Cube orientation) is 1 or more and 50 or less (second invention).

[0015] The copper alloy for electric and electronic parts according to claim 3 is:
Ratio between azimuth density of Cube azimuth: D (Cube azimuth) and azimuth density of S azimuth: D (S azimuth): D (Cube azimuth)
The copper alloy for electric and electronic parts according to claim 1 or 2, wherein / D (S direction) is 0.1 or more and 5 or less (third invention).

According to a fourth aspect of the present invention, there is provided an electric / electronic part comprising the copper alloy for an electric / electronic part according to the first, second or third aspect (a fourth invention).

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention is embodied in the following manner, for example. Fe-containing copper alloy (Fe-containing copper alloy)
The ingot made into a slab by chamfering, heated and hot-rolled, then chamfered, and thereafter, cold rolling and intermediate annealing are repeated to obtain a sheet material for electric and electronic parts .
At this time, the X-ray diffraction intensity of the (200) plane: I (200) and the X-ray diffraction intensity of the (220) plane of the obtained sheet material are adjusted by adjusting the working ratio in cold rolling and the intermediate annealing conditions. Ratio to I (220): I (200) / I (220)
Is 0.5 or more and 10 or less. Or C
Orientation density of ube orientation: D (Cube orientation) is 1 or more and 5
0 or less. Then, the copper alloy for electric / electronic parts according to the present invention is obtained.

In this manner, the copper alloy for electric / electronic parts according to the present invention is obtained. Then, by processing the copper alloy for an electric / electronic component, the electric / electronic component according to the present invention can be obtained.

Hereinafter, the function and effect of the present invention will be mainly described.

In the case of a normal copper alloy sheet, mainly, Cube orientation, Goss orientation, Brass orientation (hereinafter also referred to as B orientation), Copper orientation (hereinafter also referred to as Cu orientation), S orientation, etc. A texture called the texture is formed, and a crystal plane corresponding to the texture exists. The formation of these textures differs depending on the processing and heat treatment method even in the case of the same crystal system. In the case of the texture of a rolled sheet material, the texture is expressed by the rolling surface and the rolling direction, and the rolling surface is expressed by {ABC} And the rolling direction is <
DEF>. Based on this expression, each direction is expressed as follows.

Cube orientation {001} <100> Goss orientation {011} <100> Rotated-Goss orientation {011} <011> Brass orientation (B orientation) {011} <211> Copper orientation (Cu orientation) {112} <111> (or D direction {4441} <11118> S direction {123} <634> B / G direction {011} <511> B / S direction {168} <211> P direction {011} <111>

In the present invention, basically, those having a deviation of ± 10 ° from these crystal planes belong to the same crystal plane. Here, the B direction, the Cu direction, and the S direction are fiber textures (β-fib) that continuously change between the directions.
er).

The evaluation of these textures and the measurement of the orientation distribution density (Orientation Density) can be carried out by using an ordinary X-ray diffraction method. The X-ray diffraction intensity ratio can be determined from the intensity of the diffraction plane, that is, the X-ray diffraction intensity of the (200) plane, the (220) plane, and the (110) plane. Further, the orientation density of each orientation is obtained by measuring a complete pole figure or a pole figure of (100), (110), and (111), and then obtaining a crystal orientation distribution function (Orientation Distribution Function: ODF). Is used to calculate the ratio of the intensity peak in each direction to the sum of the intensity peak values in each direction (for example, “Texture” edited by Shinichi Nagashima, Maruzen Co., 1984, P8-44, Metallurgy Society Seminar “Texture”,
Edited by The Japan Institute of Metals, 1981, P3-7). Alternatively, electron beam diffraction by TEM or SEM (Scanning Electron Micros
copy) -ECP (Electron Chaneling Pattern) method or S
EM-EBSP (Electron Back Scattering (Scattered) Patte
rn or EBSD (Diffraction)] can be used to determine the orientation density using a crystal orientation distribution function. Since these azimuth distributions change in the thickness direction, it is preferable to obtain the average by averaging some points in the thickness direction. However, in the case of a copper alloy plate used for a semiconductor material such as a lead frame, since the plate thickness is about 0.1 to 0.3 mmw, a value measured with the plate thickness as it is can be evaluated.

As described above, the texture of a normal copper alloy sheet is composed of a considerable number of orientation factors. However, if these constituent ratios change, the plastic anisotropy of the sheet material changes and the workability changes. There was found. And among them, especially Cube
It was found that by controlling the azimuth density (hereinafter, also referred to as D (Cube)) of the azimuth in an appropriate range, improvement in workability and stabilization can be achieved.

During processing such as stamping, it is desirable to deform uniformly during deformation, but if the Cube orientation develops too strongly and D (Cube) becomes higher than the appropriate range, the plastic anisotropy in the plate surface will increase. The strength is increased, and a portion which is easily deformed and a portion which is hardly deformed are generated, and the problem such as the bending and the occurrence of burrs in the stamping process as described above is likely to occur. On the other hand, if the Cube orientation is small and D (Cube) is lower than the appropriate range, this means that the development of other crystal orientations becomes stronger, and another in-plane anisotropy causes the same problem as above. Occurs. Therefore, it is important to control the Cube orientation grains.

The appropriate range of D (Cube) is from 1 to 55. X-ray diffraction intensity of (200) plane: I (200) and (220)
X-ray diffraction intensity of surface: ratio to I (220): I (200) / I (22
When (0) is 0.5 or more and 10 or less, D (Cube) is almost 1 or more and 55 or less. However, I (200) / I (2
Since the value of (20) varies depending on the strength of the (110) plane, which is an orientation other than the Cube orientation, even if the value of I (200) / I (220) is within the range of the present invention, D (Cube) May fall outside the scope of the invention (and vice versa).

Therefore, the copper alloy for electric / electronic parts according to the present invention is a copper alloy for electric / electronic parts containing Fe,
The ratio of the X-ray diffraction intensity of the (200) plane: I (200) to the X-ray diffraction intensity of the (220) plane: I (220): I (200) / I (220) is 0.5
It is characterized by being not less than 10 and not more than 10 (first invention). This copper alloy for electric and electronic parts is
As can be seen from the above findings, the workability is excellent. Here, the reason that I (200) / I (220) is 0.5 or more and 10 or less is that when less than 0.5, the development of a specific crystal orientation other than the Cube orientation becomes strong, The anisotropy becomes stronger, and consequently, the workability is reduced and becomes insufficient. If it exceeds 10, the Cube orientation develops too strongly, the plastic anisotropy in the plane of the plate becomes stronger, and consequently the workability decreases. This is because it becomes insufficient.

The more preferable range of I (200) / I (220) is 0.6 or more and 9 or less. In this case, it has a higher level of workability.

The more preferable range of D (Cube) is 1 or more and 50 or less, and in this case, D (Cube) is 1 or more and 5 or less.
5 or less, the copper alloy for electric and electronic parts according to the present invention is a copper alloy for electric and electronic parts containing Fe,
The azimuth density of the be azimuth: D (Cube) is 1 to 50 (second invention). This copper alloy for electric / electronic parts has excellent workability, as can be seen from the above findings. Here, the reason that D (Cube) is not less than 1 and not more than 50 is that, when D (Cube) is less than 1, the development of a specific crystal orientation other than the Cube orientation becomes strong, the anisotropy becomes strong, and consequently the workability. This is because when the ratio exceeds 50, the Cube orientation is strongly developed, the plastic anisotropy in the plane of the plate becomes strong, and the workability is lowered to be insufficient.

The orientation density of the Cube orientation: D (Cube orientation)
When the ratio of the orientation density of D and the S orientation: D (S orientation): D (Cube orientation) / D (S orientation) is 0.1 or more and 5 or less, it has a more preferable high level of workability. (Third invention). That is, as can be seen from the above, the plastic anisotropy of the sheet material has a deep relationship with the balance of each texture component, and in particular, by controlling the ratio of the cubic density of the Cube orientation and the S orientation, a more preferable workability is obtained. Can be obtained, D
By setting (Cube orientation) / D (S orientation) to 0.1 to 5, a high level of workability can be obtained. Where D
If (Cube orientation) / D (S orientation) is less than 0.1, Cu
S direction becomes relatively stronger than be direction, D (Cube direction)
When / D (S direction) is more than 5, the Cube direction becomes relatively stronger than the S direction, and in each case, the anisotropy becomes stronger.
Workability decreases. Further, the above D (Cube orientation) / D (S
When the (azimuth) is 0.2 to 4.5, the workability becomes even higher.

In the present invention, the copper alloy for electric / electronic parts is
Although containing Fe, the components and compositions of the copper alloy are not particularly limited. However, there is a preferable range of component composition in order to further exert the effects of the present invention or from the viewpoint of various characteristics. The range of the component composition will be described below. In addition, regarding the unit of the content of each component, the mass% (% by weight) is abbreviated as%.

If the Fe content (content) is less than 0.01%,
Or, since the precipitation amount of the Fe-based intermetallic compound is small, it cannot sufficiently respond to the recent increase in strength required for lead frames, terminals, connectors, etc., and without setting special heating conditions. In order to obtain a grain sized structure, the Fe content is desirably 0.01% or more. On the other hand, if the Fe content exceeds 4.0%, a large amount of coarse Fe crystallized substances are generated, and these crystallized substances hardly contribute to the improvement of the strength, but rather deteriorate the bending workability, and cause the die to die at the time of press punching. It is desirable that the amount of Fe be set to 4.0% or less in order to cause wear. Therefore, the amount of Fe is desirably 0.01 to 4.0%. Within this range, a more preferred range is 0.05 to 3.0%.
It is.

P, Si, and Ti form stable intermetallic compounds with Fe, and precipitate in the matrix of Cu to improve the yield strength and heat resistance of the copper alloy. When adding P, Si, or Ti to form an intermetallic compound, one or more of these are used. P is Fe
Fe ₂ P or Fe ₃ P is formed, Si is Fe and Fe ₃ Si, Fe ₅ Si ₃ or Fe
Si forms, and Ti forms Fe and Fe ₂ Ti or FeTi. The content of P is 0.0001 to 0.7%, and the content of Si is 0.001 to 1.0%.
% And Ti are preferably in the range of 0.001 to 1.0%. If each is less than the lower limit, the proof stress and heat resistance are not improved. If the upper limit is exceeded, the electrical conductivity is reduced, casting becomes difficult, and hot rolling and cold rolling are performed. Cracks easily occur during rolling.

Zn, Sn, Co, Mg, and Mn improve the strength.
Zn has effects such as improvement of press workability (reduction of mold wear), prevention of migration, prevention of tin plating and heat peeling of solder. If the Zn content is less than 0.02%, the effect is not sufficient, and if it exceeds 5.0%, the solder wettability decreases. Therefore, the Zn content is preferably set to 0.02 to 5.0%. Sn improves the spring limit. If the amount of Sn is less than 0.01%, the effect is not sufficient, and if it exceeds 3.0%, the electrical conductivity is reduced. Therefore, the amount of Sn is preferably 0.01 to 3.0%. Co improves heat resistance. If the Co content is less than 0.01%, the effect is not sufficient, and if it exceeds 3.0%, the electrical conductivity is reduced.
Preferably, the amount is 0.01-3.0%. Mg improves the spring limit value and press workability (mold wear), prevents migration, and combines with S to form MgS, thereby improving the hot workability of the ingot. If the content of Mg is less than 0.01%, these effects are not sufficient, and if the content is more than 3.0%, the conductivity is lowered and casting becomes difficult.
% Is preferable. Mn improves heat resistance and hot workability of the ingot. If the Mn content is less than 0.01%, their effects are not sufficient. If the Mn content exceeds 1.5%, the solder wettability and the electrical conductivity decrease, and casting becomes difficult.
% Is preferable. In the above elements, Co and Mn form compounds with P and Si, respectively, but Fe-P and Fe-Si
The formation of phosphides and / or silicides of Co and Mn other than the compounds does not impair the effects of the copper alloy according to the present invention.

Other trace elements Sn, Pb, Ni, Mn, Cr, Al,
Mg, Ca, Be, Si, Zr, In, Ag, Se, Te, Sb, Bi, S, etc. are also used for improving the other main characteristics such as strength, conductivity, plating property, etc. Two or more types may be added, and these additions are acceptable as long as they do not interfere with the properties of the product.

The conventional concept of the production conditions for copper alloys for electric and electronic parts is to control by a combination of component design and optimum annealing conditions. This is from the viewpoint of workability and strength,
These are precipitation control and crystal grain size control. The specific manufacturing method was only control of the annealing conditions. On the other hand, the present invention has been studied from the viewpoint of controlling texture, from the viewpoint of improving plastic anisotropy, and has been made based on these.
The formation of the texture is determined not only by a single condition of the components, the processing conditions, and the heat treatment conditions, but is changed and formed by a combination thereof. In particular, the present inventors have found that it is greatly affected by the state of the structure in the pre-processing step, it could not be realized by the conventional method,
The control of the Cube orientation, which affects the characteristics depending on the conditions of the combination, was made possible, and the workability was improved.

The copper alloy for electric / electronic parts according to the present invention is usually produced through steps of casting, homogenizing heat treatment, hot rolling, cold rolling and repeated annealing. Since the obtained texture varies depending on the conditions, it is necessary to comprehensively select the conditions as a series of manufacturing steps. The production method is not particularly limited as long as an intended texture can be obtained, but control of production conditions in hot rolling and cold rolling is particularly important.

In the production of the copper alloy for electric and electronic parts according to the present invention, preferable production conditions and important matters will be specifically described below.

As the casting method, any casting method generally used for Cu-based alloys may be used, and continuous casting is generally used. The heat treatment for homogenization after casting is generally performed at a high temperature of about 900 to 1000 ° C. in order to homogenize macrosegregation generated in the ingot. However, in the present invention,
It is important to control the solid solution state and precipitate form here to a desired form. That is, the precipitates or intermetallic compounds that remain without being completely solid-solutioned serve as preferential nucleation sites for the recrystallization orientation in the subsequent heat treatment process, and govern what kind of texture is formed. Because.
The state of these precipitates also controls the crystal grain size.
Since the solid solution temperature of each intermetallic compound in the Cu matrix differs depending on the added element, it is desirable that the optimum homogenization heat treatment condition is appropriately selected according to the added element.

Optimum conditions for hot rolling and cold rolling after the homogenizing heat treatment vary depending on the solid solution state formed after the homogenizing heat treatment and the dispersion state of the intermetallic compound. Is desirable.

The reason why the texture is formed is that the crystal has the most slippery crystal plane and is oriented to a specific crystal orientation by rolling, and further specific orientation is obtained by annealing. Because it develops.
The texture of the copper alloy according to the present invention can be obtained by strict control by a combination of rolling and annealing as described below.

For hot rolling, the total working ratio is 80%.
It is desirable that the number of passes be 5 or more. If the total working ratio of the hot rolling is less than 80%, a sufficient texture is not developed, and the texture tends to be non-uniform in the thickness direction, which is not preferable in terms of characteristic variation.
The number of passes has the effect of controlling the Cube orientation by the recovery / recrystallization behavior occurring between passes of hot working, and less than 5 passes is not sufficient.

For the cold rolling after the hot rolling, cold rolling is performed at a cold working rate of 50% or more, a first heat treatment step is performed, and thereafter, the cold working rate is 90% or less (including 0%). ), And after the second heat treatment step, a cold working rate of 50
It is desirable to perform final cold rolling of not less than 95% and not more than 95%.
The heat treatment temperature in the heat treatment step in the middle is preferably changed depending on the precipitated phase in the alloy component. By controlling the combination of the cold working ratio and the heat treatment (annealing) as described above, the texture of the copper alloy according to the present invention can be controlled.

When the cold working rate in each cold rolling step is at the lower limit of the above cold working rate, the cubic density of the Cube orientation becomes partially high in the coil, causing variations in characteristics. It is not preferable because it becomes easy. On the other hand, when the ratio exceeds the upper limit of the cold working ratio, the Cube orientation is not sufficiently developed, and the other rolling orientations are strongly developed, which tends to cause plastic anisotropy.

In the first heat treatment step and the second heat treatment step, basically, fine precipitates appear, and the product strength,
There is an effect of controlling the level of the conductivity, and the deposition temperature varies depending on the type of the added element and the type of the precipitated phase. Therefore, the heat treatment condition is not limited to a uniform one. However, the more fine precipitates, the stronger the development of rolling texture components (S orientation, B orientation, Cu orientation, etc.) in the subsequent cold rolling step, and the amount of Cube orientation becomes relatively low, In order to optimally obtain a texture, it is important to control by a combination of a heat treatment step and a cold rolling step.

Since the copper alloy for electric / electronic parts according to the present invention is excellent in workability as described above, it can be suitably used as a material for electric / electronic parts such as semiconductor lead frames, terminals, connectors and bus bars. The electrical and electronic parts obtained thereby are excellent in quality characteristics, and can contribute to further increase in capacity, size, and function of semiconductor devices for electronic devices (a fourth invention).

[0047]

EXAMPLES Examples and comparative examples of the present invention will be described below.
Note that the present invention is not limited to this embodiment.

An Fe-containing copper alloy having the chemical components shown in Table 1 was melted in a coreless furnace, and ingots of various thicknesses were formed by a semi-continuous casting method. Next, these ingots were surface-adjusted by adjusting the amount of surface shave to obtain slabs of various thicknesses (thickness 10 mm to 300 mm x width 500 mm x length 1000 mm),
After heating these slabs at 900 to 1000 ° C. for one hour, they were rolled to a thickness of 1 to 20 mm by hot rolling. At this time, the thickness on the entry side of hot rolling (thickness of the slab) is adjusted by the ingot size and facing, and by controlling the thickness of the final plate obtained by hot rolling, the total rolling reduction ( (Processing rate) and the number of passes were changed as shown in Table 2.

After the hot-rolled sheet thus obtained was subjected to face milling, cold rolling and intermediate annealing were repeated to obtain a thickness:
A copper alloy for lead frames of about 0.25 mm was manufactured. Manufacturing conditions at this time (working rate in initial cold rolling, first heat treatment condition, working rate in cold rolling after first heat treatment, second heat treatment condition, working in final cold rolling after second heat treatment Table 2 shows the ratios. The obtained copper alloy is in the form of a coil.

With respect to the coiled copper alloy thus obtained, a test material was arbitrarily sampled from the coil and subjected to the following test. Also, a 50 mm square plate material was arbitrarily sampled from inside the coil, and the hardness of each of the four corners was measured.

(Measurement of X-ray Diffraction Intensity and Texture) The test material collected from the coil was subjected to ordinary X-ray diffraction using Cu as a target, a tube voltage of 50 KV, and a tube current.
The measurement was performed under the condition of 200 mA. Regarding the X-ray diffraction intensity, using a Rigaku X-ray diffractometer, the (200) plane [= (100)
Plane) and (220) plane (= (110) plane), and the X-ray diffraction intensity ratio of the (200) plane / (220) plane was determined from the measured diffraction intensities. The azimuth density of Cube azimuth: For each azimuth density such as D (Cube), the complete pole figure of (100), (110), and (111) is measured.
Then, the ratio was calculated by calculating the ratio of the intensity peak in each direction to the sum of the intensity peak values in each direction using the crystal orientation distribution function. Here, ±
Those with a misorientation within 10 ° belonged to the same crystal plane.

(Measurement of Conductivity) A test material collected from the coil was processed into a strip-shaped test piece by milling, and the conductivity of the test piece was measured by a double-bridge resistance measuring apparatus.

(Evaluation test of pressability) A lead having a width of 0.3 mm was punched out of a test material collected from the coil by a mechanical press, and the burring height of the punched out lead was measured to evaluate pressability. At this time, the burr height was measured by a method of observing the burr surface of the ten leads with a scanning electron microscope, and indicated by an average value of each maximum burr height.

(Evaluation test for bending workability) The test material sampled from the coil was bent at 90 ° at 0.25 mmR.
The outer surface side of the bent portion was observed with an optical microscope, and evaluated based on the presence or absence of rough skin and the presence or absence of cracks.

(Measurement of Hardness of Four Squares of 50 mm Square Plate) The hardness of each of the four squares of the 50 mm square plate sampled from the coil was measured using a Vickers hardness meter under a load of 500 g. went. Then, among the hardness measured values of the four corners, the difference in hardness was evaluated by the difference between the highest value and the lowest value.

Table 3 shows the results of the above test. No. 6 ~
13 corresponds to the comparative example, and the X-ray diffraction intensity ratio of the (200) plane / (220) plane: I (200) / I (220) is less than 0.5 or 10
In addition to being super, the orientation density of the Cube orientation: D (Cube) is less than 1 or more than 55, so that the difference in the flash height in the coil in the pressability evaluation test is large, Large variation. This indicates that the workability in the coil tends to vary and is not stable. Further, in some of the comparative examples, roughening and / or cracks occur in the evaluation test of bending workability, and these have poor bending workability.

On the other hand, no. 4 to 5 correspond to the embodiments of the present invention, where I (200) / I (220) is a value in the range of 0.5 to 10, and D (Cube) is a value in the range of 1 to 55. For this reason, the difference in the burr height in the coil in the evaluation test of pressability is extremely small, and the variation in press workability is extremely small. This indicates that the workability in the coil is hard to vary and is stable. Further, in the evaluation test for bending workability, neither roughening nor cracking occurs, and the bending workability is extremely excellent.

No. 1 to 3 correspond to an embodiment of the third invention in the present invention, wherein I (200) / I (220) is a value in the range of 0.5 to 10, and D (Cube) is 1 to 3. It is a value in the range of 50, and D (Cube) / D (S direction) is a value in the range of 0.1 to 5. For this reason, the above-mentioned No. The difference in the height of the burrs in the evaluation test of pressability in the coil is extremely smaller than in the cases of 4 to 5. This is the same as the above No. This shows that the workability in the coil is less likely to vary and is more stable than in the cases of 4 and 5.

[0059]

The copper alloy for electric / electronic parts according to the present invention comprises:
As described above, it is excellent in workability, so that it can be suitably used as a copper alloy for electric / electronic parts, and it is possible to improve the product yield in the production of electric / electronic parts and the productivity in processing. Has a remarkable effect.

[0060]

[Table 1]

[0061]

[Table 2]

[0062]

[Table 3]

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Yasuaki Sugizaki 1-5-5 Takatsukadai, Nishi-ku, Kobe City, Hyogo Prefecture Inside Kobe Research Institute, Kobe Steel Ltd. (72) Inventor Yoshio Hemi Takatsuka, Nishi-ku, Kobe City, Hyogo Prefecture 1-5-5 Daiko Kobe Steel, Ltd. Kobe Research Institute

Claims (4)

[Claims] 1. A copper alloy for electric and electronic parts containing Fe, wherein an X-ray diffraction intensity of the (200) plane: I (200) and an X-ray diffraction intensity of the (220) plane: I (220). Ratio: I
(200) / I (220) is 0.5 or more and 10 or less, The copper alloy for electric / electronic parts characterized by the above-mentioned. 2. A copper alloy for electric and electronic parts containing Fe, wherein the orientation density of Cube orientation: D (Cube orientation)
Is 1 or more and 50 or less. 3. An orientation density of Cube orientation: D (Cube
Azimuth) and azimuth density of S azimuth: D (S azimuth): D
3. The copper alloy for electric and electronic parts according to claim 1, wherein (Cube orientation) / D (S orientation) is 0.1 or more and 5 or less. 4. An electric / electronic part comprising the copper alloy for electric / electronic parts according to claim 1, 2 or 3.